JP2007066048A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card capable of solving connection defects due to expansion and maintaining smoothness on the surface of the card. <P>SOLUTION: In an IC card 1 constituted of arranging an IC chip 8 and an antenna body connected to one surface side of the IC chip 8 between sheet base materials 2, 3 opposed to each other through a gap adhesive 13; the antenna body is fixed on the IC chip 8 through a module adhesive 9 and includes an expansion member 12 having an expansion coefficient higher than that of the module adhesive 9 between at least the sheet base material 2 opposed to the opposite side of the connection surface of the IC chip 8 connected to the antenna body of the IC chip 8 and the IC chip 8. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an IC card, and more particularly to an IC card to which an IC chip is fixed using an adhesive.

  In recent years, in the fields of identification cards (ID cards) and credit cards, IC cards with built-in IC chips have begun to spread in place of magnetic cards on which data is recorded by the conventional magnetic recording method.

  In an IC card, data is read / written from / to an external device via an electrical contact provided on the surface or a loop antenna inside the card, and the storage capacity and security are greatly improved compared to a magnetic card. In particular, non-contact type IC cards with built-in antennas for exchanging information between the IC chip and the outside of the card that do not have electrical contacts outside the card are compared to contact type IC cards that have electrical contacts on the card surface. Therefore, it is being used for applications that require high confidentiality of data and prevention of forgery and alteration, such as ID cards.

As such an IC card, there is an IC card in which, for example, two opposing sheet base materials are bonded together via a resin such as an adhesive, and an IC module having an IC chip and an antenna is enclosed in the resin layer. At that time, in the IC module, the IC chip and the antenna are connected by using a mounting method such as wire bonding connection or flip chip connection (see Patent Document 1).
For example, in flip chip connection, an IC chip and an antenna are generally connected via a resin, and an ACF (anisotoropic conductive film) in which conductive particles dispersed in a resin are taped and bonded, ACP (anisotropic conductive paste), in which conductive particles are dispersed in a resin, pasted and attached, then cured, fixed and connected, ICP is connected to an antenna via bumps, and NCP (nonconductive) fixed with resin paste) etc. are known.

  However, in the case of flip-chip connection, although connection can be easily performed, the connection portion is easily detached. In particular, when the resin that fixes the IC chip to the antenna expands due to heat or moisture, the expansion coefficient of the IC chip and the resin is different, which causes breakage, cracks, etc., resulting in failure due to poor connection. . In addition, even if connection failure does not occur, unevenness occurs on the card surface due to expansion, causing image defects when recording face images and written information.

In contrast, in Patent Document 1, the IC chip and the antenna are electrically connected using bumps and silver paste, and the above-described resin (adhesive sealing resin) is heat-cured in order to fix the connection portion. After that, a protective sealing resin is injected around the connection portion between the bump and the antenna and cured, and the coefficient of thermal expansion of the protective sealing resin after curing is specified to be smaller than that of the adhesive sealing resin. By doing so, an attempt is made to prevent connection failure due to the aforementioned expansion.
JP 2000-236002 A

  However, if the thermal expansion coefficient after curing of the protective sealing resin is specified to be smaller than that of the adhesive sealing resin, the protective sealing resin is The sealing resin cannot withstand the force applied to the bump connection part when the adhesive sealing resin expands, causes breakage, cracks, etc., and cannot sufficiently cope with prevention of connection failure due to expansion It was. Further, the irregularities generated on the card surface remain unprevented, and image defects are generated during recording.

  Therefore, the present invention has been made to solve the above-described problems, and aims to eliminate connection failure due to expansion and maintain smoothness on the card surface.

In order to solve the above problem, the invention according to claim 1 is:
An IC card in which an IC chip and an antenna body connected to the IC chip are disposed between sheet substrates facing each other through a gap adhesive,
The antenna body is fixed to the IC chip via a module adhesive,
A sheet base material facing at least the surface of the IC chip opposite to the connection surface with the antenna body, and an expansion member having a higher expansion coefficient than the module adhesive is provided between the IC chip and the IC chip. To do.

  According to the first aspect of the present invention, even if the module adhesive that fixes the IC chip and the antenna body is expanded by heating or the like, the expansion member expands more than the adhesive and causes the IC chip to move toward the antenna body. It is possible to prevent breakage and cracks that occur due to different expansion coefficients between the IC module and the resin. Moreover, generation | occurrence | production of the unevenness | corrugation which arises on the sheet | seat base material surface corresponding to the connection surface of an IC chip and an antenna body can also be prevented through an expansion member among sheet base materials.

The invention according to claim 2 is the IC card according to claim 1,
The IC chip and the antenna body are connected via bumps,
The expansion member is arranged so as to correspond to at least the bump.

  According to the second aspect of the present invention, when the expansion member expands and presses the IC chip against the antenna body, the expansion member can be pressed around the bump as the connection portion. Can be reliably prevented from coming off the antenna.

The invention according to claim 3 is the IC card according to claim 1 or 2,
A plurality of the expansion members are provided.

  According to the invention described in claim 3, the expansion member can be provided according to the number of bumps, and when the IC chip is pressed against the antenna body, the connection portion can be surely pressed and expanded. At this time, it is possible to reliably prevent the IC chip from being detached from the antenna.

The invention according to claim 4 is the IC card according to any one of claims 1 to 3,
The expansion member is disposed between the IC chip and a sheet base material facing a connection surface of the IC chip with the antenna body.

  According to the fourth aspect of the present invention, the expansion member can press the IC chip from the sheet base material side facing the connection surface of the IC chip with the antenna body.

The invention according to claim 5 is the IC card according to any one of claims 1 to 4,
A thickness dimension of the expansion member is smaller than a thickness dimension of the sheet base material.

  According to the invention described in claim 5, even if the member existing between the sheet base materials expands and a force pressing the nearest sheet base material is generated, the sheet base material can resist the force. In addition, the force for pressing the IC chip against the antenna body works, and it is possible to prevent the surface of the sheet base material from being uneven.

The invention according to claim 6 is the IC card according to any one of claims 1 to 5,
A reinforcing member is provided between the expansion member and the IC chip.

  According to the sixth aspect of the present invention, the expansion member can press the reinforcing member against the antenna body together with the IC chip.

The invention according to claim 7 is the IC card according to any one of claims 1 to 6,
Among the opposing sheet base materials, the image receiving layer is provided on the surface of one sheet base material, and the writing layer is provided on the surface of the other sheet base material.

  According to invention of Claim 7, it can be set as the IC card provided with the image receiving layer and the writing layer on the card | curd surface.

The invention according to claim 8 is the IC card according to any one of claims 1 to 7,
The adhesive is a reactive adhesive.

  According to the eighth aspect of the present invention, as the adhesive, for example, a reactive adhesive that exhibits adhesiveness when a reaction is initiated by a specific trigger that crosslinks the material by light or heat can be used. .

  According to the first aspect of the present invention, it is possible to eliminate connection failure due to expansion and maintain smoothness on the card surface.

  According to the second aspect of the present invention, it is possible to reliably prevent the IC chip from being detached from the antenna at the time of expansion and causing poor connection.

  According to the third aspect of the present invention, it is possible to reliably prevent the IC chip from being detached from the antenna at the time of expansion and causing poor connection.

  According to invention of Claim 4, the unevenness | corrugation which arises on the surface of the opposing sheet | seat base material can be prevented by pressing from the both sides of the connection surface of an IC chip and an antenna body.

  According to the fifth aspect of the present invention, the smoothness on the card surface can be maintained.

  According to the sixth aspect of the present invention, particularly in an IC card provided with a reinforcing member, it is possible to eliminate connection failure due to expansion and maintain smoothness on the card surface.

  According to the seventh aspect of the invention, in such an IC card, the smoothness on the card surface can be maintained even if it is expanded, so that the fineness of images such as photographs and characters described on the card surface is maintained. Can be improved.

  According to the invention described in claim 8, the handleability can be improved.

Hereinafter, embodiments of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the IC card 1 includes an IC module 4 between opposing sheet base materials 2 and 3.

  The sheet bases 2 and 3 are rigid members, for example, polyester resins such as polyethylene terephthalate, polybutylene terephthalate, polyethylene terephthalate / isophthalate copolymer, polyolefin resins such as polyethylene, polypropylene, and polymethylpentene, and polyfluorinated resins. Polyvinylethylene resins such as vinyl, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-tetrafluoroethylene copolymer, polyamides such as nylon 6, nylon 6, 6, etc., polyvinyl chloride, vinyl chloride / vinyl acetate copolymer Polymer, ethylene / vinyl acetate copolymer, ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, biodegradable aliphatic polyester, biodegradable polycarbonate, biodegradable polylactic acid, biodegradable polyvinyl Al Biodegradable resins such as biodegradable cellulose acetate and biodegradable polycaprolactone, cellulose resins such as cellulose triacetate and cellophane, methyl polymethacrylate, ethyl polymethacrylate, butyl polyacrylate, etc. Examples include synthetic resin sheets such as acrylic resin, polystyrene, polycarbonate, polyarylate, and polyimide, or high-quality paper, thin paper, glassine paper, paper such as sulfuric paper, single layer such as metal foil, or laminates of these two or more layers. It is done. In the case where the sheet bases 2 and 3 are laminated bodies, they may be constructed by laminating single layer bodies having different layer thicknesses.

  Further, the thickness dimension of the sheet base materials 2 and 3 is preferably larger than the thickness dimension of the expansion member 12 described later, specifically, 30 to 300 μm is preferable, and in particular, 50 to 200 μm. Is preferred.

  In addition, these sheet base materials 2 and 3 are subjected to an easy-to-contact treatment by forming a layer of a coupling agent, latex, hydrophilic resin, antistatic resin or the like, or performing a corona treatment or a plasma treatment. You may give it. In addition, annealing treatment or the like may be performed to reduce thermal shrinkage.

  The sheet bases 2 and 3 are provided with an image receiving layer 20 and a writing layer 30. Here, the image receiving layer 20 is provided on the exposed surface of the sheet substrate 2 corresponding to the surface of the IC card 1 among the sheet substrates 2 and 3 facing each other, and the other sheet substrate 3 is exposed. A writing layer 30 is provided on the surface. That is, the sheet base material 3 corresponds to the back surface of the IC card 1. The image receiving layer 20 is preferably formed on the surface of the IC card, but is not necessarily limited thereto.

  The image receiving layer 20 is a layer that can receive an image. On the image receiving layer 20, an image such as a face photograph or a name can be formed by a recording method such as a thermal transfer method, an ink jet method, or an electrophotographic method. It is.

  Examples of the thermal transfer method applied to image formation include a generally known sublimation type thermal transfer method and melt type thermal transfer method. In addition, as the ink jet method, a generally known method can be used, and specifically, the methods described in JP 2000-44857 A and JP 9-71743 A are used. Is possible.

Further, the image receiving layer 20 is preferably made of a material that traps and fixes the dye when the dye is heated and thermally diffused. In order to impart such properties, the binder and various kinds of additives are used. In addition, the blending amount thereof is adjusted as appropriate.
As the binder for the image receiving layer, a binder that is generally known as an image forming material may be used. For example, polyvinyl chloride resin, vinyl chloride and other monomers (for example, isobutyl ether, vinyl propionate, etc.) Combined resin, polyester resin, poly (meth) acrylic acid ester, polyvinyl pyrrolidone, polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl alcohol, polycarbonate, cellulose triacetate, polystyrene, styrene and other monomers (eg acrylic acid ester, acrylonitrile) , Ethylene chloride, etc.), vinyl toluene acrylate resin, polyurethane resin, polyamide resin, urea resin, epoxy resin, phenoxy resin, polycaprolactone resin, polyacrylonitrile resin, and It includes modified products of the. Among them, preferable binders include polyvinyl chloride resins, copolymers of vinyl chloride and other monomers, polyester resins, polyvinyl acetal resins, polyvinyl butyral resins, copolymers of styrene and other monomers, An epoxy resin, a photocurable resin, a thermosetting resin, and the like. These binders may contain a metal ion compound, a chelate compound, a release agent material, etc. as described in JP-A-6-286350 and JP-A-5-64989. In addition, dyes and pigments as base color toning agents as needed, hardeners, cationic mordants, anti-fading agents, various anionic, cationic or nonionic surfactants, lubricants, preservatives to improve film strength Various known additives such as thickeners, antistatic agents and matting agents can also be contained.

  The image receiving layer 20 containing such components can be formed by a coating method, and a material containing the constituent components of the image receiving layer 20 described above is dispersed or dissolved in a solvent or water to apply an image receiving layer coating solution. Can be formed by applying the image receiving layer coating solution onto the sheet substrate 2 and then drying it. The thickness of the image receiving layer 20 is preferably 0.01 to 20 μm, and particularly preferably about 0.03 to 20 μm.

  On the other hand, the writing layer 30 is a layer that can be written, and can be formed of, for example, an inorganic fine powder or a porous material with a binder and various additives.

  As the porous material, for example, silica (precipitation or gel type), talc, kaolin, clay, alumina white, diatomaceous earth, titanium oxide, calcium carbonate, barium sulfate, etc. can be used, and the above-mentioned compounds etc. You may make it use 1 type from 2 or 2 types or more mixed. The writing layer 30 is not particularly limited as long as it contains the porous material described above. Moreover, as a particle size of a porous substance, the thing of 1-10 micrometers can be used, Preferably it is preferable that an average particle diameter is 1-8 micrometers.

  For example, shellac, rosin and derivatives thereof, nitrified cotton and cellulose derivatives, polyamide resin, polyacrylate resin, polyvinyl chloride resin, polyvinyl acetate resin, polystyrene resin, petroleum resin, cyclized rubber, chlorinated rubber, chlorinated Polypropylene, urethane resin, epoxy resin, polyester resin, acrylic resin, vinyl chloride, vinyl chloride-vinyl acetate copolymer, butyral resin, vinylidene chloride resin, water-soluble resin, and the like can be used. Further, a UV curable resin containing a prepolymer which is copolymerized and cured by ultraviolet rays may be used. Examples of copolymerizable compounds applicable to UV curable resins include polyol acrylates, polyester acrylates, epoxy acrylates, urethane acrylates, and alkyd acrylates. Particularly, polyester resins, polyacrylate resins, polyvinyl chloride resins, and polyvinyl acetate resins. Polyamide resins and polystyrene resins are preferably used, and one or two or more of the above compounds may be used. In addition, it is preferable that the weight ratio of the said porous substance with respect to these resin is 20 to 100 weight part with respect to 100 weight part of resin in solid content ratio. In addition, wax, surfactant, solvent, and water may be included as additives, and these substances are not particularly limited.

  Moreover, since the writing layer 30 has writing property, it is preferable to consist of at least 1 layer, and it is especially preferable that it is formed from 1 to 5 layers. The thickness is preferably 5 to 40 μm, and more preferably 5 to 30 μm.

  The surface roughness of the writing layer 30, that is, the arithmetic average roughness (Ra) of the writing layer 30 is preferably 2.0 μm or less, more preferably 0.2 to 2.0 μm, still more preferably. 0.3 to 1.8 μm. If the roughness of the surface of the writing layer 30 is 0.2 μm or less, the writing property deteriorates, and if it is 2.0 μm or more, the name of the writing layer 30 is manually or by sublimation heat transfer method, melt heat transfer method, ink jet method, etc. This is because, when an image is formed, such as the description, the ink is blurred and causes a defect in the image. In this case, when the surface protective layer is formed by further adhering a protective film made of a surface protective material to the writing layer 30, the adhesion between the writing layer and the surface protective layer is lowered.

  The sheet bases 2 and 3 can be provided with an information carrier layer (not shown). Specifically, the information carrier layer is a formatted printed matter formed on the surface opposite to the side on which the sheet base materials 2 and 3 are formed with respect to the image receiving layer 20 and the writing layer 30, respectively.

  The formatted printed matter is printed as a standard print pattern with a common part that can be printed in large quantities, and specifically represents a ruled line, a company name, a card name, notes, an issuer telephone number, and the like. In addition, the formatted printed material may be subjected to watermark printing, fine prints, etc. to prevent forgery by visual inspection. Further, as a forgery / alteration prevention layer, the printed material, hologram, barcode, mat pattern, fine pattern, ground pattern, uneven pattern Etc., visible light absorbing color material, ultraviolet absorbing material, infrared absorbing material, fluorescent whitening material, glass deposition layer, bead layer, optical change element layer, pearl ink layer, flake pigment layer, IC hiding layer, watermark It is also possible to apply a printing layer or the like.

  For the formation of formatted prints, it is generally described in “Platinum Printing Technology”, “New Printing Technology Overview”, “Offset Printing Technology”, “Plate Making / Printing Guidebook” published by Japan Printing Technology Association. It can be formed using any ink, and it can be formed using a photo-curable ink, an oil-soluble ink, a solvent-type ink, or the like with an ink such as carbon.

  Examples of the binder resin that can be used for forming the format print include, for example, actinic ray curable resin, polymethyl methacrylate acrylic resin, styrene resin such as polystyrene, polyvinyl chloride resin such as polyvinyl chloride, Vinylidene chloride resins such as vinylidene chloride, polyester resins such as polyethylene terephthalate, cellulose resins such as cellulose acetate, polyvinyl acetal resins such as polyvinyl butyral, epoxy resins, amide resins, urethane resins, melamine resins, Examples include alkyd resins, phenol resins, fluorine resins, silicone resins, polycarbonate, polyvinyl alcohol, casein, and gelatin. A preferable binder resin is to use an actinic ray curable resin. Furthermore, (a) 25 to 95 parts by weight of a binder component containing a monomer or oligomer having an unsaturated bond, and (b) a reaction initiator 1 It is particularly preferable to use an actinic ray curable resin containing ˜20 parts by weight from the viewpoint of card surface strength. In addition, when using actinic-light curable resin, it can harden | cure by irradiating light of 100mJ-500mJ using light sources, such as a mercury lamp, UV lamp, and xenon.

  In addition to the formatted printed matter, an authentication identification image and an attribute information image are generally formed on the information carrier layer. In the present invention, it is preferable that at least one of a formatted printed material, an authentication identification image, and an attribute information image is formed on the information carrier layer, and these information carriers are particularly formed on the image receiving layer 20. Is preferred.

  The authentication identification image is, for example, a photographic image such as a face photograph or a fingerprint, and is usually a full-color image having gradation. These are formed by, for example, a sublimation type thermal transfer recording system, a melt type thermal transfer recording system, an electrophotographic system, an ink jet system, or the like. In addition, the attribute information image is, for example, a bibliographic information image such as name, address, date of birth, qualification, etc., and is usually recorded as character information, and image formation by the melt-type thermal transfer recording method is generally used. The image may be formed by a method such as printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, an ink jet method, a sublimation transfer method, or a heat melting method. Here, the authentication identification image and the attribute information image are preferably formed by a sublimation thermal transfer recording method.

  The information carrier layer may be formed either before or after the step of bonding the two sheet base materials 2 and 3 together.

  Furthermore, the sheet bases 2 and 3 may be provided with an adhesive layer, a cushion layer, a surface protective layer, or the like as necessary.

The adhesive layer is for improving the adhesion between the sheet bases 2 and 3, and here, between the image receiving layer 20 and the sheet base 2 or between the writing layer 30 and the sheet base 3 It is possible to form between.
The cushion layer is for improving the printability, and is formed at least between the image receiving layer 20 and the sheet base 2 or between the writing layer 30 and the sheet base 3. As long as it is present, it may be either a single layer or a multilayer. Examples of the material include urethane resin, acrylic resin, ethylene resin, polypropylene resin, butadiene rubber, epoxy resin, polyolefin, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene. Block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-hydrogenated isoprene-styrene block copolymer, polybutadiene, described in JP-A-2002-222403 A photo-curable resin or the like can be used. Moreover, the thickness of a cushion layer is 1-50 micrometers normally, Preferably it is 3-30 micrometers.
The surface protective layer is for protecting the inside against external impacts and scratches, and is a layer formed on the outermost surface of the IC card 1. Here, it can form with respect to the exposed surface of the image receiving layer 20 and the writing layer 30, and can use a photocurable resin as the material. Further, the surface protective layer may be provided by applying a resin solution, or a transfer foil may be used. An optical change element such as a hologram may be provided on the transfer foil for the purpose of preventing falsification.

Next, the IC module 4 disposed between the sheet bases 2 and 3 will be described.
The IC module 4 includes an IC chip that electrically stores information on the user of the IC card 1 and a coiled antenna body connected to the IC chip.
Here, the IC module 4 includes a module substrate 5, and an antenna body is provided by disposing an antenna coil 6 on one surface of the module substrate 5 (here, the upper surface of the printed circuit board 5). Is configured. The IC coil 8 is disposed on the upper surface of the antenna coil 6 via bumps 7 formed at positions facing the upper surface of the antenna coil 6, thereby electrically connecting the antenna coil 6 and the IC chip 8. Connected.

  The IC chip 8 may be a single memory or may be configured by mounting a microcomputer in addition to the memory. A capacitor may be included if necessary, and there is no particular limitation as long as it is an electronic component required as an information recording member. The size of the IC chip 8 applicable in the present invention is not limited, but the thickness of the IC chip 8 is preferably 5 μm or more and 120 μm or less from the viewpoint of mechanical strength. Preferably, they are 10 micrometers-120 micrometers, More preferably, they are 20 micrometers-120 micrometers. When the thickness of the IC chip 8 is 120 μm or more, the strength of the IC chip itself is lowered, and the point pressure strength, impact property, and bendability are deteriorated, whereas the current processing technology is 5 μm or less, Since the film cannot be uniformly thinned and the surface property is deteriorated, the point pressure strength, impact property and bendability are deteriorated.

  When an antenna pattern is provided instead of the antenna coil 6, a conductive paste printing process, an aluminum foil or copper foil etching process, a winding welding process, or the like may be performed on the module substrate 5. As the module substrate 5, a thermoplastic film such as polyester is applicable, and polyimide is applicable when heat resistance is required. When it is desired to improve communication, the module substrate 5 may be covered with a resin, an insulating layer, or the like. The material of the module substrate 5 may be the same as or different from that of the sheet bases 2 and 3.

  The circuit pattern including the antenna coil 6 is preferably an etching type, and can be electrically connected in a separate process so as not to be short-circuited with an intermediate coil pattern as necessary. The number of turns of the antenna coil 6 is preferably 2 to 10 turns, but is not particularly limited in the present invention.

  Here, a module adhesive 9 is used for fixing the antenna coil 6 and the IC chip 8. The module adhesive 9 is filled between the antenna coil 6 and the IC chip 8 except for the connection surface between the antenna coil 6 and the bump 7. As the module adhesive 9, for example, NCP (non connected paste) or the like Examples thereof include resins that do not contain a conductive compound. The module adhesive 9 is applied by being dropped onto the antenna coil 6, and the IC chip 8 is integrated with the antenna coil 6 via the bumps 7, and is formed by a so-called flip chip mounting method. Function as an integrated IC module.

  A plate-like reinforcing member 11 is disposed above the IC chip 8 via a reinforcing member adhesive 10 dropped and applied on the sheet base 2 and the IC module 4. Constitutes a part of the IC module 4.

  The reinforcing member 11 is for increasing the point pressure strength of the IC chip 8 and improving its durability, and is preferably excellent in mechanical strength. For example, a highly rigid metal such as SUS, ceramic, carbon fiber, etc. , Glass fiber, aramid fiber, high elasticity resin, etc., can be selected as appropriate. In particular, a material using a material having a Young's modulus of 100 GPa or more for its main structure is preferable. Moreover, the thickness is 10-300 micrometers, Preferably it is 20-200 micrometers, More preferably, it is 30-175 micrometers. As a result, the IC chip 8 is destroyed by bending the central portion of the IC card 1 while maintaining good printability on the surfaces of the sheet base materials 2 and 3 without increasing the thickness of the IC card 1. Can be prevented. Therefore, the shape of the reinforcing member 11 is preferably at least larger than the area on the upper surface side of the IC chip 8, but is not limited to a plate shape and can be freely formed unless it is contrary to the gist of the present invention. it can. Moreover, it is preferable that one or more reinforcing members 11 are provided, and when the reinforcing member 11 is provided, the present invention can exert its effect particularly.

  The reinforcing member adhesive 10 used for fixing the reinforcing member 11 may be the same as the module adhesive 9.

  Further, as shown in FIGS. 1 and 2, above the reinforcing member 11, a disk-shaped expansion member that is inscribed in the outer periphery of the reinforcing member 11 and that covers at least the upper surface of the IC chip 8. 12 is disposed. That is, the expansion member 12 is disposed between at least the reinforcing member 11 and the sheet base material 2 adjacent to the reinforcing member 11 and is formed to correspond to at least the IC chip 8. Further, the expansion member 12 is fixed by enclosing the gap adhesive 13 together with the IC module 4 between the sheet bases 2 and 3.

  The gap adhesive 13 is a reactive adhesive. In the present invention, the gap adhesive 13 is preferably a material that is cross-linked by a trigger such as heat or light for ease of handling. Specifically, it is preferably a resin material such as a thermosetting type, a photocurable type, and a moisture curable type.

  The thermosetting resin material is not particularly limited as long as it is a resin that exhibits fluidity at room temperature and exhibits curability when heated. Examples thereof include polyurethane, unsaturated polyester, phenol resin, urea resin, epoxy resin, acrylic resin, polybutadiene, and silicon resin. In particular, polyurethane and epoxy resin which are easy to foam and have high impact resistance are preferable.

  As the photocurable resin material, a composition comprising a radical polymerizable component and a photo radical polymerization initiator, a cationic polymerizable component and a photo cationic polymerization initiator can be used. In the present invention, although there is no particular limitation, it is preferable to use a composition comprising a cationically polymerizable component and a photocationic polymerization initiator because the film after curing has flexibility.

  As the cationically polymerizable component, for example, epoxy compounds such as bisphenol-epoxy resin, phenolic epoxy resin, halogenated phenol epoxy resin, polyalkylene glycol epoxy resin, butyl glycidyl ether, and phenyl glycidyl ether are preferably used. Furthermore, vinyl ether compounds such as isopropyl vinyl ether and cetyl vinyl ether, oxetane and the like can be used. Specifically, Shinzo Yamashita, “Cross-linking agent handbook” (1981 Taiseisha); Kato Kiyomi, “UV / EB curing handbook (raw material)” (1985, Polymer publication society); Commercial editions described in the association edition, “Application and Market of UV / EB Curing Technology”, p. 79, (1989, CMC); Eiichiro Takiyama, “Polyester Resin Handbook”, (1988, Nikkan Kogyo Shimbun) Radically polymerizable, cationic polysynthetic or crosslinkable monomers, oligomers and polymers known in the art or in the industry can be used.

  The photocationic polymerization initiator is a polymerization initiator that generates cationic species by light, and generally onium salts are well known. As the onium salt, a diazonium salt of Lewis acid, an iodonium salt of Lewis acid, a sulfonium salt of Lewis acid, or the like is used. Specific examples of these compounds include, for example, boron tetrafluoride phenyldiazonium salt, phosphorus hexafluoride diphenyliodonium salt, antimony hexafluoride diphenyliodonium salt, arsenic hexafluoride tri-4-methylphenylsulfonium Salt, tri-4-methylphenylsulfonium salt of antimony tetrafluoride, and the like. However, the onium salt is not limited to these, and any compound that generates a cationic species by light irradiation can be used.

  Further, as the moisture curable resin material, JP-A-2-16180, JP-A-2000-036026, JP-A-2000-211985, JP-A-2000-21278, JP-A-2000-21855, The material disclosed in Japanese Patent Application No. 2000-369855 can be used. Specific examples include urethane resins and alkoxide group-containing silicon resins. As an example of the moisture-curing adhesive, there is one in which a urethane polymer containing an isocyanate group at a molecular terminal is a main component, and this isocyanate group reacts with moisture to form a crosslinked structure. Examples of the moisture curable adhesive made of such a moisture curable resin material include 9613N manufactured by Sekisui Chemical Co., Ltd., TE030 and TE100 manufactured by Sumitomo 3M, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., and Bond Master 170 manufactured by Kanebo UESC. Series, Macroplast QR3460 manufactured by Henkel, and the like.

Next, the expansion member 12 will be described.
The expansion member 12 is a member having a higher expansion coefficient than that of the module adhesive 9 that fixes at least the IC chip 8 and the antenna coil 6. In particular, the expansion member 12 is an adhesive (module adhesive 9, reinforcing member) used in the IC card 1. A member having a higher expansion coefficient than the adhesive 10 and the gap adhesive 13) is preferable.

  This is because the members constituting the IC card 1 expand due to heat, moisture, etc., but the expansion rate differs depending on the material used for the component at that time.

In particular, when the module adhesive 9 that fixes the IC chip 8 and the antenna coil 6 is expanded, a force is generated in a direction in which the IC chip 8 is separated from the upper surface of the antenna coil 6 together with the bumps 7.
That is, the IC chip 8 is given a force acting upward due to the expansion of the module adhesive 9 and a force assisting due to the expansion of the reinforcing member adhesive 10 and the gap adhesive 13. . On the other hand, around the periphery of the reinforcing member 11, the force acting upward is concentrated due to the difference between the expansion coefficient of the IC chip 8 or the reinforcing member 11 and the expansion coefficient of the gap adhesive 13, and the force acting upward is generated as a whole. At this time, the sheet base materials 2 and 3 have a force acting upward due to the expansion of the module adhesive 9 and a force assisting upward due to the expansion of the reinforcing member adhesive 10 and the gap adhesive 13. This causes a force to work downward in the figure. As a result, the IC chip 8 is subjected to a force that is pressed against the antenna coil 6, but the force acting upward as a whole due to the force due to expansion of the module adhesive 9 and the force acting upward around the periphery of the reinforcing member 11. However, when the force acting downward is exceeded, the IC chip 8 is pushed upward, causing a phenomenon in which the IC chip 8 is peeled off from the antenna coil 6.

  At the same time, since the reinforcing member 11 floats upward in the layer made of the gap adhesive 13 together with the IC chip 8, that is, in the direction in which the base sheet 2 is formed, the reinforcing member 11 causes unevenness on the surface of the sheet base 2. End up. That is, in the IC card 1, the force that presses the IC chip 8 downward by the reinforcing member 11 and the force that works upward in the periphery of the peripheral portion of the reinforcing member 11 are concentrated on the surface of the sheet base material 2 above the portion. At the same time as generating the convex portion, a concave portion is generated on the surface of the sheet base material 2 located above the reinforcing member 11 and facing the reinforcing member 11.

  In order to prevent this phenomenon, in the present embodiment, by disposing the expansion member 12 above the reinforcing member 11 as a member having a higher expansion coefficient than the adhesive that is the constituent member having the highest expansion coefficient in the IC card 1, The volume increased by the expansion of the expansion member 12 is made larger than the volume increased by the expansion of the adhesive, and the phenomenon that the IC chip 8 is peeled off from the antenna coil 6 is prevented. It is possible to prevent unevenness on the surface.

  In addition, the expansion coefficient in this invention means a volume expansion coefficient. The volume expansion is not limited to expansion in a solid phase state due to heat or moisture absorption, but may be expansion due to a change in phase from a solid layer to a liquid layer, or from a solid layer to a gas layer. Accordingly, the volume expansion coefficient includes a hygroscopic expansion coefficient and a thermal expansion coefficient. Examples of the thermal expansion coefficient include a linear thermal expansion coefficient α expressed by length and a volume expansion coefficient β expressed by volume. For example, the linear thermal expansion coefficient α is measured by the method of JIS K7197.

Accordingly, the expansion member 12 is not particularly limited in its numerical value itself as long as the expansion coefficient measured by the above-described measurement method is larger than the module adhesive 9 for connecting and fixing the IC chip 8 to the antenna 3. The specific linear thermal expansion coefficient is preferably 5 × 10 ⁻⁵ K ⁻¹ or more and 5000 × 10 ⁻⁵ K ⁻¹ or less (20 ° C. to 50 ° C.). This is because if the average linear thermal expansion coefficient at 20 to 50 ° C. is smaller than 5 × 10 ⁻⁵ K ⁻¹ , the improvement effect in the connection reliability between the IC chip 8 and the antenna 3 is reduced as described above. On the contrary, when the linear thermal expansion coefficient exceeds 5000 × 10 ⁻⁵ K ⁻¹ , the expansion member 12 expands and a convex portion is generated on the surface of the IC card 1 due to the increased volume, and the surface smoothness effect of the IC card 1 is increased. This is to make it smaller.

Here, as a material applicable to the expansion member 12, for example, a resin, a ceramic, a metal, or a composite material made of a plurality of these materials can be cited.
As the resin, a generally used resin material can be used without limitation unless it is contrary to the spirit of the present invention. Epoxy resins, urethane resins, silicon resins, cyanoacrylate resins, synthetic rubber resins such as nitrile rubber, UV curable resins, hot melt resins, anaerobic resins, cellulose adhesives, vinyl acetate adhesives, Paraffin wax, olefin wax, polyethylene wax, polypropylene wax, carnauba wax and the like can be used.

  In particular, a rubber system having a large volume expansion coefficient, a wax system having a large expansion coefficient with phase change, a foamable resin containing bubbles in the resin, a polyvinyl alcohol resin having a high volume expansion coefficient due to moisture absorption and a high absorption coefficient, etc. preferable. Polymer materials that can be used for the foamable resin include olefin resins such as polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-propylene-diene copolymer, ethylene-vinyl acetate copolymer, and polymethyl acrylate. , Acrylic resins such as polymethyl methacrylate, ethylene-ethyl acrylate copolymer, styrene resins such as butadiene-styrene, acrylonitrile-styrene, styrene, styrene-butadiene-styrene, styrene-isoprene-styrene, styrene-acrylic acid , Vinyl chloride resins such as acrylonitrile-polyvinyl chloride and polyvinyl chloride-ethylene, vinyl fluoride resins such as polyvinyl fluoride and polyvinylidene fluoride, and resins such as 6-nylon, 6-6-nylon, 12-nylon, etc. Resins, saturated ester resins such as polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyphenylene oxide, polyacetal, polyphenylene sulfide, silicone resin, thermoplastic urethane resin, polyether ether ketone, polyether imide, various elastomers and cross-linked products thereof Natural rubber or synthetic rubber, polyvinyl alcohol, cellulose, polyamide resin, phenol resin, urea resin, epoxy resin, polyimide resin, and the like.

  The foamable resin can be produced by mixing a foaming agent with these resins, and the foaming agent can be appropriately selected depending on the resin used. For example, physical foaming agents such as chlorofluorocarbon, carbon dioxide, pentane, etc., and azo compounds, azide compounds, sodium bicarbonate (sodium bicarbonate), talc, calcium carbonate, citric acid as gas generating agents described in JP-A-2003-231875 Such as decomposition type foaming agent, reactive foaming agent such as carbon dioxide generated by reaction of isocyanate and water, photothermal conversion material as disclosed in JP-A-11-38610, cross-linking accelerator, etc. Mold blowing agents. Moreover, as a foaming agent whose function as a foaming agent is used in the present invention, a gas generating agent, a decomposable foaming agent, and a reaction promoting foaming agent are preferable in terms of ease of production. The foamed resin material of the present invention can be prepared by adding various known additives as required. For example, a bubble regulator, a tackifier, a filler, a viscosity modifier, a dye, a pigment, an antistatic agent, metal fine particles, a flame retardant and the like can be mentioned.

  Moreover, the mixing method of a foaming agent etc. can employ | adopt a well-known mixing method suitably, Specifically, well-known techniques, such as a ball mill, a mechanical stirrer, a homogenizer, an ultrasonic disperser, can be used.

  Next, an IC card base material manufacturing apparatus 40 as an example of an IC card base material manufacturing apparatus used in the process of manufacturing the IC card 1 will be described with reference to FIG.

  In the IC card base material manufacturing apparatus 40, a sheet-like sheet base material 2 as a top sheet is disposed from the first sheet base material supply unit 41 to be transported from the upstream side to the downstream side by the sheet transport member 42. ing.

  Above the sheet conveying member 42, an adhesive supply unit 43 and an IC module supply unit 44 are sequentially formed from upstream to downstream. In the adhesive supply unit 43, the gap adhesive 13 melted at 120 ° C. under nitrogen is applied to the upper surface of the sheet base material 2 that has passed therebelow by the T-die coating method, and the IC module supply unit In 44, the IC module 4 in which the expansion member 12 is disposed is mounted on the upper surface of the sheet base material 2 that has passed therebelow.

  Further, on the further downstream side of the sheet conveying member 42, a pair of laminating rollers 45, a pair of film thickness control rollers 46, and an IC card base material conveying member 47, which are arranged vertically, are arranged in order. ing. The laminating roller 45 is a pressure roller for laminating an object passing between them, and is preferably configured to perform heating and pressurization. On the other hand, the film thickness control roller 46 is configured to control the film thickness of an object passing between them. The sheet substrate 2 conveyed by the sheet conveying member 42 is conveyed on the IC card substrate conveying member 47 after passing between the laminating roller 45 and the film thickness control roller 46. .

  Further, the long sheet base material 3 is conveyed at a predetermined speed as a back sheet from the second sheet base material supply unit 48 to the outer peripheral surface of the upper roller of the laminating roller 45. It has become. Further, an adhesive supply unit 49 similar to the adhesive supply unit 43 is formed above the outer peripheral surface of the roller disposed on the upper side of the laminating roller 45, and the sheet base 3 is connected to the adhesive supply unit. When passing below 43, the gap adhesive 13 is applied to the upper surface of the sheet base material 3. Then, the sheet substrate 3 conveyed from the second sheet substrate supply unit 48 passes between the bonding roller 45 and the film thickness control roller 46 as the bonding roller 45 rotates, and conveys the IC card substrate. The IC card base material is manufactured, which is transported onto the member 47 and is bonded to the sheet base material 2 transported by the sheet transport member 42 to enclose the expansion member 12 and the IC module 4 therebetween. It has become so.

  The adhesive supply units 43 and 49 are formed so that the adhesive is applied onto the sheet bases 2 and 3 by the T-die application method, but not limited to the T-die application method. Any commonly used coating method such as a roller method or a die method may be used. Further, a press machine heated to the bonding temperature of the gap adhesive 13 may be used instead of the bonding roller 45, or vacuum pressing is performed to prevent bubbles from entering when the gap adhesive 13 is bonded. It may be a thing.

  Further, as heating / pressurizing means for enhancing the surface smoothness of the IC card 1 and the adhesion between the sheet base materials 2 and 3 and the IC module 4 when the IC module 4 having the expansion member 12 mounted therein is incorporated, In addition to those listed above, methods such as an up-down press method, a laminate method, and a caterpillar method are listed.

The heating temperature at that time is preferably 10 to 120 ° C, more preferably 30 to 100 ° C. Pressing, from the viewpoint of avoiding damage to the IC chip 8, preferably 0.05~300kgf / cm ^2, more preferably 0.05~100kgf / cm ^2. Moreover, as preferable heating and pressurization time, it is 0.1 to 180 sec, More preferably, it is 0.1 to 120 sec.

Next, a method for manufacturing the IC card 1 will be described.
In manufacturing the IC card 1, the IC module 4 and the expansion member 12 are enclosed between the opposing sheet base materials 2 and 3. The IC module 4 and the expansion member 12 are enclosed between the sheet base materials 2 and 3. As a method, a conventionally known adhesive bonding method can be arbitrarily adopted. Here, a case where a hot melt adhesive is used for the gap adhesive 13 will be described.

  First, an image receiving layer 20, a writing layer 30, a cushion layer, or the like is provided on the two sheet base materials on the front and back sides of the IC card 1 as necessary, or the sheet base material provided with these is used as a sheet base. Prepare as materials 2 and 3.

  Then, using the IC card base material manufacturing apparatus 40 shown in FIG. 3, a hot melt adhesive is applied to one surface of the sheet base materials 2 and 3 to a predetermined thickness by the adhesive supply units 43 and 49. To do. Thereafter, the IC module supply unit 44 mounts the IC module 4 on which the expansion member 12 is mounted at a predetermined position on the sheet substrate 2.

  Here, a method of forming the IC module 4 on which the expansion member 12 is mounted will be described.

First, a method for forming the IC module 4 will be described.
The following is an example, and the forming method is not particularly limited unless it is contrary to the spirit of the present application. The IC module 4 is formed by forming a circuit by etching a metal foil previously provided on the module substrate 5 on the antenna-like pattern, or by screen-printing conductive ink. A resin selected from a thermosetting adhesive (NCP), an anisotropic conductive resin (ACP) or the like is disposed on the portion to which the IC chip 8 is connected by potting or the like. Fix it. Further, the reinforcing member adhesive 10 is provided by potting or the like, and the reinforcing member 11 is pressed and heated and fixed on the reinforcing member 11 to form the IC module 4.

  Thereafter, hot melt adhesive is dropped onto the upper portion of the reinforcing member 11, and the expansion member 12 is disposed on the hot melt adhesive to perform adhesive fixing, whereby the IC module 4 on which the expansion member 12 is mounted is formed.

  Then, the sheet base material 2 on which the IC module 4 in which the expansion member 12 is installed in the vicinity of the IC chip 8 as described above is conveyed between the laminating rollers 45 by the sheet conveying member 42.

  In addition, the mounting method of the expansion member 12 is not limited to the above example, and is not particularly limited as long as it does not contradict the purpose of the present application. For example, after the IC module 4 is created, the expansion member 12 is provided directly on the reinforcing member 11 of the IC module 4 by an ink jet method, a potting method, a coating method, or the like. In the case of an expansion member having no self-adhesiveness, a normal temperature adhesive or a hot melt adhesive is previously provided on the upper portion of the reinforcing member 11 by potting or the like, and pressurization, heating, or the like is provided on the upper portion. Moreover, after pasting the sheet base materials 2 and 3 on the two sheet base materials 2 and 3 on the front and back of the IC card 1 in advance using a printing method, an ink jet method, a potting method, a coating method, etc., A method in which the expansion member 12 is provided so as to coincide with a portion around the IC chip 8 is also exemplified.

  On the other hand, the sheet base material 3 is conveyed between the laminating rollers 45 at a predetermined speed, and the hot melt adhesive is applied to the sheet base material 2 on which the expansion member 12 and the IC module 4 are mounted. The sheet base material 2 and the sheet base material 3 are bonded together in a state where the expansion member 12 and the IC module 4 are sealed while passing between the bonding rollers 45 with the surfaces facing each other.

  Thereafter, the sheet substrates 2 and 3 pass between the film thickness control rollers 46 and are rolled to form an IC card substrate having a predetermined film thickness.

  The IC card substrate formed as described above is allowed to stand for a predetermined time to perform a curing reaction of the hot melt adhesive. Thereafter, if necessary, after an image is formed on the sheet bases 2 and 3, the IC card 1 is manufactured by further cutting to a predetermined card size.

Note that the image forming on the sheet bases 2 and 3 and the cutting to a predetermined card size are performed by the expansion member 12 disposed at a predetermined position between the sheet bases 2 and 3 after the hot melt adhesive is cured. It is preferable that the IC module 4 is sufficiently adhered to the adhesive.
Further, as a cutting method to a predetermined card size, a punching method can be selected. The thickness of the manufactured IC card 1 is 300 to 1000 μm, preferably 300 to 900 μm.

  In the IC card 1 formed as described above, even if the module adhesive 9 that fixes the IC chip 8 and the antenna coil 6 is expanded by heating or moisture, the expansion member 12 expands more than the adhesive 9. Thus, the IC chip 8 can be pressed against the antenna coil 6, and breakage and cracks that occur due to different expansion coefficients between the IC module 4 and the module adhesive 9 can be prevented. Moreover, the unevenness | corrugation which arises on the sheet | seat base material 2 surface located in the sheet substrate 2 and 3 on the opposite side to the surface where the IC chip 8 was connected with the antenna coil 6 can also be prevented. Therefore, the smoothness on the card surface can be maintained while eliminating the connection failure due to expansion.

  Further, by using rigid members for the sheet bases 2 and 3 and defining the thickness dimension thereof, the members existing between the sheet bases 2 and 3 expand and press the nearest sheet bases 2 and 3. Even if a force is generated, the sheet base materials 2 and 3 can resist the force, prevent the surface of the sheet base materials 2 and 3 from being uneven, and maintain smoothness on the card surface. Can do.

  Moreover, it has the image receiving layer 20 on the surface of one sheet base material 2 among the sheet base materials 2 and 3 which oppose, and has the writing layer 30 which can be written on the surface of the other sheet base material 3, so that the card Since the IC card 1 having various information written on the surface can be obtained, and the smoothness on the card surface can be maintained even when the IC card 1 is expanded, The fineness of images such as characters can be improved.

  Further, as an adhesive (module adhesive 9, reinforcing member adhesive 10, gap adhesive 13) used for the IC card 1, for example, the reaction is started by a specific trigger such that the material is cross-linked by light or heat. By using a reactive adhesive having adhesiveness, handling properties can be improved.

  In the present embodiment, the disk-shaped expansion member 12 is disposed above the reinforcing member 11. However, the expansion member may be an expansion member disposed at a position where the IC chip 8 is not peeled off from the antenna coil 6 during expansion. The shape is not particularly limited.

  For example, as shown in FIGS. 4 and 5, a plurality of expansion members 14 formed so as to correspond to at least the bumps 7 are provided above the reinforcing member 11 instead of the expansion member 12, and each of the expansion members 14 is provided for each pump. It is good also as a structure arrange | positioned corresponding to 7. With this arrangement, the expansion member 14 expands and presses the IC chip 8 against the antenna coil 6, and presses the bump 7, which is a connection portion between the IC chip 8 and the antenna coil 6, as a center. At the same time, it can be pressed according to the number of pumps 7, that is, the location of the connecting portion, so that it is possible to reliably prevent the IC chip 8 from being detached from the antenna coil 6 and causing poor connection when expanded.

  As shown in FIG. 6, an expansion member 15 formed in a ring shape may be disposed above the reinforcing member 11 instead of the expansion member 12. In this case, the ring-shaped expansion member 15 is a member formed by connecting portions corresponding to the plurality of bumps 7 so as to pass through positions corresponding to the plurality of bumps 7 with the IC chip 8 interposed therebetween. Yes, by providing the expansion member 15, the same effect as the expansion member 14 described above can be obtained.

  Furthermore, the expansion member 12 may be arranged not only above the reinforcing member 11 but also below the module substrate 5 as shown in FIG. By arranging in this way, in addition to the above-mentioned effects, the strength against impact from the vertical direction of the IC chip 8 can be improved, and unevenness generated on the surfaces of the opposing sheet base materials 2 and 3 can be improved. It can also be prevented.

  Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited thereto.

[Production of Example 1]

<< Production of IC module >>
As shown in FIG. 1, an IC chip having a thickness of 50 μm and a 3 mm square and an antenna coil are electrically connected to a transparent PET support having a thickness of 38 μm on which an antenna pattern has been formed by etching, and a module is bonded. It was fixed with an agent (manufactured by Sumitomo Electric Industries, Ltd .: Sumimac ECR-8015TO (linear thermal expansion coefficient 8 × 10 ⁻⁵ K ⁻¹ , 20 to 50 ° C.)) so as to have a thickness of 20 μm. Next, on the opposite side of the IC chip to the antenna coil connection surface, a main component and a curing agent using a two-component curable elastic epoxy adhesive (manufactured by Toho Kasei Kogyo Co., Ltd .: ULTITE 1540 set) are used. Potting was performed so that the thickness dimension was 10 μm, and a 4 mm square plate-shaped reinforcing member having a thickness dimension of 120 μm made of SUS301 was placed thereon. Then, the reinforcing member is fixed to the circuit in which the IC chip and the antenna coil are connected to the transparent PET support by pressing with a pressure roll (0.001 kg / cm ² ) so as to seal the IC chip. IC module was obtained.

<< Fixing of expansion member to IC module >>
Moisture curable hot-melt adhesive (manufactured by Henkel: Macroplast QR3460) was heated to 120 ° C., blown with dry nitrogen, kneaded and stirred, and the linear thermal expansion coefficient at 20 to 50 ° C. was 100 × 10 ^−5. As K- ¹ , a foamed resin adjusted to have a higher linear thermal expansion coefficient than that of the module adhesive was prepared. This was potted on the reinforcing member of the IC module, and an expansion member was provided by setting the thickness to 50 μm, and was fixed to the IC module 4.

<Creation of sheet base material>
As the sheet base material used for the IC card, a sheet base material having an image receiving layer and a sheet base material having a writing layer were prepared.

(Creation of a sheet substrate having an image receiving layer)
As a surface sheet base material, a first image-receiving layer-forming coating solution and a second image-receiving-layer-forming coating solution having the following composition are formed on a low heat yield grade of U2L98W manufactured by Teijin DuPont Film Co., Ltd. having a thickness of 188 μm. The image receiving layer 20 was formed by sequentially coating and drying the layers so that the thickness of each of the first image receiving layer was 2.5 μm and the second image receiving layer was 0.5 μm.

<Formation of image receiving layer>
<First image-receiving layer forming coating solution>
Polyvinyl butyral resin (manufactured by Sekisui Chemical Co., Ltd .: ESREC BX-1) 6 parts Metal ion-containing compound (Compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts Compound MS is Compound 1 described below.

<Second image-receiving layer forming coating solution>
Polyethylene wax (Toho Chemical Industries, Ltd .: Hitech E1000) 2 parts Urethane-modified ethylene acrylic acid copolymer
(Toho Chemical Industries, Ltd .: Hitech S6254) 8 parts Methylcellulose (Shin-Etsu Chemical Co., Ltd .: SM15) 0.1 parts Water 90 parts

  Then, format printing (employee ID, name) was performed on the image receiving layer by a resin letterpress printing method to produce a sheet substrate 2 on which a formatted printed matter was formed. UV black ink was used as the printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp.

(Creation of a sheet base material having a writing layer)
As a back sheet base material, a first writing layer forming coating solution, a second writing layer forming coating solution, and a second writing layer forming coating solution having the following composition on a low heat yield grade of U2L98W manufactured by Teijin DuPont Films Ltd. having a thickness of 188 μm The three writing layer forming coating solutions are applied and dried in this order, and are laminated so that the thickness dimensions of the first writing layer are 5 μm, the second writing layer is 15 μm, and the third writing layer is 0.2 μm. Thus, a writing layer was formed. Ra of the outermost surface after application of the writing layer was 1.56 μm.

<Formation of writing layer>
<First writing layer forming coating solution>
Polyester resin (Toyobo Co., Ltd .: Byron 200) 8 parts Isocyanate (Nippon Polyurethane Industry Co., Ltd .: Coronate HX) 1 part Carbon black Trace amount Titanium dioxide particles (Ishihara Sangyo Co., Ltd .: CR80) 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 copies
<Second writing layer forming coating solution>
Polyester resin (Toyobo Co., Ltd .: Vylonal MD1200) 8 parts Silica 6 parts Titanium dioxide particles (Ishihara Sangyo Co., Ltd .: CR80) 2 parts Water 90 parts
<Third writing layer forming coating solution>
Polyamide resin (manufactured by Sanwa Chemical Industry Co., Ltd .: Sunmide 55) 5 parts Methanol 95 parts

  Then, format printing (ruled lines, issuer name, issuer telephone number) was performed on the writing layer by the resin letterpress printing method, and the sheet base material 3 on which the format printed matter was formed was created. UV black ink was used as the printing ink. The UV irradiation conditions during printing were equivalent to 200 mj with a high-pressure mercury lamp. Using the sheet base material formed in this way, it is possible to create an IC card by the following manufacturing method.

<Creation of IC card>
First, an IC card substrate was prepared using the IC card substrate manufacturing apparatus shown in FIG. 3 for the sheet substrate prepared in the above process.
Here, Sekisui Chemical Co., Ltd .: Moisture effect type hot melt adhesive MK2013 is used for the gap adhesive, and the adhesive supply section is a T-die coating method in which the adhesive is melted at 120 ° C. under nitrogen. The supply is performed so as to be applied onto the sheet base materials 2 and 3. Further, the laminating roller is heated and pressurized at a roller surface temperature of 65 ° C. and a pressure of 3 kg / cm ² . The film thickness control roller controls the film thickness to be 760 μm.
Thereafter, the IC card substrate manufactured by the IC card substrate manufacturing apparatus was allowed to stand for 14 days in an environment of 23 ° C. and 55% humidity to promote curing of various adhesives including a gap adhesive, An IC card of a predetermined size was obtained by punching to a size of 55 × 85 mm and a thickness of 760 μm using a known card punching machine.

<< Formation of authentication identification image and attribute information image >>
An authentication identification image and an attribute information image were formed on the IC card produced by the above-described method using the sublimation type and melt type thermal transfer recording ink ribbons and the surface protective layer transfer foil described below.

(Preparation of ink ribbon for sublimation thermal transfer recording)
A 6 μm-thick polyethylene terephthalate sheet with anti-fusing processing on the back surface is coated with a yellow ink layer forming coating liquid, a magenta ink layer forming coating liquid, and a cyan ink layer forming coating liquid having the following composition to a thickness of 1 μm. Thus, yellow, magenta, and cyan ink ribbons were obtained.

<Coating liquid for yellow ink layer formation>
Yellow dye (Mitsui Toatsu Dye Co., Ltd .: MS Yellow) 3 parts Polyvinyl acetal (Denka Butyral KY-24) 5.5 parts Polymethylmethacrylate modified polystyrene (Toa Gosei Chemical Co., Ltd.) : Rededa GP-200) 1 part Urethane modified silicone oil (Dairoma Seika Kogyo Co., Ltd .: Dialomer SP-2105) 0.5 part Methyl ethyl ketone 70 parts Toluene 20 parts

<Coating liquid for magenta ink layer formation>
Magenta dye (MS Magenta manufactured by Mitsui Toatsu Dye Co., Ltd.) 2 parts Polyvinyl acetal (manufactured by Denki Kagaku Kogyo Co., Ltd .: Denka Butyral KY-24) 5.5 parts Polymethylmethacrylate modified polystyrene (manufactured by Toa Gosei Chemical Co., Ltd .: Rededa GP-200) 2 parts Urethane modified silicone oil (Dairoma Seika Kogyo Co., Ltd .: Dialomer SP-2105) 0.5 parts Methyl ethyl ketone 70 parts Toluene 20 parts

<Cyan ink layer forming coating solution>
Cyan dye (Nippon Kayaku Co., Ltd .: Kayaset Blue 136) 3 parts Polyvinyl acetal (Denka Butyral KY-24, manufactured by Denki Kagaku Kogyo Co., Ltd.) 5.6 parts Polymethyl methacrylate-modified polystyrene (Toa Gosei Chemical Co., Ltd.) Manufactured by: Rededa GP-200) 1 part Urethane modified silicone oil (manufactured by Dainichi Seika Kogyo Co., Ltd .: Dialomer SP-2105) 0.5 part Methyl ethyl ketone 70 parts Toluene 20 parts

(Preparation of melt-type thermal transfer recording ink ribbon)
An ink layer forming coating solution having the following composition was applied and dried to a thickness of 2 μm on a 6 μm thick polyethylene terephthalate sheet that had been processed to prevent fusion on the back side, and slitted to obtain an ink ribbon.

<Coating liquid for forming molten ink layer>
Carnauba wax 1 part Ethylene vinyl acetate copolymer (Mitsui DuPont Chemical: EV40Y) 1 part Carbon black 3 parts Phenolic resin (Arakawa Chemical Industries, Ltd .: Tamorol 521) 5 parts Methyl ethyl ketone 90 parts

(Formation of identification image)
The authentication identification image is formed on the IC card by superimposing the ink-attached surface of the sublimation type thermal transfer recording ink ribbon on the upper surface of the image receiving layer 20 and using a thermal head from the ink ribbon side. By performing heating under the conditions of an output of 0.23 W / dot, a pulse width of 0.3 to 4.5 milliseconds, and a dot density of 16 dots / mm, a human image having a gradation property was formed on the image receiving layer 20. .

(Formation of attribute information image)
The attribute information image is formed on the IC card by superimposing the ink-attached surface of the sublimation type thermal transfer recording ink ribbon on the upper surface of the image receiving layer 20 and using a thermal head from the ink ribbon side. Character information was formed on the image receiving layer 20 by heating under conditions of an output of 0.5 W / dot, a pulse width of 1.0 ms, and a dot density of 16 dots / mm.

<Applying a surface protective layer to the IC card>
After preparing an actinic ray curable layer resin as a material for the surface protective layer and preparing a transfer foil having the following composition, the IC card on which the authentication identification image and the attribute information image obtained in the above process are formed Then, transfer was performed by applying heat at a pressure of 150 kg / cm ² for 1.2 seconds using a heat roller having a diameter of 5 cm and a rubber hardness of 85 heated to a surface temperature of 200 ° C. on the surface on which each image was formed.

(Creation of actinic ray cured layer resin)
In a three-necked flask under a nitrogen stream, 73 parts of methacrylic methyl, 15 parts of styrene, 12 parts of methacrylic acid and 500 parts of ethanol, laminating roller, laminating roller '-azobisisobutyronitrile 3 parts, The reaction was performed in an oil bath at 80 ° C. for 6 hours. Thereafter, 3 parts of triethylammonium chloride and 1.0 part of glycidyl methacrylate were added and reacted for 3 hours to obtain an actinic ray curable layer resin as a synthetic binder for the desired acrylic copolymer.

(Create transfer foil for surface protective layer)
One surface of polyethylene terephthalate (manufactured by Diafoil Hoechst Co., Ltd .: S-25) was coated and dried sequentially by wire bar coating according to the following formulation to prepare a transfer foil.

<Release layer> Film thickness 0.2μm
Polyvinyl alcohol (manufactured by Nippon Synthetic Chemical Co., Ltd .: GL-05) 10 parts Water 90 parts The release layer was dried at 90 ° C. for 30 seconds after coating.
<Actinic ray cured layer> Film thickness 7.0 μm
Shin-Nakamura Chemical Co., Ltd .: A-9300 / Shin-Nakamura Chemical Co., Ltd .: EA-1020
35 / 11.75 parts Reaction initiator (manufactured by Ciba Geigy Japan, Inc .: Irgacure 184) 5 parts Resin used with actinic ray curable layer 48 parts Dainippon Ink Surfactant F-179
(Dai Nippon Ink Chemical Co., Ltd.) 0.25 parts Toluene 500 parts The applied actinic ray cured layer was dried at 90 ° C. for 30 seconds, and then photocured with a mercury lamp (300 mJ / cm ² ).

<Intermediate layer> Film thickness 1.0μm
Polyvinyl butyral resin (Sekisui Chemical Co., Ltd .: ESREC BX-1) 3.5 parts Tuftex M-1913 (Asahi Kasei Co., Ltd.) 5 parts Curing agent Polyisocyanate (Nippon Polyurethane: Coronate HX) 1.5 parts Methyl ethyl ketone 90 The intermediate layer after application was dried and cured at 50 ° C. for 24 hours.

<Adhesive layer> Film thickness 0.5μm
Urethane-modified ethylene ethyl acrylate copolymer (manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B) 8 parts Polyacrylic acid ester copolymer (manufactured by Nippon Pure Chemical Co., Ltd .: Jurimer AT510) 2 parts Water 45 parts Ethanol 45 parts The adhesive layer was dried at 70 ° C. for 30 seconds.

[Production of Example 2]
In the manufacturing process of the first embodiment, in “Fixing the expansion member to the IC module”, an IC card is similarly manufactured except that the expansion member is provided as shown in FIGS. Obtained.

[Production of Example 3]
In the manufacturing process of the first embodiment, in the “fixing of the expansion member to the IC module”, an IC card was similarly manufactured except that the expansion member was provided as shown in FIG. .

[Production of Example 4]
In the manufacturing process of Example 1, an IC card was prepared in the same manner as Example 4 except that the expansion member was provided by arranging as shown in FIG. .

[Production of Example 5]
In the manufacturing process of Example 1, in “Fixing of the expansion member to the IC module”, paraffin wax having a melting point of 60 ° C. having a volumetric thermal expansion coefficient larger than that of the module adhesive is used for the expansion member so that the thickness becomes 20 μm. An IC card was produced in the same manner as described above except that the example 5 was obtained.

[Production of Example 6]
In the manufacturing process of Example 1, an IC card is similarly manufactured except that PVA resin (polyvinyl alcohol) having a higher hygroscopic expansion coefficient than the module adhesive is used for the expansion member in << Fixing of expansion member to IC module >>. Example 6 was obtained.

[Production of Comparative Example]
In the manufacturing process of Example 1, an IC card was similarly manufactured except that the expansion member was not provided in << Fixing of expansion member to IC module >> to obtain a comparative example.

<Evaluation of heat resistance>
The produced IC cards of Examples 1 to 4 and the comparative example were exposed for 1000 hours at 85 ° C. and 85% high temperature and high humidity, and the malfunction rate of the IC card after the exposure was determined. The heat resistance was evaluated according to the standard. The results are shown in Table 1.
○ ・ ・ ・ Operation failure rate 1% or less △ ・ ・ ・ Operation failure rate 1% to 20% or less × ・ ・ ・ Operation failure rate 20% to 100% or less

<Evaluation of printability>
The produced IC cards of Examples 1 to 4 and Comparative Example were exposed for 3 hours under conditions of 40 ° C. and 85%, and then a melt type and sublimation type thermal transfer image was formed on the writing layer, and after image formation The printability was evaluated by determining the degree of fading of the IC card according to the criteria described below. The results are shown in Table 1.
◎ ・ ・ ・ Image can be formed without any problems ○ ・ ・ ・ There is a part where the density is partially reduced, but the part where the density is reduced is a level that can be discriminated △ ・ ・ ・ There is a part where the density is partially reduced, and the density Is a level that cannot be discriminated. × ・ ・ ・ There is a part that completely loses color.

It is sectional drawing of the IC card of this invention. It is a partial top view of the IC card of FIG. It is a block diagram of the IC card manufacturing apparatus which produces the IC card of this invention. It is sectional drawing of the IC card of this invention. It is a partial top view of the IC card of FIG. It is a partial top view of the IC card of the present invention. It is sectional drawing of the IC card of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card 2,3 Sheet base material 4 IC module 5 Module board 6 Antenna coil 7 Bump 8 IC chip 9 Module adhesive 10 Reinforcement member adhesive 11 Reinforcement member 12, 14, 15 Expansion member 13 Gap adhesive 20 Image receiving layer 30 Writing layer

Claims (8)

An IC card in which an IC chip and an antenna body connected to one surface side of the IC chip are disposed between sheet substrates facing each other through a gap adhesive,
The antenna body is fixed to the IC chip via a module adhesive,
A sheet base material facing at least the surface of the IC chip opposite to the connection surface with the antenna body, and an expansion member having a higher expansion coefficient than the module adhesive is provided between the IC chip and the IC chip. IC card to do. The IC chip and the antenna body are connected via bumps,
The IC card according to claim 1, wherein the expansion member is disposed so as to correspond to at least the bump.   The IC card according to claim 1, comprising a plurality of the expansion members.   The expansion member is disposed between the IC chip and a sheet base material facing the connection surface of the IC chip with the antenna body. The IC card according to one item.   The IC card according to any one of claims 1 to 4, wherein a thickness dimension of the expansion member is smaller than a thickness dimension of the sheet base material.   6. The IC card according to claim 1, further comprising a reinforcing member between the expansion member and the IC chip.   The sheet-receiving substrate has an image-receiving layer on the surface of one of the sheet substrates, and a writing layer on the surface of the other sheet substrate. The IC card according to one item.   The IC card according to any one of claims 1 to 7, wherein the adhesive is a reactive adhesive.

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