JP2006259715A - Image-drawing method, image-drawing apparatus, image-drawing system, and correction method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a drawing method, a drawing apparatus, a drawing system and a correction method of the system for improving the processing performance by carrying out correction with respect to deformation of an object to be drawn before carrying out correction with respect to the position and the posture of the object in an alignment function. <P>SOLUTION: The correction method in a drawing apparatus carries out alignment on an object on the basis of reference position data acquired by reading a position reference mark or pattern provided on the object, and image-drawing on the object in accordance with image data while moving the object in a scanning direction. Correction on an image-drawing position with respect to deformation of the object is carried out prior to correction on an image-drawing position with respect to a position of the object. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a drawing method, a drawing apparatus, and a correction method, and more particularly to a drawing method, a drawing apparatus, a drawing system, and a correction method for exposing a photosensitive material used as a multilayer substrate.

  Conventionally, in an exposure apparatus that performs scanning exposure on a workpiece such as a substrate coated or laminated with a photosensitive material, it is provided on the workpiece prior to exposure in order to accurately align the exposure position in the XY direction with respect to the workpiece. The alignment mark that becomes the reference of the exposure position is photographed with an alignment camera such as a CCD camera, and the alignment is performed to align the exposure position with the appropriate position based on the mark measurement position (reference position data) obtained by this photographing. For this alignment camera, since the exposure apparatus targets multiple types of workpieces with different sizes and alignment mark positions, so that even if the position of the alignment mark is changed in a direction perpendicular to the scanning direction, for example, Guide rails extended along the direction orthogonal to the scanning direction (X direction) Guided, driven by a drive mechanism such as a ball screw, it is adapted to be movable and positioned positioned anywhere over the entire area in the X direction dimension of the object to be exposed. The position of the alignment camera is detected and measured by position detection means such as a linear scale, and the above-described alignment is performed with reference to the position (see, for example, Patent Document 1).

  Here, when a large number of substrates that are exposure objects are successively processed, deformation caused by distortion or expansion / contraction of the substrate that is an exposure object differs from one substrate to another, so that the deformation is corrected each time. In addition, it is necessary to calculate the exposure position correction amount. This distortion correction processing has a very heavy load on the exposure apparatus, and this is a different value for each substrate, and is different from the position or orientation when the substrate is installed in the exposure apparatus.

  Conventionally, however, the above two corrections, that is, the correction of the exposure position for correcting the deformation of each substrate and the correction of the exposure position for correcting the position or posture when the substrate is set on the stage of the exposure apparatus are performed substantially simultaneously. The load of the control device for calculating this is large, and as a result, the processing capacity of the entire device is reduced.

Further, when performing exposure on both sides of the substrate, the above-described problem of lowering the processing capability becomes particularly noticeable in a method in which deformation correction data of the substrate is taken at the time of single-sided exposure and deformation correction is made by taking data again at the time of exposure of the back side.
Japanese Patent Application Laid-Open No. 8-222511

  In consideration of the above facts, the present invention considers the above facts, and in the alignment function, the drawing apparatus capable of improving the processing capability by performing the correction for the deformation of the drawing object before the correction for the position and orientation of the drawing object. It is another object of the present invention to provide a correction method thereof.

  The correction method of the drawing apparatus according to claim 1, performs alignment with respect to the object based on reference position data acquired by reading a position reference mark or pattern provided on the object, and moves the object in a scanning direction. A drawing apparatus correction method for drawing on an object according to image data while moving the image to the object, wherein the correction of the drawing position with respect to the deformation of the object is performed prior to the correction of the drawing position with respect to the position of the object. It is characterized by performing.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for the deformation of the work in advance separately from the position correction on the stage.

  The correction method of the drawing apparatus according to claim 2 uses the same or more number of position reference marks or patterns as the correction of the drawing position with respect to the deformation of the object for the correction of the drawing position with respect to the position of the object. It is characterized by being used.

  In the invention with the above-described configuration, the calculation of the position information on the stage required immediately before the exposure requires less or less position reference mark measurement than the calculation of the position information used for correcting the drawing position with respect to deformation, thereby reducing the work time. , Processing capacity can be improved.

  According to a third aspect of the present invention, there is provided a correction method for a drawing apparatus, wherein the drawing position correction for the deformation of an object to be drawn next is completed before the drawing is completed.

  In the invention with the above configuration, the processing capability of the entire apparatus can be improved by calculating the deformation correction of the next workpiece using the exposure time.

  According to a fourth aspect of the present invention, there is provided a correction method for a drawing apparatus that reads a plurality of the position reference marks or patterns with auxiliary reading means provided outside the drawing apparatus in advance, and is adapted to the deformation of the object based on the acquired reference position data. After the drawing position is corrected, the drawing position is corrected with respect to the position of the object based on reference position data read and acquired by a reading unit provided in the drawing apparatus.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for deformation of the workpiece by auxiliary reading means provided in advance outside the apparatus separately from position correction on the stage.

The drawing apparatus correction method according to claim 5, wherein a fluoroscopic reading means using X-rays is used as the auxiliary reading means. In the invention of the above configuration, X-rays are used as auxiliary reading means. Thus, it is possible to read position information that is difficult to read with visible light, such as the inner layer of the multilayer substrate.

  The correction method of the drawing apparatus according to claim 6, wherein in the drawing apparatus that performs double-sided drawing with the through hole as a position reference, the reference position acquired by the position reference mark or pattern for the currently drawn surface during drawing of one surface Based on position data obtained by rotating or inverting the data, the drawing position is corrected for deformation of the other surface.

  In the invention with the above configuration, the processing capability of the entire apparatus can be improved by calculating the deformation correction of the work on the other side using the deformation correction data on one side.

  The correction method for a drawing apparatus according to claim 7, wherein the fluoroscopic reading means using X-rays is provided in a marking or perforating apparatus that performs marking or perforating processing on a substrate and provides a mark or a conduction hole between the substrates. The drawing position is corrected for the deformation of the object based on the reference position data acquired by reading the position information of the inner layer structure of the substrate by means.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for deformation of the workpiece by auxiliary reading means provided in advance outside the apparatus separately from position correction on the stage.

  The drawing apparatus correction method according to claim 8 is characterized in that the drawing is an exposure process using a light beam.

  In the invention with the above configuration, the processing capability of the entire exposure apparatus can be improved by performing correction for deformation of the work in advance separately from position correction on the exposure stage.

  The drawing apparatus according to claim 9, performs alignment with respect to the object based on reference position data acquired by reading a position reference mark or pattern provided on the object by a reading unit, and moves the object. Is a drawing apparatus correction method for drawing on an object in accordance with image data while moving in the scanning direction, and the correction of the drawing position with respect to the deformation of the object is based on the correction of the drawing position with respect to the position of the object Is also performed first.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for the deformation of the work in advance separately from the position correction on the stage.

  The drawing apparatus according to claim 10 performs correction of a drawing position with respect to deformation of the object using the same or more number of position reference marks or patterns as used for correction of the drawing position with respect to the position of the object. It is characterized by that.

  In the invention with the above-described configuration, calculation of position information on the stage required before exposure can be performed with the same or less position reference mark measurement as the calculation of position information used to correct the drawing position for deformation, thereby improving processing performance. Can be made.

  The drawing apparatus according to an eleventh aspect is characterized in that, before the drawing is completed, the correction of the drawing position with respect to the deformation of the object to be drawn next is completed.

  In the invention with the above configuration, the processing capability of the entire apparatus can be improved by calculating the deformation correction of the next workpiece using the exposure time.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for deformation of the workpiece by auxiliary reading means provided in advance outside the apparatus separately from position correction on the stage.

  The drawing apparatus according to claim 12 reads a plurality of the position reference marks or patterns with auxiliary reading means provided in advance outside the drawing apparatus, and determines the drawing position for the deformation of the object based on the acquired reference position data. After the correction, the drawing position is corrected with respect to the position of the object based on the reference position data read and acquired by the reading means provided in the drawing apparatus.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for deformation of the workpiece by auxiliary reading means provided in advance outside the apparatus separately from position correction on the stage.

  According to a thirteenth aspect of the present invention, a drawing reading unit using X-rays is used as the auxiliary reading unit.

  In the invention with the above configuration, by using X-rays as auxiliary reading means, it is possible to read position information that is difficult to read with visible light, such as the inner layer of a multilayer substrate.

  15. The drawing apparatus according to claim 14, wherein the drawing apparatus performs double-sided drawing using the through hole as a position reference, and rotates the reference position data acquired by the position reference mark or pattern for the currently drawn surface while drawing one surface. Alternatively, the drawing position is corrected for the deformation of the other surface based on the reversed position data.

  In the invention with the above configuration, the processing capability of the entire apparatus can be improved by calculating the deformation correction of the work on the other side using the deformation correction data on one side.

The drawing apparatus according to claim 15 includes a fluoroscopic reading unit using X-rays in a marking or perforation apparatus that performs marking or perforation processing on a substrate and provides a mark or a conduction hole between the substrates,
The drawing position is corrected with respect to the deformation of the object based on the reference position data acquired by reading the position information of the inner layer structure of the substrate by the fluoroscopic reading means.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by performing correction for deformation of the workpiece by auxiliary reading means provided in advance outside the apparatus separately from position correction on the stage.

The drawing apparatus according to claim 16, wherein the drawing is an exposure process using a light beam. In the invention configured as described above, correction for deformation of the workpiece is performed in advance separately from position correction on the exposure stage. As a result, the processing capability of the entire exposure apparatus can be improved.

  The correction method of the drawing apparatus according to claim 17 is a method for forming an image on an object using drawing means, the step of measuring deformation of the object, and the object according to the deformation A step of performing a deformation correction process for forming an image transformed into an object, a step of measuring a position error of the object relative to the drawing means, and an image whose position is corrected on the object according to the position error And a step of drawing an image on the object, wherein the deformation correction process is performed before the step of measuring the position error or the step of performing the position correction process. It is characterized by being completed.

  In the invention having the above-described configuration, the processing capability of the entire apparatus can be improved by correcting the deformation of the workpiece in advance as the deformation correction process separately from the position correction process on the stage.

  The drawing apparatus correction method according to claim 18 is characterized in that drawing of the image on the partial area is started when the position correction processing on the partial area of the object is completed.

  In the invention having the above-described configuration, the correction process / exposure process can be performed in parallel by sequentially performing exposure from the corrected region.

  The correction method of the drawing apparatus according to claim 19 is characterized in that the position correction processing for the partial area of the object is performed simultaneously with the drawing of the image for the partial area.

  In the invention with the above configuration, the correction process / exposure process can be performed in parallel.

  The correction method of the drawing apparatus according to claim 20, wherein at least one of the step of measuring the position error for the one object, the step of performing the position correction process, and the step of drawing the image, The step of performing the deformation correction process on another object is performed.

  In the invention with the above configuration, correction processing can be performed in parallel.

  The correction method of the drawing apparatus according to claim 21, wherein the measurement of the deformation is performed by fluoroscopically reading a position of a mark or a pattern provided on the object using X-rays. .

  In the invention with the above configuration, by measuring the deformation using X-rays, it is possible to read position information that is difficult to read with visible light such as the inner layer of the multilayer substrate.

  23. The correction method for a drawing apparatus according to claim 22, wherein at least one of the measurement of the deformation and the measurement of the position error is performed by reading a position of a mark or a pattern provided on the object. To do.

The correction method of the drawing apparatus according to claim 23 is a method for forming an image on an object using drawing means, and measures at least two reference marks or pattern positions on the object, A first correction step for performing a correction process for forming an image corresponding to the positional relationship between these reference marks or pattern positions on the object; and the at least two reference marks or pattern positions on the object; A second correction step of measuring at least two other reference marks or pattern positions, and performing a correction process for forming an image on the object according to the positional relationship between these reference mark positions and the drawing means; Drawing the image on the object, and the first correction step is completed before the second correction step. Clearly, the processing capability of the entire apparatus can be improved by correcting the deformation of the workpiece before the position correction processing.

  The drawing system according to claim 24, which is a drawing system for forming an image on an object using drawing means, a measuring unit that measures deformation of the object, and the object according to the deformation A deformation correction processing unit for performing a deformation correction process for forming a deformed image, a position error measuring unit for measuring a position error of the object with respect to the drawing means, and applying the object to the object according to the position error. A position correction processing unit that performs a position correction process for forming a position-corrected image; and a drawing unit that draws an image on the object. The deformation correction process includes measuring the position error or correcting the position. It is characterized by being completed before processing.

  In the invention with the above-described configuration, the processing capability of the entire apparatus can be improved by performing the correction for the deformation of the work before the position correction process.

  Since the present invention has the above-described configuration, a drawing method capable of improving processing capability by performing correction for deformation of the drawing object before correction for the position and orientation of the drawing object in the alignment function. A drawing apparatus, a drawing system, and a correction method thereof can be provided.

<Outline of device>
FIG. 1 shows an exposure system according to the first embodiment of the present invention.

  As shown in FIG. 1, the exposure system 1 includes an exposure apparatus 10 and an option 2, and the option 2 further includes an image measurement apparatus 3 and an image processing apparatus 4.

  In the image measuring device 3, the reading device 3A measures an alignment mark (which may be the edge of the substrate) provided on a workpiece 12 such as a substrate coated or laminated with a photosensitive material, or a pattern position of an inner layer, and the like. The amount of deformation is measured for each sheet. The work 12 can be expanded and contracted in one direction with two or more marks, and other deformations can be measured with three or more marks.

  Next, the deformation of the exposure image is performed on the workpiece 12 by the image processing device 4 based on the deformation amount of the workpiece 12 measured by the image measuring device 3. That is, an exposure image deformed in accordance with the deformation of the workpiece 12 is obtained by deforming the exposure image according to the deformation amount of the workpiece 12 measured by the image measuring device 3.

  Further, the workpiece 12 is conveyed to the exposure apparatus 10 and an exposure image deformed by the image processing apparatus 4 is formed on the exposure surface. At this time, since the exposure image is deformed according to the deformation amount of the workpiece 12 measured by the image measuring device 3, the exposure image is deformed. Note that the image processing apparatus 4 may be configured using an apparatus (or a process) that conveys the workpiece 12 from the measurement apparatus 3 to the exposure apparatus 10.

  The TACtTime indicated by the black arrow is the required time as it is for the measurement in the image measuring device 3 and the exposure in the exposure device 10, and the image processing in the image processing device 4 is in each stage when performing pipeline processing to be described later. This is the processing time, and the time (TACtTime × N) times the number of stages (N stages) of this processing time is the image processing time for one substrate.

  FIG. 2 shows an example of the relationship between the deformation of the workpiece and the exposure image in the exposure system according to the first embodiment of the present invention.

  As shown in FIG. 2A, for example, when the workpiece 12 is a multi-layer substrate, if the workpiece 12A is not deformed, the image 6 formed on the workpiece 12A can also be an image 6A without deformation. However, when the workpiece 12 is deformed and has a shape like the workpiece 12B, the image 6 formed thereon is also deformed to have a shape like the image 6B.

  When a layer is formed on the deformed workpiece 12B, that is, the deformed image 6B, and the outer layer is provided on the workpiece 12B as an inner layer, the deformed image 6B becomes a problem. That is, in the multilayer substrate, the image (pattern) formed on the inner layer must match (or correspond to) the image (pattern) formed on the outer layer, and the image 6B formed on the inner layer is a deformed image 6B. If it exists, the image 6B on the inner layer and the image 6 on the outer layer will not match unless an image deformed in accordance with the deformed image 6B is formed on the outer layer.

  Therefore, in this embodiment, as shown in FIG. 2B, the exposure image exposed on the outer layer is deformed in accordance with the deformation of the inner layer, and the image formed on the inner layer is matched with the exposure image exposed on the outer layer. ing.

  That is, when the workpiece 12 is deformed and has a shape like 12 ', the image formed on the inner layer is also deformed as indicated by 6B indicated by a broken line. In accordance with this, the exposed image 5 is also deformed like 5B, so that the deformed image 6B formed on the inner layer and the exposed image 5B exposed on the outer layer can be matched.

  Alternatively, when the workpiece 12 is deformed as 12 ″, the image formed on the inner layer is also deformed as 6C shown by the broken line. In accordance with this, the exposure image 5 is also deformed as 5C. By deforming, the deformed image 6C formed on the inner layer and the exposed image 5C exposed on the outer layer can be matched.

  A flow of the above series of processing steps is shown in a flowchart in FIG.

  FIG. 3 shows a processing flow of the exposure system according to the first embodiment of the present invention.

  First, at step 201, the mark position for deformation correction of the workpiece 12 is measured. This is because the alignment mark provided on the outer layer of the work 12 is read by a CCD camera, or the pattern (or mark) formed on the inner layer of the work 12 is read by an X-ray CCD camera (see FIG. 11). Data for detecting the deformation of is acquired. As shown in FIG. 4A, the mark positions may be different between the inner layer and the outer layer. Further, deformation of the inner layer pattern may be detected using an outer layer mark whose relative position is known with respect to the inner layer mark.

  Next, at step 202, data processing for deformation correction of the workpiece 12 is performed. In this method, the original exposure image is deformed by image deformation processing, and the exposure image is deformed according to the deformation of the workpiece 12 detected in step 201. If the deformation amount of the workpiece 12 can be predicted, data processing may be performed based on the predicted value.

  Alternatively, data processing for performing mapping correction processing on exposure image data may be performed. In the mapping correction process, the exposure image is substantially deformed by directly changing the position of the light beam to which image data is to be assigned at the time of exposure. In consideration of deformation correction of the workpiece 12, data (for example, frame data and intermediate data for obtaining the data) to be given to the drawing element (DMD) is once formed from the image data, and the subsequent stage is formed. The correction process for the position error of the workpiece 12 in (Step 204) may be performed. In addition, when forming frame data, intermediate data, and the like, position correction based on a plurality of position errors (predicted values) that can be predicted is performed, and a plurality of position corrected data candidates are prepared. In the position error correction step, optimal position corrected data may be selected from these candidates. In this case, a plurality of candidates for rotation error are prepared, and in the subsequent position error correction step, an optimum candidate is selected for rotation, and data processing and stage are performed for position errors other than rotation. You may make it perform a movement process. Note that when forming the deformed image data before obtaining frame data or the like, a plurality of candidates are formed in consideration of the rotation error of the workpiece 12, and candidate selection and position error correction are performed on this. Also good.

  In this step 202, that is, data processing for deformation correction of the workpiece 12, pipeline processing may be performed. As shown in FIG. 4B, the pipeline mechanism here is a process of performing the next process simultaneously with the cycle of the previous process by operating each stage of the processing mechanism independently as shown in FIG. Refers to a process. In a system having a pipeline mechanism, a processing method is possible in which the next process is performed while the previous process is being performed.

  That is, when image processing is performed in the image processing device 4 as shown in FIG. 1, data processing for deformation correction as shown in FIG. 4B can be performed independently of each other in N stages. Data processing can be performed more efficiently by dividing the processing into pipeline processing as data processing for deformation correction of the workpiece 12. In addition, it is possible to simultaneously process the plurality of workpieces 12 while sequentially taking N stages of processing states. In this way, N workpieces 12 can be sequentially processed simultaneously.

  Next, in step 203, the workpiece 12 is placed on the exposure apparatus 10, and mark position measurement for position correction in the exposure apparatus 10 is performed. Here, by reading an alignment mark 13 (which may be an edge of the workpiece 12) provided on the workpiece 12, the position and inclination of the workpiece 12 in the exposure apparatus 10 are detected, and position data for correcting the position of the exposure image 5 is obtained. get. After step 203, the range surrounded by the broken line corresponds to the exposure apparatus 10 in FIG.

  Next, in step 204, data processing for position correction or stage movement control is performed. From the position data of the workpiece 12 acquired in step 203, the image data is corrected in order to correct this position, or mechanically corrected by moving the stage.

  Next, at step 205, an exposure process is performed based on the image data that has been subjected to deformation correction (and position correction) on the workpiece 12 by the exposure apparatus 10. Even when the workpiece 12 is deformed, the exposure image can be deformed in accordance with the deformation by the correction process performed in each of the above steps, and matched with the deformed inner layer image.

  At this time, simultaneous processing by area division may be performed. As shown in FIG. 4C, the entire image is not corrected prior to the exposure process, and the exposure by the exposure apparatus 10 is performed when the workpiece 12 is scanned and exposed (the relative position with respect to the exposure apparatus 10 changes). The exposure area 42 is subjected to correction processing before exposure as the correction area 43, and the correction area 43 moves on the work 12 before the scanning exposure proceeds and the exposure area 42 sequentially moves on the work 12. By sequentially exposing the data corrected in the area 43 in the exposed area 42, the unexposed area 44 is sequentially processed into the exposed area 41. As described above, correction processing / exposure processing can be performed in parallel by sequentially performing exposure from the corrected region.

  FIG. 5 shows an exposure apparatus applicable to the exposure system of the present invention.

  As shown in FIG. 5, the exposure apparatus 10 includes a rectangular thick plate-shaped installation base 18 supported by four legs 16. Two guides 20 extend along the longitudinal direction on the upper surface of the installation table 18, and a rectangular flat plate-like stage 14 (moving means) is provided on the two guides 20. Yes. The stage 14 is disposed such that the longitudinal direction thereof faces the extending direction of the guide 20, and is supported by the guide 20 so as to be movable on the installation table 18. The stage 14 is driven by a driving device (not shown) and moves along the guide 20. (Arrow Y direction in FIG. 5).

  On the upper surface of the stage 14, a rectangular plate-like workpiece 12 as an exposure object, that is, a workpiece such as a substrate on which a photosensitive layer is coated or laminated, is positioned in a predetermined mounting position by a positioning unit (not shown). Placed. A plurality of grooves (not shown) are formed on the upper surface (work placement surface) of the stage 14, and the workpiece 12 is placed on the upper surface of the stage 14 by applying a negative pressure inside the grooves by a negative pressure supply source. It is adsorbed and held. The work 12 is provided with a plurality of alignment marks 13 indicating the reference of the exposure position.

  A U-shaped gate 22 is provided at the center of the installation table 18 so as to straddle the movement path of the stage 14. Both ends of the gate 22 are fixed to both side surfaces of the installation base 18, and a scanner 24 for exposing the workpiece 12 is provided on one side across the gate 22, and provided on the workpiece 12 on the other side. An alignment unit 100 including a plurality of CCD cameras 26 for photographing the alignment mark 13 is provided.

  Further, detection means for detecting the above-mentioned positional deviation by detecting the irradiated beam position and its light amount on the downstream side (upstream side in the exposure direction) of the alignment measurement direction in the moving direction (arrow Y direction) of the stage 14. The detection means includes a reference plate 70 attached to the downstream edge of the stage 14 in the alignment measurement direction, and a photo sensor (not shown) movably attached to the back side of the reference plate 70. )). A calibration reference mark 77 is provided on the reference plate 70, and calibration work for the alignment function is performed using the calibration reference mark 77 provided on the reference plate 70 at the time of manufacture or maintenance of the exposure apparatus 10.

  That is, in order to calibrate the exposure position alignment function of the exposure apparatus 10, the CCD camera 26 reads the alignment mark 13 that serves as a reference for the exposure position provided on the work 12 at a position where it can be read by the CCD camera 26. A reference plate 70 having a plurality of calibration reference marks 77 arranged at a predetermined interval along the moving direction of the CCD camera 26 is disposed, and at least one of the plurality of calibration reference marks 77 is arranged as described above. The alignment mark 13 is read by the CCD camera 26 arranged at the reading position, and based on the position data of the CCD camera 26 acquired by the reading, positional deviation data between the imaging optical axis (lens optical axis) and the calibration reference mark 77, etc. Based on the above, the calibration data is calculated, and the calibration data is reflected in the reference position data.

  As a result, it is possible to calibrate the exposure alignment function whose accuracy is influenced by the attitude change factor accompanying the movement of the CCD camera 26, and the correction accuracy of the exposure position deviation with respect to the workpiece 12 can be improved. In the present embodiment, unlike the first embodiment shown in FIG. 1, data for deformation correction is acquired by reading the alignment mark 13 of the workpiece 12 on the exposure apparatus 10, and further data acquisition for position correction is performed. The number of equipment and installation location can be reduced.

  FIG. 6 shows an alignment unit according to the second embodiment of the present invention.

  As shown in FIG. 6, the alignment unit 100 includes a rectangular unit base 102 attached to the gate 22. A pair of guide rails 104 are extended on the camera mounting surface side of the unit base 102 along a direction (arrow X direction) orthogonal to the moving direction (arrow Y direction) of the stage 14. Is slidably guided by the pair of guide rails 104 and driven by a drive source such as a ball screw mechanism 106 prepared individually and a stepping motor (not shown) for driving the mechanism, It moves independently in the direction orthogonal to the moving direction. Each CCD camera 26 is arranged in such a posture that the lens portion 26B provided at the tip of the camera body 26A is directed downward and the lens optical axis is substantially vertical, and a ring is provided at the tip of the lens portion 26B. A strobe light source (LED strobe light source) 26C is attached.

  When each CCD camera 26 photographs the alignment mark 13 of the workpiece 12, it is moved in the direction of the arrow X by the drive source and the ball screw mechanism 106 and is placed at a predetermined photographing position, that is, the lens optical axis is The strobe light source 26C is caused to emit light at the timing when the alignment mark 13 reaches a predetermined photographing position, and is arranged so as to match the passing position of the alignment mark 13 of the work 12 that moves as the stage 14 moves. The alignment mark 13 is photographed by causing the reflected light of the irradiated strobe light on the upper surface of the work 12 to be input to the camera body 26A via the lens portion 26B.

  The drive device for the stage 14, the scanner 24, the CCD camera 26, and the drive source for moving the CCD camera 26 are connected to a controller 28 for controlling them. The controller 28 controls the stage 14 to move at a predetermined speed during the exposure operation of the exposure apparatus 10 to be described later, and the CCD camera 26 is placed at a predetermined position to mark the alignment mark 13 of the workpiece 12 at a predetermined timing. The scanner 24 is controlled to shoot, and the scanner 24 is controlled to expose the workpiece 12 at a predetermined timing.

  When the exposure operation of the exposure apparatus 10 is started, the drive device is controlled by the controller 28, and the stage 14 that attracts the workpiece 12 to the upper surface is moved along the guide 20 from the upstream side in the alignment measurement direction in the movement direction (arrow Y direction). Start moving at a constant speed downstream. Each CCD camera 26 is controlled and operated by the controller 28 in synchronization with the start of the movement of the stage or at a timing just before the tip of the work 12 reaches just below each CCD camera 26.

  When the workpiece 12 passes under the CCD camera 26 as the stage 14 moves, alignment measurement by the CCD camera 26 is performed.

  In this alignment measurement, first, when the alignment mark 13 provided on the downstream side (front end side) in the movement direction of the workpiece 12 reaches directly below each CCD camera 26 (on the optical axis of the lens), each CCD camera is at a predetermined timing. 26 images each alignment mark 13 and outputs the captured image data, that is, image data including reference position data whose exposure position reference is indicated by the alignment mark 13 to the CPU which is a data processing unit of the controller 28. To do. After the alignment mark 13 is photographed, the stage 14 resumes moving downstream.

  Further, when a plurality of alignment marks 13 are provided along the movement direction (scanning direction) as in the workpiece 12 of the present embodiment, the next alignment mark 13 (upstream side in the movement direction (rear end side)). When the alignment mark 13) provided at the position reaches just below each CCD camera 26, each CCD camera 26 similarly photographs the alignment mark 13 at a predetermined timing and outputs the image data to the CPU of the controller 28.

  At this time, conventionally, both the correction for the deformation of the workpiece 12 and the correction for the position and posture of the workpiece 12 are simultaneously performed from the position data obtained by photographing the alignment mark 13, so that the calculation amount is large and the processing speed is reduced. It was one of the causes.

In the present invention, in consideration of this point, in the exposure alignment function, the correction for the deformation of the work 12 is performed earlier than the correction for the position and orientation of the work 12, thereby improving the processing capability. An exposure apparatus 10 and a calibration method therefor are provided.
<Order of correction>
First, the CPU grasps the dimensional accuracy error and distortion of the workpiece 12 from the mark position and the pitch between the marks in the image determined from the input image data (reference position data) of the alignment mark 13, and the workpiece 12 is covered. An appropriate exposure position with respect to the exposure surface is calculated. Then, at the time of image exposure by the scanner 24, correction control (alignment) is performed in which the control signal generated based on the image data of the exposure pattern stored in the memory (not shown) is adjusted to the appropriate exposure position to perform image exposure. .

  That is, the shape and dimensional accuracy errors of the workpieces 12 are unique for each workpiece 12, and three or more positions of the alignment mark 13 are detected in advance by the CCD camera 26 or other detection means. It is possible to acquire data for correcting the dimensional accuracy error, distortion, and the like in advance.

  As a result, the correction processing necessary for exposure can be divided, and the amount of correction processing that needs to be performed immediately before exposure on the exposure apparatus 10 can be reduced. For this reason, the processing capability of the exposure apparatus 10 can be increased.

  FIG. 7 shows a modification of the exposure system according to the present invention.

  In order to divide the calculation amount of the correction data necessary for exposure as described above, for example, as shown in FIG. 3, one or more workpieces 12 are placed on the stage 14 and a plurality of CCD cameras 26A, 26B are placed. Thus, the dimensional accuracy error / distortion of the workpiece 12, the displacement of the mounting position of the workpiece 12 on the stage 14, and the inclination of the workpiece 12 with respect to the moving direction may be detected separately and independently. In this case, a configuration in which the sheet-like or long workpiece 12 is sequentially moved (conveyed) with respect to the stage 14 or a configuration in which the plurality of stages 14 are cyclically moved can be employed.

  Specifically, the alignment mark 13 on the workpiece 12A to be exposed first is detected at three or more locations by the CCD camera 26A dedicated for distortion correction, and after the distortion correction data is acquired, the stage 14 is driven in the direction of the arrow by the driving device. Driven and moves in the exposure direction along the guide 20.

  As shown in FIG. 7, the tilt / position of the workpiece 12 can be calculated by detecting two alignment marks 13, but the strain / deformation of the workpiece 12 needs to be detected at three locations.

  Specifically, for example, as shown in FIG. 8B, the position / inclination of the workpiece 12 can be detected by detecting two or less places, but as shown in FIG. 8C, both the positional deviation / inclination of the workpiece 12 are zero. When there is distortion, it is necessary to detect three or more alignment marks 13 in order to detect this distortion.

  The CPU determines the mark position and mark pitch in the image determined from the image data (reference position data) of the two or more input alignment marks 13, the position of the stage 14 when the alignment mark 13 is photographed, and the CCD camera. From the position of 26B, the shift of the mounting position of the workpiece 12 on the stage 14 and the inclination of the workpiece 12 with respect to the moving direction are grasped by calculation processing, and an appropriate exposure position with respect to the exposed surface of the workpiece 12 is calculated. Then, at the time of image exposure by the scanner 24, correction control (alignment) is performed in which the control signal generated based on the image data of the exposure pattern stored in the memory (not shown) is adjusted to the appropriate exposure position to perform image exposure. .

  That is, the position and inclination of the workpiece 12 relative to the exposure apparatus 10 (or relative to the stage 14) are detected and corrected. This correction can be efficiently performed immediately before exposure because the position / tilt cannot be detected or calculated unless the workpiece 12 is placed on the exposure position on the stage 14.

  At this time, as described above, when the displacement and inclination of the work 12 are both zero and distortion exists, it is necessary to detect three or more alignment marks 13 in order to detect this distortion. Since the position / inclination of the workpiece 12 can be detected by detecting two or less locations, the alignment mark 13 may be detected at two locations. As a result, only two CCD cameras 26B are required, and the cost can be reduced.

  When the work 12 moves under the scanner 24 to the downstream side in the exposure direction as the stage 14 moves, and the image exposure area on the exposed surface reaches the exposure start position, each exposure head 30 of the scanner 24 emits a light beam. Then, image exposure on the exposed surface of the workpiece 12 is started. In addition, while performing position correction and exposure processing on the previous work 12, deformation correction on the subsequent work 12 can also be performed.

  9 and 10 show a modification of the distortion correction method of the exposure apparatus according to the present invention.

  As shown in FIG. 9A, when the workpiece 12 does not have distortion such as expansion and contraction, the exposure image input to the scanner 24 is also an image without distortion as shown in FIG. 9B. Absent.

  However, when the workpiece 12 is deformed as shown in FIG. 9C, if the image as shown in FIG. 9D is input to the scanner 24 as it is, the image as shown in FIG. As a result, if the unevenness and expansion / contraction are corrected after the development process or used as a multilayer substrate as described later, the shape is deformed to the opposite of the original substrate deformation as shown in FIG.

  Therefore, for the deformation of the workpiece 12 as shown in FIG. 10C, the exposure image input to the scanner 24 is deformed in accordance with the deformation of the workpiece 12 as shown in FIG.

  As a result, when the workpiece 12 is restored to its original shape after the development processing, or when the workpiece 12 is used as a multilayer substrate as will be described later, the original correct image is developed and an image as shown in FIG. 10E is obtained. .

In the above configuration, the process of performing deformation correction processing (processing for calculating a corrected pattern such as image data deformation correction processing) from the distortion information of the workpiece 12 acquired by the CCD camera 26A has the greatest load. For this reason, a plurality of processes (processes that can be processed before placing on the stage 14) from the detection of the plurality of alignment marks 13 by the CCD camera 26A to the calculation of the distortion correction data for each workpiece 12 are performed on a plurality of lines. If the configuration is such that the process up to the calculation of the most time-consuming distortion correction data is processed in parallel and the workpiece 12 that has been processed is exposed on the stage 14, the processing capacity of the entire system is further improved. Can do.
<Perforation of multilayer substrates>
Usually, there are cases where a single substrate is used, but there are also cases where a plurality of substrates are stacked to form a multi-layer substrate to form a single component.

  At this time, when the substrates are stacked, the substrate is further stacked on the substrate on which the pattern has already been formed, and processing such as patterning is performed, so that the pattern position of the underlying layer (inner layer) is optically read It is difficult to detect. Therefore, it is possible to read the pattern position of the inner layer using a fluoroscopic reading device using X-rays penetrating the substrate, and use it for alignment of pattern exposure drawn on the upper substrate formed thereon.

  In other words, in place of the CCD camera 26A described above, a plurality of pattern positions on the multilayer substrate to be exposed on the stage 14 of the exposure apparatus are read by fluoroscopic reading means for reading the pattern position of the inner layer with X-rays for distortion correction. It is also possible to acquire data. Hereinafter, modifications of the measuring device 3 of the present invention will be described.

  Specifically, for example, in the perforation apparatus 100 as shown in FIG. 11 equipped with an X-ray CCD camera 164 and an X-ray light source 165, blind via holes (BVH) are formed in the vicinity of the four corners of the rectangular substrate. The case where alignment of a build-up printed circuit board (Build-up printed wiring BoArd) 200 such that each BVH is an alignment mark for manufacturing a substrate is performed by the exposure apparatus 10 is taken as an example. Alternatively, as another modification, a marking device other than the punching device may be used.

  When the build-up wiring board 200 placed on the stage is transported and a plurality of BVHs formed in the vicinity of the end in the moving direction approach the X-ray CCD cameras 164A and 164B, Each BVH perspective image is captured by the camera 164. Thereby, the outline of BVH is clearly imaged and identified as an alignment mark. Alternatively, position information of a pattern already formed in the inner layer may be detected instead of BVH.

  Prior to the position / tilt of the build-up wiring board 200, the distortion (deformation / extension) information is acquired from the position information of the BVH used as the alignment mark and the pattern already formed in the inner layer by the above-described method, and correction is performed. By doing so, the processing time required for alignment mark position detection and correction value calculation can be reduced, and the processing capability of the exposure apparatus can be improved as in the other embodiments.

In this embodiment, since the position information of the alignment mark is acquired using the X-ray CCD camera of the perforation apparatus, the position information is acquired from the inner layer structure of the substrate that cannot be detected by an optical detection means such as a normal CCD camera. There are advantages you can do. Thereby, even when it is difficult to provide an alignment mark on the surface of the substrate or it is difficult to read, there is no trouble in obtaining the position information. In the present embodiment, the X-ray CCD camera 164 is provided in the perforation apparatus 100, but it is naturally not limited to this and may be provided in another apparatus or may be used alone.
<Double-sided exposure>
The work 12 can be used not only on one side but also on both sides as a photosensitive surface. After image formation is performed on one surface by patterning or the like, the number of necessary workpieces 12 can be reduced by performing the same processing on the other surface. That is, a mode in which the exposure apparatus exposes both the front and back surfaces of the same substrate using the through hole as a position reference is conceivable.

  At this time, the distortion (deformation / expansion / contraction) information acquired on one surface is also substantially effective on the other surface, and if the thickness unevenness of the workpiece 12 is within a predetermined allowable range, the information is reversed and used. can do. The exposure apparatus according to the fourth embodiment of the present invention will be described below.

  Specifically, for example, as shown in FIG. 12, distortion (deformation / extension / contraction) information prior to the position / tilt of the work 12 from the position information of the alignment marks 13 </ b> A to 13 </ b> C of the Side 1 that is the first exposure surface of the work 12. Is acquired, position / tilt information on the stage 14 is acquired, corrected and exposed.

  Next, before performing the exposure by inverting the work 12, information obtained by inverting the distortion (deformation / extension / contraction) information of Side 2 and the distortion (deformation / extension / contraction) information calculated from the position information of the alignment marks 13A to 13C of Side 1 is inverted. Calculate as

  That is, since the alignment marks 13A to 13C become 13A ′ to 13C ′ at Side 2, the position of the alignment mark 13 is not measured at Side 2, and the distortion (deformation / extension) information of Side 1 is calculated as inverted information, and the stage 14 By acquiring only the position / tilt information above and performing exposure after correction, the processing time required for detecting the position of the alignment mark 13 and calculating the correction value can be reduced, and the processing capability of the exposure apparatus 10 can be improved.

  Since the present invention is configured as described above, it is possible to increase the productivity of the exposure apparatus by performing the distortion correction process with a large load on the exposure apparatus separately from the exposure position correction process.

  In addition, since a mechanism for acquiring data necessary for the distortion correction process can be separated from the exposure apparatus main body, distortion measurement can be performed before applying a resist as a photosensitive layer or laminating. As a result, strain measurement can be performed at a stage prior to photosensitivity, so that there are no restrictions on the wavelength of X-rays or light used for measurement. That is, light of an arbitrary wavelength or X-ray can be used for the measurement.

  Furthermore, in the above-described embodiment, the exposure apparatus that exposes the workpiece to form an image has been described as an example. However, the present invention is not limited to this. Needless to say.

It is a figure which shows the exposure system which concerns on the 1st form of this invention. It is a figure which shows the distortion correction method of the workpiece | work which concerns on the 1st form of this invention. It is a flowchart of the exposure system which concerns on the 1st form of this invention. It is operation | movement explanatory drawing of the exposure system which concerns on the 1st form of this invention. It is a perspective view which shows the exposure apparatus which concerns on the 2nd form of this invention. It is a perspective view which shows the alignment unit which concerns on the 2nd form of this invention. It is a side view which shows the alignment adjustment which concerns on the 2nd form of this invention. It is a figure which shows the position shift and distortion detection method of the workpiece | work concerning this invention. It is a figure which shows the distortion correction method of the workpiece | work which concerns on this invention. It is a figure which shows the distortion correction method of the workpiece | work which concerns on this invention. It is a perspective view which shows the exposure apparatus which concerns on the 3rd form of this invention. It is a figure which shows the position shift and distortion detection method of the exposure apparatus which concerns on the 4th form of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Exposure system 2 Option 3 Image measuring device 4 Image processing apparatus 10 Exposure apparatus 12 Work 13 Alignment mark (reference mark)
14 Stage (moving means)
24 Scanner (exposure means)
26 CCD camera (reading means)
26A Camera body 26B Lens unit 26C Strobe light source 26D Rotating means 28 Controller (control means)
30 exposure head (exposure means)
70 Reference plate 77 Calibration reference mark 100 Drilling device 164 X-ray CCD camera 165 X-ray light source

Claims (24)

Based on the reference position data acquired by reading the position reference mark or pattern provided on the object, alignment with the object,
A drawing apparatus correction method for drawing on an object according to image data while moving the object in a scanning direction,
A correction method of a drawing apparatus, wherein the correction of the drawing position with respect to the deformation of the object is performed prior to the correction of the drawing position with respect to the position of the object. The correction of the drawing position with respect to the deformation of the object is performed using the same or more number of position reference marks or patterns as used for the correction of the drawing position with respect to the position of the object. Correction method for the drawing apparatus. The drawing apparatus correction method according to claim 1, wherein the drawing position correction for the deformation of the object to be drawn next is completed before the drawing is completed. After reading a plurality of the position reference marks or patterns with auxiliary reading means provided in advance outside the drawing apparatus, and after correcting the drawing position for deformation of the object based on the acquired reference position data,
The correction of the drawing position with respect to the position of the object is performed based on reference position data read and acquired by a reading unit provided in the drawing apparatus. Correction method for drawing apparatus. 5. The correction method for a drawing apparatus according to claim 4, wherein a fluoroscopic reading unit using X-rays is used as the auxiliary reading unit. In a drawing apparatus that performs double-sided drawing using the through hole as a position reference, while drawing one side,
2. The drawing position correction for deformation of another surface is performed based on position data obtained by rotating or inverting the reference position data acquired by the position reference mark or pattern for the surface currently being drawn. The correction method of the drawing apparatus according to claim 5. A device for performing marking or perforation processing on a substrate constituting the object includes a fluoroscopic reading means using X-rays,
The correction of the drawing apparatus according to claim 1, wherein the drawing position is corrected with respect to the deformation of the object based on reference position data obtained by reading position information of an inner layer structure of the substrate by the fluoroscopic reading unit. Method. The correction method for a drawing apparatus according to claim 1, wherein the drawing is an exposure process using a light beam. Means for aligning the object based on reference position data obtained by reading a position reference mark or pattern provided on the object by a reading means;
A drawing device comprising: means for drawing on the object according to image data while moving the object in the scanning direction by a moving means;
A drawing apparatus, wherein correction of a drawing position with respect to deformation of the object is performed before correction of a drawing position with respect to the position of the object. The correction of the drawing position with respect to the deformation of the object is performed using the same or more number of position reference marks or patterns as used for the correction of the drawing position with respect to the position of the object. Drawing device. The drawing apparatus according to claim 9, wherein the drawing position correction for the deformation of the object to be drawn next is completed before the drawing is finished. After reading a plurality of the position reference marks or patterns with auxiliary reading means provided in advance outside the drawing apparatus, and after correcting the drawing position for deformation of the object based on the acquired reference position data,
The correction of the drawing position with respect to the position of the target object is performed based on reference position data obtained by reading with a reading unit provided in the drawing apparatus. Drawing device. The drawing apparatus according to claim 12, wherein a fluoroscopic reading unit using X-rays is used as the auxiliary reading unit. In a drawing apparatus that performs double-sided drawing using the through hole as a position reference, while drawing one side,
10. The drawing position is corrected with respect to deformation of another surface based on position data obtained by rotating or inverting the reference position data acquired by the position reference mark or pattern for the surface currently being drawn. The drawing apparatus according to claim 13. A device for performing marking or perforation processing on a substrate constituting the object includes a fluoroscopic reading means using X-rays,
The drawing apparatus according to claim 9, wherein the drawing position is corrected with respect to the deformation of the object based on reference position data obtained by reading position information of an inner layer structure of the substrate by the fluoroscopic reading unit. 16. The drawing apparatus according to claim 9, wherein the drawing is an exposure process using a light beam. A method for forming an image on an object using a drawing means,
Measuring the deformation of the object;
Performing a deformation correction process for forming an image deformed on the object according to the deformation;
Measuring a position error of the object relative to the drawing means;
Performing a position correction process for forming an image whose position is corrected on the object according to the position error;
And a step of drawing an image on the object. The drawing method, wherein the deformation correction process is completed before the step of measuring the position error or the step of performing the position correction process. 18. The drawing method according to claim 17, wherein the drawing of the image on the partial area is started when the position correction processing on the partial area of the object is completed. The drawing method according to claim 18, wherein the position correction processing is performed on a partial area of the object simultaneously with the drawing of the image on the partial area. Simultaneously with at least one of the step of measuring the position error for the one object, the step of performing the position correction process, and the step of drawing the image, the deformation correction process is performed on the other object. The drawing method according to claim 17, wherein a performing step is performed. The drawing method according to claim 17, wherein the measurement of the deformation is performed by perspectively reading a position of a mark or a pattern provided on the object using X-rays. The drawing method according to claim 17, wherein at least one of the measurement of the deformation and the measurement of the position error is performed by reading a position of a mark or a pattern provided on the object. A method for forming an image on an object using a drawing means,
A first correction for measuring at least two reference marks or pattern positions on the object and performing a correction process for forming an image on the object according to the positional relationship between the reference marks or pattern positions. Process,
The at least two reference marks or pattern positions on the object or other at least two reference marks or pattern positions are measured, and an image corresponding to the positional relationship between these reference marks or pattern positions and the drawing means is displayed. A second correction step for performing a correction process for forming the object;
Drawing an image on the object,
The drawing method, wherein the first correction step is completed before the second correction step. A drawing system for forming an image on an object using drawing means,
A measuring unit for measuring deformation of the object;
A deformation correction processing unit for performing a deformation correction process for forming an image deformed on the object according to the deformation;
A position error measuring unit for measuring a position error of the object relative to the drawing means;
A position correction processing unit that performs a position correction process for forming an image whose position is corrected on the object according to the position error;
A drawing unit that draws an image on the object, wherein the deformation correction process is completed before the measurement of the position error or the position correction process.

Images