JP2008106958A - Heat exchanger - Google Patents

Abstract

An object of the present invention is to realize a small and highly efficient heat exchange characteristic so that the configuration can be simplified and the heat transfer efficiency can be improved.
A heat exchanging unit 10 in which a coolant is circulated and supplied through a supply pipe 13 and a discharge pipe 14 is formed by a pipe 103 and a bypass pipe 104, and the pipe 103 and the bypass of the heat exchanging part 10 are formed. The Peltier element 17 is arranged to be thermally coupled to the pipe line 104, and the radiating fin 18 is arranged to be thermally coupled to the Peltier element 17, and the Peltier element 17 is driven and controlled. By controlling the heat transfer characteristics between the pipe line 103 and the bypass pipe line 104 of the heat exchange unit 10, heat exchange of the coolant circulated and supplied to the pipe line 103 and the bypass pipe line 104 of the heat exchange unit 10 is performed. Configured to do.
[Selection] Figure 1

Description

  The present invention relates to a heat exchanger that circulates and supplies a cooling liquid used in, for example, a cooling system for electronic components and controls the heat.

  In general, as a means for cooling or temperature-adjusting a beverage such as juice that is a fluid passing through a circulation pipe, a temperature adjustment device having a heat exchanger configuration using a Peltier element that is a thermoelectric element is known.

  Such a temperature control device forms a Peltier element module in which Peltier elements are arranged on a substrate, and this Peltier element module is connected to a flow member that constitutes a cooling part through which a flow pipe is inserted with a heat storage agent interposed therebetween. There has been proposed a structure that is thermally coupled and that cools or adjusts the temperature of a fluid that passes through a flow pipe inserted into the flow member using the Peltier element module and a heat storage agent (for example, patents). Reference 1).

  That is, this temperature adjustment device is used to cool or temperature the beverage by temporarily storing the amount of heat generated by driving the Peltier element module in the heat storage agent or transmitting it to the beverage passing through the flow pipe inserted into the flow member. Adjustments are made.

In addition, in such a Peltier element, for example, a cooling plate of a radiator is thermally coupled to a cooling surface of a thermomodule element that is, for example, a Peltier element, and heat is radiated to a heat generating surface of the thermomodule element. The heat generating plate with fins is thermally coupled. A plurality of heat pipes that are thermally coupled to the electronic component are connected to the cooling plate by using a mounting plate and thermally coupled, and the heat of the electronic component is cooled via the heat pipe and the mounting plate. When the heat is transferred to the plate at once, the heat is transferred to the heat generating plate with fins through the thermo module element to dissipate the heat, and applied to the cooling device that controls the heat of the electronic components. Is also known (see, for example, Patent Document 2).
JP 2002-13859 A Japanese Utility Model Publication No. 61-41244

  However, in the temperature control device proposed in Patent Document 1, the Peltier element module is disposed directly or through a heat storage agent on the flow member inserted through the flow pipe, and the Peltier element module and In order to increase the temperature control capability of the Peltier element module, a large transmission area is required to increase the temperature control capability in the configuration that adjusts the temperature of the fluid transferred into the flow pipe using the heat storage agent. Therefore, there is an inconvenience that the apparatus becomes large.

  Further, in the cooling device proposed in Patent Document 2 above, in order to increase the cooling capacity, the thermo module element is similarly cooled by being thermally coupled to a cooling plate connected to a heat pipe. If the heat transfer amount of the thermomodule element is improved, a large transfer area is required, which increases the size.

  The present invention has been made in view of the above circumstances, and is a compact heat exchanger that realizes heat exchange characteristics that are small and highly efficient so that the configuration can be simplified and heat transfer efficiency can be improved. The purpose is to provide.

  The present invention relates to a cooling pipe through which cooling liquid is circulated and a heat exchange section that is arranged in an intermediate portion of the cooling pipe and is formed by a pipe through which the cooling liquid from the cooling pipe is circulated. A Peltier element that is thermally coupled to the pipe line of the section, and a pipe of the heat exchange section that is disposed opposite to the pipe line of the heat exchange section with the Peltier element interposed therebetween. Radiation fins that are thermally coupled to the path and drive control of the Peltier element to control the heat transfer characteristics between the radiation fins and the heat exchanging part, and to circulate and supply cooling liquid to the cooling pipe And a drive control means for configuring the heat exchanger.

  According to the above configuration, when the refrigerant liquid from the cooling pipe is supplied to the pipe line, the heat exchange part directly absorbs the heat of the cooling liquid led to the pipe line by the Peltier element. Then, heat is directly transferred from the Peltier element to the radiating fin to dissipate heat, and heat exchange of the coolant in the pipe is performed. Thereby, high efficiency of the heat transfer characteristic between the Peltier element, the heat exchange part, and the radiation fin is realized, and it is possible to achieve high efficiency of the heat exchange characteristic while ensuring miniaturization.

  As described above, according to the present invention, it is possible to provide a heat exchanger that realizes a small and highly efficient heat exchange characteristic so that the configuration can be simplified and the heat transfer efficiency can be improved. Can do.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a heat exchanger according to an embodiment of the present invention, and a cooling target 11 such as an electronic component is mounted on a liquid supply port 101 of a heat exchanging section 10 which is a feature of the present invention. The liquid outlet of the cooling plate 12 is connected via a supply pipe 13 formed of a metal material such as aluminum or copper constituting the cooling pipe. Then, one end of a return pipe 14 made of a metal material such as aluminum or copper constituting the cooling pipe is connected to the liquid discharge port 102 of the heat exchanging unit 10, and the other end of the return pipe 14 is circulated. The pump 15 is connected to the liquid inlet of the cooling plate 12.

  A drive control unit 16 is connected to the circulation pump 15, and the drive control is selectively performed via the drive control unit 16. The circulation pump 16 circulates and supplies a coolant such as cooling water to the return pipe 14, the cooling plate 12, the supply pipe 13, and the heat exchange unit 10 by driving.

  For example, as shown in FIG. 2, the heat exchanging unit 10 is formed by connecting a pipe 103 formed of a metal material such as aluminum or copper into a ring-like rectangular shape, and the pipe 103 is opposed to the pipe 103. On both sides, the liquid supply port 101 and the liquid discharge port 102 are provided in a substantially central portion thereof. The supply pipe 13 and the return pipe 14 are connected to the liquid supply port 101 and the liquid discharge port 102. Between both sides forming the liquid supply port 101 and the liquid discharge port 102 of the conduit 10, a plurality of, for example, six bypass conduits 104 formed of a metal material such as aluminum or copper are provided at a predetermined interval substantially in parallel. Is installed and connected by piping.

  When the coolant is supplied from the supply pipe 13 to the liquid supply port 101, the heat exchange unit 10 is circulated through the pipe 103 and the bypass pipe 104 and discharged from the liquid discharge port 102 to the return pipe 14. Is done.

  Further, in the heat exchanging unit 10, the opposite pipe wall portions of the pipe 102 and the bypass pipe 104 arranged in parallel (one side wall of the pipe 103 and the pipe axis of the bypass pipe 104 are sandwiched. The Peltier elements 17 whose details will be described later are respectively thermally coupled to both the pipe walls. Further, between the Peltier elements 17 that are thermally coupled to the pipe walls of the pipe line 103 and the bypass pipe line 104 and opposed to each other, there are radiating fins 18 formed of a metal material such as aluminum and copper, respectively. Thermally coupled. For example, the heat radiating fins 18 are arranged substantially orthogonal to the tube axis direction of the bypass conduit 104.

  For example, as shown in FIG. 3, the Peltier element 17 has a plurality of electrodes on two heat conductive insulating bases 171 and 171 made of a material having excellent heat conductivity such as alumina and alumina nitride and having excellent electric insulation. 172 and 172 are linearly arranged and formed along the pipe walls of the pipe 103 and the bypass pipe 104 by a known printing method or the like, and the electrodes 172 and 172 of the two heat conductive insulating bases 171 and 171 are formed. P-type and N-type semiconductors 173 and 174 are sandwiched between the P-type and N-type semiconductors 173 and 174. The two heat conductive insulating bases 171 and 171 are disposed directly and thermally coupled to the pipe walls of the pipe 103 and the bypass pipe 104 and the heat radiating fins 18.

  The Peltier element 17 is connected to the drive control unit 16, and is driven and controlled via the drive control unit 16. When a voltage is applied between the electrodes 172 and 172 by the drive control unit 16, the Peltier element 17 drives the P-type and N-type semiconductors 173 and 174, and the pipe 103 and the bypass of the heat exchange unit 10. The heat of the coolant in the pipe line 104 is absorbed and transferred to the radiation fin 18.

  Note that the heat conductive insulating bases 171 and 171 constituting the Peltier element 17 are not positioned and arranged at predetermined intervals by the P-type and N-type semiconductors 173 and 174, for example, using a support structure (not shown). The positioning may be performed. Further, as the Peltier element 17, the P-type and N-type semiconductors 173 and 174 may be arranged in a plurality of rows in parallel on the heat conductive insulating bases 171 and 171.

  In the heat exchange unit 10, for example, a blower fan 19 is disposed so as to face the pipe line 103 and the bypass pipe line 104. When the drive control unit 16 is connected to the blower fan 19 and is driven via the drive control unit 16, heat is supplied to the pipe 103 and the bypass pipe 104 of the heat exchange unit 10 via the Peltier element 17. The radiating fins 18 are forcibly air-cooled by blowing air toward the radiating fins 18 (in the direction of the paper surface in FIG. 3), thereby promoting the heat radiation characteristics.

  In the above configuration, when the cooling target 11 generates heat, the cooling plate 12 receives the heat of the cooling target 11 and the built-in coolant is heated. Here, the drive control unit 16 drives and controls the circulation pump 15 based on a detection signal of a temperature sensor (not shown), for example, and supplies the heated coolant via the supply pipe 13 to the liquid supply port 101 of the heat exchange unit 10. Is circulated and supplied into the conduit 103 and the bypass conduit 104.

  At the same time, the drive control unit 16 drives and controls the Peltier element 17 and drives and controls the blower fan 19. Then, the Peltier element 17 directly absorbs the heat of the coolant guided to the pipe line 103 and the bypass pipe line 104 of the heat exchanging unit 10 from the pipe wall and transfers the heat to the radiating fins 18.

  Here, the heat radiating fin 18 is blown from the blower fan 19, so that the heat transferred from the Peltier element 17 is forcibly radiated to the outside. Thereby, the cooling liquid led from the liquid supply port 101 of the heat exchange unit 10 to the pipe line 103 and the bypass pipe line 104 is cooled, and the cooling plate 12 is returned from the liquid discharge port 102 via the return pipe 14. Then, the heat of the object 11 to be cooled is taken again and circulated and supplied to the liquid supply port 101 of the heat exchanging section 10 via the supply pipe 13, and the heat exchange is performed in the same manner.

  As described above, the heat exchanger forms the heat exchange unit 10 in which the coolant is circulated and supplied through the supply pipe 13 and the discharge pipe 14 with the pipe line 103 and the bypass pipe line 104. The Peltier element 17 is thermally coupled to the pipe line 103 and the bypass line 104, and the heat dissipation fins 18 are thermally coupled to the Peltier element 17 so that the Peltier element 17 is driven and controlled. Then, by controlling the heat transfer characteristics between the heat radiation fin 18 and the pipe line 103 and the bypass pipe line 104 of the heat exchange unit 10, the heat is supplied to the pipe line 103 and the bypass pipe line 104 of the heat exchange unit 10. The cooling liquid was configured to perform heat exchange.

  According to this, when the refrigerant liquid from the supply pipe 13 is supplied to the liquid supply port 101, the heat exchange unit 10 circulates through the pipe line 103 and the bypass pipe line 104, and from the liquid discharge port 102. It is discharged to the return pipe 14. Here, the heat of the coolant in the conduit 103 and the bypass conduit 104 is directly absorbed by the Peltier element 17 and directly transferred from the Peltier element 107 to the radiation fin 18 to be dissipated. Heat exchange of the coolant in the pipe line 103 and the bypass pipe line 104 is performed.

  As a result, the heat transfer characteristic between the Peltier element 17 and the heat exchanging unit 10 and the heat radiating fins 18 can be made highly efficient, and the heat exchange characteristic can be made highly efficient while ensuring miniaturization. .

  And since the heat exchanging part 10 is separated from the cooling plate 12 on which the cooling target 11 is mounted in this way, and it becomes possible to realize highly efficient thermal control, the peripheral part of the cooling target 11 Since the mounting density of components can be improved, the degree of freedom in designing can be obtained.

  Further, a plurality of, for example, as shown in FIG. 4, a plurality of the heat exchange units 10 in which the six bypass pipes 104 are installed in a rectangular pipe 103 at a predetermined interval and are connected substantially in parallel. Three of them may be arranged side by side and connected to the supply pipe 13 and the return pipe 14, respectively. By arranging a plurality of heat exchanging units 10 side by side in this way, it is possible to further increase the amount of heat exchange, and thus it can be applied to various heat exchange systems.

  The present invention is not limited to the above-described embodiment, and, in addition, for example, the heat exchange units 20 and 21 shown in FIGS. 5 and 6 are configured to be connected between the supply pipe 13 and the return pipe 14. Similarly, an effective effect is expected. However, in the description of FIGS. 5 and 6, for the sake of convenience, the same portions as those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The heat exchanging unit 20 in FIG. 5 has a pipe 201 formed in a substantially rectangular shape, and a liquid supply port 202 connected to the supply pipe 13 and the return pipe 14 on both opposing sides of the pipe 201. Liquid discharge ports 203 are provided alternately on one end side and the other end side. A plurality of, for example, three bypass pipes 204 are installed between the sides where the liquid supply port 202 and the liquid discharge port 203 are provided, and are connected in a pipe with a predetermined interval.

  Further, the pipe wall portion and the bypass pipe line 204 that are arranged in parallel face each other on the pipe wall portions (one pipe wall of the pipe line 201 and both pipe walls sandwiching the pipe axis of the bypass pipe line 204). The Peltier elements 17 are arranged thermally coupled to each other. The radiating fins 18 are interposed between the Peltier elements 17 that are thermally coupled to the pipe walls of the pipe line 201 and the bypass pipe line 204 and are thermally coupled to each other.

  The supply pipe 13 and the return pipe 14 are connected to the liquid supply port 202 and the liquid discharge port 203 of the heat exchange unit 20. When the coolant is supplied from the supply pipe 13 to the liquid supply port 202, the heat exchanging unit 20 is circulated to the pipe line 201 and the bypass pipe line 204 and discharged from the liquid discharge port 203 to the return pipe 14. Is done.

  The heat exchanging unit 30 in FIG. 6 has, for example, four folded portions 303 at a predetermined interval in the middle portion of a pipe 304 provided with a liquid supply port 301 at one end and a liquid discharge port 302 at the other end. Formed. On the inner wall side of the pipe 304 facing the folded portion 303, the Peltier elements 17 are arranged along the pipe wall and are thermally coupled. The radiating fins 18 are interposed between the Peltier elements 17 that are thermally coupled to the tube wall and disposed opposite to each other, and are thermally coupled to each other.

  The supply pipe 13 and the return pipe 14 are connected to the liquid supply port 301 and the liquid discharge port 302 of the heat exchange unit 30. When the coolant is supplied from the supply pipe 13 to the liquid supply port 301, the heat exchange unit 30 is circulated in turn to the folded portion 303 of the pipe 304, and is discharged from the liquid discharge port 302 to the return pipe 14. Is done.

  5 and FIG. 6 also has a configuration in which the blower fan 19 is disposed so as to face the radiating fin 18 and the blast fan 19 blows air to the radiating fin 18. Therefore, further effective effects are expected.

  Further, for example, a plurality of the heat exchanging units 20 and 30 shown in FIGS. 5 and 6 are arranged in parallel, and the plurality of heat exchanging units 20 and 30 are respectively connected to the supply pipe 13 and the return pipe 14. It may be arranged and configured so that the coolant is circulated and connected to the pipe.

  Furthermore, the pipe configuration of the heat exchange units 10, 20, and 30 is not limited to the pipe configuration described in each of the above embodiments, and various other pipe configurations are possible and similarly effective. Be expected.

  Moreover, although the case where it applied to the cooling of an electronic device was demonstrated in the said embodiment, it is applicable not only to this but various heat exchange systems, such as a water cooling type cooling structure, and the same effect There is expected.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention in the implementation stage. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the figure which showed schematic structure of the heat control system to which the heat exchanger which concerns on one embodiment of this invention is applied. It is the figure which extracted and showed the heat exchange part of FIG. It is the figure which expanded and showed the principal part of the heat exchange part of FIG. It is the figure which showed the other Example of the heat exchanger of FIG. It is the figure which showed the principal part of the heat exchanger which concerns on other embodiment of this invention. It is the figure which showed the principal part of the heat exchanger which concerns on other embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Heat exchange part, 101 ... Liquid supply port, 102 ... Liquid discharge port, 103 ... Pipe line, 104 ... Bypass line, 11 ... Cooling object, 12 ... Cooling plate, 13 ... Supply pipe, 14 ... Return pipe, 15 DESCRIPTION OF SYMBOLS ... Circulation pump, 16 ... Drive control part, 17 ... Peltier device, 171 ... Thermal conduction insulation base, 172 ... Electrode, 173 ... P-type semiconductor, 174 ... N-type semiconductor, 18 ... Radiation fin, 19 ... Blower fan, 20 ... Heat exchange section, 201 ... pipe, 202 ... liquid supply port, 203 ... liquid discharge port, 204 ... bypass pipe, 30 ... heat exchange section, 301 ... liquid supply port, 302 ... liquid discharge port, 303 ... folding section, 304: Pipe line.

Claims (5)

Cooling piping through which coolant is circulated,
A heat exchanging portion formed in a pipe line that is arranged in an intermediate portion of the cooling pipe and in which a coolant from the cooling pipe is circulated;
A Peltier element that is thermally coupled to the conduit of the heat exchange section;
A heat dissipating fin that is disposed opposite to the pipe line of the heat exchange part across the Peltier element, and is thermally coupled to the pipe line of the heat exchange part via the Peltier element,
Drive control means for driving the Peltier element to control heat transfer characteristics between the heat dissipating fins and the heat exchange unit, and a drive control means for circulatingly supplying a coolant to the cooling pipe;
The heat exchanger characterized by comprising.   The heat exchanger according to claim 1, wherein the heat exchange section includes a plurality of pipe lines arranged substantially in parallel.   The heat exchanger according to claim 1, wherein a plurality of the heat exchange units are arranged in parallel.   The Peltier element is formed by connecting an N-type and a P-type semiconductor in series to an electrode provided on a heat conductive insulating base. The heat exchanger according to any one of claims 1 to 3, wherein the heat exchanger is combined.   The heat exchanger according to claim 1, further comprising a blower fan that blows air to the heat radiation fins.

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