JP2007062074A - Display panel, laser scribing method for display panel, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display panel, a display panel manufacturing method and a laser scribing method capable of suppressing laser light traveling beyond a condensing point.
A first pattern forming surface (110) and a second pattern forming surface (120) are arranged to face each other, and a second substrate (12) is provided with a scheduled cutting line (30) for cutting a part of the second substrate (12). As a deterrence part having a reflection function, a virtual plane that passes along the direction perpendicular to the second pattern formation surface 120 and passes through the planned cutting line 30 intersects the second pattern formation surface 120. A manufacturing process for manufacturing a display panel provided with the metal film 16a and a direction perpendicular to the second pattern formation surface 120 toward the opposite surface of the second pattern formation surface 120 and along the planned cutting line 30 And an irradiation step of irradiating the laser beam 35 so that the condensing point P of the laser beam 35 is located inside the second substrate 12.
[Selection] Figure 3

Description

  The present invention relates to a display panel, a laser scribing method for the display panel, and an electronic apparatus.

  Conventionally, a laser scribing method of cutting using a laser beam is known as a method of cutting a glass substrate or the like of a display panel. For example, in the laser scribing method described in Patent Document 1, the laser beam is focused on the inside of the glass substrate to be cut, that is, the laser beam power density is maximized at the focusing point. A modified region is formed at the condensing point portion by irradiating light and utilizing the phenomenon of multiphoton absorption. Then, the glass substrate is cut starting from the modified region.

JP 2002-192371 A

  However, in the above method, there is a problem that the laser beam does not stay at the position of the condensing point but travels through the substrate beyond the condensing point. For example, when the laser beam is focused on the upper substrate of the liquid crystal display panel with the upper and lower substrates bonded together and irradiated with the laser beam, as described above, a part of the laser beam moves from the front side to the back side. Progressing, that is, penetrating, the pattern forming portion formed on the lower substrate is irradiated with laser light, and there is a problem that electrical connection failure due to pattern burning or pattern cutting is likely to occur.

  The present invention has been made to solve the above-described problems, and its object is to provide a display panel capable of suppressing laser light from traveling beyond a condensing point, a laser scribing method for the display panel, and To provide electronic equipment.

  In order to solve the above problems, in the present invention, a first substrate having a first pattern forming surface which is a substrate surface on which a first pattern is formed, and a second pattern forming which is a substrate surface on which a second pattern is formed. A second substrate having a surface is arranged so that the first pattern formation surface and the second pattern formation surface face each other, and a planned cutting line for cutting a part of the second substrate on the second substrate Is a line that intersects at least one of the first pattern formation surface and the second pattern formation surface with a virtual surface that passes along the line to be cut along the direction perpendicular to the second pattern formation surface A manufacturing process for manufacturing a display panel provided with a deterring part having at least one function of reflection, absorption, and scattering at the position of the second pattern forming surface, Vertical one To and along the line to cut, the laser beam converging point within the second substrate is summarized as further comprising an irradiation step of irradiating a laser beam to be positioned.

  According to this, in the manufacturing process, reflection, absorption, at the position of the line where the virtual plane passing through the planned cutting line intersects at least one of the first pattern formation surface and the second pattern formation surface, A suppression unit having at least one function of scattering is formed. Then, in the irradiation process, the laser beam that has further traveled beyond the condensing point set inside the second substrate among the laser beams irradiated along the scheduled cutting line reaches the suppression unit. The traveling force of the laser light that has reached the suppression unit is attenuated by the suppression unit. Accordingly, it is possible to suppress problems such as pattern defects due to burning or cutting of the first pattern formed at locations exceeding the suppression portion with respect to the laser light irradiation direction.

  In the manufacturing process of the laser scribing method for a display panel of the present invention, the suppression portion may be formed of a metal film.

  According to this, the irradiated laser beam can be reflected by the metal film.

  In the manufacturing process of the laser scribing method of the display panel of the present invention, the metal film may be formed on the second pattern forming surface with the same material as the black matrix used for forming the second pattern.

  According to this, since the same material as the black matrix used for forming the first pattern is used, the laser beam can be reflected by the formed black matrix, and further, man-hours such as material selection can be omitted and the work can be performed. Efficiency can be improved.

  In the manufacturing process of the laser scribing method of the display panel of the present invention, the metal film and the black matrix may be formed at the same time.

  According to this, the working efficiency can be improved by forming the metal film and the black matrix at the same time.

  In the manufacturing process of the laser scribing method for a display panel according to the present invention, the suppressing portion may be formed of a resin film.

  According to this, the irradiated laser beam can be absorbed by the resin film.

  In the manufacturing process of the laser scribing method of the display panel of the present invention, the suppressing portion may be formed by forming an uneven portion on the second pattern forming surface.

  According to this, the irradiated laser beam can be scattered by the formed convex and concave portions.

  The gist of the display panel of the present invention is that it is manufactured by the laser scribing method of the display panel.

  According to this, when a part of the second substrate is cut by irradiating the laser beam, the burnout of the first pattern formed on the first substrate corresponding to the portion exceeding the suppressing portion with respect to the irradiation direction of the laser beam A display panel with high reliability can be provided by suppressing defects such as pattern defects caused by cutting.

  The gist of the electronic device of the present invention is that the display panel is mounted.

  According to this, a highly reliable electronic device can be provided.

  Hereinafter, first to third embodiments of the present invention will be described with reference to the drawings.

[First embodiment]
(Configuration of display panel)
First, the configuration of the display panel according to the first embodiment will be described. 1 shows an outline of a mother substrate, FIG. 1 (a) shows a plan view, and FIG. 1 (b) shows a cross-sectional view taken along line AA of FIG. 1 (a).

  In FIG. 1A, a mother substrate 1 is configured by partitioning a liquid crystal display panel 10 as a plurality of display panels. Then, as shown in FIG. 1B, the first substrate 11 and the second substrate 12 are bonded to face each other. One liquid crystal display panel 10 is cut out from the mother substrate 1 by cutting the peripheral edge of each partition region.

  2 shows a configuration of the liquid crystal panel cut out from the mother substrate 1 shown in FIG. 1, FIG. 2 (a) shows a plan view, and FIG. 2 (b) shows a B- in FIG. Sectional drawing of a B line is shown. FIG. 2C shows a cross-sectional view after a part of the second substrate 12 is cut.

  2A and 2B, the liquid crystal display panel 10 is filled in a gap between the first substrate 11, the second substrate 12, and the first and second substrates 11 and 12 bonded by the sealing material 14. Liquid crystal 15 and the like.

  As for the 1st board | substrate 11, the 1st pattern is formed in the 1st pattern formation surface 110 of the glass substrate which has transparency. Specifically, a TFT (Thin Film Transistor) element 13, a pixel electrode (not shown) constituting a pixel connected to one of the three terminals of the TFT element 13, and the remaining two terminals of the TFT element 13 A data line (not shown) and a scanning line (not shown) connected to are formed. The data line is drawn in the Y-axis direction and connected to the data line driving circuit unit 22. The scanning lines are drawn out in the X-axis direction and are connected to the scanning line driving circuit units 21 formed in the left and right frame regions, respectively. The input side wirings of the data line driving circuit unit 22 and the scanning line driving circuit unit 21 are respectively connected to the mounting wiring 20 formed at the end of the first substrate 11 in the Y-axis direction. In the frame area opposite to the mounting wiring 20, a wiring 23 that connects the two scanning line driving circuit units 21 is provided.

  As for the 2nd board | substrate 12, the 2nd pattern is formed in the 2nd pattern formation surface 120 of the glass substrate which has transparency. Specifically, a black matrix 16, a color element 17 formed in a region partitioned by the black matrix 16, and a common electrode 18 formed on the upper surface of the black matrix 16 and the color element 17 are formed. The common electrode 18 is electrically connected to the wiring provided on the first substrate 11 side through the vertical conduction portions 24 provided at the four positions of the second substrate 12, and the wiring is also connected to the mounting wiring 20. .

  An alignment film 19 is formed on each of the surface of the first substrate 11 and the surface of the second substrate 12 facing the liquid crystal 15.

  In the liquid crystal display panel 10, a relay substrate that is electrically connected to an external drive circuit is connected to the mounting wiring 20. An input signal from the external drive circuit is input to each data line drive circuit unit 22 and the scan line drive circuit unit 21, whereby the TFT element 13 is switched for each pixel electrode, and the pixel electrode and the common electrode 18 are switched. In the meantime, a drive voltage is applied to display.

  As described above, the liquid crystal display panel 10 secures a space for connecting the mounting wiring 20 to an external relay substrate, and a part of the second substrate 12 (cutting portion 12a) that is located at a position facing the mounting wiring 20. Need to be cut off.

  For this reason, the second substrate 12 is provided with a scheduled cutting line 30 for setting a position at which a part of the cutting portion 12a of the second substrate 12 is cut. The planned cutting line 30 is provided so as to overlap the mounting wiring 20 of the first substrate 11 in a direction perpendicular to the surface of the second substrate 12. A metal film 16a serving as a restraining portion is formed at the position of a line along the direction perpendicular to the second pattern formation surface 120 and intersecting the virtual pattern surface passing through the scheduled cutting line 30 and the second pattern formation surface 120. Has been. The metal film 16a has a function of reflecting laser light, and in this embodiment, the same material as the black matrix 16 made of chromium is used.

  Laser light is used for cutting the cutting part 12a. By irradiating the laser light along the planned cutting line 30 from the surface opposite to the second pattern forming surface 120 of the second substrate 12, FIG. As shown in FIG. 5, a part of the cut portion 12a of the second substrate 12 is cut off from the second substrate 12 to form the liquid crystal display panel 10a.

(Laser scribing method for display panel)
Next, a laser scribing method for the display panel according to the first embodiment will be described. 3 and 4 are process diagrams showing a scribing method of a liquid crystal display panel as a display panel. Specifically, FIGS. 3A to 3G show a manufacturing process for manufacturing a display panel, and FIGS. 4H and 4I show an irradiation process for irradiating laser light.

  In FIG. 3A, the black matrix 16 is formed on the second pattern formation surface 120 of the second substrate 12, and the metal film 16 a serving as a restraining portion is formed along the planned cutting line 30. The metal film 16a is formed along the direction perpendicular to the second pattern formation surface 120 and at the position of a line where the virtual surface passing through the scheduled cutting line 30 and the second pattern formation surface 120 intersect. In the present embodiment, the metal film 16 a is made of the same material as that of the black matrix 16. The black matrix 16 and the metal film 16a are formed by forming a chromium film on the second pattern formation surface 120 by sputtering or the like and then applying a chromium film pattern by photolithography.

  In FIG. 3B, the color elements 17 are attached to the areas partitioned by the formation of the black matrix 16. The color element 17 is attached by an appropriate method such as a printing method, a photolithography method, or an ink jet method.

  In FIG. 3C, the common electrode 18 is formed on the surfaces of the black matrix 16 and the color element 17. The common electrode 18 is formed by an appropriate method such as a spin coating method, a roll coating method, or an ink jet method.

  In FIG. 3D, an alignment film 19 is formed on the surface of the common electrode 18. The alignment film 19 is formed by an appropriate method such as a spin coating method, a roll coating method, or an ink jet method.

  In FIG. 3E, the sealing material 14 is formed on the second pattern forming surface 120. As the sealing material 14, a thermosetting resin or a UV curable resin can be used, and a printing method, a dispenser method, an ink jet method, or the like can be employed.

  In FIG. 3F, the second substrate 12 and the first substrate 11 on which the first pattern such as the TFT element 13 is formed are bonded by the adhesive force of the sealing material 14.

  In FIG. 3G, the liquid crystal 15 is injected between both the substrates 11 and 12 regulated by the sealing material 14.

  The liquid crystal display panel 10 is formed through the above steps.

  In FIG. 4 (h), the laser beam emitted from the laser light source is used to condense the laser beam emitted from the laser light source to the opposite side of the second pattern forming surface 120 of the second substrate 12 of the liquid crystal display panel 10. A condensing point P of the laser beam 35 is formed inside the second substrate 12 in a direction perpendicular to the second pattern formation surface 120 and along the planned cutting line 30 toward the laser beam irradiation surface 130 to be a surface. The laser beam 35 is irradiated so as to be positioned.

  The laser light source of the laser irradiation apparatus is a femtosecond laser that emits laser light having, for example, titanium sapphire as a solid light source with a femtosecond pulse width. In this case, wavelength: 800 nm, pulse width: 300 fs (femtosecond), repetition frequency: 1 kHz, output: 700 mW. The condenser lens 33 is an objective lens having a magnification of 100 times and a numerical aperture (NA) of 0.8.

  The laser beam 35 is scanned along the planned cutting line 30 with a condensing point P set at a position of about 80% from the laser beam irradiation surface 130 in the thickness direction of the second substrate 12. Further, the focal point P is set in a direction approaching the laser light irradiation surface 130, and scanning is performed along the planned cutting line 30 while irradiating the laser light 35. By scanning this multiple times, a modified region is formed along the planned cutting line 30.

  Then, as shown in FIG. 4I, a part of the cut portion 12a of the second substrate 12 is cut off from the second substrate 12 starting from the modified region, and the liquid crystal display panel 10a is formed.

(Configuration of electronic equipment)
Next, the configuration of the electronic device will be described. FIG. 5 is a perspective view showing a configuration of a projector as an electronic apparatus. In FIG. 5, a plurality of liquid crystal display panels 10a are mounted on the optical system constituting the projector 60.

  Therefore, according to the first embodiment, there are the following effects.

  (1) When the laser beam 35 is irradiated from the laser beam irradiation surface 130 along the planned cutting line 30, the laser beam 35 that has traveled beyond the converging point P is applied to the second pattern formation surface 120 of the second substrate 12. When the metal film 16a formed corresponding to the portion along the planned cutting line 30 is reached, it is reflected by the metal film 16a, so that the progress of the laser light 35 is substantially suppressed, and the irradiation to the mounting wiring 20 is substantially reduced. Can be suppressed. Accordingly, it is possible to reduce defects such as pattern burns and pattern defects of the mounting wiring 20 and the like.

  (2) Since the same material as that of the black matrix 16 is used for the metal film 16a, management such as material selection can be omitted and work efficiency can be improved.

  (3) Since the metal film 16a is formed at the same time as the formation of the black matrix 16, work efficiency can be improved.

[Second Embodiment]
(Configuration of display panel)
Next, a display panel according to the second embodiment will be described. 6 shows a configuration of a liquid crystal display panel as a display panel, FIG. 6A shows a cross-sectional view, and FIG. 6B shows a cross-sectional view after a part of the second substrate 12 is cut. Indicates. In addition, said liquid crystal display panel is the piece liquid crystal display panel cut out from the same mother board | substrate 1 demonstrated in 1st Embodiment (refer FIG. 1).

  6A, the liquid crystal display panel 10 includes a first substrate 11, a second substrate 12, and a liquid crystal 15 filled in a gap between the first and second substrates 11 and 12 bonded by a sealing material 14. It consists of Since the basic configuration of the liquid crystal display panel 10 is the same as the configuration of the liquid crystal display panel 10 in the first embodiment, a description thereof will be omitted and different portions will be described.

  The second substrate 12 is provided with a scheduled cutting line 30 for setting a position for cutting a part of the cutting portions 12a of the second substrate 12. The planned cutting line 30 is provided so as to overlap the mounting wiring 20 of the first substrate 11 in a direction perpendicular to the surface of the second substrate 12. A resin film 40 serving as a restraining portion is formed at a position along a line perpendicular to the second pattern forming surface 120 and intersecting the virtual plane passing through the planned cutting line 30 and the second pattern forming surface 120. Has been. The resin film 40 has a function of absorbing laser light. For example, an epoxy resin or a vinyl chloride resin is used. Moreover, although it is preferable to employ | adopt black as the color of the resin film 40, you may use the translucent resin film 40. FIG.

  Laser light is used for the cutting of the cutting part 12a. By irradiating the laser light along the planned cutting line 30 from the surface opposite to the second pattern formation surface 120 of the second substrate 12, FIG. As shown in FIG. 5, a part of the cut portion 12a of the second substrate 12 is cut off from the second substrate 12 to form the liquid crystal display panel 10a.

(Laser scribing method for display panel)
Next, a laser scribing method for a display panel according to the second embodiment will be described. 7 and 8 are process diagrams showing a scribing method of a liquid crystal display panel as a display panel. Specifically, FIGS. 7A to 7H show a manufacturing process for manufacturing a display panel, and FIGS. 8I and 8J show an irradiation process for irradiating a laser beam.

  In FIG. 7A, a resin film 40 as a restraining portion is formed at a location along the planned cutting line 30 on the second pattern forming surface 120 of the second substrate 12. The resin film 40 is formed along the direction perpendicular to the second pattern formation surface 120 and at the position of a line where the virtual surface passing through the scheduled cutting line 30 and the second pattern formation surface 120 intersect. For example, an epoxy resin is used for the resin film 40 and is formed by a dispenser method, an inkjet method, or the like. Moreover, if necessary, a drying process is performed to form a solidified resin film 40.

  In FIG. 7B, the black matrix 16 is formed on the second pattern forming surface 120 of the second substrate 12. The black matrix 16 is formed by forming a chromium film by sputtering or the like and then applying a chromium film pattern by photolithography.

  In FIG. 7C, the color elements 17 are attached to the areas partitioned by the formation of the black matrix 16. The color element 17 is attached by an appropriate method such as a printing method, a photolithography method, or an ink jet method.

  In FIG. 7D, the common electrode 18 is formed on the surfaces of the black matrix 16 and the color element 17. The common electrode 18 is formed by an appropriate method such as a spin coating method, a roll coating method, or an ink jet method.

  In FIG. 7E, an alignment film 19 is formed on the surface of the common electrode 18. The alignment film 19 is formed by an appropriate method such as a spin coating method, a roll coating method, or an ink jet method.

  In FIG. 7F, the sealing material 14 is formed on the second pattern forming surface 120. As the sealing material, a thermosetting resin or a UV curable resin can be used, and a printing method, a dispenser method, an inkjet method, or the like can be employed.

  In FIG. 7G, the second substrate 12 and the first substrate 11 on which the first pattern such as the TFT element 13 is formed are bonded by the adhesive force of the sealing material 14.

  In FIG. 7H, the liquid crystal 15 is injected between both the substrates 11 and 12 regulated by the sealing material 14.

  The liquid crystal display panel 10 is formed through the above steps.

  In FIG. 8 (i), the condensing lens 33 that condenses the laser light emitted from the laser light source using the laser irradiation device is opposite to the second pattern forming surface 120 of the second substrate 12 of the liquid crystal display panel 10. A condensing point P of the laser beam 35 is formed inside the second substrate 12 in a direction perpendicular to the second pattern formation surface 120 and along the planned cutting line 30 toward the laser beam irradiation surface 130 to be a surface. The laser beam 35 is irradiated so as to be positioned.

  The laser light source of the laser irradiation apparatus is a femtosecond laser that emits laser light having, for example, titanium sapphire as a solid light source with a femtosecond pulse width. In this case, wavelength: 800 nm, pulse width: 300 fs (femtosecond), repetition frequency: 1 kHz, output: 700 mW. The condenser lens 33 is an objective lens having a magnification of 100 times and a numerical aperture (NA) of 0.8.

  The laser beam 35 is scanned along the planned cutting line 30 with a condensing point P set at a position of about 80% from the laser beam irradiation surface 130 in the thickness direction of the second substrate 12. Further, the focal point P is set in a direction approaching the laser light irradiation surface 130, and scanning is performed along the planned cutting line 30 while irradiating the laser light 35. By scanning this multiple times, a modified region is formed along the planned cutting line 30.

  Then, as shown in FIG. 8J, a part of the cut portion 12a of the second substrate 12 is cut off from the second substrate 12 starting from the modified region, and the liquid crystal display panel 10a is formed.

(Configuration of electronic equipment)
Since the configuration of the electronic device is the same as the configuration of the projector 60 as the electronic device of the first embodiment, a description thereof will be omitted (see FIG. 5).

  Therefore, according to said 2nd Embodiment, in addition to the effect of 1st Embodiment, there exists an effect shown below.

  (1) When the laser beam 35 is irradiated from the laser beam irradiation surface 130 along the planned cutting line 30, the laser beam 35 that has traveled beyond the converging point P is applied to the second pattern formation surface 120 of the second substrate 12. When the resin film 40 formed corresponding to the location along the planned cutting line 30 is reached, it is absorbed by the resin film 40, so that the progress of the laser light 35 is substantially suppressed, and the irradiation to the mounting wiring 20 is substantially reduced. Can be suppressed. Accordingly, it is possible to reduce defects such as pattern burns and pattern defects of the mounting wiring 20 and the like.

[Third embodiment]
(Configuration of display panel)
Next, a display panel according to the third embodiment will be described. 9 shows a configuration of a liquid crystal display panel as a display panel, FIG. 9A shows a cross-sectional view, and FIG. 9B shows a cross-sectional view after a part of the second substrate 12 is cut. Indicates. The liquid crystal display panel 10 is an individual liquid crystal display panel cut out from the same mother substrate 1 described in the first embodiment (see FIG. 1).

  9A, the liquid crystal display panel 10 includes a first substrate 11, a second substrate 12, and a liquid crystal 15 filled in a gap between the first and second substrates 11 and 12 bonded by a sealing material 14. It consists of Since the basic configuration of the liquid crystal display panel 10 is the same as the configuration of the liquid crystal display panel 10 in the first embodiment, a description thereof will be omitted and different portions will be described.

  The second substrate 12 is provided with a scheduled cutting line 30 for setting a position for cutting a part of the cutting portions 12a of the second substrate 12. The planned cutting line 30 is provided so as to overlap the mounting wiring 20 of the first substrate 11 in a direction perpendicular to the surface of the second substrate 12. Concave and convex portions 50 are formed as restraining portions at the positions of lines along the direction perpendicular to the second pattern forming surface 120 and intersecting the virtual plane passing through the planned cutting line 30 and the second pattern forming surface 120. Has been.

  Laser light is used for cutting the cutting part 12a. By irradiating the laser light along the planned cutting line 30 from the surface opposite to the second pattern forming surface 120 of the second substrate 12, FIG. 9B. As shown in FIG. 5, a part of the cut portion 12a of the second substrate 12 is cut off from the second substrate 12 to form the liquid crystal display panel 10a.

(Laser scribing method for display panel)
Next, a laser scribing method for a display panel according to the third embodiment will be described. 10 and 11 are process diagrams showing a scribing method of a liquid crystal display panel as a display panel. Specifically, FIGS. 10A to 10H show a manufacturing process for manufacturing a display panel, and FIGS. 11I and 11J show an irradiation process for irradiating a laser beam.

  In FIG. 10A, the concavo-convex portion 50 is formed as a suppression portion at a location along the planned cutting line 30 on the second pattern forming surface 120 of the second substrate 12. The concavo-convex portion 50 is formed at the position of a line along the direction perpendicular to the second pattern formation surface 120 and intersecting the virtual pattern passing through the scheduled cutting line 30 and the second pattern formation surface 120. The uneven portion 50 is formed, for example, by irradiating the second pattern forming surface 120 of the second substrate 12 with the laser light 55.

  In FIG. 10B, the black matrix 16 is formed on the second pattern formation surface 120 of the second substrate 12. The black matrix 16 is formed by forming a chromium film by sputtering or the like and then applying a chromium film pattern by photolithography.

  In FIG. 10C, the color elements 17 are attached to the areas partitioned by the formation of the black matrix 16. The color element 17 is attached by an appropriate method such as a printing method, a photolithography method, or an ink jet method.

  In FIG. 10D, the common electrode 18 is formed on the surfaces of the black matrix 16 and the color element 17. The common electrode 18 is formed by an appropriate method such as a spin coating method, a roll coating method, or an ink jet method.

  In FIG. 10E, an alignment film 19 is formed on the surface of the common electrode 18. The alignment film 19 is formed by an appropriate method such as a spin coating method, a roll coating method, or an ink jet method.

  In FIG. 10 (f), the sealing material 14 is formed on the second pattern forming surface 120. As the sealing material, a thermosetting resin or a UV curable resin can be used, and a printing method, a dispenser method, an inkjet method, or the like can be employed.

  In FIG. 10G, the second substrate 12 and the first substrate 11 on which the first pattern such as the TFT element 13 is formed are bonded by the adhesive force of the sealing material 14.

  In FIG. 10H, the liquid crystal 15 is injected between the substrates 11 and 12 regulated by the sealing material 14.

  The liquid crystal display panel 10 is formed through the above steps.

  In FIG. 11 (i), the condensing lens 33 that condenses the laser light emitted from the laser light source using the laser irradiation device is opposite to the second pattern forming surface 120 of the second substrate 12 of the liquid crystal display panel 10. A condensing point P of the laser beam 35 is formed inside the second substrate 12 in a direction perpendicular to the second pattern formation surface 120 and along the planned cutting line 30 toward the laser beam irradiation surface 130 to be a surface. The laser beam 35 is irradiated so as to be positioned.

  The laser light source of the laser irradiation apparatus is a femtosecond laser that emits laser light having, for example, titanium sapphire as a solid light source with a femtosecond pulse width. In this case, wavelength: 800 nm, pulse width: 300 fs (femtosecond), repetition frequency: 1 kHz, output: 700 mW. The condenser lens 33 is an objective lens having a magnification of 100 times and a numerical aperture (NA) of 0.8.

  The laser beam 35 is scanned along the planned cutting line 30 with a condensing point P set at a position of about 80% from the laser beam irradiation surface 130 in the thickness direction of the second substrate 12. Further, the focal point P is set in a direction approaching the laser light irradiation surface 130, and scanning is performed along the planned cutting line 30 while irradiating the laser light 35. By scanning this multiple times, a modified region is formed along the planned cutting line 30.

  Then, as shown in FIG. 11 (j), the cut portion 12a is separated from the second substrate 12 starting from the modified region, and the liquid crystal display panel 10a is formed.

(Configuration of electronic equipment)
Since the configuration of the electronic device is the same as the configuration of the projector 60 as the electronic device of the first embodiment, a description thereof will be omitted (see FIG. 5).

  Therefore, according to the third embodiment, in addition to the effects of the first and second embodiments, there are the following effects.

  (1) When the laser beam 35 is irradiated from the laser beam irradiation surface 130 along the planned cutting line 30, the laser beam 35 that has traveled beyond the converging point P is reflected on the second pattern formation surface 120 of the second substrate 12. When the concavo-convex portion 50 formed corresponding to the location along the planned cutting line 30 is reached, it is scattered by the concavo-convex portion 50, so that the progress of the laser light 35 is substantially suppressed and the irradiation to the mounting wiring 20 is substantially suppressed. be able to. Accordingly, it is possible to reduce defects such as pattern burns and pattern defects of the mounting wiring 20 and the like.

  The present invention is not limited to the above-described embodiment, and the following modifications are given.

  (Modification 1) In the first and second embodiments, the metal film 16a and the resin film 40 are formed on the second pattern formation surface 120 of the second substrate 12, but the present invention is not limited to this. For example, it may be formed on the mounting wiring 20 formed on the first substrate 11 that overlaps the planned cutting line 30 in a direction perpendicular to the surface of the second substrate 12. Even in this case, since the laser beam 35 is reflected or absorbed by the metal film 16a or the resin film 40, it is possible to reduce the occurrence of burning or cutting of the mounting wiring 20.

  (Modification 2) In the first and second embodiments, the metal film 16a and the resin film 40 are formed on the second substrate 12, but the present invention is not limited to this. For example, it may be formed on both the second substrate 12 and the mounting wiring 20 of the first substrate 11 on the line to be cut 30. In this way, it is possible to further ensure safety against burning and cutting of the mounted wiring 20.

  (Modification 3) In the first and second embodiments, the metal film 16a and the resin film 40 have a film shape with no gap on one surface, but are not limited thereto. For example, a slit shape may be used. Even in this case, the progress of the laser beam can be suppressed.

  (Modification 4) In the first and second embodiments, the metal film 16a and the resin film 40 are formed with a uniform film thickness, but the present invention is not limited to this. For example, the local portion corresponding to the planned cutting line 30 may be thicker than other film thicknesses. In this way, the progress of the laser light 35 can be further suppressed.

The outline of a mother board is shown, (a) is a top view and (b) is a sectional view. The structure of the liquid crystal display panel in 1st Embodiment is shown, (a) is a top view, (b) And (c) is sectional drawing. The laser scribe method of the liquid crystal display panel in 1st Embodiment is shown, (a)-(g) is process drawing which shows a manufacturing process. The laser scribing method of the liquid crystal display panel in 1st Embodiment is shown, (h), (i) is process drawing which shows an irradiation process. The perspective view which shows the structure of a projector. The structure of the liquid crystal display panel in 2nd Embodiment is shown, (a) And (b) is sectional drawing. The laser scribe method of the liquid crystal display panel in 2nd Embodiment is shown, (a)-(h) is process drawing which shows a manufacturing process. The laser scribe method of the liquid crystal display panel in 2nd Embodiment is shown, (i), (j) is process drawing which shows an irradiation process. The structure of the liquid crystal display panel in 3rd Embodiment is shown, (a) And (b) is sectional drawing. The laser scribe method of the liquid crystal display panel in 3rd Embodiment is shown, (a)-(h) is process drawing which shows a manufacturing process. The laser scribe method of the liquid crystal display panel in 3rd Embodiment is shown, (i), (j) is process drawing which shows an irradiation process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother board | substrate, 10, 10a ... Liquid crystal display panel as a display panel, 11 ... 1st board | substrate, 12 ... 2nd board | substrate, 12a ... Cutting part, 13 ... TFT element, 14 ... Sealing material, 15 ... Liquid crystal, 16 ... Black matrix, 16a ... Metal film as suppression part, 17 ... Color element, 18 ... Common electrode, 19 ... Alignment film, 20 ... First pattern mounting wiring, 21 ... Scanning line driving circuit part, 22 ... Data line driving circuit , 24 ... vertical conduction part, 30 ... planned cutting line, 33 ... condensing lens, 35, 55 ... laser light, 40 ... resin film as suppression part, 50 ... uneven part as suppression part, 60 ... as electronic equipment Projector 110, first pattern formation surface, 120, second pattern formation surface, 130, laser light irradiation surface.

Claims (8)

A first substrate having a first pattern formation surface that is a substrate surface on which a first pattern is formed, and a second substrate having a second pattern formation surface that is a substrate surface on which a second pattern is formed are the first substrate. A pattern forming surface and the second pattern forming surface are arranged to face each other, a cutting line for cutting a part of the second substrate is provided on the second substrate, and the second pattern forming surface and Reflection and absorption at the position of a line along a vertical direction and intersecting at least one of the first pattern formation surface and the second pattern formation surface with a virtual surface passing through the scheduled cutting line , A manufacturing process for manufacturing a display panel provided with a suppression unit having at least one function among scattering,
A condensing point of laser light is located inside the second substrate in a direction perpendicular to the second pattern formation surface and along the planned cutting line toward the opposite surface of the second pattern formation surface. An irradiation step of irradiating the laser light as described above, and a laser scribing method for a display panel. The laser scribing method for a display panel according to claim 1,
In the manufacturing process, the suppression unit is formed of a metal film. The laser scribing method for a display panel according to claim 2,
In the manufacturing process, the metal film is formed on the second pattern formation surface with the same material as the black matrix used for forming the second pattern. In the laser scribing method of the display panel according to claim 2 or 3,
In the manufacturing process, the metal film and the black matrix are formed at the same time. The laser scribing method for a display panel according to claim 1,
In the manufacturing process, the suppression unit is formed of a resin film. The laser scribing method for a display panel according to claim 1,
In the manufacturing process, the suppressing portion is formed by forming an uneven portion on the second pattern forming surface, and the laser scribing method for a display panel.   A display panel manufactured by the laser scribing method for a display panel according to claim 1. An electronic apparatus comprising the display panel according to claim 7.

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