JP2008175700A - Inspection apparatus and inspection method for semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection device for a semiconductor device capable of stably performing inspection of electric characteristics and that will not apply serious damages or large loads to a semiconductor device, and to provide an inspection method therefor. <P>SOLUTION: In this inspection device 1, a movable member 9 is provided with a housing hole 18, having a deep depth and a housing hole 19 having a shallow depth for housing conductive contact elements 7 at arbitrary positions. When only the movable member 9 is brought into close proximity to a fixing member 8, by maintaining the position of the semiconductor device 2 from the condition that terminal shape projections 16 of all the conductive contact elements 7 are abutted against external electrodes 3 of the semiconductor device 2, an innermost section 19a in the housing hole 19 having the shallow depth of the movable member 9 is brought into contact with a cylindrical body 14 of the conductive contact element 7. When the movable member 9 is further brought into close proximity to the fixing member 8, the conductive contact element 7 is made to contracted toward an inspection circuit board 5, in the housing hole 19 having the shallow depth of the movable member 9, the external electrode 3 of the semiconductor device 2 is moved away from the terminal shape projection 16 of the housing conductive contact element 7, and then electrical connection is cut. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an inspection apparatus and an inspection method for a semiconductor device in which a semiconductor device and an inspection circuit board of a measurement apparatus are electrically connected, and electrical characteristics of the semiconductor device are measured and inspected.

When performing an electrical characteristic test on a semiconductor device, an inspection device is generally used in which an external electrode of the semiconductor device is electrically connected to a measuring device (for example, Patent Document 1).
One conventional inspection apparatus is an inspection apparatus 26 shown in FIG. The inspection device 26 includes a fixed member 22 that is integrated with the inspection circuit board 21 and a movable member 23 that is attached to the fixed member 22 so as to be movable in the approaching and separating direction. Both the fixed member 22 and the movable member 23 are formed of an electrically insulating resin material, and the fixed member 22 is a pogo pin type arranged in accordance with the arrangement pitch of the external electrodes 24 of the semiconductor device 20 to be inspected. The conductive contact 25 is provided. The terminal-shaped protrusion 29 provided on the pogo pin type conductive contact 25 is pressed against the external electrode 24 of the semiconductor device 20 by the pressing force of the compression spring 27 provided inside, and the plunger 28 is measured by the measuring device. The contact pressure required for electrical continuity can be obtained by being pressed against the land electrode 30 of the inspection circuit board 21 connected to 33, and the external electrode 24 and the land electrode 30 are connected via the conductive contact 25. Are electrically connected.

  The movable member 23 is slidably supported by a guide pin (not shown) implanted in the fixed member 22, and is a compression spring (not shown) disposed between the fixed member 22 and the movable member 23. ) Is maintained in a floating state. The movable member 23 is formed with a storage portion (main body storage portion) 31 including a recess for positioning and storing the semiconductor device 20, and the external electrode 24 of the semiconductor device 20 is provided below the storage portion 31. An external terminal housing portion (exposed space portion) 32 is formed continuously for housing the lead and exposing it toward the conductive contact 25.

  In recent years, with the higher integration, smaller size, higher frequency, and higher speed of the semiconductor device 20, it is possible to reduce the pitch and reduce the inductance of the conductive contact 25 of the electrical property inspection device 26 of the semiconductor device 20. In order to do so, it is necessary to reduce the external dimensions of the conductive contact 25. Furthermore, in order to cope with an increase in the number of external electrodes of the semiconductor device 20 due to the increase in the size of the semiconductor device 20 and a reduction in the inspection cost, it is possible to conduct a plurality of inspections simultaneously. The number of conductive contacts 25 is increased, and the total contact pressure required to obtain electrical continuity between the external electrode 24 of the semiconductor device 20 and the electrode of the inspection circuit board tends to increase.

Patent Document 1 listed below describes a semiconductor device inspection apparatus including a pogo pin type conductive contact.
JP-A-11-176547

  In the conventional inspection apparatus 20 having the pogo-pin type conductive contact 25, the length of the terminal-shaped protrusion 29 on the side of the conductive contact 25 that contacts the external electrode 24 of the semiconductor device 20 is determined from the structure. Distance of the movable member 23 from the insertion into the terminal-shaped protruding portion 29 until it contacts the external electrode 24 of the semiconductor device 20 in a state where the conductive contact 25 is separated from the external electrode 24 of the semiconductor device 20, and then the electric Necessary to hold the conductive contact 25 so as not to jump out of the amount of contraction of the conductive contact 25 to obtain the contact pressure necessary for electrical conduction and the fixing member 22 in which the conductive contact 25 is accommodated. A total length dimension is required. For this reason, even when the conductive contact 25 is downsized, the length of the terminal-shaped protrusion 29 cannot be shortened, and the compression spring 27 for generating contact pressure has to be downsized. However, in order to reduce the size of the compression spring 27 while maintaining a predetermined spring life and contact pressure, the structural limit is reached, and the conductive contact 25 has a narrow operating range and a high spring constant. There wasn't. For this reason, the stability of the contact pressure for each individual is lacking, and it is not possible to sufficiently cope with the shape change such as the warp of the semiconductor device 20, making it difficult to perform a stable electrical characteristic inspection.

  Further, the inspection device 26 obtains a contact pressure necessary for electrical conduction by pressing the semiconductor device 20 against the inspection device 26 from the outside using a device or a jig with a load equal to the contact pressure. Therefore, when the degree of integration of the semiconductor device 20 is improved and the number of external electrodes is increased, or when a plurality of semiconductor devices 20 are inspected at the same time, the number of conductive contacts 25 mounted on the inspection device 20 As a result, the contact pressure of the grand total also increases dramatically. The semiconductor device 20 is seriously damaged by this load, and a device for pressing the semiconductor device 20 against the inspection device 26 from the outside. A large load was also applied to the jig.

  Furthermore, when the number of external electrodes 24 of the total of the semiconductor device 20 exceeds the number of input / output channels mounted on the measuring device 33, a changeover switch such as a relay is mounted on the inspection circuit board of the measuring device 33, The electrical conduction between the external electrode 24 of the semiconductor device 20 and the land electrode on the inspection circuit board is selected. However, the upper limit of the number of changeover switches such as relays that can be mounted on the inspection circuit board is limited. Therefore, when the semiconductor device 20 becomes larger and the number of external electrodes 24 per unit semiconductor device 20 increases, the semiconductor It becomes difficult to select the electrical continuity between the external electrode 24 of the device 20 and the land electrode on the inspection circuit board, which hinders the inspection of the semiconductor device 20.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and it is possible to perform an electrical characteristic inspection stably and without causing any trouble, and a semiconductor device inspection apparatus and inspection that do not cause serious damage or a large load on the semiconductor device. It aims to provide a method.

  In order to achieve the above object, the first aspect of the present invention provides a semiconductor device inspection apparatus for electrically connecting an external electrode of a semiconductor device and an inspection circuit board connected to a measurement apparatus for inspecting the semiconductor device. And a plurality of elastically conductive members that contact the conductive member by contacting the fixed member, the movable member disposed opposite to the fixed member, and the external electrode of the semiconductor device and the land electrode of the inspection circuit board. And the fixing member is detachable from the inspection circuit board and is fixed to the inspection circuit board at the time of mounting, and an external electrode of a semiconductor device is attached to the movable member on the inspection circuit board. A housing part is provided in which the semiconductor device can be arranged in a direction facing the land electrode, and the conductive contact is urged in a protruding direction by a compression spring housed in the main body part to contact an external electrode of the semiconductor device. Terminal The fixed member and the movable member have an accommodating hole for accommodating the conductive contact at a position corresponding to the arrangement of the external electrodes of the semiconductor device, and the fixed member and the movable member. The conductive contact is sandwiched and accommodated between the fixed member and the movable member in a retractable state in each of the accommodating holes. .

  In this configuration, first, the conductive contact is accommodated in the accommodation hole of the fixed member and the movable member, one end side of the conductive contact is in contact with the land electrode of the inspection circuit board, and the external electrode of the semiconductor device is The semiconductor device is arranged on the movable member so that the conductive contact is separated from the external electrode of the semiconductor device while facing the land electrode of the inspection circuit board through the conductive contact. In this state, the conductive contact that has been separated from the external electrode of the semiconductor device is electrically connected to the external electrode of the semiconductor device by relatively moving the semiconductor device and the movable member so as to approach the fixed member. Thus, the external electrode of the semiconductor device and the land electrode of the inspection circuit board can be satisfactorily conducted through the conductive contact.

  In this case, according to the above configuration, since the housing portion that houses the conductive contact is not formed only on the fixed member, but formed on the fixed member and the movable member, the conductive contact is movable. It can arrange | position in the state approached from the beginning with respect to the external electrode of the semiconductor device arrange | positioned at the member. Therefore, the protruding amount of the terminal-shaped protruding portion from the main body can be reduced, and as a result, a larger compression spring can be mounted in the conductive contact than in the conventional case, and a predetermined spring life can be achieved. In addition, the conductive contact can be miniaturized while maintaining the contact pressure.

  Further, the second invention is the semiconductor device inspection apparatus according to the first invention, wherein the conductive contact has a step portion formed by a dimensional difference between the outer diameter of the main body portion and the outer diameter of the terminal-shaped protruding portion. In addition, the inner end of the hole for accommodating the conductive contact in the movable member and the stepped portion of the conductive contact can be contacted, and the hole for the movable member is formed at two or more different depths. It is characterized by being.

  In this configuration, first, the conductive contact is accommodated in the accommodation hole of the fixed member and the movable member, one end side of the conductive contact is in contact with the land electrode of the inspection circuit board, and the external electrode of the semiconductor device is The semiconductor device is arranged on the movable member so that the conductive contact is separated from the external electrode of the semiconductor device while facing the land electrode of the inspection circuit board through the conductive contact. Under the present circumstances, the back end part of all the accommodation holes of a movable member and the level | step-difference part of an electroconductive contactor are spaced apart.

  After that, while maintaining the state where the back end portions of all the accommodation holes of the movable member and the stepped portions of the conductive contacts are separated from each other, the semiconductor device is relatively moved in the direction of approaching the fixed member using a device or a jig from outside. The terminal-shaped protrusions of all conductive contacts are in contact with the external electrodes of the semiconductor device, and at the same time, the plunger is in contact with the land electrodes of the test circuit board. The test circuit board can be electrically connected via the conductive contact. At this time, the movable member moves by the same distance as the semiconductor device while maintaining the housed state of the semiconductor device.

  After that, by moving only the movable member in the direction approaching the fixed member while maintaining the position of the semiconductor device using an apparatus or a jig from the outside, at the site where the depth of the accommodation hole of the conductive contact is the shallowest When the depth of the accommodation hole is in contact with the stepped portion of the cylindrical body of the conductive contact and the movable member is moved in a direction approaching the fixed member, the accommodation hole is accommodated in the shallowest part. Since the conductive contact is pressed at the back end of the accommodation hole, the conductive contact is shortened to the inspection circuit board side.

  In this state, by setting the depth of the other accommodation hole to a depth that does not contact the back end portion of the accommodation hole and the step portion of the cylindrical body, the operation of the conductive contact inserted in the other accommodation hole The amount does not change (not shortened).

  Further, when the movable member is moved in the direction approaching the fixed member direction, the inner end of the accommodation hole contacts the cylindrical body of the conductive contact at the second shallowest depth, and the movable member is further fixed to the fixed member. When the contact hole is moved in the direction approaching, the conductive contact accommodated in the place where the depth of the accommodation hole is the second shallowest is shortened to the inspection circuit board side. Thereafter, the conductive contacts are sequentially shortened by the action of the movable member, starting from a location where the depth of the accommodation hole is shallow.

Thereby, the operation amount (amount to be shortened) of the conductive contact can be changed in any conductive contact depending on the position of the movable member.
According to a third aspect of the present invention, in the semiconductor device inspection apparatus according to the second aspect of the invention, the electrical contact between the external electrode of the semiconductor device and the conductive contact is determined by the relative position of the movable member in the approaching and separating direction with respect to the fixed member. It is characterized by having a structure in which the presence or absence of connection can be selected.

  In this configuration, first, the conductive contact is accommodated in the accommodation hole of the fixed member and the movable member, one end side of the conductive contact is in contact with the land electrode of the inspection circuit board, and the external electrode of the semiconductor device is The semiconductor device is arranged on the movable member so that the conductive contact is separated from the external electrode of the semiconductor device while facing the land electrode of the inspection circuit board through the conductive contact.

  After that, by moving the semiconductor device from the outside in a direction approaching the fixing member using a device or a jig, the terminal-shaped protruding portion of the conductive contact comes into contact with the external electrode of the semiconductor device. At this time, the plunger is inspected. Since it is in contact with the land electrode of the circuit board, the external electrode of the semiconductor device and the inspection circuit board are electrically connected.

  After that, the position of the semiconductor device is maintained from the outside by using a device or a jig, and the movable member is moved in a direction approaching the fixed member, so that the accommodation hole of the conductive contact of the movable member is at the shallowest part. The inner end of the accommodation hole contacts the cylindrical body of the conductive contact. Further, when the movable member is moved in the direction approaching the fixed member, the conductive contact is shortened to the inspection circuit board side in the conductive contact accommodated in the place where the depth of the accommodation hole is the shallowest. The terminal-shaped protrusion of the contact is separated from the external electrode of the semiconductor device, and the electrical connection is cut. In this state, the conductive contacts inserted in the other accommodation holes remain in contact with the external electrodes of the semiconductor device and maintain a state where electrical continuity is obtained. Thereby, the presence or absence of electrical connection between the external electrode of the semiconductor device and the land electrode of the inspection circuit board can be selected in an arbitrary conductive contact depending on the position of the movable member.

  According to a fourth aspect of the present invention, a semiconductor device is inspected by selectively performing the presence or absence of electrical continuity between an external electrode of the semiconductor device and an electrode of an inspection circuit board using the inspection apparatus according to the third aspect of the invention. And

  As a result, even if the total number of external electrodes in the total of semiconductor devices exceeds the number of input / output channels installed in the measurement device, inspection items can be checked without mounting a switch such as a relay on the inspection circuit board of the conductor measurement device. The position of the movable member of the inspection apparatus according to claim 3 is arbitrarily controlled every time, so that the contact state between the external electrode of the semiconductor device and the conductive contact is changed, and the external electrode of the semiconductor apparatus and the inspection circuit board Since it is possible to select the presence or absence of electrical continuity with the upper land electrode, it is possible to inspect semiconductor devices without being restricted by the upper limit of the number of switches such as relays that can be mounted on the inspection circuit board It becomes.

  Furthermore, it is possible to reduce the total contact pressure applied to the semiconductor device by reducing the number of conductive contacts in contact with the external electrodes of the semiconductor device.

  As described above, according to the present invention, since the housing portion for housing the conductive contact is not formed only on the fixed member, but formed on the fixed member and the movable member, the main body portion of the terminal-shaped protruding portion. As a result, it is possible to mount a larger compression spring in the conductive contact than in the past, and to maintain the predetermined spring life and contact pressure. The contact can be miniaturized. Furthermore, since the ratio of the length of the terminal-shaped protrusion to the entire length of the conductive contact is reduced, the self-inductance of the conductive contact can be reduced.

  Further, by arbitrarily controlling the position of the movable member, it is possible to arbitrarily select whether or not the external electrode of the semiconductor device and the conductive contact are electrically connected, and the number of conductive contacts that contact the external electrode of the semiconductor device. As a result, the total contact pressure applied to the semiconductor device can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(Embodiment 1)
In FIG. 1, reference numeral 1 denotes an inspection device that measures and inspects the electrical characteristics of the semiconductor device 2 with a measuring device 4.

  The inspection apparatus 1 includes an inspection circuit board 5 connected to the measurement apparatus 4, a fixing member 8 that can be fixed to a predetermined position with respect to the inspection circuit board 5, and a movable member that is disposed in a movable state with respect to the fixing member 8. A member 9 and a plurality of pogo pin type conductive contacts 7 are provided.

  An external electrode 3 is formed on the semiconductor device 2, and a plurality of land electrodes 6 are formed on the upper surface of the inspection circuit substrate 5. The external electrode 3 of the semiconductor device 2 and the land electrode 6 of the inspection circuit board 5 are arranged to face each other.

  The fixing member 8 is detachably provided on the inspection circuit board 5 with screws (not shown) or the like. The fixed member 8 and the movable member 9 are both formed of an electrically insulating resin material, but are not limited to this. The conductive contact 7, the external electrode 3 of the semiconductor device 2, and the land electrode of the inspection circuit board 5 It is good also as a structure where the electrically insulating material was arrange | positioned only in the place which can contact 6.

  The movable member 9 is slidably supported by a guide pin (not shown) implanted in the fixed member 8 between the semiconductor device 2 and the fixed member 8, and a repulsive force of a spring or the like (not shown). Thus, the fixed member 8 is maintained in a floating state. When the movable member 9 is in a floating state, the distance between the movable member 9 and the fixed member 8 is arranged so as to be longer than the expansion / contraction operation range of the conductive contact 7. A main body housing portion 12 for housing the main body portion of the semiconductor device 2 is formed on the upper portion of the movable member 9, and an intermediate portion of the movable member 9 is for housing each external electrode 3 of the semiconductor device 2. A plurality of external terminal storage portions (exposed space portions) 13 are formed following the main body storage portion 12, and the main body storage portion 12 and the external terminal storage portion 13 constitute a storage portion. In the external terminal storage unit 13, the external electrode 3 of the semiconductor device 2 is stored in a state exposed downward.

  The movable member 9 and the fixed member 8 are divided into accommodating holes 10 and 11 as accommodating portions for accommodating the conductive contacts 7 at positions corresponding to the arrangement of the external electrodes 3 of the accommodated semiconductor device 2. The conductive contact 7 is accommodated so as to be stretchable and sandwiched. The depth of the accommodation hole 10 of the movable member 9 may be larger than 0 mm upward from the lower surface of the movable member 9.

  The pogo pin type conductive contact 7 has a configuration in which a coil-like compression spring 15 and a plunger 17 are provided inside a cylindrical body 14 as a main body. A terminal-shaped protrusion 16 that is thinner than the outer diameter of the cylindrical body 14 is formed at the tip of the cylindrical body 14 on the side facing the external electrode 3 of the semiconductor device 2. A distal end portion of 17 projects from the cylindrical body 14 so as to be able to move out and retract downward. The compression spring 15 is disposed between the wall surface of the cylindrical body 14 on the terminal-shaped protruding portion 16 side and the plunger 17, and biases the plunger 17 in the protruding direction (downward), so that the cylindrical body 14 and the terminal-shaped protruding portion are 16 is biased upward. Note that a regulating portion 14 a that regulates the plunger 17 so that it does not come downward is provided on the lower inner surface of the cylindrical body 14. Moreover, the terminal-shaped protrusion part 16, the cylinder 14, the compression spring 15, and the plunger 17 are formed with the electroconductive material (metal).

  The terminal-shaped protruding portion 16 of the cylindrical body 14 is pressed against the external electrode 3 of the semiconductor device 2 by the expansion and contraction (biasing force) of the compression spring 15, and the land of the inspection circuit board 5 connected to the measuring device 4. The outer electrode 3 and the land electrode 6 are electrically connected to each other through the cylindrical body 14 and the plunger 17 by being pressed against the electrode 6.

The operation of the above configuration will be described below with reference to FIGS.
As shown in FIG. 1, the movable member 9 is moved to the floating state, and the semiconductor device 2 is accommodated in the accommodating portions (the main body accommodating portion 12 and the external terminal accommodating portion 13) of the movable member 9. In this state, the plunger 17 is in contact with the land electrode 6 of the inspection circuit board 5, but the terminal-shaped protrusion 16 of the conductive contact 7 is not in contact with the external electrode 3 of the semiconductor device 2. , Separated.

  Thereafter, as shown in FIG. 2, by moving the semiconductor device 2 in a direction approaching the fixed member 3, the movable member 9 is also moved accordingly, and the conductive contact 7 is connected to the external electrode 3 of the semiconductor device 2. Since the terminal-shaped protrusion 16 is in contact and the plunger 17 is already in contact with the land electrode 6 of the test circuit board 5, the external electrode 3 of the semiconductor device 2 and the test circuit board 5 are electrically connected. Connected.

  According to this configuration, the housing holes 10 and 11 as housing portions for housing the conductive contacts 7 are not formed only in the fixed member 8, but are formed over the fixed member 8 and the movable member 9, The conductive contact 7 can be disposed in a state of being brought close to the external electrode 3 of the semiconductor device 2 disposed on the movable member 7 from the beginning. Therefore, the protruding amount of the terminal-shaped protruding portion 16 from the cylindrical body 14 can be reduced, and the terminal-shaped protruding portion 16 has a length necessary for the terminal-shaped protruding portion 16 of the conductive contact 7. The length of the terminal-shaped protruding portion 16 can be made smaller (that is, shorter) than in the prior art. Accordingly, it is possible to mount a larger compression spring 15 in the conductive contact 7 than in the prior art.

  Therefore, in order to reduce the size of the conductive contact 25 as in the prior art, it is not necessary to reduce the size of the compression spring 35 (see FIG. 7) while maintaining the length of the terminal-shaped protrusion 29 (see FIG. 7). The conductive contact 7 can be downsized while maintaining the life and contact pressure.

  Furthermore, the length ratio of the terminal-shaped protrusions 16 whose outer diameter is narrower than the outer diameter of the cylindrical body 14 can be reduced with respect to the total length of the conductive contact 7. In comparison, the self-inductance of the conductive contact 7 can be reduced.

(Embodiment 2)
In the inspection apparatus 1 according to this embodiment, the difference from the inspection apparatus 1 of the first embodiment is that, as shown in FIG. 3, the movable member 9 has a depth in the accommodation hole that accommodates the conductive contact 7. Is having the deep accommodation hole 18 and the shallow accommodation hole 19 at an arbitrary position. And the opening diameter dimension of the external terminal storage part 13 provided in the movable member 9 is smaller than the outer diameter dimension of the cylindrical body 14 of the conductive contact 7 and exceeds the outer diameter dimension of the terminal-shaped protrusion 16. Forming. Further, the opening diameter of the external terminal storage portion 13 is less than the diameter of the storage holes 18 and 19, and the back end portions 18a and 19a of the storage holes 18 and 19 are formed in steps. In addition, the dimension of the outer diameter of the terminal-shaped protruding portion 16 and the outer diameter of the cylindrical body 14 is also formed at the connection portion (one end surface of the cylindrical body 14) between the terminal-shaped protruding portion 16 and the cylindrical body 14 in the conductive contact 7. A stepped portion 14b formed by the difference is formed, and the rear end portions 18a, 19a of the receiving holes 18, 19 and the stepped portion 14b of the conductive contact 7 are disposed so as to be in contact with each other.

In this embodiment, two types of depth of the accommodation hole are provided, but two or more types of depths may be formed so as to have different depths.
The operation of the above configuration will be described below with reference to FIGS.

  FIG. 3 shows a case where the movable member 9 is in a floating state with respect to the fixed member 8. In this state, the plunger 17 is in contact with the land electrode 6 of the inspection circuit board 5, but the external electrode 3 of the semiconductor device 2. In contrast, the terminal-shaped protrusion 16 of the conductive contact 7 is spaced apart.

  When an external load is applied to the semiconductor device 2 from this floating state and the movable member 9 is moved together with the semiconductor device 2 to the position shown in FIG. 4 in the direction approaching the fixed member 8, the external electrode 3 of the semiconductor device 2 is applied. The terminal-shaped protrusions 16 of all the conductive contacts 7 come into contact with each other, and the external electrodes 3 of the semiconductor device 2 and the inspection circuit board 5 are electrically connected via the conductive contacts 7.

  If only the movable member 9 is moved in the direction approaching the fixed member 8 while maintaining the position of the semiconductor device 2 from this state, the inner end 19a of the accommodation hole 19 having a shallow depth of the movable member 9 becomes conductive. It contacts the step 14b of the cylindrical body 14 of the contact 7. When the movable member 9 is further moved in the direction approaching the fixed member 8, the stepped portion 14 b of the cylindrical body 14 is lowered by the rear end portion 19 a of the shallow accommodating hole 19 in the accommodating hole 19 where the depth of the movable member 9 is shallow. , The conductive contact 7 moves in the direction of the inspection circuit board 5 while the compression spring 35 is shortened, and the terminal-shaped protrusion 16 of the conductive contact 7 is separated from the external electrode 3 of the semiconductor device 2. Then, the electrical connection is broken.

  At this time, in the housing hole 18 in which the depth of the movable member 9 is deep, in this state, if the depth of the deep housing hole 18 is formed to a depth that does not contact the stepped portion 14b of the cylindrical body 14, the movable member 9 is movable. The conductive contact 7 inserted into the accommodating hole 18 having the deep member 9 maintains a state of being separated from the stepped portion 18a and does not move by being pushed. The state in contact with the external electrode 3 can be maintained.

  As described above, the presence or absence of electrical connection between the external electrode 3 of the semiconductor device 2 and the land electrode 6 of the test circuit board 5 is selected in an arbitrary conductive contact 7 by the relative position of the movable member 9 to the fixed member 8. it can.

  Further, when the movable member 9 is further moved closer to the fixed member 8 than the position shown in FIG. 5 while maintaining the position of the semiconductor device 2, the step between the external terminal storage portion 13 and the storage hole 18. The cylindrical body 14 comes into contact with the portion 18a. When further moved in the same direction, as shown in FIG. 6, in all the conductive contacts 7, the external electrodes 3 of the semiconductor device 2 and the terminal-shaped protrusions 16 of the conductive contacts 7 are separated from each other. The electrical connection is broken.

  As a result, the electrical connection between the external electrode 3 of the semiconductor device 2 and the land electrode 6 of the inspection circuit board 5 required depending on the inspection item can be performed without mounting a changeover switch such as a relay on the inspection circuit board 5. By controlling the position of the movable member 9, it can be arbitrarily selected and electrically connected and disconnected. In the case where a plurality of semiconductor devices 2 are inspected at the same time, it is possible to select an electrical connection to the external electrode 3 at the same location across the plurality of semiconductor devices 2, and simultaneous measurement can be performed as a result.

  Furthermore, since the number of conductive contacts 7 in contact with the external electrodes 3 of the semiconductor device 2 can be reduced, the total contact pressure applied to the semiconductor device 2 can be reduced.

  As described above, the present invention is useful for an inspection apparatus having a so-called pogo-pin type conductive contact, and it is possible to select whether or not an external electrode of any semiconductor device is in contact with the conductive contact. It is useful for an inspection apparatus and an inspection method for performing inspection at an arbitrary timing.

Sectional drawing which shows the inspection apparatus of the semiconductor device concerning the 1st Embodiment of this invention The figure which shows operation | movement of the test | inspection apparatus of the semiconductor device concerning the 1st Embodiment of this invention. Sectional drawing which shows the inspection apparatus of the semiconductor device concerning the 2nd Embodiment of this invention The figure which shows operation | movement of the test | inspection apparatus of the semiconductor device concerning the 2nd Embodiment of this invention. The figure which shows other operation | movement of the test | inspection apparatus of the semiconductor device concerning the 2nd Embodiment of this invention. The figure which shows other operation | movement of the test | inspection apparatus of the semiconductor device concerning the 2nd Embodiment of this invention. Sectional drawing which shows the inspection apparatus of the conventional semiconductor device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inspection apparatus 2 Semiconductor device 3 External electrode 4 Measuring apparatus 5 Inspection circuit board 6 Land electrode 7 Conductive contact 8 Fixed member 9 Movable member 10 Accommodating hole (accommodating hole of movable member)
11 receiving hole (receiving hole for fixing member)
12 Body storage part 13 External terminal storage part 14 Tubular body (main body part)
14b Stepped portion 15 Compression spring 16 Terminal-shaped protrusion 17 Plunger 18 Deep accommodation hole 19 Shallow accommodation hole

Claims (4)

A semiconductor device inspection apparatus for electrically connecting an external electrode of a semiconductor device and an inspection circuit board connected to a measurement apparatus for inspecting the semiconductor device,
A fixed member, a movable member disposed opposite to the fixed member, and a plurality of expandable and contractible conductive contacts that contact the external electrode of the semiconductor device and the land electrode of the inspection circuit board to conduct them. Is provided,
The fixing member is detachable from the inspection circuit board, and is fixed to the inspection circuit board at the time of mounting.
The movable member is provided with a storage portion in which the semiconductor device can be arranged in a direction in which the external electrode of the semiconductor device faces the land electrode of the inspection circuit board,
The conductive contact has a terminal-shaped protruding portion that is urged in a protruding direction by a compression spring housed in the main body portion and contacts an external electrode of the semiconductor device,
In the fixed member and the movable member, an accommodation hole that accommodates the conductive contact is divided across the fixed member and the movable member at a position corresponding to the arrangement of the external electrodes of the semiconductor device. An inspection apparatus for a semiconductor device, wherein the conductive contact is sandwiched and accommodated between the fixed member and the movable member in a state in which the conductive contact is formed in the accommodation hole. A conductive contact having a step formed by a dimensional difference between the outer diameter of the main body and the terminal-shaped protruding portion of the conductive contact, and the back end of the receiving hole of the conductive contact in the movable member and the conductive contact It is configured to be able to contact with the step part of
2. The inspection apparatus for a semiconductor device according to claim 1, wherein the accommodation hole of the movable member is formed at two or more different depths.   3. The semiconductor device according to claim 2, wherein whether or not an electrical connection between the external electrode of the semiconductor device and the conductive contact can be selected by a relative position of the movable member in the approaching and separating direction with respect to the fixed member. Inspection device.   4. A semiconductor device, wherein the semiconductor device is inspected by selectively performing the presence or absence of electrical continuity between an external electrode of the semiconductor device and an electrode of the inspection circuit board using the inspection device for a semiconductor device according to claim 3. Device inspection method.

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