JP2007014990A - Laser processing method and laser processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing method and a laser processing apparatus capable of performing ablation processing and cleaning processing with only a single optical system without preparing an optical system different from that for ablation processing.
A laser processing method according to the present invention includes a laser beam generating step for generating a laser beam for ablation processing, and a first irradiation speed that provides a fluence that allows the laser beam to be ablated on the surface of a workpiece. An ablation process in which a predetermined ablation pattern is irradiated and ablated, and a laser beam is used. The ablation process is sufficiently low that no ablation is performed and sufficient fluence is obtained to remove debris generated in the ablation process. A debris removing step of irradiating an area of the ablation pattern and a range including the periphery thereof at a second irradiation speed to remove the attached debris; According to this method, ablation processing and cleaning processing can be performed with the same optical system.
[Selection] Figure 1

Description

  The present invention relates to a laser processing method and a laser processing apparatus that perform ablation processing and cleaning processing using laser light.

  Laser light having a high energy density is known as a means for processing a material surface. By irradiating the processing object with laser light, it is possible to perform processing such as forming a recess in the processing object. Laser light is mainly classified into two types according to the wavelength of light: laser light existing in the infrared region or visible region and laser light existing in the ultraviolet region. The effect of the former on the object to be processed is mainly the heating action. On the other hand, the photochemical action is remarkable in the latter. The ultraviolet laser beam has a high photon energy, and has an action of strengthening the photochemical reaction by irradiating the irradiated surface, and the object to be processed can be processed by the photochemical reaction while keeping the thermal influence low.

  Ablation processing using laser light is a useful processing technique that can be applied to a wide range of materials such as organic polymer materials, metals, and ceramics. In the ablation processing by irradiating the surface of the workpiece with a laser beam, a processing residue called debris is generated around the irradiation region and is deposited or adhered to the periphery of the processing surface, resulting in deterioration of processing quality.

  As a conventional example, for example, Japanese Patent Application Laid-Open No. 08-187588 discloses a method for removing debris generated by ablation processing using a pulse laser. In this method, an organic thin film is formed in advance on the surface of a workpiece to be laser processed. After ablation processing is performed by irradiating a laser beam on the organic thin film, the surface of the workpiece is cleaned, and the generated debris is removed together with the organic thin film. According to this method, processing residues such as debris do not directly adhere to the surface to be processed, and can be effectively removed simultaneously with the organic thin film.

  Japanese Patent Application Laid-Open No. 2001-269793 discloses a method of blowing a gas such as nitrogen or helium on a processing surface during laser processing as a method for removing debris.

  Further, Japanese Patent No. 3052226 discloses a method of removing debris adhering to the periphery of a processing portion by irradiating a processing surface with a laser beam with an output weaker than a processing threshold.

In Japanese Patent No. 3416264, a laser beam is divided into two optical paths using an optical fiber having a core portion with high transmittance and a farad portion with low transmittance, and a high energy density laser for processing and a low one for cleaning. The workpiece is irradiated with an energy density laser. A method of performing ablation processing in the former and cleaning in the latter is disclosed.
Japanese Patent Application Laid-Open No. 08-187588 JP 2001-269793 A Japanese Patent No. 3052226 Japanese Patent No. 3416264

  In the method described in Patent Document 1, a process for forming and removing an organic thin film on a surface to be processed is required, which causes problems such as production facilities and costs, and further requires complicated operations. Moreover, in the method described in Patent Document 2, the contents of the debris are varied due to different materials constituting the workpiece, so that the spraying effect by gas injection may not function sufficiently. Furthermore, in the method described in Patent Document 3, it is necessary to prepare a debris removal optical system in addition to the ablation processing optical system, so that the control and the apparatus are complicated. Further, in the method described in Patent Document 4, since the laser beam is passed through the optical fiber, there is a limit to the amount of laser energy, and it is difficult to make maximum use of the output.

  In view of the above points, the present invention provides a laser processing method capable of performing ablation processing and cleaning processing (debris removal step) with only a single optical system without preparing a cleaning optical system different from that for ablation processing. And it aims at providing a laser processing apparatus.

Means, actions, and effects to solve the problem

  The laser processing method of the present invention includes a laser beam generating step for generating a laser beam for ablation processing, and a predetermined ablation at a first irradiation speed that provides a fluence capable of ablating the surface of the workpiece with the laser beam. An ablation process for ablating by irradiating a processing pattern; and a laser beam that is sufficiently low that the ablation process is not performed and a fluence sufficient to remove debris generated in the ablation process. And a debris removing step of irradiating the area including the periphery of the ablation pattern at two irradiation speeds and removing the attached debris.

  In the laser processing method of the present invention, ablation processing is performed on the processing surface of the workpiece along the ablation processing pattern with an irradiation fluence equal to or higher than the ablation processing threshold using the main irradiation means. Then, debris removal processing is performed with an irradiation fluence lower than the ablation processing threshold by using auxiliary irradiation means within a wide range including the ablation processing pattern of the workpiece, and debris generated by the ablation processing is removed.

  The laser processing apparatus of the present invention includes a light source that generates a laser beam for ablation processing, and a predetermined irradiation rate of the workpiece at a first irradiation speed that provides a fluence that allows the laser beam to be ablated on the surface of the workpiece. A main irradiating means for irradiating along the ablation pattern; and the ablation processing of the workpiece ablated at a second irradiation speed sufficient to remove the debris generated by the ablation by the laser beam. An auxiliary irradiation unit that irradiates a predetermined ablation pattern and a range including the periphery thereof, and a workpiece holding unit that holds the workpiece.

  In the debris removal process constituting the laser processing method of the present invention, the intensity of the laser beam can be suppressed to a low level without changing the intensity of the laser beam used in the ablation process.

  In the debris removing process, the irradiation path of the laser beam can be irradiated while being swung in a direction intersecting the advancing direction of the ablation processing pattern while proceeding along the ablation processing pattern by the auxiliary irradiation means. Here, “swinging” means, for example, irradiation that advances in a predetermined direction while irradiating a rotating circle or the like, or irradiation that advances in a predetermined direction while swinging left and right. As described above, the irradiation path and speed of the laser beam can be changed to obtain an appropriate fluence.

  In the debris removal step, the fluence can be adjusted to be smaller as the distance from the ablation pattern is longer in the direction intersecting the advancing direction of the ablation pattern based on the principle of debris generation. Thereby, it is possible to perform debris removal according to the density distribution of debris around the ablation pattern.

  In this way, after ablation processing is performed by the main irradiation means, a debris removal is performed by irradiating a laser beam having an appropriate fluence using an auxiliary irradiation means within a wide range including the ablation processing pattern. Ablation processing and cleaning processing can be performed with one optical system.

  The laser processing apparatus of the present invention includes a light source, main irradiation means, auxiliary irradiation means, and a workpiece holding means.

  The light source includes a laser head and a laser driving unit. The laser head is driven by a laser driving unit. The laser driving unit includes a laser controller and can control the intensity of the laser beam.

  In addition, an amplifier such as an attenuator for adjusting the intensity of the laser beam emitted from the laser head can be provided in the light source. In addition, the opening and closing of the optical path of the laser beam is controlled by a shutter, and the phase of the laser beam can be matched via a half-wave plate and a quarter-wave plate.

  The main irradiating means is for irradiating a laser beam with a predetermined fluence for ablation processing, and includes a reference irradiating means and a driving means. A reference irradiating means is composed of a total reflection mirror, a wedge substrate, a relay, a dichroic mirror, an objective entrance pupil, and a condenser objective lens.

  The laser beam emitted from the laser head is guided by an optical system composed of a total reflection mirror, a wedge substrate, a relay, a dichroic mirror, and the like, and further to the workpiece through the objective entrance pupil and the condenser objective lens. Incident. The condensing objective lens can be moved in the optical axis direction by the moving means. The laser beam whose optical path is adjusted in this way forms an image on the processing pattern while adjusting the focal length. The driving means drives the workpiece holding means.

  The auxiliary irradiating means vibrates or rotates the movement of the wedge substrate included in the main irradiating means in a predetermined direction in order to remove the debris generated by the ablation processing. For example, the auxiliary irradiating means includes a rotary motor having a rotating function. it can. By vibrating or rotating the wedge substrate, the optical path of the laser beam adjusted by the main irradiation means can vibrate in a predetermined direction and with a predetermined width, or can be rotated with a predetermined radius and a predetermined speed.

  The workpiece holding means fixes the workpiece and moves it in a predetermined direction (X axis, Y axis, Z axis direction) in the space. Ablation is performed while moving the workpiece held by the holding means in the direction along the machining pattern. In addition, when a workpiece undergoes a chemical reaction due to components in the air, such as oxidation or nitridation, when the workpiece is ablated with a laser beam in air, the holding means may be provided with a vacuum container for storing the workpiece. Is possible. Note that the vacuum container is provided with a window for transmitting the laser beam.

  Further, the laser processing apparatus of the present invention includes independent control means for independently controlling each component such as a light source, main irradiation means, auxiliary irradiation means, and workpiece holding means, or centralized control means for centralized control. It is possible to provide. The concentration control means centrally controls the light source, the main irradiation means, the auxiliary irradiation means, and the workpiece holding means. The monitoring means observes the process of irradiating the laser beam adjusted via the dichroic mirror along the processing pattern of the workpiece in real time. Information obtained by the monitoring means is sent as electronic signals to the central control means, and each part of the optical system is controlled through the central control means to perform ablation processing and cleaning processing.

  In the specification of the present application, the irradiation energy density of the laser beam is referred to as “fluence”, and the dry etching phenomenon that occurs on the irradiated surface by the laser beam irradiation is referred to as “ablation”.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic view showing an embodiment of a laser processing apparatus used for ablation processing of the present invention.

  As shown in FIG. 1, the laser processing apparatus of the present invention includes a light source 1, a main irradiation means 2, an auxiliary irradiation means 3, a workpiece holding means 4, a monitoring means 5, a central control means 6, Have

  As the light source 1, an ultrashort pulse laser head 11, a laser driving unit 12, an attenuator 13, a shutter 14, a ½ wavelength plate 15, and a ¼ wavelength plate 16 are provided. The intensity of the ultrashort pulse laser beam driven by the laser driving unit 12 and emitted from the ultrashort pulse laser head 11 is adjusted via the attenuator 13, and passes through the half-wave plate 15 and the quarter-wave plate 16. Phase matching. A shutter 14 between the attenuator 13 and the half-wave plate controls the opening and closing of the optical path.

  As the main irradiation means 2, a total reflection mirror 21, a wedge substrate 22, a first relay 23 and a second relay 24, a dichroic mirror 25, an objective entrance pupil part 26, and a condenser objective lens 27 are provided. The laser beam emitted from the laser head 11 is reflected by the surface of the total reflection mirror 21, passes through the wedge substrate 22, the optical path is adjusted by the first relay 23 and the second relay 24, and is incident on the dichroic mirror 25. . The laser beam incident on the dichroic mirror 25 is divided into two, and becomes a laser beam for laser processing and a visible light beam. The visible light beam is observed by the monitoring means 5 described later.

  The laser beam for laser processing is emitted by the dichroic mirror 25 and guided to the objective entrance pupil part 26. The objective entrance pupil 26 is provided. The condensing objective lens 27 determines the focal point of the laser beam to be ablated. Furthermore, since it has an AF movable part, it is possible to adjust the laser beam irradiation spot area, such as changing the imaging magnification, and to control the irradiation fluence. The laser beam emitted from the focusing objective lens 27 is finally incident on the ablation pattern W1 (see FIGS. 3 and 5) of the workpiece W held by the holding unit 4.

  As the auxiliary irradiating means 3, a rotating means 31 for rotating the wedge substrate 22 of the main irradiating means 2 is provided. The wedge substrate 22 is fixed to the rotating means 31 and is rotated by the rotating means 31. As the wedge substrate 22 is rotated by the rotating means 31, the laser beam incident on the wedge substrate 22 is transmitted through the wedge substrate 22 and simultaneously changes its optical path, and is rotated and emitted with a circumferential locus as shown in FIG. Furthermore, if the holding means 4 is advanced along the ablation pattern W1, it is possible to irradiate not only the ablation pattern W1 but also a wide range including its periphery. The optical path indicated by a solid line with an arrow in FIG. 1 is when the rotating means 31 constituting the auxiliary irradiating means 3 rotates the wedge substrate 22 and is at a certain rotational position a, and the optical path indicated by the dotted line with an arrow is This is when the wedge substrate 22 is rotated to reach a rotational position b different from the rotational position a.

  Further, by adjusting the rotation speed of the rotating means 31 and the traveling speed of the holding means 4, a fluence suitable for cleaning processing can be obtained. The rotating means 31 can be replaced with another auxiliary irradiating means 3. For example, a vibrating means for vibrating the wedge substrate 22 can be used instead of the rotating means 31.

  A silicon wafer W is used as a workpiece and is held on the stage 41. The stage 41 can adjust the position in the X-axis and Y-axis directions. Note that the height (Z-axis) and angle (θ) of the stage 41 can also be adjusted.

  The monitoring means 5 for observing the visible light beam is composed of a device capable of monitoring in real time such as a CCD camera. The laser processing step is monitored by the monitoring means 5 and sent to the central control means 6 as an electrical signal. The central control unit 6 centrally manages and controls each unit such as a computer, and can control the light source 1, the main irradiation unit 2, the auxiliary irradiation unit 3, the holding unit 4, and the like programmatically.

  The central control means 6 generates a signal for controlling the light source 1, the main irradiation means 2, the auxiliary irradiation means 3 and the holding means 4 based on the electrical signal from the monitoring means 5, and the light source 1, the main irradiation means 2 and the like are generated. Control is performed to perform laser processing in accordance with the signal command.

  In the laser processing method of the present invention, a laser beam having a wavelength generated by the light source 1 of 1.55 μm or 1.0 μm is used. It is characterized by using an ultrashort pulse laser having a pulse time width of 10 ps or less. The repetition frequency of the laser beam is 100 kHz or more.

  The ablation processing of the present invention is performed by irradiating a predetermined ablation processing pattern W1 using the main irradiation means 2 at a first irradiation speed that provides a fluence that allows ablation processing on the surface of the workpiece. The intensity of the laser beam used for ablation processing is controlled in advance by the light source 1. The laser beam forms an image on the surface of the workpiece W held by the holding unit 4 via the main irradiation unit 2. The ablation processing is performed by moving the stage 41 of the workpiece holding means 4 by a driving means (not shown) along a predetermined ablation processing pattern W1 at a speed at which the fluence is equal to or higher than the ablation processing threshold.

  By the ablation process, a groove due to the dry etching action is formed on the surface of the workpiece W to form a processing pattern W1. The depth of the grooved processing pattern W1 is affected by the sweep speed of the laser beam. In the ablation processing, only the main irradiation means 2 is operated and the auxiliary irradiation means 3 is not operated. Therefore, the position where the laser beam is incident on the wedge substrate 22 is fixed, and the moving speed of the stage 41 holding the workpiece W is the laser beam. The sweep speed becomes. The moving speed of the stage 41 constitutes the first irradiation speed of the present invention. If the moving speed of the stage 4 is fast, the fluence of the laser beam incident on the workpiece W becomes weak, and the groove of the processing pattern W1 becomes shallow. Conversely, if the moving speed of the stage 41 is slow, the groove of the processing pattern W1 becomes deep.

  After ablation processing, cleaning processing (debris removal) is performed. A laser beam with the same intensity as the ablation processing by the light source 1 or a laser beam adjusted to be lower than the ablation processing is used to form an ablation processing pattern W1 obtained by ablating the workpiece W via the main irradiation means 2. Irradiate. Simultaneously with this irradiation, the rotating substrate 31 of the auxiliary irradiation unit 3 rotates the wedge substrate 22 of the main irradiation unit 2. Then, as shown in FIG. 2, the laser beam is guided through the wedge substrate 22, and is rotated and emitted with a circumferential locus having a constant radius according to the wedge angle of the wedge substrate 22. The combined processing speed is determined by the rotational speed of the rotating means 31 and the traveling speed at which the stage 41 of the holding means 4 is advanced along the ablation processing pattern W1 by the driving means. This composite processing speed constitutes the second irradiation speed of the present invention. By adjusting the synthetic processing speed, it is possible to control the fluence that requires the cleaning processing to remove the debris W2 generated by the ablation processing.

  As shown in FIG. 3, a direction diagram (vertical direction in FIG. 3) intersecting the advancing direction (left-right direction in FIG. 3) of the ablation processing pattern W1 of the debris W2 generated around the ablation processing pattern W1 at the time of ablation processing. The density distribution in (direction) has a functional relationship with the distance away from the ablation pattern W1. That is, the generated debris W2 falls freely around the pattern W1 due to gravity and is blown away by ablation. Accordingly, the closer to the ablation pattern W1, the higher the density distribution, and the farther away, the lower the density distribution, and the distribution density varies depending on the distance.

  Considering this, when performing the cleaning process, the combined processing speed determined by the rotation speed of the rotating means 31 and the traveling speed of the stage 41 is adjusted, and the laser beam irradiated for the cleaning process depends on the density distribution of the debris W2. Can have a fluence with a functional relationship.

  Further, as shown in FIG. 4, the auxiliary irradiating unit 3 vibrates the optical path by a vibrating unit or the like instead of rotating the optical path by the rotating unit 31, surrounds the periphery of the ablation processing pattern W1, and becomes wider than the ablation processing region. The area can be illuminated. FIG. 5 shows a period variation diagram of the irradiation fluence according to the density distribution of the debris W2 when the optical path is vibrated. As can be seen, the irradiation fluence during the cleaning process is the strongest when the laser beam reaches the center of the ablation pattern W1, and when the density distribution of the debris W2 is low and away from the center of the ablation pattern W1. It becomes weakest and has a functional relationship with the distance from the ablation pattern W1 and changes periodically.

In FIG. 1, the laser beam guided from the dichroic mirror 25 forms an image on the workpiece W through the objective lens 27. Here, if the distance from the dichroic mirror 25 to the objective lens 27 is A, the distance from the objective lens 27 to the workpiece W is B, and the focal length of the lens is F, the lens formula: 1 / A + 1 / B = 1 / F is established. If the position of the objective lens 27 is adjusted in the optical axis direction by adjusting means (not shown), the imaging magnification at which the laser beam emitted from the objective lens 27 forms an image on the surface of the workpiece W can be changed. it can. Thereby, the spot irradiation area of the laser beam on the surface of the work surface W can be changed, and the fluence that can be cleaned can be adjusted.
[Experiment 1]

  Laser processing experiments were conducted based on the examples of the present invention. Each condition of the laser processing experiment is shown in Table 1. In this experiment, a B-250 type laser generator is used, the pulse repetition frequency is 162 kHz, and the time width is 870 fs. The optical system is composed of the main irradiating means 2, and the objective lens is 10 times made by Olympus and is trepanned by laser beam scanning. Furthermore, when performing the cleaning process, the laser beam rotation irradiation diameter is 157 μm by the wedge substrate.

It can be seen from Table 1 that the debris removal process (cleaning process) is just focused as in the ablation process, and the laser beam output is suppressed compared to the ablation process (450 mW → 150 mW). Further, the irradiation range of the laser beam is expanded by the auxiliary irradiation means 3 from the ablation pattern W1 to a wide range including the width of the rotational irradiation rotational diameter (0.157 mm) on both sides thereof, and the rotational irradiation rotational speed (260 mm / s) and The irradiation fluence is adjusted to be equal to or less than the ablation processing threshold by sweeping at a composite processing speed (second irradiation speed) determined by the advancing speed (0.6 mm / s) in the ablation processing pattern W1 direction. 6A is a photograph before the cleaning process in Experimental Example 1, and FIG. 6B is a photograph after the cleaning process in Experimental Example 1.
[Experiment 2]

  Experimental example 2 is an experiment in which ablation processing and cleaning processing were performed by adjusting the sweep speed without changing the intensity (output) of the irradiation laser beam (both 340 mW). Table 2 shows the laser processing conditions. In this experiment, a D-400 type laser generator is used, the pulse repetition frequency is 200 kHz, and the time width is 300 fs. The optical system is composed of the main irradiating means 2, and the objective lens is 5 times made by Olympus and is trepanned by laser beam scanning. Furthermore, when performing the cleaning process, the laser beam rotation irradiation diameter is 900 μm by the wedge substrate.

Table 2 reveals that ablation processing and cleaning processing can be performed by changing the sweep speed and effectively adjusting the irradiation fluence even when using a laser beam with the same laser beam output (340 mW). It was. Furthermore, by changing the focus of the laser beam emitted from the objective lens 27 (just focus → 0.4 mm upward), it becomes possible to control the irradiation fluence in different focus states. Accordingly, the cleaning process can be performed by combining the adjustment of the focus state and the adjustment of the irradiation fluence of the laser beam by the auxiliary irradiation means 3. That is, the irradiation range of the laser beam is expanded by the auxiliary irradiation means 3 from the ablation pattern W1 to a wide range including the width of the rotational irradiation rotational diameter (0.9 mm) on both sides thereof, and the rotational irradiation rotational speed (1100 mm / s). And sweeping at a composite processing speed (second irradiation speed) determined by the advancing speed (1 mm / s) in the ablation processing pattern W1 direction, adjusting the irradiation fluence to be below the ablation processing threshold, and performing the cleaning processing step after the ablation processing step. It was. 7A is a photograph before the cleaning process in Experimental Example 2, and FIG. 7B is a photograph after the cleaning process in Experimental Example 2.

It is explanatory drawing of a laser processing apparatus. It is an irradiation locus image figure at the time of debris removal by a rotation means. It is a density distribution figure of the debris produced by ablation processing. It is an irradiation locus image figure at the time of debris removal by a vibration means. It is a period change figure of irradiation fluence at the time of debris removal. It is a photograph before the cleaning process in Experimental Example 1. It is the photograph after the cleaning process in Experimental Example 1. It is a photograph before the cleaning process in Experimental Example 2. It is the photograph after the cleaning process in Experimental Example 2.

Explanation of symbols

1: Light source 11: Ultra short pulse laser head 12: Laser drive unit 13: Attenuator 14: Shutter 15: 1/2 wavelength plate 16: 1/4 wavelength plate 2: Main irradiation means 21: Total reflection mirror 22: Wedge substrate 23 : First relay 24: Second relay 25: Dichroic mirror 26: Objective entrance pupil 27: Condensing objective lens W: Workpiece W1: Ablation pattern W2: Debris 3: Auxiliary irradiation means 31: Rotating means 4: Holding Means 41: Stage 5: Monitoring means 6: Centralized control means

Claims (10)

A laser beam generating step for generating a laser beam for ablation processing;
An ablation process for ablating by irradiating a predetermined ablation pattern at a first irradiation speed that provides a fluence capable of ablation on the surface of the workpiece;
A range including the ablation pattern and its surroundings at a second irradiation speed that is sufficiently low that the ablation process is not performed using the laser beam and has a sufficient fluence to remove debris generated in the ablation process. A debris removing step of removing the attached debris by irradiation;
A laser processing method comprising:   The laser processing method according to claim 1, wherein the laser beam has the same intensity in the ablation processing step and the debris removal step.   The laser processing method according to claim 1, wherein the intensity of the laser beam used in the debris removal step is lower than the intensity of the laser beam used in the ablation processing step.   4. The laser processing method according to claim 1, wherein the laser beam irradiation in the debris removal step is performed while swinging along the ablation processing pattern in a direction intersecting the advancing direction of the ablation processing pattern. 5. .   2. The laser processing method according to claim 1, wherein the first irradiation speed is a traveling speed of moving the workpiece along the ablation pattern.   The second irradiation speed is a combined speed of a traveling speed for moving the workpiece along the ablation processing pattern and a vibration speed for moving the workpiece while swinging in a direction crossing the traveling direction of the ablation processing pattern. Item 5. The laser processing method according to Item 1 or 4.   In the debris removal step, the laser beam that irradiates the debris has a functional relationship with a distance away from the ablation processing pattern in a direction that intersects the traveling direction of the ablation processing pattern in accordance with the density distribution of the debris. The laser processing method according to claim 1, which has a fluence. A light source that generates a laser beam for ablation processing;
Main irradiation means for irradiating the laser beam along a predetermined ablation pattern of the workpiece at a first irradiation speed that provides a fluence capable of ablation processing on the surface of the workpiece;
Irradiating the laser beam to a range including the predetermined ablation pattern of the workpiece ablated and the periphery thereof at a second irradiation speed sufficient to remove debris generated by the ablation. Auxiliary irradiation means;
A workpiece holding means for holding the workpiece;
A laser processing apparatus comprising:   The laser processing apparatus according to claim 8, further comprising a control unit configured to centrally control the light source, the main irradiation unit, the auxiliary irradiation unit, and the workpiece holding unit. The main irradiating means drives the workpiece holding means at a speed corresponding to the first irradiation speed along the reference irradiating means for condensing and irradiating the laser beam of the light source at a predetermined position and the ablation pattern. Drive means,
The laser processing apparatus according to claim 8 or 9, wherein the auxiliary irradiation unit is a combination of the main irradiation unit and a vibration unit that vibrates the laser beam in a predetermined direction.

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