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JP2007245029A - Substrate cleaning device - Google Patents

Substrate cleaning device Download PDF

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Publication number
JP2007245029A
JP2007245029A JP2006073169A JP2006073169A JP2007245029A JP 2007245029 A JP2007245029 A JP 2007245029A JP 2006073169 A JP2006073169 A JP 2006073169A JP 2006073169 A JP2006073169 A JP 2006073169A JP 2007245029 A JP2007245029 A JP 2007245029A
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substrate
mixed
cleaning apparatus
liquid
cleaning
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Kiyoshi Shimada
清 嶋田
Kazuo Hatake
一男 畠
Setsuo Shibuya
節男 渋谷
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SPC Electronics Corp
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SPC Electronics Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cleaning device which has no problem for re-contamination, facilitates wastewater disposal and saves the operation cost of the device. <P>SOLUTION: In the substrate 1 cleaning device in which a substrate 1 is continuously transferred by a plurality of rollers 2 and cleaned and dried, a cleaning means includes a mixed liquid 5 mixing a solid material, a pressurized gas and a mixed liquid spraying nozzle 3, and sprays the mixed liquid 5 toward the substrate 1 by the pressurized gas from the mixed liquid spraying nozzle 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、板状電子部材の洗浄装置に係り、詳しくは、レアメタル、シリコン、フラットパネルディスプレイ用ガラス等を、洗剤に代わる水溶性無機塩等により洗浄する基板洗浄装置に関する。   The present invention relates to a plate-type electronic member cleaning apparatus, and more particularly to a substrate cleaning apparatus for cleaning rare metals, silicon, glass for flat panel displays, and the like with a water-soluble inorganic salt or the like instead of a detergent.

図4は、従来の接触式洗浄装置の洗浄部を示す装置構成図である。基板1は駆動ローラ2により駆動され、ガイドローラ7によって洗浄装置内の搬送経路を誘導され、安定して移送される。基板1の面上には、界面活性剤を含んだ洗浄液が注がれ(図示されず)、回転洗浄ブラシ6により接触洗浄が行われることで油脂分及び異物が除去され、洗浄が完了する。   FIG. 4 is an apparatus configuration diagram showing a cleaning section of a conventional contact cleaning apparatus. The substrate 1 is driven by the driving roller 2, guided by the guide roller 7 through the transport path in the cleaning device, and stably transferred. A cleaning liquid containing a surfactant is poured onto the surface of the substrate 1 (not shown), and contact cleaning is performed by the rotary cleaning brush 6 to remove oil and fat and foreign matters, thereby completing the cleaning.

この洗浄方法は、一度除去された油脂分や異物が回転洗浄ブラシ6に蓄積されて汚染源となる再汚染の問題や、常に回転洗浄ブラシ6が均等に基板1へ接触しているよう管理する必要から、運用が煩雑になり易い問題があった。さらに、洗浄剤を用いた洗浄液が高環境負荷となり、洗浄剤を含む洗浄液の廃水処理に時間と費用が多く必要となる問題があった。   This cleaning method must be managed so that the oil and fat and foreign matters once removed are accumulated in the rotary cleaning brush 6 and become a contamination source, and the rotary cleaning brush 6 is always in contact with the substrate 1 evenly. Therefore, there is a problem that the operation tends to be complicated. Furthermore, there has been a problem that a cleaning liquid using a cleaning agent has a high environmental load, and it takes a lot of time and money to treat the waste water of the cleaning liquid containing the cleaning agent.

再汚染の問題を解決するため、高圧ポンプにより洗浄液を高圧で基板に噴射し、洗浄する非接触式洗浄装置が開発されたが、高圧で洗浄液を吹付けるため、高価な高圧ポンプが必要となる。また、洗浄液の量を軽減することが困難であるため、洗浄力が高く、廃水処理が容易な洗浄液の開発が行われている。特許文献1には、洗剤洗浄装置と高圧スプレー洗浄装置とを備えた洗浄設備の記載がされている。
特開2004−174308号公報
In order to solve the problem of recontamination, a non-contact type cleaning device has been developed in which cleaning liquid is sprayed onto a substrate with a high-pressure pump to perform cleaning. However, an expensive high-pressure pump is required to spray the cleaning liquid at a high pressure. . Further, since it is difficult to reduce the amount of the cleaning liquid, a cleaning liquid having high cleaning power and easy wastewater treatment has been developed. Patent Document 1 describes a cleaning facility including a detergent cleaning device and a high-pressure spray cleaning device.
JP 2004-174308 A

本発明は、このような問題を解決するためになされたものであり、その目的は、再汚染の問題がなく、廃水処理が簡単で、且つ装置、運用コストを抑えることができる基板洗浄装置を提供することにある。   The present invention has been made in order to solve such a problem, and an object of the present invention is to provide a substrate cleaning apparatus that does not have the problem of recontamination, that is easy to treat waste water, and that can suppress the operation cost. It is to provide.

本発明の基板洗浄装置は、基板を複数のローラ又は液体又は気体を基板に噴射しながら基板を浮上させローラで連続して搬送し、基板を洗浄手段と乾燥手段により洗浄及び乾燥処理する基板洗浄装置において、洗浄手段は、固形物を混合した混合液と、加圧された気体と、混合液噴射ノズルとを有し、基板に向けて、混合液を加圧された気体により混合液噴射ノズルから噴射させることを特徴とする。   The substrate cleaning apparatus of the present invention is a substrate cleaning apparatus in which a substrate is floated while being sprayed onto a plurality of rollers or a liquid or gas onto the substrate and continuously conveyed by the rollers, and the substrate is cleaned and dried by the cleaning means and the drying means. In the apparatus, the cleaning means includes a mixed liquid obtained by mixing solids, a pressurized gas, and a mixed liquid injection nozzle, and the mixed liquid injection nozzle is formed by the pressurized gas toward the substrate. It is made to inject from.

本発明の基板洗浄装置は、基板を複数のローラ又は液体又は気体を基板に噴射しながら基板を浮上させローラで連続して搬送し、基板を洗浄手段と乾燥手段により洗浄及び乾燥処理する基板洗浄装置において、洗浄手段は、固形物を混合した混合気体と液体を混合噴射する混合液噴射ノズルとを有し、基板に向けて、固形物を混合した混合気体と液体とを加圧された気体により混合液噴射ノズルから噴射させることを特徴とする。   The substrate cleaning apparatus of the present invention is a substrate cleaning apparatus in which a substrate is floated while being sprayed onto a plurality of rollers or a liquid or gas onto the substrate and continuously conveyed by the rollers, and the substrate is cleaned and dried by the cleaning means and the drying means. In the apparatus, the cleaning means has a mixed gas injection nozzle for mixing and injecting a mixed gas mixed with a solid and a liquid, and a gas in which the mixed gas and liquid mixed with a solid are pressurized toward the substrate It is made to inject from a liquid mixture injection nozzle by this.

本発明の基板洗浄装置の固形物の硬度が、基板の硬度以下であることを特徴とする。   The substrate cleaning apparatus according to the present invention is characterized in that the solid material has a hardness equal to or lower than the hardness of the substrate.

本発明の基板洗浄装置の固形物は、炭酸水素ナトリウム(NaHCO)、セスキ炭酸ナトリウム(NaHCO・NaCO・2HO)、ウエグシャイダー塩(3NaHCO・NaCO)、炭酸ソーダ1水塩(NaCO・HO)、又は炭酸ソーダ10水塩(NaCO・10HO)の各水溶性塩類の中から選択された単独粒又は複数の混合粒から成ることを特徴とする。 Solids of the substrate cleaning apparatus of the present invention are sodium hydrogen carbonate (NaHCO 3 ), sodium sesquicarbonate (NaHCO 3 · Na 2 CO 3 · 2H 2 O), Weigshaider salt ( 3 NaHCO 3 · Na 2 CO 3 ), A single grain or a plurality of mixed grains selected from water-soluble salts of sodium carbonate monohydrate (Na 2 CO 3 .H 2 O) or sodium carbonate 10 water salt (NaCO 3 .10H 2 O) It is characterized by that.

本発明の基板洗浄装置の固形物は、重炭酸アンモニウム(NHHCO)、炭酸ソーダ(NaCO)、炭酸カルシウム(CaCO)、又は炭酸カリウム(KCO)の各水溶性塩類の中から選択された単独粒又は複数の混合粒から成ることを特徴とする。 The solid material of the substrate cleaning apparatus of the present invention is composed of water-soluble salts of ammonium bicarbonate (NH 4 HCO 3 ), sodium carbonate (Na 2 CO 3 ), calcium carbonate (CaCO 3 ), or potassium carbonate (KCO 3 ). It consists of a single grain selected from among or a plurality of mixed grains.

本発明の基板洗浄装置の固形物は、粒状又は棒状の樹脂を単独又は複数混合したものであることを特徴とする。   The solid substance of the substrate cleaning apparatus of the present invention is characterized by being a single or a mixture of granular or rod-like resins.

本発明の基板洗浄装置の固形物の形状はミクロン単位であり、材質はポリプロピレン(PP)、ポリエチレン(PE)、ポリエチレンテレフタラート(PET)、又はナイロンであることを特徴とする。   The solid state of the substrate cleaning apparatus of the present invention is in units of microns, and the material is polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or nylon.

本発明の基板洗浄装置は、また、基板を複数のローラ又は液体又は気体を基板に噴射しながら基板を浮上させローラで連続して搬送し、基板を洗浄手段と乾燥手段により洗浄及び乾燥処理する基板洗浄装置において、洗浄手段は、固形物を混合した混合液体と気体を混合噴射する混合液噴射ノズルとを有し、基板に向けて、混合液体を加圧された気体により混合液噴射ノズルから噴射させることを特徴とする。   In the substrate cleaning apparatus of the present invention, the substrate is floated while being sprayed onto a plurality of rollers or liquid or gas onto the substrate, and is continuously transported by the rollers, and the substrate is cleaned and dried by the cleaning means and the drying means. In the substrate cleaning apparatus, the cleaning means has a mixed liquid in which solids are mixed and a mixed liquid injection nozzle that mixes and injects the gas, and the mixed liquid is directed from the mixed liquid injection nozzle by the pressurized gas toward the substrate. It is made to inject.

本発明の基板洗浄装置の気体は、空気又は水蒸気あるいは空気と水蒸気を混合した気体であることを特徴とする。   The gas of the substrate cleaning apparatus of the present invention is air, water vapor, or a gas in which air and water vapor are mixed.

本発明の基板洗浄装置の混合液中の固形物は、空気又は水蒸気あるいは空気と水蒸気を混合した気体であることを特徴とする。   The solid substance in the mixed solution of the substrate cleaning apparatus of the present invention is air, water vapor, or a gas obtained by mixing air and water vapor.

本発明の基板洗浄装置によれば、ブラシによる再汚染の問題がなく、洗浄用の混合液は少量で従来と同等の洗浄効果があり、且つ排水基準が示す中性の範囲内であるため廃水処理が簡単で、高価な高圧ポンプを必要としないことから、装置及び運用コストを抑えることができる基板洗浄装置を提供することが可能となる。   According to the substrate cleaning apparatus of the present invention, there is no problem of re-contamination by the brush, the cleaning liquid is small and has the same cleaning effect as the conventional one, and is within the neutral range indicated by the drainage standards. Since the process is simple and an expensive high-pressure pump is not required, it is possible to provide a substrate cleaning apparatus capable of suppressing the apparatus and the operation cost.

図1は、本発明の非接触式洗浄装置の洗浄部を示す装置構成図である。図1において、基板1は浮上機構4により浮上した状態で送り込まれてくる。送り込まれた基板1は、混合液噴射ノズル3の噴射状況に関わらず、駆動ローラ2によって洗浄装置内の搬送経路を誘導され、安定して移送される。基板1の面上には、固形物を混合した混合液5が混合液噴射ノズル3から噴射され、油脂分及び異物を除去することにより洗浄が行われる。混合液5は、通常の加圧ポンプにより加圧された圧縮空気により混合液噴射ノズル3から噴射される。洗浄が終了すると、基板1は基板乾燥部(図示されず)へと移送される。   FIG. 1 is an apparatus configuration diagram showing a cleaning unit of a non-contact type cleaning apparatus of the present invention. In FIG. 1, the substrate 1 is sent in a state of being levitated by the levitating mechanism 4. Regardless of the jetting state of the mixed liquid jet nozzle 3, the fed substrate 1 is guided by the driving roller 2 through the transport path in the cleaning device and is stably transferred. On the surface of the substrate 1, the mixed liquid 5 mixed with the solid material is sprayed from the mixed liquid spray nozzle 3, and cleaning is performed by removing oil and fat and foreign matters. The liquid mixture 5 is injected from the liquid mixture injection nozzle 3 by compressed air pressurized by a normal pressure pump. When the cleaning is completed, the substrate 1 is transferred to a substrate drying unit (not shown).

混合液5は固形物を混合した水溶液である。この固形物は、炭酸水素ナトリウム(NaHCO)、セスキ炭酸ナトリウム(NaHCO・NaCO・2HO)、ウエグシャイダー塩(3NaHCO・NaCO)、炭酸ソーダ1水塩(NaCO・HO)、又は炭酸ソーダ10水塩(NaCO・10HO)の各水溶性塩類の中から選択された単独粒又は複数の混合粒から成る。また、重炭酸アンモニウム(NHHCO)、炭酸ソーダ(NaCO)、炭酸カルシウム(CaCO)、又は炭酸カリウム(KCO)の各水溶性塩類の中から選択された単独粒又は複数の混合粒であっても良い。さらに、粒状又は棒状のポリプロピレン(PP)、ポリエチレン(PE)、ポリエチレンテレフタラート(PET)、又はナイロンを材質とする樹脂を単独又は複数混合したものであっても良い。 The mixed solution 5 is an aqueous solution in which solids are mixed. The solids were sodium hydrogen carbonate (NaHCO 3 ), sodium sesquicarbonate (NaHCO 3 · Na 2 CO 3 · 2H 2 O), Wegschider salt ( 3 NaHCO 3 · Na 2 CO 3 ), sodium carbonate monohydrate ( Na 2 CO 3 .H 2 O) or sodium carbonate 10 hydrate (NaCO 3 .10H 2 O), each consisting of a single particle or a plurality of mixed particles selected from water-soluble salts. In addition, a single grain or a plurality selected from water-soluble salts of ammonium bicarbonate (NH 4 HCO 3 ), sodium carbonate (Na 2 CO 3 ), calcium carbonate (CaCO 3 ), or potassium carbonate (KCO 3 ) May be mixed grains. Furthermore, granular or rod-like polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or a resin made of nylon may be used alone or in combination.

主に使用される水溶性無機塩は、炭酸水素ナトリウム(NaHCO)、セスキ炭酸ナトリウム(NaHCO・NaCO・2HO)、ウエグシャイダー塩(3NaHCO・NaCO)、炭酸ソーダ1水塩(NaCO・HO)、又は炭酸ソーダ10水塩(NaCO・10HO)であり、これらは常温で水に溶解してもPHは排水基準の中性(水質汚濁防止法ではPH5.8〜8.6)の範囲内にあり、概ね8.0を示す。従って、これら水溶性塩類又は樹脂の固形物を任意に混合した混合液は中性であるため、廃水処理の負担を著しく軽減することが可能となる。また洗浄力を期待するときには、35〜80℃程度に加温することにより、弱アルカリ性を示すようになり、微粒子などの除去、油分などの有機物に対する洗浄力が向上する。その上洗浄後は、廃液を常温に戻せば、廃水処理の負担を著しく軽減することが可能となるPH5.8〜8.6の範囲になり、環境にも大変優れた洗浄装置となる。 Water-soluble inorganic salts mainly used are sodium hydrogen carbonate (NaHCO 3 ), sodium sesquicarbonate (NaHCO 3 · Na 2 CO 3 · 2H 2 O), Weigshaider salt ( 3 NaHCO 3 · Na 2 CO 3 ), Sodium carbonate monohydrate (Na 2 CO 3 · H 2 O) or sodium carbonate 10 hydrate (NaCO 3 · 10H 2 O), even if these are dissolved in water at room temperature, PH is neutral based on wastewater It is within the range of PH 5.8 to 8.6 in the water pollution prevention method, and generally shows 8.0. Therefore, since the liquid mixture which arbitrarily mixed these water-soluble salts or resin solids is neutral, it becomes possible to remarkably reduce the burden of wastewater treatment. In addition, when expecting detergency, by heating to about 35 to 80 ° C., weak alkalinity is exhibited, and the detergency for organic substances such as oil is improved. In addition, if the waste liquid is returned to room temperature after washing, the wastewater treatment burden can be remarkably reduced to a pH range of 5.8 to 8.6, which makes the washing apparatus extremely excellent in the environment.

混合液の状態でこれら水溶性塩類の粒径又は樹脂の形状を数ミクロンとすることで従来と同等の洗浄効果が得られ、洗浄時間も短縮される。また混合液噴射ノズル3から噴射される混合液5は、例えば水溶性塩類と水と圧縮空気とが混合したものであるため、廃水処理される廃水の処理量は、洗浄剤を含む廃水量に比べて軽減することができる。粒径又は形状が数ミクロンの水溶性塩類又は樹脂の硬度は5以下であるため、硬度5のガラスの表面を傷つけることなく異物を除去することができる。これにより、噴射圧力を10Mパスカルから5Mパスカル以下にすることが可能となり、加圧ポンプの性能を軽減できるため、装置コストの軽減が図れる。   By making the particle size of these water-soluble salts or the shape of the resin several microns in the state of a mixed solution, a cleaning effect equivalent to the conventional one can be obtained and the cleaning time can be shortened. Moreover, since the liquid mixture 5 injected from the liquid mixture injection nozzle 3 is, for example, a mixture of water-soluble salts, water, and compressed air, the amount of wastewater to be treated is the amount of wastewater containing a cleaning agent. It can be reduced compared. Since the water-soluble salt or resin having a particle size or shape of several microns has a hardness of 5 or less, foreign matter can be removed without damaging the surface of the glass having a hardness of 5. Thereby, the injection pressure can be reduced from 10 M Pascal to 5 M Pascal and the performance of the pressurizing pump can be reduced, so that the device cost can be reduced.

図2は、混合液噴射ノズルにおいて、液体、固体及び気体が混合されて噴射される状態を示す混合液噴射模式図である。混合液噴射ノズル3には、液体と、気体又は水蒸気或いは気体+水蒸気と、固体+気体又は固体+液体とが、3方向から注入され、混合されて基板1に向けて噴射される。基板1に付着している強固な異物も、噴射される固形物による衝撃により剥離されて除去される。   FIG. 2 is a mixed liquid injection schematic diagram showing a state in which liquid, solid and gas are mixed and injected in the mixed liquid injection nozzle. Liquid, gas or water vapor or gas + water vapor, and solid + gas or solid + liquid are injected into the mixed liquid injection nozzle 3 from three directions, mixed, and injected toward the substrate 1. Strong foreign matter adhering to the substrate 1 is also peeled off and removed by the impact of the injected solid matter.

図3は、複数の混合液噴射ノズルを用いた洗浄装置の構成を示す洗浄装置構成図である。洗浄装置の筐体10には、複数の混合液噴射ノズル3が取り付けられ、その直下の基板1は、駆動ローラ2により搬送されている。筐体10と一体を成す混合液貯留部11には、洗浄後の混合液が蓄えられ、液体と固体に分離される。液体は、ポンプ9により加圧されて、混合液噴射ノズル3に注入される。分離され、わずかの液体が残る固形物は、アスピレータ8において加圧された気体と混合されて混合液噴射ノズル3に注入される。混合液噴射ノズル3においては、これらの固形物、液体、及び気体が混合され、気体の圧力により基板1の面上に噴射されて、洗浄が行われる。   FIG. 3 is a configuration diagram of a cleaning device showing a configuration of a cleaning device using a plurality of mixed liquid injection nozzles. A plurality of liquid mixture injection nozzles 3 are attached to the casing 10 of the cleaning apparatus, and the substrate 1 immediately below the nozzles 1 is conveyed by a driving roller 2. The mixed liquid storage unit 11 that is integrated with the housing 10 stores the mixed liquid after washing and separates the liquid into a solid. The liquid is pressurized by the pump 9 and injected into the mixed liquid injection nozzle 3. The solid matter that is separated and leaves a small amount of liquid is mixed with the pressurized gas in the aspirator 8 and injected into the mixed liquid injection nozzle 3. In the mixed liquid injection nozzle 3, these solid matter, liquid, and gas are mixed and injected onto the surface of the substrate 1 by the pressure of the gas to perform cleaning.

以上説明したように、本発明の基板洗浄装置によれば、ブラシによる再汚染の問題がなく、洗浄用の混合液は少量、短時間で従来と同等の洗浄効果があり、且つ排水基準が示す中性の範囲内であるため廃水処理が簡単で、高価な高圧ポンプを必要としないことから、装置及び運用コストを抑えることが可能となる。   As described above, according to the substrate cleaning apparatus of the present invention, there is no problem of re-contamination by the brush, the cleaning liquid mixture is small, has a cleaning effect equivalent to the conventional one in a short time, and the drainage standard indicates Since it is in the neutral range, wastewater treatment is easy and an expensive high-pressure pump is not required, so that it is possible to reduce the apparatus and operation costs.

本発明の非接触式洗浄装置の洗浄部を示す装置構成図。The apparatus block diagram which shows the washing | cleaning part of the non-contact-type washing apparatus of this invention. 本発明の混合液噴射ノズルの噴射状態を示す混合液噴射模式図。The liquid mixture injection schematic diagram which shows the injection state of the liquid mixture injection nozzle of this invention. 本発明の複数の混合液噴射ノズルを用いた洗浄装置構成図。The block diagram of the washing | cleaning apparatus using the some liquid mixture injection nozzle of this invention. 従来の接触式洗浄装置の洗浄部を示す装置構成図。The apparatus block diagram which shows the washing | cleaning part of the conventional contact-type washing apparatus.

符号の説明Explanation of symbols

1 基板
2 駆動ローラ
3 混合液噴射ノズル
4 浮上機構
5 混合液
6 回転洗浄ブラシ
7 ガイドローラ
8 アスピレータ
9 ポンプ
10 筐体
11 混合液貯留部
1 Substrate
2 Drive roller
3 Liquid mixture injection nozzle
4 Levitation mechanism
5 mixture
6 Rotating cleaning brush
7 Guide roller
8 Aspirator
9 Pump 10 Housing 11 Mixed liquid reservoir

Claims (10)

基板を複数のローラ又は液体又は気体を基板に噴射しながら基板を浮上させローラで連続して搬送し、前記基板を洗浄手段と乾燥手段により洗浄及び乾燥処理する基板洗浄装置において、
前記洗浄手段は、固形物を混合した混合液と、加圧された気体と、混合液噴射ノズルとを有し、
前記基板に向けて、前記混合液を前記加圧された気体により前記混合液噴射ノズルから噴射させることを特徴とする基板洗浄装置。
In a substrate cleaning apparatus that floats a substrate while continuously spraying the substrate while spraying a plurality of rollers or liquid or gas onto the substrate, and cleaning and drying the substrate by a cleaning unit and a drying unit.
The cleaning means includes a mixed liquid in which solids are mixed, a pressurized gas, and a mixed liquid injection nozzle.
The substrate cleaning apparatus, wherein the mixed liquid is sprayed from the mixed liquid spray nozzle by the pressurized gas toward the substrate.
基板を複数のローラ又は液体又は気体を基板に噴射しながら基板を浮上させローラで連続して搬送し、前記基板を洗浄手段と乾燥手段により洗浄及び乾燥処理する基板洗浄装置において、
前記洗浄手段は、固形物を混合した混合気体と液体を混合噴射する混合液噴射ノズルとを有し、前記基板に向けて、前記固形物を混合した混合気体と液体とを加圧された気体により前記混合液噴射ノズルから噴射させることを特徴とする基板洗浄装置。
In a substrate cleaning apparatus that floats a substrate while continuously spraying the substrate while spraying a plurality of rollers or liquid or gas onto the substrate, and cleaning and drying the substrate by a cleaning unit and a drying unit.
The cleaning means includes a mixed gas jet nozzle that mixes and jets a mixed gas mixed with a solid and a liquid, and a gas obtained by pressing the mixed gas mixed with the solid and the liquid toward the substrate The substrate cleaning apparatus is characterized in that it is ejected from the mixed liquid ejection nozzle.
前記固形物の硬度が前記基板の硬度以下であることを特徴とする請求項1又は2に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein the solid material has a hardness equal to or less than the hardness of the substrate. 前記固形物は、炭酸水素ナトリウム(NaHCO)、セスキ炭酸ナトリウム(NaHCO・NaCO・2HO)、ウエグシャイダー塩(3NaHCO・NaCO)、炭酸ソーダ1水塩(NaCO・HO)、又は炭酸ソーダ10水塩(NaCO・10HO)の各水溶性塩類の中から選択された単独粒又は複数の混合粒から成ることを特徴とする請求項1又は2に記載の基板洗浄装置。 The solids include sodium bicarbonate (NaHCO 3 ), sodium sesquicarbonate (NaHCO 3 · Na 2 CO 3 · 2H 2 O), Wegschider salt ( 3 NaHCO 3 · Na 2 CO 3 ), sodium carbonate monohydrate ( It consists of a single grain or a plurality of mixed grains selected from water-soluble salts of Na 2 CO 3 .H 2 O) or sodium carbonate 10 hydrate (NaCO 3 .10H 2 O). Item 3. The substrate cleaning apparatus according to Item 1 or 2. 前記固形物は、重炭酸アンモニウム(NHHCO)、炭酸ソーダ(NaCO)、炭酸カルシウム(CaCO)、又は炭酸カリウム(KCO)の各水溶性塩類の中から選択された単独粒又は複数の混合粒から成ることを特徴とする請求項1又は2に記載の基板洗浄装置。 The solid is a single substance selected from water-soluble salts of ammonium bicarbonate (NH 4 HCO 3 ), sodium carbonate (Na 2 CO 3 ), calcium carbonate (CaCO 3 ), or potassium carbonate (KCO 3 ). The substrate cleaning apparatus according to claim 1, wherein the substrate cleaning apparatus is made of a grain or a plurality of mixed grains. 前記固形物は、粒状又は棒状の樹脂を単独又は複数混合したものであることを特徴とする請求項1又は2に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein the solid material is a single or a mixture of granular or rod-like resins. 前記固形物の形状はミクロン単位であり、材質はポリプロピレン(PP)、ポリエチレン(PE)、ポリエチレンテレフタラート(PET)、又はナイロンであることを特徴とする請求項6に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 6, wherein the shape of the solid is in units of microns, and the material is polypropylene (PP), polyethylene (PE), polyethylene terephthalate (PET), or nylon. 基板を複数のローラ又は液体又は気体を基板に噴射しながら基板を浮上させローラで連続して搬送し、前記基板を洗浄手段と乾燥手段により洗浄及び乾燥処理する基板洗浄装置において、
前記洗浄手段は、固形物を混合した混合液体と気体を混合噴射する混合液噴射ノズルとを有し、前記基板に向けて、前記混合液を加圧された気体により前記混合液噴射ノズルから噴射させることを特徴とする基板洗浄装置。
In a substrate cleaning apparatus that floats a substrate while continuously spraying the substrate while spraying a plurality of rollers or liquid or gas onto the substrate, and cleaning and drying the substrate by a cleaning unit and a drying unit.
The cleaning means includes a mixed liquid jet nozzle that mixes and injects a mixed liquid mixed with a solid substance and a gas, and jets the mixed liquid from the mixed liquid jet nozzle to the substrate by a pressurized gas. A substrate cleaning apparatus, characterized by comprising:
前記気体は、空気又は水蒸気あるいは空気と水蒸気を混合した気体であることを特徴とする請求項1又は2に記載の基板洗浄装置。   The substrate cleaning apparatus according to claim 1, wherein the gas is air, water vapor, or a gas obtained by mixing air and water vapor. 前記混合液中の固形物は、空気又は水蒸気あるいは空気と水蒸気を混合した気体であることを特徴とする請求項1又は2に記載の基板洗浄装置。   3. The substrate cleaning apparatus according to claim 1, wherein the solid in the liquid mixture is air, water vapor, or a gas obtained by mixing air and water vapor. 4.
JP2006073169A 2006-03-16 2006-03-16 Substrate cleaning device Pending JP2007245029A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192673A (en) * 2009-02-18 2010-09-02 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning device, control program, and computer-readable storage medium
KR101781389B1 (en) * 2016-10-14 2017-10-10 주식회사 비와이티 Washing apparatus for tire mold surface

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000510053A (en) * 1996-05-09 2000-08-08 チャーチ・アンド・ドゥワイト・カンパニー・インコーポレイテッド How to clean electronic hardware components
JP2003039031A (en) * 2001-07-27 2003-02-12 Kakizaki Mamufacuturing Co Ltd Plate material cleaning method and plate material cleaning device
JP2003190845A (en) * 2001-10-15 2003-07-08 Soshio Kk Cleaning nozzle
JP2004358312A (en) * 2003-06-03 2004-12-24 Bridgestone Corp Washing method for coating hanger
JP2005199196A (en) * 2004-01-16 2005-07-28 Kaijo Corp Cleaning method and apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000510053A (en) * 1996-05-09 2000-08-08 チャーチ・アンド・ドゥワイト・カンパニー・インコーポレイテッド How to clean electronic hardware components
JP2003039031A (en) * 2001-07-27 2003-02-12 Kakizaki Mamufacuturing Co Ltd Plate material cleaning method and plate material cleaning device
JP2003190845A (en) * 2001-10-15 2003-07-08 Soshio Kk Cleaning nozzle
JP2004358312A (en) * 2003-06-03 2004-12-24 Bridgestone Corp Washing method for coating hanger
JP2005199196A (en) * 2004-01-16 2005-07-28 Kaijo Corp Cleaning method and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192673A (en) * 2009-02-18 2010-09-02 Tokyo Electron Ltd Substrate cleaning method, substrate cleaning device, control program, and computer-readable storage medium
KR101781389B1 (en) * 2016-10-14 2017-10-10 주식회사 비와이티 Washing apparatus for tire mold surface

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