JP2008030074A - Alip type flow soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that an ALIP (annular linear induction pump) type electromagnetic pump of a flow-passage reversion type causes fluctuations in soldering quality due to fine changes in the discharging force of the pump, which are caused by the large flow loss generated in the region where the flow direction of molten solder is reversed from a thrust-generation flow-passage to a reversion flow-passage. <P>SOLUTION: In the region in an electromagnetic pump where a delivery flow-passage is reversed from a thrust generating forward flow-passage 36 to a thrust generating backward flow-passage 38, there are provided a region where an external core, a moving magnetic-field generating coil, and also an internal core are not set. The provided region is formed into a pressure chamber 37 where the delivery flow velocity is abruptly made lower than those of the thrust generating forward and backward flow-passages 36, 38. A chamber body 9 equipped with a diffusion chamber 10 for abruptly lowering the discharge flow velocity is integrally provided with a discharging port 39 formed in the backward flow-passage, and blowing port bodies 16 are formed in the chamber body 9. The thrust generating forward and backward flow-passages 36, 38, the pressure chamber 37, and the diffusion chamber 10 constitutes a high-region fluctuation removing filter for absorbing the fluctuations of a short repetitive period out of the fine fluctuations in the flow velocity of the molten solder. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a flow soldering apparatus that performs soldering by supplying molten solder to a soldered portion of a printed wiring board, and particularly relates to a flow soldering apparatus that uses an induction electromagnetic pump.

  The flow soldering equipment using an induction type electromagnetic pump has extremely good reproducibility and stability of the parameters for feeding molten solder while being able to stably maintain the molten solder jet state. It has a feature that it can be mounted and a stable soldering quality can be obtained.

  Electromagnetic pumps (LEPs) that generate thrust by directly applying electromagnetic force to the medium to be delivered, which are used as pump discharge force and suction force, are roughly classified into induction types. And conduction type. In general, many inductive types that do not require energization of a medium to be fed are often used.

  The induction type electromagnetic pump is roughly classified into a flat linear type (FLIP type), an annular linear type (ALIP type) and a helical type (HIP type: helical induction pump). Each has a unique configuration.

  By the way, there exists a technique of patent document 1 as a technique of the flow soldering apparatus using an ALIP type electromagnetic pump. This technology is configured by sealing one end of an ALIP type electromagnetic pump and providing an inversion channel in the inner core, and the direction of the molten solder supplied by thrust in the thrust generation channel is sealed. Inverted at the toe and fed to the reversing flow path, the molten solder feeding direction in the thrust generating flow path is opposite to the molten solder feeding direction flowing in the reversing flow path provided in the inner core. Become a direction.

The technique disclosed in Patent Document 1 has a feature that maintenance work of the electromagnetic pump can be particularly easily performed because the ALIP type electromagnetic pump is located outside the solder tank. In addition, the volume of the solder bath can be reduced. As an example of a standard ALIP type electromagnetic pump, Patent Document 2 is a reference.
JP 2005-205479 A JP-A-5-260719

  However, in the technique of Patent Document 1, since the molten solder is supplied to the inversion flow path of the inner core after all the thrust is converted into pressure at the sealing end of the thrust pipe, the flowing direction of the molten solder is reversed. The flow loss in the sealed end region is large, and the minute fluctuation of the flow loss appears as the minute fluctuation of the discharge force of the electromagnetic pump.

  The minute fluctuation of the discharge force is much smaller than the fluctuation of the discharge force by the conventional rotary pump, but it becomes an obstacle to fully draw out the advantages of the electromagnetic pump with constant thrust. . That is, the minute fluctuations in the discharge force fluctuate the shape of the molten solder jet wave, and this fluctuation fluctuates the supply pressure of the molten solder to the printed wiring board and causes the soldering quality to fluctuate. is there.

  In recent years, it has been found that short-period fluctuations among the fine fluctuations in the ejection force cause a partial deterioration in soldering quality in one printed wiring board. Was demanded.

  Therefore, the present invention realizes an ALIP type flow soldering device that reduces flow loss and absorbs minute fluctuations in discharge force by appropriately arranging the distribution of thrust in the electromagnetic pump, etc. Another object is to form a more stable jet wave and maintain high soldering quality stably.

  The present invention is characterized in that the electromagnetic pump is configured so that thrust can be applied to the molten solder in the forward path and the return path in the ALIP type electromagnetic pump. In addition, a pressure chamber is provided at a position where the feeding direction of the molten solder is reversed, and a diffusion chamber having a large volume is provided at the discharge port of the electromagnetic pump, thereby further reducing the flow loss when feeding the molten solder and reducing the discharge force. It is characterized in that it is configured to absorb minute fluctuations.

(1) An annular linear induction pump (ALIP type) electromagnetic pump used in the present invention has a cap shape by sealing one end of its thrust pipe, and the inner core inserted inside this thrust pipe is A partition plate portion that divides the thrust pipe into two along the axial direction is provided, and the thrust pipe has a semicircular cross section and a vertical cross section formed in a “U” shape. A thrust generation flow path and a thrust generation flow path as a return path are formed. On the other hand, on the outside of the thrust pipe, an outward outer core that generates a moving magnetic field in the forward thrust generating flow path and a moving magnetic field generating coil and a return path that generates a moving magnetic field in the return thrust generating flow path The outer core and the moving magnetic field generating coil are separately provided.

  When the thrust pipe of the annular linear electromagnetic pump is provided on the tank wall of the solder tank, the outward path outer core and the moving magnetic field generating coil, the return path outer core and the moving magnetic field generating coil are The ALIP is configured so as to be provided outside the thrust pipe, while the return path formed in the thrust pipe is configured to be connected to a blowing body that forms a jet wave of molten solder. This is a mold flow soldering apparatus.

  As a result, the forward path and the return path in the electromagnetic pump are configured symmetrically, and thrust is applied to the molten solder both in the forward path and in the return path, and these thrusts are also maintained at the same value. Therefore, the shape of the molten solder feeding flow path and the thrust applied thereto are balanced in the forward path and the backward path, and the flow loss for feeding the molten solder is reduced. In other words, since the total thrust applied to the molten solder is divided into two in the forward path and the backward path and is balanced, the loss when the flow of the molten solder moves from the forward path to the backward path can be greatly reduced. Also, the flow of molten solder is stabilized.

(2) The ALIP type flow soldering apparatus of (1) is configured as follows. That is, an area where the outer core, the moving magnetic field generating coil, and the inner core are not provided is provided at a position where the flow path moves from the forward thrust generation flow path to the return thrust generation flow path. A pressure chamber is formed in which the supply flow rate is lower than the supply flow rate and the supply flow rate in the return path. Furthermore, when a chamber body provided with a diffusion chamber that rapidly decreases the discharge flow rate is connected to the discharge port serving as the outlet of the return path, the blower body that forms a jet wave of molten solder in the chamber body Is provided.

  Then, a high-frequency fluctuation removal filter that absorbs a short cycle fluctuation among fine fluctuations in the flow rate of the molten solder is formed by the thrust generation flow path of the forward path and the backward path, the pressure chamber, and the diffusion chamber. It is the constructed ALIP type flow soldering apparatus.

  As a result, the flow loss that occurs when molten solder is fed from the forward thrust generation flow path to the return thrust generation flow path is further reduced. In addition, the thrust generation flow path in the forward path and the thrust generation flow path in the return path each act as a flow inductance, and the pressure chamber of the thrust pipe and the diffusion chamber of the chamber body each act as a flow capacitance. A high-frequency fluctuation removal filter is formed, and high-frequency fluctuations among fine fluctuations in discharge force are eliminated, and a jet wave having a stable shape can be formed.

  In other words, in the ALIP type electromagnetic pump, the thrust generation flow path having a longitudinal section longer than the length in the transverse section with respect to the thrust direction acts as a flow inductance when viewed from the molten solder to be fed. The pressure chamber of the thrust pipe and the diffusion chamber of the chamber body in which the flow velocity decreases rapidly act as a flow capacitance. Therefore, the thrust generation flow path (outward path) → pressure chamber → thrust generation flow path (return path) → diffusion solder and the molten solder that is fed to filter the short cycle component of the flow velocity and pressure fluctuation, that is, the high frequency component Then, it acts as a high-frequency attenuation filter that absorbs. Therefore, high-frequency fluctuations among the fine fluctuations of the discharge force are reliably removed, and a jet wave having a stable shape can be formed.

  According to the present invention, it is possible to significantly reduce the flow loss when the feeding direction of the molten solder is reversed by balancing the thrust distribution in the electromagnetic pump by dividing it in the forward path and the backward path. The fluctuation of the flow loss is also greatly reduced, and the discharge force of the electromagnetic pump and thus the jet wave of the molten solder can be stabilized in the jet state such as its shape and wave height.

  In addition, the minute high-frequency fluctuation of the thrust of the electromagnetic pump is greatly reduced, and a more stable jet wave can be formed and high soldering quality can be stably maintained. As a result, the soldering quality of each part of the large printed wiring board becomes uniform and stable, and high soldering quality can be maintained.

  A configuration example of an ALIP type flow soldering apparatus according to the present invention will be described with reference to FIGS. FIG. 1 is a diagram for explaining the configuration of an ALIP type flow soldering apparatus, in which a solder bath portion is shown in a longitudinal section, and the configuration of a control system is shown in a block diagram. FIG. 2 is a perspective view for explaining the whole of the ALIP type flow soldering apparatus. FIG. 3 is a view showing a longitudinal section of the ALIP type electromagnetic pump shown in FIGS. 1 and 2. FIG. 4 shows an ALIP type electromagnetic pump shown in FIGS. 1, 2 and 3, a thrust pipe provided in a solder bath, an internal core inserted into the thrust pipe, and an external provided in the thrust pipe so as to be freely inserted and removed. It is a disassembled perspective view explaining the insertion / extraction relationship of the core and the coil for moving magnetic field generation.

(1) Configuration Example As shown in FIG. 1, a heater is provided in the solder tank 1 along the tank bottom and the tank wall, and the solder 5 accommodated in the solder tank 1 is heated and melted. It is comprised so that it may be kept at the temperature. The temperature of the solder is controlled by the temperature control device 8, and the temperature control device 8 refers to the temperature detection result of the temperature sensor 7, and supplies the solder 6 to the heater 6 so that the temperature of the solder becomes a predesignated temperature. It is a mechanism to control the power to be.

  On the other hand, a thrust pipe 33 of the ALIP type electromagnetic pump 30 is provided in the thrust pipe mounting hole 3 of the side wall 2 of the solder tank 1 by welding, screwing or other means through the flange portion 40, and the thrust pipe 33 is provided in the thrust pipe 33. As shown in FIG. 3 and FIG. 4, internal cores 34a and 34b each having a partition plate portion 43 that equally divides the thrust pipe into two along the axial direction are provided so as to be insertable and removable. Then, by inserting the inner cores 34a and 34b into the thrust pipe 33, a thrust is generated which becomes a forward path having a semicircular cross section and a "U" shape in the longitudinal section in the thrust pipe 33. A flow path 36 and a thrust generation flow path 38 serving as a return path are formed.

  The inner core is configured by providing a semicylindrical first inner core 34a and a second inner core 34b on a plate-shaped nonmagnetic member 42, and the partition plate portion 43 is configured by this nonmagnetic member. . As a result, as shown in FIG. 4, the partition plate 43 is formed in a shape like a blade on the side surfaces of the cylindrical inner cores 34a and 34b.

  Further, on the outside of the thrust pipe 33, the first outer core 31a for the outward path for generating the moving magnetic field in the thrust generation path 36 for the forward path, the first moving magnetic field generating coil 31b, and the thrust generation path 38 for the return path. The second outer core 32a for return path for generating the moving magnetic field and the second moving magnetic field generating coil 32b are separately provided, and are configured to be inserted as a whole as shown in FIGS. The Of course, the package of the first and second outer cores and the moving magnetic field generating coil is inserted in a freely detachable manner, and is fixed by a screw means (not shown). As shown in FIGS. 2 and 4, an air gap is provided between the first outer core 31a and the second outer core 32a, thereby increasing the magnetic resistance between the outer cores to achieve magnetic coupling. It does not occur.

  In the ALIP type electromagnetic pump disclosed in Patent Document 2, the coil is wound in a so-called outer iron type as viewed from the moving magnetic field generating coil. In the ALIP type electromagnetic pump of this embodiment, as shown in FIG. The coil is wound around a so-called inner iron type.

  The direction in which the molten solder flows from the thrust generation flow path on the first internal core 34a side, that is, the forward thrust generation flow path 36, to the thrust generation flow path on the second internal core 34b side, that is, the thrust generation flow path 38 on the return path. A pressure chamber 37 is provided in the thrust pipe at the reversing position. There is no internal core in the pressure chamber 37, and there is no external core or coil for generating a moving magnetic field outside the pressure chamber.

  Further, the length and the volume of the pressure chamber 37 is such that the average flow rate of the molten solder in the pressure chamber 37 is less than or equal to 1/2 of the flow rate of the molten solder flowing in the forward and return thrust generation flow paths 36 and 38, preferably 1. / 10 or less greatly attenuates minute fluctuations in flow loss caused by turbulence in the flow of molten solder and fine thrust fluctuations caused by harmonic excitation when power is supplied to the moving magnetic field generating coil. Can be made.

  This pressure chamber has an effect of reducing flow loss when the flow direction of the molten solder is reversed from the forward path to the backward path. That is, it is possible to reduce the energy conversion loss at the time of energy conversion with forward thrust → pressure in the pressure chamber → return discharge force and energy conversion. This is because the friction loss caused by the turbulent flow can be reduced mainly by adjusting the flow of the molten solder in the pressure chamber.

  On the other hand, as shown in FIG. 1, the suction port 35 serving as the entrance of the electromagnetic pump is opened toward the solder tank 1, and the chamber body 9 is fitted to the discharge port 39 serving as the exit of the return path of the electromagnetic pump. It is fitted in the groove 41. A diffusion chamber 10 in which the cross-sectional area with respect to the flowing direction of the molten solder is abruptly expanded is provided in the chamber body 9 at the fitted connection position, and the flow rate of the molten solder in the diffusion chamber 10 is set to be electromagnetic. The size is determined so as to be 1/10 or less of the flow rate of the molten solder in the return path of the pump. As will be described later, the pressure chamber 37 and the diffusion chamber 10 of the chamber body act as a flow capacitance, and a decrease in the flow rate of the molten solder in the diffusion chamber 10 can be obtained even if it is less than a fraction. However, by determining this to be 1/10 or less, the stability of the shape of the jet wave is particularly good, and the stability of the wave height is remarkably good, and there is no high-frequency fluctuation that can be confirmed with the naked eye.

  The chamber body 9 is fixed to the upper end edge of the solder tank 1 by a suspending portion 12 with a screw 14 and is configured to be easily attached and detached by a handle 13. That is, the handle 13 is held and the chamber body 9 is fitted to the discharge port 39 of the electromagnetic pump, and is fixed to the solder tank 1 in the fitted state. The chamber body 9 is provided with a blower body 16 for forming a jet wave, and can be fixed and released on the surface of the molten solder by a screw 21 through the sleeve 20. is there. In other words, the type of jet wave used for soldering is changed depending on the type of printed wiring board, that is, the blower body is replaced, but this replacement work can be easily performed. It is. A rectifying plate 15 for aligning the flow vector of the molten solder is provided in the chamber body 9 so as to align the jet vector according to the position of the blowing port 17.

  Next, the drive system of this ALIP type electromagnetic pump will be described.

  This ALIP type electromagnetic pump is connected to a multiphase AC power supply device 50 (for example, a VVVF type three-phase inverter power supply device), and supplies multiphase AC power to a moving magnetic field generating coil of the electromagnetic pump. However, each phase of the multiphase AC power supply device and the coil for generating the moving magnetic field are set so that the thrust direction generated in the forward path, that is, the moving direction of the moving magnetic field, and the thrust direction generated in the return path, that is, the moving direction of the moving magnetic field are reversed. Connect. In FIG. 1, in order to clarify this, the connection with the first moving magnetic field generating coil 31b for the outward path is divided into a white arrow, and the connection with the second moving magnetic field generating coil 32b for the return path is divided into a black arrow. I'm drawing.

  The multiphase AC power supply device 50 has a configuration in which the output voltage, frequency, power, etc. are arbitrarily adjusted and controlled by communication with the control device 51. The control device 51 is configured by a computer system, and includes an instruction operation unit 52 such as a keyboard and a display unit 53 such as an LCD. The operation of the multiphase AC power supply device 50 is controlled by an instruction from the instruction operation unit 52. It is the structure to control.

  Further, the temperature control device 8 is also configured to be controlled by arbitrarily adjusting control characteristics such as power supplied to the heater 6, temperature, and PID through communication with the control device 51.

  Here, the melting point of the solder varies depending on the type of solder, and a tin-lead solder (for example, 37% lead and the remainder is tin) that has been conventionally used is about 183 ° C., and a lead-free solder tin-zinc solder (for example, zinc) 9% with the balance being tin, about 199 ° C., tin-silver-copper solder (eg about 3.5% silver, about 0.7% copper, the balance being tin), about 220 ° C., and so on.

  For this reason, the soldering temperature of the printed wiring board, which is the work to be soldered, varies depending on the type of solder used, but the heat resistance temperature of the electronic components mounted on the printed wiring board is considered. The most frequently used examples are in the range of about 220 ° C to 260 ° C.

  Next, the solder tank will be described. For the solder tank 1, cast iron such as FCD-400 or FCD-500 (JIS) is used. Thereby, most of the leakage magnetic field from the electromagnetic pump can be prevented from being captured in the solder tank 1 in the thrust pipe mounting hole 3 and leaking into the solder tank 1, that is, into the solder. Most of the moving magnetic field from the outer core of the electromagnetic pump through the thrust generation flow path to the inner core returns to the outer core through the reverse route. However, a leakage magnetic field is apt to be generated at the end of the electromagnetic pump that becomes the suction port 35 and the discharge port 39, and the leakage magnetic field can be prevented from leaking into the solder.

  Stainless steel conventionally used as a member of a solder bath is a non-magnetic member, and solder is also a non-magnetic member (the magnetic permeability is about several tens or less at the maximum). On the other hand, the magnetic permeability of an iron member such as cast iron is about several thousand to 10,000. Due to the difference of 100 times or more, the leakage magnetic field is trapped in a solder bath having a small magnetic resistance. And since a solder tank is comprised by the iron member which has a magnetic permeability equivalent to or more than the magnetic permeability of the inner core of the electromagnetic pump, the leakage magnetic field can be reliably captured.

(2) Operation When electric power is supplied from the multiphase AC power supply device 50 to the ALIP type electromagnetic pump 30, a magnetic field that moves toward the pressure chamber 37 is generated in the forward thrust generation flow path 36, and the thrust generation flow path in the return path At 38, a magnetic field that moves toward the discharge port 39 is generated. Then, thrust is applied to the molten solder in the moving direction of the moving magnetic field. Therefore, the forward molten solder is given a thrust in the direction of the pressure chamber, and the molten solder sucked from the suction port 35 is fed to the pressure chamber 37 of the thrust pipe 33 through the forward thrust generation flow path 36.

  The molten solder whose flow velocity has been reduced in the pressure chamber 37 is fed to the thrust generation flow path 38 on the return path after converting the kinetic energy obtained in the forward thrust generation flow path 36 into pressure energy. The molten solder fed to the return path by the forward thrust is given thrust in the direction of the discharge port 39 in this return path and is fed to the discharge port.

  In the ALIP type electromagnetic pump in which the forward path and the backward path are configured symmetrically, the forward path and the backward path are in a balanced state in both the flow path shape and the thrust. In other words, since the total thrust applied to the molten solder is divided into two in the forward path and the backward path and is balanced, the loss when the flow of the molten solder moves from the forward path to the backward path can be greatly reduced. Moreover, the flow of the molten solder is stabilized, and the discharge force of the electromagnetic pump is also stabilized.

  Subsequently, the molten solder fed from the discharge port 39 flows to the chamber body 9, and the molten solder whose flow velocity is rapidly reduced in the diffusion chamber 10 of the chamber body 9 is blown after the flow velocity vectors are aligned by the rectifying plate 15. A jet wave 19 is formed by jetting from the blowing port 17 of the mouth body 16, and then flows down the guide plate 18 (see FIG. 2) to return to the solder bath 1.

  In the ALIP type electromagnetic pump, a thrust generation flow path having a longitudinal section longer than the length in the transverse section with respect to the thrust direction acts as a flow inductance when viewed from the molten solder to be fed, and the feed flow velocity is The pressure chamber of the thrust pipe, which decreases rapidly, and the diffusion chamber of the chamber body act as a flow capacitance. Therefore, when this is drawn with an equivalent electric circuit, it can be drawn as shown in FIG.

  That is, the thrust generation flow path 36 in the forward path and the thrust generation flow path 38 in the return path are expressed as inductance, and the pressure chamber 37 of the thrust pipe and the diffusion chamber 10 of the chamber body are expressed as capacitance. The thrust is a power source and the blower body 16 can be expressed as a load. The thrust should be expressed as a distributed constant that is uniformly distributed in the forward thrust generation flow path and the return thrust generation flow path, but in FIG. 5, this is expressed as an equivalent concentrated constant.

  The circuit shown in FIG. 5 is a low-pass filter circuit, which is a high-pass filter. A component having a short flow rate and pressure fluctuation period is absorbed by the pressure chamber 37 and the diffusion chamber 10 while being blocked by the thrust generation flow paths 36 and 38 in the forward path and the return path, and the jet body from which the high-frequency fluctuation has been removed in the blowing body 16 A wave 19 is formed. And especially the high region fluctuation of a wave height is removed.

  Components with short fluctuation cycles of flow velocity and pressure include friction in the thrust generation flow path, friction with the thrust pipe when the feed direction is reversed from the forward path to the return path, and friction between molten solder caused by disturbance of the flow of molten solder. Furthermore, it is generated due to excitation by harmonics generated in the polyphase AC power supply device. However, these high-frequency fluctuation components are greatly attenuated and absorbed by the removal filter shown by the equivalent circuit in FIG. 5, so that the molten solder having a stable flow rate can be supplied to the blowing port 17 of the blowing body 16.

  In this way, when molten solder is supplied to a printed wiring board with a jet wave from which high-frequency fluctuations have been removed, the soldered portions existing in large numbers on the printed wiring board are uniform in both a short time and a long time. Molten solder is supplied with various parameters, and uniform soldering quality can be obtained at any position (region) of the printed wiring board. That is, the same fillet-shaped soldering can be performed with the same wettability in a plurality of adjacent soldered portions.

  Thereby, the part where soldering quality falls by the position (area | region) on a printed wiring board does not change for every printed wiring board, and can maintain high soldering quality stably.

  By the way, in order to perform the cleaning operation in the solder bath, the molten solder is removed from the solder bath. This operation is usually performed from a drain valve provided at the bottom of the solder bath. On the other hand, in patent document 1, it is comprised so that a drain valve may be provided in the thrust pipe lower end part of an electromagnetic pump, and the molten solder in a solder tank may be extracted. This is because the molten solder remains in the thrust pipe of the electromagnetic pump even if the molten solder is removed from the solder bath.

  However, when a drain valve is provided at a portion where the flow direction of the molten solder is reversed as in Patent Document 1, that is, when a drain valve is provided at the lower end portion of the thrust pipe of the electromagnetic pump, the shape of the lower end portion is a step by the drain valve. Because of the discontinuous shape having the portion, there is a problem that the discharge force of the molten solder is attenuated or the discharge force is minutely changed.

  In the configuration of the flow soldering apparatus of the present invention, if the drain valve 4 provided in the solder tank 1 is opened, the molten solder in the thrust pipe 33 of the ALIP type electromagnetic pump flows out from the suction port 35 and the discharge port 39. There is no need to provide a drain valve on the thrust pipe 33. Therefore, from this point as well, the discharge force is not attenuated or the discharge force is not changed minutely as in the technique of Patent Document 1.

  Note that the molten solder in the blower body 16 and the chamber body 9 also flows out through the ALIP electromagnetic pump 30. Moreover, it can also be made to flow out by uniting them and removing from a solder tank. Furthermore, if a fine hole 11 is provided in the chamber body, it can be discharged from the hole.

  As described above, the example in which the ALIP type electromagnetic pump is provided on the side wall of the solder tank has been described as an example. However, in the present invention, the ALIP type electromagnetic pump can be provided on the bottom of the solder tank.

  The ALIP type flow soldering apparatus according to the present invention is used when electronic components are soldered and mounted on a printed wiring board. According to the present invention, when flow soldering a large printed wiring board that is remarkably adopted in a large-sized flat-screen television or the like, it becomes possible to manufacture a printed wiring board having high and uniform soldering quality at each part, and high reliability. The contribution to the electronics industry will be significant by enabling the supply of electronic devices.

The figure explaining the structure of the ALIP type | mold flow soldering apparatus of this invention The perspective view of the ALIP type flow soldering apparatus of this invention Longitudinal sectional view of ALIP type electromagnetic pump used in the present invention Exploded perspective view of ALIP type electromagnetic pump used in the present invention Equivalent circuit diagram depicting solder flow in electrical circuit

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder tank 2 Side wall 3 Thrust pipe attachment hole 4 Drain valve 5 Solder 6 Heater 7 Temperature sensor 8 Temperature control device 9 Chamber body 10 Diffusion chamber 11 Hole 12 Suspension part 13 Handle 14 Screw 15 Current plate 16 Blow hole body 17 Blow hole 18 Guide plate 19 Jet wave 20 Sleeve 21 Screw 30 ALIP type electromagnetic pump 31a First outer core 32a Second outer core 31b First moving magnetic field generating coil 32b Second moving magnetic field generating coil 33 Thrust pipe 34a First 1 internal core 34 b second internal core 35 suction port 36 forward thrust generation flow path 37 pressure chamber 38 return thrust generation flow path 39 discharge port 40 flange portion 41 chamber fitting groove 42 nonmagnetic plate 43 partition plate portion 50 Multiphase AC power supply device 51 Control device 52 Instruction operation unit 53 Display unit

Claims (2)

A flow soldering apparatus in which an annular linear (ALIP type) electromagnetic pump is provided on a tank wall of a solder tank,
In the annular linear type (ALIP type) electromagnetic pump, one end of the thrust pipe is sealed into a cap shape, and the inner core inserted inside the thrust pipe passes through the thrust pipe along the axial direction. A thrust generation flow path serving as a forward path and a thrust generation flow path serving as a return path, each having a partition plate portion divided into two and having a semicircular cross section in the thrust pipe and a vertical cross section formed in a “U” shape And an outer core for moving forward and a moving magnetic field generating coil for generating a moving magnetic field in the forward thrust generating flow path and a moving magnetic field in the thrust generating flow path of the return path are formed outside the thrust pipe. An outer core for generating a return path and a moving magnetic field generating coil are separately provided,
When the thrust pipe of the annular linear electromagnetic pump is provided on the tank wall of the solder tank, the forward outer core and the moving magnetic field generating coil, and the return outer core and the moving magnetic field generating coil are the thrust. Provided around the outside of the pipe,
A return path formed in the thrust pipe is connected to a blow body that forms a jet of molten solder;
ALIP type flow soldering equipment. In the ALIP type flow soldering apparatus according to claim 1,
An area where the outer core, the moving magnetic field generating coil and the inner core are not provided is provided at a position where the flow path moves from the thrust generation flow path serving as the forward path to the thrust generation flow path serving as the return path, and the feeding flow velocity in the forward path And a pressure chamber in which the feed flow velocity is lower than the feed flow velocity in the return path
When a chamber body having a diffusion chamber for rapidly decreasing the discharge flow rate is connected to the discharge port serving as the outlet of the return path, the chamber body is provided with a blower body that forms a jet wave of molten solder. And
Forming a high-frequency fluctuation removal filter that absorbs short fluctuations in the repetition cycle of fine fluctuations in the flow rate of the molten solder by the thrust generation flow path of the forward path and the backward path, the pressure chamber, and the diffusion chamber;
ALIP type flow soldering equipment.

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