JP2003179391A - Component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component feeding device which is capable of easily detecting the cause of trouble on the basis of the height and air pressure of a component suction nozzle, correcting and setting up operating parameters quickly for a component mounting operation. <P>SOLUTION: A window for inputting the names of parameters and numerical values which can be corrected is displayed on the left side of a display screen, and a nozzle height graph 56 which indicates the relation between the time (ms) and the height (mm) of a nozzle and a nozzle air pressure graph 57 which indicates the relation between the time and the air pressure (Sp) of a nozzle are displayed on the right side of the display screen on the same time base. An operator monitors the operation of a component feeder when it is displayed in the graph on the display screen. He determines the mounting parameters when no trouble is found, and he decides which parameters should be corrected on the basis of the graphs 56 and 57 and determines the parameters to be corrected. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus, and more particularly to a component mounting apparatus for displaying information on the height of a component suction nozzle and its air pressure in a graph.

[0002]

2. Description of the Related Art Conventionally, for example, an I
There is a component mounting apparatus that automatically mounts a large number of electronic components (hereinafter simply referred to as components) such as C, resistors, and capacitors.
Further, there are various component supply devices that supply the mounted components to the component mounting device. And the kind of parts to supply,
A component supply device selected in advance according to the size, shape, etc. is mounted on the component mounting device. The most common component supply device is the tape component supply device.

FIG. 5 (a) is a perspective view of the appearance of the component mounting apparatus, and FIG. 5 (b) is a perspective view of the tape component supply apparatus arranged on the component supply stage of the component mounting apparatus. Is. A component mounting device (hereinafter also referred to as a main body device) 1 shown in FIG. 1A has a display input device 2 including a liquid crystal display and a touch panel, a monitor device 3 including a CRT display, and an operating state on the ceiling cover. An alarm lamp 4 for informing is provided, and a lower base 5 is provided with a pair of fixed and movable parallel board guide rails 6 at the center of the surface, and above these, behind a protective cover 7. Although not visible, a work head, which will be described in detail later, for carrying out the component mounting work is provided.

The component mounting apparatus 1 is provided with a component supply stage 8 in front of and behind it. As shown in FIG. 2B, a large number of mounting and fixing holes 9 are provided in the front and rear of the component supplying stage 8, and the tape component supplying device 10 is connected and arranged by these mounting and fixing holes 9.

Depending on the size of the component mounting device 1 and the size of the electronic components to be supplied, 50 to 70 tape component supplying devices 10 are usually attached to the component supplying stage 8. That is, when the front and rear component supply stages 8 are combined, 100 to 140 tape component supply devices 10
It is arranged on the component mounting apparatus 1 of the table.

The component reel 11 of the tape component supply device 10
A component tape containing an electronic component is wound around the component tape, and the component tape is pulled out to the component supply port 12,
The electronic component housed in the housing tape 13-2, which is separated into the top tape 13-1 and the housing tape 13-2, is exposed to the component supply port 12. The work head of the component mounting apparatus 1 picks up the exposed electronic component by suction with the suction nose, and transfers it onto the substrate.

Further, a tray component supply device is a typical other component supply device, but since the component supply device itself is not the gist of the present invention, there are various components here, and various components are provided accordingly. It is only mentioned that there is a component supply device of the above-mentioned supply system, and the description of the tray component supply device is omitted.

FIG. 6 (a) is a perspective view schematically showing the internal structure of the component mounting apparatus 1 with the upper and lower protective covers removed, and FIG. 6 (b) is a perspective view of its working head. Is. First, as shown in FIG. 1 (a), a pair of parallel board guide rails 6 and 6 described above are provided on the lower base 5 of the main body apparatus 1 in the board transfer direction (X-axis direction, From the lower right to the upper left). A loop-shaped substrate conveying belt (conveyor belt) is movably arranged in contact with the lower portion of the substrate guide rails 6. The board conveying belt is driven by a belt drive motor by making the belt side portions each having a width of several millimeters look into the board conveying path from below the board guide rail 6, and travels in the board conveying direction. While supporting both sides of the back surface from below, the substrate is loaded into the apparatus main body from the upstream side of the manufacturing line, and the substrate on which the components have been mounted is unloaded to the downstream side of the manufacturing line.

Inside the base 5, although not shown in particular, a board positioning device, a board fixing mechanism for fixing the board between the two board guide rails 6, a controller for controlling each part, etc. Is provided. Further, on the base 5, a pair of left and right fixed rails (Y-axis rails) that straddle the pair of board guide rails 6 and extend parallel to a direction (front-back direction) perpendicular to the board transport direction. 15 and 15 are provided. A moving rail (X-axis rail) 16 is slidably engaged with these Y-axis rails 15 along the Y-axis rails 15,
The work head 17 is attached to the X-axis rail 16 by the X-axis rail 1.
6 is slidably suspended along.

Although not clearly shown in the figures (a) and (b),
The X-axis rail 16 has its longitudinal direction (X-axis direction).
X (not shown) for freely moving the work head 17 along the
A shaft motor is provided, and a Y-axis motor (not shown) for moving the X-axis rail 16 forward and backward (Y-axis direction) along the Y-axis rail 15 is also provided on the base 5. The work head 17 moves freely in the X-axis direction and the Y-axis direction by freely rotating these X-axis motor and Y-axis motor in both forward and reverse directions according to instructions from a central control unit (not shown).

The working head 17 has a belt-shaped chain body 18 (18-1, 18-2) which is bendable and has a hollow interior.
Are connected, and a plurality of signal cords and pneumatic tubes (not shown) are protected and housed in the chain pair 18. The work head 17 is electrically connected via a signal code to a central control unit arranged on the electric component mother board inside the base 5 of the apparatus main body 1, and electric power and control are performed from the central control unit. A signal is supplied, and image data showing information on the component mounting position on the board and position data of a component suction nozzle described later are transmitted to the central control unit.

At the tip of the working head 17, two mounting heads 19 and 19 and a board recognition camera 21 are provided. The two mounting heads 19 can be moved up and down in the Z-axis direction (vertical direction) by the Z-axis motors incorporated therein, and the suction devices 22 are attached to the tips thereof. The suction device 22 includes a light diffusion plate 22-1 and a component suction nozzle 22-2, which can also be rotated in the θ-axis direction (360 ° direction) by an internal θ-axis motor. The component suction nozzle 22-2 includes a mounting head 19 and a working head 1.
7, a pneumatic tube is connected via a chain pair 18.

The working head 17 is freely moved back and forth and left and right by the above-mentioned two Y-axis rails 8 and one X-axis rail 9, and on the component supply stage 8 shown in FIG. 5B. When the tape component supply device is moved to a position above the supply port, the tape component supply device descends to remove the exposed component of the supply port from the component suction nozzle 2
2-2 Vacuum and adsorb, and the adsorbed component is imaged by the component recognition camera 23 shown in FIG. 5 (b) arranged on the base 5 side to detect the component holding position deviation. Then, the mounting position data is corrected based on the detected holding position deviation.

The work head 17 is further mounted above the component mounting position set on the NC program on a board (not shown) positioned by the board guide rail 6 shown in FIGS. 5 (a) and 6 (a). Then, the mounting position is confirmed with the board recognition camera 21 while descending, and the above-mentioned component is brought into contact with the confirmed mounting position, and a vacuum break (vacuum break) accompanied by air blow by the component suction nozzle 22-2.
The component is mounted on the board while executing.

By the way, generally, there are various kinds of parts, and various setups are required in advance in order to automatically mount such parts at correct positions on the substrate. First, a component is usually specified by a component library which is composed of characteristic data of the part, and the component library is registered as a database on an appropriate recording medium.

Next, the component library of the desired component is called from the database, the characteristic data of the desired component is acquired from the called component library, and the component is acquired based on the position data in the acquired characteristic data. An NC program is created so as to automatically mount the board at the correct position on the board.

Generally, the relative reference position of the board with respect to the reference position for operating the component mounting apparatus differs depending on the type of the board. In addition, although there are various modes of component supply by the component supply device, a technique for teaching these components so that the component suction nozzle 22-2 sucks them in a correct position is being established.

[0018]

However, even if the supply position on the component supply side is correct and the component suction nozzle is set to move to that correct position, the operation for sucking the component is performed correctly. If not, that is, if the component suction operation of the component suction nozzle of the work head is not correct, various problems will occur.

Originally, it is ideal that the vacuum is started when the component suction nozzle is completely lowered to the component surface. When the vacuum is performed for a sufficient time and the component is completely sucked, the component suction nozzle Ideally, it should rise and move onto the substrate. On the board, the vacuum is released after a certain waiting time after descending to the component mounting position, air blow is started, and the air blow is stopped when the component is completely separated from the nozzle suction port. Ideally, the product suction nozzle should rise.

However, for example, at the component suction point of the component supply device, if the work head rises without the vacuum degree of the component suction nozzle rising, that is, the component suction nozzle rises,
You will not be able to pick up parts. Further, even if it can be sucked, the suction becomes insufficient, which causes a recognition error by the camera for recognizing the component, or causes a displacement of the component on the substrate.

Further, for example, if the air blow is excessively performed at the component mounting point on the board, the mounted components around the component may be displaced or blown off in an extreme case, or conversely, the air blow is insufficient. That is, if the air blow is finished before the component suction nozzle rises, the air pressure inside the nozzle returns to atmospheric pressure and the component does not separate from the suction port of the nozzle. There was a problem such as taking the part back with the operation of.

However, conventionally, when teaching is performed in order to eliminate the above-mentioned problems, the waiting time after descending to the component suction point, the vacuum start timing, its duration, and the component mounting point are descended. Various parameters such as the waiting time from, the timing of vacuum release, the timing of air blow start, its duration etc. are numerically displayed on the display screen, and the various displayed parameters are changed by trial and error by key input respectively. The only other teaching method is the method of observing the actual operation of the work head 17, the suction state and the mounting state of the components until it is confirmed that the correct operation is performed.

In this case, the teaching work of the suction operation and the mounting operation takes too much time, and the efficiency of the whole setup work is reduced. In recent years, since it is an era of high-mix low-volume production rather than low-volume high-volume production as in the past, the types (types) of substrates to be flown to the substrate unit manufacturing line are often changed. Then, the type of components to be mounted is changed accordingly. Therefore, there is a problem that a setup work is required each time, and the time spent therefor is increased, and the work efficiency of the line for producing the substrate unit is reduced.

In view of the above conventional circumstances, the object of the present invention is to
The position of the component suction nozzle before and after suction and before and after mounting of each component and the state of the air pressure at that time can be easily known to facilitate the investigation of the cause of the defect, and based on this, the suction and mounting It is an object of the present invention to provide a component supply device capable of promptly correcting and setting operation parameters during execution.

[0025]

The structure of the component supply apparatus according to the present invention will be described below. The component supply device of the present invention is a component mounting device for mounting an electronic component on a printed circuit board, wherein height information acquisition means for acquiring height information for each predetermined time of the component suction nozzle, and supplying to the component suction nozzle. Air pressure information acquisition means for acquiring air pressure information for each predetermined time, height information for each predetermined time acquired by the height information acquisition means, and each predetermined time acquired by the air pressure information acquisition means And an information storage unit that stores the air pressure information.

Further, the component supply device includes, for example, a vacuum time display means for displaying a vacuum start time and a vacuum end time based on the air pressure information stored in the information storage means, and the above-mentioned vacuum time display means. Air blow time display means for displaying the time of air blow start and end based on the air pressure information stored in the information storage means is further provided.

In this case, the display by the vacuum time display means and the display by the air blow time display means are constituted so as to be displayed on the graph displayed on the display screen, for example, as described in claim 3, and For example, as described in claim 4, it is configured to be displayed in the numerical value display window displayed on the display screen.

Further, in this component supplying apparatus, for example, as described in claim 5, time designating means for designating an arbitrary time, time designating by the time designating means and the height stored in the information storing means are provided. And a designated information display means for displaying the nozzle height and the air pressure information at the designated time based on the information and the air pressure information.

In this case, the display by the designated information display means is configured to be displayed on the graph displayed on the display screen, for example, as described in claim 6, and, for example, as described in claim 7. In addition, it is configured to be displayed in the numerical value display window displayed on the display screen.

[0030]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a system configuration of a component mounting apparatus according to an embodiment. The component mounting device 25 is basically the same as the external perspective view and the internal structure shown in FIGS. 5 (a), 5 (b) and 6 (a), 6 (b).

As shown in FIG. 1, the component mounting device 25 is
The CPU 26 is provided with a control unit including an i / o (input / output) control unit 28 and an image processing unit 29 which are connected to the CPU 26 by a bus 27. In addition, the CPU 26
A memory 31 is connected to. The memory 31 has a program area and a data area, which are not particularly shown.

The i / o control unit 28 includes a lighting device 33 for illuminating the component mounting position of the board 32 and a component suction nozzle 34 of the mounting head (see the component suction nozzle 22 in FIG. 6B). An illumination device 36 for illuminating the adsorbed component 35 is connected.

Further, an X-axis motor 37, a Y-axis motor 38, a Z-axis motor 39, and a θ-axis motor 41 are connected to the i / o control unit 28 via respective amplifiers (AMP). The X-axis motor 37 drives the work head left and right, the Y-axis motor 38 drives the X-axis rail back and forth, and Z
The axis motor 39 drives the work head up and down, and the θ axis motor 41 rotates the component suction nozzle 34 by 360 degrees.

Although not particularly shown, each of the above-mentioned amplifiers is provided with an encoder, and these encoders are provided with respective motors (X-axis motor 37, Y-axis motor 38, Z-axis motor 39, θ-axis motor). 41) The encoder value corresponding to the rotation of CP is transmitted via the i / o control unit 28 to the CP.
Input to U26. As a result, the CPU 26 can recognize the current position of the component suction nozzle 34 according to the time axis.

Further, a vacuum unit 42 is connected to the i / o control unit 28. The vacuum unit 42 is pneumatically connected to the illustrated component suction nozzle 34 through a vacuum tube 43 and a work head and a mounting head (not shown). An air pressure sensor 44 is arranged on the vacuum tube 43.
The vacuum unit 42 causes the component suction nozzle 34 to suck the component 35 by vacuum, or vacuum release, air blow, and vacuum break (vacuum break).
Release the adsorption by. At this time, the air pressure sensor 44
The air pressure data in the vacuum tube 43 is output as an electric signal to the CPU 26 via the i / o control unit 28. As a result, the CPU 26 controls the state of the air pressure in the vacuum tube 43, and by extension, the component suction nozzle 3
It is possible to recognize the current state according to the time axis of the air pressure of No. 4.

Further, the i / o control unit 28 is connected with a positioning device, a belt drive motor, a substrate sensor, an abnormality display lamp and the like via respective drivers. The positioning device is arranged below the substrate guide rail inside the base of the component mounting device, and positions the substrate 32 guided into the device. The belt drive motor circulates and drives the substrate transport belt which is integrally arranged on the guide rail. The substrate sensor detects loading and unloading of the substrate 32. The abnormality indicator lamp lights up or blinks when an abnormality occurs such as an operation abnormality of the component mounting device or a foreign substance entering the work area to notify the operator of the abnormality occurrence.

A communication i / o interface 45, a display input device 46, and a recording device 47 are connected to the i / o control unit 28. The communication i / o interface 45 is connected to these processing devices in a wired or wireless manner so as to be able to communicate with the CPU 26 when the teaching process is performed by another processing device such as a personal computer. .

The display / input device 46 is a relatively large-sized display / input device in which a touch-type transparent input device is superposed on a display device such as an LCD. This display input device 46 is
At the time of executing the component mounting work, the image of the substrate 32 taken by the camera 48 on the work head side by the image processing unit 29,
Similarly, the image processing unit 29 is a camera 49 on the main device side.
The image of the component 35 picked up in step 3 is displayed on the display device. Further, when the teaching process is executed, a graph image and a parameter input window which will be described in detail later are displayed on the screen.

The recording device 47 is, for example, a hard desk or M
Various recording media such as O, FD, CD-ROM / RW, and flash memory device can be mounted, and programs such as component mounting processing of the component mounting device, component mounting teaching processing performed in advance, and a component library data,
Various data such as NC data from CAD is recorded and held, and these programs are loaded into the program area of the memory 31 by the CPU 26 and used for control processing of each unit, and the data is also the data area of the memory 31. And is subjected to a predetermined process. The processed and updated data is stored and saved in a predetermined data area of a predetermined recording medium.

FIG. 2 shows the C of the control unit in the above-mentioned configuration.
It is a figure which shows typically the example of a display of the display screen of the display input device 46 processed by PU26. As shown in the figure, the display screen 50 is provided with an instruction input button display area 51 on the upper left and right sides and slightly narrower. In the instruction input button display area 51, for example, master change, checkout, OK, cancel, teaching, appearance display,
Pickup, place, parts supply, image recognition, inspection,
Buttons for inputting instructions such as management are displayed.

An image display area 52 is provided on the lower left side of the instruction input button display area 51 and substantially on the left half. In the image display area 52, the component suction nozzle 34 (hereinafter,
Height data of the nozzle 34) and its nozzle 3
The data of the air pressure supplied to No. 4 is displayed as a graph with the horizontal axis as the time axis.

In the remaining area on the right side of the image display area 52, a parameter name display area 53 is provided on the left end side, and the parameter name is displayed between the parameter name display area 53 and the image display area 52. A plurality of data input windows 54 (54-) corresponding to a plurality of parameter names in the display area 53
, 54-2, ..., 54-n) are displayed.

In the above-mentioned parameter name display area 53, for example, when the operation for picking up a component from the component supply device is displayed, pickdown speed, pick time, pickup speed, vacuum start height, and pick retry. The names of parameters such as the number, the used nozzle 1, the used nozzle 2, the used nozzle 3 and the like, which are different from the parameters preliminarily incorporated in the NC program and should be incorporated by the teaching by the operator, are displayed.

Further, for example, in the case of a display showing the operation when mounting a component on a board, the moving speed XY, moving speed θ, place-down speed, place time, place-up speed, place height offset, blow time, The names of parameters to be incorporated by teaching such as place offsets X, Y, and θ are displayed.

Then, at the right end of the data input window 54 displayed corresponding to these parameter names, the designated input buttons 55 (55-1, 5-1, 5-1) corresponding to the data to be input are provided.
5-2, 55-3) is displayed. Designation input button 55- with only a downward triangle mark displayed
For 1, the pull-down menu is displayed by pressing this. For example, the parameter name is "placedown speed"
Designation input button 55 at the right end of the data input window 54 corresponding to
In the pull-down menu by, "High speed", "Medium speed",
"Low speed" is displayed, and one of the speeds selected from these is displayed as input data in the corresponding data input window 54.

Further, the designation input buttons 55-2 and 55-3 for the upward triangle mark and the downward triangle mark displayed in the upper and lower two rows increase or decrease the numerical value initially displayed in advance in the corresponding data input window 54. It is a thing. For example,
In the data input window 54 corresponding to the parameter name "Pick time", the default time is "3" in ms (milliseconds).
"0" is displayed. Each time the upward triangle mark designation input button 55-2 on the right end of the data input window 54 is pressed, the displayed numerical value increases by "1", and it is displayed each time the downward triangle mark designation input button 55-3 is pressed. The numerical value is decreasing by "1".

The teaching process of the present invention proceeds based on such a display screen. This will be further described below. Initially, the operation of picking up and mounting the component specified by the operator is executed by the NC program, but this component supply device has a function of adjusting the parameters of the program on the component master file side,
The parameters of the program are adjusted, that is, teaching is performed along with the adjustment of the display parameters by the operator described later.

First, the operator turns on the power of the component mounting device 25, and inputs a predetermined button for instructing the start of the component mounting teaching process from the initial screen of the display input device 46. As a result, the screen shown in FIG. 2 is displayed on the display input device 46. Subsequently, the operator inputs an appropriate input button displayed in the instruction input button display area 51 to cause the component supply device to execute a mounting process of a desired component. At this time, first, the nozzle 3 from the component supply device
4, the initial setting value of the processing parameter is displayed in the data input window 54 corresponding to the parameter of the display input device 46, and the height data of the nozzle 34 and its air pressure in the operation at the time of component suction. The image display area 52 is a graph whose data corresponds to the time axis.
Is displayed in.

FIG. 3 is a diagram showing an example of a time axis correspondence graph of the height data of the nozzle 34 and its air pressure data in the operation at the time of suction of the above components. In the figure, the horizontal axis represents time, and the lower left corner is represented by the origin "0" and is represented in units of measurement accuracy ms (milliseconds). The horizontal scale indicated by the broken line frame indicates the time every 50 ms, and at the time point indicated by the vertical solid line 58, the nozzle descends from the start of the suction operation (time "0") instructed by the NC program, The tip (suction port)
Indicates the time required to reach the component surface, which is 80 ms in the example of this graph.

The vertical axis represents the nozzle height and its air pressure. On the left vertical axis, the upper left corner is the origin "0", and the nozzle height is shown in units of measurement accuracy of 1/100 mm. The vertical scale indicated by the broken line frame shows the nozzle height every 10 mm. As shown by the nozzle height graph 56 indicated by the alternate long and short dash line in the figure, the reference position at the start of the suction operation is “−20.00
mm ”. After 80 ms, "-
The tip of the nozzle comes into contact with the component suction surface by descending to a height of "42.35 mm". After this, the parts are sucked up by the vacuum and lifted.

Further, on the right vertical axis, the lower right corner is set to the origin "0", and the nozzle air pressure is shown with the resolution of "4096" from the maximum air pressure to the minimum air pressure of the air pressure sensor 44 shown in FIG. Here, the unit of this resolution is tentatively called Sp. The larger the value of this Sp value, the lower the air pressure.
The vertical scale indicated by the broken line frame indicates the nozzle air pressure for each 1000 Sp.

As shown by the nozzle air pressure graph 57 indicated by the solid curve in the figure, the time from the start of the suction operation to the contact of the tip of the nozzle with the component suction surface is 0 to 80 ms,
The nozzle air pressure is the same as the atmospheric pressure, and in this example, the atmospheric pressure is 806 Sp as the resolution of the pneumatic sensor 44.

From the time point of 80 ms (the time point indicated by the vertical solid line 58) to the time point of 110 ms, the double-headed arrow 5 in FIG.
The period of time 30 ms shown by 9 is the pick time (the time during which the nozzle is stationary), during which the above time 80 m
Instructed to start vacuum at s, about 10m
After a mechanical inevitable delay period of opening the vacuum valve of s, the vacuum is actually operated, the nozzle air pressure is reduced to 2750 Sp by the time 110 ms, and the component is adsorbed to the nozzle.

After this time 110 ms, the nozzle starts to rise. A mark 61 displayed while the nozzle height graph 56 is rising indicates the time when the work head starts to move in the X-axis and Y-axis directions. The operator observes the operation of the component supply device (the operation of the work head and the nozzle) when this graph is displayed, and monitors whether or not the component suction has been performed without any inconvenience. If there is no problem, the mounting parameters of the component are confirmed. If there is a defect, observe the graph and, for example, pick down speed, pick time, pickup speed, vacuum start height, number of pick retries, used nozzle 1, used nozzle 2, used nozzle 3
Which parameter should be changed?

For example, when the suction of the parts is not successful, it can be easily found from the nozzle air pressure graph 57 in the figure that there is a delay period of the vacuum valve opening of about 10 ms. It can be determined that if the start instruction is made earlier, the vacuum execution time during the pick time becomes longer, and therefore, the nozzle air pressure is further reduced, so that the components can be more reliably sucked.

The same result can be obtained even if the vacuum start instruction is left as it is and the pick time is lengthened. However, if the mounting time is shortened, the vacuum start instruction should be advanced to shorten the mounting time so much. If you don't have to think about it, you may choose to lengthen the pick time.

FIG. 4 is a diagram showing an example of a time axis correspondence graph of the height data of the nozzle 34 and its air pressure data in the component mounting operation when mounting the component sucked as described above on the substrate. Also in this figure, the horizontal axis is time, the lower left corner is represented by the origin "0", and is represented in units of measurement accuracy ms (milliseconds), and the horizontal scale indicated by the broken line frame is time every 50 ms.

The vertical axis on the left is the origin "0" at the upper left corner.
The nozzle height is expressed in units of measurement accuracy of 1/100 mm, and the vertical scale indicated by the broken line frame indicates the nozzle height every 10 mm. On the right vertical axis, the lower right corner is the origin “0”, and the nozzle air pressure is “4096” of the air pressure sensor 44.
The resolution is shown. The vertical scale indicated by the broken line frame indicates the nozzle air pressure for each 1000 Sp. Here again, the unit of resolution is tentatively called Sp. Also, the larger the Sp value is, the lower the air pressure is as in the case of FIG.

The nozzle height graph 56 'of the broken line curve is shown in FIG.
As shown by, after starting the mounting operation at time 0 ms, time t1
In the period Pt from t2 to t2, the component at the tip of the nozzle is pressed so as to sink to the predetermined component mounting position on the substrate by about 0.5 mm. At the time t1, as shown in the nozzle air pressure graph 57 ', the start of the air blow is instructed at the point a, and there is a delay in the execution of the valve opening / closing operation (vacuum valve closing and blow valve opening operation) up to the point b. The air pressure rises and reaches the atmospheric pressure at point c, and substantial air blowing is started from this point c.

When this air blow has been sufficiently effective,
That is, at time t2, the nozzle starts rising. The component surface is in contact with the suction port at the tip of the nozzle up to a height that exceeds the pressing distance of 0.5 mm to the substrate surface, and the nozzle rises above this height, immediately after the nozzle suction port is separated from the component surface. Air blow continues until point d. When the nozzle air pressure returns to atmospheric pressure at point e, the nozzle is completely separated from the component. In this case as well, the mark 61 'displayed while the nozzle height graph 56' is rising indicates the time when the work head starts moving in the X-axis and Y-axis directions.

As described above, if the air blowing time is too long, the air blowing continues even after the nozzle is separated from the parts, and the mounted parts around the parts are displaced or blown off in extreme cases. Also, if the air blow time is too short, the nozzle air pressure will return to atmospheric pressure before the nozzle separates from the part, and especially for parts with a smooth suction surface, the part will not come off from the suction port of the nozzle and will be taken back. Will end up.

The operator observes the operation of the work head and the nozzle when the above graph is displayed, and monitors whether or not the above-mentioned trouble has occurred. If there is no problem, the mounting parameters of the component are confirmed. If there is a defect, the graph is observed and any of the parameters such as place-down speed, place time, place-up speed, place height offset, and blow time are changed to eliminate the problem.

As described above, by looking at the displayed graph, it is possible to easily find the parameter for correcting the malfunction in operation. Therefore, as in the conventional method, it is possible to save time and wasted time to correct parameters by modifying the parameters, and by repeating the trial and error of testing the mounting operation with a combination of the modifications.・ Teaching work efficiency is improved.

Further, in this example, even if the parameters are corrected first by trial and error, it is possible to visually confirm how the movement on the graph changes each time one parameter is changed. Depending on the visual experience,
Only by looking at the first graph, it becomes easy to know which parameters should be corrected, and it becomes possible to quickly perform the optimum parameter correction for each part.

[0065]

As described above in detail, according to the present invention, N is set by the preferred approach in which the parameter to be modified can be easily known by visually observing the graph.
Since it is possible to correctly adjust the relationship between the component suction nozzle position and the air pressure during the component suction operation from the component supply device or the component mounting operation on the board by simply modifying only the parameters to be corrected in the C program, The efficiency of teaching work, which could only be taught by repeating inputting and adjusting parameters for suction operation and component mounting operation by trial and error and observing the actual operation with the corrected parameters, is remarkably high. Improved to
Therefore, the efficiency of the entire component mounting teaching work including the teaching of the component suction operation and the component mounting operation is improved, which facilitates the setup work and contributes to the improvement of the efficiency of the manufacturing line as a whole.

[Brief description of drawings]

FIG. 1 is a block diagram showing a system configuration of a component mounting apparatus according to an embodiment.

FIG. 2 is a diagram schematically showing a display example of a display screen of a display input device processed by a CPU of a control unit in the component mounting device according to the embodiment.

FIG. 3 is a diagram showing an example of a time axis correspondence graph of nozzle height data and air pressure data thereof in an operation at the time of picking up a component in the teaching of the component mounting apparatus according to the embodiment.

FIG. 4 is a diagram showing an example of a graph corresponding to a time axis of nozzle height data and air pressure data thereof in an operation at the time of mounting a component in the teaching of the component mounting apparatus according to the embodiment.

5A is an external perspective view of a conventional component mounting apparatus, and FIG.
FIG. 3 is a perspective view of the tape component supply device arranged on the component supply stage.

FIG. 6A is a perspective view schematically showing the internal structure of the conventional component mounting apparatus with the upper and lower protective covers removed, and FIG. 6B is a perspective view of the working head.

[Explanation of symbols]

1 Component Mounting Device 2 Display Input Device 3 Monitor Device 4 Alarm Lamp 5 Base 6 Board Guide Rail 7 Protective Cover 8 Component Supply Stage 9 Mounting Fixing Hole 10 Tape Component Supply Device 11 Component Reel 12 Component Supply Port 13-1 Top Tape 13 -2 accommodation tape 15 Y-axis rail 16 X-axis rail 17 Working head 18 (18-1, 18-2) Wiring chain body 19 Mounting head 21 Board recognition camera 22 Adsorber 22-1 Light diffusion plate 22-2 Adsorption nozzle 25 component mounting device 26 CPU 27 bus 28 i / o control unit 29 image processing unit 31 memory 32 substrate 33 lighting device 34 suction nozzle 35 component 36 lighting device 37 X-axis motor 38 Y-axis motor 39 Z-motor 41 θ-axis motor 45 communication i / o interface 46 display input device 47 recording device 48, 49 camera 5 Display screen 51 Instruction input button display area 52 Image display area 53 Parameter name display area 54 (54-1, 54-2, ..., 54-n) Data input window 55 (55-1, 55-2, 55-) 3) Designated input buttons 56, 56 'Nozzle height graph 57, 57' Nozzle air pressure graph

Claims (7)

[Claims] 1. A component mounting apparatus for mounting an electronic component on a printed circuit board, a height information acquisition unit for acquiring height information of a component suction nozzle at predetermined time intervals, and a predetermined time period for supplying the height information to the component suction nozzle. Air pressure information acquisition means for acquiring the information of the air pressure, height information for each predetermined time acquired by the height information acquisition means and air pressure information for each predetermined time acquired by the air pressure information acquisition means An information storage means for storing and, and a component mounting apparatus comprising: 2. A vacuum time display means for displaying a vacuum start time and a vacuum end time based on the air pressure information stored in the information storage means, and an air blow start based on the air pressure information stored in the information storage means. 2. The component mounting apparatus according to claim 1, further comprising an air blow time display means for displaying the end time and the end time. 3. The component mounting apparatus according to claim 2, wherein the display by the vacuum time display means and the display by the air blow time display means are displayed on a graph displayed on a display screen. 4. The component mounting apparatus according to claim 2, wherein the display by the vacuum time display means and the display by the air blow time display means are displayed in a numerical display window displayed on a display screen. 5. A time designation means for designating an arbitrary time, and the designated time based on the time designation by the time designation means and the height information and the air pressure information stored in the information storage means. The component mounting apparatus according to claim 1, further comprising: designated information display means for displaying nozzle height and air pressure information. 6. The component mounting apparatus according to claim 5, wherein the display by the designated information display means is displayed on a graph displayed on a display screen. 7. The component mounting apparatus according to claim 5, wherein the display by the designated information display means is displayed in a numerical value display window displayed on a display screen.