JP2008030073A - Electromagnetic pump type flow soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electromagnetic pump type flow soldering apparatus which is easily overhauled including an electromagnetic pump and reduced in heat loss and has high energy efficiency. <P>SOLUTION: The electromagnetic pump type flow soldering apparatus comprises an annular linear electromagnetic pump 30, and a mouth casing 20 which has an opening only on an upper side opened at the position higher than a level of a molten solder in a solder tank 1, and is stored in the solder tank at the position for preventing ingress of a solder. A package of a thrust pipe 32 of the electromagnetic pump 30, an external core and a coil 31 for generating the moving magnetic field is attachably/detachably provided on the mouth casing 20 so that only a suction port 34 and a discharge port 38 appear on the surface of the mouth casing 20. The mouth casing 20 is attachable/detachable to/from the solder tank 1, and the electromagnetic pump 30 is provided in the solder tank 1 at the position below the level of the molten solder and exposed to the outside air or an inert gas atmosphere. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an electromagnetic pump type flow soldering apparatus that performs soldering by supplying molten solder to a soldered portion of a printed wiring board.

  The flow soldering equipment using an induction type electromagnetic pump has extremely good reproducibility and stability of the parameters for feeding molten solder while being able to stably maintain the molten solder jet state. It has a feature that it can be mounted and a stable soldering quality can be obtained.

  Electromagnetic pumps (LEPs) that generate thrust by directly applying electromagnetic force to the medium to be delivered, which are used as pump discharge force and suction force, are roughly classified into induction types. And conduction type. In general, an induction type that does not require energization of a medium to be fed is often used.

  The induction type electromagnetic pump is roughly divided into a flat linear type (FLIP type: flat linear induction pump), an annular type (ALIP type: annular linear induction pump), and a helical type (HIP type: helical induction pump). Each has a unique configuration.

  As an example of a standard ALIP type electromagnetic pump, Patent Document 1 is helpful. A thrust pipe (“outer duct”) is provided outside the inner core (“inner core” and its “inner duct”), and the outer core (“laminated core block”) moves outside the thrust pipe. A package with a magnetic field generating coil (“stator coil”) is provided. In addition, casings are provided outside these, and a suction port (“fluid inlet”) and a discharge port (“fluid outlet”) are open.

  As a technique of the flow soldering apparatus using the ALIP type electromagnetic pump, there is a technique of Patent Document 2. The electromagnetic pump is provided by being immersed in molten solder, and its inner core is provided so as to be freely inserted and removed.

Further, in the technique of Patent Document 3, the one end of the ALIP type electromagnetic pump is sealed and an inversion flow path is provided in the inner core, and molten solder that is supplied with thrust through the thrust generation flow path is fed. Of the molten solder flowing through the reversing flow path provided in the inner core and the feeding direction of the molten solder in the thrust generating flow path. The direction is opposite to the feeding direction. The technique disclosed in Patent Document 3 has a feature that maintenance work of the electromagnetic pump can be particularly easily performed because the ALIP type electromagnetic pump is located outside the solder tank.
JP-A-5-260719 JP 2003-205363 A JP 2005-205479 A

  In the technique of Patent Document 2 using an electromagnetic pump for a flow soldering apparatus, a thrust pipe, an external core provided outside the thrust pipe, a moving magnetic field generating coil package, and an outer casing thereof are integrally configured. . Only the inner core is configured to be insertable / removable, and the electromagnetic pump is sealed by its casing and immersed in molten solder. Therefore, when performing the overhaul of the flow soldering apparatus, only the inner core of the electromagnetic pump can be replaced, but the other parts of the electromagnetic pump cannot be replaced by overhaul.

  Further, in the technique of Patent Document 3, by manufacturing a specially shaped solder bath in which the electromagnetic pump is fitted into the bottom surface of the solder bath, heat energy due to the loss generated in the electromagnetic pump is conducted to the solder, and the flow The efficiency as a soldering apparatus can be improved. However, it is difficult to manufacture such a specially shaped solder bath, and it is not necessarily a preferable shape as a solder bath for accommodating several hundred kilograms of solder because of its strength.

  Therefore, an object of the present invention is to realize an electromagnetic pump type flow soldering apparatus that can easily perform an overhaul of a flow soldering apparatus including an electromagnetic pump and has low heat loss and high energy efficiency. Therefore, it is possible to perform soldering and mounting of a printed wiring board at high quality and at low cost by enabling stable operation and energy-saving operation.

  The present invention is characterized in that the electromagnetic pump is submerged in the molten solder to improve energy efficiency and the electromagnetic pump can be easily overhauled.

(1) An annular linear type (ALIP type) electromagnetic pump has an inner core that can be inserted and removed, and an outer core and a moving magnetic field generating coil package that can be inserted and removed outside the thrust pipe. A casing is not provided outside the package.

  On the other hand, it is a mouth casing accommodated in the solder bath, and has an opening only on the upper side thereof, and this opening opens to a position higher than the molten solder liquid level in the solder bath to prevent intrusion of solder. The thrust pipe of the electromagnetic pump, the external core, and the moving magnetic field generating coil package are detachably provided so that only the suction port and the discharge port appear on the surface of the mouth housing in the blocking housing. The housing is configured to be detachably provided in the solder bath.

  Further, a chamber body for reducing the flow rate of the molten solder and adjusting the flow of the molten solder is detachably provided at the discharge port of the electromagnetic pump, and a blow body for forming a jet wave of the molten solder is provided in the chamber body.

  The electromagnetic pump type flow soldering apparatus is configured so that the electromagnetic pump is provided in a solder bath at a position below the molten solder liquid level and exposed to the atmosphere or an inert gas atmosphere.

  As a result, heat loss generated in the electromagnetic pump is conducted to the solder through the mouth casing, so that operation with less loss is possible. In addition, the mouth casing can be easily pulled up from the solder bath, and the inner core of the electromagnetic pump, the thrust pipe, the outer core, and the coil for generating the moving magnetic field can be disassembled and removed from the mouth casing. The overhaul of the electromagnetic pump can be performed very easily.

(2) In the electromagnetic pump type flow soldering apparatus according to (1) above, an outer core and a moving magnetic field are filled by filling the mouth casing with a liquid that is electrically insulating and mediates heat conduction instead of air or an inert gas. The generator coil package is configured to be immersed in the liquid. Therefore, the electromagnetic pump is not exposed to the atmosphere or the inert gas atmosphere as in (1). In addition, since heat conduction from the electromagnetic pump to the solder is performed via the liquid, most of the heat loss generated by the electromagnetic pump can be supplied to the solder.

(3) In the electromagnetic pump type flow soldering apparatus according to (1) or (2), the electromagnetic pump provided in the mouth housing seals one end of the thrust pipe into a cap shape, and the thrust pipe An outer core and a moving magnetic field generating coil package are provided around the outside of the thrust pipe, and an inversion flow path is provided along the axis of the inner core inserted inside the thrust pipe. A reverse flow type annular linear type (R-ALIP type) electromagnetic pump in which a thrust generation flow path is formed between the inner core and a feed flow path is formed by the thrust generation flow path and the reverse flow path. The configuration is as follows.

  Thereby, a suction inlet and a discharge outlet are provided in the same side, and the freedom degree of arrangement design in a solder tank increases. Moreover, since only one thrust pipe mounting hole is required in the mouth casing, it is easy to perform mounting and maintenance work.

  According to the present invention, an overhaul of a flow soldering apparatus including an electromagnetic pump can be easily performed. Further, since heat loss generated in the electromagnetic pump can be efficiently conducted to the solder, a flow soldering apparatus with low heat loss and high energy efficiency can be realized.

  Therefore, it is possible to stably operate a flow soldering apparatus using an electromagnetic pump for a long period of time, and to perform an energy saving operation. It can be done at low cost.

  The structural example of the electromagnetic pump type flow soldering apparatus in this invention is demonstrated using FIGS. FIG. 1 is a diagram for explaining a configuration example 1 of an electromagnetic pump type flow soldering apparatus, in which a solder tank portion is shown in a longitudinal section, and a configuration of a control system is shown in a block diagram. FIG. 2 is a diagram for explaining a configuration example-2 of the electromagnetic pump type flow soldering apparatus, in which the solder tank portion is shown in a longitudinal section, and the configuration of the control system is shown in a block diagram. In the electromagnetic pump type flow soldering apparatus of FIG. 2, the configuration of the electromagnetic pump is different from that of FIG. FIG. 3 is an exploded perspective view for explaining how the electromagnetic pump is provided in the mouth housing in the configuration of FIG. FIG. 4 is an exploded perspective view illustrating the configuration of the electromagnetic pump in the configuration of FIG. Furthermore, FIG. 5 is a perspective view for explaining the entire contents of the electromagnetic pump type flow soldering apparatus in the present embodiment.

(1) Configuration example-1
As shown in FIG. 1, a heater 4 is provided in the solder bath 1 along the bath bottom and bath wall, and the solder 3 accommodated in the solder bath 1 is heated and melted to a target temperature. Configured to hold. The temperature of the solder is controlled by the temperature control device 6, and the temperature control device 6 refers to the temperature detection result of the temperature sensor 5 and supplies it to the heater 4 so that the temperature of the solder becomes a predesignated temperature. This is a mechanism for controlling the power to be generated.

  On the other hand, as shown in FIG. 1, the mouth casing 20 in which the mouth casing 21 is located on the surface of the molten solder is provided with thrust pipe mounting holes 23a and 23b through which the thrust pipe 32 penetrates as shown in FIG. There are flanges 29 in these holes. Then, the thrust pipe 32 of the ALIP type electromagnetic pump is passed through the mouth casing 20, one end is provided with a seal member 27a, and the flange portion 27 is pressed against the flange of the mouth casing by the screw means 27b to be sealed and fixed. To do. Further, the other end is interposed with a seal member 28a, and the presser 28b is pressed by the screw means 28c to be sealed and fixed. When the thrust pipe 32 is passed through the mouth housing 20, the outer core of the ALIP type electromagnetic pump and the moving magnetic field generating coil package 31 are passed through the mouth housing 20. That is, first, the outer core and the moving magnetic field generating coil package 31 are placed in the mouth case 20 as indicated by an arrow A, and then the thrust pipe 32 is passed through as indicated by an arrow B next. In FIG. 1 (FIG. 2) and FIG. 3 (FIG. 4), the outer core and the moving magnetic field generating coil are drawn together in a cylindrical shape, but a casing is provided outside the outer core and the moving magnetic field generating coil. It is not done.

  Incidentally, the sealing and fixing of the thrust pipe 32 referred to here means sealing so that molten solder does not enter the mouth casing 20 from the through hole portion of the thrust pipe provided in the mouth casing 20. Therefore, means other than sealing means such as a sealing member or screw means can be used.

  The inner core 33 provided in the thrust pipe 32 is provided with a convex portion 33a that maintains its position and secures a thrust generation flow path, and this convex portion 33a is provided on the inner wall of the thrust pipe 32. This is a mechanism for engaging and fixing the L-shaped buttocks.

  On the other hand, a convex fitting portion 22 is provided at the bottom of the mouth casing 20, and the fitting portion 22 is fitted into a concave portion of a solder tank (not shown) to determine the position, as shown in FIG. The mouth casing 20 is fixed with screws 26 at the upper edge of the solder bath. The lid body 24 fitted to the mouth housing portion 21 of the mouth housing 20 is a means for preventing foreign matter from entering from the mouth housing portion 21, and from the opening 25 provided outside the side end of the solder tank, the ALIP is provided. Electric wiring of the electromagnetic pump is performed.

  Further, as shown in FIG. 1, the chamber body 7 is inserted and fitted into the flange portion 27 of the discharge port 38 of the ALIP type electromagnetic pump 30, and the other end side is a hanging portion 9 and is attached to the upper edge of the solder tank 1 with a screw 11. The handle 10 is configured to be easily attached and detached. That is, the handle 10 is held and the chamber body 7 is fitted into the discharge port 38 of the electromagnetic pump 30 and fixed to the solder bath 1 in the fitted state.

  The chamber body 7 is provided with a blower body 15 for forming a jet wave 18 and can be fixed and released on the surface of the molten solder by a screw 13 passing through the sleeve 12. It is. That is, the type of jet wave used for soldering is changed depending on the type of printed wiring board, that is, the blower body is replaced, but consideration is given so that this replacement work can be easily performed. It is. Further, a rectifying plate 14 for aligning the flow vector of the molten solder is provided in the chamber body 7 so as to align the jet vector according to the position of the blowing port 16.

  In addition, since the shape of the outer core can be formed in a columnar shape, the ALIP type electromagnetic pump usually has a columnar appearance. In addition, the inner core is also cylindrical, and a moving magnetic field is generated in the annular space between the outer core and the inner core, that is, the flow path. Is generated.

  This ALIP type electromagnetic pump 30 is connected to a multiphase AC power supply device 40 (for example, a VVVF type three phase inverter power supply device), and the multiphase AC power is converted into an electromagnetic pump (hereinafter referred to as “ALIP type electromagnetic pump”. Is abbreviated as “.” And supplied to the magnetic field generating coil.

  In addition, this polyphase alternating current power supply device 40 is the structure by which the output voltage, frequency, electric power, etc. are arbitrarily adjusted and controlled by communication with the control apparatus 41. The control device 41 is configured by a computer system, and includes an instruction operation unit 42 such as a keyboard and a display unit 43 such as an LCD. The operation of the multiphase AC power supply device 40 is operated according to an instruction from the instruction operation unit 42. It is the structure to control.

  In addition, the temperature control device 6 that controls the temperature of the solder is also configured to be controlled by arbitrarily adjusting control characteristics such as power supplied to the heater 4, temperature, and PID through communication with the control device 41.

  Here, the melting point of the solder varies depending on the type of solder. Conventionally used tin-lead solder (for example, 37% lead and the remainder is tin) is about 183 ° C., and lead-free solder tin-zinc solder (for example, zinc) 9% with the balance being tin, about 199 ° C., tin-silver-copper solder (eg about 3.5% silver, about 0.7% copper, the balance being tin), about 220 ° C., and so on.

  For this reason, the soldering temperature of the printed wiring board, which is the work to be soldered, varies depending on the type of solder used, but the heat resistance temperature of the electronic components mounted on the printed wiring board is considered. The most frequently used examples are in the range of about 220 ° C to 260 ° C.

  Next, the operation of this electromagnetic pump type flow soldering apparatus will be described. As shown in FIG. 1, when electric power is supplied from the multiphase AC power supply device 40 to the electromagnetic pump 30, a moving magnetic field is generated in the thrust generation flow path 35, and thrust is applied to the molten solder in the moving direction of the moving magnetic field. Therefore, the molten solder is sucked from the suction port 34, and the molten solder is fed from the discharge port 38 to the chamber body 7. In the chamber body 7, the flow rate of the molten solder is rapidly reduced to form a gentle flow. Further, after the flow straightening plate 14 aligns the flow velocity vectors, the flow is jetted from the blower port 16 of the blower body 15 to form a jet wave 18. Subsequently, as shown in FIG. 5, the guide plate 17 is flowed down and returned to the solder bath.

  And since the heat loss which generate | occur | produced in the electromagnetic pump 30 is conducted to solder via the port housing | casing 20, the driving | operation with few losses is attained. From the reverse side, the electromagnetic pump is cooled by molten solder to suppress the temperature rise. If the mouth casing 20 is filled with oil having good electrical insulation and high thermal conductivity, such as silicon oil, the heat conduction from the electromagnetic pump 30 to the solder, and the cooling of the electromagnetic pump 30 viewed from the opposite side. Is performed better, and the energy efficiency of the flow soldering apparatus is further improved. Further, if the mouth casing 20 is filled with an inert gas or the oil, the moving magnetic field generating coil can be prevented from being oxidized, and its life can be extended.

  The overhaul of this electromagnetic pump type flow soldering apparatus is started by first removing the chamber body 7 and the mouth casing 20 fixed to the solder bath 1. This is also the reverse procedure of installation.

  And the blower body 15 is removed from the chamber body 7 pulled up from the inside of the solder tank 1, and the presence or absence of the erosion by the cleaning of the dross in these chamber bodies 7 and the blower body 15 or lead-free solder is inspected. Then, if necessary, parts are exchanged.

  Further, after removing the presser fixing the thrust pipe 32 from the mouth casing 20 pulled up from the inside of the solder bath, and removing the thrust pipe 32 from the mouth casing 20, the outer core and the coil 31 for generating the moving magnetic field coil 31 are removed. Remove. Then, the presence or absence of erosion by dross cleaning or lead-free solder in the thrust pipe 32 or the inner core 33 is checked. If necessary, parts are exchanged. Also, the condition of the outer core and the moving magnetic field generating coil package 31 is confirmed by conducting an oxidation investigation, an insulation test, or the like. If the mouth casing is filled with oil or the like, the oil is transferred to another container prior to these operations. Also, depending on the degree of oil deterioration, new oil is filled after overhaul.

  On the other hand, since the molten solder in the solder tank 1 can be discharged from the drain valve 2 and transferred to another container, the inside of the solder tank 1, the heater 4, the temperature sensor 5, etc. can be cleaned and inspected.

  Thus, in the electromagnetic pump type flow soldering apparatus of the present invention, it is possible to inspect and replace even one of the parts constituting the electromagnetic pump by overhaul. Of course, it is possible to overhaul the chamber body, the blower body, the solder tank, the heater and even the temperature sensor. At the same time, an electromagnetic pump type flow soldering device with high energy efficiency can be realized.

(2) Configuration example-2
Although it is an ALIP type | mold electromagnetic pump, the example using the electromagnetic pump characterized by the structure of the supply flow path of the molten solder is shown in FIG. As shown in the exploded perspective view of FIG. 4, in this ALIP type electromagnetic pump, one end of a thrust pipe is sealed in a cap shape, and an inversion channel is provided at the center of the inner core. That is, it has the same configuration as the electromagnetic pump disclosed in Patent Document 1.

  The thrust pipe 232 is sealed and fixed to the thrust pipe mounting hole 223 (with a flange) of the mouth housing 220 via a seal member. A screw means or the like can be used to fix the thrust pipe to the mouth casing as in the configuration example-1. When the thrust pipe is passed through the mouth casing, the outer core and the moving magnetic field generating coil package 231 are placed in the mouth casing 220, and then the thrust pipe 232 is passed through. In addition, 221 shown in FIG. 2 is a mouth casing part, and 222 is a fitting part.

  And since the discharge port 238 is formed in the inversion flow path 237 provided in the internal core 233, the chamber body 7 is inserted and fitted in the discharge port 238 provided in this internal core 233. Since the configuration for fixing the chamber body 7 to the solder bath and the configuration for fixing the mouth casing 220 to the solder bath are the same as in the previous configuration example-1, description thereof will be omitted.

  In the electromagnetic pump shown in FIGS. 2 and 4, a thrust generation flow path 235 is formed between the thrust pipe 232 and the internal core 233, and the molten solder sent from this flow path is a reversal flow provided in the internal core 233. It is fed to the chamber body 7 through the path 237. The ALIP type electromagnetic pump having this configuration is referred to as a flow inversion type annular linear induction pump (R-ALIP type) electromagnetic pump.

  A pressure chamber 236 is provided in the thrust pipe at a position where the flow direction of the molten solder is reversed from the thrust generation flow path 235 to the reversal flow path 237 to reduce the flow loss when the flow direction of the molten solder is reversed. I am letting.

  In this configuration example-2, when electric power is supplied from the multiphase AC power supply device 40 to the ALIP electromagnetic pump 230, a moving magnetic field is generated in the thrust generating flow path 235, and the molten solder has a thrust in the moving direction of the moving magnetic field. Given. Therefore, molten solder is sucked from the suction port 234 and is fed to the pressure chamber 236 of the thrust pipe through the thrust generation flow path 235. The molten solder whose flow velocity is reduced in the pressure chamber 236 is fed to the reverse flow path 237 after converting the kinetic energy obtained in the thrust generation flow path 235 into pressure energy. Subsequently, molten solder is fed from the outlet of the reversal channel 237, that is, the discharge port 238 to the chamber body 7, and the jet wave 18 is formed by jetting from the blower port 16 of the blower body 15.

  The overhaul of this electromagnetic pump type flow soldering apparatus is the same as that of the structural example 1, and is started by first removing the chamber body and the mouth casing fixed to the solder bath.

  Similarly, the inside of the chamber body and the blower body is inspected for the presence of erosion due to cleaning of dross and lead-free solder. Then, if necessary, parts are exchanged.

  Further, after the thrust pipe 232 is removed from the mouth casing 220, the package 231 of the outer core and the moving magnetic field generating coil is removed. And the presence or absence of erosion by dross cleaning or lead-free solder in the thrust pipe 232 or the inner core 233 is inspected. If necessary, parts are exchanged. Also, the condition of the outer core and the moving magnetic field generating coil package 231 is checked by conducting an oxidation investigation or an insulation test.

  Furthermore, if the molten solder in the solder tank 1 is discharged from the drain valve 2 and transferred to another container, the inside of the solder tank 1, the heater 4, the temperature sensor 5 and the like can be cleaned and inspected.

  In this way, even one of the parts constituting the electromagnetic pump 230 can be inspected and replaced by overhaul. Furthermore, it is possible to overhaul the chamber body 7, the blower body 15, the solder tank 1, the heater 4, and the temperature sensor 5. Moreover, an electromagnetic pump type flow soldering apparatus with high energy efficiency can be realized.

  Incidentally, a pressure chamber 236 is provided in the thrust pipe at a position where the flow direction of the molten solder is reversed from the thrust generation flow path 235 to the reversal flow path 237. However, there is no internal core in the pressure chamber 236, and the pressure chamber 236 Does not have an external core or a coil for generating a moving magnetic field. The length in the longitudinal section of the pressure chamber 236, that is, the length in the thrust direction of the electromagnetic pump, is preferably longer than the inner diameter of the thrust pipe 232. As a result, the average value of the flow rate of the molten solder in the pressure chamber 236 is more than twice as slow as the flow rate of the molten solder flowing through the thrust generation flow path 235 and the reversal flow path 237, and the flow loss of the molten solder is reduced. Because it is done. If the length in the longitudinal section of the pressure chamber 236 is configured to be shorter than the inner diameter of the thrust pipe 232, the average value of the flow velocity in the pressure chamber 236 does not become so slow, so that the effect of reducing the flow loss cannot be expected.

  Further, at the position where the chamber body 7 is inserted and fitted into the electromagnetic pump 230, there is provided a diffusion chamber 8 in which the cross-sectional area abruptly increases with reference to the flowing direction of the molten solder, and the molten solder in the diffusion chamber 8 is provided. Is determined so that the flow rate of the solder becomes 1/10 or less of the flow rate of the molten solder in the reverse flow path 237 of the electromagnetic pump. As will be described later, the pressure chamber 236 and the diffusion chamber 8 of the chamber body act as a flow capacitance, and a decrease in the flow rate of the molten solder in the diffusion chamber 8 can be obtained even if it is less than a fraction. However, by determining this to be 1/10 or less, the stability of the shape of the jet wave is particularly good, and the stability of the wave height is remarkably good, and there is no high-frequency fluctuation that can be confirmed with the naked eye.

  In the ALIP type electromagnetic pump, the thrust generation flow path and the reverse flow path whose longitudinal section is longer than the length in the transverse section based on the thrust direction acts as a flow inductance when viewed from the molten solder to be fed, The pressure chamber of the thrust pipe and the diffusion chamber of the chamber body in which the feed flow rate rapidly decreases act as a flow capacitance. Therefore, when this is drawn with an equivalent electric circuit, it can be drawn as shown in FIG.

  That is, the thrust generation flow path 235 and the reverse flow path 237 are expressed as inductance, and the pressure chamber 236 of the thrust pipe and the diffusion chamber 8 of the chamber body are expressed as capacitance. The thrust is a power source and the blower body 15 can be expressed as a load. The thrust should be expressed as a distributed constant that is uniformly distributed in the thrust generation flow path, but in FIG. 6, this is expressed as an equivalent concentrated constant.

  The circuit shown in FIG. 6 is a low-pass filter circuit, which is a high-pass filter. A component having a short fluctuation cycle of the flow velocity and pressure is absorbed by the pressure chamber and the diffusion chamber while being blocked by the thrust generation flow path and the reversal flow path, and a jet wave from which the high frequency fluctuation has been removed is formed in the blower body. And especially the high region fluctuation of a wave height is removed.

  When molten solder is supplied to a printed wiring board with a jet wave from which high-frequency fluctuations have been removed, the molten solder will be supplied to each soldered part existing on the printed wiring board in a short time with uniform parameters. Thus, uniform soldering quality can be obtained at any position (region) of the printed wiring board. That is, the same fillet-shaped soldering can be performed with the same wettability in a plurality of adjacent soldered portions.

  As a result, the portion where the soldering quality is lowered depending on the position (region) on the printed wiring board does not change for each printed wiring board, and high soldering quality can be stably maintained. .

  The electromagnetic pump type flow soldering apparatus according to the present invention is used when electronic components are soldered and mounted on a printed wiring board. The present invention can realize an electromagnetic pump type flow soldering device that can be easily overhauled and has good energy efficiency, thus realizing a long-life flow soldering device that does not produce huge industrial waste. The contribution to the electronics industry will be significant.

The figure explaining the structure of the electromagnetic pump type flow soldering apparatus of this invention The figure explaining another structure of the electromagnetic pump type flow soldering apparatus of this invention Exploded perspective view explaining attachment of electromagnetic pump to mouth housing Exploded perspective view explaining the configuration of the electromagnetic pump The perspective view explaining the whole content of the electromagnetic pump type flow soldering apparatus of this invention Equivalent circuit diagram depicting solder flow in electrical circuit

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Solder tank 2 Drain valve 3 Solder 4 Heater 5 Temperature sensor 6 Temperature control apparatus 7 Chamber body 8 Diffusion room 9 Hanging part 10 Handle 11 Screw 12 Sleeve 13 Screw 14 Current plate 15 Blow body 16 Blow hole 17 Guide plate 18 Jet Wave 20 port housing 21 port housing portion 22 fitting portion 23a thrust pipe mounting hole 23b thrust pipe mounting hole 24 lid body 25 opening 26 screw 27 flange portion 27a seal member 27b screw 28 seal portion 28a seal member 28b holding member 28c screw 29 flange Unit 30 ALIP type electromagnetic pump 31 External core and moving magnetic field generating coil 32 Thrust pipe 33 Internal core 33a Convex portion 34 Suction port 35 Thrust generating flow path 38 Discharge port 40 Multiphase AC power supply device 41 Control device 42 Instruction operation unit 43 Display Part 220 port case 221 port case 222 fitting part 223 thrust Type mounting hole 230 ALIP type electromagnetic pump 231 outside the core and moving magnetic field generating coil 232 thrust pipe 233 inner core 234 intake port 235 thrust generation channel 236 the pressure chamber 237 reversing flow path 238 discharge ports

Claims (3)

An electromagnetic pump type flow soldering apparatus equipped with an annular linear type (ALIP type) electromagnetic pump inside a solder bath,
The annular linear type (ALIP type) electromagnetic pump is configured such that an inner core thereof is detachably provided and an outer core and a moving magnetic field generating coil package are detachably provided outside the thrust pipe.
A mouth housing that is accommodated in the solder bath and has an opening only on the upper side thereof, and the opening opens to a position higher than the molten solder liquid surface in the solder bath to prevent entry of solder. The thrust pipe of the electromagnetic pump, the external core, and a moving magnetic field generating coil package are detachably provided in the housing so that only the suction port and the discharge port appear on the surface of the mouth housing. The body is detachably attached to the solder bath,
Furthermore, a chamber body for reducing the flow rate of the molten solder and adjusting the flow of the molten solder is detachably provided at the discharge port of the electromagnetic pump, and a blowing body for forming a jet wave of the molten solder in the chamber body is provided. Provided,
The electromagnetic pump is provided in a solder bath at a position below the molten solder liquid level, and exposed to the atmosphere or an inert gas atmosphere.
An electromagnetic pump type flow soldering device. 2. The electromagnetic pump type flow soldering apparatus according to claim 1, wherein the outer casing and the moving magnetic field generating coil are filled with a liquid that is electrically insulating and mediates heat conduction instead of the atmosphere or inert gas in the mouth casing. Immersing the package in the liquid,
An electromagnetic pump type flow soldering device. The electromagnetic pump provided in the mouth housing is provided with a package of an outer core and a moving magnetic field generating coil mounted outside the thrust pipe, in addition to sealing one end of the thrust pipe into a cap shape. In addition, a thrust generation flow path is formed between the thrust pipe and the inner core by providing an inversion flow path along the axis of the inner core inserted inside the thrust pipe. A reverse flow type annular linear (R-ALIP type) electromagnetic pump in which a supply flow path is formed with the reverse flow path;
The electromagnetic pump type flow soldering apparatus according to claim 1 or 2.

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