JP2006181488A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of accurately transporting a substrate while ensuring a sufficient cleaning function and easily manufacturing a substrate cleaning mechanism.
SOLUTION: A tip 50H of a hair bundle 50 of brush portions 221 and 222 is placed on a main surface of a substrate B supported by a conveyance roller in one direction along a main surface of the substrate B from a direction in which the hair bundle 50 extends. In this state, the tip 50H is brought into sliding contact with the main surface of the substrate B. In this posture, while the tip 50H is in contact with the surface of the substrate B, the brush portion 221 moves back and forth in a direction parallel to the substrate surface orthogonal to the substrate transport direction to clean the substrate surface being transported.
[Selection] Figure 5

Description

  In the manufacturing process of a liquid crystal display device (LCD), a plasma display device (PDP), a semiconductor device, etc., the present invention performs various processes such as a cleaning process on a glass substrate for LCD or PDP, a semiconductor substrate, a printed circuit board, etc. The present invention relates to a substrate processing apparatus.

  Conventionally, in a substrate production line such as a glass substrate for LCD or PDP, a substrate cleaning mechanism has been provided after a specific processing apparatus using a chemical solution such as an etching process to remove foreign matters such as thin films and particles remaining on the substrate surface. Washing and removal is performed. As a substrate processing apparatus having such a substrate cleaning mechanism, for example, as shown in Patent Document 1, while supplying a processing liquid such as pure water to a substrate transported by transporting means such as a roller conveyor, the substrate The thing which makes a cylindrical roll brush contact | abut on the surface is proposed.

Further, as shown in Patent Document 2, a plurality of rod-like brushes are arranged at predetermined intervals on the upper surface side and the lower surface side of a substrate to be conveyed, and reciprocating in a direction perpendicular to the substrate conveyance direction. Also, a cleaning device for removing dust on the substrate has been proposed.
JP 9-326377 A JP 10-34090 A

  However, since the substrate processing apparatus disclosed in Patent Document 1 cleans a substrate using a roll brush, it is difficult to manufacture a roll brush having the accuracy required for cleaning a large-sized substrate. That is, with the increase in the size of the substrate, the length of the roll brush extending in the horizontal direction orthogonal to the substrate transport direction is increased, and therefore the deflection of the central portion in the length direction occurs due to the weight of the roll brush itself, It is difficult to keep the distance between the roll brush constant, and it is not easy to manufacture a cleaning mechanism in which the distance between the substrate and the roll brush is constant.

  In the case of the cleaning apparatus shown in Patent Document 2, the brush cannot be uniformly slidably contacted with the main surface of the substrate unless the plane formed at the tip of the brush bristle bundle is uniform. It is difficult for processing to make the plane uniform. Further, in order to ensure sufficient cleaning performance with such a rod-shaped brush that is orthogonal to the substrate surface, the pressing force on the substrate surface must be increased. There is a possibility that the substrate conveyance may be hindered by the pressure, or the substrate may meander and be conveyed. Furthermore, it is necessary to press the brush with the plane of the brush tip parallel to the main surface of the substrate, but as the substrate size increases, the brush length extending in the horizontal direction perpendicular to the substrate transport direction becomes longer. Because the weight of the brush itself is likely to cause bending near the center in the longitudinal direction, the brush is not inclined up and down in the longitudinal direction of the brush, and the distance between the substrate and the brush is kept constant. It is difficult to press the brush body against the main surface of the substrate because high accuracy is required.

  The present invention has been made to solve the above-described problems, and can provide a substrate processing apparatus that can accurately transport a substrate while ensuring a sufficient cleaning function, and that can easily manufacture a substrate cleaning mechanism. An object of the present invention is to provide a substrate processing method.

The invention according to claim 1 of the present invention comprises a supporting means for supporting the substrate,
A brush having a base and a hair bundle composed of a plurality of hairs extending from the base;
The tip portion of the bristles of the brush supported on the main surface of the substrate supported by the support means is bent in one direction along the main surface of the substrate from the direction in which the bristles extend. And a sliding contact means for slidingly contacting the main surface of the substrate.

  In the invention according to claim 9, the tip end portion is bent in one direction along the main surface of the substrate with the tip end portion of the hair bundle composed of a large number of hairs extending from the base portion of the brush. In this substrate processing method, the substrate is processed in sliding contact with the main surface of the substrate.

  In these configurations, the tip of the bristles of the brush is in sliding contact with the main surface of the substrate in a bent state along the main surface of the substrate. For this reason, stress that tends to return to the straight state acts on the tip of the bent bristle bundle, so that the tip of the bristle bundle is urged toward the main surface of the substrate. As a result, for example, the flat surface formed by the tip of the hair bundle of the brush is uneven, or due to the length of the brush, the weight of the brush itself causes the deflection in the vicinity of the central portion in the length direction of the brush, Even if the brush is slightly tilted up and down in the longitudinal direction of the brush, the tip of the bristles of the brush can be slidably contacted with the main surface of the substrate.

Moreover, invention of Claim 2 is the substrate processing apparatus of Claim 1, Comprising: The said brush is made into the rod-shape extended in a 1st direction,
Transporting means for transporting the substrate relative to the brush in a second direction intersecting the first direction;
With respect to the main surface of the substrate that is conveyed relative to the brush along the second direction by the conveying means, the sliding contact means moves the tip of the bristle bundle of the brush relative to the substrate. As a state bent toward the downstream side in the transport direction, the brush is slidably contacted with the main surface of the substrate while reciprocating along the first direction.

  According to this configuration, the front end portion of the bristles of the brush is bent toward the downstream side in the relative conveyance direction of the substrate with respect to the main surface of the substrate conveyed relative to the brush along the second direction. Since the brush is slidably contacted with the main surface of the substrate while reciprocating along the first direction, even if the brush is slightly inclined up and down in the lengthwise direction of the brush due to the lengthening of the brush The brush can be reciprocated along the first direction with the tip of the bristles of the brush being in sliding contact with the substrate main surface uniformly.

  Further, the invention according to claim 3 is the substrate processing apparatus according to claim 2, wherein the sliding contact means has a tip end portion of the bristle bundle of the brush directed toward a downstream side in a relative conveyance direction of the substrate. As described above, the brush is slidably brought into contact with the main surface of the substrate while the brush is inclined and supported.

  According to this configuration, since the brush is disposed so as not to resist the relative conveyance direction of the substrate, the substrate can be smoothly conveyed even when the brush is in sliding contact with the main surface of the substrate.

  According to a fourth aspect of the present invention, there is provided the substrate processing apparatus according to the second or third aspect, wherein the plurality of brushes are arranged in parallel along the second direction. .

  In this configuration, by the parallel arrangement of the plurality of brushes along the second direction, the cleaning of the substrate main surface is enhanced by continuously scraping off the dirt from the substrate surface with the brush.

  The invention according to claim 5 is the substrate processing apparatus according to claim 3 or claim 4, wherein a plurality of the brushes are provided on both principal surface sides of the substrate supported by the support means. Each is arranged.

  In this configuration, by disposing a plurality of brushes on both main surface sides of the substrate, the cleaning power of both main surfaces of the substrate by the brush is enhanced.

  Further, the invention according to claim 6 is the substrate processing apparatus according to claim 5, wherein the plurality of brushes are arranged opposite to each other on both main surface sides of the substrate supported by the support means, In addition, when the substrate is not supported by the support means, the brushes are arranged so that the tip portions of the brushes arranged opposite to each other come into contact with each other, and the substrate is supported by the support means. When not done, the tip portions of the brushes arranged to face each other by the sliding contact means are brought into sliding contact with each other.

  In this configuration, when the substrate is not supported by the supporting means, the tip portions of the brushes are brought into contact with each other, and the sliding contact means is brought into sliding contact with the tip portions of the brushes arranged to face each other. The hair bundle tips of both brush portions are rubbed together, thereby washing both hair bundle tips of each brush.

  The invention described in claim 7 is the substrate processing apparatus according to any one of claims 1 to 6, wherein the flat surface formed by the tip of the hair bundle of the brush is bent. The inclined surface approaches the main surface of the substrate supported by the support means in one power direction.

  In this configuration, when the bristles of the brush are in sliding contact with the main surface of the substrate and bent, the tip of the brush spreads in a fan shape in a side view, so the number of hairs acting on the main surface of the substrate can be reduced. This increases the cleaning efficiency. For example, if the tip of the bristles is not cut obliquely, the bristles are stacked when the bristles of the brush come into sliding contact with the main surface of the substrate, and the bristles located above the bent portion of the bristles are Although there are some which do not act on the main surface of the substrate, according to the above configuration, occurrence of such a situation can be reduced.

  The invention according to claim 8 is the substrate processing apparatus according to any one of claims 1 to 7, wherein the brush is in a state of being bent in sliding contact with the main surface of the substrate. The apparatus further includes processing liquid supply means for supplying a processing liquid toward the tip of the hair bundle.

  The invention according to claim 10 is the substrate processing method according to claim 9, wherein the brush treatment is directed toward the tip of the bristle bundle of the brush which is in a slidable contact with the main surface of the substrate. The processing liquid is supplied.

  According to these configurations, by supplying the treatment liquid toward the tip of the bristle bundle of the brush, the matter (foreign matter) generated by the sliding contact of the brush with the main surface of the substrate can be discharged out of the brush, so that the treatment (cleaning) Efficiency is improved.

  According to the invention described in claim 1 and claim 9, the tip of the bristle bundle of the brush is in sliding contact with the main surface of the substrate in a bent state along the main surface of the substrate. The tip of the bristle bundle is bent, for example, because the tip of the bristle bundle is biased toward the main surface of the substrate. The flat surface formed by the brush is uneven, or due to the length of the brush, the weight of the brush itself causes deflection near the center in the length direction of the brush, and the brush slightly moves up and down in the length direction of the brush. Even if it is inclined, the tip of the bristle bundle of the brush can be slid uniformly against the main surface of the substrate.

  According to the second aspect of the present invention, with respect to the main surface of the substrate that is conveyed relative to the brush along the second direction, the tip of the bristle bundle of the brush is downstream in the relative conveyance direction of the substrate. Since the brush is slidably contacted with the main surface of the substrate while reciprocating along the first direction, the brush is slightly moved up and down in the lengthwise direction of the brush. Even if it is inclined, the brush can be reciprocated along the first direction in a state where the tip of the bristles of the brush is in sliding contact with the substrate main surface uniformly.

  According to the invention described in claim 3, since the brush is disposed so as not to resist the relative conveyance direction of the substrate, the substrate can be smoothly conveyed even when the brush is in sliding contact with the main surface of the substrate. can do.

  According to the fourth aspect of the present invention, due to the parallel arrangement of the plurality of brushes along the second direction, dirt is continuously scraped off from the substrate surface by the brush, and the cleaning power for the substrate main surface is increased. be able to.

  According to the fifth aspect of the present invention, by disposing a plurality of brushes on both main surfaces of the substrate, it is possible to enhance the cleaning power of the brushes on both main surfaces of the substrate.

  According to the sixth aspect of the present invention, in a state where the substrate is not supported by the support means, the tip portions of the brushes are brought into contact with each other, and the sliding contact means is arranged to face the tip of each brush. It is possible to clean the ends of both hair bundles of each brush by bringing the parts into sliding contact with each other and rubbing the ends of the hair bundles of both brush parts.

  According to the seventh aspect of the present invention, when the bristles of the brush are bent in sliding contact with the main surface of the substrate, the tip of the brush spreads in a fan shape in a side view. The number of hairs acting on the hair increases, and the cleaning efficiency is improved.

  According to the invention described in claims 8 and 10, an object (foreign matter) generated by the sliding contact of the brush with respect to the main surface of the substrate is removed from the brush by supplying the treatment liquid toward the tip of the bristle bundle of the brush. Since it can be discharged, the processing (cleaning) efficiency is improved.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an outline of a substrate cleaning apparatus provided in a substrate processing apparatus according to an embodiment of the present invention. The substrate cleaning apparatus 10 provided in the substrate processing apparatus 1 includes a brush cleaning chamber 2 that performs chemical treatment on the substrate B to be processed, and a rinse chamber 3 that rinses the substrate B that has passed through the brush cleaning chamber 2. And an air knife chamber 4. Moreover, it is preferable that the board | substrate B is conveyed with the attitude | position inclined from the horizontal direction orthogonal to the conveyance direction of the board | substrate B. FIG. By transporting the substrate B in this posture, the liquid supplied to the substrate B in the brush cleaning chamber 2 and the rinsing chamber 3 can be easily dropped downward, and the liquid breakage from the surface of the substrate B is improved. ing.

  For example, the brush cleaning chamber 2 is in contact with the transport roller 21 that receives and transports the substrate B that has been processed in the previous process such as the etching process and the peeling process, and the upper surface of the substrate B transported by the transport roller 21. The brush part 221 to be cleaned, the brush part 222 to be in contact with the lower surface of the substrate B, and the upper surface of the substrate B can be applied with a processing liquid such as pure water (various processing liquids used for substrate cleaning can be applied. A pure water is an example), and a processing liquid supply nozzle (liquid supply unit) 231 for supplying the processing liquid and a processing liquid supply nozzle 232 for supplying the processing liquid to the lower surface of the substrate B are provided. A plurality of these brush portions 221 and 222 and a plurality of treatment liquid supply nozzles 231 and 232 are provided. Further, the treatment liquid supply nozzles 231 and 232 are disposed upstream of the brush portions 221 and 222 in the substrate transport direction in order to prevent damage to the surface due to the brushes 221 and 222 slidingly contacting the surface of the dry substrate B. It is also disposed at a position on the side (before sliding contact of the substrate B by the brush portions 221 and 222), and the treatment liquid discharge direction is directed to the downstream side in the substrate transport direction. The processing liquid supply nozzles 231 and 232 are connected to a processing liquid supply source (not shown).

  The rinsing chamber 3 performs a rinsing process on the substrate B that has been processed in the brush cleaning chamber 2. The rinse chamber 3 includes a transport roller 31 that receives and transports the substrate B from the brush cleaning chamber 2, a rinse liquid supply nozzle 32 that supplies pure water or the like as a rinse liquid to the upper surface of the substrate B, and a rinse liquid on the lower surface of the substrate B A rinsing liquid supply nozzle 33 for supplying

  The air knife chamber 4 includes a transport roller 41 that receives and transports the substrate B transported from the rinse chamber 3, and an air knife that blows air onto the upper surface of the substrate B transported by the transport roller 41 to dry the upper surface of the substrate B. 421 and an air knife 422 that blows air against the lower surface of the substrate B and dries it.

  FIG. 2 is a configuration diagram simply showing the brush unit 221 provided in the brush cleaning chamber 2 of the substrate cleaning apparatus 10 and its driving mechanism. The brush unit 222 has the same configuration as the brush unit 221. The brush unit 221 of the brush cleaning chamber 2 includes a brush bristle bundle 50 for cleaning the surface of the substrate B, and a flat brush base 51 on which the brush bristle bundle 50 is erected (planted). The brush portion 221 including the brush bristle bundle 50 and the brush base portion 51 has a shape extending in a long shape in a direction perpendicular to or in the direction perpendicular to the conveyance direction of the substrate B and parallel to the upper surface of the substrate B. ing. Further, the brush portion 221 is inclined such that the tip 50H side of the bristle bundle 50 is directed downstream in the conveyance direction of the substrate B from a posture orthogonal to the surface of the substrate B. (Details will be described later).

  A support member 60 that supports the brush portion 221 in a suspended manner is attached to the upper surface portion 111 side of the brush base portion 51, and the brush portion 221 is attached to a brush attachment base 61 made of a rigid member by the support member 60. . A swinging mechanism 8 is attached to the brush mounting base 61, and the brush mounting base 61 is placed on the upper surface of the substrate B perpendicular to the transport direction of the substrate B by the driving force in the horizontal lateral direction given from the swinging mechanism 8. The tip 50H of the bristle bundle 50 of the brush part 221 attached to the brush attachment base 61 is parallel to the upper surface of the substrate B by swinging in a parallel direction (for example, the horizontal direction in FIG. 2). Is swung. The mechanism of the swing mechanism 8 will be described later. The support member 60 is provided so as to be movable with respect to the brush mounting base 61 so that the distance G shown in FIG. The support member 60, the brush mounting base 61, and the swing mechanism 8 are examples of sliding contact means (the configuration of the sliding contact means is not intended to be limited to this).

  The operation of the substrate cleaning apparatus 10 configured as described above will be described. First, the height position of the brush base 51 is set. This height position is determined by considering the diameter and material of each bristles constituting the bristles 50, the angle (inclination) of the bristles 50 with respect to the upper surface of the substrate B, the particle size of the particles to be cleaned, and the like. It is determined from the viewpoint of how much pressure and how much contact area the tip 50H of the brush bristle bundle 50 is brought into contact with the upper surface of the substrate B to be processed.

  The operation of finely adjusting the position of the tip 50H of the brush bristle bundle 50 with respect to the upper surface of the substrate B is also possible by adjusting the position of the support member 60 with respect to the brush mounting base 61. For example, when the brush base 51 has a long shape corresponding to a large substrate, the substantially central portion in the longitudinal direction of the brush base 51 is easily bent downward. In such a case, by adjusting the position of the support member 60 near the bent portion with respect to the brush mounting base 61 and lifting the bent portion upward, the substrate B of the tip 50H of the brush bristle bundle 50 is lifted. The positional relationship with respect to the upper surface can be made uniform in the longitudinal direction of the brush portion 222.

  Thus, the cleaning process of the substrate B is performed after the positional relationship of the tip 50H of the bristle bundle 50 with respect to the upper surface of the substrate B is adjusted. In this cleaning process, the supply pump 93 of the processing liquid supply mechanism 9 is operated to discharge the processing liquid from the processing liquid discharge hole 131 provided in the brush base 51 toward the substrate B, and to swing the mechanism. 8, the brush mounting base 61 is swung. As a result, the tip 50H of the bristle bundle 50 is inclined with respect to the substrate B as described above on the surface of the substrate B being conveyed, and comes into rocking contact in the presence of the processing liquid. The brush hair bundle 50 acts on the substrate B to remove particles and the like.

  Next, a specific aspect of the swing mechanism 8 will be described. FIG. 3 shows a swinging motion that causes the brush mounting base 61 (brush tip 50H) to reciprocate linearly in a direction (indicated by arrow c in the figure) perpendicular to the direction of travel of the substrate B (indicated by arrow b in the figure). 3 is a plan view showing an outline of a moving mechanism 8. FIG.

  The crank mechanism 80 is driven by an electric motor (drive source) 82, and a shaft support pin 812 is provided in the vicinity of the outer peripheral portion of a rotary disk 811 coupled to the rotary shaft 821 of the drive source 82. A connecting hole provided on one end side of the drive shaft 813 is loosely fitted to the shaft support pin 812. A connecting hole provided on the other end side of the drive shaft 813 and a shaft support portion 611 protruding from the side end edge of the brush mounting base 61 are rotatably connected by a connecting pin 612.

  On the other hand, the brush mounting base 61 is supported by a linear guide 613 so as to be capable of linear reciprocation in the direction of arrow c in the figure. Instead of the linear guide 613, a linear bush or the like may be used.

  In such a configuration, when the driving source 82 is driven, the rotating disk 811 coupled to the rotating shaft 821 of the driving source 82 is rotated, and the shaft support pin 812 projecting from the rotating disk 811 is rotated. The drive shaft 813 to which one end side is connected performs a crank operation in the horizontal direction of the drawing. By this crank operation, the brush mounting base 61 connected to the drive shaft 813 by the connecting pin 612 reciprocates in the direction of arrow c in the figure while being guided by the linear guide 613. That is, the brush portion 221 has the tip 50H of the bristle bundle 50 in contact with the upper surface of the substrate B in a posture inclined by an angle θ1 from a posture orthogonal to the substrate B, and reciprocates in the direction of arrow c in the figure. Thus, the dirt on the surface of the substrate B is scraped off and cleaned. Instead of such a linear reciprocating mechanism using the crank mechanism 80 and the drive source 82, a linear reciprocating mechanism using an air cylinder or the like may be adopted.

  Next, the structure of the brush part 221 will be described. 4 is a side sectional view of the brush portion 221 shown in FIG. As described above, the brush part 221 includes the brush bristle bundle 50 for cleaning the surface of the substrate B and the flat brush base part 51 on which the brush bristle bundle 50 is erected (planted). The brush bristle bundle 50 has a large number of bristles in which a shaft 52 is sandwiched at a substantially central portion in the length direction, and a brush base 51 is covered from above the brush bristle bundle 50 portion sandwiching the shaft 52. . The brush base 51 has a substantially “U” shape in cross section when viewed from the side, and has a tapered shape when viewed from the side toward the lower opening. With this shape of the brush base 51, the portion of the bristle bundle 50 sandwiching the shaft 52 is housed inside the brush base 51 and is caulked by the brush base 51.

  Each of the bristles constituting the bristle bundle 50 is made of, for example, nylon, Teflon (registered trademark), or vinyl chloride (PVC), and has a diameter of 0.05 to 0.2 (mm). The brush bristle bundle 50 is a portion exposed from the brush base 51, and the length L of the longest leg is 10 ≦ L ≦ 40 (mm).

  Further, the width dimension W in the substrate transport direction of the brush base 51 is preferably as small as possible so long as the bristle bundle 50 can be erected (planted), and specifically, it is preferably 10 mm or less. The length direction dimension of the brush base 51 is sequentially set according to the dimension in the direction orthogonal to the transport direction of the substrate to be processed.

  FIG. 5 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 with respect to the substrate B. The brush portions 221 and 222 are disposed above or below the substrate B, respectively.

  The brush portions 221 and 222 are tilted by a predetermined angle θ1 from a posture orthogonal to the upper surface or the lower surface of the substrate B with the tip 50H side of the brush bristle bundle 50 facing downstream in the transport direction of the substrate B. It is said that. This angle θ1 is 5 to 20 ° (more preferably 15 °). By arranging the brush portions 221 and 222 in such a manner as to be inclined with respect to each surface of the substrate B, the gap adjustment between the tip 50H of the brush bristle bundle 50 of the brush portions 221 and 222 and each surface of the substrate B is adjusted. Accuracy is not required, and there is a gap between the tip 50H of the bristle bundle 50 and each surface of the substrate B without setting the inclination angle θ1 of the brush portions 221 and 222 with high accuracy. There is very little possibility of causing a problem that each surface of the substrate B is unnecessarily pressed by the tip 50H.

  The processing liquid supply nozzles 231 and 232 are, for example, (1) a high-pressure nozzle that mainly discharges pure water at a high pressure, and (2) liquid-like liquid and gas are supplied by spraying the liquid to the substrate by pressure. A two-fluid nozzle that ejects two fluids, and (3) an ultrasonic nozzle that discharges pure water to which ultrasonic vibration is applied. The processing liquid supply nozzles 231 and 232 are disposed above or below the substrate B on the downstream side of the brush portions 221 and 222 in the substrate transport direction. In the treatment liquid supply nozzles 231 and 232, the treatment liquid from the treatment liquid supply nozzles 231 and 232 is such that the tip 50 </ b> H of the brush bristle bundle 50, the upper or lower surface of the substrate B, and the tip 50 </ b> H of the brush bristle bundle 50 and the substrate B The arrangement position and the arrangement angle are set so as to be sprayed (supplied) to the contact portion of the upper surface or the lower surface. Thereby, both the cleaning of each surface of the substrate B and the cleaning of the tip 50H of the brush bristle bundle 50 can be performed.

  FIG. 6 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 with respect to the substrate B, and shows a state where the substrate B is not present. As shown in FIG. 6, the brush portion 221 and the brush portion 222 are disposed at positions where the tips 50H of the brush bristle bundle 50 come into contact with each other when there is no substrate B therebetween. preferable. The brush unit 221 and the brush unit 222 are arranged in this manner, and the swing mechanism 8 is driven in a state where the substrate B does not exist in the substrate transport path between the brush unit 221 and the brush unit 222 to drive the brush unit 221 and the brush unit. If the 222 is reciprocated (vibrated) in the direction c of FIG. 3, the tips 50H of the bristle bundle 50 of the brush part 221 and the brush part 222 can be rubbed together, and the brushes of the brush part 221 and the brush part 222 can be rubbed together. The tip 50H of the hair bundle 50 can be cleaned.

  FIG. 7 is a side view showing a state in which a plurality of brush portions 221 and 222 and a plurality of treatment liquid supply nozzles 231 and 232 are arranged. A plurality of brush portions 221 and 222 and processing liquid supply nozzles 231 and 232 are provided in the brush cleaning chamber 2, and the brush portions 221 and the processing liquid supply nozzles 231 are alternately arranged in the transport direction of the substrate B. Similarly, The brush portions 222 and the treatment liquid supply nozzles 232 are also alternately arranged in the transport direction of the substrate B. If comprised in this way, scraping of the stain | pollution | contamination from each surface of the board | substrate B by the brush parts 221 and 222 and removal of the stain | pollution | contamination by the on-line liquid supplied from the process liquid supply nozzles 231 and 232 do not provide a comparative time difference. Therefore, the cleaning power for each surface of the substrate B can be increased.

  Another embodiment of the present invention will be described. For example, in the above embodiment, the structure of the brush portion 222 is such that the lower surface portion of the tip 50H of the bristle bundle 50 has a shape parallel to the horizontal plane as shown in FIG. As shown in FIG. 8, it is good also as a shape which has inclination-angle (theta) 2 of 5-20 degrees (more preferably 15 degrees) with respect to a horizontal surface. Accordingly, the lower surface portion of the tip 50H of the bristle bundle 50 is made to follow the upper surface or the lower surface of the substrate B. In this case, the brush bristle bundle 50 is a portion exposed from the brush base 51, and the length L of the longest leg is 10 ≦ L ≦ 40 (mm).

  FIG. 9 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 that are formed of the brush bristle bundle 50 having the inclination angle θ2. Even when the brush portions 221 and 222 including the brush bristle bundle 50 having the inclination angle θ <b> 2 are disposed, the brush portions 221 and 222 have the tip 50 </ b> H side of the brush bristle bundle 50 facing the downstream side in the conveyance direction of the substrate B. The posture is inclined by a predetermined angle θ3 from the posture orthogonal to the upper surface or the lower surface of the substrate B. The relationship between the angles θ2 and θ3 is θ2 <θ3 (for example, 15 ° <20 °). ). By arranging the brush portions 221 and 222 in such a posture inclined with respect to each surface of the substrate B, almost the entire surface of the surface where the tip 50H of the brush bristle bundle 50 faces the upper surface or the lower surface of the substrate B, It can be brought into contact with the upper surface or the lower surface of the substrate B.

  Furthermore, when supplying the treatment liquid toward the bent portion of the tip 50H of the hair bundle 50 of the brush portions 221 and 222, compared to the hair bundle tip portion in which the inclined surface having the inclination angle θ2 is not formed, Since the hair bundle 50 having an inclined surface spreads in a fan shape when it comes into contact with the main surface of the substrate B, the thickness of the tip 50H is reduced (because hair is sparse). The treatment liquid easily penetrates between the hair bundle 50 and the main surface of the substrate B, and the treatment efficiency by the treatment liquid is improved.

  Even if the setting of the inclination angle θ3 of the brush portions 221 and 222 and the adjustment for making the angle θ3 and the angle θ2 substantially equal to each other are not performed with high accuracy, the brush portions 221 and 222 are inclined to each of the substrates B. Since the surfaces are in contact with each other, a gap is generated between the tip 50H of the bristle bundle 50 and each surface of the substrate B, and each surface of the substrate B is unnecessarily pressed by the tip 50H. There is very little possibility.

  The present invention is not limited to the configuration of the above embodiment, and various modifications can be made. For example. In the said embodiment, although the brush parts 221 and 222 are provided in the position facing both the main surfaces of the board | substrate B, you may provide in any one main surface side. Further, the brush portions 221 and 222 are arranged in such a posture that the tip 50H is inclined with respect to the main surface of the substrate B toward the conveyance direction side of the substrate B, but the tip 50H of the brush bristle bundle 50 is arranged. If the brush B is in contact with the main surface of the substrate B in a state of being bent along the main surface of the substrate B, the brush portions 221 and 222 are inclined substantially perpendicularly to the main surface of the substrate B or in the opposite direction. It is also possible to arrange in a posture other than the above-mentioned tilted posture, such as a tilted posture.

  Moreover, in the said embodiment, although the case where the brush parts 221 and 222 were applied to the brush cleaning chamber 2 was demonstrated as an example, application of this brush part 221 and 222 is not limited to the brush cleaning chamber 2. The present invention can also be applied to a case where a process is performed with a brush in a processing chamber that performs other processes such as a peeling process and a developing process.

  In the above-described embodiment, the configuration in which the treatment liquid is supplied to the brush portions 221 and 222 by the treatment liquid supply nozzles 231 and 232 in the brush cleaning chamber 2 is shown. You may provide the mechanism supplied toward the board | substrate B from the base of the brush parts 221,222.

  In the above embodiment, the brush cleaning chamber 2 has been described as being connected to the processing chamber for the previous process. However, the brush cleaning chamber 2 to which the brush portions 221 and 222 are applied is limited to the above. And can be widely applied. For example, it may be applied to a substrate cleaning mechanism or the like that is disposed as a single cleaning device and that cleans a substrate that has been processed by another single device for pre-process (such as an etching device).

  In the above-described embodiment, the brush portions 221 and 222 are swung in a predetermined direction by the swing mechanism 8. However, the present invention can be configured without providing the swing mechanism 8. .

It is a figure which shows the outline of the substrate cleaning apparatus with which the substrate processing apparatus which concerns on one Embodiment of this invention is equipped. It is a block diagram which shows simply the brush part with which the chemical | medical solution process chamber of a board | substrate cleaning apparatus is equipped, and its drive mechanism. It is a top view which shows the outline of the rocking | fluctuation mechanism which reciprocates a brush attachment base. It is a sectional side view of a brush part. It is a side view which shows arrangement | positioning of the brush part with respect to a board | substrate, and a process liquid supply nozzle. It is a side view which shows arrangement | positioning of the brush part and process liquid supply nozzle with respect to a board | substrate, Comprising: The state without a board | substrate is shown. It is a side view which shows the state by which multiple brush parts and process liquid supply nozzles are each arrange | positioned. It is a sectional side view which shows other embodiment of a brush part. It is a side view which shows arrangement | positioning of the brush part and process liquid supply nozzle which concern on other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Chemical solution processing chamber 3 Rinse chamber 4 Air knife chamber 8 Oscillating mechanism 9 Processing liquid supply part 10 Substrate cleaning apparatus 21, 31 Conveyance roller 32, 33 Rinse liquid supply nozzle 50 Brush hair bundle 50H Tip 51 Brush base 52 Winding Attached shafts 221 and 222 Brush portions 231 and 232 Processing liquid supply nozzle B Substrate

Claims (10)

A support means for supporting the substrate;
A brush having a base and a hair bundle composed of a plurality of hairs extending from the base;
The tip portion of the bristles of the brush supported on the main surface of the substrate supported by the support means is bent in one direction along the main surface of the substrate from the direction in which the bristles extend. A substrate processing apparatus comprising: sliding contact means for slidingly contacting the main surface of the substrate. The brush has a rod shape extending in the first direction,
Transporting means for transporting the substrate relative to the brush in a second direction intersecting the first direction;
With respect to the main surface of the substrate that is conveyed relative to the brush along the second direction by the conveying means, the sliding contact means moves the tip of the bristle bundle of the brush relative to the substrate. The substrate processing apparatus according to claim 1, wherein the brush is slidably contacted with the main surface of the substrate while being reciprocated along the first direction as a state bent toward the downstream side in the transport direction.   The sliding contact means slides the brush against the main surface of the substrate while tilting and supporting the brush so that the tip of the bristle bundle of the brush is directed downstream in the relative transport direction of the substrate. The substrate processing apparatus according to claim 2.   The substrate processing apparatus according to claim 2, wherein the plurality of brushes are arranged in parallel along the second direction.   The substrate processing apparatus of Claim 3 or Claim 4 with which the said some brush is each arrange | positioned at the both main surface sides of the said board | substrate supported by the said support means.   The plurality of brushes arranged opposite to each other when the plurality of brushes are arranged opposite to each other on both main surface sides of the substrate supported by the support means, and the substrate is not supported by the support means. The brushes are arranged so that the tips of the brushes come into contact with each other, and when the substrate is not supported by the support means, the tips of the brushes arranged to face each other are slid against each other. The substrate processing apparatus of Claim 5 made to contact.   The plane formed by the tip of the bristle bundle of the brush is an inclined surface that approaches the main surface of the substrate supported by the support means in one direction in which the bristle bundle is to be bent. Item 7. The substrate processing apparatus according to Item 6.   The processing liquid supply means for supplying a processing liquid toward the tip of the bristle bundle of the brush which is in a state of being bent in sliding contact with the main surface of the substrate. The substrate processing apparatus as described.   In a state in which the tip of the hair bundle consisting of a large number of hairs extending from the base of the brush is bent in one direction along the main surface of the substrate, the tip is brought into sliding contact with the main surface of the substrate. A substrate processing method for processing.   The substrate processing method according to claim 9, wherein the processing liquid is supplied toward a tip end portion of the bristle bundle of the brush that is in a state of being bent in sliding contact with the main surface of the substrate.

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