1244719 玫、發明說明： 【發明所屬之技術領域】 本發明係關於以濕式處理（洗淨、顯影、敍刻、剝離處理 等）半導體晶圓、液晶顯示器及電漿顯示器等平面顯示器製 造用之玻璃基板、印刷基板等之板狀基板用之基板處理裝 置及基板洗淨單元。 【先前技術】 近年來’隨著圖案之微細化及AL膜等柔軟膜質之膜之-啟 用’要求對基板採用傷害較少之洗淨工具。 作為傷害較少之洗淨單元，可使用以高壓對基板噴出洗 淨液，以…先淨之高壓洗淨μ、將洗淨液與线混合成 霧狀之混合流體而對基板噴出，以施行洗淨之2流體洗淨單 元、及將施加超音波之洗淨液對基板噴出，以施行洗淨之 超音波洗淨單元等。 〜 【發明所欲解決之問題】 刀但’採用單獨使用上述高壓洗淨單元、2流體洗淨單元及 超首波洗淨單元之構成時’雖分別可獲得—定之洗淨效果 :但無法獲得可令人滿意之效果。尤其，因洗淨而由基板 刮離《污染物在離開基板之前會再附著，故防止再污染基 板之效果並不充分。 土 ’在成艇處理之上游側之工序中’垂直於基板之搬塌 ^ ι方向之端耗污染時，上述各洗淨單元無法確管 該基板端部之污染物，剥離之基板端部之冷染物會 再附者於基板表面，或污染到基板之搬運滾輪等，以致也 1244719 有其他基板被該受污染之搬運滾輪所污染之2次污染發生 等之問題。 因此’有鑒於前述之問題，本發明之第]目的在於提供可 有效防止由基板剝離之污染物再附著於基板，以提高洗淨 效果之基板處理裝置。 又，本發明惑第2目的在於提供可確實除去附著於基板端 部之污染物，以提高洗淨效果之基板處理裝置及基板洗淨 口穿 一 單兀。 【發明内容】 【解決問題之手段】 、L成觔述目的 < 技術的手段在於包含··第】噴出部， 其係對依照特定搬運路徑被搬運來之基板噴出高壓之洗淨 义、…⑽了 ’先淨者，第2噴出邵，其係設於前述搬運路徑之 ^弟1/出部之搬運方向下游側，對依照前述搬運路徑被 板連來《基板噴出混合洗淨液與氣體而成之霧狀混合流體 ，以施行洗淨者。 “ 之步第3喷出部，其係設於前述搬運路徑上 路徑被搬二 可述搬運方向上游側，對依照前述搬運 又，最好=艾基板噴出低壓之洗淨液，以施行洗淨者。 :外取It::包:收容前述噴出部之全部之處理槽者。 處理样内〜 ：第1液流形成部’其係設於前述 〜a、則述搬運路徑上之前述各噴出部間，以隔開前 =運“之方式喷出液流者。 進步包含：第2液流形成部，其係設於前述處 85942 1244719 理槽内之前述搬運路徑上+ < 、 向上游側，或設有前^第3^财述第1嘴出部之前述搬運方 之前述搬運方向上游側，〆時，设於前述第3喷出部 液流者。 、^開‘述搬運路徑之方式喷出 另外，最妤進一步包4 ， 處理槽内之前述搬運路:；^=部？係:於前述 又，最妤進-步包含：第4 〜，貝出液流者。 内> —+、敗— ，、出邵，其係設於前述處理1# 、、： 馒上之前述第2噴出部之前述搬運方向下 巧于側，或設有前述第3液、、* 成、 本 夜4成邵時，設於前述第3液流形 ^之前述«方向下游側，對基板噴出由裝置外部所供 應之未使用之洗淨液而予以洗淨者。 另外，最好基板在被前述各嘴出㈣淨之「m㈣ 於水平方向之狀態’-面被搬運，—面被洗淨者。 又，最好前述第卜賣出部及前述第2喷出部所使用之洗淨 液係回收使用後之洗淨液而再使用者；洗淨液係在回收後 ，被共同之泵升壓而被供應至前述第〗噴出部及前述第2噴 出部者。 另外，最好進一步包含：洗淨刷，其係設於前述第丨噴出 邰之前述搬運方向上游側，或設有前述第3噴出部時，設於 前述第3噴出部之前述搬運方向上游側或實質上與第3喷出 部同一位置，且可在接近於基板之接近位置與離開基板之 退避位置間移動，以位於前述接近位置之狀態洗淨基板者。 又，最好前述第1噴出部及前述第2噴出部中至少一方係 物42 1244719 包含基板端部洗淨用之喷嘴部，其係洗淨垂直於基板之前 述搬運方向之寬方向之端部者。 另外，最好前述第〗喷出部及前述第2噴出部中至少一方 係包含多數喷嘴部，其係向基板分別噴出前述洗淨液或前 述混合流體形成之噴出流，該噴出流之軸直角剖面形狀在 一方向王姻長（略長橢圓形者；前述多數嘴嘴部係包含第】 喷嘴部，其係被設置成使前述噴出流在基板表面之前述一 方向以角度α (但0。< α <〗80。）與前述搬運方向交叉一者 ，及第2噴嘴邵，其係被設置成在前述噴出流接觸到基板之 前述端部之位置，使前述一方向與前述搬運方向略成平行 者；並以前述第2噴嘴部作為前述基板端部洗淨用之噴嘴部 者。 、 又，最好進一步包含：基板端部洗淨用之噴嘴部，其係 洗淨垂直於基板之前述搬運方向之寬方向之端部者。 另外，瑕好丽述基板端部洗淨用之噴嘴部係構成：其噴 出流之軸直角剖面形狀在一方向呈細長之略長橢圓形，且 被設置成在該噴出流接觸到基板之前述端部之位置，使前 述一方向與前述搬運方向略成平行者。 又’最好前述洗淨液係水者。 另外，為達成前述目的用之技術的手段係基板洗淨單元 ，其特徵在於對搬運來之基板嘴出特定噴出流，以施行洗 淨者；且包含隸端部洗淨用之噴”，其係向垂直於基 板之搬運方向之寬方向之端部噴出前述噴出流，該噴出^ 之軸直角剖面形狀係沿著前逑搬運方向呈細長之略長橢圓 85942 1244719 形者。 又’為達成前逑目的用之技術的手段係基板洗淨單元， 其特徵在於對搬運來之基板噴㈣定噴出《，以施行洗淨 者二且包含多數嘴嘴部，其係向基板分別噴出前述洗淨液 或』、° : 开’成之噴出法1*，該噴出流之軸直角剖面形 7 方向王、田長足略長橢圓形者；前述多數噴嘴部係被 配f成：纟各噴嘴部之前述各嘴出流在基板上之啥出區域 由前繼方向上游側或下游側觀看時，呈現與垂直於1 板之前述搬運方向之寬方向互相局部重叠；向前述多數噴 嘴部中之基板之前述寬方向之端部噴出前述噴出流之喷嘴 邵之前述喷出流之軸直角剖面形狀之前述略長橢圓之長度 方向係被設定於略平行於前述搬運方向者。 另外，為達成前述目的用之技術的手段係基板洗淨單元 ，其特徵在於對搬運來之基板嘴出特定噴出流，以施行洗 淨者；且包含多數第!噴嘴部，其係向基板分別喷出前述洗 淨液或前述混合流體形成之噴出流，且被配置成：其喷出 流在基板上之赁出區域由前述搬運方向上游側或下游側觀 看時，呈現與垂直於基板之前述搬運方向之寬方向互相局 部重疊者；及至少1個之第2噴嘴部，其係向垂直於基板之 前述搬運方向之寬方向之端部，噴出前述洗淨液或前述混 合流體形成之噴出流者；前述各第丨噴嘴部之前述噴出流之 軸直角剖面形狀係沿著斜斜地傾斜於前述搬運方向之方向 呈細長之略長橢圓形；前述第2噴嘴部之前述喷出流之軸直 角剖面形狀係沿著前述搬運方向呈細長之吻長彳隋圓形者。 S5942 1244719 又，最好前述噴出流係以高壓被噴出之洗淨水者。 另外，最好則述噴出流係將洗淨液與氣體混合成霧狀而 噴出之混合流體者。 【貫施方式】 <第1實施形態> 圖1係表7F本盔明义第1實施形態之基板處理裝置之構成 之模式圖。此基板處理裝置】如圖]所示，制未圖示之驅 動源所驅動之搬運滾輪3，一面搬運例如半導體基板或平一面 面板製造用（矩形玻璃基板、或印刷電路基板等基板w(參 照圖2)，一面在處理槽5内施行洗淨處理，以洗淨基板以之 基板洗淨裝直。又，在實際之構成中，為了穩定搬運基板 w，设1：有由上方壓制基板w之上壓滾輪69(參照圖2)及由 上下夾入支持基板W之支持滾輪71(參照圖2)，但在圖1中， 為方便起見，省略此等之圖示。又，在本專利說明書及圖 式中，為便於說明起見，導入x、y、z之直交座標系，以略 與2個水平軸方向中之基板w之搬運方向a平行之方向為x 方向，以垂直於剩下足水平軸方向之搬運方向A之方向為y 方向，以垂直方向為z方向。 在基板處理裝置1之處理槽5内’由基板W之搬運方向A上 游側依序設置有洗淨部7、9、Π、1 3、1 5。又，在處理槽5 内之洗淨部7之搬運方向上游側，於洗淨部7與洗淨部9之間 、洗淨部9與洗淨部1 1之間、洗淨部〗]與洗淨部1 3之間、及 洗淨部丨3與洗淨部丨5之間分別設置有隔開基板w之搬運路 徑而略呈水簾狀地喷出純水之水流形成部1 7、1 9、2丨、2 3 H5942 10 1244719 25。此等構成兀件中，洗淨部n、〗3之後述之嘴出部47 、49、55相當於本發明之第！噴出部，洗淨部^之後述之噴 出部53相當於第2噴出部、洗淨部7、9之後述之噴出部33、 3)、37、41、43相當於第3噴出部，洗淨部丨5之後述之噴出 邙）9、6 1相當於第4噴出部。又，水流形成部丨9、2丨、23相 當於第】液流形成部，水流形成部]7相當於第2液流形成部 、水泥形成邵2：)相當於第3液流形成部。另外，洗淨部丨|或 洗淨邓1 3或其雙方相當於本發明之基板洗淨單元。 一 …水流形成部17、25具體上為液簾，係以隔開基㈣之搬 建路徑之方式，如圖〗之箭號B1、B2所示，由上方向基㈣ 喷出略呈液簾狀之純水水流。在本實施形態中，雖僅在基 板W〈上面側設置水流形成部! 7、2 5，但也可在基板w之下 面倒設置水流形成部1 7、2 5。 ““成邙丨9、21、23具體上係管噴嘴或液簾，係以隔 開基板w之搬運路徑之方式，如圖ι之箭號β3、Β4、Β5所示 =上方向基板W噴出略呈液簾狀之純水水流。在本實施 U 堇在基板W之上面側設置水流形成部1 9、2 1、 2”但也可在基板〜之下面側設置水流形成部19、21、23。 立洗料7具有洗淨刷3卜噴出低壓純水作為洗淨液之喷出 :二3 35、37、及收容洗淨刷31、與噴出部33、35、37之 /先⑽3 U又置於基板〜之下面側，被未圖示之驅 勤機構旋轉驅動，用於刷洗基㈣之下面側。嗜 置於基㈣之上面側，如圖！之箭號B6所示，由上方向基;; Μ出低壓純水，以施行洗淨。噴出部137設置於基板w S5942 1244719 ::面側，如圖1之箭號B7、B8所示，由下方向基板w喑出 =純水，以施行洗淨。又，喷出㈣、則出之純水也 ^占濕洗淨刷取被洗淨刷31洗淨之基板w之洗淨面之 作用。在容器39之相對向之兩側壁設置有基板界之送入及 排出用之開口部。 在此，在本貫施形態中，對於上述噴出部W、Μ、D及 後述噴出部41、43、47、49之純水之噴出壓力，稱「低壓」 時，係指小於3 kgW(〇 294 Mpa)之壓力，稱「高壓」‘時 kg/cm^(〇.294 , £ f| , „ 才曰 J kg/cm (0.294 MPa)至]5 kg/cm2(1 47 Mpa)之範圍之壓 力。 洗淨部9具有喷出低壓純水作為洗淨液之噴出部41、431244719 Description of the invention: [Technical field to which the invention belongs] The present invention relates to the manufacture of flat displays such as semiconductor wafers, liquid crystal displays and plasma displays by wet processing (cleaning, developing, engraving, peeling processing, etc.) A substrate processing apparatus and a substrate cleaning unit for plate substrates such as glass substrates and printed substrates. [Prior art] In recent years, 'with the miniaturization of patterns and the activation of soft films such as AL films,' it is required to use a cleaning tool with less damage to the substrate. As a less harmful cleaning unit, the substrate can be sprayed with a high-pressure cleaning liquid, and the high-pressure cleaning μ is first cleaned, and the cleaning liquid and the thread are mixed into a mist-like mixed fluid to spray the substrate for execution. The two-fluid cleaning unit to be cleaned, and the ultrasonic cleaning liquid to be sprayed onto the substrate to perform the cleaned ultrasonic cleaning unit. ~ [Problems to be Solved by the Invention] Although the knife is 'available separately when using the above-mentioned high-pressure cleaning unit, 2-fluid cleaning unit, and super-first-wave cleaning unit', the cleaning effect is fixed: but it cannot be obtained Satisfactory effect. In particular, the substrate is scraped away due to cleaning, and contamination will reattach before leaving the substrate, so the effect of preventing recontamination of the substrate is not sufficient. When soil is used in the process on the upstream side of the boating process, the end that is perpendicular to the direction of the substrate's collapse ^ ι consumes pollution, and the above-mentioned cleaning units cannot ensure the contamination of the end of the substrate, and the stripped end of the substrate. The cold-stained material will be attached to the substrate surface, or the transport rollers that contaminate the substrate will cause problems such as the occurrence of secondary contamination of other substrates by the polluted transport roller. Therefore, in view of the aforementioned problems, it is a first object of the present invention to provide a substrate processing apparatus that can effectively prevent contaminants peeled from the substrate from re-adhering to the substrate to improve the cleaning effect. In addition, a second object of the present invention is to provide a substrate processing apparatus and a substrate cleaning mouthpiece that can reliably remove contaminants attached to the end portions of the substrate to improve the cleaning effect. [Summary of the Problem] [Means for Solving the Problem] The technical purpose of L is as follows: <Technical means is to include the first part of the ejection part, which is a cleaning method for ejecting high pressure on the substrate conveyed according to a specific conveyance path, ... The "first cleaner", the second spray Shao, is located on the downstream side of the transport direction of the aforementioned transport path 1/1 of the output section, and is connected to the board according to the aforementioned transport path. "The substrate sprays mixed cleaning liquid and gas. The resulting mist-like mixed fluid is used for cleaning. "The third ejection section of the step is located on the upstream side of the conveying direction of the path being moved on the aforementioned conveying path. For the conveying in accordance with the foregoing, it is preferable that a low-pressure cleaning liquid is ejected from the substrate to perform cleaning. : Take out It :: Package: Holds all the processing tanks of the above-mentioned ejection section. Inside the processing sample ~: The first liquid flow forming section 'is provided in the aforementioned ~ a, then each of the aforementioned ejections on the conveying path Between the departments, the person who spouts the liquid flow in the way of "front separation = transport". Progress includes: a second liquid flow forming section, which is located on the aforementioned conveying path in the above-mentioned location 85942 1244719 trough + <, upstream, or is provided with a front ^ 3 ^ financial description first mouth exit On the upstream side in the conveying direction of the conveying side, at a short time, the liquid is provided in the third ejection unit. ^ Open the method of spraying out the conveying path. In addition, it is further packaged 4 to deal with the aforementioned conveying path in the tank: ^ = 部? Department: In the foregoing, the most advanced steps include: the 4th ~, the beaker outflow. Inside > — +, defeat—, and out, which are set in the aforementioned processing 1 #, :: The second ejection section on the 巧 is located on the side in the transport direction, or the third liquid ,, * When it is 40% of the night, it is set on the downstream side of the aforementioned «direction of the third liquid manifold ^, and the unused cleaning liquid supplied from the outside of the device is sprayed on the substrate to be cleaned. In addition, it is preferable that the substrate is transported in the state "m㈣ is horizontally" cleaned by each of the nozzles, and the surface is cleaned. Also, the second selling portion and the second ejection are preferable. The cleaning liquid used by the department is recovered and reused after being used; the cleaning liquid is boosted by a common pump after being recovered and supplied to the aforementioned spraying section and the second spraying section. In addition, it is preferable to further include a cleaning brush which is provided on the upstream side in the conveyance direction of the third spraying section, or when the third discharge section is provided on the upstream side in the conveying direction of the third discharge section. The side or substantially the same position as the third ejection part can be moved between an approach position close to the substrate and a retreat position away from the substrate, and the substrate is cleaned in the aforementioned close position. Preferably, the first At least one of the ejection portion and the second ejection portion 42 1244719 includes a nozzle portion for cleaning the end portion of the substrate, and is one that cleans the end portion in the width direction perpendicular to the conveying direction of the substrate. Article 〖Ejection Section and the aforementioned Article 2 At least one of the ejection sections includes a plurality of nozzle sections, which eject the ejection streams formed by the cleaning liquid or the mixed fluid onto the substrate, respectively. The axial cross-sectional shape of the ejection stream is in one direction. The above-mentioned most nozzles include the first nozzle portion, which is arranged so that the ejection flow on the substrate surface in the aforementioned direction is at an angle α (but 0. < α < 〖80.) and the conveying direction. The one that intersects and the second nozzle Shao are arranged at a position where the ejection stream contacts the end portion of the substrate so that the one direction is slightly parallel to the transport direction; and the second nozzle portion is used as The nozzle portion for cleaning the substrate end portion, and preferably further includes: a nozzle portion for cleaning the substrate end portion, which cleans the end portion in a width direction perpendicular to the conveying direction of the substrate. The nozzle part for cleaning the end of the substrate is composed of: the axial cross-sectional shape of the axis of the ejection stream is elongated and slightly oval in one direction, and it is arranged so that the ejection stream contacts the substrate. The position of the end portion is such that the aforementioned one direction is slightly parallel to the aforementioned conveying direction. It is also preferred that the aforementioned washing liquid is water. In addition, a technique for achieving the aforementioned purpose is a substrate cleaning unit, which is characterized by A specific ejection stream is sent to the nozzle of the substrate to be conveyed for cleaning; and a nozzle for cleaning the end portion is included ", which ejects the aforementioned ejection stream toward the end portion in a width direction perpendicular to the substrate conveying direction. The right-angled cross-sectional shape of the axis of the spray ^ is a long and slightly elliptical 85942 1244719 shape along the front conveyance direction. It is also a substrate cleaning unit that is a technique used to achieve the previous purpose. The substrate spray is set to spray out, in order to perform the cleaning of the second and include the majority of the mouth and mouth, which sprays the aforementioned cleaning solution onto the substrate or "," °: open 'into the spray method 1 *, the axis of the spray stream is at right angles Sectional shape 7 direction king, Tian long foot slightly elliptic; most of the aforementioned nozzles are configured to: 啥 The area where the nozzles of the nozzles flow out on the substrate is upstream or downstream from the previous direction. When watching, It presents a vertical cross-sectional shape of the axial direction of the ejection stream of the nozzle stream that ejects the ejection stream toward the end of the substrate in the width direction of the substrate in the majority of the nozzle parts and partially overlaps each other with the width direction perpendicular to the conveying direction of the 1 plate. The length direction of the slightly longer ellipse is set to be slightly parallel to the carrying direction. In addition, the technical means for achieving the aforementioned purpose is a substrate cleaning unit, which is characterized by a specific jet stream from the nozzles of the substrates being conveyed to perform cleaning; and includes a plurality of first nozzle portions, which are respectively directed to the substrates. The ejection stream formed by ejecting the cleaning solution or the mixed fluid is configured such that when the leased area of the ejection stream on the substrate is viewed from the upstream side or the downstream side in the conveying direction, the present stream is perpendicular to the substrate perpendicular to the substrate. The width direction of the conveying direction partially overlaps each other; and at least one second nozzle portion which ejects the jet stream formed by the cleaning liquid or the mixed fluid toward an end portion of the width direction perpendicular to the substrate in the conveying direction. The axial cross-sectional shape of the axis of the ejection flow of each of the aforementioned nozzle sections is an elongated and slightly oval shape along the direction obliquely inclined to the conveying direction; the axis of the ejection flow of the second nozzle section The right-angled cross-sectional shape is a slender kiss-shaped long-sui round shape along the aforementioned carrying direction. S5942 1244719 Also, it is preferable that the aforementioned spraying stream is a washing water sprayed at a high pressure. In addition, it is preferable to describe a discharge fluid system in which the cleaning liquid and the gas are mixed into a mist and discharged. [Implementation method] < First Embodiment > Fig. 1 is a schematic view showing the structure of a substrate processing apparatus according to the first embodiment of the helmet of Table 7F. This substrate processing apparatus is as shown in the figure, and a conveyance roller 3 driven by a driving source (not shown) is produced, and for example, a semiconductor substrate or a flat panel (a rectangular glass substrate or a printed circuit substrate such as a printed circuit board w (see FIG. FIG. 2), one side is subjected to a cleaning treatment in the processing tank 5 to clean the substrate and to install the substrate straight. In an actual configuration, in order to stably transport the substrate w, it is set to 1: press the substrate w from above The upper roller 69 (see FIG. 2) and the support roller 71 (see FIG. 2) that sandwiches the support substrate W from above and below, are omitted in FIG. 1 for the sake of convenience. In the patent specification and drawings, for the convenience of explanation, orthogonal coordinate systems of x, y, and z are introduced, so that the direction slightly parallel to the carrying direction a of the substrate w in the two horizontal axis directions is the x direction, and is perpendicular to In the remaining horizontal direction, the direction of the conveying direction A is the y direction, and the vertical direction is the z direction. In the processing tank 5 of the substrate processing apparatus 1, a cleaning section is sequentially provided from the upstream side of the substrate W in the conveying direction A. 7, 9, Π, 1 3, 1 5. Also, in the processing tank 5 The upstream side of the conveying direction of the cleaning section 7 is between the cleaning section 7 and the cleaning section 9, between the cleaning section 9 and the cleaning section 11 and between the cleaning section and the cleaning section 13], And the washing section 丨 3 and the washing section 丨 5 are respectively provided with a transport path for separating the substrate w and a water flow forming section 17 that sprays pure water in a slightly water curtain shape. H5942 10 1244719 25. Among these components, the nozzles 47, 49, and 55 described later in the cleaning section n, 3 correspond to the first aspect of the present invention! Corresponds to the second ejection section, the ejection sections 33, 3 described later after cleaning section 7, 9), 37, 41, 43 correspond to the third ejection section, the ejection section described later for cleaning section 5) 9, 6 1 Corresponds to the fourth discharge portion. Also, the water flow forming sections 9, 2, and 23 are equivalent to the first liquid flow forming section, and the water flow forming section 7 corresponds to the second liquid flow forming section and the cement forming section 2) corresponds to the third liquid flow forming section. In addition, the cleaning section 丨 | or cleaning Deng 13 or both correspond to the substrate cleaning unit of the present invention. First ... The water flow forming sections 17, 25 are specifically liquid curtains, which are separated from the path of the base, as shown by arrows B1 and B2 in the figure. Pure water flow. In this embodiment, the water flow forming sections 1 and 2 are provided only on the substrate W <upper side, but the water flow forming sections 17 and 25 may be provided under the substrate w. "" Chen 邙 丨 9, 21, and 23 are specifically the nozzles or liquid curtains of the system, which are used to separate the transportation path of the substrate w, as shown in the arrow β3, B4, and B5 of the figure = the substrate W is ejected in the upper direction. A stream of pure water with a liquid curtain shape. In this embodiment, the water flow forming portions 19, 21, and 2 "are provided on the upper surface of the substrate W. However, the water flow forming portions 19, 21, and 23 may be provided on the lower surface of the substrate ~. The vertical washing material 7 has a cleaning brush. 3. Spraying low-pressure pure water as the cleaning liquid: 2 3 35, 37, and the cleaning brush 31, and the ejection parts 33, 35, 37 / first 3 U and placed on the lower side of the substrate ~, was The driving mechanism (not shown) is driven for rotation and is used to scrub the lower side of the base. It is placed on the upper side of the base, as shown by the arrow B6 in the figure, from the upper direction to the base; Washing is performed. The spraying portion 137 is provided on the substrate w S5942 1244719 :: surface side, as shown by arrows B7 and B8 in FIG. 1, and the substrate w scoops out = pure water from the lower direction to perform cleaning. The pure water that is produced and discharged also occupies the role of the wet cleaning brush to take the cleaning surface of the substrate w washed by the cleaning brush 31. The opposite sides of the container 39 are provided with a substrate boundary feeding Here, in the present embodiment, the discharge pressure of the pure water of the above-mentioned ejection sections W, M, and D, and later-described ejection sections 41, 43, 47, 49 is referred to as "low "Pressure" means a pressure of less than 3 kgW (〇294 Mpa), which is referred to as "high pressure" kg / cm ^ (〇.294, £ f |, 『J kg / cm (0.294 MPa) to] 5 Pressure in the range of kg / cm2 (1 47 Mpa). The cleaning section 9 has spraying sections 41 and 43 that spray low-pressure pure water as the cleaning liquid.
、及收容喷出部4]、43之容器45。喷出部41設置於基板W 之上面側，如圖1之箭號B9所示，由上方向基板…噴出定壓 純水，以施行洗淨。噴出部43設置於基板…之下面側，如 圖1 (前號B 1 0所示，由下方向基板w喷出低壓純水，以施 忭洗淨。在容器45之相對向之兩側壁設置有基板w之送入 及排出用之開口部。 洗淨部1 1具有噴出高壓純水作為洗淨液之喷出部47、49 、及收答噴出邵47、49之容器51。喷出部47設置於基板w -c上面i J如圖】 < 箭號Β 11所示，由上方向基板w喷出定 壓純水’以施行洗淨。噴出部49設置於基板W之下面側， 如圖I之前號Β丨2所示，由下方向基板w喷出高壓純水，以 施行洗淨。在4器5 1之相對向之兩側壁設置有基板w之送 X5942 -12- 1244719 入及排出用之開口部。 洗淨部1 3具有噴出部53、55與收容噴出部53、55之容器 57。噴出部53係用於喷出以特定之體積比（例如1 : ] 〇〇裎度 之比）混合後述供應管線67供應之洗淨液之純水與供應管 線5 8供應之空氣（氣fa )而成之霧狀混合流體。而，喷出部5 3 係設置於基板W之上面側，如圖1之箭號b丨3所示，由上方 向基板W喷出霧狀混合流體，以施行洗淨。喷出部5 5設置 於基板W之下面側，如圖1之箭號B ] 4所示，由下方向基-板 w噴出高壓純水作為洗淨液，以施行洗淨。在容器57之相 對向之兩側壁設置有基板W之送入及排出用之開口部。 洗淨邵1 5具有噴出洗淨液之純水之噴出部$ 9、6 1。喷出 邵5 9設置於基板W之上面側，如圖1之箭號b〗5所示，由上 方向基板W噴出純水，以施行洗淨。喷出部6 1設置於基板w 之下面側，如圖1之箭號B1 6所示，由下方向基板w喷出純 水，以施行洗淨。 由基板處理裝置1外部之工場設施之純水供應管線63所 供應之純水係被供應至洗淨部〗5，該純水可經由喷出部59 、6 1直接噴出至基板w。 其他*C洗淨邵7、9、1 1、1 3及水流形成部1 7、1 9、2 1、 23、25則可回收被洗淨部7、9、1 1、1 3、1 5及水流形成部 1 7、1 9、2 1、2 3、2 5排放出至處理槽5内之純水，經施以過 滤等/糸淨化處理後再使用（循環使用）。回收之潔淨化之純水 暫時Q存於未圖示之水槽中，由該水槽升壓而供應至洗淨 部 7、9、1 1、1 3 及水流形成部 1 7、1 9、2 1、23、25。 85942 -13 - 1244719 在本實施形態中，如圖1所示，升壓用之泵6 5係被共用於 喷出洗淨邵1丨、1 3之高壓純水之喷出部4 7、4 9、5 5、與喷 出洗淨部1 3之霧狀混合流體之喷出部53。即，由未圖示之 水槽所供應之純水被泵65升壓後，經供應管線67被供應至 各噴出部47、49、53、55。 圖2係說明基板W之傾斜搬運用之圖，即以模式顯示設置 基板處理裝置丨之洗淨部11之部分之剖面構成。在本實施形 態之基板處理裝置1中’可將基板W以由y軸方向傾斜特__定 角度（9之狀態，一面搬運，一面在各洗淨部7、9、1〗、^ 3 、15及水流形成部17、19、21、23、25施行洗淨處理。更 具體而言’使基板W之搬運方向A下游側作為前方側而觀看 基板處理裝置1時，基板W係以對水平方向向左側傾斜角度 0之狀態被搬運。如圖2所示’以設於洗淨部π等之容器5 1 之側壁部之基板W之送入、排出用之開口部5丨a為首之各開 口部也配合基板W之傾斜而形成。又，以圖2所示之喷出部 47、49為首之各噴出部也以與傾斜搬運之基板…略平行地 被傾斜配置。 另外，在搬運滾輪3設置與基板w直接接觸之2個滾輪部 3a、3b，但設在傾斜下方側（圖2左側）之滾輪部补設有防止 基板W滑落用之凸緣部3c。上壓滾輪69及支持滾輪门也同 樣地分別设置與基板W直接接觸之滾輪部6 9 6 %及滾輪 部 7 1 a、7 1 b。 圖3及圖4係由洗淨部1〗及洗淨部丨3之噴出部47、兄喷出 之喷出流之一般的（基本的）形態之說明圖。又，下面側之喷 S5942 -14- 1244719 、王見大致相同於上面側之噴出部4 7、5 3噴出 开 < 能 /故在此僅就上面側之噴出部4 7、5 3加以說明。 貪出4 4 7、^ 3如圖3所示，設有與基板w之搬運方向A垂 直足見万向約略平行地延伸之管部73、及隔著間隔設於該 吕°丨5 7j ’且向基板〜噴出上述高壓純水或霧狀混合流體形 成 < 赁出流77之多數噴嘴部乃。噴嘴部乃有必要被配置成 。貧實4 7 5 <噴出流7 7在基板w上之噴出區域由搬運方 向A上游側或下游側觀看時，呈現在基板w之寬方向互相一局 部重疊。各噴嘴部75噴出之喷出流77之軸直角剖面形狀如 圖4所7F，係在一方向呈現細長之略長橢圓形。喷出流”之 軸直角剖面形狀之指向性（可使該略長橢圓形之長度方向 朝向哪一方向）可利用例如調整噴嘴部75對管部73之其軸 周圍之設定角度加以變更。 在有關各噴嘴部75之噴出流77之指向性之一般的設定形 態中，各喷嘴部75之噴出流77之指向性如圖3及圖4所示， 係被設定為··其軸直角剖面形狀之略長橢圓形之長度方向N 以特定角度α對基板W之搬運方向A斜斜地傾斜，傾斜角度 α在各喷?角邓7 5之噴出流7 7間相等。又，噴嘴部7 5之噴出 區域之長度方向Ν與基板之搬運方向Α所形成之角〇；只要 為〇° < α < 180°之值即可，但若α关9〇。，即使喷嘴部 之喷出區域之長度方向ΝΙ之大小大於鄰接之喷嘴部75問之 距離時，也可防止鄰接之噴嘴部75之噴出區域彼此相干擾。 相對地，在本實施形態中，對洗淨部】丨及洗淨部丨3中至 少其中一方，如圖5及圖6所示變更其噴出部47、53之一部 Κ5942 -15- 1244719 分之11貧？角部7 5之σ貧出泥7 7之指向性。即，對設於喷出部4 7 、53之多數喷嘴部75中向基板w之寬方向之兩端部噴出噴 出流口之噴嘴部75(在此，係指左右兩側之喷嘴部75a、75b) ，變更噴出流77之指向性，此噴嘴部75a、75b具有作為基 板端部洗淨用（喷嘴邵之機能。更詳言之，係將由噴嘴部 7 5 a、7 5 b貧出4 0貧出泥7 7 <車由直角剖面形狀之略長橢圓形 之長度方向N a又足為略平行於搬運方向a。因此，噴嘴部7 ^ 、75b之喷出流77可集中地向基板w之寬方向之兩端部（含嗉 端部）喷出。 又，在噴嘴邵75a、75b之噴出流77之指向性之設定變更 之同時，噴嘴部75之配置位置、配置間隔、配置數等也依 照需要被調整。有關噴嘴部75a、75b以外之噴嘴部乃之噴 出流77之指向性(N)，實質上無變更。在本實施形锻之設定 狀態中，各喷嘴部75噴出之各嗜出流77之噴出區域係被設 定為：由搬運方向A上游側或下游側觀看時，呈現在基㈣ 之宽方向上互相局部重疊。 有關此種噴出流77之指向性—& 曰u〜，又疋k更，可僅在洗淨部 1 1上執行，也可僅在洗淨部13 1 3上執仃，或在洗淨部]丨及洗 淨部13雙方上執行。又，在、 杜圃5及圖6所π艾例中，雖僅就 上面側之噴出部47、53執行嘖屮化^、與， 灵出/札7 71才日河性+母定變萝 ，但也可僅就下面側之嘴出 …And a container 45 containing the ejection sections 4] and 43. The ejection portion 41 is provided on the upper surface side of the substrate W, and as shown by arrow B9 in FIG. 1, the substrate is sprayed with constant pressure pure water from the upper direction to perform cleaning. The ejection portion 43 is provided on the lower surface of the substrate, as shown in FIG. 1 (previous number B 10), and low-pressure pure water is ejected from the substrate w in the lower direction to be cleaned. It is provided on the opposite side walls of the container 45 There are openings for feeding and discharging the substrate w. The cleaning section 11 has spraying sections 47 and 49 that spray high-pressure pure water as a cleaning solution, and a container 51 that responds and discharges 47 and 49. The spraying section 47 is provided on the substrate w -c i i as shown in the figure] < As shown by arrow B 11, the substrate w is sprayed with constant pressure pure water from the upper direction for cleaning. The ejection portion 49 is provided on the lower side of the substrate W, As shown in the previous number B 丨 2 of Fig. I, high-pressure pure water is sprayed from the substrate w in the lower direction for cleaning. The substrate w is provided on the opposite side walls of the 4 and 51 to send X5942 -12-1244719 into And the opening for discharge. The cleaning section 13 has the ejection sections 53, 55 and a container 57 that houses the ejection sections 53, 55. The ejection section 53 is for ejecting at a specific volume ratio (for example, 1:] 〇〇 裎Degree ratio) is a mist-like mixed fluid formed by mixing pure water of the washing liquid supplied from the supply line 67 described later and air (air fa) supplied from the supply line 58. The outlet portion 5 3 is provided on the upper side of the substrate W. As shown by arrow b 3 in FIG. 1, the mist-like mixed fluid is sprayed from the upper direction to the substrate W for cleaning. The outlet portion 5 5 is provided on the substrate. The lower side of W, as shown by arrow B] 4 in FIG. 1, high-pressure pure water is sprayed from the lower direction to the base plate w as a washing liquid for cleaning. A substrate is provided on two opposite side walls of the container 57 The opening for feeding and discharging of W. Washing Shao 15 has a spraying section of pure water that sprays out the cleaning liquid $ 9, 6 1. Spraying Shao 5 9 is set on the upper side of the substrate W, as shown in Figure 1. As shown by arrow b 5, pure water is sprayed from the upper substrate W for cleaning. The ejection part 61 is provided on the lower side of the substrate w, as shown by arrow B1 6 of FIG. 1, from the lower substrate Pure water is sprayed out for cleaning. Pure water supplied from the pure water supply line 63 of the factory facility outside the substrate processing apparatus 1 is supplied to the cleaning section. The pure water can be passed through the spraying section 59. , 6 1 are directly ejected to the substrate w. Other * C washing Shao 7, 9, 11, 1 3, and the water flow forming section 1 7, 19, 2 1, 23, 25 can be recycled to the cleaned section 7, 9 , 1 1, 1 3, 1 5 and the water flow forming section 1 7, 19, 2 1, 2, 3, 2 5 The pure water discharged into the treatment tank 5 is used after being treated with filtration, etc. (糸) for purification (recycling). The purified pure water is temporarily stored in a water tank (not shown), which is pressurized by the water tank and is supplied to the washing sections 7, 9, 1 1, 1 3, and the water flow forming section 17, 7, 9, 2, 1, 23, 25. 85942 -13-1244719 In this embodiment, as shown in Fig. 1, the pump 6 5 for boosting is used for spraying out the high-pressure pure water spraying parts 1 and 13 of the washing 4 7 , 4, 9, 5, 5 and the spraying portion 53 of the mist-like mixed fluid that sprays the cleaning portion 1 3. That is, the pure water supplied from a water tank (not shown) is pressurized by the pump 65 and then supplied to each of the discharge sections 47, 49, 53, 55 through the supply line 67. Fig. 2 is a diagram for explaining the inclined conveyance of the substrate W, that is, a cross-sectional structure of a portion where the cleaning unit 11 of the substrate processing apparatus 丨 is provided is displayed in a pattern. In the substrate processing apparatus 1 of this embodiment, the substrate W can be tilted at a specific angle from the y-axis direction at a predetermined angle (in a state of 9 while being transported and in each cleaning section 7, 9, 1}, ^ 3, 15 and the water flow forming units 17, 19, 21, 23, and 25 are subjected to a cleaning process. More specifically, when the substrate processing apparatus 1 is viewed with the downstream side of the substrate W in the transport direction A as the front side, the substrate W is horizontally aligned. It is conveyed with the direction inclined to the left by an angle of 0. As shown in FIG. 2, each of the openings 5 ′ a for feeding and discharging the substrate W provided on the side wall of the container 5 1 of the cleaning section π and the like is led. The opening is also formed in accordance with the inclination of the substrate W. In addition, each of the ejection sections including the ejection sections 47 and 49 shown in FIG. 2 is also disposed obliquely in parallel with the substrate conveyed obliquely ... In addition, the conveyance roller 3 Two roller parts 3a, 3b are provided, which are in direct contact with the substrate w, but the roller part provided on the inclined lower side (the left side of FIG. 2) is provided with a flange part 3c for preventing the substrate W from slipping. The upper pressure roller 69 and the support The roller door is similarly provided with a roller portion 6 9 6% and a roller portion 7 which are in direct contact with the substrate W. 1 a, 7 1 b. Fig. 3 and Fig. 4 are explanatory diagrams of the general (basic) form of the ejection part 47 and the ejection flow from the washing part 1 and the washing part 3, and again. The spray on the lower side S5942 -14-1244719 and Wang Jian are roughly the same as the spray on the upper side 4 7 and 5 3 < can / so only the upper spray 4 4 and 5 3 will be described here. Corruption 4 4 7 and ^ 3, as shown in FIG. 3, are provided with a pipe section 73 extending approximately parallel to the direction of the substrate W's transportation direction A, and are arranged at the distance 5 ° 5j The above-mentioned high-pressure pure water or mist-like mixed fluid is ejected to the substrate to form a plurality of nozzle portions of the leased stream 77. The nozzle portion must be configured. Lean 4 7 5 < the discharged stream 7 7 on the substrate w When the ejection area is viewed from the upstream or downstream side of the conveying direction A, they partially overlap each other in the width direction of the substrate w. The right-angled cross-sectional shape of the axis of the ejection flow 77 ejected from each nozzle portion 75 is shown in FIG. 4F. Shows a slender, slightly longer ellipse in one direction. The directivity of the axial cross-sectional shape of the "jet stream" (allows the length of the slightly longer ellipse In which direction), for example, the setting angle of the nozzle portion 75 around the axis of the tube portion 73 can be changed by adjusting the nozzle portion 75. In a general setting form regarding the directivity of the ejection flow 77 of each nozzle portion 75, each nozzle portion The directivity of the ejection stream 77 of 75 is shown in Figs. 3 and 4, and is set to the length direction of the slightly longer ellipse whose axial cross-sectional shape is N. The substrate W is conveyed in a direction A at a specific angle α. The ground is inclined, and the inclination angle α is equal between the ejection streams 77 of each ejection angle Deng 75. Also, the angle formed by the length direction N of the ejection area of the nozzle portion 75 and the substrate conveyance direction A is 0; The value of ° < α < 180 ° is sufficient, but α is 90 °. Even if the size of the ejection area of the nozzle portion in the length direction N1 is larger than the distance between the adjacent nozzle portions 75, it is possible to prevent the ejection areas of the adjacent nozzle portions 75 from interfering with each other. In contrast, in this embodiment, at least one of the cleaning unit] and the cleaning unit 丨 3 is changed as shown in FIG. 5 and FIG. 6, which is one of the ejection sections 47 and 53. K5942 -15-1244719 points 11 of the poor? The σ of the corner portion 7 5 is depleted in the directivity of the mud 7 7. That is, the nozzle portions 75 (in this case, the left and right nozzle portions 75a, 75a, 75b) to change the directivity of the ejection stream 77, and the nozzle sections 75a and 75b have the function of cleaning the substrate end (the function of the nozzle Shao. More specifically, the nozzle sections 7 5 a and 7 5 b will be depleted by 4 0 出 出 泥 7 7 < The vehicle is made from a slightly longer ellipse with a right-angled cross section, and the length direction N a is substantially parallel to the conveying direction a. Therefore, the ejection flow 77 of the nozzle portions 7 ^ and 75b can be concentrated toward the The substrate w is ejected at both end portions (including the end portion) in the width direction. When the directivity setting of the ejection flow 77 of the nozzles 75a and 75b is changed, the arrangement position, arrangement interval, and arrangement of the nozzle portions 75 are also changed. The number and the like are also adjusted as necessary. The directivity (N) of the jet stream 77 of the nozzle sections other than the nozzle sections 75a and 75b is substantially unchanged. In the setting state of the forging in this embodiment, each nozzle section 75 ejects The ejection area of each of the effervescent flows 77 is set such that when viewed from the upstream or downstream side of the conveying direction A, It appears that they overlap each other partially in the width direction of the base. Regarding the directivity of this jet stream 77— &u;, and more, it can be performed only on the washing section 11 or only on the washing section. It can be executed on the part 13 1 3, or executed on both the washing part 13 and the washing part 13. In addition, in the example of π, 5 and 6 shown in FIG. 6, only the ejection part 47 on the upper side, 53 啧 屮 啧 屮 与, and, Ling out / Zha 7 71 Only the day of the river + mother will change, but you can also only come out on the lower mouth ...
Wi^49、55執nm之設定變更 ，或就上下兩面側之噴出部4 - _ 147 49、w執行同樣之設 定變更。 又’作為變形例，如圖7所示 在圖3及圖4所示之多數噴 85942 -16- 1244719 嘴部75(第1噴嘴部）75以外，追加設有專門洗淨基板W之寬 方向之兩端部之至少2個（在此為2個）噴嘴部（第2喷嘴部，基 板端部洗淨用之喷嘴部）79a、79b。此噴嘴部79a、79b係向 基板W之寬方向之對應端部噴出與其他噴嘴部75同樣之高 壓純水或霧狀混合流體形成之噴出流77。又，噴嘴部79a、 79b所噴出之噴出流77之軸直角剖面形狀係與其他噴嘴部 7 5同樣之形狀，其軸直角剖面形狀之略長橢圓形之長度方 向N設定為略平行於搬運方向A。因此，喷嘴部79a、79b之 噴出流77可集中地向基板W之對應端部（含兩端部）噴出。又 ，如此洗淨基板W之端部之噴嘴部75a、75b、79a、79b未 必需要屬於可形成軸直角剖面呈略長橢圓形之噴出流之喷 嘴邵’且未必需要對應於基板W之兩端部設置。例如，為 了防止污染物流至基板W表面側，只要在基板w之傾斜方向 •上側之端部，對應於基板W之傾斜方向上側之端部而設置 噴嘴部75a、75b即可，又在因與搬運滾輪3之凸緣部3c之接 觸而使基板W之傾斜方向之下側端部容易受；亏染時，只要 對應於基板W之傾斜方向之下側端部而設置噴嘴部7 5 a、 75b即可。 其次’过明利用基板處理裝置1施行洗淨處理之情形。依 照特定搬運路徑被導入基板處理裝置1内之基板W係如上 所述，沿著搬運方向A，一面被傾斜搬運，一面被施行洗淨 。首先，基板W被水流形成部Ί 7之略呈水簾狀純水之水流 洗淨後，被送至洗淨部7。在洗淨部7,利用嘴出部33喷出 之低壓純水洗淨基板w之上面側，並一面利用喷出部35、 85942 1244719Wi ^ 49, 55 change the setting of nm, or perform the same setting change for the ejection parts 4-147 on the upper and lower sides. As a modification, as shown in FIG. 7, in addition to the majority of the nozzles 85942 -16-1244719 shown in FIG. 3 and FIG. 4, the width direction of the special cleaning substrate W is additionally provided in addition to the nozzle portion 75 (first nozzle portion) 75. At least two (here, two) nozzle portions (second nozzle portions, nozzle portions for cleaning substrate end portions) of both end portions 79a, 79b. The nozzle portions 79a and 79b eject a jet stream 77 of high-pressure pure water or a mist-like mixed fluid similar to that of the other nozzle portions 75 toward the corresponding end portion in the width direction of the substrate W. The axial right-angled cross-sectional shape of the ejection flow 77 ejected from the nozzle portions 79a and 79b is the same shape as that of the other nozzle portions 75, and the slightly longer elliptical length direction N of the axial right-angled cross-sectional shape is set to be slightly parallel to the conveying direction. A. Therefore, the ejection streams 77 of the nozzle portions 79a and 79b can be collectively ejected toward the corresponding end portions (including both end portions) of the substrate W. In addition, the nozzle portions 75a, 75b, 79a, and 79b that clean the ends of the substrate W in this way do not necessarily need to belong to the nozzles Shao 'that can form a slightly longer elliptical ejection stream with an axial right-angled section and do not necessarily need to correspond to both ends of the substrate W Ministry settings. For example, in order to prevent the contaminants from flowing to the surface side of the substrate W, the nozzle portions 75a and 75b may be provided at the ends of the substrate W in the oblique direction and the upper side, corresponding to the ends of the substrate W in the oblique direction. The contact of the flange portion 3c of the conveying roller 3 makes the lower end portion of the substrate W in the oblique direction easy to suffer; in the case of defective dyeing, as long as the nozzle portion 7 5 a is provided corresponding to the lower end portion of the substrate W in the oblique direction. 75b is sufficient. Next, the case where the cleaning process is performed by the substrate processing apparatus 1 is too clear. The substrate W introduced into the substrate processing apparatus 1 according to the specific conveyance path is as described above. The substrate W is conveyed obliquely and cleaned while being conveyed along the conveyance direction A. First, the substrate W is cleaned by a stream of pure water having a water curtain-like shape, and then sent to the washing section 7. In the cleaning section 7, the upper surface side of the substrate w is cleaned with low-pressure pure water sprayed from the nozzle discharge section 33, and the spray section 35, 85942 1244719
3 7向基板W噴出低壓純水，一面利用洗淨刷3丨剃洗基板W 之下面側。 接著’利用水流形成部1 9之略呈水簾狀純水之水流洗淨 基板W後，將其送至洗淨部9。在洗淨部9，利用喷出部4 1 、4 j由上下對基板w喷出低壓純水，以施行基板之洗淨。 接著’利用水流形成部2 1之略呈水簾狀純水之水流洗淨 基板W後，將其送至洗淨部]丨。在洗淨部1 1，利用喷出部 47、49由上下對基板W喷出高壓純水，以施行基板w之洗 淨0 接著，利用水流形成部23之略呈水簾狀純水之水流洗淨 基板w後，將其送至洗淨部13。在洗淨部]3，利用喷出部 5 ^由上方對基板W喷出混合純水與空氣之霧狀混合流體， 以施行基板w之上面側之洗淨，並利用噴出部55由下方對 基板W喷出高壓純水，以施行基板w之下面側之洗淨。 接著，利用水流形成部25之略呈水簾狀純水之水流洗淨 基板w後，將其送錢淨部15。在洗淨部丨)·，&基板處理 裝置1外部將未使用之高潔淨度之純纟利用喷出部59、61由 上下噴出至基板w’以施行基板w之洗淨。通過洗淨部15 基板W被排出至基板處理裝置1外。 如上所述’依據本會祐形能，刹田、土、<,、 ^ 爲她形怨利用洗淨邵1 1之嘴出部47 之高壓喷出之純水之強衝墼吏Low pressure pure water is sprayed onto the substrate W, and the lower surface of the substrate W is shaved by the cleaning brush 3 丨. Next, the substrate W is cleaned by a stream of pure water of a water curtain-shaped pure water in the water flow forming section 19, and then sent to the cleaning section 9. In the cleaning section 9, the substrates w are sprayed with low-pressure pure water from the top and bottom by the spraying sections 4 1 and 4 j to clean the substrate. Next, 'the substrate W is cleaned by a stream of pure water of a water curtain-like pure water flow in the water flow forming section 21, and then sent to the cleaning section] 丨. In the cleaning section 11, the substrate W is sprayed with high-pressure pure water by the spraying sections 47 and 49 from above and below to perform the cleaning of the substrate w. Next, the water flow of the water flow forming section 23 is a water curtain-like pure water. After the substrate w is cleaned, it is sent to the cleaning section 13. In the cleaning section] 3, the spraying section 5 is used to spray a misty mixed fluid of pure water and air on the substrate W from above to perform cleaning on the upper side of the substrate w, and the spraying section 55 is used for The substrate W sprays high-pressure pure water to clean the lower surface of the substrate w. Next, the substrate w is cleaned by a stream of pure water having a water curtain-like shape in the water flow forming section 25, and then the substrate w is sent to the money cleaning section 15. In the cleaning section 丨), & the substrate processing apparatus 1, the unused high purity pure 纟 is ejected from above and below to the substrate w 'by the ejection sections 59, 61 to clean the substrate w. The substrate W is discharged to the outside of the substrate processing apparatus 1 by the cleaning unit 15. As mentioned above, according to the sacred energy of this society, Sakata, Tu, < ,, ^ used the strong pressure of pure water to wash the high-pressure spray from the mouth 47 of the mouth of Shao 1 1 1 for her resentment.
打手刀 K /7衣物有效地由基板W 上面側剝離後，利用洗淨喑 ， 尹J〜貧出45 J之霧狀混合流體 之某軟性且利用空裒六狄&上认、亡、+ 一 力盔择大的沭速，可在瞬間將浮游於 基板W上面側上之〉'亏垫私 < 物除去主基板W外。其結果，可有效 85942 1244719 防止由基板w剝離之污染物再附著於基板w，提高洗淨效 果。 又’利用洗淨部1 1及洗淨部1 3施行洗淨前，可利用洗淨 部7(噴出邵33、3:>、37及洗淨部9之喷出部41、43之低壓 純水’了員先除去附著力較弱之污染物及粒子尺寸較大之粒 子狀污染物’以減輕洗淨部u及洗淨部〗3之污染物除去之 負擔’並降低被洗淨部1〗及洗淨部1 3剝離之污染物再附著 於基板Wi概率’其結果，可提高基板處理裝置丨整體之1先 淨效果。此效果在污染程度大的基板w之洗淨中特別有效。 另外’由於洗淨部7、9、U、13、15及水流形成部]7、 丨9、2 1、2 3、2 5被收容於處理槽5中，可防止在各洗淨部7 、9、1 1、13、15及水流形成部17、19、21、23、25使用之 純水（也含水#)及所除去之污染物等漏到基板處理裝置1外 ’並可在由外界被阻斷足狀態下，執行在各洗淨部7、9、 1 1、1 3、1 5及水流形成部1 7、1 9、2 1、23、25之洗淨處理 及在各洗淨部7、9、1 1、1 3、1 5間之基板搬運。 又，在各洗淨部7、9、11、13呈現設有容器39、45、51 、57之雙重箱構造，故可防止在各洗淨部7、9、丨丨、n使 用之純水（也含水霧）及所除去之污染物等漏到基板洗淨部7 、9、11、13外’而對其他洗淨部7、9、n、|3等造成不良 影響，並可防止在洗淨部7、9、Π、13之洗淨中，由處理 槽5之頂板部等掉下之水滴等落在基板W上，而；亏染到&才反 W。 另外，利用設於各洗淨部7、9、Η、π間之水流形成部 -19 - 1244719 1 9、2 1、2 3之田么g… 王水廉狀之水流，藉前段之洗淨部7、9、 1 1由基板W所剝齙$、、la , ^ 二… 汀Ti雄而；予游於基板W上之污染物可被水流形 成部19、人丄 部7 9 一 —佘去至基板W外，可有效抑制前段之洗淨 、9、11由基板W所剝離之污染物被搬運至後段之洗淨 部 9、1 1、1 3 〇 在利用私運方向A最上游端之洗淨部之洗淨部7設在 搬運方向八上軸之水流开彡成部17之略呈水簾狀之水流，施 订在各洗淨邵7、9、11、13、15之洗淨之前階段，可預-先 除去、，低附著於基板…之污染物，以減輕洗淨部7' 9、 丨5〜污术物除去之負擔，並降低被洗淨部7、9、 Η、丨3、】5剝離之污染物再附著於基板w之概率，其結果 ，可提高基板處理裝置1整體之洗淨效果。 另外，利用不含洗淨部15之搬運方向A最下游端之洗淨部 之洗淨部丨3設在搬運方向A下游側之水流形成部25之略呈 水簾狀之水流，可防止被前段之各洗淨部7、9、n、丨3由 基板w剝萬隹而浮游於基板w上之污染物再附著於基板w，並 可防止-旦由基板W被除去之污染物混入洗淨液之純水之 水霧及水滴等而再附著於基板w。 又，由於設有洗淨部〗5作為搬運方向A最下游側之洗淨部 ，以洗淨邵1 5之咼潔淨度之未使用之純水施行基板w之洗 淨作為基板洗淨之加工工序時，可防止被前段之各洗淨部7 、9、11、13等由基板W剝離而浮游於基板w上之污染物再 附著於基板w，並可防止一旦由基板w被除去之污染物混入 洗淨液之純水之水霧及水滴等而再附著於基板Wt>此效果 85942 -20 - 1244719 在W段之各洗淨部7、9、1 1、〗3等所使用之純水一旦使用 後予以回收再使用時特別有效。 力外，由於基板W係以傾斜於水平方向之狀態，一面被 搬運，一面被各洗淨部7、9、u、13、]5及各水流形成部 1 7、1 9、2 1、23、25施行洗淨，故使用於洗淨之純水不致於 長時間滞留於基板W表面，可抑制污染物再附著於基板w。 又，由於供應純水用之泵65在洗淨部1丨及洗淨部〗3中被 共用，故可謀求成本降低及設置空間之降低。 “ 另夕丨在’先’爭邵11及洗淨邵1 3中至少一方，其噴出部4 7 、53(或上下之噴出部47、49、53、55)洗淨基板…之寬方向 之兩端部之噴嘴部75a、75b之噴出流77之指向性係如圖5及 圖6所示，將噴出流77之軸直角剖面形狀之略長橢圓形之長 度方向設定為略平行於搬運方向A。因此，噴嘴部75a、7讣 、出机7 7可集中地向基板w之寬方向之兩端部噴出。因 此，可確實除去附著於基板w端部之污染物，其結果，可 防止被刮離 < 基板w端部之污染物再附著於基板w，或污染 、：運’袞l 等，導致其他基板w被該受污染之搬運滾輪3 等所冷染之2次污染發生。 又，由於使用純水作為在各洗淨部7、9、丨丨、丨3、丨5及 :水流形成部17、19 ' 21、23、25使用之洗淨液，故洗淨 後不必再度以純水洗淨，故可謀求裝置ι之小型、低成本化 等。 乃由於利用設於洗淨部7之污染物之剥離力較高之洗 ⑽糾洗淨基板W之下面側，附著力強的污染物也可有效 S5lM2 1244719 地由基板w被剝離除去，故可提高洗淨效果。 又，由於洗淨部7之洗淨刷31設於洗淨部9、11、13之搬 運方向A上游側，由基板w被洗淨刷3 1剥離之污染物假使再 附著於基板W，也可利用後段之各洗淨部9、11、1 3有效地 將該再附著之污染物除去至基板W外。 <第2實施形態> 圖8係表示本發明之第2實施形態之基板處理裝置1之構 成之模式圖。本實施形態之基板處理裝置1與上述第1實一施 形態之基板處理裝置1實質上相異之點僅在於在洗淨部7追 加基板W之上面侧之洗淨刷81之點而已，故互相對應之部 分僅附上同一參照符號而省略其說明。 在本實施形態之基板處理裝置1中，於洗淨部7追加設置 基板W之上面側之洗淨刷81。洗淨刷81設於容器7内之基板 W之上面側，可利用未圖示之移動機構，在接近於基板w 上面之接近位置與離開基板W上面之退避位置間移動。又 ’洗淨刷81係在位於接近位置之狀態下，被未圖示之驅動 機構旋轉趨動，用於刷洗基板W之上面側。噴出部33喷出 之純水也擔當沾濕洗淨刷81及被洗淨刷81洗淨之基板W之 洗淨面之作用。 在利用此種構成，使欲避免對基板W之圖案形成面之上 面側造成傷害之情形，可在使洗淨刷81退避至退避位置之 狀態下，不會對基板W之上面側造成傷害地施行洗淨處理。 又，對於無需顧慮傷害問題之基板W(素玻璃基板及成膜 後之膜之膜質較硬之基板等），利用使洗淨刷81接近於接近 85942 -22- 1244719 伋且，利用污染物之剝離力較高之洗淨刷81施行洗淨時， ，力強的污染物也可有效地由基板…上面予以 去’謀求提高洗淨效果。 、又，因洗淨部7之洗淨刷81設於洗淨部9、丨丨、13之搬運 :向A上游側，由基板…被洗淨剥離之污染物假使= 者於基板w，也可利用後段之各洗淨部9、n、n有效地^ 孩再附著之污染物除去至基板w外。 1 <變形例> — ⑴在上述各實施形態中，洗淨部7、9、】5可分別予以省 略，各水流形成部〗7、1 9、2〗、π、κ u u 21、2j、25也可分別予以省略。 尤其’在洗淨部7、9、"、13間之水流形成部丨9、）丨、 23万面，如上述實施形態般，—面傾斜搬運基板W，一面 對其施以洗淨處理時，由於可右 田万'了有效地抑制污染物再附著於 基板W，故可予以劣略。但不傾斜搬運而採用水平搬運基 板W時，仍以設置水流形成部】9、21、為宜。 又，洗淨部9之上面側之噴出部41如第2實且施形態般，在 設置有洗㈣7之上錢淨用之洗淨仙時可加以省略。 (2) 在上述各實施形態中，洗淨部】丨、13之喷出部47、49 、55與洗淨部丨3之噴出部53雖採用共用供應純水用之果65 之構成’但也可採用在洗淨部π、]3之噴出部Ο、49、W 與洗出部53個別地設置果之構成。 (3) 也可將上述各實施形態之基板處理裝置】適用於使用 .藥液或機能水（臭氧水、驗性水、氫水等）施行處理之基板處 理裝置。 S5942 -23 - 1244719 (4) 在上述各實施形態中，對不太要. |八文水 > 面側之潔淨庐一> 基板W施行洗淨時，也可省略洗淨部7 > ' 刷3 1。 〜-元乎 (5) 在上述各實施形態之洗淨部9、η、 1 j甲，上下雖办3 噴出部41、43、47、49、53、55，乍斟ζ。乂且 仁對不太要求下面側之 潔淨度之基板W施行洗淨時，也可省訂㈣Μ出部43 、49、55。反之，希望更提高基板w之潔淨度時，也可在J 上下雙方各併設多數個（例如2個）噴出部4丨、43、47 一 53 、 55 。 49 、 又，在洗淨部13方面，欲提高基板w之下面側之潔淨度 時，也可在基板W之下面側追加設置嘴出純水與空氣之^ 狀混合泥體之噴出部47。$夕卜，希望更提高下面側之潔淨 度時，也可在基板W之下面側併設2個以上之噴出部。 【發明之效果】 依據申請專利範圍第1項之發明，利用第I噴出部之高屙 喷出之洗淨液之強衝擊力有效地由基板剝離污染物後，利 用第2噴出邵之霧狀混合流體之柔軟性且利用氣體之力發 揮大的流速，可在瞬間將浮游於基板上之污染物除去至基 板外。其結果，可有效防止由基板剝離之污染物再附著= 基板’提南洗淨效果。 依％申凊專利範圍第2項之發明，利用第|及第2噴出部施 行洗淨前，可利用第3噴出部之低壓洗淨液，預先除去附著 力較弱之污染物及粒子尺寸較大之粒子狀污染物，以減輕 第1及第2喷出邵之污染物除去之負擔，並降低被第1及第） S5942 •24- 1244719 噴:部剝離之；亏染物再附著於基板之概率’其結果，可提 =基㈣理裝置整體之洗淨效果。此效果在污染程度大的 基板之洗淨中特別有效。 依據申5¾專利範圍第3 jg >久 收容於處理槽中，==出由於第1及_部被 +、 万止在各貧出邵使用之洗淨液及所除 去：：染物等漏到基板處理裝置外，並可在由外界被阻斷 基板搬運。 處理及在各噴出部間之 _申請專利_第4項之發明，利用設於各噴出部間之 其爾邵之液流，藉前段之嘴出部由基板所剝離而浮 污染物可被第1液流形成部除去至基板外，可 出部:卩段《噴出部所剝離之冷染物被搬運至後段之噴 之第5項之發明，在利用設於第1噴㈣ 部第2液流形成部之液流，掩行在各嘴出 物乂:1:讀段’可預先除去、降低附著於基板之污汰 ::夂：減輕後段之各喷出部之污染物除去之負擔，並降； 可：：二邵：離之污染物再附著於基板之概率，其結果： J挺巧基板處理裝置整體之洗淨效果。 依據申請專利範圍第6項之發明，利用設於第 “ 搬運方向下游側♦学， ^ °丨5 < 夂喑+形成部之液流，可防止被前段+ ;，、出邵由基板剥離而浮游於基板上之污染物再附著心 :及7防止一旦由基板被除去之污染物混入洗淨液：： 務及水滴等而再附著於基板。 便〜水 85942 -25 - 1244719 …依據中請專利範圍第7項之發明，由於在第2噴㈣之搬 運万向下籽側，設有直接使用由裝置外部供應之未使用之 洗乎液而洗耗板之第4噴出部，故作為基板洗淨之加工工 序’以弟4噴出邵之高潔淨度之未使用之洗淨液洗淨基板時 ϋ方止被利&足各噴出邵等由基板剝離而浮游於基板上 =染物再附著於絲，並可防止—旦由絲麵去之污 木物此人洗#液《水霧及液滴等而再附著於基板。此效果 在前段之各噴出部等所使用之洗淨液-旦使用後予以回1 再使用時特別有效。 依據申請專利範圍第8項之發明，由於.基板係以傾斜於水 平万向之狀態’―面被搬運，—面被各噴出部施行洗淨， 故使用於洗淨之液體不致於長時間滞留於基板表面，可抑 制污染物再附著於基板。 :崎申請專利範圍第9項之發明，由於供應洗淨水用之系 在第1噴出部及第2噴出部中被共用’故可謀求成本降低及 設置空間之降低。 依據申請專利範圍第1G項之發明，由於設有附退避機能 之洗淨刷’在㈣免對基板造成傷害之情形’可在使洗淨 刷退避至退避位置之狀態下，施行洗淨處理。另一方面， 料無需顧慮傷害問題之基板（素玻璃基板及成膜後之膜 之技育較硬之基板等），利用污染物之剥離力較高之洗㈣ 施行洗淨時’連附著力強的污染物也可有效地由基板上面 卞以剝離除去，謀求提高洗淨效果。 又，因洗淨刷設於第卜貪出部之搬運方向上游側，由基板 S5942 -26- 1244719 破洗淨刷剝離之污染物假使再”於基板，也可利用後段 〈各噴出部有效地將該再附著切染物除去至基板外。 +依據中請專利範圍別項之發明，由於^噴出部及第2 ^出邵中至少-方包含洗淨垂直於基板之前述搬運方向之 兄万向之端部之基板端部洗淨用之嘴嘴部，故可確啻洗 基板端部。 … :據中請專利範圍⑽項之發明，心可利用設於第i #部及第2喷出部中至少K多數第嘴部所喷出_之 」2 "_L ’肖勾地洗淨基板整體，有效地洗淨附著於基板之 ::物’且由於基板端部洗淨用之噴嘴部之噴出流之軸直 2面形狀沿著基板之搬運方向呈細長之略長摘圓形，可 二X 4賣均邰之嘴出流集中地向基板端部喷出，並可確實除 、附料基板端部之污染物，其結果，可防止被剝離之基 =邵之污染物再附著於基板’或污染到搬運滾輪等，導 致其他基板被該受污染之搬運滾輪等所冷染之2次污染發 生0 基=中請專利範圍第13項之發明，由於設有洗淨垂直於 二 挑1運方向足兔方向之端部之基板端部洗淨用之噴嘴 邯，故可確實洗淨基板端部。 士：：申請專利範圍第]4項之發明’由於基板端部洗淨用 w 4之噴出流之軸直角剖面形狀沿著基板之搬運方向 a長〜略長#1圓形，可使該噴嘴部之喷出流集巾地而基 板端邵噴出’並可確實除去附著於基板端部之污染物，其 仝士 果 、 、 可防止被刮離之基板端部之污染物再附著於基板表 -27- 1244719 面，或污染到搬運滾輪等，導致其他基板被該受污染之搬 運滾輪等所污染之2次污染發生。 由於使用水作為洗淨 可謀求裝置之小型化 由於設有向垂直於基 依據申請專利範圍第1 5項之發明 液，故洗淨後無必要以水再度洗淨 、低成本化等。 依據申請專利範圍第1 6項之發明 板之搬運方向之宽方向之端部噴出洗淨用之喷出流之基板 端部洗淨用之噴嘴部，該噴嘴部之喷出流之抽直角剖面-形 狀沿著前述搬運方向呈細長之略長橢圓形，故可使該噴嘴 邵之噴出流集中地向基板端部噴出，並可確實除去附著於 基板端部之污染物’其結果’可防止被剝離之基板端部之 染物再附著於基板，或污染到搬運滾輪等，導致其他基 板被該受污染之搬運滾輪等所污染之2次污染發生。 依據申請專·圍第17項之發明，由於可制多數哈嘴 部所噴出之喷出流有效洗淨附著於基板端部之污染物，並 =該多數噴嘴部中之基板之寬方向之端部嗜出喷出流之 ΪΓΓ之噴出流之軸直角剖面形狀之略長橢圓之長度方向 W疋於略平行於基板之搬運方向，故可使該喷嘴部之喷 π中地向基板端部噴出，並可確實除去附著於基板端 奴染物’其結果，可防止被剥離之基板端部之冷染物 再附著於m料雜運滾輪等，導㈣ 雙冷染之搬運滾輪等所污染之2次污染發生。 1據申請專利範圍第]8項之發明，由於設有整體地均勾 淨基板之多數個第1噴嘴部、與集中地洗淨基板端部之至 物42 -28- 1244719 ：> 2個足第2噴嘴部，因此，可利用多數個第丨喷嘴部所喷出 之噴出流均勻洗淨基板整體，且將至少2個之第2噴嘴部之 噴出流之軸直角剖面形狀之略長橢圓形設定為沿著基板之 搬連方向呈細長之略長橢圓形，故可使該噴嘴部之噴出流 本中地向基板端部噴出，並可確實除去附著於基板端部之 丨亏术物其結果，可防止被剝離之基板端部之污染物再附 著於基板，或污染到搬運滾輪等，導致其他基板被該受污 术足搬運滾輪等所污染之2次污染發生。 一 依據申印專利範圍第】9項之發明，可利用以高壓喷出之 洗淨液之強衝擊力有效地由基板㈣污染物，&高洗淨效 果。 依據申請專利範圍第2〇項之發明，利用霧狀混合流體之 本幻生且利用2氣力發揮大的流速，可在瞬間將浮游於基 权上面i彳上 < 污染物除去至基板外。故提高洗淨效果。 【圖式簡單說明】 圖係表示本盔明 < 第】實施形態之基板處理裝置之構成 之模式圖。 圖2係說明基板之傾斜搬運用之圖。 圖3係由洗淨部或洗淨部之噴出部噴出之噴出流之一般 的（基本的）形態之說明圖。 ，圖4係由洗淨部或洗淨部之噴出部噴出之噴出流之一般 的（基本的）形態之說明圖。 圖5係由洗平邯或洗淨部之噴出部噴出之嘴出流之第1實 施形態之設定形態之說明圖。 S5942 -29- 1244719 圖6係由洗淨部或洗淨部之噴出部噴出之噴出流之第丨實 施形態之設定形態之說明圖。 圖7係由洗淨部或洗淨部之喷出部喷出之噴出流之變形 例之設定形態之說明圖。 圖8係表示本發明之第2實施形態之基板處理裝置之構成 之模式圖。 【圖式代表符號說明】 基板處理裝置 搬運滾輪 處理槽 洗淨部 水流形成部 洗淨刷 5 7、 9、 11、 13、 15 17 、 19 、 21 、 23 、 25 31 33 、 35 、 41 、 43 、 47 、 49 、53、55、59、61 喷出部 39、45、51、57 容器 75、75a、75b、79a、79b 喷嘴部 81 洗淨刷 A 搬運方向 P 泵 W 基板 S5942 -λ()-After the knives K / 7 clothing is effectively peeled off from the upper side of the substrate W, it is cleaned with a wash 喑, Yin J ~ 45 J, a certain softness of the mist-like mixed fluid, and the use of air Liu Di & identify, die, + A strong helmet can be selected at a large speed, and the "defective material" floating on the upper side of the substrate W can be removed from the main substrate W in an instant. As a result, 85942 1244719 can effectively prevent the contaminants peeled off from the substrate w from re-adhering to the substrate w, thereby improving the cleaning effect. It is also possible to use the low pressure of the washing section 7 (spraying Shao 33, 3: >, 37 and the washing sections 9 and 43 of the washing section 9 before the washing section 11 and the washing section 13 are cleaned. Pure water 'removes pollutants with weak adhesion and particulate pollutants with large particle size to reduce the burden of pollutant removal in the washing section u and the washing section 3 and reduce the washed section 1】 and the probability that the peeled off pollutants will reattach to the substrate Wi. As a result, the overall cleaning effect of the substrate processing device can be improved. This effect is particularly effective in cleaning the substrate w with a large degree of pollution. In addition, 'because the washing sections 7, 9, U, 13, 15, and the water flow forming section] 7, 丨 9, 2 1, 2, 3, and 2 5 are housed in the processing tank 5 and can be prevented in each washing section 7 , 9, 1, 1, 13, 15 and pure water (also containing water #) and removed contaminants used by the water flow forming sections 17, 19, 21, 23, 25 leak out of the substrate processing apparatus 1 'and can be used in When the outside is blocked, the washing process is performed in each of the washing sections 7, 9, 1 1, 1, 3, 1 5 and the water flow forming section 1, 7, 19, 2 1, 23, and 25. Net part 7, 9, 1 1, 1 The substrate is transported between 3 and 15. In addition, the double box structure with containers 39, 45, 51, and 57 is provided in each cleaning section 7, 9, 11, and 13, so it can be prevented in each cleaning section 7, 9 , 丨 丨, n The pure water (also containing water mist) and the removed pollutants leak out of the substrate cleaning section 7, 9, 11, 13 'and other cleaning sections 7, 9, n, | 3 This can cause adverse effects, and can prevent water droplets falling from the top plate portion of the processing tank 5 from falling on the substrate W during the cleaning of the cleaning sections 7, 9, Π, and 13; In order to reverse W. In addition, use the water flow forming unit -19-1244719 1 9, 2 1, 2 3 installed in each washing section 7, 9, 1, 2 ... The water flow in the shape of Wang Shui, borrowed from the previous paragraph The cleaning sections 7, 9, and 11 are peeled off by the substrate W. $ ,, la, ^ ... Ting Ti Xiong; pollutants swimming on the substrate W can be formed by the water flow forming section 19, and the human part 7 9 a -It is effectively removed from the substrate W, which can effectively suppress the cleaning in the previous stage, and the pollutants peeled off by the substrate W in 9, 11 are transported to the cleaning unit 9, 1 1, 1 3 in the subsequent stage. The cleaning section 7 of the upstream cleaning section is set to be moved. The water flow in the direction of the upper eight axis is split into a slightly water curtain-shaped water flow in the part 17, and it is ordered at the stage before the washing of each washing Shao 7, 9, 11, 13, 15 and can be pre-removed, low Contaminants adhering to the substrate to reduce the burden on the cleansing section 7 '9, 5 ~ 5, and reduce the re-attachment of the pollutants peeled off by the cleansing section 7, 9, Η, 3, 5] As a result, the cleaning effect of the entire substrate processing apparatus 1 can be improved as a result of the substrate w. In addition, the cleaning section using the cleaning section at the most downstream end of the transportation direction A without the cleaning section 15 is provided at the transportation The water flow of the water flow forming portion 25 on the downstream side in the direction A is a curtain-like water flow, which can prevent pollutants floating on the substrate w from being stripped from the substrate w by the washing sections 7, 9, n, and 3 in the preceding stage. Re-adhesion to the substrate w can prevent the contaminants removed from the substrate W from being mixed with the water mist and water droplets of pure water in the cleaning solution, and then being attached to the substrate w. In addition, since the cleaning section 5 is provided as the cleaning section at the most downstream side in the conveying direction A, the cleaning of the substrate w is performed by washing unused pure water with a cleanliness of 15 ° C as the processing for cleaning the substrate. During the process, it is possible to prevent contaminants floating on the substrate w from being peeled off from the substrate W by the respective cleaning sections 7, 9, 11, 13 and the like in the preceding stage, and then to adhere to the substrate w, and to prevent pollution once the substrate w is removed. The substance is mixed with pure water, water mist and water droplets of the cleaning solution, and then adheres to the substrate Wt> This effect 85942 -20-1244719 The cleaning parts 7, 9, 1, 1, 3 etc. used in the W section It is particularly effective when water is recycled after it is used. In addition, since the substrate W is inclined in a horizontal direction, the substrate W is transported while being cleaned by each of the washing sections 7, 9, u, 13, and 5 and each of the water flow forming sections 1 7, 19, 2 1, 23. Since the washing water is washed at 25, the pure water used for washing will not stay on the surface of the substrate W for a long time, and it is possible to prevent the pollutants from attaching to the substrate w again. In addition, since the pump 65 for supplying pure water is shared by the washing section 1 丨 and the washing section 3, cost reduction and installation space can be reduced. "In addition, in at least one of the" first "competition Shao 11 and the cleaning Shao 1 3, the ejection sections 4 7 and 53 (or the upper and lower ejection sections 47, 49, 53, 55) clean the substrate in a wide direction ... The directivity of the ejection stream 77 of the nozzle sections 75a and 75b at both ends is shown in Figs. 5 and 6, and the length direction of the slightly longer ellipse of the orthogonal cross-sectional shape of the axis of the ejection stream 77 is set to be slightly parallel to the conveying direction. A. Therefore, the nozzle portions 75a, 7 讣, and the outlet 7 7 can be collectively sprayed toward both ends in the width direction of the substrate w. Therefore, the contaminants attached to the ends of the substrate w can be reliably removed, and as a result, it can be prevented The contaminates scraped off the end of the substrate w then adhere to the substrate w, or become contaminated, such as: transport, etc., causing the second substrate w to be cold-stained by the contaminated transporting roller 3 and the like to cause secondary pollution. In addition, since pure water is used as the washing liquid used in each of the washing sections 7, 9, 丨 丨, 丨 3, 丨 5, and the water flow forming sections 17, 19 '21, 23, and 25, it is not necessary to clean it again after washing. It can be washed with pure water, so that the size and cost of the device can be reduced. It is because the peeling force of the pollutants provided in the washing section 7 is relatively small. Takazumi cleans and cleans the lower surface of the substrate W. Contaminants with strong adhesion can also be removed and removed from the substrate w by S5lM2 1244719, so the cleaning effect can be improved. Also, the cleaning brush of the cleaning section 7 31 is provided on the upstream side in the conveying direction A of the cleaning sections 9, 11, 13 and the substrate w is cleaned by the cleaning brush 31. If the pollutants peeled off from the substrate W are reattached to the substrate W, the cleaning sections 9 and 11 in the rear section can also be used. And 13 effectively remove the re-adhered contaminants out of the substrate W. < Second Embodiment > Fig. 8 is a schematic diagram showing the configuration of a substrate processing apparatus 1 according to a second embodiment of the present invention. This implementation The substrate processing apparatus 1 of this form is substantially different from the substrate processing apparatus 1 of the first embodiment described above only in that a cleaning brush 81 on the upper surface side of the substrate W is added to the cleaning section 7, and therefore correspond to each other. Only the same reference numerals are attached to the parts, and description thereof is omitted. In the substrate processing apparatus 1 of this embodiment, a cleaning brush 81 on the upper surface side of the substrate W is additionally provided in the cleaning section 7. The cleaning brush 81 is provided in the container 7 The upper side of the inner substrate W can be moved by an unillustrated moving mechanism. Move between the approaching position on the substrate w and the retreating position away from the substrate W. In the state where the cleaning brush 81 is in the approaching position, it is rotated by a driving mechanism (not shown) for cleaning the substrate W Upper side. The pure water sprayed from the spraying part 33 also functions as a wet surface for the cleaning brush 81 and the cleaning surface of the substrate W washed by the cleaning brush 81. With this configuration, the substrate W In the case where the upper surface of the pattern forming surface causes damage, the cleaning brush 81 can be retreated to the retreat position without causing damage to the upper surface of the substrate W. In addition, it is not necessary to worry about the problem of injury. Substrate W (plain glass substrate and substrate with harder film quality after film formation), use cleaning brush 81 to make the cleaning brush 81 close to 85942 -22-1244719, and use a cleaning brush with a higher peeling force of pollutants When cleaning is performed, strong pollutants can also be effectively removed from the substrate ... to improve the cleaning effect. Moreover, since the cleaning brush 81 of the cleaning section 7 is disposed on the cleaning section 9, 丨 丨, and 13 for transportation: to the upstream side of A, the substrate is cleaned and stripped of the pollutants. The cleaning sections 9, n, n in the rear stage can be used to effectively remove the pollutants re-adhered to the substrate w. 1 < Modifications > — ⑴ In each of the above embodiments, the washing sections 7, 9, and 5 can be omitted respectively, and each of the water flow forming sections 〖7, 19, 2〗, π, κ uu 21, 2j , 25 can also be omitted separately. In particular, the water flow forming sections 丨 9,), and 230,000 in the cleaning sections 7, 9, " and 13 are like the above-mentioned embodiment, the substrate W is inclined to transport the substrate W, and the substrate W is cleaned while facing it. At the time of processing, it is possible to prevent the contamination from re-adhering to the substrate W effectively, so it can be inferior. However, when the substrate W is transported horizontally without being inclined, it is still preferable to provide a water flow forming unit] 9, 21, or the like. In addition, the spraying portion 41 on the upper side of the washing portion 9 is the same as the second embodiment and can be omitted when a washing sensation for washing money on the washing bowl 7 is provided. (2) In each of the above-mentioned embodiments, the cleaning section], 13 of the spraying sections 47, 49, 55 and the cleaning section 丨 3 of the spraying section 53 adopt the structure of the fruit 65 for supplying pure water. It is also possible to adopt a configuration in which fruit is separately provided in the spraying sections 0, 49, W of the washing section π,] 3 and the washing section 53. (3) The substrate processing apparatus of each of the above embodiments can also be applied to a substrate processing apparatus that performs processing using chemical solution or functional water (ozone water, test water, hydrogen water, etc.). S5942 -23-1244719 (4) In each of the above embodiments, it is not necessary. | Hachimansui > Clean Room 1 on the side > When the substrate W is cleaned, the cleaning section 7 may be omitted. ≫ 'Brush 3 1. ~ -Yuanhu (5) Although the cleaning sections 9, η, and 1j in each of the above embodiments are formed, there are 3 ejection sections 41, 43, 47, 49, 53, and 55 at the top and bottom. When the substrate W is cleaned, which does not require the cleanliness of the lower side, the 省 M output sections 43, 49, 55 can be saved. On the other hand, when it is desired to further improve the cleanliness of the substrate w, a plurality of (for example, two) ejection sections 4 丨, 43, 47, 53, 55 may be provided on each of the upper and lower sides of J. 49. Also, in the case of the cleaning unit 13, if the cleanliness of the lower surface of the substrate w is desired, a spraying unit 47 for spraying a mixture of pure water and air from the lower surface of the substrate W may be additionally provided. When it is desired to further improve the cleanliness of the lower surface, two or more ejection portions may be provided on the lower surface of the substrate W in parallel. [Effects of the invention] According to the invention of the first scope of the patent application, the strong impact of the cleaning liquid sprayed by the high spray of the first spraying portion is used to effectively peel off the pollutants from the substrate, and then the second spraying mist is used. The softness of the mixed fluid and the use of gas to exert a large flow rate can remove contaminants floating on the substrate to the outside of the substrate in an instant. As a result, it is possible to effectively prevent re-adhesion of contaminants peeled from the substrate = substrate's cleaning effect. According to the invention in item 2 of the patent application of %%, before using the | and 2nd spraying section for cleaning, the low-pressure cleaning liquid in the 3rd spraying section can be used to remove the weakly adherent pollutants and the particle size in advance. Large particulate pollutants, in order to reduce the burden of removing pollutants from the first and second sprays, and reduce the first and second) S5942 • 24-1244719 spray: Partially peeled off; defective materials are then attached to the substrate Probability 'The result can be improved = the overall cleaning effect of the basic appliance. This effect is particularly effective in cleaning a substrate having a large degree of contamination. According to application 5¾ patent scope No. 3 jg > long-term storage in the processing tank, == out of the cleaning solution used by the first and second parts +, Wan Zhi in each poor out Shao Shao and removed :: dyes, etc. leaked Outside the substrate processing device, the substrate can be transported by being blocked from the outside. Treatment and application of the _ patent application _ item 4 between the ejection sections, utilizing the flow of the fluids provided between the ejection sections, the floating contamination can be removed by the substrate in the front section by peeling off the substrate 1 The liquid flow forming part is removed from the substrate, and the part can be taken out: The invention of item 5 in the section "Cold dyed material peeled from the discharge section is transferred to the latter section, and the second liquid flow provided in the first spray section is used. The liquid flow in the forming part is hidden in the discharge of each mouth. 乂: 1: read the section 'can be removed in advance to reduce the dirt attached to the substrate .: 夂: reduce the burden of removing pollutants from each discharge section in the subsequent section, and Decrease; Can :: Er Shao: Probability of the re-attachment of contaminated pollutants on the substrate. The result: J. The cleaning effect of the substrate processing device as a whole. According to the invention in item 6 of the scope of patent application, using the liquid flow located on the downstream side of the "conveying direction", ^ ° 丨 5 < 夂 喑 + forming part can prevent the front stage +; And the pollutants floating on the substrate are re-attached: and 7 to prevent the pollutants from being removed from the substrate from being mixed into the cleaning solution: water and water droplets and so on to re-attach to the substrate. ~ Water 85942 -25-1244719… The invention according to item 7 of the patent scope, because the second spray nozzle is provided with a fourth spraying portion that directly cleans the plate by using the unused washing liquid supplied from the outside of the device. Processing process of substrate cleaning 'When washing the substrate with the unused cleaning solution sprayed with the high cleanliness of the 4th spray Shao Fang Zhili & each sprayed out Shao, etc. peeled off from the substrate and floated on the substrate = dye and then Adhesion to the silk, and can be prevented-once the dirt is removed from the silk surface, this person will wash the liquid #water mist and droplets and then attach it to the substrate. This effect is used in the cleaning liquid used in each ejection section in the previous section. -It is especially effective when it is returned to 1 after use. According to the eighth invention, since the substrate is transported in a state inclined to the horizontal universal, the surface is cleaned, and the surface is cleaned by each ejection section, so the liquid used for cleaning does not stay on the surface of the substrate for a long time. Residual contaminants can be prevented from adhering to the substrate .: The invention in item 9 of Saki's patent application scope, because the supply of cleaning water is shared between the 1st and 2nd ejection sections, so that cost reduction and installation space can be achieved. According to the invention in item 1G of the scope of the patent application, because the cleaning brush with a retraction function is provided in the case of avoiding damage to the substrate, the cleaning brush can be retreated in a state where the cleaning brush is retracted to the retreated position. Clean treatment. On the other hand, substrates that do not need to worry about damage (such as plain glass substrates and harder substrates after film formation) are cleaned by cleaning with a higher peeling force of pollutants. Even strong adhesion pollutants can be effectively removed by peeling off the top surface of the substrate, so as to improve the cleaning effect. The cleaning brush is installed on the upstream side of the transport direction of the second dimple, and the substrate S5942 -26- 1244719 If the pollutants peeled off by the cleaning brush are re-applied to the substrate, it is also possible to effectively remove the re-attached cut-and-stain material out of the substrate by using the rear stage (each ejection unit). + According to the invention in the patent claim, since the ^ spouting part and the second ^ out Shaozhong at least-the side includes the nozzle for cleaning the end of the substrate, which is used to clean the end of the brother universal card perpendicular to the aforementioned carrying direction of the substrate. Mouth, so you can clean the end of the substrate. …: According to the invention in the scope of the patent, please use at least K most of the mouth of the i # part and the second ejection part to spray out _ of the "2" " _L 'Xiao Gou clean The substrate as a whole is effectively cleaned and attached to the substrate :: 'and because the axis of the jet stream of the nozzle portion for cleaning the end of the substrate is straight and two-sided, the shape is slightly elongated along the substrate transport direction. The outlet of the nozzle of the second X 4 can be sprayed to the end of the substrate in a concentrated manner, and the contaminants at the end of the substrate can be removed and attached. As a result, the peeled substrate can be prevented from attaching to the contaminants of Shao. The substrate 'or the contamination to the conveying roller, etc., caused the second contamination of the other substrate to be cold-stained by the contaminated conveying roller, etc. 0 base = the invention in item 13 of the patent claim, because the cleaning is provided perpendicular to the second Pick the nozzle nozzle for cleaning the end of the substrate at the end in the direction of the foot and rabbit, so the end of the substrate can be cleaned reliably. Taxi: The invention in the scope of patent application] Item 4 of the invention 'Because the end section of the substrate 4 for cleaning the end of the jet stream, the right-angled cross-sectional shape of the substrate along the conveying direction of the substrate is a long ~ slightly longer # 1 round, which can make the nozzle The ejection stream of the part collects the ground and the substrate end is ejected. It can reliably remove the pollutants attached to the end of the substrate. The same fruit, can prevent the pollutants from being scraped off the end of the substrate and then attach to the substrate. Table-27 -1244719 surface, or contamination to the transport roller, etc., resulting in secondary contamination of other substrates by the contaminated transport roller, etc. Since water can be used for washing, the miniaturization of the device can be achieved. Since the invention liquid is provided perpendicular to the base according to item 15 of the scope of the patent application, it is not necessary to wash again with water after washing, and the cost can be reduced. According to the patent application No. 16 of the invention, the end of the board in the width direction of the conveying direction sprays out the nozzle for cleaning the substrate end, and the nozzle section is used to draw a right-angled section of the nozzle. -The shape is a slender and slightly oval shape along the aforementioned conveying direction, so that the jet stream of the nozzle can be concentratedly sprayed toward the end of the substrate, and the contaminants 'result' attached to the end of the substrate can be reliably removed, and the result can be prevented The dye on the end of the peeled substrate is reattached to the substrate, or is contaminated by the conveying roller, etc., causing secondary contamination of other substrates by the contaminated conveying roller and the like. According to the invention of the application item No. 17, since the ejection stream sprayed out by the majority of the nozzles can effectively clean the pollutants attached to the end of the substrate, and = the widthwise end of the substrate in the majority of the nozzles. Partially injecting the jet stream ΪΓΓ The axis of the jet stream is a rectangular cross-section of a slightly longer ellipse. The length direction W is slightly parallel to the substrate transport direction, so the nozzle portion can be sprayed toward the substrate end. It can reliably remove the attached dyes on the substrate side. As a result, it can prevent the cold dyed objects on the end of the peeled substrate from re-adhering to the m material miscellaneous transport rollers, etc., and the contamination caused by the double cold dyed transport rollers. Pollution occurs. (1) According to the invention in item 8 of the scope of patent application, since there are a plurality of first nozzle portions that clean the substrate as a whole, and a substrate 42--28-1244719 that cleans the ends of the substrate collectively: > 2 Since the second nozzle portion is sufficient, the entire substrate can be uniformly cleaned by the ejection streams ejected from the plurality of second nozzle portions, and at least two of the second nozzle portions have slightly longer elliptical cross-sectional shapes at right angles. The shape is set to be a slender, slightly long ellipse along the direction in which the substrate is moved, so that the ejection flow of the nozzle portion can be ejected toward the end of the substrate, and the defective objects attached to the end of the substrate can be reliably removed. As a result, it is possible to prevent the contamination on the end of the peeled substrate from re-adhering to the substrate, or contaminating the conveying roller, etc., and causing secondary contamination of other substrates by the contaminated foot conveying roller or the like. 1. According to the invention in item 9 of the scope of the applied patent, the strong impact of the cleaning solution sprayed under high pressure can be used to effectively remove contaminants from the substrate and the high cleaning effect. According to the invention in the scope of the patent application No. 20, using the essence of the mist-like mixed fluid and using the 2 air force to exert a large flow rate, it is possible to remove the pollutants floating on the base right away < the pollutants outside the substrate. Therefore, the cleaning effect is improved. [Brief Description of the Drawings] The figure is a schematic diagram showing the structure of the substrate processing apparatus of the present embodiment. FIG. 2 is a diagram for explaining the inclined conveyance of a substrate. Fig. 3 is an explanatory diagram of a general (basic) form of the ejection stream ejected from the cleaning section or the ejection section of the cleaning section. Fig. 4 is an explanatory diagram of a general (basic) form of the ejection flow ejected from the cleaning section or the ejection section of the cleaning section. Fig. 5 is an explanatory view of a setting form of the first embodiment of the nozzle outflow from the spraying part of the washing part or the cleaning part of the cleaning part. S5942 -29- 1244719 Fig. 6 is an explanatory diagram of the setting form of the first embodiment of the ejection flow ejected from the cleaning part or the ejection part of the cleaning part. Fig. 7 is an explanatory diagram of a setting form of a modification example of the ejection flow ejected from the cleaning section or the ejection section of the cleaning section. Fig. 8 is a schematic diagram showing a configuration of a substrate processing apparatus according to a second embodiment of the present invention. [Illustration of the representative symbols of the figure] The substrate processing device conveys the roller processing tank, the cleaning part of the water flow forming part, the cleaning brush 5 7, 9, 11, 13, 15 17, 19, 21, 23, 25 31 33, 35, 41, 43 , 47, 49, 53, 55, 59, 61 Ejection section 39, 45, 51, 57 Container 75, 75a, 75b, 79a, 79b Nozzle section 81 Cleaning brush A Transport direction P Pump W Substrate S5942 -λ () -