JP2008152040A - Microlens array manufacturing method, microlens array, organic EL line head using the same, and image forming apparatus - Google Patents

Abstract

A method of manufacturing a microlens array for use in an organic EL line head or the like having good optical performance and a small optical axis shift between lens surfaces on both sides.
SOLUTION: A photo-curable resin 76 is injected into molds 82 and 84 having mold surfaces 92 and 94 corresponding to respective lens surfaces of a microlens array, and transparent substrates 71 and 73 are placed thereon, respectively. The two lens arrays 6 ₁ , 6 are positioned by positioning the transparent substrate using positioning means provided in the mold, and irradiating light from the transparent substrate 71, 73 side to cure the photocurable resins 76, 76 ′. ₂ is formed, and the two lens arrays 6 ₁ and 6 ₂ are aligned and integrated with each other using the positioning portions used for positioning in the respective molding, thereby producing a microlens array.
[Selection] Figure 16

Description

  The present invention relates to a method of manufacturing a microlens array, a microlens array manufactured by the method, an organic EL line head using the same, and an image forming apparatus.

  Conventionally, a plurality of LED array chips are arranged in the direction of the LED array, and enlarged and projected onto a photosensitive member with a positive lens in which the LED arrays of the respective LED array chips are arranged correspondingly, and the ends of adjacent LED array chips on the photosensitive member. An optical writing line head that forms images adjacent to each other at the same pitch as the pitch between the light emitting dots of the same LED array chip, and an optical reading line head with the optical path reversed. This is proposed in Japanese Patent Application Laid-Open No. H10-228707.

  On the other hand, as a method of manufacturing a microlens array that collects divergent light from each light emitting dot of an LED array chip, a mold of the microlens array is formed by photolithography and electroforming, and a photocurable resin is used on a glass substrate. Patent Document 2 discloses a method of manufacturing a microlens array by copying to a thermoplastic resin or by replicating to a thermoplastic resin.

In addition, in Patent Document 3, as a method for manufacturing a microlens array for liquid crystal panel illumination or the like, a photoresist is patterned on both surfaces of a glass substrate corresponding to pixels, and the photoresist is heated and melted by surface tension. A method of forming a lens array by processing a lens refractive surface is disclosed.
Japanese Patent Laid-Open No. 2-4546 JP 2005-276849 A JP-A-6-208006

  Conventionally, as described in Patent Document 2, a method of manufacturing a hybrid microlens array by forming a lens using a photocurable resin on a glass substrate in order to prevent linear expansion of the entire lens is proposed. Has been. In this manufacturing method, it is necessary to form lens refracting surfaces (lens surfaces) on both sides of the substrate in order to improve optical performance.

  However, when molding using a photocurable resin on both sides of the glass substrate, if the mold is made of an opaque material such as metal, the light for light curing is blocked by the mold and does not pass through. Both lens surfaces cannot be molded simultaneously.

  In such a case, in order to mold the lens surfaces on both sides, the lens surface must be removed from the mold after molding the lens surface on one side of the glass substrate. There is a problem that.

  The present invention has been made in view of such problems of the prior art, and its purpose is to integrate and integrally form microlenses on one side, which are separately molded, and has good optical performance. To provide a manufacturing method of a microlens array used for an organic EL line head having a small optical axis deviation between both lens surfaces, a microlens array manufactured in this way, an organic EL line head using the same, and an image forming apparatus. It is.

The method for producing a microlens array of the present invention that achieves the above object is a method of forming a microlens array of a photocurable resin using a mold,
A photocurable resin is injected into a first mold having a mold surface corresponding to one lens surface of the microlens array, and a first transparent substrate is placed on the first mold. At that time, the first mold is provided. Positioning the first transparent substrate using the first positioning means provided,
Forming a first lens array on one surface of the first transparent substrate by irradiating light from the first transparent substrate side to cure the photocurable resin,
A photocurable resin is injected into a second mold having a mold surface corresponding to the other lens surface of the microlens array, and a second transparent substrate is placed on the second mold, and provided on the second mold. Positioning the second transparent substrate using the second positioning means provided,
Forming a second lens array on one surface of the second transparent substrate by irradiating light from the second transparent substrate side to cure the photocurable resin,
The first lens array and the second lens array are positioned relative to each other using the positioning portion of the first transparent substrate and the positioning portion of the second transparent substrate that are used for positioning at the time of molding. A microlens array is manufactured by combining and integrating.

  With this configuration, it is possible to easily produce a microlens array for use in an organic EL line head or the like having good optical performance and high-precision axis alignment on both lens surfaces.

  In this case, the positioning portion can be two orthogonal sides of the first transparent substrate and the second transparent substrate.

  With this configuration, the lens surfaces of both lens arrays can be aligned with high accuracy without providing any special marks on the first and second transparent substrates.

  The positioning portion may be a mechanical mark provided around each of the first transparent substrate and the second transparent substrate.

  With this configuration, the lens surfaces of both lens arrays can be aligned with each other with high accuracy. This mechanical mark can also be used as a positioning means when assembling an organic EL line head or the like, and an optical system such as an organic EL line head or the like can be assembled with high accuracy.

  The positioning portion may be an optical mark provided on each of the first transparent substrate and the second transparent substrate.

  With this configuration, the lens surfaces of both lens arrays can be aligned with each other with high accuracy. And this optical mark can be used also as a positioning means when assembling an organic EL line head or the like, and an optical system such as an organic EL line head or the like can be assembled with high accuracy.

  Also, a photocurable resin is injected into the first mold and the second mold halfway to make the photocurable resin semi-cured, and then a further photocurable resin is injected thereon. The first transparent substrate and the second transparent substrate are mounted thereon, the first transparent substrate and the second transparent substrate are positioned, and the photo-curing property is irradiated with light from the transparent substrate side. It is desirable that the first lens array and the second lens array are respectively formed on one surface of the first transparent substrate and the second transparent substrate by curing the resin.

  By comprising in this way, a bubble becomes difficult to enter and the fall of the surface precision by shrinkage | contraction in the case of hardening can be suppressed.

  Further, it is desirable that the energy for curing the photocurable resin on the first mold and the second mold is stronger in the second time.

  By comprising in this way, a bubble becomes difficult to enter and the fall of the surface precision by shrinkage | contraction in the case of hardening can be suppressed.

  Further, a light-shielding film provided with an opening concentric with the optical axis of each lens constituting the microlens array may be disposed and integrated between the first lens array and the second lens array. it can.

  With this configuration, crosstalk between microlenses can be prevented and other stray light can be blocked.

  Further, a light shielding plate provided with an opening concentric with the optical axis of each lens constituting the microlens array may be disposed and integrated between the first lens array and the second lens array. it can.

  With this configuration, crosstalk between microlenses can be prevented and other stray light can be blocked. Further, the light shielding plate can be used as a spacer between the first lens array and the second lens array, and any one of the lens surfaces can be arranged inside the microlens array.

  In that case, the first lens array, the second lens array, and at least one of the transparent substrates can be integrated so as to face outward.

  With this configuration, for example, the image-side surface of the microlens array can be a flat surface. For example, when the microlens array is used as a microlens array of a line head of an image forming apparatus, the developer toner scatters and the microlens Even if it adheres to the flat surface of the array, it can be easily cleaned and the cleaning performance is improved.

  In this case, the first lens array or the second lens array is arranged so that the transparent substrate side faces outward, and a plurality of light emitting elements made of organic EL are arranged in a row on the outer transparent substrate surface. The light emitter blocks each including one or more light emitting element rows can be arranged corresponding to the lenses constituting the microlens array.

  With this configuration, one glass substrate of the microlens array can be used also as the glass substrate of the organic EL device, and the number of components is reduced, and the lens and the light emitter block are not displaced due to a temperature change.

Another microlens array manufacturing method of the present invention is a method of forming a resinous microlens array using a mold,
Using a first mold having a mold surface corresponding to one lens surface of the microlens array, a first microlens array having a resinous surface opposite to the surface is molded.
Using a second mold having a mold surface corresponding to the other lens surface of the microlens array, a second microlens array having a flat resin surface is formed on the opposite side,
The first microlens array and the second microlens array are bonded and integrated on both sides of the transparent substrate on the plane side, and the first microlens array and the second microlens array are integrated when the bonding is performed. The microlens array is manufactured by aligning and integrating the microlenses with the microlenses using a positioning portion used for positioning in each molding.

  With this configuration, it is possible to easily produce a microlens array for use in an organic EL line head or the like having good optical performance and high-precision axis alignment on both lens surfaces.

  The microlens array of the present invention includes a first single-sided planar microlens array in which a curved lens refracting surface portion having a predetermined shape made of a transparent resin is integrally formed on one surface of a first transparent substrate, A second single-sided microlens array in which a curved lens refracting surface portion of a predetermined shape made of transparent resin is integrally formed on one surface of the transparent substrate is integrated so that the lens refracting surface portions are aligned with each other. The same microlens is arranged in a row at a constant pitch in a predetermined direction, and N similar microlens rows are arranged in a direction orthogonal to the predetermined microlens row, and the N microlens rows are arranged in the first microlens row. The positions are arranged with a shift of 1 / N pitch.

  With this configuration, a microlens array having a configuration particularly suitable for an organic EL line head is obtained.

  In this case, mechanical marks are provided around the first transparent substrate and the second transparent substrate, or optical marks are provided on the first transparent substrate and the second transparent substrate. It is desirable.

  With this configuration, mechanical marks or optical marks can be used as positioning means when assembling an organic EL line head or the like, and an optical system such as an organic EL line head can be assembled with high accuracy. Will be able to.

  In the organic EL line head of the present invention, a plurality of light emitter blocks each including at least one light emitting element row in which a plurality of light emitting elements are arranged in a row in the main scanning direction are arranged at least in the main scanning direction. On the emission side of the organic EL light emitter array, a microlens array is arranged in parallel with the organic EL light emitter array so that one positive lens is aligned with each of the light emitter blocks. As the microlens array, a first single-sided planar microlens array in which a curved lens refracting surface portion of a predetermined shape made of a transparent resin is integrally formed on one surface of a first transparent substrate, and a second transparent substrate A lens refracting surface portion is axially aligned with a second single-sided planar microlens array in which a curved lens refracting surface portion of a predetermined shape made of transparent resin is integrally formed on one surface of A microlens array integrated with each other, wherein the first transparent substrate and the second transparent substrate are provided with mechanical or optical marks for positioning. To do.

  With this configuration, an organic EL line head in which the optical system is assembled with high accuracy can be obtained.

  In addition, at least two or more image forming stations in which image forming units including a charging unit, the organic EL line head as described above, a developing unit, and a transfer unit are arranged around the image carrier are provided, and a transfer medium By passing through each station, it is possible to configure an image forming apparatus that forms an image by a tandem method.

  With this configuration, it is possible to configure an image forming apparatus such as a printer that is small in size and has high resolution and little image deterioration.

  Before describing in detail the method of manufacturing a microlens array of the present invention, the microlens array, and the organic EL line head using the microlens array, the organic EL line head using the microlens array will be briefly described.

  FIG. 4 is an explanatory diagram showing a correspondence relationship between the light emitter array 1 according to the embodiment of the present invention and the microlens 5 having a negative optical magnification. In the line head of this embodiment, two rows of light emitting elements correspond to one microlens 5. However, since the microlens 5 is an imaging element having a negative optical magnification (inverted imaging), the position of the light emitting element is reversed in the main scanning direction and the sub-scanning direction. That is, in the configuration of FIG. 1, even-numbered light emitting elements (8, 6, 4, 2) are arranged on the upstream side (first row) in the moving direction of the image carrier, and on the downstream side (second row). Are arranged with odd-numbered light emitting elements (7, 5, 3, 1). In addition, a light emitting element having a large number is arranged on the head side in the main scanning direction. Note that an organic EL device described later is used as the light emitter array 1 of this embodiment.

  1 to 3 are perspective views of a portion corresponding to one microlens of the line head of this embodiment. As shown in FIG. 2, the image spot 8a of the image carrier 41 corresponding to the odd-numbered light emitting elements 2 arranged on the downstream side of the image carrier 41 is formed at a position reversed in the main scanning direction. The R is the moving direction of the image carrier 41. Further, as shown in FIG. 3, the imaging spot 8b of the image carrier 41 corresponding to the even-numbered light emitting elements 2 arranged on the upstream side (first row) of the image carrier 41 is in the sub-scanning direction. It is formed at the inverted downstream position. However, in the main scanning direction, the positions of the imaging spots from the head side correspond to the light emitting elements 1 to 8 in order. Therefore, in this example, it is understood that the imaging spots can be formed in the same row in the main scanning direction by adjusting the timing of forming the imaging spots in the sub scanning direction of the image carrier.

  FIG. 5 is an explanatory diagram showing an example of the memory table 10 of the line buffer in which image data is stored. The memory table 10 in FIG. 5 is stored with being inverted in the main scanning direction with respect to the light emitting element numbers in FIG. In FIG. 5, among the image data stored in the memory table 10 of the line buffer, first image data (1, 3, 5, 5) corresponding to the light emitting elements on the upstream side (first row) of the image carrier 41 first. 7) to read out the light emitting element. Next, after T time, the second image data (2, 4, 6, 8) corresponding to the light emitting elements on the downstream side (second row) of the image carrier 41 stored in the memory address is read and emitted. Let In this way, as indicated by the position 8 in FIG. 6, the first row of imaging spots on the image carrier is formed in the same row as the second row of imaging spots in the main scanning direction.

  FIG. 1 is a perspective view conceptually showing an example in which image data is read out at the timing of FIG. 5 to form an imaging spot. As described with reference to FIG. 5, the light emitting element on the upstream side (first row) of the image carrier 41 is first caused to emit light, thereby forming an imaging spot on the image carrier 41. Next, after a predetermined timing T has elapsed, the odd-numbered light emitting elements on the downstream side (second row) of the image carrier 41 are caused to emit light, thereby forming an imaging spot on the image carrier. At this time, the imaging spot formed by the odd-numbered light emitting elements is not formed at the position 8a described in FIG. 2, but is formed at the position 8 in the same row in the main scanning direction as shown in FIG. become.

  FIG. 7 is a schematic explanatory diagram showing an example of a light emitter array used as a line head. In FIG. 7, in the light emitter array 1, a light emitter block 4 (see FIG. 4) is formed by providing a plurality of light emitting element rows 3 in which a plurality of light emitting elements 2 are arranged in the main scanning direction. In the example of FIG. 7, the light emitter block 4 forms two light emitting element rows 3 in which four light emitting elements 2 are arranged in the main scanning direction in the sub scanning direction (see FIG. 4). A large number of the light emitter blocks 4 are arranged in the light emitter array 1, and each light emitter block 4 is arranged corresponding to the microlens 5.

  A plurality of microlenses 5 are provided in the main scanning direction and the sub-scanning direction of the light emitter array 1 to form a microlens array (MLA) 6. The MLA 6 is arranged with the leading position in the main scanning direction shifted in the sub-scanning direction. Such an arrangement of the MLA 6 corresponds to a case where the light emitting elements 1 are provided in a staggered manner in the light emitter array 1. In the example of FIG. 7, three rows of MLA 6 are arranged in the sub-scanning direction. However, for convenience of explanation, the unit blocks 4 corresponding to the respective positions of the three rows of MLA 6 in the sub-scanning direction are group A and group B. And group C.

  As described above, when the plurality of light emitting elements 2 are arranged in the microlens 5 having a negative optical magnification and the lenses are arranged in a plurality of rows in the sub-scanning direction, the main body of the image carrier 41 is used. In order to form imaging spots arranged in a line in the scanning direction, the following image data control is required. (1) Inversion in the sub-scanning direction, (2) Inversion in the main scanning direction, (3) Adjustment of light emission timing of a plurality of light emitting elements in the lens, and (4) Adjustment of light emission timing of light emitting elements between groups.

  FIG. 8 is an explanatory view showing an imaging position when the exposure surface of the image carrier is irradiated through the microlens 5 with the output light of each light emitting element 2 in the configuration of FIG. In FIG. 8, as described with reference to FIG. 7, the light emitter array 1 has unit blocks 4 divided into group A, group B, and group C. The light-emitting element rows of the unit blocks 4 of group A, group B, and group C are divided into the upstream side (first row) and the downstream side (second row) of the image carrier 41, and even-numbered light emission in the first row Elements are assigned, and odd-numbered light emitting elements are assigned to the second column.

  For group A, by operating each light emitting element 2 as described with reference to FIGS. 1 to 3, an image spot is formed on the image carrier 41 at a position reversed in the main scanning direction and the sub scanning direction. . In this manner, imaging spots are formed on the image carrier 41 in the order of 1 to 8 in the same row in the main scanning direction. Thereafter, the image carrier 41 is moved in the sub-scanning direction for a predetermined time, and the processing of the group B is similarly executed. Further, by moving the image carrier 41 in the sub-scanning direction for a predetermined time and executing the processing of group C, it is based on the input image data in the order of 1 to 24... In the same column in the main scanning direction. An imaging spot is formed.

  FIG. 9 is an explanatory diagram showing a state of forming an imaging spot in the sub-scanning direction in FIG. S is the moving speed of the image carrier 41, d1 is the distance between the first and second light emitting elements in group A, and d2 is the second light emitting element in group A and the second light emission in group B. The element spacing, d3 is the distance between the light emitting elements in the second row of group B and the light emitting elements in the second row of group C, and T1 is the light emitting element in the first row after the light emitting elements in the second row of group A emit light. T2 is the time required for the image forming position of the light emitting elements in the second row of group A to move to the image forming position of the light emitting elements in the second row of group B, and T3 is the light emitting elements in the second row of group A Is the time required for the imaging position to move to the imaging position of the light-emitting elements in the second row of group C.

  T1 can be obtained as follows. T2 and T3 can be similarly obtained by replacing d1 with d2 and d3.

T1 = | (d1 × β) / S |
Here, each parameter is as follows.
d1: Distance in the sub-scanning direction of the light emitting elements S: Moving speed of the imaging surface (image carrier) β: Lens magnification In FIG. The light emitting elements in the second row of group B are caused to emit light. Furthermore, the light emitting elements in the second row of group C are caused to emit light after T2 to T3 hours. The first row of light emitting elements in each group emits light after T1 time after the second row of light emitting elements emits light. By performing such processing, as shown in FIG. 8, the imaging spots formed by the light emitters arranged two-dimensionally on the light emitter array 1 can be formed in a line on the image carrier. It becomes possible. FIG. 10 is an explanatory diagram showing an example in which the imaging spot is formed in a reversed manner in the main scanning direction of the image carrier when a plurality of microlenses 5 are arranged.

  An image forming apparatus can be configured using the line head as described above. In the embodiment, a tandem color printer (exposed to four photoconductors with four line heads, simultaneously forms four color images, and transfers them to one endless intermediate transfer belt (intermediate transfer medium)). The line head as described above can be used in the image forming apparatus. FIG. 11 is a longitudinal side view showing an example of a tandem image forming apparatus using an organic EL device as the light emitter array 1. This image forming apparatus includes four line heads 101K, 101C, 101M, and 101Y having the same configuration, and corresponding four photosensitive drums (image carriers) 41K, 41C, 41M, and 41Y having the same configuration. These are respectively arranged at exposure positions, and are configured as a tandem image forming apparatus.

  As shown in FIG. 11, this image forming apparatus is provided with a driving roller 51, a driven roller 52, and a tension roller 53. The tension roller 53 applies tension to the image forming apparatus and stretches it in the direction indicated by the arrow (counterclockwise). ) Is circulated to the intermediate transfer belt (intermediate transfer medium) 50. Photosensitive members 41K, 41C, 41M, and 41Y having photosensitive layers are arranged on the outer peripheral surface as four image carriers arranged at predetermined intervals with respect to the intermediate transfer belt 50.

  K, C, M, and Y added after the above symbols mean black, cyan, magenta, and yellow, respectively, and indicate that the photoconductors are black, cyan, magenta, and yellow, respectively. The same applies to other members. The photoreceptors 41K, 41C, 41M, and 41Y are rotationally driven in the direction indicated by the arrow (clockwise) in synchronization with the driving of the intermediate transfer belt 50. Around each photoconductor 41 (K, C, M, Y), charging means (corona charger) 42 (K) for uniformly charging the outer peripheral surface of the photoconductor 41 (K, C, M, Y), respectively. , C, M, Y) and the outer peripheral surface uniformly charged by the charging means 42 (K, C, M, Y) are synchronized with the rotation of the photoconductor 41 (K, C, M, Y). Thus, the above-described line head 101 (K, C, M, Y) of the present invention for sequentially scanning the line is provided.

  Further, a developing device 44 (K, C, and M) that applies a toner as a developer to the electrostatic latent image formed by the line head 101 (K, C, M, and Y) to form a visible image (toner image). M, Y) and a primary transfer roller 45 (K, Y) as transfer means for sequentially transferring the toner image developed by the developing device 44 (K, C, M, Y) to the intermediate transfer belt 50 as a primary transfer target. C, M, Y) and a cleaning device 46 (K, C, M, Y) as a cleaning means for removing the toner remaining on the surface of the photoreceptor 41 (K, C, M, Y) after being transferred. ).

  Here, in each line head 101 (K, C, M, Y), the array direction of the line head 101 (K, C, M, Y) is set to the bus of the photosensitive drum 41 (K, C, M, Y). It is installed along. The emission energy peak wavelength of each line head 101 (K, C, M, Y) and the sensitivity peak wavelength of the photoconductor 41 (K, C, M, Y) are set to substantially coincide.

  The developing device 44 (K, C, M, Y) uses, for example, a non-magnetic one-component toner as a developer, and the one-component developer is conveyed to the developing roller by a supply roller, for example, and adhered to the developing roller surface. The film thickness of the developed developer is regulated by a regulating blade, and the developing roller is brought into contact with or increased in thickness by the photosensitive body 41 (K, C, M, Y), whereby the photosensitive body 41 (K, C, M, Y). The toner is developed as a toner image by attaching a developer according to the potential level.

  The black, cyan, magenta, and yellow toner images formed by the four-color single-color toner image forming station are intermediated by the primary transfer bias applied to the primary transfer roller 45 (K, C, M, Y). The toner image, which is sequentially primary transferred onto the transfer belt 50 and sequentially superposed on the intermediate transfer belt 50 to become a full color, is secondarily transferred to a recording medium P such as paper by a secondary transfer roller 66, and serves as a fixing unit. The toner is fixed on the recording medium P by passing through the fixing roller pair 61, and is discharged onto a paper discharge tray 68 formed in the upper part of the apparatus by a paper discharge roller pair 62.

  In FIG. 11, reference numeral 63 denotes a paper feed cassette in which a large number of recording media P are stacked and held, 64 denotes a pickup roller for feeding the recording media P from the paper feed cassette 63 one by one, and 65 denotes a secondary transfer roller. A pair of gate rollers for defining the supply timing of the recording medium P to the secondary transfer portion 66, a secondary transfer roller 66 as a secondary transfer means for forming a secondary transfer portion with the intermediate transfer belt 50, 67 Is a cleaning blade as a cleaning means for removing the toner remaining on the surface of the intermediate transfer belt 50 after the secondary transfer.

  Next, an example of an organic EL device as a light emitting device used in the organic EL line head as described above will be described.

  FIG. 12 is a plan view of the organic EL device 1 (corresponding to the light emitter array 1 in FIGS. 1 to 10). The organic EL device 1 includes a light-transmitting rectangular glass substrate 20 as a base, and the glass substrate 20 corresponds to a plurality of circular light emitting regions 2 (the light emitting elements 2 in FIGS. 1 to 10). ) Is provided. The light emitting regions 2 are formed at equal intervals so as to form a row along the longitudinal direction of the glass substrate 20. The rows of the light emitting regions 2 are arranged in two rows on the glass substrate 20. Each light emitting region 2 is arranged so as to be shifted by a half pitch in the longitudinal direction of the glass substrate 20 with respect to the light emitting region 2 in the other adjacent row. That is, the light emitting regions 2 are arranged in a staggered pattern. The organic EL device 1 emits light in the light emitting region 2. FIG. 12 is a view of the organic EL device 1 as viewed from the light emission side. As the substrate, in addition to the glass substrate 20, various members such as a quartz substrate can be used.

  13 is an enlarged view of the peripheral portion of the light emitting region 2 in FIG. 12, and FIG. 14 is a cross-sectional view of the organic EL device 1 taken along the line EE in FIG. Hereinafter, the structure of the organic EL device 1 will be described with reference to the plan view of FIG. 13 using the cross-sectional view of FIG.

The organic EL device 1 has a configuration in which a glass substrate 20 is a base and each component is stacked thereon. A base protective film 31 made of a silicon oxide film (SiO ₂ ) or the like is formed on the glass substrate 20. A TFT (Thin Film Transistor) element 27 is formed on the base protective film 31.

More specifically, the semiconductor film 21 made of a polysilicon film is formed in an island shape on the base protective film 31. A source region and a drain region are formed in the semiconductor film 21 by introduction of impurities, and a portion where no impurities are introduced is a channel region. A gate insulating film 32 made of a silicon oxide film or the like is formed on the base protective film 31 and the semiconductor film 21. On the gate insulating film 32, aluminum (Al), molybdenum (Mo), tantalum (Ta), A gate electrode 23 made of titanium (Ti), tungsten (W), or the like is formed. A first interlayer insulating film 33 and a second interlayer insulating film 34 are stacked in this order on the gate electrode 23 and the gate insulating film 32. Here, the first interlayer insulating film 33 and the second interlayer insulating film 34 are made of an inorganic insulating film such as a silicon oxide film (SiO ₂ ) or a titanium oxide film (TiO ₂ ).

  A common power supply line 25 is formed in the upper layer of the first interlayer insulating film 33. The common power supply line 25 is connected to the source region of the semiconductor film 21 through a contact hole provided through the first interlayer insulating film 33 and the gate insulating film 32.

  A light-transmissive pixel electrode 11 made of ITO (Indium Tin Oxide) is formed on the second interlayer insulating film 34 for each light emitting region 2. The pixel electrode 11 is formed in a region that is slightly larger than the circle shown as the light emitting region 2 in the plan view of FIG. The light emitting regions 2 are formed at equal intervals so as to form a row along the longitudinal direction of the glass substrate 20. The pixel electrode 11 is electrically connected to the drain region of the semiconductor film 21 through a contact hole provided through the second interlayer insulating film 34, the first interlayer insulating film 33, and the gate insulating film 32. . In such a configuration, the TFT element 27 functions to flow a drive current from the common power supply line 25 to the pixel electrode 11 when switched on and off by supplying a voltage to the gate electrode 23 and is turned on.

  A first bank 12 made of an inorganic material is formed on the second interlayer insulating film 34. The first bank 12 is disposed on the second interlayer insulating film 34 so as to surround the pixel electrode 11, and a part of the first bank 12 is on the outer edge of the pixel electrode 11 when viewed from the normal direction of the glass substrate 20. It is formed in an overlapping state. In other words, the first bank 12 has an opening 12 a smaller than the pixel electrode 11 and is disposed so as to overlap the pixel electrode 11. The opening 12 a is provided in a region corresponding to the light emitting region 2. That is, the shape of the light emitting region 2 shown in FIG. 12 becomes the shape of the opening 12a as it is. In other words, the first bank 12 is formed in a region excluding the light emitting region 2. The first bank 12 is made of an inorganic insulating film such as a silicon oxide film and has a thickness of about 50 to 100 nm.

  A second bank 22 is stacked on the first bank 12 in the same formation region as the first bank 12. The second bank 22 has a first liquid repellent area 22a, a lyophilic area 22b, and a second liquid repellent area 22c. The first liquid repellent region 22a is formed in an annular region A surrounding the light emitting region 2 shown in FIGS. The lyophilic region 22b is formed in an annular region B surrounding the region A. The second liquid repellent region 22c is formed in a region C corresponding to the outside of the region B. In this embodiment, the region A and the region B are both concentric annular regions. In addition, the inner circle of the region A matches the light emitting region 2, and the outer circle of the region A and the inner circle of the region B match. Therefore, the light emitting region 2, the region A in which the first liquid repellent region 22a is formed, the region B in which the lyophilic region 22b is formed, and the region C in which the second liquid repellent region 22c is formed are adjacent to each other. When viewed from the normal direction of the glass substrate 20, the region on the organic EL device 1 is included in any one of the light emitting region 2, the region A, the region B, and the region C. In this embodiment, the diameter of the circle of the light emitting region 2 is about 50 μm, the width of the region A where the first lyophobic region 22 a is formed is about 5 μm, and the width of the region B where the lyophilic region 22 b is formed is about 20 μm. is there.

  Here, the lyophilic region 22b in the second bank 22 has a relatively higher wettability than the first liquid repellent region 22a and the second liquid repellent region 22c. High wettability means that the contact angle with the liquid is relatively small. It can be said that the liquid ejected to a certain region is difficult to enter a region adjacent to the region that has relatively low wettability (that is, a large contact angle). Therefore, in this embodiment, the liquid ejected to the light emitting region 2 does not easily enter the first liquid repellent region 22a, and the liquid ejected to the lyophilic region 22b does not easily enter the second liquid repellent region 22c. It has become.

  On the pixel electrode 11, a hole injection layer 14 is formed in a region surrounded by the first liquid repellent region 22 a, that is, a region corresponding to the light emitting region 2. More specifically, the hole injection layer 14 is formed in a recess having the pixel electrode 11 as a bottom and the first bank 12 and the second bank 22 as side walls. Since the light emitting region 2 where the hole injection layer 14 is formed is surrounded by the first liquid repellent region 22a of the second bank 22, the functional liquid discharged when forming the hole injection layer 14 is It is difficult to enter outside the light emitting region 2. For this reason, the hole injection layer 14 can be easily formed in the light emitting region 2.

  The hole injection layer 14 is composed of a conductive polymer layer containing a dopant in a conductive polymer material. Such a hole injection layer 14 can be composed of, for example, 3,4-polyethylenedioxythiophene (PEDOT-PSS) containing polystyrene sulfonic acid as a dopant.

  In the region on the hole injection layer 14 and the second bank 22 and surrounded by the second liquid repellent region 22c (that is, the region composed of the light emitting region 2, the first liquid repellent region 22a, and the lyophilic region 22b). A light emitting layer 15 is formed. Due to the presence of the second liquid repellent area 22c, the functional liquid discharged when forming the light emitting layer 15 spreads only in the lyophilic area 22b and the area inside thereof, and does not easily enter the second liquid repellent area 22c. . For this reason, the light emitting layer 15 can be easily formed in a region surrounded by the second liquid repellent region 22c. Since the light emitting layer 15 thus formed has an area larger than the area of the hole injection layer 14 (that is, the area of the light emitting region 2), the thickness of the light emitting layer 15 is made uniform in the light emitting region 2. be able to. That is, a relatively flat region in the light emitting layer 15 can be used for light emission.

  In the present specification, a layer including the hole injection layer 14 and the light emitting layer 15 is also referred to as an organic EL element 13. The thickness of the hole injection layer 14 is about 50 nm, and the thickness of the light emitting layer 15 is about 100 nm.

  On the light emitting layer 15 and the second liquid repellent region 22c of the second bank 22, a cathode 16 that is a laminate of calcium (Ca) having a thickness of about 5 nm and aluminum (Al) having a thickness of about 300 nm is formed. Yes. In other words, the cathode 16 is formed on the opposite side of the pixel electrode 11 with the light emitting layer 15 interposed therebetween. A sealing member 17 made of a resin or the like is laminated on the cathode 16 to prevent water and oxygen from entering and prevent the cathode 16 or the organic EL element 13 from being oxidized.

  The light emitting layer 15 described above is a layer of an organic light emitting material that exhibits an electroluminescence phenomenon. By applying a voltage between the pixel electrode 11 and the cathode 16, holes are injected from the hole injection layer 14 and electrons are injected from the cathode 16 into the light emitting layer 15. The light emitting layer 15 emits light when they are combined. The emission spectrum from the light emitting layer 15 depends on the light emission characteristics and film thickness of the material. In the present embodiment, the light emitting layer 15 emits red light, and the main emission wavelength, that is, the wavelength at which the emission intensity is maximum in the emission spectrum is about 630 nm.

  The organic EL device 1 emits light only in the light emitting region 2 and does not emit light in the region where the first bank 12 is formed. As shown in FIG. 14, in this region, the first bank 12, which is an insulating material, is arranged between the pixel electrode 11 (anode) and the cathode 16. This is because it is blocked.

  The light emitted from the light emitting layer 15 downward in FIG. 14 passes through the glass substrate 20 as it is, and the light emitted upward in FIG. 14 is reflected by the cathode 16 and then travels downward, and also passes through the glass substrate 20. To do. The organic EL device 1 having such a configuration is called a bottom emission type.

  When the organic EL device 1 is a top emission type that emits display light toward the side opposite to the glass substrate 20, the cathode 16 is composed of, for example, a thin calcium layer, an ITO layer, and the like to transmit light. Therefore, on the lower layer side of the pixel electrode 11, a light reflection layer made of an aluminum film or the like is formed so as to overlap substantially the entire pixel electrode 11.

  According to the organic EL device 1 having the above configuration, the thickness of the light emitting layer 15 can be made uniform in the light emitting region 2. Therefore, a relatively flat portion of the light emitting layer 15 can be used for light emission, and the organic EL device 1 having uniform light emission characteristics can be obtained.

  The present invention relates to an organic EL line head as described above and a method for manufacturing a microlens array used in an image forming apparatus using the organic EL line head. Examples of the manufacturing method will be described below. .

  FIG. 15 is a cross-sectional view of a microlens array 6 of one embodiment manufactured according to the manufacturing method of the present invention. The same microlens 5 constituting the microlens array 6 is in a predetermined direction, and in the case of FIG. Arranged in rows at a constant pitch, three rows of three similar microlenses 5 are arranged in the sub-scanning direction, and the leading positions of the rows in the main scanning direction are shifted by a third pitch. Is done. The deviation of the head position is 1 / N pitch when there are N rows of microlenses 5.

This microlens array 6 is a single-sided planar microlens array in which a curved lens refracting surface portion 72 having a predetermined shape made of a transparent resin is integrally formed on the surface of a rectangular transparent substrate 71 having a predetermined thickness and made of a glass plate or the like. 6 _1, similarly, a lens refractive surface 74 of the curved surface of a predetermined shape surface made similar transparent resin of another similar transparent substrate 73 and the single-sided planar microlens array 6 ₂ formed is molded integrally, each The optical surfaces of the lens refracting surface portions 72 and 74 are accurately aligned with each other so that the optical axes OO ′ of the corresponding microlenses 5 are accurately aligned, and are bonded and integrated with each other on the plane side. It will be. The lens refracting surface portion 72 and the lens refracting surface portion 74 may have the same shape or different shapes. Further, the transparent substrate 71 and the transparent substrate 73 may be the same material and the same thickness, or may be different materials and different thicknesses.

A method of manufacturing such single-sided planar microlens arrays 6 ₁ , 6 ₂ will be described with reference to the drawings illustrating the manufacturing process of FIG. Hereinafter, the front one side plane microlens array ₆₁ and the rear sided planar microlens array 6 ₂ are prepared separately, so prepared in the same manner, will be described simultaneously.

  First, in step (a), a front lens surface mold 82 corresponding to the front lens surface of the microlens array 6 and a back lens surface mold 84 corresponding to the back lens surface are separately prepared. The curved surface mold parts 92 and 94 corresponding to the concave molds of the microlens surfaces in both molds 82 and 84 are formed by machining. The depths of the curved surface mold portions 92 and 94 are usually 100 to 200 μm and the diameter is about 0.1 to 1 mm. Instead of forming the curved surface mold portions 92 and 94 by machining, they can be formed by etching. Alternatively, it can also be formed by a method in which a large number of beads having surface shapes corresponding to the first surface and the second surface of each microlens 5 are arranged and transferred to a mold substrate. The dispenser 75 capable of measuring and injecting the liquid amount into the curved surface mold portions 92 and 94 of the front side lens surface mold 82 and the back side lens surface mold 84 formed in this way is halfway through the curved surface mold portions 92 and 94. A quantity of ultraviolet (UV) curable resin 76 that fills up to is injected in sequence. During the injection, the UV curable resin 76 can be prevented from being disturbed by injecting it while raising the dispenser 75 as shown by the arrow.

  Next, in the step (b), in a state where the UV curable resin 76 is injected into all the curved mold portions 92 and 94, the UV curable resin 76 is irradiated with ultraviolet rays 78 from above to make the UV curable resin 76 semi-cured. To do. Here, the reason why the UV curable resin 76 is not completely cured is to prevent the occurrence of an interface with the UV curable resin 76 'additionally injected in the next step (c).

  Next, in the step (c), as in the step (a), an additional UV curable resin 76 ′ is injected into the curved surface mold portions 92 and 94 that are filled with the semi-cured UV curable resin 76 halfway. The curved surface mold portion 92 is filled with the UV curable resin 76 + 76 ′ to some extent.

Next, in the step (d), each of the curved surface mold portions 92 and 94 is formed of UV glass substrates 71 and 73 having the same shape and being the same as the transparent substrates 71 and 73 in the single-sided planar microlens arrays 6 ₁ and 6 ₂ . It is pressed at a constant pressure onto the lens surface molds 82 and 84 which are filled with the cured resin 76 + 76 ′. At this time, a gap member 80 that maintains a predetermined small distance is disposed around the entire curved surface mold portions 92 and 94. By disposing the gap member 80, excess UV curable resin 76 'and air bubbles can be easily removed. In this state, the ultraviolet ray 78 from the UV lamp 77 is irradiated from above through the glass substrates 71 and 73 to completely cure the UV curable resin 76 + 76 ′.

After the UV curable resin 76 + 76 ′ is completely cured to become the front-side lens refracting surface portion 72 and the back-side lens refracting surface portion 74, in step (e), the glass substrates 71 and 73 are molded together with the lens refracting surface portions 72 and 74. By removing from 82 and 84, the front-side single-sided planar microlens array 6 ₁ and the back-side single-sided planar microlens array 6 ₂ are obtained, respectively.

  Here, injecting the UV curable resins 76 and 76 'into the curved surface mold portions 92 and 94 in two portions makes it difficult to produce bubbles because the amount of the injected solution is small each time, and even if it is possible, it is easily removed. This is for the purpose of suppressing a decrease in surface accuracy due to shrinkage during curing. In addition, the curved mold portions 92 and 94 are sufficiently filled with the UV curable resin 76 by the first injection, and the UV curable resin 76 is completely cured by the single irradiation of the ultraviolet ray 78 through the glass substrates 71 and 73, and the lens. Of course, the refracting surface portions 72 and 74 may be used.

However, when integrating the front sided planar microlens array ₆₁ and the rear sided planar microlens array 6 _2, be accurately aligned axially with the optical axis between the corresponding lens refractive surface portion 72 and the lens refractive surface portion 74 is important. Hereinafter, an alignment method for that purpose will be described.

  FIG. 17 is a view for explaining one of the positioning methods for that purpose, and FIG. 17 (a) shows the glass substrate 71 placed on the front lens surface mold 82 in FIG. 16 (d) from above. FIG. 17B is a view of the glass substrate 73 placed on the back lens surface mold 84 in FIG. 16D as viewed from above. Both molds 82, 84 have the same position (the entire curved surface mold portion 92 as a mirror image) with respect to the entire pattern of the curved surface mold portion 92 and the entire pattern of the curved surface mold portion 94 that are mirror images of each other. The positioning pins 513 to 515 and 513 ′ to 515 ′ are arranged at the same position corresponding to the pattern of the curved surface mold portion 94 and the entire pattern of the curved surface mold portion 94). The positioning pins 515 and 515 ′ are for abutting the respective short sides 712 and 732 of the glass substrates 71 and 73 corresponding to the ends in the main scanning direction, and the positioning pins 513 and 513 ′ extend in the main scanning direction. This is for the same position on the short side 712, 732 side of one long side 711 of the glass substrate 71 and one long side 731 of the glass substrate 73 to abut each other, and the positioning pins 514 and 514 ′ are in the main scanning direction. One long side 711 of the extending glass substrate 71 and one long side 731 of the glass substrate 73 are in contact with the same position on the opposite side of the short sides 712 and 732, respectively. As the glass substrates 71 and 73, those in which the long sides 711 and 731 and the short sides 712 and 732 are orthogonal to each other are used.

Because of this arrangement, when the lens refracting surface portions 72 and 74 are integrally formed on the surfaces of the glass substrates 71 and 73, respectively (FIG. 16D), the surfaces of the glass substrates 71 and 73 are respectively front side. The glass substrates 71 and 73 are placed on the molds 82 and 84 so as to face the lens surface mold 82 and the back lens surface mold 84, and the glass substrates 71 and 73 are mounted as shown in FIGS. by irradiating ultraviolet rays 78 in abutting state with 3-point support state with the positioning pins 513～515,513'～515 ', front sided planar microlens array ₆₁ and the rear sided planar microlens array 6 ₂ is obtained .

Then, facing the flat side of the flat surface side and the back side sided planar microlens array 6 ₂ of the glass substrate 73 of the front sided planar microlens array ₆₁ of the glass substrate 71, the long sides 711 and short sides 712 of the glass substrate 71 by accurately aligning each long side 731 and short side 732 of the glass substrate 73, the front one-sided planar front lens refractive surface 72 of the microlens array ₆₁ and the rear sided planar microlens array 6 ₂ of the rear side lens refractive surface portion 74 As a result, the axis can be aligned with high accuracy without axis misalignment. In this state, by integrating the glass substrate 71 and the glass substrate 73 with an adhesive or the like, the front side lens refracting surface portion 72 and the back side lens refracting surface portion 74 of each microlens 5 are aligned with high accuracy without axis misalignment. Thus, the microlens array 6 of the present invention (FIG. 15) is obtained.

In the example of FIG. 17, the long sides 711 and 731 and the short sides 712 and 732 of the glass substrates 71 and 73 are used as the positioning reference. However, the glass substrates 71 and 73 are provided with mechanical means serving as the positioning reference. May be. An example is shown in FIG. First positioning portions 713 and 733 made of V-shaped cuts at the same position on the short side 712 side of the long side 711 of the glass substrate 71 and the short side 732 side of the long side 731 of the glass substrate 73, respectively, and the long side On the opposite side of the short sides 712 and 732 of 711 and 731, second positioning portions 714 and 734 made of trapezoidal cuts are provided at the same position. Using the glass substrates 71 and 73 provided with the first positioning portions 713 and 733 and the second positioning portions 714 and 734, the front side lens refracting surface portion 72 and the back side lens refracting surface portion 74 are aligned with high accuracy without axis misalignment. In order to obtain the microlens array 6, the respective microlens arrays 6 ₁ and 6 ₂ may be formed in an arrangement as shown in FIG.

  That is, FIG. 18 is a view similar to FIG. 17. In this case as well, the entire pattern of the curved surface mold portion 92 and the entire pattern of the curved surface mold portion 94 are mirror images of each other. On the other hand, the positioning pins 516 to 517 and 516 ′ to 517 ′ are arranged at the same mirror image relation positions (the same positions corresponding to the entire pattern of the curved surface mold portion 92 and the entire pattern of the curved surface mold portion 94). Has been. The positioning pins 516 and 516 ′ are for abutting the first positioning portions 713 and 733 formed of V-shaped cuts provided on the long sides 711 and 731 of the glass substrates 71 and 73 extending in the main scanning direction, The positioning pins 517 and 517 ′ are for abutting the second positioning portions 714 and 734 made of trapezoidal cuts provided on the long sides 711 and 731 of the glass substrates 71 and 73.

Because of this arrangement, when the lens refracting surface portions 72 and 74 are integrally formed on the surfaces of the glass substrates 71 and 73, respectively (FIG. 16D), the surfaces of the glass substrates 71 and 73 are respectively front side. Glass substrates 71 and 73 are placed on the molds 82 and 84 so as to face the lens surface mold 82 and the back side lens surface mold 84, and positioning pins 516 and 517 as shown in FIGS. 18 (a) and 18 (b). Are positioned on the first positioning portion 713 and the second positioning portion 714 of the glass substrate 71, respectively, and the positioning pins 516 ′ and 517 ′ are respectively positioned on the first positioning portion 733 and the second positioning portion 734 of the glass substrate 73, thereby positioning. Interaction between the pins 516 and 516 ′ and the first positioning portions 713 and 733 determines the positions of the glass substrates 71 and 73 at points on the short sides 712 and 712 ′, and the positioning pins 517 and 517 The swivel position around that point is determined by the interaction between the second positioning portions 714 and 734, and as a result, the glass substrates 71 and 73 are positioned. By irradiating ultraviolet rays 78 in the positioned state, the front one-sided planar microlens array ₆₁ and the rear sided planar microlens array 6 ₂ lens refracting surface portion 72, 74 at a predetermined position is integrally molded can be obtained.

Then, facing the flat side of the flat surface side and the back side sided planar microlens array 6 ₂ of the glass substrate 73 of the front sided planar microlens array ₆₁ of the glass substrate 71, a first positioning portion 713 of the glass substrate 71 second The positioning unit 714 is accurately aligned with the first positioning unit 733 and the second positioning unit 734 of the glass substrate 73 using positioning pins similar to the positioning pins 516 and 517, respectively, so that the front side single-sided planar microlens array 6 is aligned. so _that the _first and the front lens refractive surface 72 and the back sided planar microlens array 6 ₂ of the rear side lens refracting surface portion 74 is axially aligned with high accuracy with no offset axis is made. In this state, by integrating the glass substrate 71 and the glass substrate 73 with an adhesive or the like, the front side lens refracting surface portion 72 and the back side lens refracting surface portion 74 of each microlens 5 are aligned with high accuracy without axis misalignment. Thus, the microlens array 6 of this embodiment (FIG. 19) is obtained.

  In the example of FIGS. 18 and 19, first positioning portions 713 and 733 and second positioning portions 714 and 734 are provided on the long sides 711 and 731 of the glass substrates 71 and 73, and the positioning is performed on both molds 82 and 84. It was an example in which positioning pins 516 to 517 and 516 ′ to 517 ′ were provided corresponding to the portions 713, 714, 733, and 734 and positioned by mechanical means, but the glass substrates 71 and 73 and both molds 82, Alternatively, an optical positioning mark may be provided at 84 and optically positioned. An example will be described with reference to FIG. FIG. 20 is a view similar to FIGS. 17 and 18, and as shown in FIG. 20A, X-shaped positioning marks 518 and 519 surrounded by circles are provided on both rear surfaces in the longitudinal direction of the glass substrate 71. On the other hand, + -shaped positioning marks 821 and 822 are provided at positions accurately corresponding to the positioning marks 518 and 519 of the front lens surface mold 82, and as shown in FIG. In addition, + -shaped positioning marks 518 ′ and 519 ′ surrounded by circles are provided at positions accurately corresponding to the positioning marks 518 and 519 on the back surfaces at both ends in the longitudinal direction of the glass substrate 73, X-shaped positioning marks 821 ′ and 822 ′ are provided at positions corresponding to the positioning marks 518 ′ and 519 ′ of the back side lens surface mold 84 accurately.

Therefore, when the lens refracting surface portion 72 is integrally formed on the surface of the glass substrate 71, the glass substrate 71 is disposed so that the surface of the glass substrate 71 faces the front lens surface mold 82, as shown in FIG. Is placed on the front lens surface mold 82, and the glass substrate 71 is used, for example, using a microscope so that the positioning marks 518 and 519 of the glass substrate 71 and the positioning marks 821 and 822 of the front lens surface mold 82 are accurately aligned. determining the location, by irradiating the ultraviolet rays 78 in this state, the lens refractive surface 72 at a predetermined position is formed integrally, the front one-sided planar microlens array ₆₁ is obtained.

Similarly, when the lens refracting surface portion 74 is integrally formed on the surface of the glass substrate 73, the glass substrate 73 is disposed so that the surface of the glass substrate 73 faces the back lens surface mold 84 as shown in FIG. 73 is placed on the rear lens surface mold 84, and for example, a microscope is used so that the positioning marks 518 'and 519' on the glass substrate 73 and the positioning marks 821 'and 822' on the rear lens surface mold 84 are accurately aligned. position the glass substrate 73 using, by irradiating ultraviolet light 78 in this state, the lens refractive surface portion 74 at a predetermined position is formed integrally, the back one-sided planar microlens array 6 ₂ is obtained.

Then, facing the flat side of the flat surface side and the back side sided planar microlens array 6 ₂ of the glass substrate 73 of the front sided planar microlens array ₆₁ of the glass substrate 71, a glass substrate positioning marks 518 and 519 of the glass substrate 71 each positioning mark 73 518 ', 519' that precise alignment with the example microscope, the front one-sided planar microlens array ₆₁ of the front lens refractive surface 72 and the back sided planar microlens array 6 ₂ of the rear side lens The refracting surface portion 74 is aligned with high accuracy without any axial misalignment. In this state, by integrating the glass substrate 71 and the glass substrate 73 with an adhesive or the like, the front side lens refracting surface portion 72 and the back side lens refracting surface portion 74 of each microlens 5 are aligned with high accuracy without axis misalignment. Thus, the microlens array 6 of this embodiment (FIG. 21) is obtained.

  As a modification of FIG. 20, positioning marks 518, 519, 518 ′, and 519 ′ are not provided in advance on the glass substrates 71 and 73. Instead, the lens refracting surface portions 72 and 74 are formed on the glass substrates 71 and 73. At the time of integral molding, positioning marks 518, 519, 518 'and 519' are simultaneously integrally molded with UV curable resin at positions corresponding to the positioning marks 518, 519, 518 'and 519' on the surfaces of the glass substrates 71 and 73. You may make it do. In that case, a mold for forming such UV curable resin positioning marks 518, 519, 518 ', 519' at the positions of the positioning marks 821, 822, 821 ', 822' of the molds 82, 84. Will be formed.

  Now, an example of an optical writing line head using the microlens array 6 manufactured as described above will be described. FIG. 22 is a partially cutaway perspective view showing the configuration of the optical writing line head 101 of this example, and FIG. 23 is a plan view showing a mechanism for attaching the microlens array 6 to the optical writing line head 101. In this example, the microlens array 6 of FIG. 19 is used. In this example, the light emitter blocks 4 are arranged in three rows so as to extend in the main scanning direction while being shifted by a third pitch in the sub-scanning direction, and the microlenses 5 of the microlens array 6 are also correspondingly scanned in the main scanning direction. They are arranged at a constant pitch so as to extend in the direction, and in the sub-scanning direction, the leading positions of the columns in the main scanning direction are shifted by a third pitch.

  The organic EL device 1 constituting the light emitter array 1 is fitted and fixed in a receiving hole provided at the bottom of the long housing 35. The positioning pins 36 provided at both ends of the long housing 35 are fitted into the positioning holes of the opposing image forming apparatus main body, and the fixing screws are inserted through the screw insertion holes 37 provided at both ends of the long case 35. The optical writing line head 101 is fixed at a predetermined position by being screwed into the screw hole.

  A light shielding member 28 having a predetermined thickness is formed on the surface side of the organic EL device 1 of the long housing 35 with a through hole 29 formed so as to align with each light emitter block 4 of the light emitter array 1. The microlens array 6 is fixed through. At that time, the microlens array 6 is fixed so that the optical axis of each microlens 5 of the microlens array 6 is aligned with the center of the light emitter block 4.

  In order to make it possible to fix the microlens array 6 to the long housing 35 with high accuracy, as shown in FIG. 23, the housing 35 is provided with a rectangular opening 38 for attachment that is slightly larger than the outer shape of the microlens array 6. Protrusions 526 and 527 corresponding to the positioning pins 516 (516 ′) and 517 (517 ′) of the molds 82 and 84 are provided on one wall surface along the long side, and the opposite wall surface is biased to one wall surface side. A biasing member 523 for applying force is provided.

  Accordingly, the urging member 523 is opened, the microlens array 6 of FIG. 19 is fitted into the rectangular opening 38, and the urging force of the urging member 523 is applied to fix the microlens array 6 to the long housing 35. At that time, the protrusions 526 and 527 on the wall surface of the rectangular opening 38 enter and contact the first positioning portions 713 and 733 and the second positioning portions 714 and 734 of the glass substrates 71 and 73 constituting the microlens array 6, respectively. The microlens array 6 is accurately positioned and fixed to the housing 35.

  As described above, in this embodiment, the positioning means (first positioning portions 713 and 733, second positioning portions 714 and 734) used for the positioning reference of the lens surface when manufacturing the microlens array 6 is used as the optical writing line head 101. Therefore, the optical system of the optical writing line head 101 can be assembled with high accuracy.

  Next, some modified examples of the microlens array 6 according to the present invention will be described.

Microlens array 6 shown in the sectional view of FIG. 24, integral with facing 16 of way produced a front sided planar microlens array ₆₁ and the rear sided planar microlens array 6 ₂ at respective planes side when a configuration including arranging the light shielding film 6 ₃ for blocking other stray Guests prevent crosstalk between the micro lenses 5 between one side plane microlens array 6 _and 62. The light shielding film 6 _3, corresponding to each microlens 5 with the optical axis O-O 'is a light-shielding film concentric openings are provided, for example, any of the lens refractive surface 72, 74 of the glass substrate 71 and 73 Can be printed on a plane opposite to the first plane or formed by a photolithographic technique, and then the single-sided planar microlens arrays 6 ₁ and 6 ₂ are aligned with each other by the method described with reference to FIGS. Can be manufactured by integrating them.

Microlens array 6 shown in the sectional view of FIG. 25, integral with facing 16 of way produced a front sided planar microlens array ₆₁ and the rear sided planar microlens array 6 ₂ at respective planes side when, in order to block other stray Guests prevent crosstalk between the micro lenses 5 between one side plane microlens array 6 _and 62, in place of the light shielding film 6 ₃ of FIG. 24, the thickness thicker, is an example corresponding to each microlens 5 with the optical axis O-O 'is concentric apertures disposed a light-shielding plate 6 ₄ provided. In this case, the front one side plane between the microlens array ₆₁ and the rear sided planar microlens array 6 ₂ sandwiching the light shielding plate 6 _4, then 17 to 21 single-sided planar microlens array in the manner described in 6 ₁ and 6 ₂ can be manufactured by aligning and integrating each other.

  FIG. 26 is a view similar to FIG. 22 of an optical writing line head using the microlens array 6 of this embodiment. Details thereof will be omitted because they are apparent from the description of FIG. 25 and the description of FIG.

Microlens array 6 shown in the sectional view of FIG. 27 is a modified example of the microlens array 6 of FIG. 25, the plane side of the front sided planar microlens array ₆₁ plane side and the back side sided planar microlens array 6 ₂ rather than confront the, is intended to integrate both towards one of the flat side to the object side or the image side or a light shielding plate 6 ₄ as a spacer, in the case of FIG. 27, the front one-sided planar microlens array 6 toward the _first plane side to the image side, an example in which face each other and the back sided flat plane side of the microlens array 6 ₂ and front sided planar microlens array ₆₁ of the lens refractive surface 72 side. The mutual alignment between the single-sided planar microlens arrays 6 ₁ and 6 ₂ is performed by the method described with reference to FIGS. This configuration, as described later, when used as a micro lens array 6 of the line head 101 of the image forming apparatus shown in FIG 11, the exposed microlens array ₆₁ of the glass substrate 71 toner in the developer is scattered Although it adheres to a flat surface, since the surface is a flat surface, it can be easily cleaned and the cleaning performance is improved.

The microlens array 6 of the present invention described above is a single-sided planar microlens array 6 ₁ configured by providing lens refracting surface portions 72 and 74 formed of, for example, UV curable resin 76 + 76 ′ on one surface of glass substrates 71 and 73, respectively. 6 ₂ had been constructed by integrally aligned, it may be used those formed of resin or the like having a single composition as a single-sided planar microlens array. A configuration example in that case is shown in a sectional view of FIG. In this case, the single-sided planar microlens arrays 6 ₅ and 6 ₆ are each integrally formed of transparent resin or the like including the lens refracting surface portions 72 and 74 by a molding method such as injection molding. The other lens surface is molded into a flat surface. Such single-sided planar microlens arrays 6 ₅ , 6 ₆ are opposed to the planes on both sides of the glass substrate 70 with their respective planar sides facing each other, and the single-sided planar microlens array 6 is subjected to the method described with reference to FIGS. ₅ and 6 ₆ are produced by aligning each other and integrating them on both surfaces of the glass substrate 70 with an adhesive or the like. When the thickness of the microlens array 6 is thin, the single-sided planar microlens arrays 6 ₅ and 6 ₆ may be integrated directly without the glass substrate 70.

Here, an example of a method for forming such single-sided planar microlens arrays 6 ₅ and 6 _{6 having} a single composition will be described with reference to the drawing explaining the manufacturing process of FIG. As shown in FIG. 29A, curved surface mold parts 92 and 94 corresponding to the concave molds of the microlens surfaces of the single-sided planar microlens arrays 6 ₅ and 6 ₆ are formed in the same manner as the molds 82 and 84, respectively. The upper molds 95 and 97 are prepared, and the lower mold 96 having the planar mold part 100 corresponding to the plane opposite to the microlens surface of the single-sided planar microlens arrays 6 ₅ and 6 ₆ is prepared. The lower mold 96 may be a single mold corresponding to the upper molds 95 and 97, or may be prepared separately corresponding to the molds 95 and 97, respectively.

  Then, as shown in FIG. 29 (b), the positioning pins 98 and 98 of the upper molds 95 and 97 are inserted into the positioning holes 99 and 99 provided at positions corresponding to the positioning pins 98 and 98 of the lower mold 96. Assemble the mold. The lower mold 96 is provided with injection holes 110 and 110 for injecting resin.

  Next, as shown in FIG. 29 (c), a thermoplastic resin 111 such as PMMA that is heated and melted from the injection holes 110 and 110 is poured into a mold composed of the upper molds 95 and 97 and the lower mold 96 and cooled. To do.

Next, by disassembling the mold as shown in FIG. 29 (d), the molded single-sided planar microlens arrays 6 ₅ and 6 ₆ are taken out.

FIG. 29 shows one molding method of single-sided planar microlens arrays 6 ₅ , 6 _{6 having} a single composition, and can be produced by other molding methods.

Now, some further modifications of the microlens array 6 according to the present invention will be described. FIGS. 30 to 32 below show a single-sided planar microlens array 6 ₁ , 6 ₂ according to the present invention, and a glass substrate 73 of the single-sided planar microlens array 6 ₂ below as a light emitter array (organic EL). FIG. 15 is a cross-sectional view showing an example of a microlens array 6 that is also used as a glass substrate 20 (FIGS. 12 and 14) forming an apparatus 1. In these cases, the light emitter block on a plane opposite to the lens refractive surface 74 of the single-sided planar microlens array 6 _second glass substrate 73, a light emitting region 2 of the organic EL so as to correspond to each microlens 5 4 is arranged (FIG. 4) to obtain a bottom emission type organic EL device 1.

In the configuration of FIG. 30, the microlens array 6, the same as in FIG. 27, toward the plane side of the back sided planar microlens array 6 ₂ on the object side (the light emitter block 4), the front one-sided planar microlens array 6 via the light shielding plate 6 ₄ provided the _first plane side and the back side one side plane microlens apertures and an array 6 _second lens refracting surface portion 74 side so as to correspond to each microlens 5 with the optical axis O-O 'concentric And are integrated by performing mutual alignment by the method described with reference to FIGS.

In the configuration of FIG. 31, the microlens array 6, toward the plane side of the back sided planar microlens array 6 ₂ on the object side (the light emitter block 4), and front sided planar microlens array ₆₁ of the lens refractive surface 72 side facing the rear sided planar microlens array 6 _second lens refracting surface portion 74 side through the light shielding plate 6 _4, by integrating performing alignment of each other in the manner described in FIGS. 17 to 21 Produced. For this configuration, as in the case of FIG. 27, when used as a micro lens array 6 of the line head 101 of the image forming apparatus as shown in FIG. 11, scattered toner of the microlens array ₆₁ of the glass substrate 71 Since it adheres to the exposed flat surface, it can be easily cleaned and has good cleanability.

In the configuration of FIG. 32, as the microlens array 6 'for organic EL line head, a single-sided planar microlens array 6 ₂ was also used as the glass substrate 20 to form a light emitter array (organic EL device) 1, a glass substrate 73 15 or 28 is an example using a combination of a microlens array 6 in which lens surfaces are formed on both surfaces of a composite type configured as shown in FIG. 15 or FIG. 28, and one lens refractive surface portion side of the microlens array 6. by the facing the one side plane microlens array 6 _second lens refracting surface portion 74 side through the light shielding plate 6 _4, integrated by performing the alignment of one another in the manner described in FIGS. 17 to 21 Produced. In the case of this configuration, since each microlens 5 is composed of a lens system composed of three curved surfaces, a brighter and better imaging characteristic can be achieved.

Next, as shown in FIG. 21, two single-sided planar microlens arrays 6 ₁ , 6 ₂ are aligned, and the front lens refractive surface portion 72 and the back lens refractive surface portion 74 of each microlens 5 are aligned with high accuracy. An example in which an optical writing line head is configured using the microlens array 6 that has been formed will be described. FIG. 33 is an exploded view of the front-side single-sided planar microlens array 6 ₁ (FIG. 33 (a)) and the back-sided single-sided planar microlens array 6 ₂ (FIG. 33 (b)) constituting the microlens array 6 (FIG. 21) in this example. And a plan view showing a light emitter array (organic EL device) 1 (FIG. 33 (c)) corresponding to the microlens arrays 6 ₁ and 6 ₂ . When the optical writing line head 101 as shown in FIG. 22 is assembled using the array 1, the optical axis of each microlens 5 constituting the microlens array 6 and the center of each light emitter block 4 of the light emitter array 1 are precisely set. Must be positioned on. Therefore, positioning marks 528 and 529 are provided at positions corresponding to the positioning marks 518 + 518 ′ and 519 + 519 ′ (FIG. 21) of the microlens array 6 on the light emitting surface of the organic EL device 1 constituting the light emitter array 1.

In order to assemble the optical writing line head 101 as shown in FIG. 22 using such a microlens array 6 and the light emitter array 1, a positioning mark of the microlens array 6 is formed as shown in FIG. The positioning marks 518 and 519 of the glass substrate 71 and the marks (FIG. 21) on which the positioning marks 518 ′ and 519 ′ of the other glass substrate 73 are superimposed are accurately aligned with the positioning marks 528 and 529 of the light emitter array 1, respectively. Thus, for example, the glass substrate 71 and the light emitter array 1 are aligned using a microscope. At this time, since the light shielding member 28 interposed therebetween becomes an obstacle, a slightly larger opening 30 is provided at a position corresponding to the positioning marks 518 + 518 ′ and 519 + 519 ′ of the light shielding member 28, so that the microlens array 6 and the light emission are emitted. There is no problem even if the light shielding member 28 is interposed between the body arrays 1. In the perspective view of FIG. 34, but is shown by decomposing the front sided planar microlens array ₆₁ and the rear sided planar microlens array 6 ₂ constituting the microlens array 6, the microlens array 6 as the light emitter array when aligning a microlens array ₆₁ and the microlens array 6 ₂ is integrated (Figure 21).

FIG. 35 is a diagram showing the positional relationship between the positioning mark 528 (529) provided on the light emitting surface of the light emitter array 1 and the positioning mark 518 + 518 ′ (519 + 519 ′) of the microlens array 6 and the alignment. is there. In the microlens array 6 one of the microlens array ₆₁ of the glass substrate 71 positioned is provided in the mark 518 constituting the (519) are X-shaped surrounded by ○, a glass substrate of the other of the microlens array 6 ₂ In the case where the positioning mark 518 (519) provided in 73 is a + character surrounded by a circle, as the positioning mark 528 (529) provided on the light emitting surface of the light emitter array 1, as shown in FIG. Assuming that the intersection of the + character is an L-shaped mark that surrounds the four quadrant directions at equal intervals, the positioning mark 518 + 518 ′ (519 + 519 ′) of the microlens array 6 and the positioning mark 528 (529) of the light emitter array 1 are accurately aligned. To be able to.

  Also in this example, the positioning means (positioning marks 518, 519, 518 ′, and 519 ′) used for the lens surface positioning reference when manufacturing the microlens array 6 are used when the optical writing line head 101 is assembled. Since it is also used as a positioning means for the microlens array 6, the optical system of the optical writing line head 101 is assembled with high accuracy.

Hereinafter, one specific example when manufacturing the single-sided planar microlens arrays 6 ₁ and 6 ₂ constituting the microlens array 6 by the method shown in FIG. 16 will be described.

  As the UV curable resins 76 and 76 ′, an epoxy ultraviolet curable resin (ADEKA OPTMER KR400 manufactured by ADEKA Corporation) having a refractive index of 1.52 to 1.54 was used. This resin is generally used for a protective coating.

The UV lamp 77 has a central wavelength of 365 nm and a light irradiation amount of 80 mJ / cm ^{2. The} first UV irradiation (FIG. 16B) is 1 to 2 seconds, the second UV irradiation (FIG. 16). 16 (d)) was irradiated for 5 to 10 seconds.

As the single-sided planar microlens array 6 _1, 6 ₂ of the transparent substrate 71, 73 using, using an alkali-free glass (Nippon Electric Glass Co., Ltd. OA-10). In addition, BK7 or the like can be used. It is desirable to use the same transparent substrates 71 and 73 of the single-sided planar microlens arrays 6 ₁ and 6 ₂ and the glass substrate 20 of the organic EL device 1. The reason is that, even if there is a temperature change, the expansion coefficients of the two are equal, so that it is difficult for the microlens 5 and the light emitter block 4 to be misaligned.

And about the surface treatment of these glass substrates 71 and 73,
(1) Cleaning: Ozone cleaning, sulfuric acid cleaning, plasma treatment, etc. were performed. This is intended to improve wettability.
(2) Next, a cyan coupling agent was spin-coated. The purpose is to improve the adhesion to the resin. A cyan coupling agent (Shin-Etsu Chemical Co., Ltd. KBE-903 added to water and ethanol mixed solution (1: 1) 1% was used. It is also possible to use a resin containing a cyan coupling agent.

  As mentioned above, although the manufacturing method of the microlens array of this invention, the microlens array, the organic EL line head using the same, and the image forming apparatus have been demonstrated based on the principle and Example, this invention is limited to these Examples. Various modifications are possible.

It is a perspective view of the part corresponding to one micro lens of the line head concerning one embodiment of the present invention. It is a perspective view of the part corresponding to one micro lens of the line head concerning one embodiment of the present invention. It is a perspective view of the part corresponding to one micro lens of the line head concerning one embodiment of the present invention. It is explanatory drawing which shows the correspondence of the light-emitting body array which concerns on one Embodiment of this invention, and the micro lens with minus optical magnification. It is explanatory drawing which shows the example of the memory table of the line buffer in which image data is stored. It is explanatory drawing which shows a mode that the imaging spot by the light emitting element of an odd number and an even number is formed in the same row in the main scanning direction. It is explanatory drawing of the outline which shows the example of the light-emitting body array used as a line head. It is explanatory drawing which shows the image formation position at the time of irradiating the exposure surface of an image carrier through a micro lens with the output light of each light emitting element by the structure of FIG. FIG. 9 is an explanatory diagram illustrating a state of forming an imaging spot in the sub-scanning direction in FIG. 8. It is explanatory drawing which shows the example in which an imaging spot is reversed and formed in the main scanning direction of an image carrier when a plurality of microlenses are arranged. 1 is a schematic cross-sectional view illustrating an overall configuration of an embodiment of an image forming apparatus using an electrophotographic process according to the present invention. It is a top view of 1 Example of the organic EL apparatus used for the organic EL line head of this invention. It is an enlarged view of the peripheral part of the light emission area | region in FIG. It is sectional drawing of the organic electroluminescent apparatus in the EE line | wire in FIG. It is sectional drawing of the micro lens array produced according to the manufacturing method of this invention. It is process drawing of an example of the manufacturing method of the single-sided planar microlens array which comprises the microlens array of this invention. It is a figure for demonstrating one example of the positioning method of one single-sided planar microlens array and the other single-sided planar microlens array. It is a figure for demonstrating the other example of the positioning method of one single-sided planar microlens array and the other single-sided planar microlens array. It is a top view of the micro lens array obtained by aligning by the method of FIG. It is a figure for demonstrating another example of the positioning method of one single-sided planar microlens array and the other single-sided planar microlens array. It is a top view of the micro lens array obtained by aligning by the method of FIG. It is the perspective view which fractured | ruptured a part which shows a structure of one example of an optical writing line head. It is a top view which shows the attachment mechanism of the micro lens array to the optical writing line head of FIG. It is sectional drawing of one modification of the micro lens array by this invention. It is sectional drawing of another modification of the micro lens array by this invention. FIG. 26 is a view similar to FIG. 22 of an optical writing line head using the microlens array of the embodiment of FIG. It is sectional drawing of another modification of the micro lens array by this invention. It is sectional drawing of another modification of the micro lens array by this invention. It is process drawing of an example of the shaping | molding method of the single-sided planar microlens array of a single composition. It is sectional drawing of another modification of the micro lens array by this invention. It is sectional drawing of another modification of the micro lens array by this invention. It is sectional drawing of another modification of the micro lens array by this invention. The front side single-sided planar microlens array (a) and the backside single-sided planar microlens array (b) in the example in which the optical writing line head is configured using the microlens array positioned by the method of FIG. It is a top view of the light-emitting body array (c) corresponding to. It is a figure for demonstrating how to align between the positioning marks at the time of assembling an optical writing line head using the microlens array and light-emitting body array of FIG. It is a figure which shows the mutual positional relationship at the time of the illustration of the positioning mark provided in the light emission surface of a light-emitting body array in FIG. 34, and the positioning mark of a micro lens array, and alignment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Light emitter array (organic EL device), 2 ... Light emitting element (light emitting area), 3 ... Light emitting element row, 4 ... Light emitter block, 5 ... Micro lens, 6, 6 '... Micro lens array, 6 ₁ , 6 ₂ ... single-sided planar microlens array, 6 ₃ ... light-shielding film, 6 ₄ ... light-shielding plate, 6 ₅ , 6 ₆ ... single-sided planar microlens array, 8, 8a, 8b ... imaging spot, 10 ... memory table, 11 ... pixel Electrode (anode), 12 ... first bank, 12a ... opening, 13 ... organic EL element, 14 ... hole injection layer, 15 ... light emitting layer, 16 ... cathode, 17 ... sealing member, 20 ... glass substrate, 21 ... Semiconductor film, 22 ... second bank, 22a ... first liquid repellent area, 22b ... lyophilic area, 22c ... second liquid repellent area, 23 ... gate electrode, 25 ... common feed line, 27 ... TFT element, 28 ... Light shielding member, 29 ... through hole, 30 ... opening, 31 ... base Protective film 32 ... Gate insulating film 33 ... First interlayer insulating film 34 ... Second interlayer insulating film 35 ... Long housing 36 ... Positioning pin 37 ... Screw insertion hole 38 ... Rectangular opening for mounting 41 (photosensitive member (image carrier) or reading surface), 41 (K, C, M, Y) ... photosensitive drum (image carrier), 42 (K, C, M, Y) ... charging means (corona charging) ), 44 (K, C, M, Y) ... developing device, 45 (K, C, M, Y) ... primary transfer roller, 50 ... intermediate transfer belt, 66 ... secondary transfer roller, 70 ... glass substrate, 71, 73 ... Transparent substrate (glass substrate), 72, 74 ... Lens refractive surface portion, 75 ... Dispenser, 76, 76 '... Ultraviolet (UV) curable resin, 77 ... UV lamp, 78 ... Ultraviolet, 80 ... Gap material, 82 84, lens surface mold, 92, 94 ... curved surface mold part, 95, 97 ... Upper mold, 96 ... Lower mold, 98 ... Positioning pin, 99 ... Positioning hole, 100 ... Planar mold part, 101, 101K, 101C, 101M, 101Y ... Line head (optical writing line head), 110 ... Injection Hole 111, thermoplastic resin, 528, 529, positioning mark, 513, 514, 515, 513 ′, 514 ′, 515 ′, positioning pin, 516, 517, 516 ′, 517 ′, positioning pin, 518, 519, 518 ', 519' ... positioning mark, 523 ... biasing member, 526, 527 ... projection, 711, 731 ... one long side, 712, 732 ... one short side, 713, 733 ... first positioning part, 714, 734 ... 2nd positioning part, 821, 822, 821 ', 822' ... Positioning mark, OO '... Optical axis

Claims (17)

A method of forming a microlens array of a photocurable resin using a mold,
A photocurable resin is injected into a first mold having a mold surface corresponding to one lens surface of the microlens array, and a first transparent substrate is placed on the first mold. At that time, the first mold is provided. Positioning the first transparent substrate using the first positioning means provided,
Forming a first lens array on one surface of the first transparent substrate by irradiating light from the first transparent substrate side to cure the photocurable resin,
A photocurable resin is injected into a second mold having a mold surface corresponding to the other lens surface of the microlens array, and a second transparent substrate is placed on the second mold, and provided on the second mold. Positioning the second transparent substrate using the second positioning means provided,
Forming a second lens array on one surface of the second transparent substrate by irradiating light from the second transparent substrate side to cure the photocurable resin,
The first lens array and the second lens array are positioned relative to each other using the positioning portion of the first transparent substrate and the positioning portion of the second transparent substrate that are used for positioning at the time of molding. A method of manufacturing a microlens array, wherein the microlens array is manufactured by combining and integrating. 2. The method of manufacturing a microlens array according to claim 1, wherein the positioning portion is two orthogonal sides of the first transparent substrate and the second transparent substrate. 2. The method of manufacturing a microlens array according to claim 1, wherein the positioning portion is a mechanical mark provided around each of the first transparent substrate and the second transparent substrate. 2. The method of manufacturing a microlens array according to claim 1, wherein the positioning portion is an optical mark provided on each of the first transparent substrate and the second transparent substrate. Injecting photocurable resin into the first mold and the second mold halfway to make the photocurable resin semi-cured, and then injecting further photocurable resin thereon, Each of the first transparent substrate and the second transparent substrate is placed on the first transparent substrate, the first transparent substrate and the second transparent substrate are positioned, and the light curable resin is irradiated with light from the transparent substrate side. 5. The first lens array and the second lens array are respectively formed on one surface of the first transparent substrate and the second transparent substrate by curing. The method for producing a microlens array according to any one of the above. 6. The microlens array according to claim 5, wherein the energy for curing the photocurable resin on the first mold and the second mold is stronger in the second time. Method. A light-shielding film provided with an opening concentric with the optical axis of each lens constituting the microlens array is disposed and integrated between the first lens array and the second lens array. The method for manufacturing a microlens array according to any one of claims 1 to 6. A light-shielding plate provided with an opening concentric with the optical axis of each lens constituting the microlens array is disposed and integrated between the first lens array and the second lens array. The method for manufacturing a microlens array according to any one of claims 1 to 6. 9. The method of manufacturing a microlens array according to claim 8, wherein the first lens array, the second lens array, and at least one of the transparent substrates are integrated so as to face outward. A light emitting device in which the transparent substrate side of the first lens array or the second lens array faces outward, and a plurality of light emitting devices made of organic EL are arranged in a row on the outer transparent substrate surface 10. The method of manufacturing a microlens array according to claim 9, wherein the light emitter blocks including one or more rows are respectively arranged corresponding to the lenses constituting the microlens array. A method of forming a resinous microlens array using a mold,
Using a first mold having a mold surface corresponding to one lens surface of the microlens array, a first microlens array having a resinous surface opposite to the surface is molded.
Using a second mold having a mold surface corresponding to the other lens surface of the microlens array, a second microlens array having a flat resin surface is formed on the opposite side,
The first microlens array and the second microlens array are bonded and integrated on both sides of the transparent substrate on the plane side, and the first microlens array and the second microlens array are integrated when the bonding is performed. A microlens array is manufactured by aligning and integrating the microlenses with a microlens array using a positioning portion used for positioning in each molding. A first single-sided planar microlens array in which a curved lens refracting surface portion of a predetermined shape made of a transparent resin is integrally formed on one surface of the first transparent substrate, and transparent on one surface of the second transparent substrate A second single-sided planar microlens array in which a curved lens refracting surface portion having a predetermined shape made of resin is integrally formed is integrated so that the lens refracting surface portions are aligned with each other. Arranged in a row at a constant pitch in a predetermined direction, N similar microlens rows are arranged in a direction orthogonal thereto, and the position of the first microlens in N microlens rows is 1 / N pitch. A microlens array arranged in a shifted manner. 13. The microlens array according to claim 12, wherein mechanical marks are provided around the first transparent substrate and the second transparent substrate. The microlens array according to claim 12, wherein an optical mark is provided on the first transparent substrate and the second transparent substrate. At least on the emission side of the organic EL light emitter array in which a plurality of light emitter blocks each including one or more light emitting element rows arranged in a row in the main scanning direction are arranged at intervals in the main scanning direction. A microlens array arranged so that one positive lens is aligned with each of the light emitter blocks is arranged in parallel to the organic EL light emitter array, A first single-sided planar microlens array in which a curved lens refracting surface portion of a predetermined shape made of transparent resin is integrally formed on one surface of the transparent substrate, and one surface of the second transparent substrate made of transparent resin A microlens formed by integrating a lens refracting surface portion of a predetermined shape with a second single-sided planar microlens array formed integrally with the lens refracting surface portion. A Zuarei, said first transparent substrate and said second transparent mechanical or organic EL line head, which comprises using those optical mark is provided for a substrate for positioning. 16. The organic EL device according to claim 15, wherein the organic EL light emitter array is disposed on a plane on which the lens refracting surface portion of the first transparent substrate or the second transparent substrate is not integrally formed. Line head. Around the image carrier, at least two or more image forming stations each provided with a charging unit, an organic EL line head according to claim 15 or 16, a developing unit, and a transfer unit are provided, and transfer is performed. An image forming apparatus that forms an image in a tandem manner as a medium passes through each station.

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