JP2005329305A - Single wafer coating method, single wafer coating apparatus, coating substrate, and single wafer coating member manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve the production yield and the quality by suppressing the occurrence of the liquid shortage defect in the coating of a large sized substrate. <P>SOLUTION: In the sheet type coating method for applying a liquid material on a sheet like member to be coated such as a color filter used for a liquid crystal display, a collected liquid corresponding to the prescribed initial bead quantity is formed on the member before a discharge part of the liquid material and the member are relatively moved and after that, the discharge part of the liquid material and the member are relatively moved and the discharge of the liquid material from the discharge part is started to intentionally delay from the start of the relative movement. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a single wafer coating method for applying a liquid material to a single sheet coated member such as a display member, and more specifically, a sheet on which a liquid material is coated by relatively moving a paint discharging unit and a coated member. It relates to a leaf application method.

  Conventionally, various fluid materials (coating liquids, coating fluids) such as insulating materials and photoresist liquids are applied to coating objects such as glass flat plates used in various display devices such as wafers for semiconductor manufacturing and liquid crystal displays. Work is being done. As the most typical application method, there is a spin coat type application method, and when applying these application liquids, it is required to form a thin film having a uniform film thickness. In this spin coating type coating method, for example, a predetermined nozzle is arranged near the center of an object to be coated such as a substrate or a wafer, a coating liquid is dropped from this nozzle, the coating object is rotated at a high speed, and a centrifugal by rotation is performed. The coating liquid is diffused by force to form a uniform film thickness. However, in this spin coating type coating method, the amount of coating liquid scattered by rotation is large, and the coating liquid that has been shaken off is wasted.

  On the other hand, in recent years, a die coating (slit coating) type coating method has attracted attention. In this die coating type coating method, coating is performed on a coating target such as a rectangular substrate or wafer using a die (paint discharge unit) provided over the entire length of one side of the coating target. The The die is provided with a slit-like opening, and the die or application object is moved at a constant speed while discharging the coating liquid from the tip (lip) of the opening to form a uniform film thickness. . This die coating type coating method is excellent in that there is almost no waste caused by scattering, which was remarkable in the spin coating type coating method.

  However, in the die coating method, it is relatively difficult to obtain a uniform thin film by moving the die or the object to be coated. In particular, the coating unevenness becomes remarkable at the start end of the coating object where the die or the coating object starts running and the coating starts, and the end edge of the coating object where the die finishes coating. I can't keep it. In addition, when the coating operation is temporarily interrupted due to an unexpected situation, the coating liquid adhering to the tip of the slit in the die may be dried and solidified, making it difficult to restart the coating operation. In order to cope with these problems, as a conventional technique described in the publication, a liquid pool is formed at the start of coating, and the distance between the slit tip and the single-wafer substrate is set to the coating start position and end position in the coating area. There is a technique for making the area narrower than the center part (see, for example, Patent Document 1).

JP 2000-157908 A (page 4, FIG. 1)

Here, in recent years, a large-screen liquid crystal display has been developed at a very high speed, and the substrate itself to be coated in a single-wafer coating manufacturing process for display members and the like has become larger. For example, some liquid crystal displays using a large glass substrate have an area of more than 1 m ² , and in the near future, coating and drying may be performed on glass substrates exceeding ² to 3 m ^2. It will be necessary to do it. The above-mentioned die coating (slit coating) type coating method is particularly suitable for coating such a large substrate, but the die moving distance becomes longer due to the increase in the size of the substrate, and the die is also used to maintain manufacturing efficiency. It is required to move at high speed. However, the size of the die has been increased due to the need to apply a large substrate, and the weight has also increased. As a result, the power for accelerating the die becomes very high due to this weight increase, and the rising acceleration of the coating speed (moving speed) at the start of die coating cannot be increased due to the limitations of the apparatus. If this rising acceleration is low, there will be a problem in the film thickness uniformity at the coating start part, and there will also be a problem that a liquid shortage defect is likely to occur.

The present invention has been made in order to solve the technical problems as described above. The object of the present invention is to suppress the occurrence of a liquid shortage defect when coating a large substrate, and to improve the production yield and quality. It is to improve.
Another object is to speed up the determination of the coating conditions and improve the manufacturing operation rate.
Still another object is to reduce the acceleration time of the die when coating a large substrate by the die coating method, thereby reducing the cost of the single wafer coating apparatus and stabilizing the operation.
Still another object is to ensure good coating performance even when coating liquids having different characteristics are used.

  As a result of intensive studies to solve such problems, the present inventors have found that a good result can be obtained by delaying the discharge start from the die from the start of relative movement between the die and the substrate. . That is, the present invention relates to a single-wafer coating method for applying a liquid material to a single-wafer coated member, the step of relatively moving the liquid material discharge portion and the coated member, and the start of this relative movement And a step of starting the discharge of the liquid material from the discharge portion after a significant delay.

Here, the method may further include a step of forming a liquid pool having a predetermined initial bead amount on the member to be coated before the start of the relative movement.
In addition, the rising time Tv of the relative movement speed is longer than the rising time Tq of the liquid material discharge flow rate from the discharge unit.
Further, in the step of starting the discharge of the liquid material from the discharge unit, the timing of the start delay of the liquid material supply is Tm.
Tv × 0.5 ≦ Tq + Tm ≦ Tv × 1.5
The following relational expression is satisfied.

  On the other hand, a single wafer coating apparatus to which the present invention is applied includes a discharge means for discharging a liquid material applied to a member to be coated on a single sheet to the member to be coated, and the discharge means and the member to be coated. The discharge means is configured to move the liquid after a predetermined time from the start of the relative movement by the moving means when applying the coated member at a predetermined supply discharge flow rate according to the relative movement by the moving means. It is characterized by starting material discharge.

  Here, the discharge means may be characterized in that a liquid pool having a predetermined initial bead amount is formed on the member to be coated before the relative movement by the moving means is started. In addition, it is preferable that the predetermined initial bead amount is secured to a predetermined amount or more in order to prevent liquid breakage when intermittently applied from the slit nozzle of the discharge means.

Further, the present invention can be characterized in that it is a large-sized coated substrate having an area of 1 m ² or more manufactured by these single wafer coating apparatuses.

From another point of view, the manufacturing method of the single wafer application member to which the present invention is applied is a step of applying a liquid material by die coating to an application member of a single wafer, and applied to the application member. The step of applying the liquid material includes forming a predetermined liquid reservoir before the relative movement between the discharge unit for discharging the liquid material and the member to be coated, and then performing the relative movement. It starts, and discharge of the liquid material from a discharge part is started after a predetermined time passes after starting a relative movement. Here, the member to be coated may be a substrate having an area of 1 m ² or more.

  ADVANTAGE OF THE INVENTION According to this invention, the favorable coating performance can be ensured at the time of the application | coating of a large sized substrate, generation | occurrence | production of a liquid shortage defect can be suppressed, and favorable coating performance can be ensured.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
The description of the constituent requirements described below is an example (representative example) of the embodiment of the present invention, and the present invention is not limited to these contents.
FIG. 1 is a diagram showing an overall configuration of a die coat type coating apparatus (single sheet coating apparatus) to which the present embodiment is applied. The die coat type coating apparatus shown in FIG. 1 includes a pressurized tank 11 for storing a fluid material (coating liquid and coating material), a deaeration module 12 for removing residual air, a pump 13 for feeding the fluid material, and an operation of the pump 13. Switching valves 14 and 15 that perform switching operations according to the above, a filter 16 that removes wear powder from the piston of the pump 13, a pressure sensor 17 that measures the pressure of the fluid material to be discharged, and a slit-like opening when sliding in the horizontal direction A die 18 as a paint discharger that discharges the fluid material from the substrate and applies the fluid material to the substrate, which is a member to be coated, an air vent valve 19 for performing air venting when air engagement occurs in the piping system, Dispensing roll 21 for pre-coating, doctor blade 22 for scraping off the fluid material attached to the dispensing roll 21, And a plate 29 for placing the substrate is wood. Moreover, the control part 30 which controls the discharge flow rate from the die | dye 18 and the application | coating speed (movement speed) of the die | dye 18 is provided. In addition to these controls, the control unit 30 performs overall control of various operations of the die coat type coating apparatus.

  The pressurized tank 11 is pressurized by, for example, about 10 kPa, and cavitation occurs when the fluid material is charged by being sucked by the pump 13 and charged with the fluid material. The fluid material is pressurized to such an extent that it does not become. The deaeration module 12 is provided between the pump 13 and the pressurized tank 11 and removes residual air (dissolved oxygen, nitrogen, etc.) dissolved in the fluid material. If this residual air is present, bubbles will appear due to a slight pressure change.For example, the outside of the hollow fiber is decompressed by a module through which the hollow fiber passes to function to remove dissolved gas. doing. The pump 13 is a positive displacement type flow rate pump such as a syringe pump, and is connected to two switching valves 14 and 15. The pump 13 is switched at the outlet or the inlet by these switching valves 14 and 15 and repeats suction and discharge. . However, it is also possible to use a three-way valve instead of providing the switching valves 14 and 15 comprising two-way valves.

  A filter 16 is provided in the piping from the outlet of the pump 13 to the die 18. In general, a resin material is often used as the material of the filter 16. However, when the housing is deformed by pressure, it may hinder the adjustment of the discharge amount based on the pressure measurement. Stainless steel that is not easily deformed is used for the housing to be formed. This filter 16 is provided as a countermeasure against foreign matter by removing wear powder generated from the piston of the pump 13. The pressure sensor 17 is required to have a high response and high rigidity such as a semiconductor gauge diaphragm sensor, and a sensor having a response speed of 1 ms or less is used. Further, in FIG. 1, the pressure sensor 17 is provided on the outlet side of the filter 16, but may be provided on the inlet side of the filter 16. However, it is preferable to arrange at a position close to the die 18 where the liquid pool is generated as in the position of FIG.

The die 18 is made of stainless steel, has a thickness of about 30 to 300 mm, and is designed to be slightly wider on both sides than the width of the member to be coated (substrate). In the present embodiment, the length of the die 18 is much longer than that of the conventional one so that the coating can be applied to a large substrate having an area of 1 m ² or more. The die 18 is also thickened to prevent distortion that tends to occur because the die 18 is long. As a result, the weight of the die 18 is very high. The tip of the die 18 is provided with a slit (width of about 20 to 200 μm) for discharging a fluid material at the center, and the width of the slit 18 protrudes from the side end of the die 18 at an angle of about 45 ° on both sides of the slit. A lip of about ~ 1000 μm is formed. The fluid material supplied to the die 18 is supplied to the substrate and the dispense roll 21 through this slit. The die 18 having such a shape is placed on a surface plate 29 via slider portions provided on both sides, and is slid on the substrate by a linear motor. In addition, upper and lower sensors and actuators are provided on the slider portion, and the heights of both sides of the die 18 are adjusted by these to maintain the distance between the lip and the substrate within a predetermined range (for example, about 100 μm).

  With such a configuration, the die 18 slides on the surface plate 29 at about 100 mm / sec, and the liquid material discharged from the slit of the die 18 is stretched by a lip, while maintaining a uniform film thickness. Application work is being performed. Since the substrate to be coated in this embodiment is larger than the conventional substrate, when the traveling speed of the die 18 is the same as the conventional speed, the time required for the coating operation becomes very long. End up. Therefore, in order to improve the manufacturing operation rate, the speed of the die 18 is increased as compared with the conventional one.

The dispense roll 21 is, for example, a roll material having a diameter of about 20 to 100 mm, and the length is configured to be at least longer than the length of the die 18, and is formed by applying a predetermined plating process to an iron material or a stainless steel material. .
FIG. 2 is a view for explaining the positional relationship between the die 18 and the dispense roll 21. The die 18 is disposed on the top of the dispense roll 21 and performs preliminary coating before coating (actual coating) on a substrate that is an actual coating object. The dispensing roll 21 rotates at a peripheral speed that substantially matches the speed of the die 18 that moves on the surface plate 29. Further, the distance d between the die 18 and the dispensing roll 21 is substantially equal to the distance maintained between the die 18 and the substrate in the actual application on the substrate. Note that, instead of the dispensing roll 21, it is also possible to perform preliminary coating on a relatively moving plate material or the like.

Here, the relationship between the discharge flow rate Q from the die 18 and the coating speed V of the die 18 will be described.
FIGS. 3A and 3B are diagrams showing examples of the relationship between the discharge flow rate Q and the coating speed V in an ideal state and when a conventional small substrate is applied. The changes of the discharge flow rate Q from the die 18, the coating speed V, and the virtual film thickness H = Q / V are shown corresponding to the time axis (horizontal axis). In the ideal state shown in FIG. 3A, the time from the start of application until the discharge flow rate Q becomes stable is equal to the time from the start of application until the die 18 reaches a constant speed, and the rise time T Almost matches. For example, when the rising time T is 0.2 seconds, in order to ensure the uniformity of the film thickness during the rising time T, a paint reservoir (liquid reservoir) is secured in advance before the start of coating, The initial bead amount is secured. The acceleration distance L of the die 18 until the rise time T is
L = 1/2 x V x T
It is represented by

  In the example shown in FIG. 3B, as a conventional technique when a small substrate is applied, a large initial bead amount that is a liquid pool is secured, and the rise of the discharge flow rate Q from the die 18 is set to the rise time T. An example of delaying is shown. When the initial bead amount is reduced and narrowed down, the coating liquid (liquid material) is intermittently applied while being discharged from the slit nozzle, and the coating liquid is not partially connected in the longitudinal direction of the die 18, and the area is partially missing. And a so-called liquid shortage defect is likely to occur. Therefore, a large initial beat amount is secured, and the rising of the discharge flow rate Q is delayed so that the virtual film thickness becomes undershoot. As a result, the film thickness can be controlled while preventing the liquid shortage defect by controlling the initial beat amount.

4 (a) and 4 (b) are diagrams showing the relationship between the discharge flow rate Q and the coating speed V before and after countermeasures for coating on a large substrate. As described above, in order to apply a large substrate using the die 18, it is necessary to enlarge the die 18, and the weight of the die 18 also increases significantly. Moreover, since the substrate which is a member to be coated is increased in size, it is necessary to increase the speed of the die 18 in order to improve the manufacturing operation rate. However, if the speed of the die 18 is suddenly increased to increase the acceleration, the load applied to the drive source such as the linear motor becomes very large, and the heat generated from the drive source also increases, thereby increasing the acceleration. There are limits. As a result, in the application to the large substrate, the rise of the relative movement speed between the die 18 serving as the discharge unit and the substrate serving as the member to be coated is delayed, and the rise time of the application speed V compared to the rise time Tq of the discharge flow rate Q. Tv increases.
Note that it is not preferable to lengthen the rising time Tq of the discharge flow rate Q. This is because if the pump 13 constituted by a syringe pump or the like is started slowly, the stability and reproducibility of operation deteriorates due to friction of the piston and the like.

FIG. 4A shows the state of the virtual film thickness H when Tq <Tv. Since the coating speed V rises slowly, the virtual film thickness H becomes overshooting at the beginning of coating. The die 18 is intermittently applied while discharging a liquid material from a slit nozzle to a member to be applied that is in a relative movement relationship. However, if the initial bead amount is reduced in order to adjust this overshoot, the die 18 In the longitudinal direction of 18, the liquid is not partially connected, and the coated part is partially lost.
Thus, as a result of the intensive studies by the inventors, it has been found that these problems can be solved by delaying the application start time of the discharge flow rate Q in accordance with the rising time Tv to the application speed V. That is, as shown in FIG. 4 (b), by ensuring the timing Tm of the start delay of the liquid material supply, the virtual film thickness H can be made undershoot, which is favorable by controlling the initial bead amount. It was discovered that an initial film thickness can be obtained.

Here, the definition of the rising time of the discharge flow rate Q and the coating speed V will be described.
FIGS. 5A and 5B are diagrams showing two examples for defining the rise time. In this embodiment, as shown in FIGS. 5 (a) and 5 (b), a tangent line tangent to the maximum point (inflection point) of the slope is drawn, the intersection with the time axis is set as the rising start point, and the steady state asymptote Let the intersection with the rise end point. The interval between the rising start point and the rising end point is defined as a rising time (Tq or Tv).

6-8 is a figure for demonstrating the film thickness state of the application | coating start part by the difference in the timing Tm of the start delay of liquid material supply.
First, in FIGS. 6A and 6B, Tm = 0, that is, as shown in FIG. 4A, the movement of the die 18 is started without delaying the start of liquid material supply from the die 18 serving as a discharge unit. At the same time, the initial film thickness is shown when the liquid material is supplied. FIG. 6A shows the change in the discharge flow rate Q and the coating speed V over time in a ratio where the steady state is 100, with time on the horizontal axis. It can be seen that the discharge flow rate Q rises in a shorter time than the coating speed V. FIG. 6B shows the change from the coating start end to a predetermined distance with respect to the film thickness at the coating start stage of the film formed under the conditions of FIG. 6A. The initial bead amount is 72 μl, 113 μl, Four types of 178 μl and 261 μl are given. The film thickness is indicated by the chromaticity (y value) of the C light source in the CIE display system in the case where a green resist is used. For example, the target value is 0.54. In the local range, a substantially linear correlation is obtained. It can be understood that the start of coating is thick with respect to the reference film thickness y = 0.54, and control by the initial bead amount is almost impossible. Although the initial bead amount becomes 72 μl, it seems like an undershoot, but at this initial bead amount, the liquid runs out.

  FIGS. 7A and 7B show the state of the initial film thickness when Tm = 100, that is, when the start of liquid material supply is greatly delayed from the start of movement of the die 18. The meaning of each axis is the same as in FIG. FIG. 7A shows changes in the discharge flow rate Q and the coating speed V over time. The film thickness at the start of coating of the film shown in FIG. 7B is greatly undershooted when the initial bead amounts are 72 μl, 113 μl, and 178 μl. = 0.54 can be obtained. However, in order to obtain a predetermined film thickness, it is necessary to greatly increase the initial bead amount, and the nozzle tip of the die 18 becomes dirty.

  On the other hand, FIGS. 8A and 8B show the state of the initial film thickness when Tm = 50, that is, when the start of the liquid material supply is delayed by a preferable time from the start of the movement of the die 18. The meaning of each axis is the same as in FIGS. The film thickness at the start of coating of the film shown in FIG. 8 (b) varies well from the undershoot side according to the level of each initial bead amount of 72 μl, 113 μl, 178 μl, and 261 μl. It can be understood that the film thickness can be sufficiently controlled.

From the above examination results, the rising time Tq of the discharge flow rate Q, the rising time Tv of the coating speed V, and the timing Tm of the start delay of the liquid material supply in a good state as shown in FIG. Applicant has found that the following relational expression is satisfied.
Tv × 0.5 ≦ Tq + Tm ≦ Tv × 1.5

First, when Tq + Tm is smaller than Tv × 0.5, for example, as shown in FIG. 6B, the film thickness overshoot at the coating start portion cannot be suppressed, and the initial bead amount cannot be increased sufficiently. As a result, a liquid breakage defect is likely to occur, and the manufacturing yield may be reduced.
Further, if Tq + Tm is larger than Tv × 1.5, for example, as shown in FIG. 7B, the film thickness undershoot at the coating start portion becomes excessive, and it is necessary to greatly increase the initial bead amount. As a result, contamination of the nozzle tip becomes a problem.
Therefore, by determining the timing Tm of the start delay in supplying the liquid material so as to satisfy the above relational expression, it is possible to form an appropriate film thickness by controlling the initial bead amount as shown in FIG. 8B, for example.

Next, a method for manufacturing a coated substrate to which the present embodiment is applied will be described.
FIG. 9 is a diagram showing a flow of a method for manufacturing a color filter used in a liquid crystal display as one method for manufacturing a coated substrate. First, in a BM (black matrix) process, a photoresist is patterned on glass with a Cr thin film, and a black matrix is formed by a method of etching Cr using the photoresist as a mask (step 201). Thereafter, the process proceeds to a red pixel generation process (step 202), a green pixel generation process (step 203), and a blue pixel generation process (step 204). Next, a protective film is formed in the overcoat process (step 205), ITO (conductive film) is formed in the sputtering process (step 206), and then, for example, a photospacer process for coating and patterning a photospacer material is performed. It is executed (step 207). Finally, visual inspection or the like is performed in the inspection process (step 208), and the color filter manufacturing process is completed. Steps 205, 206, and 207 may omit one or more of these steps.

  In step 202 to step 204, only the fluid material is different in the order of color R (red) → G (green) → B (blue) by patterning a photoresist as a raw material of each pixel on glass. The same process is repeated three times. For example, in step 202, the substrate is first cleaned (step 211). Next, liquid material application by die coating, which is a characteristic configuration in the present embodiment, is executed (step 212). In the step of applying a liquid material by die coating in step 212, a coating operation by the above-described coating method is performed by a die coating type coating apparatus as shown in FIG. That is, first, the die 18 is moved to the position of the dispense roll 21 and preliminary coating is performed. The die 18 is moved to the position of the surface plate 29. For example, after the die 18 performs a preliminary slide and the height is adjusted, the die 18 slides on the substrate placed on the surface plate 29. Application work is performed. At this time, a liquid pool having a predetermined initial bead amount is first formed from the die 18. Then, after the movement of the die 18 is started, the liquid material supply from the slit of the die 18 is started by the operation of the pump 13 after the timing Tm of the start delay of the liquid material supply described above has elapsed. By applying by such a work procedure, in general, it is more uniform in the die coating type application in which it is difficult to control the uniformity at the start of coating (when the movement of the die 18 starts) and at the end of coating (when the die 18 stops). Application becomes possible.

  After the step 212, in order to cure the applied fluid material, after the solvent is blown off in the vacuum chamber, the prebaking step is performed by heating (50 to 100 ° C.) with a hot plate (step 213). Thereafter, proximity exposure using a photomask is performed (step 214), and spray development using an alkali developer is performed (step 215). Then, after the automatic inspection process (step 216), a baking process at a high temperature again, that is, a heat curing baking process (about 200 ° C. or higher for about 30 to 120 minutes) is performed (step 217). By repeating the steps 211 to 217 three times, it is possible to obtain a coated substrate in which R, G, and B color filters are formed on the substrate.

  As described above, according to the present embodiment, it is possible to satisfactorily apply to a large substrate by appropriately setting the discharge timing of the coating liquid (liquid material) and increasing the initial bead amount of the liquid pool. Thus, it is possible to suppress a liquid shortage defect. As a result, it is possible to suppress the manufacturing yield and improve the quality when manufacturing the coated substrate. In addition, the application condition can be determined quickly, and the production operation rate can be improved. Furthermore, the acceleration time can be relaxed when the die 18 is moved, and the cost of the apparatus can be reduced and the operation can be stabilized. In addition, it is possible to widen the corresponding margin due to the difference in coating liquid characteristics, and it is possible to expand the product variety.

  The present invention is, for example, a method for manufacturing a single-wafer coating member such as a display member, a vacuum drying treatment method in the manufacturing method, a vacuum drying processing apparatus that actually performs vacuum drying processing, and a device manufactured thereby It can be applied to a coated substrate or the like.

It is the figure which showed the whole structure of the die coat type coating device (single wafer coating device) to which this Embodiment is applied. It is a figure for demonstrating the positional relationship of a die | dye and a dispense roll. (a), (b) is the figure which showed the example in the case of an ideal state, and the case of apply | coating the conventional small board | substrate about the relationship between the discharge flow rate Q and the application | coating speed V. FIG. (a), (b) is the figure which showed the relationship between the discharge flow rate Q and the coating speed V before and after countermeasures about application | coating to a large sized substrate. (a), (b) is the figure shown about two examples which define a rise time. (a), (b) shows the initial film thickness when Tm = 0, ie, when the liquid material is supplied simultaneously with the start of the movement of the die without delaying the start of the liquid material supply. (a), (b) shows the state of the initial film thickness when Tm = 100, that is, when the start of liquid material supply is greatly delayed from the start of movement of the die. (a), (b) shows the state of the initial film thickness when Tm = 50, that is, the start of the liquid material supply is delayed by a preferable time from the start of the movement of the die. It is the figure which showed the flow of the manufacturing method of the color filter used for a liquid crystal display as one of the manufacturing methods of a coating substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 ... Pressurized tank, 12 ... Deaeration module, 13 ... Pump, 14, 15 ... Switching valve, 16 ... Filter, 17 ... Pressure sensor, 18 ... Die, 19 ... Air vent valve, 21 ... Dispensing roll, 22 ... Doctor Blade, 29 ... surface plate, 30 ... control unit

Claims (9)

A sheet-fed application method for applying a liquid material to a member to be coated on a sheet,
A relative movement of the liquid material discharge portion and the member to be coated;
A single-wafer coating method including a step of starting the discharge of the liquid material from the discharge unit with a significant delay from the start of the relative movement.   2. The single wafer coating method according to claim 1, further comprising a step of forming a liquid pool having a predetermined initial bead amount on the member to be coated before the relative movement is started.   2. The single wafer coating method according to claim 1, wherein a rising time Tv of the relative movement speed is longer than a rising time Tq of the liquid material discharge flow rate from the discharge unit. In the step of starting the discharge of the liquid material from the discharge unit, the timing of the start delay of the liquid material supply is Tm.
Tv × 0.5 ≦ Tq + Tm ≦ Tv × 1.5
The single wafer coating method according to claim 3, wherein the relational expression is satisfied. A discharge means for discharging a liquid material to be applied to a member to be coated on a sheet to the member to be coated;
Moving means for relatively moving the discharge means and the member to be coated;
The discharging means starts discharging the liquid material after a predetermined time has elapsed from the start of the relative movement by the moving means when applying the member to be coated at a predetermined supply discharge flow rate according to the relative movement by the moving means. A single wafer coating apparatus characterized by that.   6. The single wafer coating apparatus according to claim 5, wherein the discharge unit forms a liquid pool having a predetermined initial bead amount on the coated member before the relative movement by the moving unit is started. A coated substrate having an area of 1 m ² or more manufactured by the single wafer coating apparatus according to claim 5. A step of applying a liquid material by die coating to a member to be coated;
Curing the liquid material applied to the member to be coated,
In the step of applying the liquid material, a predetermined liquid pool is formed before the relative movement between the discharge unit for discharging the liquid material and the member to be coated, and then the relative movement is started and the relative movement is started. A method for manufacturing a single-wafer coating member, wherein the discharge of the liquid material from the discharge portion is started after a predetermined time has elapsed. The method for manufacturing a single wafer coating member according to claim 8, wherein the member to be coated is a substrate having an area of 1 m ² or more.

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