JP2007281163A - Cooler - Google Patents

Abstract

A semiconductor device cooler having excellent cooling performance is provided.
The cooler includes a substrate on which a semiconductor element is disposed, a plate-like member fixed to the back surface of the substrate, a main pipe, and an auxiliary pipe. A space sandwiched between the substrate 1 and the main pipe 11 constitutes a first flow path for the refrigerant. The main pipe 11 and the auxiliary pipe 12 constitute a second flow path for the refrigerant. The auxiliary pipe 12 is disposed so as to eject the refrigerant toward the region where the semiconductor element 21 is disposed. The second flow path is formed separately from the first flow path.
[Selection] Figure 1

Description

  The present invention relates to a cooler. In particular, it relates to a cooler for a power converter.

  In recent years, vehicles using electric power as a power source, such as a fuel cell vehicle equipped with a hybrid vehicle, an electric vehicle, and a fuel cell, have attracted attention. A hybrid vehicle is a vehicle powered by a motor in addition to a conventional engine. A hybrid vehicle obtains power by driving an engine, converts a DC voltage from a DC power source into an AC voltage, and drives a motor by the converted AC voltage. An electric vehicle is a vehicle that obtains power by driving a motor with an AC voltage obtained by converting a DC voltage from a DC power source.

  In an automobile using such electricity as a power source, a power converter is mounted. The power converter includes, for example, a power semiconductor element such as an inverter or a converter. Examples of the power semiconductor element include a power MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) and an IGBT (Insulated Gate Bipolar Transistor).

  In a power converter mounted on an automobile or the like, a large amount of electric power may be required to obtain high power performance of the automobile. Since a high-power power converter or the like generates a large amount of heat, a cooler for cooling the power converter is mounted.

  In cooling a heating element such as a high-power power converter, cooling plates (fins) are joined to members that are in contact with the power converter, etc., and the heat transfer area is expanded to improve efficiency, or power Cooling by a so-called impinging jet, in which cooling water collides toward the region where the transducer is disposed, is useful. Furthermore, a method of combining these cooling methods is effective.

  Japanese Patent Laid-Open No. 2-100350 discloses an integrated circuit cooling structure including a cooling plate having fins. This cooling structure has an integrated circuit in which a plurality of integrated circuit elements are mounted on a substrate, a substrate frame that holds the substrate, and a counterbore on the opposite surface of the substrate that faces the integrated circuit element. A cooling plate having fan-shaped fins arranged on the bottom surface and a nozzle for ejecting a refrigerant at the center of the fan-shaped fins are provided. According to this integrated circuit cooling structure, it is disclosed that the thermal resistance between the integrated circuit element and the refrigerant can be kept low, the flow rate of the refrigerant can be reduced, and heat can be efficiently discharged to the outside of the device. .

  In Japanese Patent No. 2955590, a plurality of semiconductor elements arranged on a substrate, a cooling medium supply header disposed on the opposite side of the substrate across each semiconductor element, and a tubular shape communicating with the cooling medium supply header A cooling medium supply member, a cooling medium supply member formed at the tip of the cooling medium supply member, for discharging the cooling medium from the cooling medium supply header toward each semiconductor element, and a semiconductor including a cooling medium return header A cooling device is disclosed. In this semiconductor cooling device, the substrate is installed in the vertical direction, a cooling medium return pipe communicating with the cooling medium return header is provided, and a partition member for partitioning the semiconductor elements is provided. According to this semiconductor cooling device, the cooling medium bubbles generated in each element are prevented from flowing into other elements and each element is cooled independently, so that the temperature difference between the elements can be reduced. It is disclosed that it can be done.

  Japanese Patent No. 2853481 discloses a cooling structure for a semiconductor element in which a radiator and a nozzle are combined. In this cooling structure, the radiator has a bottom radiator plate and first and second vertical radiator plates, and the bottom radiator plate is mounted on a wiring board and has a semiconductor element mounted therein. Is provided on the heat dissipation surface. The first vertical heat sink is composed of a plurality of curved heat sinks. The curved convex surfaces face each other, and a jet flow path is formed between the curved convex surfaces. The second vertical heat radiating plate is provided at the jet outlet of the passage by the first vertical heat radiating plate, and the nozzle collides with the bottom heat radiating plate through the passage by the first vertical heat radiating plate. A refrigerant is ejected. According to this semiconductor element cooling structure, it is disclosed that the cooling efficiency can be improved without increasing the flow velocity or the flow rate by causing the refrigerant once collided as a jet to collide with the heat radiating plate as the jet again.

Japanese Patent Laid-Open No. 5-190716 discloses a semiconductor device in which a large number of integrated circuit packages are mounted on a ceramic multilayer substrate, and a cooling jacket is mounted on each package. A flexible tube is connected to each cooling jacket. A nozzle for allowing the cooling fluid to flow into the cooling jacket as a slit-like jet is provided inside the flexible channel. Space for the return of fins and cooling fluid is provided in the cooling jacket. According to this semiconductor device, water with high cooling capacity can be used as a cooling medium, flat fins that can easily expand the heat transfer area can be used, and a cooling fluid can be uniformly supplied to each fin by a slit-like jet. It is disclosed that a semiconductor device having an excellent cooling structure can be provided.
Japanese Patent Laid-Open No. 2-100350 Japanese Patent No. 2955590 Japanese Patent No. 2853481 Japanese Patent Laid-Open No. 5-190716

  When the temperature of the power converter rises, the efficiency may decrease and the semiconductor element included in the power converter may be damaged. For this reason, as described above, a cooler for cooling the power converter may be mounted, and in particular, cooling of a heating element such as a power converter corresponding to high power is an important issue.

  An object of this invention is to provide the cooler of the power converter excellent in cooling performance.

  The cooler according to the invention comprises a substrate for placing the power converter on one side. A heat dissipating member fixed to the other surface of the substrate is provided. First flow path configuring means for configuring a first flow path formed so that the refrigerant contacts the heat radiating member is provided. Second flow path configuring means is provided that configures a second flow path that is formed so as to eject the refrigerant toward the region where the power converter is disposed on the other surface. The second channel is formed separately from the first channel.

  In the above invention, preferably, the heat dissipation member includes at least one of a plate-like member and a rod-like member.

  Preferably, in the above invention, the heat dissipating member is disposed around a region where the power converter is disposed. The second flow path constituting means includes a main pipe disposed away from the other surface of the substrate, and an auxiliary pipe formed so as to protrude from the main pipe toward the substrate. The auxiliary tube is disposed so as to face a region of the substrate where the power converter is disposed. The first flow path includes a space sandwiched between the main pipe and the substrate.

  Preferably, in the above invention, the auxiliary pipe includes an end face facing the substrate, and the end face is inclined so that a flow path becomes larger along a direction of the refrigerant flowing through the first flow path forming means. Yes.

  Preferably, in the above invention, the auxiliary pipe is formed in a tapered shape so as to become thinner toward the substrate.

  In the above invention, preferably, third flow path constituting means for discharging the refrigerant flowing through the second flow path is provided. The third flow path forming means includes a separator disposed between the main pipe and the substrate. The auxiliary pipe is formed so as to penetrate the separator. The auxiliary pipe is fixed to the separator without a gap.

  Preferably, in the above invention, the substrate is arranged such that a direction in which the one surface extends is either a vertical direction or a direction inclined with respect to the vertical direction.

  Preferably, in the above invention, the substrate is arranged so that the one surface faces downward in the vertical direction.

  ADVANTAGE OF THE INVENTION According to this invention, the cooler of the power converter excellent in cooling performance can be provided.

(Embodiment 1)
With reference to FIGS. 1-4, the cooler in Embodiment 1 based on this invention is demonstrated. The cooler in the present embodiment is a cooler for cooling a power converter as a body to be cooled.

  The power converter includes devices such as an inverter for converting DC power into AC power and a converter for changing voltage. For example, the power converter includes a power semiconductor element such as a power MOSFET or IGBT.

  FIG. 1 is a schematic exploded perspective view of a semiconductor device according to the present embodiment. The semiconductor device in the present embodiment includes a power converter as an electric device and a cooler for cooling the power converter.

  The semiconductor device in the present embodiment includes a semiconductor element 21 as a power converter. The semiconductor element 21 is formed so that the planar shape is rectangular. The semiconductor element 21 is connected to an external electric circuit (not shown). The semiconductor element 21 is a heating element that generates heat when driven. In the present embodiment, the semiconductor element 21 is a body to be cooled.

  The cooler in the present embodiment includes a substrate 1 for placing the semiconductor element 21 on one surface. The substrate 1 is formed in a plate shape. In the present embodiment, a plurality of semiconductor elements 21 are arranged on the front surface of the substrate 1. The semiconductor element 21 is arranged such that the main surface is bonded to the substrate 1 as indicated by an arrow 54. Substrate 1 in the present embodiment includes a metal plate and an insulating layer formed on the surface of the metal plate. The semiconductor element 21 is fixed to the surface of the insulating layer.

  The cooler in the present embodiment includes a heat radiating member fixed to the surface of the substrate 1 opposite to the surface on which the semiconductor element 21 is disposed. The heat radiating member in the present embodiment includes a plate-like member 2. The plate-like member 2 is, for example, a straight fin. The plate-like member 2 is disposed in at least one of a region where the semiconductor element 21 is disposed and a region around the region where the semiconductor element 21 is disposed. The plate-like member 2 is disposed on the back surface of the substrate 1. The plate-like member 2 is arranged so that the main surface is substantially perpendicular to the main surface of the substrate 1.

  FIG. 2 shows a first schematic cross-sectional view of the semiconductor device according to the present embodiment. FIG. 2 is a schematic cross-sectional view when cut along a plane parallel to the main surface of the substrate. The cooler of a semiconductor device includes a plurality of plate-like members 2, and each plate-like member 2 is arranged and arranged. The plate-like members 2 are arranged so that their main surfaces are substantially parallel to each other. The plate-like members 2 are arranged so as to be separated from each other. The plate-like member 2 has a notch 2a formed in a region where an auxiliary tube 12 described later is disposed.

  FIG. 3 shows a second schematic cross-sectional view of the semiconductor device in the present embodiment. FIG. 4 shows a third schematic cross-sectional view of the semiconductor device in the present embodiment. 3 is a cross-sectional view taken along line III-III in FIG. 2, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

  The plate-like member 2 in the present embodiment has a rectangular planar shape. The notch 2a is formed so that a gap is formed between the auxiliary tube 12 and the end of the plate-like member 2. The direction indicated by the arrow 51 is the direction in which the cooling medium flows. The plate-like member 2 is disposed so that the main surface is substantially parallel to the direction in which the refrigerant flows. The plate-like member 2 is formed to have substantially the same height as the height of the first flow path described later.

  1 to 4, the cooler in the present embodiment includes first flow path forming means formed so that the refrigerant contacts the heat radiating member. The first flow path constituting means is formed to constitute the first flow path of the refrigerant. The first flow path constituting means in the present embodiment includes a substrate 1 and a main pipe 11 disposed on the side of the substrate 1 where the plate-like member 2 is disposed. The first flow path component includes a wall member 5 disposed on the side of the substrate 1 and the main pipe 11. The first flow path is formed by a space surrounded by the substrate 1, the main pipe 11, and the wall member 5.

  The cooler in the present embodiment is formed such that the first refrigerant flows in the first flow path sandwiched between the substrate 1 and the main pipe 11. In the present embodiment, a refrigerant supply device for supplying the refrigerant to the first flow path of the cooler is arranged (not shown).

  The cooler in the present embodiment includes second flow path forming means formed to collide the second refrigerant toward the region where the power converter is disposed on the back surface of the substrate 1. The second flow path constituting means is formed so as to directly eject the second refrigerant to the portion where the power converter is disposed.

  The second flow path constituting means in the present embodiment is formed so as to constitute the second flow path of the refrigerant. The second flow path component includes a main pipe 11 disposed away from the back surface of the substrate 1. The main pipe 11 includes a flow path component plate 11a and a flow path component plate 11b. The flow path component plate 11a and the flow path component plate 11b are arranged apart from each other. The flow path component plate 11a and the flow path component plate 11b are arranged so that their main surfaces are parallel to each other. Wall members 5 are arranged on the sides of the flow path component plate 11a and the flow path component plate 11b. A part of the second flow path is formed by the space surrounded by the flow path constituting plates 11 a and 11 b and the wall member 5.

  The second flow path constituting means in the present embodiment includes an auxiliary pipe 12 formed so as to protrude from the main pipe 11 toward the substrate 1. The auxiliary tube 12 is disposed so as to face the region where the semiconductor element 21 of the substrate 1 is disposed. The auxiliary tube 12 in the present embodiment is formed in a cylindrical shape. The auxiliary pipe 12 is formed so as to protrude from the flow path constituting plate 11a. The auxiliary pipe 12 is formed so as to communicate with the main pipe 11. The auxiliary pipe 12 and the main pipe 11 constitute a second flow path. In the present embodiment, a refrigerant supply device for supplying the second refrigerant to the second flow path is arranged (not shown).

  In the present embodiment, water is used for each of the first refrigerant flowing through the first flow path and the second refrigerant flowing through the second flow path. Cooling water is supplied to the first flow path and the second flow path by a common refrigerant supply device.

  Referring to FIGS. 1 and 3, auxiliary tube 12 in the present embodiment includes an end surface 12a. The end surface 12 a faces the substrate 1. The end surface 12a is inclined so that the flow path becomes larger along the direction of the first refrigerant flowing through the first flow path indicated by the arrow 51. That is, the end surface 12a is formed such that the distance from the substrate 1 increases along the direction in which the first refrigerant flows. The end surface 12a is formed so that the inclined surface faces the downstream side of the first refrigerant.

  Referring to FIGS. 2 to 4, the heat generated by semiconductor element 21 is transferred to substrate 1 and plate-like member 2. The first refrigerant supplied by the refrigerant supply device is introduced into the first flow path. The first refrigerant flows through a space between the substrate 1 and the main pipe 11 as indicated by an arrow 51. The first refrigerant flows between the plate-like members 2 in the first flow path. The first refrigerant flows while contacting the plate-like member 2 and the substrate 1. The plate-like member 2 and the substrate 1 are cooled when the first refrigerant contacts the plate-like member 2 and the substrate 1. After this, the first refrigerant is discharged.

  The semiconductor element 21 is cooled via the substrate 1. The semiconductor element 21 is cooled through the substrate 1 when the plate-like member 2 is cooled. The heat of the semiconductor element 21 is transmitted to the substrate 1 and the plate-like member 2 and is radiated from the substrate 1 and the plate-like member 2 to the first refrigerant.

  The 2nd refrigerant | coolant supplied by a refrigerant | coolant supply apparatus is introduce | transduced into the 2nd flow path comprised by the 2nd flow path structural member. The second refrigerant is introduced into the main pipe 11 as indicated by an arrow 52. Part of the second refrigerant flowing in the main pipe 11 flows into the auxiliary pipe 12 as indicated by an arrow 53.

  The second refrigerant that has flowed into the auxiliary pipe 12 is discharged from the end surface 12 a of the auxiliary pipe 12 as indicated by an arrow 53. In the present embodiment, the second refrigerant supplied from the second flow path isolated from the first refrigerant contributes to the cooling of the semiconductor element 21 only when it is ejected from the auxiliary pipe 12. Until the second refrigerant is ejected from the auxiliary pipe 12, the cooling capacity does not decrease because the second refrigerant is not in contact with the plate-like member 2 disposed in the second flow path. When the second refrigerant is ejected from the auxiliary pipe 12, it collides with a region of the back surface of the substrate 1 where the semiconductor element 21 is disposed. That is, the second refrigerant cools the region of the substrate 1 where the semiconductor element 21 is disposed by the collision jet. When the second coolant collides with the substrate 1, the semiconductor element 21 can be effectively cooled.

  The 2nd refrigerant | coolant which collided with the board | substrate 1 flows through a 1st flow path with a 1st refrigerant | coolant. At this time, the second refrigerant proceeds while cooling the substrate 1 and the plate-like member 2 by contacting the substrate 1 and the plate-like member 2. Thereafter, the second refrigerant is discharged together with the first refrigerant.

  In the present embodiment, the first flow path forming means formed so that the refrigerant contacts the heat radiating member, and the second flow path forming means for causing the collision jet to collide with the region where the semiconductor element is disposed. The first flow path and the second flow path are separated. In the first flow path, by disposing the heat dissipating member, the heat dissipating area is expanded and heat can be removed efficiently. In the second flow path, the second refrigerant is supplied in a state separated from the first refrigerant until it is ejected from the auxiliary pipe. The temperature of the first refrigerant flowing through the first flow path gradually increases toward the downstream side of the first refrigerant, but the second refrigerant is substantially the same as the upstream temperature also on the downstream side. For this reason, the 2nd refrigerant | coolant of low temperature can be made to collide with the semiconductor element 21, and the semiconductor element 21 can be cooled efficiently. Moreover, it can suppress that a cooling capability falls as it goes downstream in the flow path of a refrigerant | coolant, and can cool the semiconductor element 21 substantially uniformly.

  As described above, in the present embodiment, the collision jet flow and the cooling by the convection of the heat transfer member can be substantially separated, and the object to be cooled can be effectively cooled.

  In the present embodiment, the second flow path constituting means includes a main pipe and an auxiliary pipe. The first flow path includes a space sandwiched between the main pipe and the substrate. The plate-like member is arranged around the region where the semiconductor element is arranged. With this configuration, the first flow path forming means and the second flow path forming means can be easily formed. Further, the configuration of the cooler can be simplified.

  Referring to FIGS. 1 and 3, in the present embodiment, end surface 12a of auxiliary pipe 12 is inclined so that the flow path becomes larger along the direction of the flow of the first refrigerant. With this configuration, the collision jet flow ejected by the auxiliary pipe 12 can be guided to the downstream side of the first refrigerant.

  The cooler in the present embodiment is arranged so that the surface on which the semiconductor element of the substrate is arranged faces the upper side in the vertical direction. However, the present invention is not limited to this form, and the cooler is arranged with the semiconductor element of the substrate. You may arrange | position so that the surface currently made may face the lower side of a perpendicular direction. With this configuration, when bubbles are generated in the first flow path or the second flow path, the bubbles can be guided to the side opposite to the side on which the substrate is disposed, and the retention on the back surface of the substrate is suppressed. Can do. It can suppress that the liquid film of the back surface of a board | substrate is removed by a bubble, and the efficiency of heat transfer falls.

  Or the cooler may be arrange | positioned so that the direction where the surface where the semiconductor element of the board | substrate is arrange | positioned may be in any one of the direction which inclines with respect to a perpendicular direction or a perpendicular direction. With this configuration, bubbles generated in the first flow path or the second flow path can be moved upward in the vertical direction. It is possible to suppress air bubbles from staying on the back surface of the substrate. Even when bubbles are generated in the first flow path or the second flow path, a liquid film can be secured on the back surface of the substrate.

  In particular, when a liquid is used as the refrigerant and the heat flux is large, vapor may be generated in the refrigerant. By adopting any one of the above configurations, such steam can be discharged to the outside of the cooler or moved to the periphery of the cooler. As a result, it is possible to suppress a decrease in cooling efficiency due to the generation of bubbles.

  The plate-like member as the heat radiating member in the present embodiment is formed so that the height is substantially the same as the height of the first flow path. With this configuration, the plate-like member can be disposed over the entire height direction of the first flow path, and the heat transfer area can be increased. As a result, cooling with the first refrigerant can be performed effectively.

  In the present embodiment, a plurality of semiconductor elements are arranged along the direction in which the refrigerant flows, and auxiliary tubes having the same shape are arranged for each semiconductor element. The auxiliary pipe is not limited to this form, and auxiliary pipes having different sizes or different shapes may be arranged. Further, in the present embodiment, a cylindrical tube is arranged as the auxiliary tube. However, the present invention is not limited to this configuration, and the auxiliary tube can adopt any shape.

  For example, when the type of the object to be cooled is different, an auxiliary tube with a large diameter is arranged for the object to be cooled with a large calorific value, and an auxiliary pipe with a small diameter is arranged for the object to be cooled with a small calorific value. It doesn't matter. As described above, the cooler in the present embodiment can easily adjust the amount of heat removal in accordance with each object to be cooled.

  Furthermore, an adjustment valve for adjusting the flow rate of the refrigerant ejected from the specific auxiliary pipe, a shut-off valve for blocking the flow of the specific auxiliary pipe, or the like may be arranged on the auxiliary pipe or the main pipe. With this configuration, it is possible to adjust the flow rate of the collision jet in accordance with the amount of heat generated by the cooled object, or to perform intermittent cooling by the collision jet. Furthermore, although the heat generation amount of the cooled object may change in time series, the flow rate of the collision jet can be changed in response to such fluctuations in the heat generation amount, and optimal cooling can be performed. .

  Further, in the present embodiment, the notch is formed in the plate member as the heat radiating member. However, the present invention is not limited to this form, and the notch may not be formed in the plate member. . For example, the plate member may be formed so as to penetrate the auxiliary pipe. Furthermore, the plate member is not limited to a planar shape, and may be formed to have a curved surface.

  In the present embodiment, the same refrigerant is used for the first refrigerant and the second refrigerant. However, the present invention is not limited to this, and different refrigerants may be used. Furthermore, the refrigerant is not limited to liquid but may contain gas.

  Further, the cooler in the present embodiment is formed such that the direction of the first refrigerant flow in the first flow path and the direction of the second refrigerant flow in the second flow path are the same. It is not restricted to this form, You may form so that the direction of the flow of the 1st refrigerant | coolant of a 1st flow path and the direction of the flow of the 2nd refrigerant | coolant of a 2nd flow path may mutually differ.

  Further, as the refrigerant supply device, a refrigerant supply device for supplying the first refrigerant and a refrigerant supply device for supplying the second refrigerant may be arranged. Alternatively, the refrigerant supply device may include a circulation device that circulates while cooling the refrigerant.

  In the present embodiment, a description has been given by taking a high-power power converter as an example of a body to be cooled. . For example, the present invention can be applied to a power converter with low power and a cooler for other objects to be cooled.

(Embodiment 2)
With reference to FIG. 5 to FIG. 7, a cooler in Embodiment 2 based on the present invention will be described. The cooler in the present embodiment is a cooler for cooling the power converter. The cooler includes the first flow path forming means and the second flow path forming means as in the first embodiment. In the present embodiment, a heat radiating member for radiating the heat of the cooled object is different from the first embodiment.

  FIG. 5 is a schematic exploded perspective view of the semiconductor device according to the present embodiment. The heat radiating member in the present embodiment includes a rod-shaped member 3. The rod-shaped member 3 is fixed to the back surface of the substrate 1. The rod-shaped member 3 is disposed so as to protrude from the back surface of the substrate 1. The rod-shaped member 3 in the present embodiment is arranged so that the longitudinal direction is substantially perpendicular to the back surface of the substrate 1.

  FIG. 6 shows a first schematic cross-sectional view of the semiconductor device in the present embodiment. FIG. 6 is a schematic cross-sectional view when cut along a plane parallel to the main surface of the substrate. The rod-shaped member 3 is disposed around the auxiliary pipe 12. The rod-shaped member 3 is disposed around a region where the semiconductor element 21 is disposed. The rod-shaped member 3 is disposed in the vicinity of the region where the semiconductor element 21 is disposed. In the present embodiment, four rod-shaped members 3 are arranged for one semiconductor element 21. The first refrigerant flows in the direction indicated by the arrow 51.

  FIG. 7 shows a second schematic cross-sectional view of the semiconductor device according to the present embodiment. 7 is a cross-sectional view taken along line VII-VII in FIG. The rod-shaped member 3 is formed so as to have substantially the same length as the height of the first flow path sandwiched between the main tube 11 and the substrate 1.

  The heat dissipation member in the present embodiment includes a rod-shaped member. By changing the position, length, number, etc. of the rod-shaped members, the position where heat is removed by the heat radiating member and the contact area with the refrigerant can be easily changed.

  In the present embodiment, the rod-shaped member is disposed so as to surround the region where the body to be cooled is disposed. However, the present invention is not limited to this configuration, and the rod-shaped member collides with the cooling surface of the substrate. After that, an arbitrary position and an arbitrary number can be arranged so as not to prevent the radial spread as much as possible and to prevent the flow of the first refrigerant.

  The rod-shaped member in the present embodiment has substantially the same height as the first flow path through which the first refrigerant flows. By adopting this configuration, the rod-shaped member can be disposed over almost the entire height direction of the first flow path, and cooling with the first refrigerant can be performed effectively.

  Since other configurations, operations, and effects are the same as those of the first embodiment, description thereof will not be repeated here.

(Embodiment 3)
With reference to FIG. 8, the cooler in Embodiment 3 based on this invention is demonstrated. The cooler includes the first flow path forming means and the second flow path forming means, as in the first embodiment. The cooler in the present embodiment is different from the first embodiment in the shape of the heat dissipating member and the shape of the auxiliary pipe of the second flow path constituting means.

  FIG. 8 shows a schematic cross-sectional view of the cooler in the present embodiment. FIG. 8 is a schematic cross-sectional view when cut along a plane perpendicular to the main surface of the substrate. The cooler in the present embodiment includes an auxiliary pipe 13 formed so as to protrude from the surface of the main pipe 11. The auxiliary tube 13 is formed so that the cross-sectional shape is a mountain shape. The auxiliary tube 13 is formed in a tapered shape so that the flow path becomes narrower toward the substrate 1. The end face of the auxiliary tube 13 in the present embodiment is formed so as to be substantially parallel to the substrate 1.

  The cooler in the present embodiment includes a plate-like member 4. The plate-like member 4 has a notch 4a. The notch 4 a is formed so as to be inclined along the shape of the auxiliary pipe 13. The notch 4 a is inclined so that the cross-sectional shape becomes narrower toward the substrate 1. The notch 4 a is formed so that the plate-like member 4 is separated from the auxiliary pipe 13.

  In the present embodiment, the second refrigerant flowing in as shown by the arrow 52 is discharged from the auxiliary pipe 13 as shown by the arrow 55. When the second refrigerant is discharged from the auxiliary pipe 13, it is discharged along the flow of the first refrigerant indicated by the arrow 51. By forming the auxiliary pipe 13 in a tapered shape, the collision jet flow by the second refrigerant can be smoothly joined with the first refrigerant. Further, by changing the tapered shape of the auxiliary pipe, the pressure and flow rate of the collision jet can be easily adjusted.

  Further, since the cross-sectional shape of the auxiliary pipe 13 constituting the second flow path is tapered, the first refrigerant in the first flow path is likely to move closer to the substrate 1, and the second refrigerant after colliding with the substrate 1 is transferred to the substrate. You can stop by 1. For this reason, the cooling effect of the board | substrate 1 by a 2nd refrigerant | coolant can be improved. Further, the first refrigerant and the second refrigerant can be flowed in the first flow path, and the pressure loss due to the mixing of both refrigerants can be reduced.

  Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof will not be repeated here.

(Embodiment 4)
With reference to FIG. 9 and FIG. 10, the cooler in Embodiment 4 based on this invention is demonstrated. The cooler in the present embodiment includes third flow path forming means in addition to the first flow path forming means and the second flow path forming means. That is, the cooler in the present embodiment has a third flow path in addition to the first flow path and the second flow path. The third channel is formed so as to communicate with the second channel.

  In FIG. 9, the 1st schematic sectional drawing of the cooler in this Embodiment is shown. FIG. 9 is a schematic cross-sectional view when cut along a plane parallel to the main surface of the substrate. In FIG. 10, the 2nd schematic sectional drawing of the cooler in this Embodiment is shown. 10 is a cross-sectional view taken along line XX in FIG.

  Referring to FIGS. 9 and 10, the cooler in the present embodiment includes third flow path configuring means that configures a third flow path for discharging the refrigerant flowing in the second flow path. The third flow path forming means includes a separator plate 6. The separator 6 is disposed between the main pipe 11 and the substrate 1. The separator 6 is formed in a flat plate shape. Separator plate 6 is arranged such that the main surface is substantially parallel to the back surface of substrate 1. The separator plate 6 is disposed so as to divide the first flow path into two flow paths.

  The second flow path component in the present embodiment includes an auxiliary pipe 14. The auxiliary pipe 14 is disposed so as to penetrate the separator plate 6. The outlet of the auxiliary pipe 14 is disposed in a space sandwiched between the substrate 1 and the separator 6. The auxiliary tube 14 is fixed to the separator 6 without a gap. That is, a gap is not formed between the auxiliary tube 14 and the separator 6.

  The cooler in the present embodiment includes a plate-like member 7 as a heat radiating member. The plate-like member 7 is formed so as to penetrate the separator plate 6. The plate-like member 7 has a notch 7a. The notch 7a is formed so that the planar shape is circular. The notch 7 a is formed along the shape of the auxiliary pipe 14.

  In the present embodiment, a first flow path is formed by a space sandwiched between the main pipe 11 and the separator plate 6. Further, a third flow path is formed by a space sandwiched between the substrate 1 and the separator 6. A second flow path is formed by the main pipe 11 and the auxiliary pipe 14.

  The refrigerant supply device in the present embodiment is formed so as to supply the refrigerant directly to the first flow path and the second flow path, and is formed so as not to supply the refrigerant directly to the third flow path. Yes.

  In the present embodiment, the first flow path and the second flow path are isolated. The first refrigerant proceeds while cooling the plate-like member 7 as indicated by an arrow 51 in the first flow path. The second refrigerant is ejected from the auxiliary pipe 14 as indicated by an arrow 53 in the second flow path. The second refrigerant cools the back surface of the substrate 1 as a collision jet.

  The second refrigerant flows through the third flow path after colliding with the substrate 1. In the third flow path, it flows toward the discharge port as indicated by the arrow 56. In the third flow path, the second refrigerant proceeds while cooling the substrate 1 and the plate-like member 7. The first path is completely separated from the second path and the third path.

  In the cooler in the present embodiment, the path for cooling by the collision jet is separated from the path for cooling the heat radiating member. The second refrigerant for the collision jet and the first refrigerant for cooling the heat radiating member are not mixed. For this reason, interference of the 1st refrigerant | coolant which cools the thermal radiation member with respect to the 2nd refrigerant | coolant which produces a collision jet can be suppressed, and the cooling effect by a collision jet can be heightened.

  Or the cooler in this Embodiment can avoid mixing a 1st refrigerant | coolant and a 2nd refrigerant | coolant. For example, different refrigerants can be used as the first refrigerant and the second refrigerant. In this case, the refrigerant supply device may be a supply device including a first refrigerant circulation device and a second refrigerant circulation device different from the first refrigerant.

  Further, in the present embodiment, the plate member has a notch, and the notch is formed along the shape of the auxiliary pipe. Although the 2nd refrigerant | coolant ejected from an auxiliary pipe spreads radially along the shape of an auxiliary pipe, it can suppress that the expansion of a 2nd refrigerant | coolant is inhibited by a plate-shaped member by this structure.

  Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof will not be repeated here.

  In the respective drawings described above, the same or corresponding parts are denoted by the same reference numerals.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.

1 is a schematic exploded perspective view of a semiconductor device according to a first embodiment. 1 is a first schematic cross-sectional view of a semiconductor device in a first embodiment. FIG. 4 is a second schematic cross-sectional view of the semiconductor device in the first embodiment. FIG. 4 is a third schematic cross-sectional view of the semiconductor device in the first embodiment. FIG. 6 is a schematic exploded perspective view of a semiconductor device in a second embodiment. FIG. 6 is a first schematic cross-sectional view of a semiconductor device in a second embodiment. FIG. 6 is a second schematic cross-sectional view of the semiconductor device in the second embodiment. FIG. 10 is a schematic cross-sectional view of a semiconductor device in a third embodiment. FIG. 10 is a first schematic cross-sectional view of the semiconductor device in the fourth embodiment. FIG. 10 is a second schematic cross-sectional view of the semiconductor device in the fourth embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Board | substrate, 2, 4, 7 Plate-shaped member, 2a, 4a, 7a Notch part, 3 Bar-shaped member, 5 Wall member, 6 Separation plate, 11 Main pipe, 11a, 11b Flow path component board, 12-14 Auxiliary pipe, 12a end face, 21 semiconductor element, 51-56 arrow.

Claims (8)

A substrate for placing the power converter on one side;
A heat radiating member fixed to the other surface of the substrate, and a first flow path constituting means constituting a first flow path formed so that the refrigerant contacts the heat radiating member;
A second flow path constituting means constituting a second flow path formed so as to eject the refrigerant toward the region where the power converter is disposed in the other surface,
The cooler, wherein the second channel is formed separately from the first channel.   The cooler according to claim 1, wherein the heat radiating member includes at least one of a plate-like member and a rod-like member. The heat dissipating member is disposed around a region where the power converter is disposed,
The second flow path constituting means includes a main pipe disposed away from the other surface of the substrate;
An auxiliary pipe formed so as to protrude from the main pipe toward the substrate,
The auxiliary tube is disposed so as to face a region of the substrate where the power converter is disposed,
The cooler according to claim 1 or 2, wherein the first flow path includes a space sandwiched between the main pipe and the substrate. The auxiliary tube includes an end surface facing the substrate,
4. The cooler according to claim 3, wherein the end surface is inclined so that a flow path becomes larger along a direction of the refrigerant flowing through the first flow path forming unit.   The cooler according to claim 3 or 4, wherein the auxiliary pipe is formed in a tapered shape so as to become thinner toward the substrate. A third flow path constituting means for discharging the refrigerant flowing through the second flow path;
The third flow path constituting means includes a separator disposed between the main pipe and the substrate,
The auxiliary pipe is formed to penetrate the separator;
The cooler according to any one of claims 3 to 5, wherein the auxiliary pipe is fixed to the separator without a gap.   The cooler according to any one of claims 1 to 6, wherein the substrate is arranged so that a direction in which the one surface extends is either a vertical direction or a direction inclined with respect to the vertical direction.   The said board | substrate is a cooler in any one of Claim 1 to 6 arrange | positioned so that said one surface may face the lower side of a perpendicular direction.

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