JP2006261367A - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

An object of the present invention is to prevent misalignment after mounting electronic components in consideration of the warpage of a printed circuit board and the vacuum suction breaking time of a suction nozzle.
After confirming that the suction nozzle is lowered, a predetermined mounting stop position is calculated and a target position for mounting ascent is calculated. That is, the drive waveform of the drive motor is calculated by the CPU in accordance with the first deceleration data at the time of rising after mounting, and then the value obtained by adding the push amount S after subtracting the thickness t of the electronic component from the stroke N. The speed change position is calculated by subtracting the sum of the pushing amount S and the increased stroke α. After this calculation, when the suction nozzle 15 rises at the first deceleration and the encoder detects the speed change position, the CPU calculates its drive waveform according to the second deceleration data, and then changes the rise speed of the suction nozzle 15 Control to do. When the encoder detects arrival at the target position, the CPU controls the drive motor to stop.
[Selection] Figure 13

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method in which an electronic component is picked up by a suction nozzle from a component supply unit and mounted on a printed board.

In general, in electronic component mounting devices, the amount of push-in when mounting electronic components is a fixed value (fixed value), so it can handle variations in the height of electronic components and mounting height due to solder swells. When the electronic component is mounted, the component is pushed too much onto the board, and when the nozzle is raised, the electronic component jumps up due to the elasticity of the board, resulting in a displacement of the electronic component. There is a problem that the accuracy of later parts deteriorates. For this reason, the technique which prevents the position shift after electronic component mounting | wearing and improves productivity (for example, refer patent document 1) is proposed.
Patent Publication of Japanese Patent No. 3574666

  According to the technique disclosed in Patent Document 1, after the electronic component held by the suction nozzle is brought into contact with the printed circuit board, the electronic component is further lowered by the pushing amount to be mounted on the printed circuit board, and thereafter The suction nozzle is raised by an amount corresponding to the pushing amount of the suction nozzle, and then temporarily stopped, the electronic component is pressed by the suction nozzle, and the suction nozzle is further lifted after a certain period of time in this pressed state. The control device controls the drive device.

  Although the fall of the electronic parts due to the warping of the printed circuit board is taken into account, the control at the time of raising the suction nozzle considering the vacuum break time of the suction nozzle is not performed, and the suction nozzle is again turned on before the vacuum break is finished. When it is raised, or when it is raised at a high speed, the electronic component is pulled by the suction nozzle and rises, and there is a possibility that the electronic component is displaced or tilted.

  Accordingly, an object of the present invention is to prevent misalignment after mounting an electronic component in consideration of not only warping of a printed circuit board but also a vacuum suction breaking time of the suction nozzle.

  For this reason, the invention related to the first electronic component mounting apparatus includes a suction nozzle that holds the electronic component and moves up and down relative to the printed circuit board, a drive device that moves the suction nozzle up and down, and the suction that holds the electronic component. After the nozzle is lowered toward the printed circuit board and the electronic component is brought into contact with the printed circuit board, the electronic component is further lowered by the amount of pressing, and then the electronic component is mounted on the printed circuit board, and then the suction nozzle is pushed in. And a controller for controlling the driving device so as to raise the suction nozzle at a low speed by an amount obtained by adding a predetermined amount to the quantity, and then raise the suction nozzle at a high speed.

  An invention relating to a second electronic component mounting apparatus includes: a suction nozzle that holds an electronic component and moves up and down relative to a printed circuit board; a drive device that moves the suction nozzle up and down; and the suction nozzle that holds the electronic component. The electronic component is lowered toward the printed circuit board and brought into contact with the printed circuit board, and then further lowered by a pushing amount to mount the electronic component on the printed circuit board, and then the pushing amount of the suction nozzle is set to the pushing amount. And a controller for controlling the driving device so as to raise the suction nozzle at a low speed by a predetermined amount and then stop, and then raise the suction nozzle at a high speed. To do.

  In the invention according to the third electronic component mounting method, the suction nozzle holding the electronic component is lowered toward the printed circuit board by the driving device and the electronic component is brought into contact with the printed circuit board, and then further lowered by the pushing amount. The electronic component is mounted on the printed circuit board, and then the suction nozzle is raised at a low speed by a predetermined amount added to the pushing amount of the suction nozzle, and then the suction nozzle is raised at a high speed. It is characterized by that.

  In the invention according to the fourth electronic component mounting method, the suction nozzle holding the electronic component is lowered toward the printed circuit board by the driving device to bring the electronic component into contact with the printed circuit board and then further lowered by the pushing amount. The electronic component is mounted on the printed circuit board, and then the suction nozzle is raised at a low speed by a predetermined amount added to the pushing amount of the suction nozzle, and then stopped. It is characterized by increasing at a speed.

  In the invention relating to the fifth electronic component mounting apparatus or the electronic component mounting method, in any one of the first to fourth inventions, the predetermined amount of the amount of raising the suction nozzle at a low speed is the type of electronic component. It is characterized by different.

  According to a fifth electronic component mounting apparatus or an electronic component mounting method, in any one of the first to fourth inventions, the predetermined amount out of the amount by which the suction nozzle is raised at a low speed is a vacuum for the electronic component. It is an amount that takes into account the vacuum break time of the suction nozzle to be sucked.

  The present invention can prevent displacement after mounting electronic components in consideration of the warpage of the printed circuit board and the vacuum suction breaking time of the suction nozzle.

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of an electronic component mounting device 1, and electronic components as a component supply device are supplied one by one to a component extraction position (component suction position) on a machine base (device main body) 2 of the electronic component mounting device 1. A plurality of known component supply units 3 are arranged side by side in four blocks. That is, the electronic component mounting apparatus 1 is divided into a left and right stage 1 and a stage 2, and further divided into front and rear SIDE-A and SIDE-B for each stage, and as a result, is divided into four blocks.

  A supply conveyor 4 is provided at an intermediate portion of the mounting device 1 so that the transport direction of the printed circuit board P is the left-right direction. The supply conveyor 4 is provided with a positioning mechanism for positioning the printed circuit board P received from the upstream device at the two positioning portions, and after electronic components are mounted on the substrate P, the printed circuit board P is transported to the downstream device. .

  Reference numeral 8 denotes a pair of beams that are long in the X direction, and a printed circuit board P that is fixed by a positioning mechanism by sliding a slider fixed to each beam 8 along a pair of left and right guides by driving each linear motor 9. In addition, the component supply unit 3 is individually moved in the Y direction above the component delivery position (component adsorption position). The linear motor 9 is composed of a pair of upper and lower stators fixed to the base 2 and a mover fixed to the lower part of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along a guide 13 by a linear motor 14 in the longitudinal direction, that is, in the X direction. As shown in FIG. 3 and the like, the linear motor 14 includes a pair of front and rear stators 14 A fixed to the beam 8 and a movable element 14 B provided on the mounting head body 7. Each mounting head body 7 includes a mounting head 16 having twelve suction nozzles 15 urged upward by springs 12.

  Hereinafter, the mounting head 16 will be described in detail with reference to FIGS. Reference numeral 20 denotes a rotor of a pulse motor 21 provided at the upper portion of the first inner cylinder 17A. In the θ direction via a bearing 23 inside a stator 22 provided in the outer cylinder 18 fixed to the mounting head body 7. It is provided so as to be rotatable. Reference numeral 25 denotes a rotor of a pulse motor 26 provided at the lower portion of the second inner cylindrical body 17B, and θ is provided inside the stator 27 provided in the outer cylindrical body 18 fixed to the mounting head body 7 via a bearing 28. It is provided to be rotatable in the direction. The suction nozzles 15 hold the electronic parts by vacuum suction, and are arranged on the circumference at predetermined intervals so as to be vertically movable in the second inner cylindrical body 17B. Yes.

  Reference numeral 30 denotes a first cam that creates a basic stroke of the vertical movement of the suction nozzle 15 and is stretched between a pulley 33 provided on the drive shaft 32 and a pulley 35 provided on the driven shaft 34 when the drive motor 31 is driven. The first cam 30 fixed to the driven shaft 34 is rotated by the belt 36 (see FIG. 4). Further, a cam follower 39 is provided on the other end side of the first lever 38 which can be rotated with the support shaft 29 supported by the support portion 7A extending from the mounting head body 7 as a fulcrum, and the support shaft 29 and the driven shaft 34 are provided. Are connected by a connecting lever 37.

  Reference numeral 40 denotes a second cam that is rotated by a drive motor 41 to create an adjustment stroke for the vertical movement of the suction nozzle 15 in accordance with the thickness of the electronic component. The cam follower 39 is in pressure contact with the outer periphery of the second cam 40. A cam follower 44 provided on one end side of the second lever 43 that rotates around the support shaft 42 is in pressure contact with the outer periphery of the first cam 30. Further, a cam follower 45 is provided on the other end side of the second lever 43, and the cam follower 45 is a cam engaging portion of an elevating body 47 that can move up and down along a column 46 that is the center of θ rotation of the mounting head 16. 48 is engaged. A spring 50 is interposed between the elevating body 47 and the support body 49 to urge the elevating body 47 downward.

  Reference numeral 52 denotes a third cam for turning on and off the vacuum valve that is rotated by a drive motor 53. A cam follower 56 on one end side of a third lever 55 that can be rotated about a support shaft 54 is in pressure contact with the third cam 52. The cam follower 57 on the other end side is engaged with a cam engagement portion 59 of a vacuum valve on / off operation body 58 that can move up and down along the elevating body 47.

  Further, the elevating body 47 is provided with an elevating rod 62 for elevating the suction nozzle 15, and the first lever 30 and the support shaft 42 are moved around the support shaft 29 by the rotation of the first cam 30 and the second cam 40. The second lever 43 swings as a fulcrum, the elevating body 47 descends, and the suction nozzle 15 is lowered by a predetermined stroke according to the thickness of the electronic component D by the elevating rod 62, and the electronic component D is placed on the printed circuit board P. It is the structure which mounts.

  Further, when the suction nozzle 15 is lowered during mounting, the vacuum valve on / off operation body 58 is moved through the cam engagement portion 59 by the swing of the third lever 55 by the rotation of the third cam 52. Descent along 47. Accordingly, the lifting / lowering rod 63 of the vacuum valve on / off operating body 58 pushes down the first switching rod 65, the switching lever 68 is swung around the support shaft 67 as a fulcrum, and the second switching rod 66 is pushed up to stop the projection 61. Engages with the engaging groove 69B of the second switching rod 66. At the time of suction, as shown in FIGS. 3 and 7, the lifting / lowering rod 63 of the vacuum valve on / off operating body 58 pushes down the second switching rod 66, and the switching lever 68 is swung around the support shaft 67 as a fulcrum. The first switching rod 65 is pushed up so that the stopping projection 61 engages with the engagement groove 69 </ b> A of the second switching rod 66.

  At this time, in a state where the first switching rod 65 is lowered due to the lowering of the lifting rod 63 of the vacuum valve on / off operating body 58 at the time of mounting, the electronic component D by the suction nozzle 15 is cut off from the vacuum passage from the vacuum source. In the state where the vacuum suction is stopped and air is blown into the suction nozzle 15 and the second switching rod 66 is lowered, a vacuum passage communicating with the vacuum source is formed and the vacuum suction of the electronic component D by the suction nozzle 15 is maintained. To do.

  That is, when the first switching rod 65 is lowered, air from the air supply source is blown into the internal passage 15A of the suction nozzle 15 through the air passage 70, the passage 71, and the communication passage 72, and the second switching rod 65 is turned on. In a state where the rod 66 is lowered, the internal passage 15A of the suction nozzle 15 communicates with the vacuum source via the communication passage 72, the passage 71, and the vacuum passage 73, and is vacuum-adsorbed.

  Reference numeral 74 denotes a line sensor unit as means for detecting the presence / absence of parts, suction posture detection, and suction nozzle diameter, and is provided at the lower end of a support column 75 provided at the substantially central portion of each mounting head 16 as shown in FIG. A light emitting element 77 such as an LED is disposed in the upper part of a cylindrical light emitting unit mounting body 76 with a bearing B interposed between the inner cylindrical body 17C and a lens 78 below and 45 degrees below the lens 78. A light emitting unit 80 configured by arranging a prism 79 having an inclined reflecting surface 79a and a plurality of light receiving units that receive light from the light emitting element 77 that is fixed to the bottom surface of the outer cylindrical body 18 and that passes through the prism 79. It comprises a light receiving unit 81 in which a plurality of CCD elements as elements are arranged in the vertical direction and the horizontal direction. With the arrangement of the line sensor unit 74 in each mounting head 16 as described above, the mounting head 16 including the line sensor unit can be made compact.

  For example, when the height position of the lower end surface of the electronic component D is detected as a boundary position where the light receiving state of each CCD element changes from light shielding to light receiving, the component is normally sucked as shown in FIG. A case where a surface that should not be adsorbed is adsorbed and is in a so-called standing state or a case where it is adsorbed obliquely is detected. That is, after the suction nozzle 15 is lowered and the electronic component D is picked up and lifted from the component supply unit 3, the mounting head 16 is rotated by driving the pulse motors 21 and 26. The first inner cylinder body 17A and the second inner cylinder body 17B rotate to rotate the suction nozzle 15 that sucks and holds the electronic component D, and is positioned between the prism 79 and the light receiving unit 81 during the rotation. Therefore, by detecting the height position of the lower end surface of the electronic component D at a plurality of positions, it is possible to detect the presence / absence of the component and the suction posture.

  When the suction nozzle 15 does not suck the electronic component D, the light to be shielded (by the sucked electronic component) among the light from the light emitting element 77 is received by the light emitting unit 80. Therefore, “None” of the electronic component D is detected, the first switching rod 65 is lowered by the lowering of the raising / lowering rod 63 of the vacuum valve on / off operating body 58, the vacuum valve (not shown) is closed, and the vacuum source is turned off. This is necessary when the vacuum suction operation is stopped by cutting the vacuum passage to prevent leakage, and it is necessary to detect that the surface that should not be sucked is sucked and so-called standing or sucked diagonally. The mounting head 16 and the suction nozzle 15 are moved above the discharge box 82 (see FIG. 1) at a corresponding timing to drop the electronic component D.

  A component recognition camera 83 is provided for each of the mounting heads 16 for a total of four, and how much the electronic component is displaced and held with respect to the suction nozzle 15 in the XY direction and rotation. In order to recognize the position of each angle, all the electronic components D sucked and held by the plurality of suction nozzles 15 are collectively imaged, and a plurality of electronic components can be simultaneously imaged. The component recognition camera 83 can also check whether the electronic component D is sucked and held by the suction nozzle 15 by taking an image.

  Next, a description will be given below based on the control block diagram of the electronic component mounting apparatus 1 of FIG. Reference numeral 90 denotes a CPU (mounting control unit) as a control unit that performs overall control of the mounting apparatus 1, and the CPU 90 is connected to a RAM (Random Access Memory) 92 and a ROM (Read Only) via a bus line. Memory) 93 is connected. Based on the data stored in the RAM 92, the CPU 90 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 93. That is, the CPU 90 controls the drive of the linear motors 9 and 14, the pulse motors 21 and 26, and the drive motors 31, 41 and 53 via the interface 94 and the drive circuit 95.

  The RAM 92 stores mounting data related to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 92 stores component arrangement data, which stores the types of electronic components (component IDs) and the arrangement coordinates of the supply units 3 corresponding to the arrangement numbers of the component supply units 3. Has been.

  Furthermore, for each type of electronic component, size and thickness data in the XY direction of the electronic component and component library data composed of various data are stored. As one of the component library data, there is indentation amount data as shown in FIG. 10, and when the electronic component is mounted on the printed board P, the printed board P is positioned from the lower end level when the suction nozzle 15 is waiting to rise. The CPU 90 calculates the target lowering position of the suction nozzle 15 by subtracting the thickness t of the electronic component from the stroke N up to the surface level and adding the pushing amount S, and the drive motor so that the suction nozzle 15 is lowered as described above. 31 is controlled.

  A recognition processing device 91 is connected to the CPU 90 via an interface 94. The recognition processing device 91 performs recognition processing of an image captured by the component recognition camera 83.

  The image picked up by the component recognition camera 83 is displayed on a CRT 96 as a display device. The CRT 96 is provided with various touch panel switches 97, and when the operator operates the touch panel switch 97, various settings including settings for teaching designation can be performed.

  As part library data, the first deceleration data (can be set from no deceleration to 99% deceleration), the second deceleration data (can be set from no deceleration to 99% deceleration), as well as deceleration There is an increase stroke α at the time (0.0 mm to 1.5 mm can be set). The pushing amount S is a fixed value set for each type of electronic component, and is the pushing amount of the electronic component after the electronic component reaches the upper surface of the printed circuit board P due to the lowering of the suction nozzle 15. α is also set, but this plus α is a numerical value that takes into account component collapse due to warping of the printed circuit board P and vacuum break time of vacuum suction of the suction nozzle 15.

  Hereinafter, the setting operation relating to the control of the rising speed of the suction nozzle 15 will be described with reference to FIG. First, the touch panel switch 97 displayed on the CRT 96 is operated to display the screen shown in FIG. 11, the first deceleration setting switch portion 97A for setting the first deceleration data is pressed, and the numeric key switch After pressing the part 97D and inputting, for example, “9” and “0”, pressing the SET key switch part 97E sets a 90% deceleration of the predetermined high speed (the speed is 10% of the high speed). When the second deceleration setting switch portion 97B for setting the second deceleration data is pressed, the numeric key switch portion 97D is pressed and [0] is input, and then the SET key switch portion 97E is pressed. After a predetermined high speed without deceleration is set and the increase stroke switch 97C for setting the increase stroke data at the time of deceleration is pressed and "0" and [3] are input, the SET key When pressing the switch portion 97E, increased stroke α during deceleration is set to 0.3 mm. These setting data are stored in the RAM 92 under the control of the CPU 90.

  For electronic components that are not likely to fall even if they are not decelerated, the first deceleration data may be set as “no deceleration”, and the value of the increase stroke α during deceleration is the same regardless of the type of electronic component. It may be set to.

  With the above configuration, the mounting operation of the electronic component D will be described below. First, the printed circuit board P is carried into the positioning unit from the upstream device via the supply conveyor 4, and the positioning operation is started by the positioning mechanism.

  Next, in accordance with the mounting data stored in the RAM 92, the CPU 90 sucks out the electronic component to be mounted by the suction nozzle 15 of the mounting head 16 corresponding to the component type of the electronic component from the predetermined component supply unit 3. At this time, the linear motors 9 and 14 are controlled by the CPU 90, and the suction nozzle 15 of the mounting head 16 of each mounting head body 7 is positioned above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides. In the X direction, the linear motor 14 is similarly driven by the drive circuit 95 and the guide 13 is driven. Each mounting head body 7 moves along

  Since each predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the first inner cylindrical body 17A and the second inner body of the mounting head 16 are driven by the pulse motors 21 and 26. The suction nozzle 15 selected by the rotation of the cylindrical body 17B is located above the component delivery position of the component supply unit 3 at any position of 0, 3, 6 or 9 in the mounting head 16. The first cam 30 is rotated by a predetermined angle by the drive motor 31 and the second lever 43 swings with the support shaft 42 as a fulcrum, and the elevating body 47 is lowered to move the suction nozzle 15 by the elevating rod 62. The electronic component D is reliably picked up from the component supply unit 3 by lowering the stroke, and further, the first cam 30 rotates by a predetermined angle, the second lever 43 swings, and the elevating body 47 is raised. The suction nozzle 15 is raised along with.

  At this time, the third cam 52 is rotated by the drive motor 53 and the third lever 55 is swung so that the vacuum valve on / off operation body 58 is lowered along the lifting body 47 and the lifting rod 63 is lowered. 2 The switch rod 66 is lowered, the internal passage 15A of the suction nozzle 15 communicates with the vacuum source via the communication passage 72, the passage 71 and the vacuum passage 73, and the suction nozzle 15 receives the electronic component D from the component supply unit 3. It will be taken out by vacuum suction. In this way, the 12 suction nozzles 15 provided on the mounting head 16 move one after another to the corresponding component recognition camera 83 while being lifted after sucking the electronic component D. During this movement, the pulse motor The mounting head 16 is rotated by driving 21 and 26. Specifically, the first inner cylindrical body 17A and the second inner cylindrical body 17B rotate around the support column 75 to suck and hold the electronic component D. 15 is swung, and the electronic component D attracted during the swiveling is located between the prism 79 and the light receiving unit 81. Therefore, by detecting the height position of the lower end surface of the electronic component D at a plurality of positions. The line sensor unit 74 detects the presence / absence of each electronic component D and the suction posture.

  When it is detected that the surface that should not be sucked is sucked and is in a so-called standing state or sucked diagonally, the mounting head 16 and the suction nozzle 15 are moved above the discharge box 82 to cause abnormal detection. The electronic component D is dropped to dispose of the component.

  When the CPU 90 determines that it is time to move the mounting head 16 over the recognition camera 83 after the electronic component detected as an abnormality has been discarded While the component recognition camera 83 moves the beam 8, it performs simultaneous imaging and image capture of all the suction components D of the mounting head 16, and performs a component recognition process by the recognition processing device 91.

  If the result of the component recognition processing is, for example, a recognition abnormality that the electronic component is standing or a defective electronic component is held by suction, or if the electronic component D is not held by suction, the mounting head 16 and the suction nozzle 15 is moved above the discharge box 82 to drop the electronic component D related to the recognition abnormality, and the component is discarded.

  Then, after the disposal of the electronic component detected as abnormal, the electronic component D determined to be normal detection or normal recognition is maintained in vacuum suction, and the CPU 90 stores it in the RAM 92 as shown in FIG. A mounting descending stroke is calculated based on the mounted data, component arrangement data, and component library data. That is, the suction nozzle 15 is mounted and lowered by subtracting the thickness t of the electronic component from the stroke N from the lower end level when the suction nozzle 15 is waiting to rise to the surface level of the printed circuit board P and adding the pushing amount S. Calculate the stroke.

  Then, the CPU 90 calculates a driving waveform and starts the lowering operation of the suction nozzle 15. That is, the drive motor 31 is driven and controlled, the first cam 30 is rotated by a predetermined angle, the second lever 43 is swung around the support shaft 42, and the elevating body 47 is lowered to move the suction nozzle by the elevating rod 62. 15 is lowered by a predetermined stroke and the electronic component D is mounted. In this case, the mounting head 16 and the suction nozzle 15 are moved in consideration of the recognition result by the recognition processing device 91, and the electronic component D is mounted on the printed circuit board P. That is, the CPU 90 obtains the recognition processing result obtained by the recognition processing device 91, calculates the movement target value of XYθ, drives the linear motor 9 in consideration of the shift amount, moves the beam 8 in the Y direction, and moves linearly. The motor 14 is driven to move the mounting head 16 in the X direction, the pulse motors 21 and 26 are driven to rotate the suction nozzle 15 by θ, and the first cam 30 and the second cam 40 are rotated, thereby the component D. The electronic nozzle D is mounted on the printed circuit board P by lowering the suction nozzle 15 by a predetermined stroke according to the thickness of the printed circuit board P.

  In this case, after confirming the descent stop of the suction nozzle 15 by the encoder, when a predetermined mounting stop time has elapsed, the mounting rising target position is calculated. Since the electronic component D is brought into contact with the printed circuit board P and then pushed in by the pushing amount S, the printed circuit board P bends somewhat downward when the component is mounted, and the suction nozzle 15 is raised at a high speed after the mounting of the electronic component is completed. If this is done, the repulsive force of the deflection of the printed circuit board P will be transmitted to the electronic component, and the electronic component will fall or be displaced, but the raising of the suction nozzle 15 is controlled as shown in FIG. 13 to prevent this. The

  Further, when the suction nozzle is lifted again before the vacuum break of the suction nozzle 15 for vacuum-sucking the conventional electronic component is finished, or when the suction nozzle is raised at a high speed, the electronic component is pulled by the suction nozzle and rises. There is a possibility that the electronic components may be displaced or fall down. However, as described above, this can also be prevented by performing control in consideration of the vacuum break time of the suction nozzle.

  First, as shown in FIG. 14, the drive waveform of the drive motor 31 is calculated by the CPU 90 according to the first deceleration data (set to 90% deceleration) when ascending after mounting, and then the speed change position is calculated. . That is, after subtracting the thickness t of the electronic component from the stroke N, the speed change position is calculated by subtracting the sum of the pushing amount S and the increasing stroke α from the value obtained by adding the pushing amount S.

  After this calculation, when the suction nozzle 15 starts the ascending operation and rises at the first deceleration and the encoder detects the speed change position, the CPU 90 displays the drive waveform according to the second deceleration data (no deceleration setting). Then, control is performed to change the rising speed of the suction nozzle 15. When the encoder detects arrival at the target position, the CPU 90 controls the drive motor 31 to stop.

  As described above, after the electronic component is mounted, the suction nozzle 15 is raised, and thereafter, the same operation is repeated until all of the electronic components D sucked and held by the suction nozzles 15 of the mounting head 16 are completed.

  In addition, although demonstrated as embodiment which does not stop the drive motor 31 when changing from 1st deceleration to 2nd deceleration, you may control so that the drive motor 31 may be stopped before changing not only to this. .

  When all the electronic components D specified by the mounting data are taken out and mounted on the printed circuit board P, the printed circuit board P is transferred from the upstream device to the left stage 1 and the left stage. One printed circuit board P is moved to the right stage 2 and the printed circuit board P on the stage 2 is transferred to the downstream apparatus.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a vertical front view of a mounting head body. It is a vertical side view of a mounting head body in a state where a thin electronic component is adsorbed. It is a top view of a 1st cam, a 1st lever, etc. It is a top view of a mounting head body. It is a simplified top view explaining the state of the vacuum or the air blowing at the time of adsorption | suction or attachment of an adsorption nozzle. It is a vertical side view of the main part of the mounting head body in a state where an electronic component having a small thickness is adsorbed. FIG. 3 is a bottom view of FIG. 2. It is a control block diagram. It is a reference figure for showing a calculation method of a suction nozzle descent target position. It is a figure which shows the setting screen regarding control of the raising speed of a suction nozzle. It is a flowchart figure which concerns on the fall and rise of a suction nozzle. It is a reference figure of the speed change at the time of a raise of a suction nozzle. It is a drive waveform diagram of the drive motor when the suction nozzle is raised.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 3 Component supply unit 15 Adsorption nozzle 16 Mounting head 31 Drive motor 90 CPU
92 RAM
95 Drive circuit 96 CRT
97 Touch panel switch

Claims (6)

  A suction nozzle that holds the electronic component and moves up and down relative to the printed circuit board, a drive device that moves the suction nozzle up and down, and lowers the suction nozzle that holds the electronic component toward the printed circuit board to move the electronic component. After contacting the printed circuit board, the electronic component is mounted on the printed circuit board by further lowering the pressing amount, and then the suction nozzle is lowered by a predetermined amount added to the pressing amount of the suction nozzle. An electronic component mounting apparatus comprising: a control device that controls the drive device so as to raise at a speed and then raise the suction nozzle at a high speed.   A suction nozzle that holds the electronic component and moves up and down relative to the printed circuit board, a drive device that moves the suction nozzle up and down, and lowers the suction nozzle that holds the electronic component toward the printed circuit board to move the electronic component. After contacting the printed circuit board, the electronic component is mounted on the printed circuit board by further lowering the pressing amount, and then the suction nozzle is lowered by a predetermined amount added to the pressing amount of the suction nozzle. An electronic component mounting apparatus comprising: a control device that controls the drive device so as to stop after being raised at a speed and then raise the suction nozzle at a high speed.   The suction nozzle holding the electronic component is lowered toward the printed circuit board by the driving device and the electronic component is brought into contact with the printed circuit board and then further lowered by the pushing amount to mount the electronic component on the printed circuit board, After that, the suction nozzle is raised at a low speed by a predetermined amount added to the pushing amount of the suction nozzle, and then the suction nozzle is raised at a high speed.   The suction nozzle holding the electronic component is lowered toward the printed circuit board by the driving device and the electronic component is brought into contact with the printed circuit board and then further lowered by the pushing amount to mount the electronic component on the printed circuit board, After that, the suction nozzle is raised at a low speed by a predetermined amount added to the pushing amount of the suction nozzle and then stopped, and then the suction nozzle is raised at a high speed. Method.   The electronic component mounting apparatus or the electronic component mounting method according to any one of claims 1 to 4, wherein the predetermined amount of the amount by which the suction nozzle is raised at a low speed differs depending on a type of electronic component. . 5. The predetermined amount of the amount by which the suction nozzle is raised at a low speed is an amount that takes into account the vacuum break time of the suction nozzle that vacuum-sucks electronic components. The electronic component mounting apparatus or electronic component mounting method described in 1.

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