JP2008091712A - Wiring substrate, semiconductor device using the same, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board capable of surely bringing the conductive pad of a connector and the terminal of the wiring board into contact and fixing them in the case of mounting the connector on the wiring board. <P>SOLUTION: The wiring board comprises: an insulating substrate 2; conductor wiring 3 formed on the surface of the insulating substrate 2; a first projected electrode 4 formed over an area on the insulating substrate 2 on both sides of the conductor wiring 3 crossing the longitudinal direction of the conductor wiring 3; a terminal 5 formed on the surface of the insulating substrate 2 and connected with the conductor wiring 3; and a second projected electrode 6a formed on the surface of the terminal 5. The second projected electrode 6a is provided with an opening 7a formed so as to expose the surface of the terminal 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a wiring board on which protruding electrodes are formed, a semiconductor device using the wiring board, and a method for manufacturing the same.

  In semiconductor devices, a method of face-down mounting a semiconductor element on a wiring board by a TAB (Tape Automated Bonding) method is frequently used. By this method, the protruding electrode of the wiring board and the electrode pad on the semiconductor element are bonded (for example, see Patent Document 1).

  Hereinafter, a semiconductor device having a wiring substrate on which the bump electrodes of the conventional example are formed will be described with reference to the drawings. FIG. 12 is a plan view showing a conventional wiring board. FIG. 13 is an enlarged perspective view of a part of the wiring board shown in FIG. FIG. 14 is a cross-sectional view taken along the line C-C ′ of the wiring board 21 shown in FIGS. 12 and 13.

  In the wiring board 21, conductor wiring 23 is formed on the surface of the insulating base material 22. The insulating base material 22 is a flexible tape made of polyimide or the like having a thickness of about 40 μm to 80 μm. The first protruding electrode 24 is formed at the tip of the conductor wiring 23, and is formed across the region on the insulating base 22 on both sides of the conductor wiring 23 across the longitudinal direction of the conductor wiring 23. The terminal 25 is connected to the conductor wiring 23 and formed wider than the conductor wiring 23.

  The conductor wiring 23 and the terminal 25 on the insulating base material 22 are formed by patterning a Cu foil having a thickness of about 9 μm to 25 μm by wet etching. The second protruding electrode 26 is formed on the surface of the terminal 25 and is formed over a region on the insulating base 22 on both sides of the terminal 25. The first protruding electrode 24 and the second protruding electrode 26 are formed to have a thickness of about 5 to 15 μm by electrolytic Cu plating. The surfaces of the conductor wiring 23, the first protruding electrode 24, and the second protruding electrode 26 are coated with electrolytic Au plating, electrolytic Ni / Au plating (after Ni plating, further Au plating), or electroless Sn plating. ing.

  FIG. 15 is a plan view of a semiconductor device in which the semiconductor element 27 is flip-chip mounted on the wiring board 21 shown in FIG. 16 is a cross-sectional view taken along the line D-D ′ of the semiconductor device shown in FIG. 15.

  The semiconductor element 27 has an element electrode 28. The electrode pad 29 is formed on the element electrode 28 and joins the first protruding electrode 24 and the element electrode 28 of the wiring substrate 21. The element electrode 28 is formed by Al, and the electrode pad 29 is formed by electrolytic Au plating, electroless Ni / Au plating, or the like. The sealing resin 30 seals and fixes the connection region between the semiconductor element 27 and the wiring substrate 21.

The connector 31 has a conductive pad 32 and a housing 33 and is electrically connected to the terminal 25. The conductive pad 32 is disposed at a position in contact with the terminal 25 of the wiring board 21. The protrusion 34 of the conductive pad 32 is in contact with the surface of the second protrusion electrode 26.
JP 2005-252227 A

  In the conventional wiring board or the semiconductor device using the wiring board, the surface of the second protruding electrode 26 is flat. For this reason, when the connector 31 is mounted on the wiring board 21, there is little friction between the protrusion 34 of the conductive pad 32 and the second protruding electrode 26, the connector 31 and the wiring board 21 are easily detached, and the contact is uncertain. There is a problem of becoming.

  The present invention solves the above-described conventional problems, and provides a wiring board capable of securely contacting and fixing the conductive pads of the connector and the terminals of the wiring board when the connector is mounted on the wiring board. Objective.

  The wiring board of the present invention includes an insulating base material, conductor wiring formed on the surface of the insulating base material, and the insulating base material on both sides of the conductor wiring across the longitudinal direction of the conductor wiring. A first protruding electrode formed over a region, a terminal formed on the surface of the insulating base material and connected to the conductor wiring, and a second protruding electrode formed on the surface of the terminal. . In order to solve the above-mentioned problem, the second protruding electrode is provided with an opening formed so that the surface of the terminal is exposed.

  The method for manufacturing a wiring board according to the present invention includes a step of preparing an insulating base material having conductor wiring and terminals formed on the surface, and a photosensitive resist is formed on the surface of the insulating base material on which the conductor wiring is formed. A step of exposing and developing the photosensitive resist, patterning a resist opening that exposes a portion of the conductor wiring and terminals that form the first protruding electrode and the second protruding electrode, and electroplating The conductor wire exposed by the resist opening extends across the longitudinal direction of the conductor wire over the region on the insulating base on both sides of the conductor wire, and the first protruding electrode and the second conductor wire. Forming a protruding electrode. In order to solve the above-described problem, in the step of patterning the resist opening, the resist opening is patterned by leaving the resist in a part of the portion where the second protruding electrode is formed, and the second In the step of forming the protruding electrode, an opening for exposing the surface of the terminal portion is provided in a portion of the second protruding electrode where the resist is left.

  According to the present invention, by providing an opening in a terminal, it is possible to provide a wiring board capable of securely contacting and fixing the conductive pads of the connector and the terminals of the wiring board when the connector is mounted on the wiring board. it can.

  In the wiring board of the present invention, the second protruding electrode may be formed over a region on the insulating base on both sides of the terminal.

  The width of the second protruding electrode may be narrower than the width of the terminal, and the second protruding electrode may be formed so as not to protrude from the terminal. With this configuration, the distance between the terminals can be increased, and the insulation can be improved.

  Further, the second protruding electrode and the terminal may be formed of the same material.

  The terminal and the second protruding electrode may be covered with a first conductive layer made of one or more materials different from the terminal and the second protruding electrode.

  According to another aspect of the present invention, there is provided a semiconductor device including the wiring board described above and a semiconductor element mounted on the wiring board, and an element electrode of the semiconductor element and a first protruding electrode formed on the wiring board. And can be electrically connected.

  Moreover, it can also be set as the structure provided with the 2nd conductive layer comprised from the one or more material different from the said element electrode on the surface of the said element electrode.

  The connector further includes a connector having a conductive pad arranged corresponding to the terminal and a housing for holding the conductive pad, the conductive pad having a protrusion formed corresponding to the position of the terminal. The opening formed in the second protruding electrode of the terminal may be fitted into the protruding portion formed in the conductive pad.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view showing a wiring board according to Embodiment 1 of the present invention. FIG. 2 is an enlarged perspective view of a part of the wiring board shown in FIG. FIG. 3 is a cross-sectional view showing a cross-sectional configuration along AA ′ of the wiring board shown in FIGS. 1 and 2.

  In the wiring board 1 a, a plurality of conductor wirings 3 are formed on the surface of the insulating base 2. The insulating substrate 2 is a flexible tape made of polyimide having a thickness of about 40 μm to 80 μm. The insulating base material 2 is formed with a convex portion 2a. The first protruding electrode 4 is formed at the tip of the conductor wiring 3, and is formed across the region on the insulating base 2 on both sides of the conductor wiring 3 across the longitudinal direction of the conductor wiring 3. The terminal 5 is formed on the convex portion 2 a of the insulating substrate 2. The terminal 5 is connected to the conductor wiring 3 and is formed wider than the conductor wiring 3. The conductor wiring 3 and the terminal 5 on the insulating substrate 2 are patterned by wet etching a Cu foil having a thickness of about 9 μm to 25 μm.

  The second protruding electrode 6 a is formed on the surface of the terminal 5 and is formed over a region on the insulating base 2 on both sides of the terminal 5. The first protruding electrode 4 and the second protruding electrode 6a are formed to have a thickness of about 5 to 15 μm by electrolytic Cu plating. Conductive layers (first conductive layers) formed on the surfaces of the conductor wiring 3, the first protruding electrode 4, and the second protruding electrode 6a by electrolytic Au plating, electrolytic Ni / Au plating, electroless Sn plating, or the like. It is covered with. An opening 7 a is formed in the second protruding electrode 6 a so as to expose the surface of the terminal 5.

  FIG. 4 is a cross-sectional view showing a cross-sectional configuration of a semiconductor device in which the semiconductor element 8 is flip-chip mounted on the wiring board 1a in this embodiment. FIG. 5 is a plan view of the semiconductor device shown in FIG. 4 and shows a state before the connector 12 is attached to the wiring board 1a. The semiconductor element 8 has an element electrode 9. The electrode pad 10 is formed on the element electrode 9 and connects the first protruding electrode 4 and the element electrode 9 of the wiring board 1a. The element electrode 9 is formed using Al, and the electrode pad 10 is covered with a conductive layer (second conductive layer) formed by electrolytic Au plating, electroless Ni / Au plating, or the like. The sealing resin 11 fixes the semiconductor element 8 and the wiring board 1a.

  FIG. 6 is a plan view showing a configuration in which the connector 13 of the semiconductor device shown in FIG. 5 is mounted. FIG. 7 is a cross-sectional view showing a configuration of the B-B ′ cross section of the semiconductor device shown in FIG. 6. The connector 12 includes a conductive pad 13 and a housing 14, and the convex portion 2 a of the insulating base material 2 is inserted. The housing 14 is made of resin. The conductive pad 13 is fitted in the housing 14 and is disposed at a position in contact with the terminal 5 of the wiring board 1a. The protrusion 15 of the conductive pad 13 is fitted with the opening 7a of the second protrusion electrode 6a.

  As described above, in the wiring board 1a according to the embodiment of the present invention, the opening 7a formed in the second protruding electrode 6a and the protruding portion 15 formed in the conductive pad 13 of the connector 12 are fitted. To do. For this reason, when the connector 12 is attached to the wiring board 1a, the conductive pads 13 of the connector 12 and the terminals 5 of the wiring board 1a can be reliably brought into contact and fixed.

  Next, a method for manufacturing a semiconductor device having the wiring board 1a according to the present embodiment will be described with reference to the drawings. 1, 6, and 8 </ b> A to 8 </ b> F are process diagrams illustrating a manufacturing process of a semiconductor device.

  First, a Cu foil is formed on the insulating base material 2, and the Cu foil is wet-etched to form the conductor wiring 3, the terminal 5, and the feeder line 16 as shown in FIG. 8A. Next, as shown in FIG. 8B, a negative resist film 17 is affixed to the entire surface on the insulating base material 2 on which the conductor wiring 3, the terminal 5, and the feeder line 16 are formed. Next, as shown in FIG. 8C, a mask pattern 18a for shielding light is disposed on the negative resist film 17, and exposure development is performed. The negative resist film 17 is formed so that the position corresponding to the opening 7a shown in FIG. 1 is exposed. Next, as shown in FIG. 8D, the unexposed negative film 17 is removed by the mask pattern 18a, and a resist opening 19 is formed.

  Next, as shown in FIG. 8E, the wiring substrate on which the resist opening 19 is formed is placed in a solution containing Cu ions, and a voltage is applied to the power supply line 16. When a voltage is applied to the power supply line 16, a current flows through the conductor wiring 3 and the terminal 5, and the conductor wiring 3 and the terminal 5 exposed from the resist opening 19 of the negative resist film 17 are electrolytically plated with Cu. And the 2nd protruding electrode 6a is formed. The shape of the opening 7a can be formed in an arbitrary shape by the mask pattern 18a.

  Next, as shown in FIG. 8F, the negative resist film 17 is peeled off, and the wiring board 1a is placed in a solution containing Ni or Au ions. Next, a voltage is applied to the feeder line 16 to cover the surfaces of the conductor wiring 3, the first protruding electrode 4, the terminal 5, and the second protruding electrode 6 a with Ni or Au. Next, as shown in FIG. 1, unnecessary portions of the insulating base material 2 such as the power supply line 16 are cut and removed so that the position where the second protruding electrode 6a is formed becomes the convex portion 2a. The wiring board 1a can be manufactured through the above steps.

  Next, as shown in FIG. 6, the semiconductor element 8 is mounted on the wiring board 1a by connecting the first protruding electrode 4 and the element electrode 9 to each other. Then, the semiconductor element 8 and the wiring board 1a are fixed with a sealing resin. Next, the connector 12 is inserted into the convex portion 2a of the wiring board 1a to manufacture the semiconductor device.

  As described above, in the wiring board 1a according to the embodiment of the present invention, the opening 7a formed in the second protruding electrode 6a and the protruding portion 15 formed in the conductive pad 13 of the connector 12 are fitted. To do. For this reason, when the connector 12 is attached to the wiring board 1a, the conductive pads 13 of the connector 12 and the terminals 5 of the wiring board 1a can be reliably brought into contact and fixed.

  Further, in the manufacturing process, the first protruding electrode 4 is formed on the conductor wiring 3 by electrolytic plating, and at the same time, the second protruding electrode 6a having the opening 7a is formed on the terminal 5, so that no additional process is required. The wiring board 1a can be formed.

(Embodiment 2)
FIG. 9 is a perspective view showing a configuration example of a wiring board according to Embodiment 2 of the present invention. The wiring board 1b according to the second embodiment is the same as the wiring board 1a according to the first embodiment except that the shape of the second protruding electrode 6b is different. In the wiring board 1b according to the second embodiment, the same components as those of the wiring board 1a according to the first embodiment are denoted by the same reference numerals, and description thereof will not be repeated.

  The second protruding electrode 6 b is formed on the terminal 5 so that the width is narrower than the width of the terminal 5. A method for manufacturing the wiring board 1b will be briefly described. FIG. 10 is a plan view showing the configuration of the terminal 5 of the wiring board 1b during the manufacturing process. In the manufacturing method of the second protruding electrode 6b, the mask pattern 18b shown in FIG. 10 is replaced with the terminal 5 in place of the mask pattern 18a formed in the step shown in FIG. 8C. Place on top. The mask pattern 18 b is formed to be narrower than the terminal 5. Note that the mask pattern in the region where the first protruding electrode 4 is formed is the same as the mask pattern 18a shown in FIG. 8C. Steps other than the step shown in FIG. 8C are the same as the manufacturing steps of the first embodiment.

  As described above, according to the present embodiment, since the second protruding electrode 6b is not formed on the side surface of the terminal 5, the interval between the adjacent terminals 5 is widened, and the insulation of the terminal 5 is improved.

  Further, in the manufacturing process, only the shape of the mask pattern in the manufacturing process in the first embodiment is changed, and the wiring board 1b can be formed without adding a new process.

  In the first or second embodiment, an example is shown in which the shape of the opening 7a provided in the second protruding electrodes 6a and 6b is circular as shown in FIGS. However, the shape of the opening 7a is not limited to a circle, and may be any shape as long as a step is provided on the second protruding electrodes 6a and 6b and can be fitted to the protruding portion 15 formed on the conductive pad 13 of the connector 12. In addition to a circle, a rectangle, a triangle, or the like may be used.

  In addition, as shown in FIG. 11, the opening 7c may be formed by dividing the second protruding electrode 6c of the wiring board 1c.

  The wiring board of the present invention has an effect that the connector and the terminal can be reliably connected and fixed when the connector is mounted, and can be used as a semiconductor device.

The top view which shows the wiring board which concerns on Embodiment 1 of this invention Enlarged perspective view showing the wiring board Sectional view showing the wiring board Sectional drawing which shows the semiconductor device which concerns on Embodiment 1 of this invention. The top view which shows a semiconductor device same as the above The top view which shows a semiconductor device same as the above Sectional view showing the semiconductor device The top view which shows the manufacturing process of the wiring board which concerns on Embodiment 1 of this invention Plan view showing the next step of FIG. 8A Plan view showing the next step of FIG. 8B Plan view showing the next step of FIG. 8C Plan view showing the next step of FIG. 8D Plan view showing the next step of FIG. 8E The perspective view which shows the wiring board which concerns on Embodiment 2 of this invention. Plan view showing the manufacturing process of the wiring board The perspective view which shows the modification of a wiring board same as the above Plan view showing a conventional wiring board The perspective view which shows a wiring board same as the above Sectional view showing the wiring board Plan view showing a semiconductor device using a conventional wiring board Sectional view of the semiconductor device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a, 1b, 1c Wiring board 2 Insulating base material 2a Convex part 3 Conductor wiring 4 1st protrusion electrode 5 Terminal 6a, 6b, 6c 2nd protrusion electrode 7a, 7b Opening part 8 Semiconductor element 9 Element electrode 10 Electrode pad DESCRIPTION OF SYMBOLS 11 Sealing resin 12 Connector 13 Conductive pad 14 Housing 15 Protrusion 16 Feed line 17 Negative resist film 18a, 18b Mask pattern 19 Resist opening

Claims (9)

An insulating substrate;
Conductor wiring formed on the surface of the insulating substrate;
A first protruding electrode formed across a region on the insulating substrate on both sides of the conductor wiring across the longitudinal direction of the conductor wiring;
A terminal formed on the surface of the insulating substrate and connected to the conductor wiring;
In a wiring board provided with a second protruding electrode formed on the surface of the terminal,
A wiring board comprising an opening formed in the second protruding electrode so as to expose a surface of the terminal.   The wiring board according to claim 1, wherein the second protruding electrode is formed over a region on the insulating base on both sides of the terminal. The width of the second protruding electrode is narrower than the width of the terminal,
The wiring board according to claim 1, wherein the second protruding electrode is formed so as not to protrude from the terminal.   The wiring board according to claim 1, wherein the second protruding electrode and the terminal are formed of the same material.   The said terminal and the said 2nd protruding electrode were coat | covered with the 1st conductive layer comprised from the 1 or more material different from the said terminal and the said 2nd protruding electrode. Wiring board as described in. The wiring board according to any one of claims 1 to 5,
A semiconductor element mounted on the wiring board;
A semiconductor device in which an element electrode of the semiconductor element and a first protruding electrode formed on the wiring substrate are electrically connected.   The semiconductor device according to claim 6, further comprising a second conductive layer made of at least one material different from the element electrode on a surface of the element electrode. Conductive pads arranged corresponding to the terminals;
A connector having a housing for holding the conductive pad;
The conductive pad has a protrusion formed corresponding to the position of the terminal,
8. The semiconductor device according to claim 6, wherein the opening formed in the second protruding electrode of the terminal is fitted into the protruding portion formed in the conductive pad. Preparing an insulating base material having conductor wiring and terminals formed on the surface;
Forming a photosensitive resist on the surface on which the conductor wiring of the insulating substrate is formed;
Patterning a resist opening that exposes and develops the photosensitive resist and exposes portions of the conductor wiring and terminals that form the first protruding electrode and the second protruding electrode; and
By electroplating, the conductor wiring exposed by the resist opening crosses the longitudinal direction of the conductor wiring and spans the regions on the insulating base on both sides of the conductor wiring, and the first protruding electrode and the In a method for manufacturing a wiring board having a step of forming a second protruding electrode,
In the step of patterning the resist opening, the resist opening is patterned by leaving a resist in a part of a portion where the second protruding electrode is formed,
Manufacturing of a wiring board, wherein an opening for exposing the surface of the terminal portion is provided in a portion of the second protruding electrode where the resist is left by the step of forming the second protruding electrode. Method.

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