JP2008011379A - High frequency package and receiving converter - Google Patents

Abstract

In a high-frequency package, sufficient adhesion between a grounding region of a substrate and a frame can be ensured.
A high-frequency package includes a substrate having a high-frequency circuit and a casing for housing the high-frequency circuit in an internal space and shielding it from the outside. The casing includes a chassis 1 and a frame 5 that define the internal space by being combined with each other. The substrate 2 has a ground area on the surface. The frame 5 has a frame contact portion 5 a to which a projection material for contacting the substrate 2 is connected. The frame 5 presses the substrate 2 toward the chassis 1 through the projection material so that the projection material contacts the grounding region.
[Selection] Figure 1

Description

  The present invention relates to a high frequency package and a receiving converter.

  A conventional receiving converter (LNB) will be described with reference to FIGS. This receiving converter is a receiving converter for satellite broadcasting or satellite communication, and includes a horn cap 25 and a high-frequency package 20 as shown in FIG. The high frequency package 20 includes a chassis 1, a frame 3, and screws 4. FIG. 19 shows the reception converter as viewed from the side. FIG. 20 shows a cross-sectional view taken along the line XX-XX in FIG. The board | substrate 2 is a circuit board provided with a high frequency circuit. As shown in FIG. 20, inside the high-frequency package 20, the substrate 2 is placed on the chassis 1 and covered with a frame 3 made of a conductor. The frame 3 and the chassis 1 are fixed by being tightened with screws 4. That is, the substrate 2 is shielded from the outside by the chassis 1 and the frame 3.

An example of a related technique is described in JP2003-32131A (Patent Document 1).
JP 2003-32131 A

  The substrate 2 has a grounding region (also referred to as “GND region” or “ground region”) on the surface thereof. In order to complete the shield, the grounding region is preferably in close contact with the frame 3. That is, as shown by hatching in FIG. 21, it is preferable that all the regions of the frame 3 that protrude toward the substrate 2 are in contact with the grounding region of the substrate 2 evenly. However, in practice, the flatness of the grounding region of the substrate 2 and the flatness of the surface in contact with the substrate 2 on the frame 3 side are often not sufficient, and there are portions that are not in close contact. Even if the original flatness of the substrate 2 and the frame 3 is sufficient, the flatness may be deteriorated by being deformed by being tightened with the screws 4. Even in this case, a part of the region to be in close contact is not in close contact.

  Accordingly, an object of the present invention is to provide a high-frequency package and a receiving converter that can sufficiently ensure the adhesion between a grounding region of a substrate and a frame.

  In order to achieve the above object, a high-frequency package according to the present invention includes a substrate having a high-frequency circuit, and a housing for housing the high-frequency circuit in an internal space and shielding it from the outside. The chassis includes a chassis and a frame defining the internal space by being combined, the substrate has a grounding area on the surface, and the frame has a frame abutting portion to which a projection material for abutting the substrate is connected. The frame presses the substrate toward the chassis via the projection material so that the projection material contacts the grounding region.

  According to the present invention, since the projecting material easily comes into contact with the substrate, the projecting material is in close contact with the grounding region of the substrate, and sufficient adhesion between the frame and the grounding region of the substrate is ensured.

(Embodiment 1)
(Constitution)
With reference to FIGS. 1-3, the high frequency package in Embodiment 1 based on this invention is demonstrated. As shown in FIG. 1, the high-frequency package 20 i includes a substrate 2 having a high-frequency circuit, and a housing for housing the high-frequency circuit in an internal space and shielding it from the outside. The housing includes a chassis 1 and a frame 5 that define the internal space by being combined with each other. The substrate 2 has a ground area on the surface. FIG. 2 shows an enlarged view of the Z1 portion in FIG. The frame 5 has a frame contact portion 5a to which a projection material 5b for contacting the substrate 2 is connected. The frame 5 presses the substrate 2 toward the chassis 1 via the projection material 5b so that the projection material 5b contacts the grounding region. The frame contact portion 5a is formed integrally with the frame upper plate portion 5c as a part of the frame 5. Most of the frame contact portion 5a has a wall shape protruding downward from the frame upper plate portion 5c. The frame 5 is made of a conductor. The frame 5 is made of, for example, an aluminum alloy and is formed by casting, for example. The protruding material 5b is also made of a conductor.

  FIG. 3 shows a state where the frame 5 is removed and viewed from the substrate 2 side. The projecting material 5 b is widely disposed over the entire frame contact portion 5 a of the frame 5. In FIG. 3, for the convenience of explanation, the range where the protruding material 5 b exists is indicated by a dot pattern.

(Action / Effect)
In the present embodiment, the projection material 5b is provided over the entire top of the frame contact portion 5a, and the projection material 5b is easy to contact the substrate 2. Therefore, the projection material 5b is in the grounding region of the substrate 2. As a whole, the adhesion between the frame 5 and the grounding area of the substrate 2 is sufficiently secured.

  In the present embodiment, the projection material 5b is provided over the entire rib-shaped frame contact portion 5a. However, the projection material may not necessarily be the entire frame contact portion 5a. It may be provided locally only at some specific sites. For example, as shown in FIG. 4, it may be divided into a plurality of projecting members 6, and at least some of them may be arranged at substantially equal intervals on the top of the frame contact portion 5a. If this is the case, even if the frame 5 is twisted or warped by screwing in the screws 4, the protruding material 6 will continue to abut against the substrate 2 at each location, and the chassis 1 and the substrate 2 of the frame 5 will remain. It is possible to improve the adhesion to.

  FIG. 5 shows a partially enlarged perspective view of the frame contact portion 5a of FIG. Like the projection material 6 shown in FIG. 5, the projection material is preferably columnar. The protruding material may be cylindrical, or may be prismatic as shown in FIG. In FIG. 5, the entire projection material 6 has a columnar shape, but it is preferable that at least the tip of the projection material that contacts the substrate has a columnar shape even when the projection material has a more complicated shape. If this is the case, the tip of the projection material comes into contact with the substrate in a surface contact with a limited area, so that the adhesion between the frame 5 and the grounding region of the substrate 2 is sufficiently ensured as a whole.

  Or it is preferable that the projection material is hemispherical like the projection material 7 shown in FIG. In FIG. 6, the entire projection material 7 is hemispherical. However, even when the projection material has a more complicated shape, at least the tip of the projection material that contacts the substrate is preferably hemispherical. If this is the case, the tip of the projection material comes into contact with the substrate in a substantially point contact, so that the contact area is further reduced. As a result, the contact pressure can be increased, and the frame 5 and the substrate 2 Adequate contact with the grounding area is ensured.

  Alternatively, it may be a high frequency package 20j shown in FIG. FIG. 8 shows an enlarged view of the Z2 portion in FIG. As shown in FIG. 8, the projection material 8 has a conical shape. Thus, it is preferable that the projection material has a conical shape. As used herein, the “conical shape” may be a cone or a pyramid. In FIG. 7, the entire protrusion member 8 has a conical shape. However, even when the protrusion member has a more complicated shape, it is preferable that at least a tip of the protrusion member that contacts the substrate has a conical shape. If it is in this way, the tip of the projection material bites into the substrate, so that the close contact between the frame 5 and the grounding region of the substrate 2 is sufficiently ensured.

(Embodiment 2)
(Constitution)
With reference to FIG. 9 and FIG. 10, the high frequency package in Embodiment 2 based on this invention is demonstrated. As shown in FIG. 9, the high-frequency package 20 k includes a protruding member 9 at the tip of a frame contact portion 5 a that protrudes from the frame 5 in a wall shape. The structure of other parts is the same as that shown in the first embodiment. FIG. 10 shows an enlarged view of the Z3 portion in FIG. The projection material 9 is a conductive elastic body. The protruding material 9 may be a conductive cushion, for example. The protruding material 9 may be provided over the entire top of the frame contact portion 5a or may be provided locally. The protruding members 9 may be provided at equal intervals on the top of the frame contact portion 5a.

(Action / Effect)
In the present embodiment, the substrate 2 is tightly sandwiched between the chassis 1 and the frame 5 when the projecting material 9 made of a conductive elastic body is crushed.

  Alternatively, the projecting material may be a conductive elastic body and a columnar material like the projecting material 10 shown in FIG. Alternatively, the projection material may be a conductive elastic body and hemispherical like the projection material 11 shown in FIG. Alternatively, it may be a conductive elastic body and a conical shape like the projection material 12 shown in FIG. FIG. 13 shows the shape before assembly. In the case of such an elastic and cone-shaped projection material 12, the projection material 12 is crushed by being pressed against the substrate 2 at the time of assembly, as shown in FIG. 14. In these configurations, even if the flatness of either the substrate 2 or the frame 5 is not sufficient, the projecting material made of an elastic body is crushed so that the contact between the grounding region of the substrate 2 and the frame 5 is sufficient. Will be secured. Particularly in the case of a hemispherical or conical shape, the tip is easily crushed with a small force, so that a small contact area can be ensured reliably.

  In addition, the joint between the projection material and the frame contact portion 5a may be a fitting type or an adhesive type. The fitting type is as shown in FIG. 15, and here, the protruding member 13 is disposed so as to sandwich the frame contact portion 5a. The adhesion type is as shown in FIG. 16, and here, the protruding member 14 is bonded to the frame contact portion 5 a by an adhesive 21. In the case of the fitting type, there is an advantage that it can be attached without applying an adhesive, and in the case of the adhesive type, there is an advantage that it is not necessary to design a special shape in advance in the joint portion. The fact that either the fitting type or the bonding type may be used applies to any of the examples shown in the first and second embodiments.

  A receiving converter including any one of the high-frequency packages described so far is also an object of the present invention. For example, a receiving converter as shown in FIG. This reception converter is a converter for satellite broadcast reception or satellite communication reception, and includes the high-frequency package 20i described in the first embodiment. In the receiving converter having such a configuration, the adhesion between the ground region and the frame is sufficiently ensured, so that the receiving converter with a sufficiently secured shield can be obtained. Naturally, a receiving converter including the high-frequency packages 20j and 20k instead of the high-frequency package 20i is also an object of the present invention.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

It is sectional drawing of the high frequency package in Embodiment 1 based on this invention. It is an enlarged view of the Z1 part in FIG. It is a bottom view of the flame | frame contained in the high frequency package in Embodiment 1 based on this invention. It is a bottom view of the frame contained in the 1st modification of the high frequency package in Embodiment 1 based on this invention. It is the elements on larger scale of the frame contained in the 1st modification of the high frequency package in Embodiment 1 based on this invention. It is a partial expanded sectional view of the 2nd modification of the high frequency package in Embodiment 1 based on this invention. It is sectional drawing of the 3rd modification of the high frequency package in Embodiment 1 based on this invention. It is an enlarged view of the Z2 part in FIG. It is sectional drawing of the high frequency package in Embodiment 2 based on this invention. It is an enlarged view of the Z3 part in FIG. It is a partial expanded sectional view of the 1st modification of the high frequency package in Embodiment 2 based on this invention. It is a partial expanded sectional view of the 2nd modification of the high frequency package in Embodiment 2 based on this invention. It is a conceptual diagram before the assembly in a part of 3rd modification of the high frequency package in Embodiment 2 based on this invention. It is a partial expanded sectional view of the 3rd modification of the high frequency package in Embodiment 2 based on this invention. It is a partial expanded sectional view in the case of the fitting type of the high frequency package in Embodiment 1, 2 based on this invention. It is a partial expanded sectional view in the case of the adhesion type of the high frequency package in Embodiment 1, 2 based on this invention. FIG. 3 is a top view of a receiving converter according to the present invention. It is a top view of the receiving converter based on a prior art. It is a side view of the receiving converter based on a prior art. It is arrow sectional drawing regarding the XX-XX line in FIG. It is a bottom view of the frame contained in the receiving converter based on a prior art.

Explanation of symbols

  1 chassis, 2 substrate, 3, 5 frame, 4 screw, 5a frame contact portion, 5b, 6, 7, 8, 9, 10, 11, 12, 13, 14 protrusion material, 5c frame upper plate portion, 20, 20i, 20j, 20k high frequency package, 21 adhesive, 25 horn cap.

Claims (9)

A substrate with a high-frequency circuit;
A housing for accommodating the high-frequency circuit in an internal space and shielding it from the outside,
The housing includes a chassis and a frame that define the internal space in combination with each other;
The substrate has a ground area on the surface;
The frame has a frame contact portion to which a projecting material for contacting the substrate is connected,
The high-frequency package, wherein the frame presses the substrate toward the chassis via the projection material so that the projection material contacts the grounding region.   The high-frequency package according to claim 1, wherein at least a part of the projecting material is arranged at equal intervals on the top of the frame contact portion.   The high-frequency package according to claim 1, wherein the protruding material has a columnar tip in contact with the substrate.   The high-frequency package according to claim 1, wherein the protruding material has a hemispherical tip that contacts the substrate.   The high-frequency package according to claim 1, wherein the protruding material has a conical shape at a tip that contacts the substrate.   The high-frequency package according to claim 1, wherein the protruding material is a conductive elastic body.   The high-frequency package according to claim 1, wherein the projecting material is disposed so as to sandwich the frame contact portion.   The high-frequency package according to claim 1, wherein the protruding material is bonded to the frame contact portion.   A receiving converter comprising the high-frequency package according to claim 1.

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