JP2005347660A - Surface mount component mounting structure and mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure and a mounting method for a surface mounting component that is small and easy to mount.
The mounting structure of a surface mounting component according to the present invention includes first and second surface mounting components having main body portions 1a and 2a and a plurality of electrodes 1b and 2b provided on the lower surfaces of the main body portions 1a and 2a. 1 and 2 and a circuit board 3 having a plurality of land portions 4 and 5 to which the electrodes 1b and 2b are soldered, and the first and second surface mount components 1 and 2 are respectively connected to the main body portion 1a, Since the electrodes 1b and 2b of the first and second surface-mounted components 1 and 2 are soldered to the land portions 4 and 5 in a state where the adjacent side surfaces of 2a are in contact with each other, the first and second The degree of integration of the surface mount components 1 and 2 can be improved, the area of the circuit board 3 can be reduced, and the size can be reduced.
[Selection] Figure 1

Description

  The present invention relates to a mounting structure for a surface-mounted component suitable for application to various electronic circuit units and the like that require a reduction in size, and a mounting method therefor.

  FIG. 4 is a front view showing a conventional surface mounting component mounting structure, and FIG. 5 is an explanatory diagram showing a conventional surface mounting component mounting method. It is.

  Next, the configuration of the conventional surface mounting component mounting structure will be described with reference to FIG. 4. The first and second surface mounting components 51 and 52 made of semiconductor chips are respectively box-shaped body portions 51a and 52a. And a plurality of electrodes 51b and 52b provided on the lower surfaces of the main body portions 51a and 52a.

  The circuit board 53 is provided with a wiring pattern, and has a plurality of first and second land portions 54 and 55 provided in the wiring pattern. The first and second surface mount components 51 and 52 are The electrodes 51b of the first surface mount component 51 are connected to the first land portion 54 by the aluminum electrode 56 in a state where the main body portions 51a and 52a are separated from each other, and the electrodes of the second surface mount component 52 are also connected. 52 b is connected to the second land portion 55 by an aluminum electrode 56.

  The conventional mounting structure of the surface mounting component has a low degree of integration and requires a large circuit board 53 because the main body portions 51a and 52a of the first and second surface mounting components 51 and 52 are mounted apart from each other. , Become large.

  Next, a conventional surface mounting component mounting method will be described with reference to FIG. 5. First, as shown in FIG. 5, the electrodes 51 b and 52 b of the first and second surface mounting components 51 and 52 are disposed below. An aluminum electrode 56 protruding to the surface is formed.

  Next, as shown in FIG. 5, the circuit board 53 is placed on the stage 57, and the first and second surface mount components 51 and 52 are placed on the circuit board 53. The first surface mount component 51 is pressed against the circuit board 53 side by the pressurizing and heating jig 58 to pressurize and heat the electrode 51b of the first surface mount component 51 by the aluminum electrode 56. Connected to the land portion 54 of the main body.

  Next, the pressurizing / heating jig 58 is moved to the second surface mount component 52 side, and the pressurizing / heating jig 58 is used to press the second surface mount component 52 against the circuit board 53 side. When the electrode 52b of the second surface mounting component 52 is connected to the second land portion 55 by the aluminum electrode 56 by pressure and heating, the mounting of the surface mounting component is completed.

In the conventional surface mounting component mounting method, the first and second surface mounting components 51 and 52 are pressed against the circuit board 53 by the pressurizing and heating jig 58. This is cumbersome, has poor productivity, and tends to cause misalignment between the electrodes 51b, 52b and the first and second land portions 54, 55 when pressed by the pressurizing / heating jig 58. (For example, see Patent Document 1)

JP-A-6-349892

  The conventional mounting structure of the surface mounting component has a low degree of integration and requires a large circuit board 53 because the main body portions 51a and 52a of the first and second surface mounting components 51 and 52 are mounted apart from each other. There is a problem of becoming large.

In addition, the conventional surface mounting component mounting method is such that the first and second surface mounting components 51 and 52 are pressed against the circuit board 53 by the pressurizing and heating jig 58. Troublesome, inferior in productivity, and easily misaligned between the electrodes 51b and 52b and the first and second land portions 54 and 55 when pressed by the pressing and heating jig 58. There is.

  Accordingly, an object of the present invention is to provide a mounting structure for a surface-mounted component that is small in size and easy to mount, and a mounting method thereof.

  As a first means for solving the above-mentioned problems, a main body part, first and second surface mount components having a plurality of electrodes provided on the lower surface of the main body part, and a plurality of the electrodes to be soldered And the first and second surface-mounted components in a state where adjacent side surfaces of the main body portions are in contact with each other. Each of the electrodes was soldered to the land portion.

As a second solution, each of the electrodes of the first and second surface mount components is opposed to the land portion, and the electrode and the land portion facing each other are soldered. It was set as the structure by which the surface area was formed equally.
As a third solution, the first and second surface mount components are formed of semiconductor chips.

  Further, as a fourth solving means, there are a main body portion, first and second surface mount components having a plurality of electrodes provided on the lower surface of the main body portion, and a plurality of land portions to which the electrodes are soldered. A circuit board, and a solder bump provided on the electrode in a state of projecting downward, with a gap between the main body parts so as to shift the position of the electrode with respect to the land part, and In a state where the solder bump is placed at a position off the center of the land portion, the first and second surface mount components are placed on the circuit board, and then the solder bump is melted by heating. The first and second surface mount components are moved by the surface tension of the melted solder so that the first and second surface mount components approach each other, and the side surfaces of the main body portions are in contact with each other. Each of the above Pole was soldered mounting method to the land portion.

  As a fifth solution, the electrodes of the first and second surface mount components are soldered opposite to the land portion, and the electrode and the land portion facing each other are The mounting method was such that the surface areas to be soldered were equal.

  The mounting structure of the surface mount component according to the present invention includes a main body portion, first and second surface mount components having a plurality of electrodes provided on the lower surface of the main body portion, and a plurality of land portions to which the electrodes are soldered. Each of the first and second surface mount components is in a state where the adjacent side surfaces of the main body portions are in contact with each other, and the electrodes of the first and second surface mount components are land portions. Therefore, the degree of integration of the first and second surface mount components can be improved, the area of the circuit board can be reduced, and the size can be reduced.

  In addition, the electrodes of the first and second surface mount components are opposed to the land portion, and the electrodes and the land portion facing each other have the same surface area to be soldered. The self-alignment of the surface mount component can be accurately performed, and a reliable soldering of the first and second surface mount components can be obtained.

  In addition, since the first and second surface mount components are formed of semiconductor chips, the semiconductor chips are often used in electronic circuit units, and thus are suitable for application to semiconductor chips.

  In addition, a main body part, first and second surface-mounted components having a plurality of electrodes provided on the lower surface of the main body part, a circuit board having a plurality of land parts to which the electrodes are soldered, and projecting downward A solder bump provided on the electrode in a state, a gap is provided between the main body parts so as to shift the position of the electrode with respect to the land part, and the position where each solder bump deviates from the center of the land part After mounting the first and second surface mount components on the circuit board, the solder bumps are melted by heating, and the first and second surface mounts are made by the surface tension of the melted solder. Since the components are moved so as to approach each other and the respective side surfaces of the main body portions are in contact with each other, the respective electrodes of the first and second surface mount components are soldered to the land portions. Self-alignment of surface mount components The mounting of the first and second surface mount components can be improved, the area of the circuit board can be reduced, and the size can be reduced. .

  In addition, each electrode of the first and second surface mount components is soldered opposite to the land portion, and the electrode and the land portion facing each other have the same surface area to be soldered. The first and second surface mount components can be accurately self-aligned, and a reliable soldering of the first and second surface mount components can be obtained.

  FIG. 1 is a front view showing a mounting structure for a surface mounting component according to the present invention, and FIG. 2 shows a mounting method for the surface mounting component according to the present invention. FIG. 3 is an explanatory view showing a first step, and FIG. 3 is an explanatory view showing a second step of the mounting method of the surface mount component of the present invention.

  Next, the structure of the mounting structure of the surface mount component according to the present invention will be described with reference to FIG. 1. The first and second surface mount components 1 and 2 made of a semiconductor chip or the like are respectively a box-shaped main body 1a, 2a and a plurality of electrodes 1b and 2b provided on the lower surfaces of the main body portions 1a and 2a.

  The circuit board 3 formed of one or a multi-layer substrate is provided with a wiring pattern and has a plurality of first and second lands 4 and 5 provided in the wiring pattern, and the first The land portion 4 is formed as a land group for soldering the electrode 1 b of the first surface mount component 1, and the second land portion 5 is soldered to the electrode 2 b of the second surface mount component 2. It is formed as a group of lands.

  The first and second surface mount components 1 and 2 have the electrodes 1b of the first surface mount component 1 soldered to the first land portion 4 while the side surfaces of the main body portions 1a and 2a are in contact with each other. 6 and the electrode 2b of the second surface mount component 2 is soldered to the second land portion 5.

  When the first and second surface mount components 1 and 2 are soldered 6, the electrode 1 b of the first surface mount component 1 is in a state of facing the first land portion 4, and The electrode 2 b of the second surface mount component 2 is in a state of facing the second land portion 5.

  Furthermore, the electrode 1b and the first land portion 4 facing each other have the same surface area to which the solder 6 is attached, and the electrode 2b and the second land portion 5 facing each other have a surface area to which the solder 6 is attached. As a result, the surface tension due to the melted solder during soldering effectively acts between the electrode 1b and the first land portion 4 and between the electrode 2b and the second land portion 5. The electrode 1b and the first land portion 4 and the electrode 2b and the second land portion 5 can be in a state of being opposed to each other.

  In this embodiment, the electrodes 1b and 2b and the first and second land portions 4 and 5 are described as having the same surface area to which the solder 6 is attached. The two surface mount components may be different.

  Next, the mounting method of the surface mount component according to the present invention will be described with reference to FIGS. 2 and 3. First, as shown in FIG. 2, the electrodes 1b and 2b of the first and second surface mount components 1 and 2 are used. For this, solder bumps 7 projecting downward are formed.

  Next, as shown in FIG. 2, a gap is provided between the main body portions 1a and 2a so as to shift the positions of the electrodes 1b and 2b with respect to the first and second land portions 4 and 5, respectively. The first and second surface mount components 1 and 2 are placed on the circuit board 3 in a state where the solder bumps 7 are placed at positions away from the centers of the first and second land portions 4 and 5. To do.

Next, when transported into the reflow furnace in this state, as shown in FIG. 3, the solder bumps 7 are melted by heating, and the surface tension of the melted solder causes the first and second surface mount components 1 and 2 to move. As shown in FIG. 1, the first and second surface mount components 1 and 2 are brought into a state in which the side surfaces of the main body portions 1 a and 2 a are in contact with each other. The two electrodes 1b and 2b are soldered 6 to the first and second land portions 4 and 5 to complete the mounting of the surface mount component.
That is, when the solder bump 7 is melted, each of the first and second surface mount components 1 and 2 is self-aligned.

The front view which shows the attachment structure of the surface mounting component of this invention. Explanatory drawing which shows the 1st process of the mounting method of the surface mounting components of this invention. Explanatory drawing which shows the 2nd process of the mounting method of the surface mounting components of this invention. The front view which shows the attachment structure of the conventional surface mounting component. Explanatory drawing which shows the attachment method of the conventional surface mount component.

Explanation of symbols

1: First surface mount component 1a: Main body portion 1b: Electrode 2: Second surface mount component 2a: Main body portion 2b: Electrode 3: Circuit board 4: First land portion 5: Second land portion 6: Solder 7: Solder bump

Claims (5)

A first and second surface mount components having a main body portion and a plurality of electrodes provided on a lower surface of the main body portion; and a circuit board having a plurality of land portions to which the electrodes are soldered. The second surface mount component has the electrodes of the first and second surface mount components soldered to the land portions in a state where adjacent side surfaces of the main body portions are in contact with each other. The mounting structure of the surface mount component characterized by this. Each of the electrodes of the first and second surface mount components is opposed to the land portion, and the electrode and the land portion facing each other are formed with equal surface areas to be soldered. The mounting structure of the surface-mounted component according to claim 1. 3. The mounting structure for a surface mounting component according to claim 1, wherein the first and second surface mounting components are formed of a semiconductor chip. First and second surface mount components having a main body portion and a plurality of electrodes provided on the lower surface of the main body portion, a circuit board having a plurality of land portions to which the electrodes are soldered, and a state protruding downward A solder bump provided on the electrode, and a gap is provided between the main body portions so as to shift the position of the electrode with respect to the land portion, and each solder bump is in the center of the land portion. After placing the first and second surface mount components on the circuit board in a state of being placed at a position away from the solder, the solder bumps are melted by heating, and the surface tension of the melted solder The first and second surface mount components are moved so as to approach each other, and the respective side surfaces of the main body portions are in contact with each other, and the electrodes of the first and second surface mount components are connected to the land portions. Solder to Mounting surface mount components, characterized in that it is. The electrodes of the first and second surface mount components are soldered opposite to the land portions, and the electrodes and the land portions facing each other have the same surface area to be soldered. The mounting method of the surface mount component according to claim 4, wherein the surface mount component is attached.

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