JP2008164595A - Apparatus for raising/lowering temperature, and high and low temperature test handler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for raising/lowering a temperature which raises or lowers the temperature of numerous semiconductor devices at a time in a handler for performing high temperature test and low temperature test to realize high-speed processing as the whole apparatus, and also to provide the high and low temperature test handler. <P>SOLUTION: The high and low temperature test handler 1 includes, in a chamber 2, the test handler 3 for carrying out various kinds of process treatments for a semiconductor device, and the apparatus 4 for raising/lowering the temperature for transferring the semiconductor device raised or lowered in temperature to the test handler 3. The apparatus 4 includes a drum 41 having torque applied by a motor not shown and rotating around the rotation shaft O. The drum 41 consists of a plurality of cylindrical storage rails 42, which is arranged in a circle, including inside a conveyance path for the semiconductor and having an opening along the outer peripheral direction of the drum 41. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an improvement in a test handler that performs various process processes on devices such as electronic components and semiconductor devices, and in particular, a device for lowering the temperature of a device that can increase the temperature of a large number of devices at once, and Related to high / low temperature test handler.

  Conventionally, devices are mainly used indoors, such as audio, television, and personal computers. However, in recent years, with the introduction of IT in automobiles, they have been used in various applications for automobiles. For this reason, the environment used by automobiles, in extreme cases, is required to have performance that can be used mainly in high temperatures and low temperatures, such as desert areas and the Arctic Circle.

  The device structure consists of a pellet made of aluminum wiring on a silicon substrate, a board (copper, glass epoxy, etc.) on which it is mounted, wiring to connect them (gold, aluminum, solder, etc.), and the whole It is composed of a protective resin.

  As mentioned above, the device is composed of various substances, but the thermal expansion coefficient and thermal resistance are different, respectively, the characteristics at normal temperature and the characteristics at high temperatures such as deserts and low temperatures such as the Arctic Circle, In the worst case, it may not operate in a high and low temperature environment. Therefore, when performing device characteristic inspection, it is necessary to assume the use under such high temperature and low temperature conditions.

  In addition, as described above, since the device has a different coefficient of thermal expansion depending on the properties of the stacked components, the substances contained in the components expand due to temperature changes from the time of assembly at room temperature. It is conceivable that cracks (cracks) occur in the entire part and it will not function. Since the thermal resistance also varies depending on the properties of the materials constituting the part, the electrical characteristics obtained at room temperature may not be obtained at high and low temperatures.

  Thus, for example, a low temperature handler for IC has been proposed that performs IC quality inspection in a low temperature environment in a chamber assuming use at a low temperature (see Patent Document 1). According to this document, it is configured so that the inside of the chamber is kept at a positive pressure and outside air containing moisture is not mixed in the chamber without increasing the size of the apparatus, and the chamber is kept in a low temperature environment while being kept in the low temperature environment. The purpose is to prevent frost formation on the cooling unit of the apparatus due to moisture in the entire air flowing into the inside.

  Also, assuming use under high temperatures, a rail-shaped heater is provided before the device mounted on the lead frame is transported to the test position, and a plurality of devices waiting for testing are placed on the rail-shaped heater. A technique has been proposed in which the devices can be heated to a desired temperature with the heat of the heater by arranging them (see Patent Document 2).

There is also proposed an apparatus in which a plurality of rows of conveyance rails provided with heating means are provided in the middle of the conveyance path, a lead frame moves on the conveyance rails, and a device is heated on the rails to perform a test (patent) Reference 3).
JP-A-6-148268 JP 2004-219226 A JP 2005-62090 A

  By the way, when testing a device under the assumption of high and low temperatures, the test temperature is around 120 ° C. in the high temperature test and about −40 ° C. in the low temperature test.

  As a method for raising the temperature to a high temperature environment, for example, when the temperature of the device is raised from room temperature to 125 ° C., a sudden temperature change causes a large damage to the device. Moreover, even if the device surface has reached a predetermined temperature, the inside of the device may not have reached the predetermined temperature. Therefore, it is necessary to spend at least about 90 seconds to heat the device slowly. This also applies to the case of being placed in a low temperature environment.

  In this regard, in the test apparatuses in Patent Documents 1 and 2, since the devices are aligned in a row, and the test is performed one by one by sequentially heating or cooling, the soak time for raising or lowering the temperature of the device is tested. Since it is long with respect to time, the processing time as a whole also becomes long, and in order to shorten processing time, it was necessary to heat a lot of devices at once.

  In addition, when a plurality of rails are provided in parallel as in Patent Document 3, a space is required in the apparatus configuration when a large number of electronic components are processed at the same time by increasing the number of rails.

  Furthermore, if it is a device like DIP / SIP (pin insertion type) used conventionally, the method of putting an electric heater in a conveyance rail and applying it like patent document 2 and 3 was main. In recent SMD (surface mount type) devices, since the product is transported by a transport arm or the like, it is preferable to measure by making the inside of the measuring section into a high-temperature tank by high-temperature air blow or the like.

  The present invention has been proposed in order to solve the above-described problems of the prior art. The object of the present invention is to increase or decrease the temperature of a large number of devices at a time in a handler that performs a high temperature test and a low temperature test. It is an object of the present invention to provide a high temperature reducing device and a high temperature test handler for devices such as electronic parts and semiconductor devices which can realize high-speed processing as a whole device.

  In order to achieve the above object, the invention of claim 1 is an apparatus for lowering the temperature of a device that receives a device, heats or cools it with a predetermined heating or cooling means, and sequentially delivers it to a conveying device that performs various process treatments. A storage rail having a device transport path and capable of storing a plurality of devices, a plurality of storage rails arranged and held at predetermined intervals in an annular shape, and a plurality of storage rails arranged in the annular shape And a driving means for intermittently rotating through the support portion.

  The invention of claim 6 relates to a high / low temperature test handler comprising the high / low temperature apparatus of claim 1, which receives a device such as an electronic component or a semiconductor device and heats or cools it by a predetermined heating or cooling means. A high and low temperature test handler for a device that is sequentially transferred to a transfer device that performs various process processes, and is disposed in a chamber and performs various process processes on the device, and a high or low temperature for the test handler. A high temperature reduction apparatus that delivers a device that has been converted to a high temperature, a high temperature reduction means that heats or cools the atmosphere in the chamber, and a supply apparatus that is disposed outside the chamber and delivers the device to the high temperature reduction apparatus. The high temperature reducing device includes a device rail and a storage rail that can store a plurality of devices, and the storage rail is arranged and held in a plurality of annular shapes. A lifting unit, characterized in that a plurality of storage rails arranged on the annular with a drive means to intermittently rotate through the support portion.

  According to the above aspect, the high temperature reducing apparatus used for the test handler is provided with a plurality of storage rails that can store a plurality of devices therein in an annular shape and is configured to be rotatable via the support portion. A large number of devices can be simultaneously stored in the entire storage rail. Therefore, a large number of devices can be held at the same time, heated or cooled, and devices can be transferred one by one to a separately provided test handler. As a result, it is possible to sufficiently ensure the soak time for the device, that is, the heating or cooling time in the impregnated state in the high temperature reducing apparatus without delaying the delivery timing to the test handler.

  Further, by arranging the storage rails in an annular shape, it is possible to save space compared to the case where the storage rails are arranged in parallel in a planar shape. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating.

  According to a second aspect of the present invention, in the first aspect of the present invention, the support member is a disk that holds the storage rails arranged in an annular shape from the inner peripheral surface at both ends, and a rotation shaft is provided at the center of the disk. The drive means rotates the rotary shaft.

  According to a third aspect of the present invention, in the first aspect of the present invention, the support member includes a pulley and a belt that is hung on the pulley, the storage rail is disposed at a predetermined interval on the belt, and the driving unit includes: The rotating shaft of the pulley is rotated.

  According to the above aspect, when the storage rails are arranged in an annular shape, various configurations can be employed depending on the purpose, application, and arrangement space of the apparatus.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the storage rail includes a narrow groove, and the narrow groove is disposed on an outer peripheral side of the storage rail disposed in the annular shape. The storage rail is disposed so as to be positioned, and the device stored in the storage rail is pushed out by the rod-shaped body inserted into the narrow groove, and is transported in the storage rail. .

  According to the above aspect, the rod-shaped body is inserted into the narrow groove provided in the storage rail arranged in an annular shape, thereby pushing the device stored in the storage rail to the test handler side. Thus, it is possible to supply a device to the test handler.

  According to a fifth aspect of the present invention, in the invention according to any one of the first to third aspects, the storage rail and the support member are inclined and installed in a transport direction of a device stored inside the storage rail. It is characterized by being.

  In the aspect as described above, when the storage rail and the support member are inclined toward the device transport direction, for example, when the devices are picked up one by one at the delivery position to the test handler, the weight of the device is reduced. Thus, the device is transported.

  According to a seventh aspect of the invention, in the sixth aspect of the invention, the test handler and the supply device are arranged at both ends of the high temperature reducing device, and the supply device in the storage rail of the high temperature reducing device is provided. The device receiving position and the device delivery position from the storage rail to the test handler of the high temperature reducing device are positions adjacent to each other on the circumference of the storage rail arranged in an annular shape, The receiving position is provided downstream of the delivery position in the rotation direction of the storage rail.

  According to the aspect as described above, the receiving position of the device from the supply device and the delivery position of the device to the test handler are not provided at the same storage rail position, and the receiving position is the adjacent position and the delivery position. By providing the storage rail on the downstream side of the storage rail, the device can be smoothly replaced with the storage rail.

  The invention according to claim 8 includes various processing steps of taping and packing the device through appearance inspection and electrical property inspection of the device such as the semiconductor device or the electronic component while the device such as the semiconductor device or the electronic component is conveyed by the conveyance device. A test handler having a process processing unit for performing a process of receiving a device from a holding mechanism provided in the transfer device, heating or cooling the device and sequentially transferring the device to the holding mechanism, or both The high-temperature reduction apparatus having the function is provided as a one-process processing unit, the high-temperature reduction apparatus includes a device conveyance path, and a plurality of storage rails capable of storing a plurality of devices and a plurality of the storage rails at predetermined intervals. A support portion arranged and held in an annular shape, and a plurality of storage rails arranged in an annular shape are intermittently rotated via the support portion. Characterized in that a that the drive means.

  In the above-described aspect, since the device is received and stored on the storage rail from the transfer device side, and the device is transferred again to the transfer device, it can be configured as one processing step processing device of the transfer device. Compared to a configuration in which devices are held on rails and heated and delivered sequentially, there is no need to prepare a new test handler for high temperature testing. Costs can be kept low.

  According to a ninth aspect of the present invention, in the eighth aspect of the invention, the high temperature reducing apparatus receives the device from a holding position provided in the transfer device and a holding position provided in the transfer device. The delivery position is provided at a stop position adjacent to the holding mechanism in the transport device, and the receive position is provided on the upstream side in the transport direction of the transport device among the adjacent stop positions. Of the adjacent stop positions, it is provided on the downstream side in the transport direction of the transport device.

  The receiving position of the device from the transfer device and the delivery position of the device to the transfer device are not provided at the same storage rail position, but are stored at adjacent positions and at the upstream side of the transfer position. The device can be replaced smoothly on the rail.

  According to the present invention as described above, in a handler that performs a high temperature test and a low temperature test, an electronic component or a semiconductor device that enables high temperature or low temperature of a large number of devices at a time and realizes high-speed processing as the entire apparatus. It is possible to provide a high temperature reduction apparatus and a high temperature test handler for such devices.

  Next, the best mode for carrying out the present invention (hereinafter referred to as the present embodiment) will be described with reference to FIGS.

(1) First Embodiment [Configuration]
As shown in FIG. 1, a high / low temperature test handler 1 according to the first embodiment of the present invention includes a test handler 3 that performs various process processes on a device in a chamber 2, and a high temperature for the test handler 3. Alternatively, the apparatus includes a high temperature reduction device 4 that delivers a device such as a temperature-reduced electronic component or a semiconductor device, and a high temperature reduction means 5 that heats or cools the atmosphere in the chamber. And a supply device 6 for delivering the device to the conversion device 4.

  The test handler 3 receives a device processed by the high temperature reducing device 4 at the delivery position X of the high temperature reducing device 4, and while holding this device by suction, a position correction process, an electrical measurement process, a stamping process, taping It conveys between various processes, such as a process, and inspects a device.

  As shown in the partial cross-sectional view of FIG. 2, the high temperature reducing device 4 includes a drum 41 that is rotated about a rotation axis O and is given a rotational force by a motor (not shown). The drum 41 has a cylindrical shape and is provided with a device conveyance path inside, and a storage rail 42 having an opening in the outer peripheral surface of the drum 41 is arranged in a plurality of annular shapes. The drum 41 also includes support members 43 that maintain the storage rail 42 in an annular shape at both ends of the storage rail 42. The support member 43 is formed in a disc shape, and supports the storage rail 42 from the inner peripheral surface side at both ends of the drum 41. And this support member 43 is connected with the rotating shaft O provided in the center axis | shaft of the drum 41 in the center part.

  In this embodiment, the drum 41 has 16 storage rails 42 arranged at intervals of 22.5 degrees, and the rotation shaft 41 is rotated by a motor (not shown), so that the storage rails 42 are spaced at intervals of 22.5 degrees. It is designed to rotate intermittently.

  As shown in FIG. 1, the drum 41 has a device receiving position X on the supply device 6 side and a device delivery position Y on the opposite test handler 3 side. That is, the receiving position X is provided at the supply device 6 side end, which is the inlet side of the drum 41, of the storage rail 42b adjacent to the rotation direction indicated by the arrow of the drum 41 relative to the storage rail 42a at the top of the annular shape. It has been. On the other hand, the delivery position Y is provided at the end of the storage rail 42a located at the top of the annular shape, on the end side of the test handler 3, which is the exit side of the drum 41.

  As shown in FIG. 3, the shape of one storage rail 42 is a narrow groove on a surface located on the outer periphery when the drum 41 is formed as a cylindrical surface with a rectangular cross section. It has. Further, the size of the inner peripheral surface forming the transport path of the storage rail 42 is designed according to the size of the device to be processed, and the transported device can be transported without clogging or contacting the side surface. It is designed appropriately to a certain size.

  The axial lengths of the drum 41 and the storage rail 42 are determined by the number of devices waiting in the conveyance path of the storage rail 42 and the desired number of devices for batch processing. The number of standbys of this device is such that the delivery time interval for the test handler 3 (the sum of the transport time per intermittent rotation of the test handler 3 and the index time which is the processing time in one process) and the device at a predetermined temperature. Heating or cooling time is taken into account. For example, it is considered that the delivery time interval in the test handler 3 is 0.2 to 0.3 seconds, and the heating time of the device is 90 seconds. In the present embodiment, about 50 devices are configured to be stored in one storage rail 42.

  Further, the high temperature reducing device 4 is a pressing rod that pushes a device stored in the storage rail 42a from the supply device 6 side to the test handler 3 side on the storage rail 42a positioned at the top of the annular shape of the drum 41. 44. The pressing bar 44 enters the groove of the storage rail 42a located at the top of the annular shape, and moves in the axial direction of the drum 41 to physically press the device stored in the storage rail 42, thereby causing the test handler 3 to move. It conveys to the side. The pressing bar 44 is also configured to retreat from a position where it is inserted into the groove of the storage rail 42 and move to a position where it does not interfere with the groove, and all of the group of devices stored in the storage rail 42a are tested. After being conveyed to the side, the sheet is retracted to a position where it does not interfere with the groove and moves to the supply device 6 side.

  The high temperature lowering means 5 is configured by high temperature air blow or the like, and is a means for setting the atmosphere in the chamber 2 to a high temperature or low temperature environment. Specifically, the inside of the chamber 2 is set to around 120 ° C. when the temperature is high, and about −40 ° C. when the temperature is low. In the present embodiment, means for increasing the temperature only in the chamber 2 is adopted. However, since a sudden temperature change causes a large damage to the device, before entering the chamber 2, for example, the supply device 6 It is also possible to pre-heat when supplying with.

  The supply device 6 includes an alignment rail 61, a transfer rail 62, and a supply rail 63. The alignment rail 61 includes a linear groove 61a. Devices are sequentially supplied to the linear groove 61a from device alignment supply means such as a parts feeder and a tube feeder (not shown), and the devices are aligned and mounted on the rail. It is supposed to be placed. Devices sequentially supplied to the alignment rail 61 are sequentially delivered to the transfer rail 62.

  The transfer rail 62 is provided with a groove 62a that forms a device transport path continuously to the alignment rail 61, and a device transported from the alignment rail 61 is placed in the groove 62a.

  Similarly to the alignment rail 61 and the transfer rail 62, the supply rail 63 includes a groove 63 a serving as a device conveyance path, and is connected and fixed to a device receiving position X provided on the supply device 6 side of the drum 41. . That is, the device is supplied from the supply rail 63 to the storage rail 42 a of the drum 41. In the present embodiment, the alignment rail 61 and the supply rail 63 are provided at an angle of 22.5 degrees in accordance with the position of the storage rail 42.

  Here, as shown in FIG. 1 or 4, the transfer rail 62 connects the alignment rail 61 and the supply rail 63, and transfers the device received from the alignment rail 61 to the supply rail 63. More specifically, the transfer rail 62 is horizontal from the alignment rail 61 and from a position where the groove 61a and the groove 62a are continuous to a position where the transfer rail 62 is horizontal from the supply rail 63 and is continuous from the groove 62a and the groove 63a. A rotation support part 64 that rotates the transfer rail 62 along the same circumference as the circumference of the drum 41 is provided, and the rotation support part 64 moves between the alignment rail 61 and the supply rail 63. Is configured to do.

  The transfer rail 62 moves to the supply rail 63 side when the device received from the alignment rail 61 is filled to fill the groove of the transfer rail 62, and all the devices in the groove are delivered to the supply rail 63. By the way, it returns to the alignment rail 61 side.

  Then, when the device is transferred from the transfer rail 62 to the supply rail 63 and the transfer rail 62 returns to the alignment rail 61 side, the device on the supply rail 63 is configured to be conveyed to the storage rail 42b. .

  It should be noted that the mechanism for transporting the devices placed in the grooves of the alignment rail 61, the transfer rail 62, and the supply rail 63 is a known linear component transfer, such as a configuration in which vibrations and air act in the transport direction. Any configuration of means can be used. In this regard, in the present embodiment, as a pressing rod 65 shown as an example in the figure, it has substantially the same shape as the groove of the transport path R, and is configured to move in the groove toward the storage rail 42. Yes. As a result, devices placed in alignment in the grooves of the alignment rail 61, the transfer rail 62, and the supply rail 63 are delivered to the storage rail 42 one by one.

[Function and effect]
The high / low temperature test handler 1 configured as described above operates as follows.
Referring to FIG. 4, first, devices are sequentially supplied from a device alignment supply means such as a parts feeder (not shown) to the linear groove 61 a of the alignment rail 61. The devices sequentially supplied to the alignment rail 61 are then sequentially transferred to the grooves 62a of the transfer rail 62.

  The transfer rail 62 is moved to the supply rail 63 side when the device received from the alignment rail 61 is filled to fill the groove of the transfer rail 62, and when all the devices in the groove are delivered to the supply rail 63. , And return to the alignment rail 61 side.

  Then, when the device is transferred from the transfer rail 62 to the supply rail 63 and the transfer rail 62 returns to the alignment rail 61 side, the devices on the supply rail 63 are received one by one by the pressing rod 65 into the storage rail 42b. It is supposed to be passed.

Next, the delivery to the high temperature reducing device 4 and the operation of the device will be described.
Referring to FIG. 1, first, as an initial state, devices are placed on the storage rails 42 one by one from the supply rail 63 as described above. At this time, the inside of the chamber 2 has an atmosphere of about 120 ° C. when the temperature is high, and an atmosphere of about −40 ° C. when the temperature is low.

  Here, for example, when the number of devices stored in the storage rail 42b is 18, and the number of devices mounted on each of the alignment rail 61, the transfer rail 62, and the supply rail 63 is nine, the storage rail For each row of 42b, delivery is performed in two portions from the supply rail 63.

  In this way, the device is supplied in two steps from the supply rail 63 to the storage rail 42b, so that one row of the storage rail 42b is filled with the device. Thereafter, the drum 41 rotates 22.5 in the direction of the arrow in the figure. Then, the storage rail 42 a in which no device is stored is connected to the supply rail 63. In the same manner, the device is supplied from the supply rail 63 to the storage rail 42 in two steps, so that the other storage rails 42 are sequentially filled with the device.

  By repeating this operation and rotating the drum 41 once, when all the storage rails 42 are filled with devices, the devices stored in the storage rails 42 are heated to a temperature required for testing.

  Subsequently, the electronic components heated in the storage rail 42 are pushed out one by one and transported to the delivery position Y to the test handler 3, and various tests are performed in the test handler 3.

  The action of the drum 41 during delivery to the test handler 3 will be described in detail with reference to FIG. 5. The device whose temperature is increased or decreased in the storage rail 42 is moved to the test handler 3 side by the pressing rod 44. By being pushed out, it is discharged from the storage rail 42 one by one to the delivery position Y of the test handler 3.

  At this time, all the devices stored in the storage rail 42a are sequentially moved to the delivery position Y of the test handler 3 by the pressing rod 44 at intervals of 0.2 to 0.3 seconds, and the drum 41 is rotated during this time. I won't let you. When all of the devices stored in the storage rail 42a move to the delivery position Y of the test handler 3, the drum 41 rotates 22.5 degrees in the direction of the arrow in the figure and moves to the position of the storage rail 42b.

  At the position of the storage rail 42a, the storage rail in which the devices are stored in a row is positioned. Therefore, at the position of the storage rail 42a, the above process is repeated, and the stored devices are sequentially and intermittently moved to the delivery position Y on the test handler 3 side.

  On the other hand, since the empty storage rail 42 is located at the position of the storage rail 42b, a new device is inserted into the storage rail 42 by the action of the supply device 6 described above.

  From the point of view of the delivery time to the test handler 3, as described above, in the present embodiment, about 50 devices are accommodated in one row of storage rails. Assuming delivery to the test handler 3 at intervals of seconds, it takes about 10 to 15 seconds for all the devices in one row of the storage rail 42 to be delivered. That is, since the drum 41 is intermittently rotated at intervals of 10 to 15 seconds, the device insertion operation from the supply device 6 to the storage rail at the position of the storage rail 42b is also performed in about 10 to 15 seconds. To do.

  According to the high / low temperature test handler 1 of the present embodiment acting as described above, the high / low temperature apparatus 4 arranged in the chamber 2 in a high temperature or low temperature atmosphere is configured to be rotatable around the rotation axis O. The drum 41 is provided with a plurality of storage rails 42 that are vertically long and have a conveyance path inside and can store a plurality of devices in an annular shape. The devices can be stored at the same time.

  Therefore, in the high temperature reduction device 4 of the present embodiment, a large number of devices can be simultaneously held and heated or cooled, and further, devices can be transferred from the drum 41 to the test handler 3 one by one. Is possible. As a result, it is possible to sufficiently ensure the soak time for the device in the drum 41, that is, the heating or cooling time in the impregnated state without delaying the delivery timing to the test handler 3.

  Further, the storage rail 42 is arranged in an annular shape, and after the device is delivered from the supply device 6 at the delivery position of the storage rail 42, the device is delivered to the test handler 3 after being rotated once. By adopting, for example, space can be saved as compared with the case where the storage rails are arranged in parallel in a planar shape. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating.

  Further, the receiving position X of the device from the supply device 6 and the delivery position Y of the device to the test handler 3 are not provided at the position of the same storage rail 42, and the receiving position is stored at the adjacent position and at the delivery position. By providing on the downstream side of the rail rotation, the device can be smoothly replaced with the storage rail.

(2) Second Embodiment [1. Configuration Overview]
In the second embodiment, the high temperature reduction apparatus shown in the first embodiment is used as a high temperature reduction unit, and the same positioning process as the appearance inspection process, electrical property inspection process, taping process, etc. in the test handler is performed. The process processing apparatus is configured.

  First, the whole structure of the high temperature reduction apparatus of this embodiment is demonstrated with reference to FIG. FIG. 6 is a plan view (a) and a schematic side view (b) of a test handler including the high temperature reducing apparatus of the present embodiment as its one-step processing apparatus. In this embodiment, as a process processing apparatus of one test handler, a high temperature apparatus for increasing the temperature of a device such as an electronic component or a semiconductor device, and a low temperature for decreasing the temperature of the device or increasing the temperature of the heated device. It is provided at a position different from the control device. However, this embodiment shows an optimal embodiment. As another embodiment, the process processing unit of the test handler can be configured using only the high temperature apparatus or the low temperature apparatus.

  As shown in FIG. 6, the high temperature reduction apparatus 7 of the present embodiment is a process processing apparatus provided at a circumferentially equidistant position of a test handler 30 that performs various process processes on devices such as electronic components and semiconductor devices. The temperature increasing device 71 and the temperature decreasing device 72 are part of the above.

  More specifically, at position 1 in FIG. 6, a plurality of devices aligned and conveyed from the parts feeder are arranged at equal circumferential positions so as to extend below the turntable T (here, at intervals of 22.5 degrees). 16) Picked up by the nozzle N of the suction holding mechanism provided. This turntable T rotates intermittently in the clockwise direction in the figure, and is provided with an appearance inspection device in which the polarity of the electrode of the device is checked by an appearance camera or the like at position 2, and the polarity is corrected at position 3. A reversing device is provided.

  In the present embodiment, the device supply means to the turntable T is a parts feeder. However, this is merely an example of the component supply means. In addition, for example, supply in a lead frame, tube (stick) supply Any known supply means such as wafer supply can be substituted.

  And the high temperature apparatus 71 which concerns on this embodiment is provided in the position 4 and the position 5, and the device hold | maintained at the nozzle N here is heated to predetermined temperature. The heated device is again held by the nozzle N, and an electrical test process is performed at position 6 in a heated state.

  Positions 7 and 8 are provided with a temperature reducing device 72 according to the present embodiment, in which the device held and transported by the nozzle N is cooled from the heated temperature to room temperature. The room temperature device is then subjected to an electrical test at position 9. In the low temperature apparatus 1b, the electrical test process at the position 9 may be performed in a state where the device is cooled from room temperature and cooled.

  As described above, in the high temperature device 71 and the low temperature device 72 of the present embodiment, two stop positions of the nozzle N, which is the suction holding means, are provided at positions 4 and 5, and positions 7 and 8, respectively. The temperature increasing device 71 or the temperature decreasing device 72 receives the device from the nozzle N at the position 4 or 7 and heats or cools the device over a predetermined time, and then receives the device at the position 5 or 8 at the nozzle N. To pass.

  The device that has completed the electrical test process as described above is held in the nozzle N as it is, and the reversing device (position 10), the appearance inspection device (position 11) for determining defective products, and the defective products, as in the past. Sorting and sorting devices (positions 12 and 13) that classify and shoot according to their level, taping devices (positions 14 and 15) that sequentially pack good products on tape, and devices that have not been taped and packed It passes through a forced discharge device (position 16) to be discarded.

[2. Configuration of high temperature reduction equipment]
Next, the structure of the high temperature reduction apparatus 7 is demonstrated with reference to FIGS. FIG. 7 is a simplified perspective view (a) and a plan view (b) extracted from the overall configuration shown in the plan view of FIG. 6 only for the high temperature reducing device 7 at positions 4 and 5 and positions 8 and 9. In FIG. 7A, the configuration is appropriately omitted for convenience of illustration. In the present embodiment below, in the high temperature reducing device 7, the same configuration as that of the first embodiment may be denoted by the same reference numeral, and description thereof may be omitted.

  As shown in FIG. 7 and FIG. 8, the high temperature reducing device 7 includes a drum 73 that receives a rotational force from a motor M via a belt and rotates about a rotation axis O. As shown in the sectional view of FIG. 8, the drum 73 has a cylindrical shape and a plurality of annular storage rails 74 each having a device transport path and an opening in the outer peripheral surface of the drum 73. Become. The drum 73 also includes support members 75 that maintain the storage rail 74 in an annular shape at both ends of the storage rail 74. The support member 75 is formed in a disc shape, and supports the storage rail 74 from the inner peripheral surface side at both ends of the drum 73. And this support member 75 is connected with the rotating shaft O provided in the center axis | shaft of the drum 73 in the center part.

  Here, the heating or cooling means of the high temperature reducing device 7 will be described. In the high temperature unit 71, as shown by a dotted line in FIG. 7, the entire apparatus is covered with a chamber, and the inside of the chamber is made a high temperature atmosphere to serve as a heating means. Also, heating means such as a heater is provided in or near the drum 73 to emit infrared rays, and the emitted infrared rays are conducted to the device directly or indirectly through the storage rail to heat the device from a close position. It is also possible to configure. In this case, the storage rail 74 is preferably made of a material having high thermal conductivity.

  On the other hand, the low temperature unit 72 can be configured by using a cooling atmosphere in the chamber as a cooling means, or by using a Peltier element as a cooling means instead of the heater of the high temperature unit 71. When the atmosphere in the chamber is increased or decreased in temperature, as shown in the dashed line in FIG. Use a low temperature environment. In this case, specifically, the inside of the chamber is set to around 120 ° C. when the temperature is high, and about −40 ° C. when the temperature is low.

  In the present embodiment, as shown in FIG. 8, the drum 73 has eight storage rails 74 arranged at intervals of 45 degrees, and the rotating shaft O is rotated by a motor (not shown), so that the interval between the storage rails 74, that is, 45 It is designed to rotate intermittently at intervals of °.

  As shown in FIG. 7, the drum 73 includes a receiving position X for receiving a device from the test handler and a delivery position Y for transferring to the test handler in the same direction. That is, both the receiving position X for receiving the device from the test handler 30 and the delivery position Y for transferring the device to the test handler 30 are provided on the test handler 30 side. The receiving position X is provided at the end on the test handler 30 side of the storage rail 74b adjacent to the rotation direction indicated by the arrow of the drum 73 relative to the storage rail 74a at the top of the annular shape.

  In this receiving position X, as shown in a detailed enlarged view in FIG. 9A, a stage 76a for temporarily placing a device received by vacuum breakage of the N nozzle is provided, and the device placed on this stage 76a A push-in member 76b is provided for inserting each of them toward the storage rail 74b. The pushing member 76b is configured to reciprocate on the stage 76a from the test handler 30 side toward the storage rail 42b in accordance with the rotation timing of the turntable T of the test handler 30. In addition, after receiving the device from the nozzle N, the stage 76a is rotated by 45 ° so as to be in a plane parallel to the conveyance path of the storage rail 42b (before the rotation is indicated by a two-dot chain line in the figure). Show.)

  On the other hand, the delivery position Y is provided at the end on the test handler 30 side of the storage rail 74a located at the top of the annular shape. 9B, the device at the side end of the storage rail 74a is separated from the storage rail and picked up by the nozzle N of the test handler 30. An escape 77a that moves to a position is provided. Further, a feed member 77b for sequentially feeding the devices in the storage rail 74a is provided for the escape 77a. Note that the escape 77a, the feed member 77b, and the support portion 77c are not shown in FIG. 7 for convenience of explanation.

  The feed member 77b is inserted from the opening of the storage rail 74a and moves in the axial direction of the storage rail 74a from the opposite side of the test handler 30 toward the test handler 30 side. The drive mechanism is provided on the side of the drum 73, and is realized by the ball screw B being rotated by the rotation of a motor (not shown) and the feed member 77b and the support portion 77c connected thereto being moved.

  The movement timing of the feed member 77b is also synchronized with the timing of intermittent rotation of the turntable T in the test handler 30, and as the nozzle N moves, the devices stored in the storage rail 74a are escaped one by one. It is supposed to be discharged towards. The feed member 77b is also configured to move away from the position where it is inserted into the groove of the storage rail 74a and move to a position where it does not interfere with the groove, and all of the group of devices stored in the storage rail 74a are tested. After transporting to the handler 30 side, it retreats to the end opposite to the test handler 30 which is a position that does not interfere with the groove.

  Note that the shape of the storage rail 74 is the same as that of the first embodiment, and a description thereof will be omitted. Further, as in the first embodiment, the size of the inner peripheral surface of the storage rail is designed according to the size of the device to be processed, and the device to be transported is transported without being clogged or in contact with the side surface. It is appropriately designed to have a possible size.

  The axial lengths of the drum 73 and the storage rail 74 are determined by the number of devices waiting in the conveyance path of the storage rail 74 and the desired number of devices for batch processing. The number of standbys of this device is the delivery time interval to the test handler 3 (the sum of the transport time per intermittent rotation of the test handler 3 and the processing time in one process) and the heating or heating to bring the device to a predetermined temperature. Cooling time is taken into account. For example, it is considered that the delivery time interval in the test handler 30 is 0.2 to 0.3 seconds, and the heating time of the device is 90 seconds. In the present embodiment, about 50 devices are stored in one storage rail 74.

  The high temperature lowering means 5 shown in FIG. 7 is the same as that of the first embodiment, is configured by high temperature air blow or the like, and is a means for setting the atmosphere in the chamber 2 to a high temperature or low temperature environment. Specifically, the inside of the chamber 2 is set to around 120 ° C. when the temperature is high, and about −40 ° C. when the temperature is low.

  The mechanism for transporting the device placed in the groove of the storage rail may use any configuration of known linear component transfer means, such as a configuration in which vibration and air act in the transport direction. it can. In this respect, in the present embodiment, like a feed member 77b shown as an example in the figure, it has substantially the same shape as the groove of the conveyance path, and is configured to move in the groove toward the storage rail 74a. .

[3. Overall effect]
An outline of the operation of the high temperature reducing device of the present embodiment configured as described above will be described. In the following, an example of the high temperature apparatus at position 4 and the high temperature measurement at position 6 in FIG. 6 will be described, and the low temperature apparatus and low temperature measurement at positions 7 and 9 will be omitted. The contents of the process in the low temperature measurement are the same as those in the high temperature apparatus and the high temperature measurement.

  As shown in FIG. 6, the device C held by the nozzle N of the test handler 30 and transported to the position 4 is placed on the stage 76 a in FIG. 7 at the receiving position X of the high temperature apparatus 71 at the position 5. The The devices placed on the stage 76a are sequentially inserted into the storage rail 74b by the push-in member 76b (see FIG. 9A).

  For the storage rail 74b, the devices held by the nozzles subsequent to the nozzle N are synchronized one by one with the reciprocating motion of the pushing member 76b in synchronism with the intermittent rotation of the turntable T of the test handler 30. Will be inserted.

  As described above, the number of devices that can be inserted in the storage rail 74b can be set as appropriate depending on the type of device, the length setting of the storage rail 74a, and the like. When 50 devices are inserted into the storage rail 74a, the drum 73 rotates 45 °, which is one storage rail.

  On the other hand, in the storage rail 74a, as described above, the nozzle C that has passed the device C at the receiving position X and has become empty moves as the turntable T rotates. At this time, the storage operation of the device C at the position shown in the storage rail 74b is completed on the storage rail 74a, and the storage rail 74a is rotated once in the direction of the arrow in FIG. Rotation of °) and fully heated device is stored. A feed member 77b is inserted into the storage rail 74a from the end opposite to the test handler with respect to the storage rail 74a, and pushes one device C against the escape 77a.

  Next, the nozzle N picks up the device C pushed out by the feed member 77b and placed on the escape 77a, and the device C is moved to the position 6 shown in FIG. It is transported to a high-temperature measuring device provided in In this high-temperature measuring apparatus, the electrical characteristics of the heated device are inspected.

  In the high temperature reducing apparatus 7 of the present embodiment as described above, a large number of devices can be held and heated or cooled at the same time, and devices are transferred from the drum 73 to the test handler 30 one by one. It is possible. As a result, it is possible to sufficiently ensure the soak time for the device in the drum 73, that is, the heating or cooling time in the impregnated state without delaying the delivery timing to the test handler 30.

  Further, the storage rail 74 is arranged in an annular shape, and after receiving the device from the nozzle N of the test handler 30 at the receiving position X of the storage rail 74, the device is rotated once and then transferred to the test handler 30 at the delivery position Y. By adopting a configuration in which devices are delivered, for example, space can be saved compared to a case where storage rails are arranged in parallel in a planar shape. Moreover, it is possible to ensure a sufficient soak time of the device during one round by a simple action of rotating.

  Further, the device reception position X from the test handler 30 and the device delivery position Y to the test handler 30 are not provided at the same storage rail 74 position, and the reception position is stored at the adjacent position at the delivery position. By providing on the upstream side of the rail rotation, the device can be smoothly replaced with the storage rail. In particular, since the device is received and stored in the storage rail from the test handler 30 side, and the device is transferred from the test handler 30 side again, the device can be configured as a single processing step processing apparatus of the test handler 30. Compared to a configuration in which the device is held and heated and delivered sequentially, there is no need to prepare a new test handler for high-temperature testing. It becomes possible to keep it cheap.

(3) Other Embodiments The present invention is not limited to the aspect shown in the first embodiment, and includes, for example, the following aspects. In the above embodiment, in the drum 41, the storage rail 42 is arranged in a substantially true circle as an annular shape. However, in the present invention, for example, the storage rail is arranged in an elliptical shape, and the storage rail is rotated. As long as the soak time is ensured, the significance of the annular arrangement is not limited to a perfect circle. Further, the length and number of storage rails to be arranged are design matters, and can be appropriately changed according to the processing time of the test handler and the heating or cooling time of the device.

  Further, the support member for holding the drum storage rail in an annular shape is not limited to the configuration described in the above embodiment. For example, as shown in FIG. 10, a belt is arranged on a pulley and the storage rail is arranged on the belt. Any configuration that can secure the soak time by rotating the storage rail, such as a fixed configuration, is also included in the scope of the present invention. As described above, in the present invention, when the storage rails are arranged in an annular shape, various configurations can be adopted according to the purpose, application, and arrangement space of the apparatus.

  In the first embodiment, the configuration in which the device is pushed in the transport direction by the pressing rod is shown for both the movement of the device in the supply device 6 and the movement of the device in the storage rail 42, but the present invention is limited to this. Instead, any known transfer method such as air chute or vibration transfer can be employed. For example, the drum rotation axis O can be tilted toward the test handler 3 and moved in the direction of the delivery position Y of the test handler 3 by the weight of the device. As a result, when devices are picked up one by one at the delivery position to the test handler, the devices are transported by their own weight.

  In the first embodiment, the supply device 6 is composed of three parts, that is, an alignment rail 61, a transfer rail 62, and a supply rail 63. This is different from the receiving position X in the storage rail 42 and the delivery. This is because the position Y is shifted by 22.5 degrees in the first embodiment, and if possible, the receiving position X and the delivery position Y are set, for example, due to structural or processing time constraints. It is also possible to provide the drum 41 at the top of the ring. In the case of such a configuration, the supply device 6 can be configured from one rail.

  In the high temperature reduction device of the second embodiment, the receiving position X is set to the upstream position 4 or 7 in the rotation direction of the test handler 30, and the delivery position Y is set to the downstream position 5 or 5 in the rotation direction of the test handler 30. Although provided at each of the positions 8, the present invention is not limited to the embodiment as described above, and includes, for example, the following aspects.

  That is, as shown in FIG. 11, contrary to the above-described embodiment, the receiving position X is at the downstream position 5 or 8 in the rotational direction of the test handler 30, and the delivery position Y is upstream in the rotational direction of the test handler 30. It is also possible to provide them at position 4 or position 7, respectively. In this embodiment, the holding suction means of the test handler is provided in 36 units of 10 ° intervals instead of 18 units of 20 ° in the above embodiment, and the nozzles N are held every other device (special feature). This is effective in Japanese Unexamined Patent Publication No. 2005-064182. In this case, the drum 73 is configured to rotate in the same direction as the conveyance direction of the test handler 30 as indicated by an arrow in the drawing.

  11 is further improved. As shown in FIG. 12, the receiving position X and the delivery position Y are set as one stop position of the turntable T, and the receiving position in the above embodiment is set as the insertion position P. The delivery position is the discharge position Q, and as shown in FIG. 12 (a), the stage 76a and the escape 77a are reciprocally rotated at an angle of 45 ° to move to one delivery position X and delivery position Y. It is also possible to make it. In this case, the nozzle N that has moved to the stop position delivers the held device on the stage 76a, and the device placed on the stage 76a is moved to the storage rail 74a at the insertion position P by the push-in member 76b. At the same time, the heated device is discharged to the discharge position Q on the escape 77a by the action of the pushing member 77b in the storage rail 74b. Thereafter, the stage 76a and the escape 77a rotate to the right in the figure at an angle of 45 °, the escape 77a moves to the receiving position X and the delivery position Y, the nozzle N receives the heated device on the escape 77a, It is something that moves.

  Thus, even when the receiving position X and the delivery position Y are configured as one stop position of the turntable T, the high temperature reducing device 7 of the present invention is used as one processing process processing device of the test handler 30. Compared to a configuration in which the device is held on a conventional rail, and this is sequentially heated and delivered, there is no need to prepare a new test handler for high-temperature testing. The installation cost can be saved and the cost of the apparatus can be reduced.

The perspective view which shows the whole structure of the high-low temperature test handler in the 1st Embodiment of this invention. The fragmentary sectional view of the high temperature reduction apparatus in the 1st Embodiment of this invention. The perspective view of the storage rail in the 1st Embodiment of this invention. The schematic diagram of the supply apparatus in the 1st Embodiment of this invention. The partial schematic diagram of the high temperature reduction apparatus in the 1st Embodiment of this invention. The schematic diagram which shows the whole structure of the test handler provided with the high temperature reduction apparatus in the 2nd Embodiment of this invention. The simplified perspective view (a) and top view (b) which show the structure of the high temperature reduction apparatus in the 2nd Embodiment of this invention. The cross-sectional schematic diagram which shows the structure of the drum in the high temperature reduction apparatus in the 2nd Embodiment of this invention. The perspective view which shows the partial structure of the high temperature reduction apparatus in the 2nd Embodiment of this invention. The fragmentary sectional view of the high temperature reduction apparatus in other embodiment of this invention. The top view of the high temperature reduction apparatus in other embodiment of this invention. The partial expansion perspective view of the high temperature reduction apparatus in other embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... High and low temperature test handler 1b ... Low temperature apparatus 2 ... Chamber 3, 30 ... Test handler 4 ... High temperature reduction apparatus 5 ... High temperature reduction means 6 ... Supply apparatus 7 ... High temperature reduction apparatus 41 ... Drum 41 ... Rotating shaft 42 42a, 42b ... storage rail 43 ... support member 44 ... pressing rod 61 ... alignment rail 61a, 62a, 63a ... groove 62 ... transfer rail 63 ... supply rail 64 ... rotating support 65 ... pressing rod 71 ... high temperature device 72 ... Low temperature device 73 ... drum 74, 74a, 74b ... storage rail 75 ... support member 76a ... stage 76b ... push-in member 77a ... escape 77b ... push-out member B ... ball screw C ... device M ... motor N ... nozzle O ... rotating shaft P ... Insertion position Q ... Discharge position R ... Conveyance path X ... Reception position Y ... Delivery position

Claims (9)

A high-temperature reduction device that receives devices such as electronic parts and semiconductor devices, heats or cools them with a predetermined heating or cooling means, and sequentially delivers them to a conveying device that performs various process treatments,
A storage rail with a device transport path that can store multiple devices,
A support portion for arranging and holding the storage rails in a ring shape at a predetermined interval; and
In a chamber with a high or low temperature atmosphere,
And a driving means for intermittently rotating the plurality of storage rails arranged in an annular shape via the support portion. The support part is composed of a disk that holds the storage rails arranged in an annular shape on the inner peripheral surface at both ends,
A rotation axis is provided at the center of the disk;
The high temperature reduction apparatus according to claim 1, wherein the driving unit rotates the rotating shaft. The support portion includes a pulley and a belt hung on the pulley,
The storage rails are arranged at predetermined intervals on the belt,
2. The high temperature reducing apparatus according to claim 1, wherein the driving means rotates a rotating shaft of the pulley. The storage rail includes a narrow groove,
The storage rail is arranged so that the narrow groove is positioned on the outer peripheral side of the storage rail arranged in the annular shape,
4. The device according to claim 1, wherein the device stored in the storage rail is pushed out by the rod-shaped body inserted into the narrow groove so that the device is transported through the storage rail. 5. High temperature reduction equipment.   The high temperature reduction according to any one of claims 1 to 3, wherein the storage rail and the support portion are installed to be inclined toward a transport direction of a device stored in the storage rail. apparatus. A high and low temperature test handler for a device that receives a device, heats or cools it with a predetermined heating or cooling means, and sequentially delivers it to a transfer device that performs various process processes,
A test handler that is disposed in the chamber and performs various process processes on the device, a high-temperature reduction apparatus that delivers a device that is high or low in temperature to the test handler, and an atmosphere in the chamber is heated or cooled High temperature reduction means,
A supply device that is disposed outside the chamber and delivers the device to the high temperature reducing device,
The high temperature reduction apparatus includes a storage rail having a device transport path and capable of storing a plurality of devices, a support portion for arranging and holding the storage rail in a plurality of annular shapes, and a plurality of storage rails arranged in the annular shape. A high-low temperature test handler characterized by comprising a driving means for intermittently rotating the cradle through the support section. The test handler and the supply device are arranged at both ends of the high temperature reducing device,
The receiving position of the device from the supply device in the storage rail of the high temperature reducing device and the delivery position of the device from the storage rail to the test handler of the high temperature reducing device are arranged in the annular shape. 7. The high / low temperature test handler according to claim 6, wherein the receiving rails are adjacent to each other on the circumference of the storage rail, and the receiving position is provided downstream of the transfer position in the rotation direction of the storage rail. A process processing unit is provided that performs various processing steps for taping and packing a device through an appearance inspection and an electrical property inspection of the device such as the semiconductor device or the electronic component while the device such as the semiconductor device or the electronic component is transferred by the transfer device. A high and low temperature test handler,
A high temperature reduction apparatus having a function of increasing or decreasing the temperature by receiving a device from a holding mechanism provided in the transfer apparatus, and sequentially transferring the device to the holding mechanism by heating or cooling the device. As a processing unit,
The high temperature reducing device is:
A storage rail with a device transport path that can store multiple devices,
A support portion for arranging and holding the storage rails in a ring shape at a predetermined interval; and
With
And a drive means for intermittently rotating the plurality of storage rails arranged in an annular shape via the support portion. The high temperature reduction apparatus has a receiving position for receiving a device from a holding mechanism provided in the conveying apparatus and a delivery position for transferring the device to a holding mechanism provided in the conveying apparatus adjacent to the holding mechanism in the conveying apparatus. Provided at each stop position,
The receiving position is provided on the upstream side in the transport direction of the transport device among the adjacent stop positions, and the delivery position is provided on the downstream side in the transport direction of the transport device among the adjacent stop positions. The high and low temperature test handler according to claim 8.

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