JP2007118009A - Laminate processing method - Google Patents

Abstract

Provided is a method for processing a laminated body, which can easily cut and divide the laminated body even if the materials of substrates constituting the laminated body are different.
A processing method of a stacked body P is a processing method of a stacked body P composed of a plurality of substrates, and a substrate P1 as a first substrate and a first substrate are stacked on the stacked body P. And a substrate P2 as a second substrate. A step of irradiating the substrate P1 with the first laser beam 5a to form the first material altered portion 7a, and irradiating the substrate P2 with the second laser beam 5b to form the crack 7b as the second material altered portion. Forming the material altered portion 7.
[Selection] Figure 2

Description

  The present invention relates to a method for processing a laminate.

Conventionally, when dividing a silicon single crystal substrate, the substrate is irradiated with laser light to form a modified region portion by multiphoton absorption inside the substrate, and stress is applied from the outside of the substrate to cut and divide the substrate. There was a way.

For example, as disclosed in Patent Document 1, in the case of a substrate in which an electronic device or an electrode pattern is formed on the front surface and an adhesive sheet is attached to the back surface, the substrate has transparency to the adhesive sheet. A method has been proposed in which a laser beam is incident from the back surface of a substrate and irradiated with a laser beam along a planned cutting line of the substrate to form a modified region portion by multiphoton absorption inside the substrate. Further, as disclosed in Patent Document 2, a modified region portion by multiphoton absorption is formed inside the substrate by irradiating a laser beam along a planned cutting line of the substrate (processing object), and There has also been proposed a method of forming the modified region portion by multiphoton absorption so as to be aligned along the incident direction by changing the position of the condensing point of the laser beam.

JP 2002-192367 A JP 2002-205180 A

However, in these methods, in the case of a laminated body in which a plurality of substrates are laminated, if the materials of the substrates constituting the laminated body are different, the laser light irradiated on the laminated body depends on the difference in the refractive index of the substrate. Due to the influence, the light is refracted in a direction different from the predetermined direction. And the laser beam irradiated to the laminated body cannot be condensed on a predetermined region of the laminated body. If the laser beam cannot be focused on a predetermined region of the laminate, it is difficult to form a modified region portion in the laminate. If the modified region portion cannot be formed in the laminate, the laminate cannot be cut or divided even when external stress is applied. That is, if the materials of the substrates constituting the laminated body are different, it is difficult to cut and divide the laminated body.

An object of the present invention is to provide a method for processing a laminate that can easily cut and divide the laminate even if the materials of the substrates constituting the laminate are different.

A method for processing a laminate according to the present invention is a method for processing a laminate including a plurality of substrates, and the laminate includes a first substrate and a second substrate on which the first substrate is stacked, First on the first substrate
Irradiating the second substrate with a laser beam, and forming a second material altered portion by irradiating the second substrate with the second laser light. It is characterized by.

According to this invention, even if the first substrate and the second substrate constituting the laminate are made of different materials, the first substrate is irradiated with the first laser beam to form the first material altered portion, It is possible to form the second material altered portion by irradiating the second substrate with the second laser beam and form the second material altered portion. If the material altered portion can be formed in the laminate, the laminate can be easily cut and divided along the material altered portion by applying external stress.

In the laminate processing method of the present invention, in the step of forming the second material altered portion, the second laser beam is substantially simultaneously with the first laser beam from a direction opposite to the irradiation direction in which the first laser beam is irradiated. It is desirable to form the second material altered portion by irradiating the laser beam.

According to the present invention, if the first laser beam and the second laser beam are irradiated almost simultaneously,
Since the first material altered portion and the second material altered portion are formed almost simultaneously in the laminate and the material altered portion can be formed in a short time, it is efficient.

In the method of processing a laminate according to the present invention, in the step of forming the second material altered portion, the second material is irradiated by irradiating a second laser beam in the same direction as the irradiation direction of the first laser beam. It is desirable to form an altered portion.

According to this invention, after irradiating the first laser beam and then irradiating the second laser beam from the same direction, the first material altered portion and the second material altered portion are formed, and the arrangement position accuracy is obtained. Therefore, the laminated body can be cut and divided with high accuracy along the material-affected portion.

In the method of processing a laminate according to the present invention, in the step of forming the second material altered portion, after the first material altered portion is formed, the laminate is inverted and then irradiated with the second laser light. It is preferable that the second material altered portion is formed.

According to the present invention, since the second laser beam may be irradiated after inverting the stacked body after the first laser light irradiation, it is possible to easily form the material altered portion in the stacked body.

In the method of processing a laminated body according to the present invention, in the step of forming the second material altered portion, the second material altered portion is formed using heat generated when the first material altered portion is formed. Is desirable.

According to the present invention, the second material altered portion is formed on the second substrate using the heat generated when the first material altered portion is formed by irradiating the first laser beam, and the material altered portion is formed. Since it can be formed, the laminate can be easily cut and divided by applying stress to the material-affected portion formed in the laminate.

In the laminate processing method of the present invention, the first substrate is made of a material made of silicon single crystal, and the first laser is applied to the first substrate in the step of forming the first material altered portion. The first material altered portion is formed by condensing and irradiating light with a condensing element.

According to the present invention, when the first laser beam is focused on the first substrate by the condensing element and irradiated, the first laser beam is transmissive to the silicon material because the first substrate is the silicon material. If the laser beam has, the first material altered portion can be easily formed.

In the laminate processing method of the present invention, the second substrate is made of a material made of glass, and in the step of forming the second material altered portion, the second laser beam is applied to the second substrate. The second material altered portion is formed by condensing and irradiating with a condensing element.

According to this invention, when the second laser beam is condensed and irradiated on the second substrate by the condensing element, the second substrate is made of the glass material, and therefore the second laser beam is transmissive to the glass material. The second material altered portion can be easily formed with a laser beam having

In the laminate of the present invention, in the step of forming the first material altered portion, the first laser beam is:
A YAG laser is characterized in that the first material altered portion is formed by irradiating a fundamental wave of the YAG laser.

According to the present invention, when the fundamental wave of the YAG laser is irradiated onto the first substrate, the first wave at the predetermined position of the first substrate is obtained if the fundamental wave of the YAG laser has transparency to the first substrate. It is possible to easily form the material altered portion.

In the laminate of the present invention, in the step of forming the second material altered portion, the second laser beam is:
It is a titanium sapphire laser, and the second material altered portion is formed by irradiating a fundamental wave of the titanium sapphire laser.

According to the present invention, when the fundamental wave of the titanium sapphire laser is irradiated to the second substrate, the fundamental wave of the titanium sapphire laser is transmitted to the predetermined position of the second substrate if the second substrate has transparency. It is possible to easily form the second material altered portion.

Hereinafter, embodiments of the method for processing a laminate and the laminate of the present invention will be described in detail with reference to the accompanying drawings. Before describing the characteristic processing method of the present invention, the laminate used and the method for forming the material-affected portion will be described.
<Laminated body>

Various substrates such as a silicon wafer, quartz glass, and glass can be used as the substrate that can be used in the present invention. In addition, a substrate in which a semiconductor film, a metal film, a dielectric film, an organic film, or the like is formed as a base layer on the surface of these various material substrates may be used as a substrate. Here, a laminated body in which silicon and glass are laminated is used as a base material.
<Formation method of material alteration part>

  A method for forming a material altered portion on a substrate by irradiating laser light will be described.

FIG. 1 is a diagram for explaining a method of forming a material-modified part as a modified layer by laser light.

In FIG. 1, the laser beam 5 is condensed and irradiated inside the substrate 4, and the laser beam 5 is scanned in the scanning direction X (dividing direction). Since the laser beam 5 is condensed by the lens 6 as a condensing element, the laser beam 5 can be focused on the inside of the substrate 4. When the laser beam 5 is scanned in the scanning direction X (division direction), the material-affected portion 7 can be formed inside the substrate 4. The moving speed of the laser beam 5 in the scanning direction X is 100 mm / sec. The thickness of the substrate 4 is about 200 μm.

Further, since the amount of the material altered portion 7 as the modified layer can be several tens of μm only by scanning the laser beam 5 once, in order to form the material altered portion 7 in the entire depth direction of the substrate 4. Is
It is necessary to scan the laser beam 5 several times in the scanning direction X (division direction). And
Each time the laser beam 5 is scanned, the focal position of the lens 6 as a condensing element is raised from the lower surface of the substrate 4 toward the upper surface, and scanning is performed. The focal position of the laser beam 5 is raised from the lower surface to the upper surface of the substrate 4 by condensing the laser beam 5 inside the substrate 4 without scattering the light of the laser beam 5 on the formed material alteration portion 7. This is for irradiation.

(First embodiment)
In the present embodiment, a description will be given of a processing method for forming a material-altered portion in a laminate by irradiating different laser beams almost simultaneously from both sides of the laminate in a laminate composed of different materials.

FIG. 2 is a diagram showing a laser beam irradiation method for the laminate in the present embodiment, and FIG. 2A is a diagram showing an initial state of the formation process of the first material altered portion and the second material altered portion. (B)
) Is a diagram showing a completed state.

As shown in FIG. 2A, the stacked body P includes a substrate P1 as a first substrate and a substrate P2 as a second substrate. The material of the substrate P1 is silicon, and the material of the substrate P2 is glass. An adhesive is used for bonding the substrates P1 and P2. In addition, as a method for bonding the substrates P1 and P2, a bonding method using an adhesive is employed, but this is not particular and other methods may be employed.

The laser beam 5a as the first laser beam is condensed by a lens 6 as a condensing element, and irradiates the lower surface side of the substrate P1 with the laser beam 5a condensed by the lens 6. Irradiated laser beam 5a
Are arranged so that their focal positions are aligned over the entire depth direction of the substrate P1. Then, the laser beam 5a is irradiated while gradually moving the condensing point to the upper side of the substrate P1. At the same time, the upper surface side of the substrate P2 is irradiated with the laser beam 5b as the second laser beam. The irradiated laser beam 5b is arranged so that the focal position is aligned over the entire depth direction of the substrate P2. Then, the laser beam 5b is irradiated while gradually moving the condensing point to the upper side of the substrate P2.

The detailed conditions of the laser beam 5a are as follows. The laser light source to be used is excited by a semiconductor laser. Nd: YAG. Laser wavelength: 1064 nm. Laser light spot cross section: 3.14 × 10 ⁻⁸ cm ² . Oscillation form: Q switch pulse. Repeat frequency: 100 KHz. Pulse width: 30 ns. Output: 20 μJ / pulse. Laser light quality: TEM
₀₀ . Polarization characteristics: linearly polarized light (C). Condenser lens magnification: 50 times. NA: 0.55. Transmittance with respect to laser light wavelength: 60% (D). Movement speed: 100 mm / sec.

The detailed conditions of the laser beam 5b are as follows. The laser light source used is a titanium sapphire laser with a laser wavelength of about 800 nm. Oscillation mode: Mode lock. Repeat frequency: 1 kHz. Pulse width: 300 fs. Output: 150 μJ / pulse. Laser light quality: T
EM ₀₀ . Polarization characteristics: linearly polarized light. Condenser lens magnification: 100 times. NA: 0.8. Moving Speed:
10 mm / sec. The laser light source used in the laser beam 5b is not limited to the titanium sapphire laser, and may be any laser light source that is transparent to the substrate P2 (Pyrex (registered trademark) glass). A fundamental wave, a second harmonic of a YAG laser, a third harmonic of a YAG laser, or the like can also be used.

As shown in FIG. 2B, the substrate P1 irradiated with the laser beam 5a uses the phenomenon of multiphoton absorption, so that the material altered portion 7a as the first material altered portion is changed in the depth direction of the substrate P1. Form all over. Similarly, on the substrate P2 irradiated with the laser beam 5b, the crack 7b as the second material altered portion is formed in the entire depth direction of the substrate P2. And the material alteration part 7 is formed in the laminated body P. FIG.

Next, when stress is applied to the laminate P from the outside, the portion of the material altered portion 7 is modified, so the laminate P (substrates P1 and P2) is cut and divided along the material altered portion 7 can do. As a method of applying stress from the outside, for example, bending or shearing stress is applied to the laminated body P along a planned cutting line, or thermal stress is generated by giving a temperature difference to the laminated body P. In addition, when the thickness of the laminated body P is thinner, the laminated body P may be naturally cracked along the material altered portion 7 by forming the material altered portion 7.

Since the stacked body P is cut and divided by irradiating the stacked body P with the laser beams 5a and 5b, no chips are generated during cutting. Then, the laser beam 5a, 5b is a lens 6 as a condensing element.
This is a method of converging and then irradiating the laminated body P (substrates P1, P2) to cut and divide the laminated body P, so that the cutting width required for the division can be made narrower, so that the dividing property is improved. To do.
That is, since the number can be increased, productivity can be improved.

  In the first embodiment, the following effects can be obtained.

(1) Even if the substrate P1 as the first substrate and the substrate P2 as the second substrate constituting the stacked body P are made of different materials, the substrate P1 is irradiated with the laser beam 5a as the first laser beam. Then, the material altered portion 7a as the first material altered portion is formed, and the substrate P2 is irradiated with the laser beam 5b as the second laser beam to form the crack 7b as the second material altered portion. Can be formed. If the material altered portion 7 can be formed in the laminate P, the laminate P can be easily cut and divided along the material altered portion 7 by applying external stress.
(2) If the laser beam 5a and the laser beam 5b are simultaneously irradiated, the material alteration portion 7a is applied to the stacked body P.
And the crack 7b are formed almost simultaneously and the material-affected portion 7 can be formed in a short time, which is efficient.
(3) When the laser beam 5a is condensed and irradiated on the substrate P1 by the lens 6 as a condensing element,
Since the substrate P1 is made of a silicon material, if the laser beam 5a is a laser beam that is transmissive to the silicon material, the material altered portion 7a can be easily formed.
(4) When the laser beam 5b is condensed and irradiated on the substrate P2 by the lens 6 as a condensing element,
Since the substrate P2 is made of a glass material, the crack 7b can be easily formed if the laser beam 5b is a laser beam having transparency to the glass material.
(5) When the substrate P1 is irradiated with the fundamental wave of the YAG laser, if the fundamental wave of the YAG laser is transmissive to the substrate P1, the material altered portion 7a is formed at a predetermined position of the substrate P1. Is easy to do.
(6) When the substrate P2 is irradiated with the fundamental wave of the titanium sapphire laser, if the fundamental wave of the titanium sapphire laser is transparent to the substrate P2, the crack 7b is formed at a predetermined position of the substrate P2. Is easy to do.

(Second Embodiment)
In the present embodiment, a processing method will be described in which different laser beams are irradiated from one surface of a laminated body made of different materials to form a material altered portion in the laminated body.

FIG. 3 is a diagram showing a laser beam irradiation method for the laminate in the present embodiment. FIG. 3A is a diagram showing a process of forming the first material altered portion, and FIG. It is a figure which shows the formation process of 2 material alteration part. The same parts as those in the first embodiment described above and parts having the same functions are denoted by the same reference numerals and description thereof is omitted. The laser beam 5a used is a YAG laser, and the laser beam 5b is a titanium sapphire laser.

As shown in FIG. 3A, the laser beam 5a as the first laser beam is condensed by the lens 6 as a condensing element, and the laser beam 5a condensed by the lens 6 is converted into the lower surface side of the substrate P1. Irradiate. The irradiated laser beam 5a is arranged so that the focal position is aligned over the entire depth direction of the substrate P1. Then, the laser beam 5a is irradiated while gradually moving the condensing point to the upper side of the substrate P1, so that the material altered portion 7a is formed in the entire depth direction of the substrate P1. And the material alteration part 7 is formed in the laminated body P. FIG.

As shown in FIG. 3B, the laser beam 5b as the second laser beam is used instead of the laser beam 5a.
Is irradiated on the upper surface side of the substrate P2. The irradiated laser beam 5b is arranged so that the focal position is aligned over the entire depth direction of the substrate P2. Then, the laser beam 5b is irradiated while gradually moving the condensing point to the upper side of the substrate P2, and the crack 7b is formed in the entire depth direction of the substrate P2. And the material alteration part 7 is formed in the laminated body P. FIG.

Next, when stress is applied to the laminate P from the outside, the portion of the material altered portion 7 is modified, so the laminate P (substrates P1 and P2) is cut and divided along the material altered portion 7 can do.

In the second embodiment as described above, the following effects are obtained in addition to the same effects as those of the first embodiment described above.

(7) If the laser beam 5b is irradiated from the same direction after irradiating the laser beam 5a, the material altered portion 7a and the crack 7b can be formed, and the material altered portion 7 with high placement position accuracy can be formed. The laminated body P can be cut and divided with high accuracy along the material altered portion 7.

(Third embodiment)
In the present embodiment, a processing method will be described in which each time a laser beam is irradiated to a laminated body made of different materials, the laminated body is inverted to form a material altered portion in the laminated body.

FIG. 4 is a diagram showing a laser beam irradiation method for the laminate in the present embodiment. FIG. 4A is a diagram showing a process of forming the first material altered portion, and FIG. It is a figure which shows the formation process of 2 material alteration part. The same parts as those in the first embodiment and the second embodiment described above and parts having the same functions are denoted by the same reference numerals and description thereof is omitted. The laser beam 5a used is a YAG laser, and the laser beam 5b is a titanium sapphire laser.

As shown in FIG. 4A, the laser beam 5a as the first laser beam is condensed by the lens 6 as a condensing element, and the laser beam 5a condensed by the lens 6 is converted into the lower surface side of the substrate P1. Irradiate. The irradiated laser beam 5a is arranged so that the focal position is aligned over the entire depth direction of the substrate P1. Then, the laser beam 5a is irradiated while gradually moving the condensing point to the upper side of the substrate P1, so that the material altered portion 7a is formed in the entire depth direction of the substrate P1.

As shown in FIG. 4B, the stacked body P is inverted and arranged. And the laser beam 5b is arrange | positioned so that it may correspond to the position of the formed material alteration part 7a, and it irradiates to the board | substrate P2. The irradiated laser beam 5b is arranged so that the focal position is aligned over the entire depth direction of the substrate P2. Then, the laser beam 5b is irradiated while gradually moving the condensing point to the upper side of the substrate P2, and the crack 7b is formed in the entire depth direction of the substrate P2. And the material alteration part 7 is formed in the laminated body P. FIG.

Next, when stress is applied to the laminate P from the outside, the portion of the material altered portion 7 is modified, so the laminate P (substrates P1 and P2) is cut and divided along the material altered portion 7 can do.

In the third embodiment as described above, the following effects can be obtained in addition to the same effects as those of the first embodiment and the second embodiment described above.

(8) Since it is sufficient to irradiate the laser beam 5b after irradiating the laser beam 5a and then irradiating the laser beam 5b, it is possible to easily form the material altered portion 7 in the laminate P.

(Fourth embodiment)
In the present embodiment, a processing method will be described in which a laminated body made of different materials is irradiated with laser light to form a material altered portion and a crack in the laminated body.

FIG. 5 is a view showing a method of irradiating a laminated body in the present embodiment with a laser beam, and FIG. 5A is a view showing a process of forming a first material altered portion and a second material altered portion. (B) is a figure which shows the division | segmentation method. The same parts as those in the first to third embodiments and parts having the same functions are denoted by the same reference numerals, and description thereof is omitted. The laser beam 5a used is YAG
It is a laser.

As shown in FIG. 5A, the laser beam 5a as the first laser beam is condensed by the lens 6 as the condensing element, and the laser beam 5a condensed by the lens 6 is converted into the lower surface side of the substrate P1. Irradiate
The material altered portion 7a is formed on the substrate P1. At the same time, a crack 7b is formed in the substrate P2. The crack 7b is formed from the surface of the substrate P2 toward the inside. When the substrate P1 is laser-processed, heat absorbed from the laser (vaporized material or melt generated by processing the substrate P1 becomes an absorption end) is transmitted to the substrate P2 to form a crack 7b in the substrate P2.

In addition, the laminated body P has the board | substrate P1 and the board | substrate P2 joined by the anodic bonding method. When performing the anodic bonding method, a voltage (about 800 V) of + is applied to the substrate P1 (silicon) side and − is applied to the substrate P2 (Pyrex (registered trademark) glass) side. At this time, the substrate P2 (Pyrex (registered trademark) glass) side is heated to about 400 ° C. Since the material of the substrate P2 bonded by the anodic bonding method is Pyrex (registered trademark) glass, oxygen ions easily collect on the interface side with the substrate P1, and Na ions easily collect on the surface opposite to the interface side. Become a trend. As described above, in the anodic bonding method between the silicon material and the glass material, the substrate P2 (Pyrex (registered trademark)) is used.
The composition of glass is easy to change. Further, the substrate P1 (silicon) and the substrate P2 (Pyrex (registered trademark) glass) can be bonded at a crystal level (atomic level) by bonding between a silicon material and oxygen ions.

Since the outermost surface of the substrate P2 on the interface side in the stacked body P is likely to contain silicon, it is easy to generate the crack 7b by irradiating the substrate P2 with the laser beam 5a. The irradiated laser beam 5a is arranged so that the focal position is aligned over the entire depth direction of the substrate P1. Then, the laser beam 5a is irradiated while gradually moving the condensing point to the upper side of the substrate P1, so that the material altered portion 7a is formed in the entire depth direction of the substrate P1. And the material alteration part 7 is formed in the laminated body P. FIG.

Next, as shown in FIG. 5 (b), when a stress F is applied to the laminated body P from the outside, the portion of the material altered portion 7 is modified, so the laminated body along the material altered portion 7. P (Substrate P1, P2)
Can be cut and divided. The direction in which the stress F is applied is from the substrate P2 side to the substrate P1.
Added towards the side.

In the fourth embodiment as described above, the following effects are obtained in addition to the same effects as in the first to third embodiments described above.

(9) Because the heat generated when the substrate P1 is irradiated with the laser beam 5a to form the material altered portion 7a is used, the material altered portion 7 can be formed by forming the crack 7b in the substrate P2. The laminate P can be easily cut and divided by applying a stress to the material-affected portion 7 formed in the laminate P. In addition, since only one laser is required, the laser light irradiation apparatus can be downsized, and if the apparatus is downsized, the number of members constituting the apparatus can be reduced, which is economical. .

Further, the method of cutting / dividing the stacked body P by the laser beams 5a and 5b can be applied to a stacked body that requires high-precision bonding of substrates, such as an inkjet head, a semiconductor element, a liquid crystal display device, and a piezoelectric element. Further, it can also be applied to cutting / dividing organic electroluminescence display devices, DNA devices and the like.

The present invention has been described above with reference to preferred embodiments. However, the present invention is not limited to the above-described embodiments, and includes the following modifications and the scope in which the object of the present invention can be achieved. Thus, it can be set to any other specific structure and shape.

(Modification 1) In the third embodiment described above, as a method of forming the material altered portion 7 in the laminate P,
After forming the material alteration portion 7a on the substrate P1, the laminate P is inverted and then the crack 7b is formed on the substrate P2. However, the present invention is not limited to this. For example, as shown in FIGS. 6A and 6B, after forming the crack 7b in the substrate P2, the laminated body P is inverted, and the material altered portion 7a is formed in the substrate P1.
May be formed. Even if it does in this way, since the material alteration part 7 can be formed in the laminated body P, the effect similar to 3rd Embodiment is acquired.

(Modification 2) In the above-described first embodiment, the laser beam is condensed and irradiated while moving the condensing point in the thickness direction of the stacked body P, but is not limited thereto. For example, as shown in FIG. 7, a plurality of laser beams having different divergence angles may be condensed by a condensing element and irradiated.
In this way, in addition to obtaining the same effect as in the first embodiment, it is possible to shorten the time required for forming the material-affected portion 7, and thus it is possible to improve the processing efficiency.

(Modification 3) In the above-described first embodiment, as a method of condensing the laser light, the light is condensed and irradiated while moving the condensing point in the thickness direction of the stacked body P, but is not limited thereto. For example, as shown in FIG. 8, laser light may be split into a plurality of beams by a diffractive optical element and irradiated at multiple points simultaneously. In this way, in addition to obtaining the same effect as in the first embodiment, it is possible to shorten the time required for forming the material-affected portion 7, and thus it is possible to improve the processing efficiency.

(Modification 4) In the first to fourth embodiments described above, silicon is used as the material of the substrate P1 and glass is used as the material of the substrate P2. However, the present invention is not limited to this. For example, a combination of other materials may be used. In this way, the same effects as those of the first to fourth embodiments can be obtained.
Other laminates P or devices can be formed.

(Modification 5) In the first to fourth embodiments described above, the stacked body P is composed of two substrates P1 and P2.
Although it is a sheet configuration, it is not limited to this. For example, the laminated body P may have a configuration of three or more. In this way, the same effects as those of the first to fourth embodiments can be obtained, and other laminates P or devices can be formed.

(Modification 6) In the first to fourth embodiments described above, the part to be cut / divided of the multilayer body P is applied to a part arranged in a straight line, but the present invention is not limited to this. For example, you may apply to the laminated body P of the components arrange | positioned in zigzag form (alternately). In this way, the same effects as those of the first to fourth embodiments can be obtained, and the components can be arranged efficiently, so that the number of components can be increased and the material can be increased. Don't waste it. In addition, it is possible to cut and divide a part shape that has been difficult to achieve with a conventional cutting method such as dicing using a rotating grindstone or slicing.

The figure for demonstrating the formation method of the material alteration part as a modified layer by a laser beam. It is a figure which shows the laser beam irradiation method to the laminated body in 1st Embodiment, (a) is a figure which shows the initial state of the formation process of a 1st material altered part and a 2nd material altered part, (b) The figure which shows the completion state of (a). It is a figure which shows the laser beam irradiation method to the laminated body in 2nd Embodiment, (a) is a figure which shows the formation process of a 1st material alteration part, (b) is the 2nd material alteration of (a). The figure which shows the formation process of a part. It is a figure which shows the laser beam irradiation method to the laminated body in 3rd Embodiment, (a) is a figure which shows the formation process of a 1st material alteration part, (b) is the 2nd material alteration of (a). The figure which shows the formation process of a part. It is a figure which shows the laser beam irradiation method to the laminated body in 4th Embodiment, (a) is a figure which shows the formation process of a 1st material alteration part and a 2nd material alteration part, (b) is a division | segmentation method FIG. It is a figure which shows the laser beam irradiation method to the laminated body in the modification 1, (a) is a figure which shows the formation process of a 2nd material alteration part, (b) is the 1st material alteration of (a). The figure which shows the formation process of a part. The figure which shows the example which condenses and irradiates the several laser beam from which the divergence angle differs in the modification 1 with a condensing element. The figure which shows the example which branches the laser beam in the modification 2 into a some beam by a diffractive optical element, and irradiates multi-point simultaneously.

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 ... Laser beam, 5a ... 1st laser beam, 5b ... 2nd laser beam, 6 ... Lens as condensing element, 7 ... Material alteration part as modified layer, 7a ... First material alteration part, 7b ... cracks as the second material alteration part, P1 ... first substrate, P2 ... second substrate, P ... laminate.

Claims (9)

A method for processing a laminate comprising a plurality of substrates,
The laminate includes a first substrate and a second substrate on which the first substrate is laminated,
Irradiating the first substrate with a first laser beam to form a first material altered portion;
Irradiating the second substrate with a second laser beam to form a second material altered portion;
A method for processing a laminate, comprising: In the processing method of the laminated body of Claim 1,
In the step of forming the second material altered portion,
The second material altered portion is formed by irradiating the second laser light substantially simultaneously with the first laser light from a direction opposite to the irradiation direction of irradiating the first laser light. Body processing method. In the processing method of the laminated body of Claim 1,
In the step of forming the second material altered portion,
A method for processing a laminate, wherein the second material altered portion is formed by irradiating a second laser beam in the same direction as the irradiation direction of the first laser beam. In the processing method of the laminated body of Claim 1,
In the step of forming the second material altered portion,
After forming the first material altered portion, the laminate is inverted, and then the second material altered portion is formed by irradiating the second laser beam. In the processing method of the laminated body of Claim 1,
In the step of forming the second material altered portion,
A method of processing a laminated body, wherein the second material altered portion is formed using heat generated when the first material altered portion is formed. In the processing method of the laminated body as described in any one of Claims 1-5,
The first substrate is made of a material made of silicon single crystal,
In the step of forming the first material altered portion,
Condensing and irradiating the first laser beam on the first substrate with a condensing element;
A method for processing a laminate, wherein the first material altered portion is formed. In the processing method of the laminated body as described in any one of Claims 1-6,
The second substrate is made of a material made of glass,
In the step of forming the second material altered portion,
The second substrate is irradiated with the second laser beam condensed by a condensing element;
A method for processing a laminate, wherein the second material altered portion is formed. In the processing method of the laminated body as described in any one of Claims 1-7,
In the step of forming the first material altered portion,
The first laser beam is a YAG laser, irradiates a fundamental wave of the YAG laser,
A method for processing a laminate, wherein the first material altered portion is formed. In the processing method of the laminated body as described in any one of Claims 1-7,
In the step of forming the second material altered portion,
The second laser beam is a titanium sapphire laser, and is irradiated with a fundamental wave of the titanium sapphire laser.
A method for processing a laminate, wherein the second material altered portion is formed.

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