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JP2008074675A - Method of producing die for forming optical element, and method for production of optical element - Google Patents

Method of producing die for forming optical element, and method for production of optical element Download PDF

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JP2008074675A
JP2008074675A JP2006256700A JP2006256700A JP2008074675A JP 2008074675 A JP2008074675 A JP 2008074675A JP 2006256700 A JP2006256700 A JP 2006256700A JP 2006256700 A JP2006256700 A JP 2006256700A JP 2008074675 A JP2008074675 A JP 2008074675A
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molding
optical element
molding die
die
mold part
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Shunji Chiaki
俊司 千明
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Olympus Corp
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Olympus Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a forming die production method which enables lead time reduction and cost saving in the production of a forming die material, the response to enhancement of the forming surface accuracy as a forming die, the securement of the comprehensive accuracy of the forming die and also enables to quickly, inexpensively provide a high-quality, high-performance optical element. <P>SOLUTION: The forming die 1 for an optical element is composed by firmly fixing the edge of a cylindrical reference form part 2 to that of a cylindrical forming die part 3 having a larger diameter than the reference form part 2 to integrate both parts 2 and 3. The forming die 1 for the optical element is installed to the major axis of a processing machine using the side of the reference form part 2 being a reference face as an opposition, and is subjected to centering adjustment concentrically with the major axis. Then, the diameter of the forming die part 3 is made to be equal to that of the reference form part 2 by processing the forming die part 3 using a grinding wheel 18, and thereafter, the forming face of the forming die part 3 is processed into a desired shape. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、成形技術に関し、レンズ等の光学素子を成形する光学素子成形用型の製造方法および光学素子の製造方法に関する。   The present invention relates to a molding technique, and relates to a method for manufacturing an optical element molding die for molding an optical element such as a lens and a method for manufacturing an optical element.

レンズ等の光学素子を得るために、ガラス若しくはプラスチックである光学素子の成形材料を一対の光学素子成形用型間に配置し、これを熱間にて成形(押圧成形若しくは射出成形)する手法が広く行われている。   In order to obtain an optical element such as a lens, there is a method in which a molding material for an optical element made of glass or plastic is placed between a pair of optical element molding dies, and this is molded hot (press molding or injection molding). Widely done.

このような成形で用いられる成形用型を作成する手法としては、例えば、超硬合金、セラミックス、あるいはSUS材に無電解ニッケルメッキを施したものを超精密旋盤で研削・切削し研磨して加工する手法、成形型が所望形状に得られるようにした成形母型を製作し、この成形母型によりガラス材料を押圧成形して得られたガラス成形用型を用いる手法、などがある。   As a method of creating a molding die used in such molding, for example, cemented carbide, ceramics, or SUS material with electroless nickel plating is ground, cut and polished with an ultra-precision lathe. And a method of using a glass molding die obtained by pressing a glass material with the molding mother mold by producing a molding die in which a molding die is obtained in a desired shape.

このような手法に関し、例えば特許文献1には、ガラス材料に型成形面を転写させる工程では胴型との摺動外形は規制しないように成形するガラス成形用型の製造方法が開示されている。特許文献1には、このようにすることで、型成形面が先に成形されたガラス成形型基材を得ることができるので、型成形面を基準として芯取り加工をすることでガラス成形用型としてのトータル精度が向上し、品質の安定化が図れると開示されている。
特開2005−97009号公報
With regard to such a technique, for example, Patent Document 1 discloses a method for manufacturing a glass molding die that performs molding so that a sliding outer shape with a body die is not regulated in a step of transferring a molding surface to a glass material. . According to Patent Document 1, a glass molding die base having a molding surface previously molded can be obtained in this manner, and therefore, for glass molding by performing a centering process on the basis of the molding surface. It is disclosed that total accuracy as a mold is improved and quality can be stabilized.
JP 2005-97009 A

しかしながら、成形用型の製造方法についての上述した従来技術には次のような問題がある。
まず、超硬合金、セラミックス、あるいはSUS材に無電解ニッケルメッキを施したものを超精密旋盤で研削・切削し研磨して加工する手法では、成形面の精度、成形面と型基準部との位置精度(偏芯精度)、成形面に直交する胴型との摺動部等の型として総合精度は満足できるものであるが、成形型素材の製作リードタイムが長く、またコストも高いものとなってしまっている。
However, there are the following problems in the above-described prior art regarding the manufacturing method of the mold.
First, in the technique of grinding, cutting and polishing cemented carbide, ceramics, or SUS material with electroless nickel plating using an ultra-precision lathe, the accuracy of the molding surface, the molding surface and the mold reference part Position accuracy (eccentricity accuracy) and overall accuracy are satisfactory as a mold such as a sliding part with a barrel mold orthogonal to the molding surface, but the production lead time of the molding material is long and the cost is high. It has become.

また、上掲した特許文献1に開示されている手法は、母型の転写による成形面の確保であるため、高い精度が要求される成形用型としての精度確保が十分でない。つまり、仮に高い精度に対応する場合でも、母型の加工を超高精度で行う必要があり、その精度確保は困難である。また、成形型はガラス一体であるため、特に型可動側での摺動面のカケや摩耗が生じやすく、ガラス型基準面と成形面との位置精度(偏芯精度)の十分な確保が難しい。   In addition, since the technique disclosed in Patent Document 1 described above is to secure a molding surface by transferring a mother die, it is not sufficient to ensure accuracy as a molding die that requires high accuracy. That is, even if high accuracy is supported, it is necessary to process the master die with ultra-high accuracy, and it is difficult to ensure the accuracy. In addition, since the molding die is made of glass, the sliding surface on the movable side of the die is likely to chip and wear, and it is difficult to ensure sufficient positional accuracy (eccentricity accuracy) between the glass die reference surface and the molding surface. .

本発明は上述した問題に鑑みてなされたものであり、その解決しようとする課題は、成形型素材の製造リードタイム及びコストを抑えて、更には、成形用型としての成形面精度の高精度化への対応と併せ成形型の総合的な精度確保が可能な成形用型の製造方法を提供して、高品質・高性能の光学素子を素早く廉価に提供できるようにすることである。   The present invention has been made in view of the above-mentioned problems, and the problem to be solved is to suppress the production lead time and cost of the molding die material, and further to high accuracy of the molding surface as a molding die. It is to provide a manufacturing method of a molding die that can ensure the overall accuracy of the molding die and to provide high-quality and high-performance optical elements quickly and inexpensively.

本発明の態様のひとつである光学素子成形用型の製造方法は、光学素子の成形時における基準面を有する基準型部と、前記光学素子を成形する成形面を有する成形用型部と、を一体的に構成する光学素子成形用型の製造にあたり、前記基準型部よりも外径が大きい前記成形用型部の一端面と前記基準型部の端面とを一体化する工程と、前記基準型部の基準面を衝として加工機の主軸に取り付け、前記成形用型部を前記加工機で加工することにより、前記基準型部の中心軸と前記成形用型部の中心軸とを一致させる工程と、前記成形用型部の他端面に前記成形面を加工する工程と、を有することを特微とするものであり、この特徴によって前述した課題を解決する。   According to another aspect of the present invention, there is provided a method for manufacturing an optical element molding die, comprising: a reference mold part having a reference surface when molding an optical element; and a molding mold part having a molding surface for molding the optical element. In manufacturing an optical element molding die that is integrally formed, a step of integrating one end surface of the molding die portion having an outer diameter larger than the reference die portion and an end surface of the reference die portion; and the reference die A process of attaching the center axis of the reference mold part to the center axis of the molding die part by attaching the molding die part to the spindle of the processing machine using the reference surface of the part as a counter and processing the molding die part with the processing machine. And a step of processing the molding surface on the other end surface of the molding die, and this feature solves the above-described problems.

なお、上述した本発明に係る光学素子成形用型の製造方法において、前記基準型部と前記成形用型部は円柱形状であってもよい。
また、前述した本発明に係る光学素子成形用型の製造方法において、前記基準型部は耐熱性を有した金属、超硬またはセラミックスからなり、前記成形用型部は前記基準型部と線膨張係数がほぼ等しいガラスからなっていてもよい。
In the above-described method for manufacturing an optical element molding die according to the present invention, the reference mold part and the molding mold part may be cylindrical.
In the method for manufacturing an optical element molding die according to the present invention described above, the reference mold part is made of a metal, carbide or ceramic having heat resistance, and the molding mold part is linearly expanded with the reference mold part. You may consist of glass with a substantially equal coefficient.

また、前述した本発明に係る光学素子成形用型の製造方法において、前記成形用型部と前記基準型部とを一体化する工程は、加熱した融着接合部材を成形用型部の端面と前記基準型部の端面とで押圧して固着するようにしてもよい。   In the above-described method for manufacturing an optical element molding die according to the present invention, the step of integrating the molding die portion and the reference die portion may be performed by using a heated fusion bonding member as an end face of the molding die portion. You may make it fix by pressing with the end surface of the said reference | standard type | mold part.

また、前述した本発明に係る光学素子成形用型の製造方法において、前記成形用型部と前記基準型部とを一体化する工程は、前記成形用型部の端面と前記基準型部の端面とを接着剤で接着して固着するようにしてもよい。   In the method for manufacturing an optical element molding die according to the present invention described above, the step of integrating the molding die portion and the reference die portion includes the end surface of the molding die portion and the end surface of the reference die portion. And may be fixed with an adhesive.

また、前述した本発明に係る光学素子成形用型の製造方法において、前記成形用型部を前記加工機で加工する工程は、前記成形用型部の外径を前記基準型部の外径以下とするようにしてもよい。   In the method for manufacturing an optical element molding die according to the present invention described above, the step of processing the molding die portion with the processing machine may be performed such that the outer diameter of the molding die portion is equal to or smaller than the outer diameter of the reference die portion. You may make it.

また、前述した本発明に係る光学素子成形用型の製造方法において、前記成形用型部と前記基準型部とを一体化する前に、前記成形用型部の他端面を前記光学素子に対応した形状に近似した球面形状に予め加工しておくようにしてもよい。

なお、前述した本発明に係る光学素子成形用型の製造方法を使用して製造された一対の光学素子成形用型の間に、成形材料を配置し、これを熱間にて成形して光学素子を得ることを特徴とする光学素子の製造方法も、本発明に係るものである。
Further, in the method for manufacturing an optical element molding die according to the present invention described above, the other end surface of the molding mold portion corresponds to the optical element before the molding die portion and the reference mold portion are integrated. You may make it process beforehand in the spherical shape approximated to the shape which carried out.

In addition, a molding material is arranged between a pair of optical element molding dies manufactured using the method for manufacturing an optical element molding dies according to the present invention described above, and this is molded by hot molding. An optical element manufacturing method characterized by obtaining the element also relates to the present invention.

本発明によれば、以上のようにすることにより、成形型素材の製造リードタイム及びコストを抑えられ、更には、成形用型としての成形面精度の高精度化への対応と併せ成形型の総合的な精度確保が可能な成形用型の製造方法が提供される結果、高品質・高性能の光学素子が素早く廉価に提供できるようになるという効果を奏する。   According to the present invention, the manufacturing lead time and cost of the molding die material can be suppressed by doing as described above, and further, the molding die can be used in combination with the improvement of the molding surface accuracy as a molding die. As a result of providing a method for manufacturing a mold capable of ensuring comprehensive accuracy, it is possible to provide a high-quality and high-performance optical element quickly and inexpensively.

以下、本発明の実施の形態を図面に基づいて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図1は、本実施例における被加工物である光学素子成形用型1の最終的な仕上がり状態を示している。この光学素子成形用型1は円柱形状であり、母材であるSUS(ステンレス鋼)材の基準型部2と、線膨張係数が基準型部2にほぼ等しいガラスよりなる成形用型部3とが一体的に構成されている。なお、本実施例では、基準型部2の側面が光学素子成形用型1の成形基準面になる。   FIG. 1 shows a final finished state of an optical element molding die 1 which is a workpiece in this embodiment. This optical element molding die 1 has a cylindrical shape, a reference mold part 2 made of SUS (stainless steel) as a base material, and a molding mold part 3 made of glass having a linear expansion coefficient substantially equal to that of the reference mold part 2. Are integrally configured. In the present embodiment, the side surface of the reference mold portion 2 becomes the molding reference surface of the optical element molding die 1.

図2は、基準型部2の端面と成形用型部3の一端面を融着させて光学素子成形用型1を形成するための押圧成形装置4の概略構成を示す断面図である。
図2において、ヒータ5が内設されている筒状の加熱リング6には上成形型7と基準型部2とが嵌合されており、上成形型7は上下に(同図に示されている矢印の向きに)摺動可能である。
FIG. 2 is a cross-sectional view showing a schematic configuration of a press molding apparatus 4 for forming the optical element molding die 1 by fusing the end surface of the reference mold portion 2 and the one end surface of the molding die portion 3.
In FIG. 2, an upper mold 7 and a reference mold portion 2 are fitted to a cylindrical heating ring 6 in which a heater 5 is provided, and the upper mold 7 is vertically moved (shown in the figure). (In the direction of the arrow).

基準型部2の接合面2aには、基準型部2とほぼ同径の融着接合部材8と、直径が基準型部2よりも大きいガラスよりなる成形用型部3とがセットされている。加熱リング6に設けられているヒータ5により押圧成形装置4全体を加熱した状態の下で、上成形型7に接続されている図示しないプレス機構による所望の押圧力で上成形型7を下方に摺動させると、成形用型部3と基準型部2とが融着接合部材8により強固に融着する。   On the joining surface 2 a of the reference mold part 2, a fusion bonding member 8 having substantially the same diameter as the reference mold part 2 and a molding mold part 3 made of glass having a diameter larger than that of the reference mold part 2 are set. . Under a state in which the entire press molding apparatus 4 is heated by the heater 5 provided in the heating ring 6, the upper mold 7 is moved downward by a desired pressing force by a press mechanism (not shown) connected to the upper mold 7. When sliding, the mold part 3 and the reference mold part 2 are firmly fused by the fusion bonding member 8.

図1に示した光学素子成形用型1の成形用型部3における外径(外周面)3b及び成形面3aの加工に使用する超精密加工機9の構成を、図3に斜視図で示す。
この超精密加工機9はX軸及びZ軸の2軸方向にそれぞれスライド可能なX軸テーブル10及びZ軸テーブル11を超精密加工機ベース15上に有しており、更に、主軸12を回転させる主軸回転モータ16と工具回転スピンドル13を回動させるB軸回転テーブル14とを有している。つまり、超精密加工機9は、スライド軸であるX軸及びZ軸と回転軸であるB軸とで3軸制御が可能な構成を有している。
FIG. 3 is a perspective view showing the configuration of the outer diameter (outer peripheral surface) 3b in the molding die portion 3 of the optical element molding die 1 shown in FIG. 1 and the ultraprecision processing machine 9 used for processing the molding surface 3a. .
This ultra-precision machine 9 has an X-axis table 10 and a Z-axis table 11 slidable in two directions of the X-axis and Z-axis, respectively, on an ultra-precision machine base 15, and further rotates the spindle 12. And a B-axis rotary table 14 for rotating the tool rotary spindle 13. That is, the ultraprecision machine 9 has a configuration capable of three-axis control with the X and Z axes as slide axes and the B axis as a rotation axis.

光学素子成形用型1はZ軸テーブル11上に設置されている主軸12に固定されている。なお、ここで、Z軸は主軸12の回転軸12aと平行な軸となっており、X軸はこの回転軸12aに対して垂直な軸となっている。   The optical element molding die 1 is fixed to a main shaft 12 installed on a Z-axis table 11. Here, the Z-axis is an axis parallel to the rotation axis 12a of the main shaft 12, and the X-axis is an axis perpendicular to the rotation axis 12a.

工具回転スピンドル13は、このZ軸と対向したX軸テーブル10上のB軸回転テーブル14上に設置されている工具回転スピンドルホルダ17に固定されている。ここで、B軸はX軸とZ軸によって形成される面に対して垂直な軸であり、工具回転スピンドル13は主軸12の回転軸12aに対して水平方向に回動可能な状態に設置されている。   The tool rotating spindle 13 is fixed to a tool rotating spindle holder 17 installed on a B-axis rotating table 14 on the X-axis table 10 facing the Z-axis. Here, the B-axis is an axis perpendicular to the plane formed by the X-axis and the Z-axis, and the tool rotating spindle 13 is installed so as to be rotatable in the horizontal direction with respect to the rotating shaft 12a of the main shaft 12. ing.

図4は研削砥石18を取り付けた工具回転スピンドル13の上面図である。
研削砥石18は、超精密加工機9のB軸回転テーブル14上に設置された工具回転スピンドル13に取付けられる。ここで、研削砥石18の加工作用点18aと、B軸回転テーブル14の回転軸14aとを工具スピンドルホルダ17の図示しない調整機構により合致させておく。なお、工具回転スピンドル13の回転軸13aと主軸12の回転軸12aも、工具スピンドルホルダ17の図示しない調整機構により水平に合致させておく。
FIG. 4 is a top view of the tool rotating spindle 13 to which the grinding wheel 18 is attached.
The grinding wheel 18 is attached to a tool rotating spindle 13 installed on the B-axis rotating table 14 of the ultraprecision machine 9. Here, the working point 18 a of the grinding wheel 18 and the rotating shaft 14 a of the B-axis rotary table 14 are matched with each other by an adjustment mechanism (not shown) of the tool spindle holder 17. The rotating shaft 13 a of the tool rotating spindle 13 and the rotating shaft 12 a of the main shaft 12 are also horizontally aligned by an adjustment mechanism (not shown) of the tool spindle holder 17.

次に、光学素子成形用型1の加工の工程を、図5に示した工程図に沿って説明する。
まず、光学素子成形用型1を超精密加工機9の主軸12に固定する。このとき、光学素子成形用型1の成形基準となる基準型部2の外径(側面)2b(図1参照)を衝として主軸12の回転軸12aと同軸に芯出し調整しておく。
Next, the process of processing the optical element molding die 1 will be described with reference to the process chart shown in FIG.
First, the optical element molding die 1 is fixed to the main shaft 12 of the ultraprecision machine 9. At this time, the outer diameter (side surface) 2b (see FIG. 1) of the reference mold part 2 that is a molding reference of the optical element molding die 1 is centered and adjusted coaxially with the rotary shaft 12a of the main shaft 12.

次に、図5に(1)として示すように、工具回転スピンドル13に取付けられた研削砥石18により、円柱形状である成形用型部3の外径3b(図1参照)を、同じく円柱形状である基準型部2の外径2bと同径になるように研削加工する。すなわち、基準型部2の中心軸と成形用型部3の中心軸とを一致させる。なお、このときには、工具回転スピンドル13の回転軸13aと主軸12の回転軸12aとが平行となるように、若しくは、研削砥石18の側面が成形用型部3の側面に食い込まない範囲に、B軸回転テーブル14で調整しておく。   Next, as shown as (1) in FIG. 5, the outer diameter 3 b (see FIG. 1) of the forming die portion 3 having a cylindrical shape is changed to a cylindrical shape by a grinding wheel 18 attached to the tool rotating spindle 13. Grinding is performed so as to have the same diameter as the outer diameter 2b of the reference mold part 2. That is, the central axis of the reference mold part 2 and the central axis of the molding mold part 3 are matched. At this time, the rotation axis 13a of the tool rotation spindle 13 and the rotation axis 12a of the main shaft 12 are parallel to each other, or within a range where the side surface of the grinding wheel 18 does not bite into the side surface of the molding die 3. Adjustment is performed with the shaft rotation table 14.

次に、図5に(2)として示すように、光学素子成形用型1の成形用型部3の他端面の成形面3a(図1参照)を平面から研削砥石18で研削加工する。この加工は、B軸回転テーブル14の回転軸14aと主軸12の回転軸12aと位置合わせしてある研削砥石18の加工作用点18aを、図示しない超精密加工機9のCNC(コンピュータ数値制御)装置によるX、Z、B軸の3軸制御で所望の形状に走査させることにより行う。   Next, as shown as (2) in FIG. 5, the molding surface 3a (see FIG. 1) of the other end surface of the molding die portion 3 of the optical element molding die 1 is ground with a grinding wheel 18 from the flat surface. In this processing, the machining action point 18a of the grinding wheel 18 aligned with the rotary shaft 14a of the B-axis rotary table 14 and the rotary shaft 12a of the main shaft 12 is converted into a CNC (computer numerical control) of a super-precision machine 9 (not shown). The scanning is performed in a desired shape by three-axis control of the X, Z, and B axes by the apparatus.

その後、必要に応じ、図5に(3)として示すように、研磨工具19を用いて研磨加工を行い、成形面3aを高精度に仕上げる。
以上のように、本実施例によれば、単純形状である基準型部2とガラス材からなる成形用型部3とを用いることにより、光学素子成形用型1としての素材の製造コストやリードタイムを抑えることができる。また、基準型部2における成形基準である外径2bを衝にして基準型部2の直径と成形用型部3の直径とを同軸加工した上で、成形用型部3の成形面3aを所望の形状に加工して光学素子成形用型1を製造することにより、成形面3aの精度、成形面3aと型基準部2との位置精度、成形面3aに直交する胴型との摺動部の合わせ等、成形型としての高い総合精度を得ることができる。
Thereafter, as shown in FIG. 5 as (3), polishing is performed using a polishing tool 19 to finish the molding surface 3a with high accuracy.
As described above, according to the present embodiment, by using the reference mold part 2 having a simple shape and the molding mold part 3 made of a glass material, the manufacturing cost and the lead of the material as the optical element molding mold 1 are obtained. Time can be suppressed. Further, the outer diameter 2b, which is a molding reference in the reference mold part 2, is used as an axis, and the diameter of the reference mold part 2 and the diameter of the molding mold part 3 are coaxially processed, and then the molding surface 3a of the molding mold part 3 is formed. By manufacturing the optical element molding die 1 by processing into a desired shape, the accuracy of the molding surface 3a, the positional accuracy of the molding surface 3a and the mold reference portion 2, and the sliding with the barrel die orthogonal to the molding surface 3a. It is possible to obtain high overall accuracy as a molding die, such as matching of parts.

図6は、本実施例における被加工物である光学素子成形用型20の最終的な仕上がり状態を示している。この光学素子成形用金型20は、母材であるSUS材の基準型部21と、線膨張係数がほぼ基準型部21に等しいガラスよりなる成形用型22とが一体的に構成されている。この点においては実施例1における光学素子成形用金型1と同様である。但し、光学素子成形用金型20は、円柱形状である成形用型部22の直径が、同じく円柱形状である基準型部21の直径よりも小さく形成される点において、成形用型部3と基準型部2との直径が同一になるように形成される実施例1の光学素子成形用金型1と異なっている。   FIG. 6 shows a final finished state of the optical element molding die 20 which is a workpiece in this embodiment. In this optical element molding die 20, a reference mold portion 21 made of SUS material as a base material and a molding die 22 made of glass whose linear expansion coefficient is substantially equal to the reference mold portion 21 are integrally formed. . This is the same as the optical element molding die 1 in the first embodiment. However, the optical element molding die 20 is different from the molding die portion 3 in that the diameter of the cylindrical molding portion 22 is smaller than the diameter of the reference cylindrical portion 21 which is also cylindrical. This is different from the optical element molding die 1 of Example 1 which is formed so as to have the same diameter as the reference mold part 2.

なお、本実施例では、基準型部21の側面が光学素子成形用型10の成形基準面になる。
図7は光学素子成形用金型20のブランク状態を示している。成形用型部22は、一方の端面(他端面)である成形面22aが所望の形状に近い近似R(球面)で予め加工されており、成形面22aに対向しているもう一方の端面が基準型部21の端面に耐熱性接着剤23で強固に接着されている。なお、このときの成形用型部22の直径は基準型部21よりも大きい。
In the present embodiment, the side surface of the reference mold portion 21 becomes the molding reference surface of the optical element molding die 10.
FIG. 7 shows a blank state of the optical element molding die 20. The molding die 22 has a molding surface 22a, which is one end surface (the other end surface), processed in advance with an approximate R (spherical surface) close to a desired shape, and the other end surface facing the molding surface 22a. The end face of the reference mold part 21 is firmly bonded with a heat resistant adhesive 23. At this time, the diameter of the molding die 22 is larger than that of the reference die 21.

図6に示した光学素子成形用金型20の成形用型部22における成形面22aの加工に使用する超精密加工機9’の構成を、図8に斜視図で示す。
この超精密加工機9’の構成と図3に示した超精密加工機9とは、工具回転スピンドル13及び工具スピンドルホルダ17が、振動切削装置24に置換されている点において相違している。超精密加工機9’のB軸回転テーブル14上に設置されている振動切削装置24は振動を用いて切削を行う装置であり、芯出しされたダイヤモンド工具25を具備している。
FIG. 8 is a perspective view showing the configuration of an ultra-precision machine 9 ′ used for processing the molding surface 22a of the molding die 22 of the optical element molding die 20 shown in FIG.
The configuration of the ultraprecision machine 9 ′ and the ultraprecision machine 9 shown in FIG. 3 are different in that the tool rotating spindle 13 and the tool spindle holder 17 are replaced with a vibration cutting device 24. The vibration cutting device 24 installed on the B-axis rotary table 14 of the ultra-precision machine 9 ′ is a device that performs cutting using vibration, and includes a centered diamond tool 25.

図9は、ダイヤモンド工具25が取り付けられている振動切削装置24の上面図である。ここで、ダイヤモンド工具25の切刃作用点25aと、B軸回転テーブル14の回転軸14aとを図示しない調整機構により合致させておく。なお、ダイヤモンド工具25の切刃すくい面と主軸12の回転軸12aも、図示しない調整機構により水平に合致させておく。   FIG. 9 is a top view of the vibration cutting device 24 to which the diamond tool 25 is attached. Here, the cutting edge operating point 25a of the diamond tool 25 and the rotating shaft 14a of the B-axis rotary table 14 are matched with each other by an adjusting mechanism (not shown). The cutting edge rake face of the diamond tool 25 and the rotating shaft 12a of the main shaft 12 are also horizontally aligned by an adjustment mechanism (not shown).

図8に示した超精密加工機9’におけるその他の構成は、図3に示した超精密加工機9と同様である。
次に、光学素子成形用型20の加工の工程を、図10に示した工程図に沿って説明する。
The other configurations of the ultraprecision machine 9 ′ shown in FIG. 8 are the same as those of the ultraprecision machine 9 shown in FIG.
Next, the process of processing the optical element molding die 20 will be described with reference to the process diagram shown in FIG.

まず、光学素子成形用型20を超精密加工機9’の主軸12に固定する。このとき、光学素子成形用型20の成形基準となる基準型部21の外径21a(図7参照)を衝として主軸12の回転軸12aと同軸に芯出し調整しておく。   First, the optical element molding die 20 is fixed to the main shaft 12 of the ultraprecision machine 9 '. At this time, the outer diameter 21a (see FIG. 7) of the reference mold portion 21 that serves as a molding reference for the optical element molding die 20 is used as a center and adjusted to be coaxial with the rotary shaft 12a of the main shaft 12.

次に、図10に(1)として示すように、振動切削装置24に取付けられたダイヤモンド工具25により、成形用型部22の外径22b(図7参照)を基準型部21の外径21aよりマイナスになるように(すなわち、成形用型部22の直径が基準型部21の直径よりも小さくなるように)切削加工する。なお、このときにマイナスとする数値としては、光学素子の成形時に樹脂が入り込むことがない程度の値とすることが好ましく、具体的には50μm以下が望ましい。   Next, as shown as (1) in FIG. 10, the outer diameter 22 b (see FIG. 7) of the molding die 22 is changed to the outer diameter 21 a of the reference die 21 by the diamond tool 25 attached to the vibration cutting device 24. Cutting is performed so as to be more negative (that is, the diameter of the molding die portion 22 is smaller than the diameter of the reference die portion 21). Note that the negative value at this time is preferably a value that does not allow the resin to enter during molding of the optical element, and specifically 50 μm or less is desirable.

次に、図10に(2)として示すように、光学素子成形用型20の成形用型部22の成形面22a(図7参照)をダイヤモンド工具25で切削加工する。この加工は、位置合わせがされているダイヤモンド工具25を、図示しない超精密加工機9’のCNC装置によるX、Z、B軸の3軸制御で所望の形状に走査させることにより行う。   Next, as shown as (2) in FIG. 10, the molding surface 22 a (see FIG. 7) of the molding die portion 22 of the optical element molding die 20 is cut with a diamond tool 25. This processing is performed by causing the diamond tool 25 that has been aligned to scan in a desired shape by three-axis control of the X, Z, and B axes by the CNC device of the ultra-precision machine 9 '(not shown).

その後、必要に応じ、図10に(3)として示すように、研磨工具19を用いて研磨加工を行い、成形面22aを高精度に仕上げる。
以上のように、本実施例によれば、実施例1と同様に、高い総合精度をもつ光学素子成形用型20を得ることができる。更に、本実施例によれば、成形用型部22の直径を基準型部21の直径よりも小さくなるように加工して光学素子成形用型20を製造することにより、成形型可動側に光学素子成形用型20を用いても摺動面にカケや摩耗が生じることがなく、成形面22aの位置精度が確保できる。また、基準型部21との一体化の前に成形面22aが所望の形状である光学素子形状の近似Rに予め加工されている成形用型部22を用いて光学素子成形用型20を製造することにより、成形面22aの加工リードタイムを削減することができる。
Thereafter, as shown in FIG. 10 as (3), a polishing process is performed using a polishing tool 19 to finish the molding surface 22a with high accuracy.
As described above, according to the present embodiment, the optical element molding die 20 having high total accuracy can be obtained as in the first embodiment. Furthermore, according to the present embodiment, the optical element molding die 20 is manufactured by processing the diameter of the molding die portion 22 so as to be smaller than the diameter of the reference die portion 21, so that the optical mold can be moved to the movable side of the molding die. Even if the element molding die 20 is used, the sliding surface will not be chipped or worn, and the positional accuracy of the molding surface 22a can be ensured. In addition, the optical element molding die 20 is manufactured by using the molding die portion 22 that has been processed in advance to approximate the optical element shape R in which the molding surface 22a has a desired shape before the integration with the reference die portion 21. By doing so, the processing lead time of the molding surface 22a can be reduced.

ところで、以上のようにして製造された光学素子成形用型1若しくは20を用いて光学素子を製造するには、ガラス若しくはプラスチックである光学素子の成形材料を、一対の光学素子成形用型1若しくは20の間に配置し、これを熱間にて成形(押圧成形若しくは射出成形)すればよい。   By the way, in order to manufacture an optical element using the optical element molding die 1 or 20 manufactured as described above, a molding material for an optical element made of glass or plastic is used as a pair of optical element molding molds 1 or 20. It may be disposed between 20 and molded (press molding or injection molding) while hot.

以上、本発明の実施形態を説明したが、本発明は、上述した各実施形態に限定されることなく、本発明の要旨を逸脱しない範囲内で種々の改良・変更が可能である。
例えば、上述した各実施例においては、SUS材である基準型部2及び21を用いたが、光学素子成形時における耐熱性を有しているものであれば、基準型部2及び21の材質として、金属、超硬合金、セラミックスなどのいずれであってもよい。
As mentioned above, although embodiment of this invention was described, this invention is not limited to each embodiment mentioned above, A various improvement and change are possible within the range which does not deviate from the summary of this invention.
For example, in each of the above-described embodiments, the reference mold parts 2 and 21 that are SUS materials are used. However, the material of the reference mold parts 2 and 21 may be used as long as it has heat resistance during optical element molding. Any of metal, cemented carbide, ceramics and the like may be used.

また、上述した実施例2においては、成形用型部22の直径を基準型部21の直径よりも小さくなるように加工して光学素子成形用型20を製造したが、成形用型部22の直径を基準型部21と同径になるように加工して光学素子成形用型20を製造することも、もちろん可能である。   In Example 2 described above, the optical element molding die 20 is manufactured by processing the diameter of the molding die portion 22 so as to be smaller than the diameter of the reference die portion 21. It is of course possible to manufacture the optical element molding die 20 by processing the diameter so as to be the same as that of the reference die portion 21.

実施例1における光学素子成形用型の最終的な仕上がり状態を示す図である。2 is a diagram illustrating a final finished state of the optical element molding die in Example 1. FIG. 押圧成形装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of a press molding apparatus. 実施例1で使用する超精密加工機の構成を示す斜視図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a configuration of an ultraprecision machine used in Example 1. 研削砥石を取り付けた工具回転スピンドルの上面図を示す図である。It is a figure which shows the upper side figure of the tool rotation spindle which attached the grinding wheel. 実施例1における光学素子成形用型の加工の工程を示す工程図である。FIG. 6 is a process diagram illustrating a process of processing an optical element molding die in Example 1. 実施例2における光学素子成形用型の最終的な仕上がり状態を示す図である。6 is a diagram illustrating a final finished state of an optical element molding die in Example 2. FIG. 実施例2における光学素子成形用金型のブランク状態を示す図である。It is a figure which shows the blank state of the optical element shaping die in Example 2. FIG. 実施例2で使用する超精密加工機の構成を示す斜視図である。It is a perspective view which shows the structure of the ultraprecision processing machine used in Example 2. FIG. ダイヤモンド工具が取り付けられている振動切削装置の上面図である。It is a top view of the vibration cutting apparatus to which the diamond tool is attached. 実施例2における光学素子成形用型の加工の工程を示す工程図である。6 is a process diagram showing a process of processing an optical element molding die in Example 2. FIG.

符号の説明Explanation of symbols

1、20 光学素子成形用型
2、21 基準型部
2a 基準型部接合面
2b、21a 基準型部外径
3、22 成形用型部
3a、22a 成形用型部成形面
3b、22b 成形用型部外径
4 押圧成形装置
5 ヒータ
6 加熱リング
7 上成形型
8 融着接合部材
9、9’ 超精密加工機
10 X軸テーブル
11 Z軸テーブル
12 主軸
12a 主軸回転軸
13 工具回転スピンドル
13a 工具回転スピンドル回転軸
14 B軸回転テーブル
14a B軸回転テーブル回転軸
15 超精密加工機ベース
16 主軸回転モータ
17 工具回転スピンドルホルダ
18 研削砥石
18a 研削砥石加工作用点
19 研磨工具
23 耐熱性接着剤
24 振動切削装置
25 ダイヤモンド工具
25a ダイヤモンド工具切刃作用点
DESCRIPTION OF SYMBOLS 1,20 Optical element shaping | molding die 2, 21 Reference | standard type | mold part 2a Reference | standard type | mold part joining surface 2b, 21a Reference | standard type | mold part outer diameter 3, 22 Molding type | mold part 3a, 22a Molding type | mold part molding surface 3b, 22b Molding type External diameter 4 Press forming device 5 Heater 6 Heating ring 7 Upper mold 8 Fusion bonding member 9, 9 'Ultra-precision processing machine 10 X-axis table 11 Z-axis table 12 Spindle 12a Spindle rotation shaft 13 Tool rotation spindle 13a Tool rotation Spindle rotating shaft 14 B-axis rotating table 14a B-axis rotating table rotating shaft 15 Super precision processing machine base 16 Spindle rotating motor 17 Tool rotating spindle holder 18 Grinding wheel 18a Grinding wheel working point 19 Polishing tool 23 Heat resistant adhesive 24 Vibration cutting Equipment 25 Diamond tool 25a Diamond tool cutting edge working point

Claims (8)

光学素子の成形時における基準面を有する基準型部と、前記光学素子を成形する成形面を有する成形用型部と、を一体的に構成する光学素子成形用型の製造にあたり、
前記基準型部よりも外径が大きい前記成形用型部の一端面と前記基準型部の端面とを一体化する工程と、
前記基準型部の基準面を衝として加工機の主軸に取り付け、前記成形用型部を前記加工機で加工することにより、前記基準型部の中心軸と前記成形用型部の中心軸とを一致させる工程と、
前記成形用型部の他端面に前記成形面を加工する工程と、
を有することを特微とする光学素子成形用型の製造方法。
In manufacturing an optical element molding die that integrally constitutes a reference mold part having a reference surface when molding an optical element and a molding mold part having a molding surface for molding the optical element,
Integrating the one end surface of the molding die portion having an outer diameter larger than that of the reference die portion and the end surface of the reference die portion;
A reference surface of the reference mold part is attached to a main shaft of a processing machine as a counter, and the molding mold part is processed by the processing machine to obtain a central axis of the reference mold part and a central axis of the molding mold part. A matching step;
Processing the molding surface on the other end surface of the molding die,
A process for producing an optical element molding die characterized by comprising:
前記基準型部と前記成形用型部は円柱形状であることを特徴とする請求項1に記載の光学素子成形用型の製造方法。   The method for manufacturing an optical element molding die according to claim 1, wherein the reference mold part and the molding mold part have a cylindrical shape. 前記基準型部は耐熱性を有した金属、超硬またはセラミックスからなり、前記成形用型部は前記基準型部と線膨張係数がほぼ等しいガラスからなることを特徴とする請求項1または2に記載の光学素子成形用型の製造方法。   3. The reference mold part according to claim 1, wherein the reference mold part is made of heat-resistant metal, cemented carbide or ceramics, and the molding mold part is made of glass having a linear expansion coefficient substantially equal to that of the reference mold part. The manufacturing method of the optical element shaping | molding die of description. 前記成形用型部と前記基準型部とを一体化する工程は、加熱した融着接合部材を成形用型部の端面と前記基準型部の端面とで押圧して固着することを特徴とする請求項1から3のうちのいずれか一項に記載の光学素子成形用型の製造方法。   The step of integrating the molding die and the reference die is characterized by pressing and fixing the heated fusion bonding member between the end surface of the molding die and the end surface of the reference die. The manufacturing method of the optical element shaping | molding die as described in any one of Claims 1-3. 前記成形用型部と前記基準型部とを一体化する工程は、前記成形用型部の端面と前記基準型部の端面とを接着剤で接着して固着することを特徴とする請求項1から3のうちのいずれか一項に記載の光学素子成形用型の製造方法。   2. The step of integrating the molding die and the reference die is characterized by adhering and fixing the end surface of the molding die and the end surface of the reference die with an adhesive. 4. A method for producing an optical element molding die according to any one of items 1 to 3. 前記成形用型部を前記加工機で加工する工程は、前記成形用型部の外径を前記基準型部の外径以下とすることを特徴とする請求項1から5のうちのいずれか一項に記載の光学素子成形用型の製造方法。   6. The step of processing the molding die portion with the processing machine sets an outer diameter of the molding die portion to be equal to or smaller than an outer diameter of the reference die portion. The manufacturing method of the type | mold for optical element shaping | molding of description. 前記成形用型部と前記基準型部とを一体化する前に、前記成形用型部の他端面を前記光学素子に対応した形状に近似した球面形状に予め加工しておくことを特徴とする請求項1から6のうちのいずれか一項に記載の光学素子成形用型の製造方法。   Before integrating the molding die portion and the reference die portion, the other end surface of the molding die portion is processed in advance into a spherical shape approximate to a shape corresponding to the optical element. The manufacturing method of the optical element shaping | molding die as described in any one of Claims 1-6. 請求項1から7のうちのいずれか1項に記載の光学素子成形用型の製造方法を使用して製造された一対の光学素子成形用型の間に、成形材料を配置し、これを熱間にて成形して光学素子を得ることを特徴とする光学素子の製造方法。   A molding material is disposed between a pair of optical element molding dies manufactured using the method for manufacturing an optical element molding dies according to any one of claims 1 to 7, and the molding material is heated. An optical element manufacturing method, wherein an optical element is obtained by molding in between.
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JP7135194B1 (en) * 2021-10-19 2022-09-12 Towa株式会社 Method for manufacturing mold for resin molding, mold for resin molding, resin molding apparatus, and method for manufacturing resin molded product

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