JP2007031502A - 水性砥粒分散媒組成物 - Google Patents
水性砥粒分散媒組成物 Download PDFInfo
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- JP2007031502A JP2007031502A JP2005213868A JP2005213868A JP2007031502A JP 2007031502 A JP2007031502 A JP 2007031502A JP 2005213868 A JP2005213868 A JP 2005213868A JP 2005213868 A JP2005213868 A JP 2005213868A JP 2007031502 A JP2007031502 A JP 2007031502A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/025—Use, recovery or regeneration of abrasive mediums
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/007—Use, recovery or regeneration of abrasive mediums
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- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M111/00—Lubrication compositions characterised by the base-material being a mixture of two or more compounds covered by more than one of the main groups C10M101/00 - C10M109/00, each of these compounds being essential
- C10M111/04—Lubrication compositions characterised by the base-material being a mixture of two or more compounds covered by more than one of the main groups C10M101/00 - C10M109/00, each of these compounds being essential at least one of them being a macromolecular organic compound
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- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/06—Metal compounds
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- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
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- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
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- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/046—Hydroxy ethers
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- C10M2207/125—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids
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- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
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- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
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- Oil, Petroleum & Natural Gas (AREA)
- Mining & Mineral Resources (AREA)
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Abstract
Description
(式中、R1は水素原子またはメチル基を表し、R2は炭素数1〜18のアルキル基またはアルケニル基を表し、R3は水素原子、または炭素数1〜18のアルキル基もしくはアルケニル基を表し、mは1〜20の数を表す。)
(式中、R1は水素原子またはメチル基を表し、R2は炭素数1〜18のアルキル基またはアルケニル基を表し、R3は水素原子、または炭素数1〜18のアルキル基もしくはアルケニル基を表し、mは1〜20の数を表す。)
本発明の水性砥粒分散媒組成物(実施例1〜4)および本発明以外の水性砥粒分散媒組成物(比較例1〜4)を、表1の組成となるように作成した。さらに、それぞれの水性砥粒分散媒組成物1Lに対し、GC砥粒(#1500)1kgを添加して、攪拌機で1000rpm、1時間攪拌することによって加工用水性スラリーを得た。なお、表1中に記載の各成分に対応する数値は、質量部である。
Claims (10)
- 前記脂肪族多価カルボン酸のアルカリ塩の含有量が、前記水性砥粒分散媒組成物全量を100質量%とした場合に、0.01〜10質量%である請求項2に記載の水性砥粒分散媒組成物。
- 前記グリコール類と前記グリコールエーテル類の含有量の合計が、前記水性砥粒分散媒組成物全量を100質量%とした場合に、50〜98質量%である請求項1〜3のいずれか1項に記載の水性砥粒分散媒組成物。
- 前記水の含有量が、前記水性砥粒分散媒組成物全量を100質量%とした場合に、2〜50質量%である請求項1〜4のいずれか1項に記載の水性砥粒分散媒組成物。
- 前記グリコール類と前記グリコールエーテル類の含有比率が、質量基準で前記グリコール類:前記グリコールエーテル類=50:50〜99:1である請求項1〜5のいずれか1項に記載の水性砥粒分散媒組成物。
- 請求項1〜6のいずれか1項に記載の水性砥粒分散媒組成物と、砥粒とを含むことを特徴とする加工用水性スラリー。
- 請求項7に記載の加工用水性スラリーを用いて、切削加工、研削加工、研磨加工または切断加工を行うことを特徴とする加工方法。
- 請求項7に記載の加工用水性スラリーを用いて、ワイヤソー加工またはバンドソー加工を行うことを特徴とする加工方法。
- 被加工材が、シリコン、石英、水晶、化合物半導体、セラミックス、ガラス、金属酸化物、超硬合金および焼結合金のうち少なくとも一種である、請求項8または9に記載の加工方法。
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005213868A JP4481898B2 (ja) | 2005-07-25 | 2005-07-25 | 水性砥粒分散媒組成物 |
| US11/488,507 US20070169422A1 (en) | 2005-07-25 | 2006-07-18 | Aqueous abrasives dispersion medium composition |
| TW095126730A TWI395807B (zh) | 2005-07-25 | 2006-07-21 | 水性研磨粒分散媒介組成物 |
| EP06253826A EP1752521A1 (en) | 2005-07-25 | 2006-07-21 | Aqueous dispersion medium for abrasive particles |
| KR1020060068981A KR101254339B1 (ko) | 2005-07-25 | 2006-07-24 | 수성 지립 분산매 조성물 |
| CN200610099284XA CN1903968B (zh) | 2005-07-25 | 2006-07-25 | 水性磨料分散剂组合物 |
| US12/486,949 US20090258580A1 (en) | 2005-07-25 | 2009-06-18 | Aqueous abrasives dispersion medium composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005213868A JP4481898B2 (ja) | 2005-07-25 | 2005-07-25 | 水性砥粒分散媒組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007031502A true JP2007031502A (ja) | 2007-02-08 |
| JP4481898B2 JP4481898B2 (ja) | 2010-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005213868A Expired - Lifetime JP4481898B2 (ja) | 2005-07-25 | 2005-07-25 | 水性砥粒分散媒組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20070169422A1 (ja) |
| EP (1) | EP1752521A1 (ja) |
| JP (1) | JP4481898B2 (ja) |
| KR (1) | KR101254339B1 (ja) |
| CN (1) | CN1903968B (ja) |
| TW (1) | TWI395807B (ja) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009031515A1 (ja) * | 2007-09-05 | 2009-03-12 | Kyodo Yushi Co., Ltd. | 遊離砥粒ワイヤソー用水溶性加工油剤、スラリー及び切断加工方法 |
| WO2009041443A1 (ja) * | 2007-09-25 | 2009-04-02 | Kyodo Yushi Co., Ltd. | 遊離砥粒ワイヤソー用水溶性加工油剤 |
| KR20100130159A (ko) | 2009-06-02 | 2010-12-10 | 닛신 가가꾸 고교 가부시끼가이샤 | 수성 절삭액 및 수성 절삭제 |
| WO2010143649A1 (ja) | 2009-06-12 | 2010-12-16 | 日信化学工業株式会社 | 水性切削液及び水性切削剤 |
| KR20100135225A (ko) | 2008-04-30 | 2010-12-24 | 팰리스 카가쿠 가부시기가이샤 | 수용성 절단액 조성물, 수용성 절단액 및 그 수용성 절단액을 이용한 절단방법 |
| JP2011021096A (ja) * | 2009-07-15 | 2011-02-03 | Yushiro Chemical Industry Co Ltd | 固定砥粒ワイヤソー用水溶性加工液 |
| WO2011058929A1 (ja) * | 2009-11-12 | 2011-05-19 | パレス化学株式会社 | 固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法、そのリサイクル方法及び切断によって得られるウェハー |
| JP2011148974A (ja) * | 2009-08-31 | 2011-08-04 | Sanyo Chem Ind Ltd | シリコンインゴットスライス用水溶性切削液 |
| JP2012214638A (ja) * | 2011-03-31 | 2012-11-08 | Sanyo Chem Ind Ltd | 含水切削液組成物およびその製造方法 |
| WO2013113859A1 (de) | 2012-02-01 | 2013-08-08 | Basf Se | Kühl- und/oder schmierflüssigkeiten zur waferherstellung |
| JPWO2013065491A1 (ja) * | 2011-11-01 | 2015-04-02 | 旭硝子株式会社 | ガラス基板の製造方法 |
| JP2016087764A (ja) * | 2014-11-10 | 2016-05-23 | トーヨーエイテック株式会社 | ワイヤソ−用ガイドローラ及びそれを備えたワイヤソー、並びにそのガイドローラの製造方法及び外被層再生方法 |
| JP2016087763A (ja) * | 2014-11-10 | 2016-05-23 | トーヨーエイテック株式会社 | ワイヤソ−用ガイドローラの樹脂層再生方法 |
| WO2016103576A1 (ja) * | 2014-12-26 | 2016-06-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨方法、及びセラミック製部品の製造方法 |
| US9522481B2 (en) | 2009-08-31 | 2016-12-20 | Sanyo Chemical Industries, Ltd. | Water-soluble cutting fluid for slicing silicon ingots |
| JP2021031630A (ja) * | 2019-08-28 | 2021-03-01 | パレス化学株式会社 | 水溶性切削加工液 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8157876B2 (en) * | 2007-07-31 | 2012-04-17 | Cabot Microelectronics Corporation | Slurry composition containing non-ionic polymer and method for use |
| US20090032006A1 (en) * | 2007-07-31 | 2009-02-05 | Chul Woo Nam | Wire saw process |
| DE102010015111A1 (de) * | 2010-03-23 | 2011-09-29 | Schott Solar Ag | Fluide Trennmedien und deren Verwendung |
| JP2012172117A (ja) * | 2011-02-23 | 2012-09-10 | Yushiro Chemical Industry Co Ltd | 固定砥粒ワイヤソー用水溶性加工液 |
| DE102011014828A1 (de) | 2011-03-23 | 2012-09-27 | Schott Solar Ag | Fluide Trennmedien und deren Verwendung |
| CN103131331B (zh) * | 2013-01-30 | 2014-05-21 | 东莞市垠星科技发展有限公司 | 一种沉降性水基研磨液及其制备方法 |
| CN106675696A (zh) * | 2016-12-28 | 2017-05-17 | 苏州协鑫光伏科技有限公司 | 硅片切割用砂浆 |
| CN111298950B (zh) * | 2019-08-07 | 2022-04-05 | 西安隆基锂电新材料有限公司 | 一种水系研磨硅粉的方法及硅粉 |
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| WO2009031515A1 (ja) * | 2007-09-05 | 2009-03-12 | Kyodo Yushi Co., Ltd. | 遊離砥粒ワイヤソー用水溶性加工油剤、スラリー及び切断加工方法 |
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| KR20100135225A (ko) | 2008-04-30 | 2010-12-24 | 팰리스 카가쿠 가부시기가이샤 | 수용성 절단액 조성물, 수용성 절단액 및 그 수용성 절단액을 이용한 절단방법 |
| KR20100130159A (ko) | 2009-06-02 | 2010-12-10 | 닛신 가가꾸 고교 가부시끼가이샤 | 수성 절삭액 및 수성 절삭제 |
| JP2011012249A (ja) * | 2009-06-02 | 2011-01-20 | Nisshin Chem Ind Co Ltd | 水性切削液及び水性切削剤 |
| WO2010143649A1 (ja) | 2009-06-12 | 2010-12-16 | 日信化学工業株式会社 | 水性切削液及び水性切削剤 |
| US8591611B2 (en) | 2009-06-12 | 2013-11-26 | Nissin Chemical Industry Co., Ltd. | Aqueous cutting fluid and slurry |
| JP2011021096A (ja) * | 2009-07-15 | 2011-02-03 | Yushiro Chemical Industry Co Ltd | 固定砥粒ワイヤソー用水溶性加工液 |
| JP2011148974A (ja) * | 2009-08-31 | 2011-08-04 | Sanyo Chem Ind Ltd | シリコンインゴットスライス用水溶性切削液 |
| US9522481B2 (en) | 2009-08-31 | 2016-12-20 | Sanyo Chemical Industries, Ltd. | Water-soluble cutting fluid for slicing silicon ingots |
| CN102686713A (zh) * | 2009-11-12 | 2012-09-19 | 帕莱斯化学株式会社 | 固定研磨粒线锯用水溶性切割液、使用其的铸锭切割方法、其回收方法及切割所得的晶圆 |
| WO2011058929A1 (ja) * | 2009-11-12 | 2011-05-19 | パレス化学株式会社 | 固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法、そのリサイクル方法及び切断によって得られるウェハー |
| JP5764067B2 (ja) * | 2009-11-12 | 2015-08-12 | パレス化学株式会社 | 固定砥粒ワイヤーソー用水溶性切断液、それを用いたインゴットの切断方法、そのリサイクル方法及び切断によって得られるウェハー |
| JP2012214638A (ja) * | 2011-03-31 | 2012-11-08 | Sanyo Chem Ind Ltd | 含水切削液組成物およびその製造方法 |
| JPWO2013065491A1 (ja) * | 2011-11-01 | 2015-04-02 | 旭硝子株式会社 | ガラス基板の製造方法 |
| WO2013113859A1 (de) | 2012-02-01 | 2013-08-08 | Basf Se | Kühl- und/oder schmierflüssigkeiten zur waferherstellung |
| JP2016087764A (ja) * | 2014-11-10 | 2016-05-23 | トーヨーエイテック株式会社 | ワイヤソ−用ガイドローラ及びそれを備えたワイヤソー、並びにそのガイドローラの製造方法及び外被層再生方法 |
| JP2016087763A (ja) * | 2014-11-10 | 2016-05-23 | トーヨーエイテック株式会社 | ワイヤソ−用ガイドローラの樹脂層再生方法 |
| WO2016103576A1 (ja) * | 2014-12-26 | 2016-06-30 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨方法、及びセラミック製部品の製造方法 |
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| JP2021031630A (ja) * | 2019-08-28 | 2021-03-01 | パレス化学株式会社 | 水溶性切削加工液 |
| JP7231934B2 (ja) | 2019-08-28 | 2023-03-02 | パレス化学株式会社 | 水溶性切削加工液 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20070169422A1 (en) | 2007-07-26 |
| KR101254339B1 (ko) | 2013-04-12 |
| TWI395807B (zh) | 2013-05-11 |
| CN1903968B (zh) | 2012-08-22 |
| KR20070013221A (ko) | 2007-01-30 |
| EP1752521A1 (en) | 2007-02-14 |
| US20090258580A1 (en) | 2009-10-15 |
| CN1903968A (zh) | 2007-01-31 |
| JP4481898B2 (ja) | 2010-06-16 |
| TW200708605A (en) | 2007-03-01 |
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