JP2008172724A - Camera module, pedestal mount, imaging device, and manufacturing method of imaging device - Google Patents

Abstract

Provided is a camera module that is improved in workability for mounting on a circuit board while being reduced in size.
A camera module includes a sensor that converts incident light into an electrical signal, a glass cover that transmits light and enters the sensor, and forms an image of the incident light on the sensor via the glass cover. The lens unit 2 and the side wall portion 3e, the pedestal 3 holding the sensor 5, the glass cover 7, and the lens unit 2 are attached to the end surface of the side wall portion 3e of the pedestal 3 and fixed for joining to the circuit board. Metal fittings 11.
[Selection] Figure 3

Description

  The present invention relates to a camera module, a pedestal mount, an imaging apparatus, and a manufacturing method of the imaging apparatus that are mounted on, for example, a mobile phone.

  In recent years, camera systems have been installed in various devices such as mobile phones. In such a camera system, a camera module that forms a subject image on an image sensor using a microlens is widely used.

Here, for example, Patent Document 1 and Patent Document 2 exist as technologies related to the camera module.
Patent Document 1 discloses an electrical connection between a small camera module and a socket by adopting a structure in which a spring-like arm part of a frame-shaped socket does not hit the small camera module with respect to a structure for mounting the small camera module to the socket. A technique for improving the reliability of the system is disclosed.
Patent Document 2 discloses a technique in which when a camera module is inserted into a socket connector, the camera module is held in an elastically biased state by a spring terminal of the socket connector and a module fixing rib. Yes.

JP 2004-304604 A JP 2005-176185 A

  Here, when joining a camera module used in an imaging device such as a cellular phone to a circuit board, a method of manually connecting the camera module alone to the circuit board after joining other electronic components is generally adopted. It had been. However, when joining the camera module after joining other electronic components, the camera module is positioned on the circuit board and, if necessary, adhered with an adhesive, to the camera module and other surrounding electronic components. Therefore, a complicated work of electrically connecting the camera module with solder without causing thermal damage is required. For this reason, productivity was very low.

  In order to avoid this complicated work, the camera module is bonded to an FPC board separate from the circuit board, and after mounting the electronic components on the circuit board, the FPC board on which the camera module is mounted is connected by a connector. The way was done. However, this method has a limit on miniaturization of the camera module due to the presence of the FPC board and the connector.

  The present invention has been made to solve such technical problems, and the object of the present invention is to improve the workability when mounting the camera module on a circuit board while reducing the size of the camera module. It is to provide a camera module that can be used.

  In order to solve the above problems, a camera module according to the present invention includes an image sensor that converts incident light into an electrical signal, a cover member that transmits light and enters the image sensor, and incident light that passes through the cover member. A lens that forms an image on the imaging device, a pedestal mount that includes a side wall and holds the imaging device, the cover member, and the lens, and a joint that is formed on an end surface of the side wall of the pedestal mount and joins the pedestal mount to the circuit board It is characterized by including.

In the camera module, the joint portion is attached to an end surface of the side wall portion of the pedestal mount by insert molding.
In the camera module, the joint portion is formed by metal plating on the end surface of the side wall portion of the pedestal mount.
In the camera module, the pedestal mount holds the cover member by a convex portion formed on the inner wall surface of the side wall portion.
In the camera module, the joint portion includes a protruding claw formed integrally with the joint portion.

  In order to solve the above-described problems, a pedestal mount according to the present invention is formed on a lens holding portion that directly or indirectly holds a lens, a side wall portion that is provided continuously to the lens holding portion, and an end surface of the side wall portion. And a bonding portion bonded to the circuit board.

  In order to solve the above problems, an imaging apparatus according to the present invention includes an imaging element that converts incident light into an electrical signal, a cover member that transmits light and enters the imaging element, and the incident light that passes through the cover member. A lens that forms an image on the image pickup device, a pedestal mount that includes a side wall and holds the image pickup device, the cover member, and the lens, a joint formed on an end surface of the side wall of the pedestal mount, and output from the image pickup device And a circuit board including a signal processing unit for processing an electric signal.

  In the above imaging device, the joining portion is soldered to the circuit board, and the imaging element is electrically connected to the signal processing portion of the circuit board via a solder bump provided on the cover member. To do.

  In order to solve the above problems, a method of manufacturing an imaging apparatus according to the present invention includes a camera module including a pedestal mount that holds a cover member and a lens to which an imaging element is bonded, and an electrical signal output from the imaging element. A method of manufacturing an imaging device including a circuit board including a signal processing unit that processes a camera module, a mounting step of mounting the camera module on the circuit board, and a camera module by heating the circuit board on which the camera module is mounted And a heating step of bonding the pedestal mount to the circuit board.

  In the manufacturing method of the imaging apparatus, the heating step is performed by connecting the imaging element to the circuit board via the solder bump provided on the cover member when the joint formed on the end surface of the side wall of the pedestal mount is soldered to the circuit board. It is characterized by being electrically connected to the signal processing unit.

  According to the present invention, the camera module can be reduced in size, and workability when mounted on a circuit board can be improved.

(First embodiment)
The best mode (embodiment) for carrying out the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is an external perspective view showing a camera module 1 according to the present embodiment, and FIG. 2 is an exploded perspective view of the camera module 1 according to the present embodiment.

  As shown in FIGS. 1 and 2, the camera module 1 holds a plurality of lenses and forms a lens unit 2 that forms incident light on a sensor 5 (described later), and a pedestal 3 that holds the lens unit 2. It has. The camera module 1 also includes a filter 4 that removes a specific frequency component of external light, a sensor 5 that converts incident light into an electrical signal, and a rectangular glass cover that is disposed between the filter 4 and the sensor 5. 7. In addition, the part which attaches the lens unit 2 to the base 3 may be called a lens-barrel.

  The lens unit 2 includes a barrel (holder) 2a of the lens unit 2 body and a lens 2b (see FIG. 3) held by the barrel 2a. An opening 2d is formed on the end surface of the barrel 2a. The lens 2b is an optical element that transmits external light and forms an image on a light receiving region (imaging area) 5a (see FIG. 3) of the sensor 5. That is, the lens 2b forms a predetermined optical system so that light from the opening 2d enters and forms an image on the sensor 5. The lens 2b can be composed of a single lens or a plurality of lens groups. The lens unit 2 is screwed into the cylindrical portion 3a of the pedestal 3, and after image adjustment is performed by a screw action, the lens unit 2 is fixed to the pedestal 3 with an adhesive. Thereby, focusing of the lens unit 2 is realized.

  The barrel 2a and the pedestal 3 are made of a synthetic resin having a light shielding property such as a black liquid polymer, a polyphthalamide resin, a PEEK (polyether ether ketone) resin, and a heat resistance capable of withstanding a reflow temperature. The The lens 2b is made of a synthetic resin such as a transparent silicone resin or a heat resistant resin such as glass. Here, the heat resistant temperature is desirably 200 ° C. or higher, and more desirably 260 to 300 ° C.

The pedestal 3 is configured integrally with a cylindrical portion 3a to which the lens unit 2 is attached and a rectangular portion 3b that accommodates and holds the filter 4, the sensor 5, and the glass cover 7. The base 3 is configured such that the internal space of the cylindrical portion 3a and the internal space of the rectangular portion 3b are continuous. The pedestal 3 has a flange portion 3d (see FIG. 3) formed so as to extend from the inner surface and narrow the internal space. A fixing bracket 11 (described later) is attached to the lower end surface of the rectangular portion 3 b of the pedestal 3.
A female female 3c is formed on the inner peripheral surface of the cylindrical portion 3a of the pedestal 3, and a male screw 2c corresponding to the female female 3c is formed on the outer peripheral surface of the lens unit 2. As will be described later, the lens unit 2 is attached to the cylindrical portion 3a of the pedestal 3 by screwing. The lens 2b may be directly attached to the pedestal 3.

The filter 4 is a thin plate member that removes a specific frequency component of external light. In this embodiment, an infrared cut filter (IRCF) is used. The filter 4 is attached to the flange portion 3 d of the pedestal 3. When the filter 4 is attached to the flange portion 3d, the internal space of the base 3 is divided into two. The filter 4 is disposed in the vicinity of the sensor 5, thereby suppressing the influence of irregular reflection.
The sensor 5 is an image sensor (imaging device) such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). In the present embodiment, a sensor having a CSP (Chip Scale Package) structure is used. The sensor 5 generates and outputs an electrical signal according to the light imaged in the light receiving region 5a via the lens unit 2.

FIG. 3 is a longitudinal sectional view of the camera module 1 according to the present embodiment according to the present embodiment.
As shown in FIG. 3, the lens unit 2 has a barrel 2a of the lens unit 2 body and two lenses 2b held by the barrel 2a. In the present embodiment, it is composed of two lenses 2b, and an intermediate ring 2e is provided between the lenses 2b. The intermediate ring 2e has a diaphragm function that limits the amount of light passing therethrough. The lens press 2f holds the two lenses 2b. In the present embodiment, the lens unit 2 is composed of two lenses 2b, but it may be one or three.

A side wall 3e is formed on the lower end surface of the rectangular portion 3b of the pedestal 3 opposite to the cylindrical portion 3a. A glass cover 7 to which the sensor 5 is fixed via a solder bump 8 is accommodated inside a region formed by being surrounded by the side wall 3e of the pedestal 3.
The glass cover 7 is disposed between the filter 4 and the sensor 5. A sensor 5 is fixed to the glass cover 7. More specifically, a wiring pattern 7 a is provided in advance on the emission surface (lower surface) side of the glass cover 7. A plurality of solder bumps 8 are positioned so that the wiring pattern 7a and the sensor 5 are electrically and physically connected. Thus, the sensor 5 is physically fixed (bonded) to the glass cover 7 and electrically connected to the wiring pattern 7a of the glass cover 7 by the solder bumps 8 attached to the position of the wiring pattern 7a. ing.

Here, the distance between the sensor 5 and the glass cover 7 is determined by the size of the solder bump 8. Since it is easy to control the size of the solder bump 8, it is possible to accurately position the sensor 5 and the glass cover 7. Further, since the positioning is performed by the plurality of solder bumps 8, the distance between the sensor 5 and the glass cover 7 is averaged.
Solder bumps 9 are arranged at other positions of the wiring pattern 7 a on the light emission surface side of the glass cover 7. The solder bumps 9 ensure electrical connection between the glass cover 7 and a circuit board (not shown). The solder bumps 9 are also used as spacers for separating the sensor 5 fixed to the glass cover 7 and the circuit board from each other.

  On the entire periphery of the lower end surface of the side wall portion 3e of the rectangular portion 3b of the pedestal 3, a fixing bracket 11 is attached by insert molding. The fixing metal fitting 11 is pre-soldered. The fixing bracket 11 is soldered to the circuit board and the camera module 1 is joined to the circuit board. At the same time, the sensor 5 housed in the region surrounded by the side wall 3e of the base 3 is shielded from light. Further, when the camera module 1 is attached to the circuit board, the position is adjusted so that the fixing bracket 11 and the solder bump 9 simultaneously touch the solder pad (not shown) of the circuit board, so that the solder contact failure due to the displacement is prevented. It is preventing. Note that the fixing bracket 11 may be attached by, for example, an adhesive instead of insert molding.

A convex portion 10 is formed on the inner wall surface of the side wall portion 3 e of the pedestal 3. The convex portion 10 is provided on at least two opposing surfaces of the four inner wall surfaces of the side wall portion 3 e of the base 3. The glass cover 7 is press-fitted while riding on the convex portion 10, and the convex portion 10 hooks and holds the glass cover 7. Thereby, the glass cover 7 is held and is prevented from falling off. That is, the glass cover 7 is adhered to the pedestal 3 with an adhesive (not shown), and is held by the projections 10 to prevent the glass cover 7 from falling off. It does not fall off due to impact.
In addition, although the convex part 10 may be formed in the whole edge | side of the longitudinal direction of the inner wall face of the side wall part 3e, when the press fit is considered, the center of the inner wall face movable by press fit is preferable. Further, R may be formed at the tip of the convex portion 10.

Here, a manufacturing method of the camera module 1 according to the present embodiment will be described.
The sensor 5 is bonded and fixed in advance to the glass cover 7 by a plurality of solder bumps 8 with the light receiving region 5a facing the glass cover 7.
The lens unit 2 is temporarily screwed into the cylindrical portion 3 a of the pedestal 3. Then, the filter 4 is attached to the flange portion 3d of the base 3.

The glass cover 7 joined to the sensor 5 is fitted into a region formed by being surrounded by the side wall 3e of the base 3. At this time, the glass cover 7 rides on the convex part 10 formed on the inner wall surface of the side wall part 3e and is fitted.
Thereafter, an adhesive is poured into the gap between the side end face of the fitted glass cover 7 and the side wall 3e of the pedestal 3, and the glass cover 7 and the pedestal 3 are bonded. Alternatively, before the glass cover 7 to which the sensor 5 is bonded is fitted, an adhesive is poured into the pedestal 3 in advance to be bonded. At this time, the gap between the side end surface of the glass cover 7 and the side wall 3e is minimized. Therefore, when the glass cover 7 is fitted into the base 3, the light receiving area 5a of the sensor 5 is optically positioned in the imaging area of the lens 2b. That is, the vertical and horizontal optical axes are adjusted. Thereafter, after image adjustment is performed, the lens unit 2 is fixed to the base 3 with an adhesive.

A process in which the camera module 1 assembled as described above is mounted on a circuit board (not shown) by an automatic mounting machine (mounter) will be described below.
The assembled camera module 1 is mounted on a reel. The mounting process starts when the reel on which the camera module 1 is mounted is set on the mounter and the mounter is operated.
The mounter picks up the camera module 1 from the reel and mounts it at a predetermined position on the circuit board (mounting process). Solder paste is printed in advance on the circuit board where the camera module 1 is mounted. When the mounter mounts the camera module 1 at a predetermined position, the camera module 1 is temporarily fixed. Subsequently, the mounter mounts other electronic components on the circuit board to complete the mounting operation.

Next, the circuit board is transferred to a reflow furnace. In the reflow furnace, the circuit board is heated for several tens of seconds at a temperature at which the solder melts, for example, 260 ° C. or higher, and soldered (heating process).
When the solder paste printed on the circuit board melts and aggregates and cools, the fixing bracket 11 arranged on the lower end surface of the side wall portion 3e of the camera module 1 is soldered to the circuit board.
At this time, the solder bumps 9 arranged on the wiring pattern 7a of the glass cover 7 of the camera module 1 are also melted and soldered to terminals (not shown) formed in advance on the circuit board. Thereby, the sensor 5 in the camera module 1 and the signal processing unit (ISP 101 in FIG. 6) on the circuit board are electrically connected.

  In addition, although the example in which the camera module 1 is soldered to the circuit board has been described, the camera module 1 may be bonded using a thermosetting adhesive. In addition, the filter 4 is not only attached to the pedestal 3, but may be provided with a recess in the pedestal 3, or may be sandwiched between the glass cover 7 and the pedestal 3.

  Thus, according to the camera module 1 according to the present embodiment, various parts are manufactured using a material having heat resistance sufficient to withstand the heat applied in the reflow furnace. Generally, the heat resistance temperature of resin materials such as lenses, barrels, and pedestal mounts is lower than the temperature applied during the solder bonding process of other electronic components. Therefore, when joining the camera module to the circuit board, a method of joining the camera module alone to the circuit board after the joining of other electronic components has been adopted. On the other hand, in the present embodiment, since a heat-resistant component is employed, the camera module 1 can be mounted on a circuit board together with other electronic components and placed in a reflow furnace. Thereby, the work of mounting the camera module 1 alone on the circuit board separately from other electronic components and the work of joining the camera module 1 alone to the circuit board can be omitted, and the workability can be improved.

Also, the mounter can mount the camera module 1 on the circuit board. Therefore, the mounting workability can be improved.
The mounting area can be reduced by automatic mounting by the mounter. Therefore, the camera module 1 can be downsized. The flexible board (FPC board) and the connector connection provided in the conventional camera module can be eliminated, thereby reducing the size. Compared to the conventional product, the mounting area ratio of the components was reduced to about 50% of the conventional product.

Further, in the camera module 1, the fixing bracket 11 is attached to the side wall portion 3e of the pedestal 3, so that when the camera module 1 is joined to the circuit board, it can be joined using solder.
Since the fixing metal fitting 11 is attached to the upper end surface of the entire circumference of the side wall portion 3e, when the camera module 1 is soldered to the circuit board, the inside of the region surrounded by the side wall portion 3e is shielded from light. .
Further, in the camera module 1, the glass cover 7 to which the sensor 5 is fixed is held on the pedestal 3 by the convex portion 10 provided on the inner wall surface of the side wall portion 3 e. Therefore, when the camera module 1 is transported alone or automatically mounted by the mounter, the glass cover 7 does not fall off the pedestal 3.

Furthermore, according to the camera module 1, the fixing bracket 11 on the lower end surface of the side wall portion 3e of the base 3 and the solder bumps 9 attached to the wiring pattern 7a of the cover glass 7 are simultaneously connected to the terminals of the circuit board (not shown). Since the position is adjusted so as to touch the solder, poor contact of solder due to misalignment is prevented.
In the camera module 1, the fixing bracket 11 is attached to the side wall 3e of the pedestal 3 by insert molding. Therefore, it is possible to attach the fixing bracket 11 to the base 3 at a low cost. Also, it can be securely attached.

(Other embodiments)
FIG. 4 is a longitudinal sectional view of the camera module 15. The same members as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
In the camera module 1 according to the first embodiment, the fixing bracket 11 is embedded in the lower end surface of the side wall 3e of the pedestal 3 by insert molding. However, in the camera module 15 shown in FIG. 4, the side wall 3e. An attachment portion 13 is formed by applying metal plating to the lower end surface. Thereby, when joining the camera module 15 to a circuit board, it can join using solder.

FIG. 5 is a longitudinal sectional view of the camera module 20.
In the camera module 1 according to the first embodiment described above, since the convex portion 10 is formed on the side wall 3e of the pedestal 3, the mold of the pedestal 3 requires a slide mold, and the manufacturing cost of the mold Becomes higher.
As a countermeasure, the camera module 20 shown in FIG. 5 has a shape that does not require sliding on the mold. Specifically, in the camera module 1 according to the first embodiment, the convex portion 10 holds the glass cover 7, but in the camera module 20, the fixing bracket 11 includes the protruding claws 12. Held the glass cover 7. That is, the fixing metal fitting 11 has substantially the same shape as that of the first embodiment, but differs in that it has a protruding claw 12.

Since the projection claw 12 is manufactured integrally with the fixing bracket 11, a material having a restoring force is preferable. For example, a spring material such as phosphor bronze is preferable.
When the fixing metal fitting 11 is embedded in the side wall portion 3e of the base 3 by insert molding using a mold, the protruding claw 12 has a size protruding from the inner wall surface of the side wall portion 3e. Then, using the same method as the manufacturing method of the camera module 1 described in the first embodiment, the projection claw 12 is run up and the glass cover 7 is fitted, so that the edge of the glass cover 7 is hooked on the projection 12. To prevent falling off.

The fixing bracket 11 having the protruding claws 12 can hold the glass cover 7 as long as it is formed on at least three walls of the side wall 3e of the base 3. In particular, if a force is required when the cover glass 7 is attached, or if there is a risk of the cover glass 7 being damaged during the attachment, the cover glass 7 is preferably provided on three walls.
Thereby, in the camera module 20, there is no convex part in the base 3, and the base 3 can be manufactured without using a slide mold. As a result, the cost of the mold can be kept low, and the molding operation time can be shortened because the slide process is not required when the base 3 is taken out from the mold.

  Thus, according to the camera module 20, since the side wall 3e of the pedestal 3 does not have a convex shape (the convex portion 10 in the first embodiment) that restricts the mold drawing direction, the pedestal 3 is manufactured. Does not require a slide mold. As a result, the mold cost can be kept low, and the manufacturing process can be kept low because the slide process is not required in the manufacture of the base 3.

(Imaging device)
Next, a mobile phone 100 as an example of a mobile device equipped with the camera module 1 according to the first embodiment will be described. In addition to the cellular phone 100, the camera module 1 can be applied to, for example, a camera mounted on a personal computer or a PDA (Personal Digital Assistant), a camera mounted on a car, or a surveillance camera. .

FIG. 6 is a block diagram showing the configuration of the mobile phone 100.
As illustrated in FIG. 6, the mobile phone 100 performs an image processor (ISP) 101 as an example of a signal processing unit that performs image processing on an image signal from the camera module 1 and various controls in the mobile phone 100. An MPU (Micro Processing Unit) 102 and an input key 103 for giving an instruction from the user to the MPU 102 are provided. In addition, the mobile phone 100 includes a liquid crystal display (LCD) 104 that displays a subject photographed by the camera module 1. The cellular phone 100 includes a memory 105 that stores various information for controlling the cellular phone 100 and a memory card 106 that records image data.

  Furthermore, the mobile phone 100 receives, for example, mobile phone band radio waves via the antenna 107 and communicates with an RF (Radio Frequency) unit 108 that performs wireless communication with a server provided by a mobile phone operator or the like. A baseband unit 109 that generates a sound signal, an audio codec unit 112 that reproduces sound such as a voice during a call and a ringing melody, and a speaker 110 that outputs a ringing sound based on the signal from the audio codec unit 112 The LED 111 is provided to notify the incoming call by light.

In addition, the mobile phone 100 communicates with the MPU 102 through an interface such as IIC or SPI to transmit / receive signals.
Here, among the components shown in FIG. 6, a circuit board (not shown) on which the ISP 101, the memory 105, and the like are mounted corresponds to the circuit board in the first embodiment.

  In the mobile phone 100, when the digital camera use mode is selected with the input key 103, the MPU 102 starts communication with the camera module 1. Then, the MPU 102 transmits a control signal to the camera module 1. Then, the light from the subject that has passed through the lens 2b of the camera module 1 is converted into an electrical signal by the sensor 5 of the camera module 1, and signal processing is performed by the ISP 101. The image signal processed by the ISP 101 is temporarily stored in the memory 105 of the mobile phone 100 and displayed on the LCD 104 as a through image.

The subject is shot with the shutter button on the input key 103. When the shutter button is pressed, the MPU 102 stores the image data processed by the ISP 101 in the memory 105. The MPU 102 includes a compression / decompression circuit using a technique such as JPEG or MPEG, and the image data stored in the memory 105 is compressed by the MPU 102 and recorded on the memory card 106. Further, the image data recorded on the memory card 106 can be decompressed by the MPU 102, read into the memory 105, and displayed again on the LCD 104.
Note that the MPU 102 can select a shooting mode and set white balance, exposure, sensitivity, and the like by an operation from the input key 103. Further, when the image data processed by the ISP 101 is stored in the memory 105, digital zoom processing can be performed.

  Thus, the mobile phone 100 according to the present embodiment employs the camera module 1 that can be automatically mounted on a circuit board by a mounter and soldered by a reflow furnace. Therefore, since the camera module 1 with improved manufacturing workability is employed, the manufacturing cost of the mobile phone 100 can be reduced. In addition, since the camera module 1 that is miniaturized by eliminating the FPC board and connector provided in the conventional camera module is employed, the mobile phone 100 can be miniaturized.

1 is an external perspective view of a camera module according to a first embodiment. It is a disassembled perspective view of the camera module shown in FIG. It is a longitudinal cross-sectional view of the camera module shown in FIG. It is a longitudinal cross-sectional view of the camera module concerning other embodiment. It is a longitudinal cross-sectional view of the camera module concerning other embodiment. It is the block diagram which showed the structure of the mobile telephone which employ | adopted the camera module shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,15,20 ... Camera module, 2 ... Lens unit (lens), 2a ... Barrel, 2b ... Lens, 2d ... Opening, 2e ... Intermediate ring, 2f ... Lens holder, 3 ... Base (pedestal mount), 3a ... Cylindrical portion, 3b ... rectangular portion, 3d ... flange portion, 3e ... side wall portion, 4 ... filter, 5 ... sensor (imaging element), 5a ... light receiving region, 7 ... glass cover (cover member), 7a ... wiring pattern, 8 DESCRIPTION OF SYMBOLS, 9 ... Solder bump, 10 ... Convex part, 11 ... Fixing metal fitting, 12 ... Projection nail, 13 ... Mounting part, 100 ... Mobile phone, 101 ... Image processor (ISP) (signal processing part)

Claims (10)

An image sensor that converts incident light into an electrical signal;
A cover member that transmits light and enters the image sensor;
A lens that focuses incident light on the image sensor through the cover member;
A pedestal mount that includes a side wall and holds the imaging element, the cover member, and the lens;
A camera module, comprising: a joint portion that is formed on an end surface of the side wall portion of the pedestal mount and joins the pedestal mount to a circuit board.   The camera module according to claim 1, wherein the joint portion is attached to the end surface of the side wall portion of the pedestal mount by insert molding.   The camera module according to claim 1, wherein the joint portion is formed by metal plating on an end surface of the side wall portion of the pedestal mount.   The camera module according to claim 1, wherein the pedestal mount holds the cover member by a convex portion formed on an inner wall surface of the side wall portion.   The camera module according to claim 1, wherein the joint portion includes a protrusion claw formed integrally with the joint portion. A lens holding part for holding the lens directly or indirectly;
A side wall portion provided continuously to the lens holding portion;
A pedestal mount comprising: a joint portion formed on an end surface of the side wall portion and joined to a circuit board. An image sensor that converts incident light into an electrical signal;
A cover member that transmits light and enters the image sensor;
A lens that focuses incident light on the image sensor through the cover member;
A pedestal mount that includes a side wall and holds the imaging element, the cover member, and the lens;
A joint formed on an end surface of the side wall of the pedestal mount;
An image pickup apparatus comprising: a circuit board including a signal processing unit that processes an electric signal output from the image pickup element. The joint is soldered to the circuit board,
The image pickup apparatus according to claim 7, wherein the image pickup element is electrically connected to the signal processing unit of the circuit board via a solder bump provided in the cover member. A camera module including a pedestal mount for holding a cover member and a lens to which an image sensor is bonded;
A circuit board including a signal processing unit that processes an electrical signal output from the imaging device, and a manufacturing method of an imaging device comprising:
A mounting step of mounting the camera module on the circuit board;
And a heating step of bonding the pedestal mount of the camera module to the circuit board by heating the circuit board on which the camera module is mounted.   In the heating step, when the joint portion formed on the end surface of the side wall portion of the pedestal mount is solder-joined to the circuit board, the imaging element is placed on the circuit board via the solder bump provided on the cover member. The method of manufacturing an imaging apparatus according to claim 9, wherein the imaging apparatus is electrically connected to the signal processing unit.

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