JP2006021411A - Card with writing layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a card with a writing layer which is free from wear and deterioration even in case the card is carried for a long time and ensures smooth writing effect and excellent suitability for sealing. <P>SOLUTION: This card with a writing layer has the writing layer 61 at least over the entire surface of one side and 5 to 60% coating part of a water-repellent resin are formed on the writing layer 61. Further, the coating part is represented by a desired printing pattern and is located at the card edge part. The water-repellent resin contains a lubricant. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a card with a writing layer, and more particularly to a card with a writing layer that does not wear and deteriorate even when carried over a long period of time and that has excellent writing properties and proper stamping.

  In recent years, various cards have been developed as cards on which information recording units such as a magnetically readable magnetic recording unit, a photosensitive recording unit, a thermal recording unit, a pressure sensitive recording unit, and an electronic information recording unit are formed. It is used as a credit card, cash card, prepaid card, debit card and the like. In various cards, as disclosed in JP-A-2003-341238, a water-repellent resin-coated portion is scattered on the recording layer, and a heat-sensitive recording layer is provided on the recording layer, thereby providing water resistance, imprinting, and the like. There is something that aims at an appropriate improvement.

In addition, there are also applications in which the back side is directly written with a writing instrument such as a water-based pen, a ballpoint pen, or a pencil, or a stamp or vermilion is required. Some of such writable card surfaces are provided with a writing layer comprising a binder resin and filler particles on a support.
JP 2003-341238 A (pages 1 to 5)

  Such a card with a writing layer is required to have scratch resistance that can withstand the act of repeatedly putting the card in and out of the wallet in addition to writing with various writing tools. If there is no such scratch resistance, the writing layer will be worn away and the plastic film will be exposed, the writing itself will not be possible, the writing information will not be readable, and the appearance will be impaired. is there.

  Therefore, the writing layer is usually given a certain hardness by increasing the ratio of the binder resin to the filler particles or by curing the resin. However, when the hardness of the writing layer is increased by such means, there is a problem that although the scratch resistance is increased, the writing property and the stamping ability are deteriorated.

  Accordingly, an object of the present invention is to provide a card with a writing layer that does not cause wear deterioration of the writing layer even if it is carried for a long period of time and that has excellent writing properties and stamping suitability.

  In order to solve the above-described problems and achieve the object, the present invention is configured as follows.

The invention according to claim 1 is a card with a writing layer having a writing layer on at least one entire surface,
It is a card with a writing layer characterized by the application part of the water-repellent resin on the writing layer being 5 to 60%.

  The invention according to claim 2 is the card with a writing layer according to claim 1, wherein the application portion of the water-repellent resin is a desired print pattern.

  The invention according to claim 3 is the card with a writing layer according to claim 1, wherein the application portion of the water repellent resin is a card edge.

  The invention according to claim 4 is the card with a writing layer according to any one of claims 1 to 3, wherein the water-repellent resin contains a slip agent.

  With the above configuration, the present invention has the following effects.

  According to the first aspect of the present invention, the application portion of the water-repellent resin on the writing layer is 5 to 60%, and if the application portion is less than the specified value, there is a problem in wearability. In the case where the specified range is satisfied, the writing layer surface is excellent in wearability while maintaining excellent stamping suitability.

  According to the second aspect of the present invention, the application portion of the water-repellent resin is a desired print pattern, and may be a ruled line or frame line for writing, written characters, a background pattern or a fine pattern over the entire surface, for example.

  According to the third aspect of the present invention, the application portion of the water-repellent resin is the card edge portion, and the card peripheral portion is particularly easily worn by the action of repeatedly putting the card with the writing layer in and out of the wallet or the like. Excellent wear by applying a water-repellent resin to the edge.

  According to invention of Claim 4, it is excellent in abrasion property because water-repellent resin contains a slip agent.

  Hereinafter, although embodiment of the card | curd with a writing layer of this invention is described, this invention is not limited to this embodiment. The embodiment of the present invention shows the most preferable mode of the present invention, and the present invention is not limited to this.

  1 is an exploded perspective view of the IC card, FIG. 2 is a cross-sectional view of the IC card, FIG. 3 is a front view of the IC card, and FIG. 4 is a back view of the IC card.

  The IC card 1 of this embodiment is a card with a writing layer, and the thickness is regulated to 0.76 mm according to the ISO standard. The IC card 1 includes first and second sheet materials 2 and 3 which are two sheet materials, and adhesives 4 and 5 interposed between the first and second sheet materials 2 and 3. .

  An image receiving layer 60 is provided on the surface of the first sheet material 2 on the side not including the adhesive 4, and a writing layer 61 is provided on the surface of the second sheet material 3 on the side not including the adhesive 5. Is formed.

  As an example of the image receiving layer 60, a material composed of a material that traps and fixes a dye when sublimation dye ink is heated and thermally diffused by a TPH (thermal head) is used. Personal identification information 62 is provided. For example, in the case of an employee certification card, the personal identification information 62 is “name” characters, “issue date” characters, “face photo” image information, and the like. The image receiving layer 60 is protected by a transparent protective layer 63.

  The writing layer 61 has a water-repellent resin coating portion of 5 to 60%, preferably 40 to 70%. In the embodiment of FIG. 4A, the application portion of the water repellent resin is the desired print pattern 70. In the embodiment of FIG. 4A, the application portion of the water repellent resin is the card edge 71. The card edge 71 has a width a of 3.0 mm and a corner b of 3.18 mm.

  An IC module 9 is enclosed in the adhesives 4 and 5, and the IC module 9 includes an antenna 7 and an IC chip 6. The IC module 9 has a single wafer shape supported by the module support 8.

  The IC module of the present invention includes an IC chip that electrically stores information on the user of the IC card and a coiled antenna connected to the IC chip. The IC chip is a memory alone or in addition to a microcomputer, and may include a capacitor in some cases. The IC module has an antenna coil, but when it has an antenna pattern, any method such as conductive paste printing, copper foil etching, or winding welding may be used. The IC chip and antenna pattern can be joined using conductive adhesives such as silver paste, copper paste, and carbon paste (EN-4000 series from Hitachi Chemical, XAP series from Toshiba Chemical) and anisotropic conductive films (Hitachi Chemical). There are known methods using industrial anisol, etc.), or soldering and ACF joining, but any method may be used. It is also preferable to have a reinforcing plate in the vicinity of the IC chip in order to improve the point pressure strength of the IC chip.

  Further, the IC module has a single-wafer shape supported by a module support, and the module support is not particularly limited, but polyethylene terephthalate (PET), polyethylene naphthalate (PEN), PET-G (at least ethylene glycol, Modified polyester resin obtained by polymerizing three components of terephthalic acid and 1,4-cyclohexanedimethanol), polybutylene terephthalate (PBT), polycarbonate (PC) polyimide (PI) acrylonitrile-butadiene-styrene (ABS), polyvinyl chloride (PVC) Etc. are used.

  The thickness of the module support is preferably 10 to 100 μm, more preferably 20 to 60 μm. Furthermore, the total thickness of the IC module is preferably 100 to 500 μm, more preferably 150 to 450 μm.

[adhesive]
The adhesive is not particularly limited, but the adhesive of the present invention is preferably a reactive hot melt adhesive. A reactive hot-melt adhesive has a solid state at room temperature, and is melted by heating and then subjected to an adhesive process, and then the adhesive itself is cured.

  In the present invention, the IC card base is easily warped, or the base material undergoes thermal shrinkage or the like due to bonding at a high temperature, so that the size and the positional accuracy at the time of bonding are deteriorated, so that the bonding is performed through an adhesive. In some cases, the bonding is preferably performed at 80 ° C. or lower, more preferably 10 to 80 ° C., and still more preferably 20 to 80 ° C. The reactive hot melt adhesive is excellent in such low-temperature adhesive processing. As reactive hot melt adhesives, moisture curable materials are disclosed in JP 2000-036026, JP 2000-21855, JP 2000-21278, and JP 2002-175510. JP-A-10-316959, JP-A-11-5964 and the like are disclosed as photocurable adhesives. As an example of the reactive moisture-curing adhesive, there is one in which an isocyanate group-containing urethane polymer is a main component at a molecular end, and this isocyanate group reacts with moisture to form a crosslinked structure.

  Examples of reactive adhesives that can be used in the present invention include TE030 and TE100 manufactured by Sumitomo 3M Limited, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bond Master 170 series manufactured by Kanebouenu SSC, Macroplast QR3460 manufactured by Henkel, Sdyne 9631 manufactured by Sekisui Chemical Co., Ltd. Is fisted. Moreover, it is preferable to use a moisture curable adhesive having a free MDI content of 1.0% or less in view of safety of the material.

  Here, an example of a method for producing an IC card using an adhesive is given. In producing the IC card, first, an adhesive is applied to the front and back sheets with an applicator to a predetermined thickness. As a coating method, a normal method such as a roller method, a T-die method, or a die method is used. In the case of coating in the form of stripes according to the present invention, there is a method of intermittently providing T-die slits with openings, but it is not limited thereto. In addition, as a method for making the adhesive surface of the present invention uneven, there is a method in which the adhesive surface coated by the above method is pressurized with an embossing roll. The IC module is mounted between the upper and lower sheets coated with the adhesive. The adhesive applied before mounting may be preheated with a heater or the like. Then, the IC module mounted between the upper and lower sheets is pressed for a predetermined time with a press heated to the bonding temperature of the adhesive, or rolled while conveying the sheet in a constant temperature layer at a predetermined temperature instead of rolling with the press. You may roll in. Moreover, you may vacuum-press in order to prevent a bubble from entering at the time of bonding. After bonding with a press or the like, it is punched into a predetermined shape and cut into a card shape to form a card. When a reactive adhesive is used as the adhesive, it is cut into a card shape after curing for a predetermined time.

[Sheet material for IC card substrate]
Examples of the sheet member used for the first and second sheet materials include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, and polyfluorine. Polyfluorinated ethylene resins such as vinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6 and nylon 66, polyvinyl chloride, vinyl chloride / vinyl acetate Polymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable Biodegradable resins such as polyvinyl alcohol, biodegradable cellulose acetate, biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, polyethyl methacrylate, ethyl polyacrylate, poly Acrylic resin such as butyl acrylate, synthetic resin sheet such as polystyrene, polycarbonate, polyarylate, polyimide, or paper such as fine paper, thin paper, glassine paper, sulfuric acid paper, single layer such as metal foil, or these two layers The above laminated body is mentioned. The thickness of the support of the present invention is 30 to 300 μm, preferably 50 to 200 μm.

  In the present invention, in addition to performing the adhesive processing at low temperature from the viewpoint of shrinkage and warpage of the support, the sheet member has a thermal shrinkage rate of not more than 1.2% in the longitudinal (MD) direction at 150 ° C. for 30 minutes. (TD) is preferably 0.5% or less.

[Writing layer]
The writing layer of the present invention mainly comprises a binder resin and filler particles. Examples of the binder resin include vinyl thermoplastic resins such as acrylic resin, vinyl chloride resin, and vinyl acetate resin, formaldehyde thermosetting resins such as melamine resin and phenol resin, urethane thermosetting resins, and polyester resins. . Filler particles include silica, clay, talc, calcium carbonate, calcium sulfate, barium sulfate, titanium oxide, synthetic pigments, alumina, smectite, and other inorganic pigments, as well as styrene resins, urethane resins, benzoguanamine resins, silicone resins, and acrylic resins. Organic pigments such as resin beads consisting of these, or hollow resin beads made of these as raw materials, can be used, and these can be used alone or in admixture of two or more. These filler particles usually have an average particle size of 0.01 to 20 μm. The added amount of the filler particles is 10 to 150 parts by weight, preferably 40 to 100 parts by weight with respect to 100 parts by weight of the binder resin.

  The writing layer is provided on the surface of the sheet substrate constituting the card, but an adhesive layer may be provided between the writing layer and the sheet substrate, and a protective layer may be provided on the writing layer.

  The water-repellent resin used in the present invention is not particularly limited, and examples thereof include a fluorine resin, a silicone resin, and an ultraviolet curable resin. The UV curable resin layer is described in detail in published books such as “Light / Radiation Curing Technology” published by Taiseisha Co., Ltd., or magazines. In short, photopolymerizable monomers and prepolymers ( (Oligomer) and a photopolymerization monomer and a prepolymer (oligomer) are copolymerized by irradiating ultraviolet rays onto a coating layer made of an ultraviolet curable resin composition containing a photopolymerization initiator as an essential component. . The monomer and prepolymer (oligomer) in the ultraviolet curable resin composition are compatible and copolymerizable. Examples of the prepolymer in the ultraviolet curable resin composition include unsaturated polyester, epoxy, acrylic, various polyesters, and examples of the monomer include various ethylene derivatives having an ethylenically unsaturated bond.

  The water repellent resin of this invention preferably contains a slip agent. There are no particular limitations on the slip agent, but examples include silicone compounds, higher aliphatic carboxylic acids and derivatives or salts thereof, higher alcohols and derivatives thereof, polyethylene wax, paraffin wax, fluorine-based polymers, fluorine compounds, or montanic acid esters. And natural waxes such as carnauba wax and beeswax.

In this invention, the application | coating part of the water repellent resin on a writing layer is 5 to 60%, Preferably, it is 10 to 50%. As coating methods, various known methods such as curtain coating, reverse roll coating, fountain air doctor coating, slide hopper coating, extrusion coating, dip coating, blade coating, air knife coating, squeeze coating, impregnation coating, transfer, etc. Roll coating, gravure coating, kiss coating, cast coating, spray coating, and the like can be used, but printing is preferred in the present invention. As a printing method, a conventional printing method such as letterpress printing or offset printing can be used. Moreover, it is preferable that an application part is a desired printing pattern on a writing layer. Although there is no restriction | limiting in a printing pattern, In order to ensure the damage resistance of the whole writing layer surface, writing property, and a stamping proper, it is preferable that the printing part is scattered over the entire writing layer. For example, it may be a ruled line or frame line for writing, written characters, a background pattern or a fine pattern over the entire surface. Further, since the card is easily worn around the card by the action of repeatedly putting it in and out of a wallet or the like, a water repellent resin may be applied to the edge of the card. In this case, a transparent water-repellent resin as well as printing may be applied as a wear-resistant overcoat. The amount of resin applied may be appropriately determined depending on the thickness and area of the resin layer, but is generally preferably 0.1 to 3.0 g / m ² . The card form of the present invention is not particularly limited as long as the configuration of the present invention is satisfied, and may be an IC card incorporating an IC module. In the case of an IC card, for example, as disclosed in JP-A-2002-74298, another sheet material facing the sheet material provided with the writing layer of the present invention is bonded via an adhesive, and between the adhesives Enclose the IC module.

[IC card manufacturing method]
As an IC card manufacturing method of the present invention, a heat bonding method, an adhesive bonding method, and an injection molding method are known, but they may be bonded by any method. In addition, two opposing first and second sheet materials may be subjected to format printing or information recording either before or after bonding, offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing. It can be formed by any method such as an inkjet method, a sublimation transfer method, an electrophotographic method, or a heat melting method.

  The manufacturing method of the IC card of this invention is a method of bonding and coating as in JP 2000-036026, JP 2000-21855, JP 2000-21278, JP 10-316959, JP 11-5964, and the like. It is disclosed. Any bonding method, coating method, and the like can be used, and the present invention is not particularly limited.

  The laminated single-wafer sheet or continuous coating lamellar roll formed as a continuous sheet by the adhesive bonding method or the resin injection method is allowed to leave the authentication identification image and bibliographic items after being left within the time according to the predetermined curing time of the adhesive. Recording may be performed, and thereafter, a predetermined card size may be formed. As a method of forming a predetermined card size, a punching method, a cutting method, or the like is mainly selected, and an IC card substrate can be created.

[Example]
EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, the aspect of this invention is not limited to this. The evaluation in the examples was measured by the following method. The results of evaluation are shown in Tables 1 and 2.

<Sealability>
The surface of the card writing layer was stamped with a rubber stamp using a water-based stamp ink (Solhatha Kogyo Co., Ltd. sol stamp stand, black), and the surface was rubbed with a finger one minute later.

○: No smear around the stamp due to stamp ink △: Stain due to the stamp ink occurs around the stamp, but the contents of the stamp can be read ×: The area around the stamp is smudged with the stamp ink, and the stamp content cannot be read <Card Abrasion of writing layer surface>
The card writing layer surface was stamped with a rubber stamp using water-based stamp ink (Shirhata Kogyo Co., Ltd. sol stamp stand, black) and left in an environment of 23 ° C. and 55% RH for 24 hours, and then Shinto Kagaku Co., Ltd. Using a HEIDON SURFACE PROPERTY TESTER tribogear TYPE-14FW manufactured by HEIDON SURFACE PROPERTY TESTER, a 1 cm ² cotton cloth was in contact with the stamped surface, a load of 500 g / cm ² was applied, and the surface was rubbed back and forth 1000 times at a speed of 200 mm / s, and the degree of surface rubbing was observed.

○: There is no wear on the seal. △: The wear of the seal or contamination due to wear occurs, but the contents of the stamp can be read. ×: The seal is worn and the content of the stamp cannot be read. <Wearability of the card edge>
The two cards were overlapped so that the writing layer surface was on the outside, and the card was put in and out of the PLUS card case hard type standard B8 product number PC-218 1000 times, and the degree of rubbing on the surface was observed.

○: No wear △: Wear occurs, but the stamp contents can be read ×: The stamp contents are worn and the stamp contents cannot be read [Example 1]
<Creation of IC card>
Lumirror E20 188 μm manufactured by Toray Industries, Inc. was used as a support for the front and back surfaces of the IC card.
(Create a sheet)
A first image-receiving layer-forming coating solution, a second image-receiving layer-forming coating solution, and a third image-receiving-layer-forming coating solution having the following composition were applied and dried in this order on the support, and each thickness was 0.2 μm. , 2.5 μm and 0.5 μm were laminated to form an image receiving layer.
First coating layer forming coating solution Polyvinyl butyral resin Sekisui Chemical Co., Ltd. Eslex BL-1 9 parts Isocyanate Nippon Polyurethane Industry Co., Ltd. Coronate HX 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts Second image receiving Layer-forming coating solution Polyvinyl butyral resin Sekisui Chemical Co., Ltd. Eslex BL-1 6 parts Metal ion-containing compound Shiono Koryo Co., Ltd. MS-60 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts Third image receiving layer Coating liquid for forming Polyethylene wax Hitech E1000 manufactured by Toho Chemical Industries Co., Ltd. 2 parts Urethane-modified ethylene acrylic acid copolymer Hitech S6254 manufactured by Toho Chemical Industries Co., Ltd. Methylcellulose SM15 manufactured by Shin-Etsu Chemical Co., Ltd. 0.1 parts 90 copies of water (format printing)
The logo and OP varnish were sequentially printed by the resin letterpress printing method.
(Create back sheet)
The first writing layer forming coating solution, the second writing layer forming coating solution and the third writing layer forming coating solution having the following composition are applied and dried in this order on the support, and the thicknesses thereof are 5 μm and 15 μm, respectively. The writing layer was formed by laminating to a thickness of 0.5 μm.
・ Coating liquid for forming the first writing layer Polyester resin Byron 200 manufactured by Toyobo Co., Ltd. Isocyanate Coronate HX manufactured by Nippon Polyurethane Industry Co., Ltd. 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts Coating for forming the second writing layer Liquid Polyester Resin Vironal MD1200 manufactured by Toyobo Co., Ltd. 4 parts Silica 5 parts Water 90 parts / Third writing layer forming coating liquid Polyamide resin Sanmide 55 from Sanwa Chemical Industry Co., Ltd. 5 parts Methanol 95 parts IC in FIG. A card manufacturing apparatus was used, and a back sheet and a top sheet were used as the first sheet material and the second sheet material. Next, an IC card manufacturing apparatus will be described.

  In this IC card manufacturing apparatus, a first sheet material having a long sheet shape and a thickness of 188 μm is provided in the first sheet member supply unit A, and a second sheet material 3 having a thickness of 188 μm and a second sheet material is second. Deployed in the sheet member supply unit B. The second sheet member supply unit B conveys the second sheet material 3 by sand grip conveyance and conveys it to the second sheet conveyance member C. The second sheet conveying member C sends the second sheet material 3 to the pressure heating unit D.

  When the second sheet conveying member C is conveyed, an adhesive is supplied from the adhesive supply unit E to the second sheet material 3, and the IC module 9 shown in FIG. 6 is connected to the second sheet material 3 from the IC fixing member supply unit F. To place.

An adhesive is supplied to the first sheet material 2 from the adhesive supply unit G, and the first sheet material 1 is sent to the pressure heating unit D. In the pressure heating part D, the IC card material is sandwiched between the first sheet material 2 and the second sheet material 3 by heating or a pressure roll (pressure 3 kg / cm ² ), and the IC card base A material master is created.

  Each of the first sheet material 2 and the second sheet material 3 was coated with sdyne 9611 manufactured by Sekisui Chemical Co., Ltd., which is a reactive hot melt adhesive, to a thickness of 162 μm. An IC module was placed between the sheet materials and laminated at 65 ° C. for 1 minute. The thickness of the base material for IC card thus prepared was 760 μm. After the preparation, it was stored for 10 days in an environment of 25 ° C. and 55% RH, and punched by a card-shaped punching die apparatus having a size of 55 mm × 85 mm.

(Back side printing)
Printing was performed by the offset printing method using the following printing ink A or B so that the area of the format printing (ruled lines, issuer name, issuer telephone number) was as shown in Table 1. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. In addition, the printing area calculated | required the area which printing ink has adhered from the microscope observation photograph.
・ Ink A
Carbon black 30 parts Urethane acrylate oligomer 40 parts Aliphatic polyester acrylate oligomer 15 parts DyroCure 1173
(Ciba Specialty Chemicals Co., Ltd.) 5 parts Trimethylolpropane acrylate 10 parts Ink B
Carbon black 30 parts Urethane acrylate oligomer 35 parts Aliphatic polyester acrylate oligomer 15 parts DyroCure 1173
(Ciba Specialty Chemicals Co., Ltd.) 5 parts Trimethylolpropane acrylate 10 parts Polyethylene wax 5 parts (Personal information description method and surface protection method on personal authentication card)
A personal authentication card in which a face image, attribute information, and format printing were provided on the back printed IC card was prepared as follows.
(Creation of ink sheet for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusing processing on the back side is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid each having a thickness of 1 μm. Thus, ink sheets of three colors of yellow, magenta and cyan were obtained.
<Coating liquid for yellow ink layer formation>
Yellow dye (Compound Y-1) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Coating liquid for forming a magenta ink layer>
Magenta dye (Compound M-1) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.]
Polymethylmethacrylate modified polystyrene 2 parts [Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating solution>
Cyan dye (Compound C-1) 1.5 parts Cyan dye (Compound C-2) 1.5 parts Polyvinyl acetal 5.6 parts [manufactured by Denki Kagaku Kogyo Co., Ltd .: Denka Butyral KY-24]
Polymethylmethacrylate-modified polystyrene 1 part [manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200]
Urethane-modified silicone oil 0.5 part [Dainomer SP-2105, manufactured by Dainichi Seika Kogyo Co., Ltd.]
Methyl ethyl ketone 70 parts Toluene 20 parts (Preparation of ink sheet for melt type thermal transfer recording)
An ink sheet was obtained by applying and drying an ink layer forming coating solution having the following composition to a polyethylene terephthalate sheet having a thickness of 6 μm that had been processed to prevent fusing on the back surface to a thickness of 2 μm.
<Ink layer forming coating solution>
Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemicals: EV40Y]
Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries, Ltd .: Tamanol 521] 5 parts Methyl ethyl ketone 90 parts (formation of face image)
The image receiving layer and the ink side of the ink sheet for sublimation type thermal transfer recording are overlapped and the output from the ink sheet side is 0.23 W / dot, the pulse width is 0.3 to 4.5 ms, the dot density is 16 dots / A person image having gradation in the image was formed on the image receiving layer by heating under the condition of mm. In this image, the dye and the nickel of the image receiving layer form a complex.
(Formation of character information)
The OP varnish and the ink side of the melt-type thermal transfer recording ink sheet are overlapped and the thermal sheet is used from the ink sheet side to output 0.5 W / dot, pulse width 1.0 ms, and dot density 16 dots / mm. The character information was formed on the OP varnish by heating with.
[Surface protection method]
(Method for forming surface protective layer)
<Creation of actinic ray curable transfer foil 1>
The following composition was laminated | stacked on the mold release layer of the 25-micrometer-thick polyethylene terephthalate film-2 which provided the mold release layer of the 0.1 micrometer fluororesin layer, and the actinic-light curable transfer foil 1 was produced.
(Actinic ray curable compound)
Shin-Nakamura Chemical A-9300 / Shin-Nakamura Chemical
EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184, manufactured by Nippon Ciba-Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 parts Other additives Dainippon Ink Surfactant F-179 0.25 part <intermediate layer Forming coating solution> Film thickness 1.0μm
Polyvinyl butyral resin [manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1] 3.5 parts Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent
Polyisocyanate [Coronate HX made by Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts After curing, the curing agent was cured at 50 ° C. for 24 hours.
<Adhesive layer forming coating solution> Film thickness 0.5 μm
Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic acid ester copolymer [manufactured by Nippon Pure Chemicals Co., Ltd .: Jurimer AT510] 2 parts Water 45 parts Ethanol 45 parts A pressure of 150 kg / cm ² using a heat roller having a diameter of 5 cm and a rubber hardness of 85, heated to a surface temperature of 200 ° C. using the actinic ray curable transfer foil 1 having the above-described configuration on the image receptor on which images and characters are recorded. Then, transfer was performed by heating for 1.2 seconds.
Table 1

As is apparent from Table 1, when the application portion of the water-repellent resin on the surface of the writing layer satisfies the scope of the present invention, the wearability of the surface of the writing layer is excellent while maintaining excellent stamping suitability.
[Example 2]
The back side printing of Example 1 is changed to the following printing ink C, and a discontinuous halftone dot shape is printed on the entire writing layer surface so as to be 10% of the coated portion. Further, in the region of the card edge in FIG. Printing was performed so that the application area of the halftone dots was as shown in Table 2. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

The printing area was determined from the area where the printing ink was adhered from a microscopic observation photograph. Further, the appropriateness of stamping in Table 2 was tested using the area of the card edge in FIG. 4B.
・ Ink C
Urethane acrylate oligomer 40 parts Aliphatic polyester acrylate oligomer 15 parts DyroCure 1173 (Ciba Specialty Chemicals Co., Ltd.) 5 parts Trimethylolpropane acrylate 10 parts Table 2

  As is apparent from Table 2, when the water-repellent resin is applied to the edge of the card, the writing layer surface is not worn away and worn away even when the card is repeatedly put in and out of the wallet or the like.

  A card with a writing layer has a writing layer on at least one entire surface, the application portion of the water-repellent resin on the writing layer is 5 to 60%, and the writing accuracy is maintained while satisfying the prescribed range, Excellent wear on the layer surface.

It is a disassembled perspective view of an IC card. It is sectional drawing of an IC card. It is a surface view of an IC card. It is a back view of an IC card. It is an enlarged view of an IC card manufacturing apparatus. It is a figure which shows an IC module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card 2 1st sheet material 3 2nd sheet material 4,5 Adhesive 6 IC chip 7 Antenna 8 Module support body 9 IC module 60 Image receiving layer 61 Writing layer 62 Personal identification information

Claims (4)

It is a card with a writing layer having a writing layer on at least one side entire surface,
A card with a writing layer, wherein a coating portion of the water-repellent resin on the writing layer is 5 to 60%. The card with a writing layer according to claim 1, wherein the application portion of the water-repellent resin is a desired printing pattern. The card with a writing layer according to claim 1, wherein the application portion of the water repellent resin is a card edge. The card with a writing layer according to any one of claims 1 to 3, wherein the water-repellent resin contains a slip agent.

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