JP2004333161A - Inspection device and inspection method for film carrier tape for mounting electronic components - Google Patents

Abstract

Provided is an inspection device and an inspection method for an electronic component mounting film carrier tape that can inspect a wiring pattern defect using reflected light even in a portion where a solder resist layer is present on a wiring pattern surface. I do.
A guide member is provided along a transport direction of a film carrier tape for mounting electronic components, and guides the tape to a predetermined inspection position, and a predetermined distance from both edges of the guide member in an upper outer direction. Irradiation is performed by the irradiating unit on the irradiating unit 37 disposed on the substrate and the film carrier tape for mounting electronic components guided to a predetermined inspection position by the guide member, and the tape is reflected on the surface of the wiring pattern. A detecting unit 30 disposed above the guide member for detecting a defect in the wiring pattern of the tape by light.
[Selection diagram] FIG.

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, CSP (Chip Size Package) tape, ASIC (Application SpecifiC (Chip On Film) tape, two-metal (double-sided) tape, multilayer wiring tape, etc. (hereinafter simply referred to as “film carrier tape for electronic component mounting”) for detecting a defective wiring pattern of an electronic component. And a visual inspection apparatus.
[0002]
[Prior art]
With the development of the electronics industry, demand for printed wiring boards on which electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) are mounted has been rapidly increasing. There is a demand for higher functionality, and as a mounting method of these electronic components, recently, a film carrier for mounting electronic components such as a TAB tape, a T-BGA tape, an ASIC tape, a COF tape, a two metal (double-sided) tape, and a multilayer wiring tape. A mounting method using a tape is adopted. In particular, the importance thereof is increasing in the electronic industry using a liquid crystal display device (LCD), such as a personal computer, which is required to have a high definition, a low profile, and a small frame area of a liquid crystal screen.
[0003]
In such film carrier tapes for mounting electronic components, inspection of the quality of the film carrier tape for mounting electronic components has been carried out. However, conventionally, visual inspection (transmission light inspection, reflection light inspection), which is a visual inspection by a person, has been performed. ), And an inspection method of displaying a defective product by punching, inking, magic, or the like as a result of various quality inspections such as disconnection, short circuit, chipping, and projection.
[0004]
For this reason, conventionally, a single electronic component mounting film carrier tape in which one or a plurality of electronic component mounting portions are arranged in the width direction is unwound from an unwinding device, and a predetermined pattern is detected by a defective pattern detecting device. Inspection devices have been proposed in which the inspection is carried out by a winding device (see, for example, Patent Documents 1 to 5).
[0005]
That is, as shown in FIG. 4, in the conventional inspection apparatus 100, an electronic component mounting film carrier tape 102 on which one or a plurality of electronic component mounting units are arranged in the width direction is wound around a reel 104. ing. Then, the reel 104 is mounted on an unwinding shaft 108 of an unwinding device 106, and the unwinding device 106 unwinds the film carrier tape 102 for mounting electronic components.
[0006]
The film carrier tape 102 for mounting electronic components unwound from the unwinding device 106 is inspected by a defective pattern detection device 110 using a microscope 111 for a defective appearance of a wiring pattern of the film carrier tape 102 for mounting electronic components. In the case where a defective portion exists, for example, a defect is displayed by a marking device 112 such as punching.
[0007]
As described above, after the appearance inspection and the defect display process are completed, the electronic component mounting film carrier tape 102 is wound on the winding reel 118 mounted on the winding drive shaft 116 of the winding device 114. ing.
[0008]
[Patent Document 1]
JP 2001-35891 A
[Patent Document 2]
JP-A-2000-227401
[Patent Document 3]
JP 2000-182061A
[Patent Document 4]
JP-A-10-256278
[Patent Document 5]
JP-A-9-92692
[0009]
[Problems to be solved by the invention]
In the inspection apparatus using reflected light as shown in FIG. 4, as shown in FIG. 5, a partial cross-sectional view of the defective pattern detection apparatus 110 as viewed from the transport direction of the electronic component mounting film carrier tape 102 is shown by a microscope. A ring light 120 is provided below 111. The ring light 120 is configured to emit light to the surface of the electronic component mounting film carrier tape 102 being conveyed by the guide member 122. The irradiated light is reflected on the surface of the tape 102, and the reflected light is received (image received) by the microscope 111, and is visually inspected or printed by an automatic appearance inspection device using a CCD camera. Inspection of defects.
[0010]
As shown in FIG. 6, when the electronic component mounting film carrier tape 102 has the solder resist layer 128 on the wiring pattern 126, a part of the light transmitted through the solder resist layer 128 The reflected light is reflected on the surface of the pattern 126, and the reflected light is received (image-received) by the microscope 111 to inspect the wiring pattern for a defective appearance.
[0011]
However, in the conventional defective pattern detection device as shown in FIG. 5, the ring light 120 is disposed at a position substantially perpendicular to the electronic component mounting film carrier tape at the inspection position, and the ring light 120 is applied to the tape surface from that position. It is configured to emit light.
[0012]
Therefore, most of the light was reflected on the surface of the solder resist layer 128, and little light was transmitted through the solder resist layer. That is, in the portion where the solder resist layer 128 exists on the surface of the wiring pattern 126, the light reflected on the surface of the wiring pattern 126 is weaker than the light reflected on the surface of the solder resist layer 128, and The reflected light could not be fully recognized. Therefore, it is difficult to inspect the appearance defect of the wiring pattern below the solder resist layer, and it has not been possible to accurately inspect the quality of the film carrier tape for mounting electronic components.
[0013]
In the present invention, in consideration of such a current situation, when inspecting a defect of a wiring pattern of a film carrier tape for mounting electronic components using reflected light, a solder resist layer is present on the surface of the wiring pattern. It is an object of the present invention to provide an inspection device and an inspection method for a film carrier tape for mounting electronic components, which can easily inspect a wiring pattern for a defect in a portion.
[0014]
[Means for Solving the Problems]
The present invention has been invented in order to achieve the problems and objects in the prior art as described above, and the inspection device for an electronic component mounting film carrier tape of the present invention is an electronic component mounting film carrier tape. An inspection device including a defective pattern detection device for inspecting a defect of a wiring pattern,
The defective pattern detection device,
A guide member that is provided along the transport direction of the electronic component mounting film carrier tape and guides the tape to a predetermined inspection position,
An irradiating unit disposed at a predetermined distance in the upper outer direction from both edges of the guide member,
The irradiating unit irradiates light to the electronic component mounting film carrier tape guided to a predetermined inspection position by the guide member, and detects a defective wiring pattern of the tape by reflected light on the wiring pattern surface of the tape. And a detector disposed above the guide member.
[0015]
The irradiating unit is arranged such that light irradiated from the irradiating unit is reflected on a wiring pattern surface covered with a solder resist layer, and the reflected light causes the detecting unit to detect a defect in the wiring pattern. It is characterized by having been done.
[0016]
Further, the inspection method of the electronic component mounting film carrier tape of the present invention is an inspection method for inspecting the defect of the wiring pattern of the electronic component mounting film carrier tape,
Both ends of the electronic component mounting film carrier tape are guided to a predetermined inspection position by a guide member provided along a transport direction of the tape,
Irradiate light to the tape at a predetermined inspection position from an irradiation unit disposed at a predetermined distance in the upper outer direction from both edges of the guide member,
The reflected light on the surface of the wiring pattern of the tape is detected by a detection unit disposed above the guide member, and a defect of the wiring pattern is detected.
[0017]
The light reflected on the surface of the wiring pattern is light reflected on the surface of the wiring pattern covered with a solder resist layer.
With this configuration, since the surface of the film carrier tape for mounting electronic components at the inspection position is irradiated with light from the outside of the tape, the light does not strongly reflect on the surface of the solder resist layer of the tape. In other words, the detecting device detects the light reflected on the wiring pattern surface by the light reflected on the solder resist layer surface even in the portion where the solder resist layer is present on the wiring pattern surface of the electronic component mounting film carrier tape. , And it is possible to easily detect the appearance defect of the wiring pattern existing under the solder resist layer.
[0018]
Therefore, the inspection efficiency and the inspection accuracy of the film carrier tape for mounting electronic components are also extremely improved.
[0019]
Further, in the defective pattern detection device, it is preferable that a reflection plate is provided outside the irradiation device. Further, in the inspection method of the electronic component mounting film carrier tape of the present invention, the reflector reflects light from the irradiation device, and at least a part of the reflected light reflects on the electronic component mounting film carrier tape surface. Irradiating is also preferable.
[0020]
With this configuration, the film carrier tape for mounting electronic components is brightly illuminated over the entire width, and an accurate and accurate quality inspection can be performed.
[0021]
Further, it is preferable that the reflection plate has a substantially L-shaped cross section.
[0022]
With this configuration, the reflected light can be efficiently collected on the electronic component mounting film carrier tape, and the electronic component mounting film carrier tape is illuminated more brightly over the entire width. An accurate and accurate quality inspection can be performed.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments (examples) of the present invention will be described in more detail with reference to the drawings.
[0024]
In addition, when showing the same part in each drawing, the same code | symbol is described.
[0025]
FIG. 1 is a front view of an inspection device for a film carrier tape for mounting electronic components according to the present invention. As shown in FIG. 1, reference numeral 10 denotes an inspection device for a film carrier tape for mounting electronic components according to the present invention.
[0026]
As shown in FIG. 1, the inspection device 10 for the electronic component mounting film carrier tape includes an unwinding device 20, a defective pattern detecting device 30, a marking device 40, and a winding device 50.
[0027]
In the unwinding device 20, a film carrier tape T for mounting electronic components (hereinafter, also referred to as a tape T) wound around a reel R via a spacer S, and the reel R is driven to unwind. Mounted on the shaft 22.
[0028]
Then, by driving a drive motor (not shown), the unwinding drive shaft 22 rotates, and the film carrier tape T for mounting electronic components is fed out from the reel R together with the spacer S. 30.
[0029]
In FIG. 1, reference numeral 28 denotes a dancer roller for keeping the tension of the tape T constant by its own weight.
[0030]
The electronic component mounting film carrier tape sent out from the unwinding device 20 in this way passes through the guide roller 24 and is supplied to the defective pattern detecting device 30, where the wiring pattern is inspected for defects.
[0031]
The defective pattern detection device 30 will be described with reference to the drawings.
[0032]
FIG. 2 is a schematic partial cross-sectional view of the defective pattern detection device 30 as viewed from the transport direction of the film carrier tape for mounting electronic components, and FIG.
[0033]
As shown in FIGS. 2 and 3, the defective pattern detection device 30 basically includes a microscope 32 and a tape irradiation device 34. Further, the tape irradiating device 34 includes a guide member 36 for guiding the tape T to a predetermined inspection position, an irradiating section 37 disposed at a predetermined distance outward from both edges of the guide member 36 in an upper outer direction, It basically has a reflector 38 disposed outside the irradiation unit 37.
[0034]
The guide member 36 guides the electronic component mounting film carrier tape T to a predetermined inspection position, as shown in FIG. As shown in FIG. 2, the shape of the tape has a substantially U-shaped cross section, and is provided so as to project upward from both ends to guide both side ends T1 and T2 of the outermost tape T. , 39b.
[0035]
Steps 39c and 39d are formed on the side guides 39a and 39b, respectively, so that both end portions T1 and T2 of the outermost tape T are guided along the steps 39c and 39d. Has become.
[0036]
As a result, a gap 39e is formed between the side guides 39a and 39b. When the electronic component mounting film carrier tape T is transported, the tape T is not damaged by friction or the like. It is configured as follows.
[0037]
With this configuration, both end portions T1 and T2 of the film carrier tape T for mounting electronic components are guided by the side guide portions 39a and 39b of the guide member 36 and the step portions 39c and 39d. become.
[0038]
Therefore, in the defective pattern detection device 30, the electronic component mounting film carrier tape T does not bend in the width direction, that is, does not bend. As a result, at the inspection position, the focus position of the microscope 32 becomes constant. As a result, in the quality inspection that requires extremely high accuracy such as bending or missing of the inner lead, the microscope is not defocused and accurate and accurate. Good quality inspection can be performed.
[0039]
In this embodiment, an example using one electronic component mounting film carrier tape T is shown, but multiple electronic component mounting film carrier tapes may be used.
[0040]
Further, as shown in FIGS. 2 and 3, the tape irradiating device 34 is provided with a pair of irradiating portions 37 and 37 'spaced apart from both edges of the guide member 36 by a predetermined distance in the upper outward direction. The supporting means is provided so as to be substantially parallel to the transport direction of the electronic component mounting film carrier tape T.
[0041]
The irradiators 37 and 37 'are not particularly limited, but include a fluorescent lamp, an incandescent lamp, a halogen lamp, a xenon lamp, and the like, and it is preferable to use a fluorescent lamp. A fluorescent lamp having a power consumption of 4 to 15 W can be used.
[0042]
The position of the irradiation part 37 (37 ′) is not particularly limited, but as shown in FIG. 2, the horizontal distance a from the inner surface of the side guide part 39a is 10 to 70 mm, preferably 10 to 50 mm, Is preferably arranged such that the vertical distance b is 10 to 50 mm, preferably 10 to 30 mm.
[0043]
By irradiating the surface of the electronic component mounting film carrier tape T at the inspection position with light from the irradiating portions 37 and 37 'arranged at such positions, the portion where the solder resist layer is present on the surface of the wiring pattern is provided. In this case, it is also possible to easily inspect the wiring pattern for defects, thereby improving the accuracy and speed of the inspection.
[0044]
That is, even in a portion where the solder resist layer exists on the wiring pattern surface, the microscope 32 is not prevented from recognizing the light reflected on the wiring pattern surface by the light reflected on the solder resist layer surface, Defective wiring patterns covered with the solder resist layer can be detected.
[0045]
Further, as shown in FIG. 3, the length c of the irradiation unit 37 (37 ') in the tape transport direction is not particularly limited, but is preferably 50 to 350 mm. Since the irradiation units 37 and 37 'have such a length, the entire tape T at the inspection position can be brightly illuminated, and an accurate and accurate quality inspection can be performed.
[0046]
In the present embodiment, a description will be given of an example in which one irradiation section 37, 37 'is provided on each of both edges of the guide member 36, but a plurality of irradiation sections may be provided.
[0047]
Further, as shown in FIGS. 2 and 3, the tape irradiating device 34 has a reflector 38, 38 'supported by a support member (not shown), and is spaced apart from the irradiating portions 37, 37' by a predetermined distance. It is arranged.
[0048]
As shown in FIG. 2, the reflection plates 38 and 38 ′ have a substantially L-shaped cross section and are provided so as to be substantially parallel to the guide member 36.
[0049]
The reflector 38 (38 ') having a substantially L-shaped cross section is not particularly limited, but as shown in FIG. 3, the width f in the vertical direction is 20 to 50 mm, the width g in the tape transport direction is 50 to 350 mm, and the width is horizontal. The width h in the direction is preferably 20 to 100 mm.
[0050]
Since the reflectors 38, 38 'are formed in such a size, light from the irradiation units 37, 37' can be efficiently condensed on the surface of the tape T at the inspection position.
[0051]
Further, the reflectors 38, 38 'reflect the light from the irradiators 37, 37', and are arranged so that at least a part of the reflected light can irradiate the surface of the tape T located at a predetermined inspection position. ing.
[0052]
Although the position of such a reflection plate 38 (38 ') is not particularly limited, as shown in FIG. 2, the horizontal distance d from the inner surface of the side guide portion 39a is 20 to 120 mm, and the vertical distance e from the tape T surface is e. Is preferably set to be 20 to 90 mm.
[0053]
By providing the reflectors 38, 38 'at such positions, the tape is brightly illuminated over the entire width of the tape, and accurate and accurate quality inspection can be performed. Also, when inspecting multiple electronic component mounting film carrier tapes, since the light is brightly illuminated over the entire width of the tape running in parallel, it is possible to simultaneously apply a plurality of electronic component mounting film carrier tapes at once. On the other hand, accurate and accurate quality inspection can be performed.
[0054]
In the present embodiment, an example will be described in which the reflectors 38 and 38 'have a substantially L-shaped cross section. However, the shape is not particularly limited, and the light from the irradiation units 37 and 37' is used. Any shape may be used as long as it is reflected and at least a part of the reflected light can be applied to the surface of the electronic component mounting film carrier tape located at the predetermined inspection position.
[0055]
The reflecting plates 38 and 38 'are not particularly limited as long as they can reflect the light from the irradiation units 37 and 37', and are formed of a mirror, a plastic plate, a SUS plate, or the like provided with a mirror coating. In addition, it is only necessary that the inner surfaces 38a, 38a 'of such reflectors 38, 38' are formed of the above-mentioned material so that the light from the irradiation units 37, 37 'can be reflected.
[0056]
In this embodiment, an example in which the reflection plates 38 and 38 'are provided outside the irradiation units 37 and 37' will be described. However, the light from the irradiation unit does not affect the inspection of the wiring pattern for defects. However, this does not exclude an aspect in which a reflection plate is not provided.
[0057]
Further, in place of the microscope 32 shown in FIG. 2, a magnifying glass having a magnification (length) of 1.2 to 5 times for performing the above-described appearance inspection may be arranged in the defective pattern detection device 30. Good.
[0058]
The magnifying glass is configured by a magnifying lens that enlarges the film carrier tape in the entire width direction of the electronic component mounting film carrier tape T guided by the guide member 36. Such a lens is not particularly limited, but for example, a stereo microscope for low magnification, a single convex glass lens, or a Fresnel lens can be used.
[0059]
As shown in FIGS. 1 and 2, the defective pattern detection device 30 having such a tape irradiation device 34 performs, for example, an appearance inspection such as a disconnection, a short circuit, a chip, or a projection by using reflected light. A microscope 32 or a magnifying glass for visual inspection is disposed above the guide member 36.
[0060]
Next, an inspection method of the electronic component mounting film carrier tape T in the defective pattern detection device 30 having such a configuration will be described.
[0061]
The tape T supplied to the defective pattern detection device 30 having the above configuration is transported by the back tension roller 42 and the drive gear 44 shown in FIG.
[0062]
That is, as shown in FIGS. 2 and 3, both side ends T1 and T2 of the film carrier tape T for mounting electronic components in the defective pattern detecting device 30 are formed by the side guide portions 39a and 39b of the guide member 36. Is transported while being supported by the steps 39c and 39d.
[0063]
Then, when the drive gear 44 passes between the back tension roller 42 and the drive gear 44, the drive of the drive gear 44 is temporarily stopped, the feeding of the tape T is stopped, and the predetermined inspection position ( It stops at the upper part of the guide member 36).
[0064]
The control in this case is performed by controlling the rotation of the drive gear 44 by controlling an internal pulse caused by the rotation of a pulse motor which is a drive mechanism for driving the drive gear 44.
[0065]
Instead of controlling the rotation of the drive gear 44 by controlling the internal pulse generated by the rotation of a pulse motor, which is a drive mechanism for driving the drive gear 44, and stopping the conveyance of the film carrier tape, the sprocket hole of the tape T is used. It is also possible to detect the longitudinal position of the tape T via a light irradiation device that irradiates the longitudinal position with light such as laser light and a light receiving sensor.
[0066]
In this manner, the electronic component mounting film carrier tape T is positioned at a predetermined inspection position on the guide member 36, and the tape T is irradiated with light from the irradiation units 37 and 37 '. Further, the reflected light reflected on the surface of the wiring pattern is received (image received) by the microscope 32 arranged above the guide member 36 at a predetermined distance, and the wiring pattern is inspected for defects.
[0067]
By using such a defective pattern detecting device 30, it is possible to detect a defective wiring pattern even in a portion where a solder resist layer exists on the surface of the wiring pattern.
[0068]
Further, as shown in FIGS. 2 and 3, reflection plates 38 and 38 'are provided outside the irradiation units 37 and 37', and the light reflected by the reflection plates 38 and 38 'is used to mount electronic components. Since the film carrier tape is brightly illuminated over the entire width, accurate and accurate quality inspection can be performed.
[0069]
By using the defective pattern detection device 30 in which the reflection plates 38, 38 'are disposed outward of the irradiation units 37, 37' in this manner, in the portion where the solder resist layer exists on the surface of the wiring pattern, The defect detection rate of the wiring pattern is improved by about 10% as compared with the conventional defective pattern detection device.
[0070]
Since the reflectors 38, 38 'have a substantially L-shaped cross section as shown in FIGS. 2 and 3, the reflected light can be efficiently condensed on the film carrier tape for mounting electronic components. The film carrier tape for use is illuminated more brightly over the entire width, and more accurate and accurate quality inspection can be performed.
[0071]
Although not shown, such a defective pattern detection device 30 is provided with an input switch for judging a non-defective product or a defective product by inspection with the microscope 32 and inputting the position. Thereby, the predetermined position of the electronic component mounting portion, the position of the defective portion in the longitudinal direction of the tape, and the position of the defective portion in the width direction are input to the control device 60.
[0072]
As described above, the tape T whose wiring pattern has been inspected for defects by the defective pattern detection device 30 is subsequently supplied to the marking device 40 via the guide roller 54.
[0073]
Then, as shown in FIG. 1, the tape T supplied to the marking device 40 is based on the detection information of the defective portion detected by the defective pattern detection device 30 while passing through the guide roller 44 from the guide roller 42. Thus, defective portions are marked with ink, punching, or the like. As described above, after the marking device 40 performs the marking on the predetermined position of the defective portion on the front surface or the back surface of the tape T, the tape T passes through the guide roller 54 and is supplied to the next winding device 50. Is done.
[0074]
As shown in FIG. 1, the tape T supplied to the winding device 50 is wound on a reel R mounted on a winding drive shaft 52 by a drive motor (not shown) via a guide roller 54. As the shaft 52 rotates, the tape T is wound up. At this time, the spacer S unwound from the reel R of the unwinding device 20 is supplied to the reel R of the winding device 50 via the guide rollers 57 and 58 and is interposed between the tapes T. The tape T is protected from being damaged by contact.
[0075]
In FIG. 1, reference numeral 59 denotes a dancer roller for keeping the tension of the tape T constant by its own weight.
[0076]
In the above embodiment, as shown in FIG. 1, the inspection device 10 includes the unwinding device 20, the defective pattern detection device 30, the marking device 40, and the winding device 50. By omitting 40, the unwinding device 20, the defective pattern detecting device 30, and the winding device 50 are separately or integrally configured as an inspection device only, and the information inspected by this inspection device is separately configured. It is also possible to input the information to the marking device.
[0077]
The preferred embodiment of the present invention has been described above, but the present invention is not limited to this. For example, the above description is based on one electronic component mounting film carrier tape. Various changes can be made without departing from the object of the present invention, for example, the present invention can be applied to the case of inspecting a plurality of film carrier tapes for mounting electronic components.
[0078]
【The invention's effect】
According to the present invention, since the surface of the electronic component mounting film carrier tape at the inspection position is irradiated with light from the irradiation unit provided in the upper outer direction of the tape, the light is strongly applied on the surface of the solder resist layer of the tape. There is no reflection. In other words, even in a portion where the solder resist layer is present on the wiring pattern surface of the electronic component mounting film carrier tape, the light reflected on the wiring pattern surface can be recognized by the light reflected on the solder resist layer surface. Without being hindered, it is possible to easily detect a defect in the wiring pattern covered with the solder resist layer.
[0079]
Therefore, the inspection efficiency and the inspection accuracy of the film carrier tape for mounting electronic components are also extremely improved.
[0080]
Further, according to the present invention, the reflection plate is provided outside the irradiation unit. With this configuration, the film carrier tape for mounting electronic components is brightly illuminated over the entire width, and more accurate and accurate quality inspection can be performed.
[Brief description of the drawings]
FIG. 1 is a front view of an inspection device for a film carrier tape for mounting electronic components according to the present invention.
FIG. 2 is a schematic cross-sectional view of the tape irradiating device for a film carrier tape for mounting electronic components, as viewed from a transport direction.
FIG. 3 is a schematic perspective view of a tape irradiation device.
FIG. 4 is a front view of a conventional inspection device for a film carrier tape for mounting electronic components.
FIG. 5 is a partial cross-sectional view of the defective pattern detecting device of the film carrier tape for mounting electronic components in the conventional inspection device of FIG. 4, as viewed from the transport direction.
FIG. 6 is a schematic diagram showing a state in which light is reflected on the surface of the film carrier tape for mounting electronic components in the conventional inspection device of FIG. 4;
[Explanation of symbols]
10,100 Inspection device for film carrier tape for mounting electronic components
20,106 Unwinding device
22,108 Unwinding drive shaft
24, 54, 57, 58 Guide rollers
28,59 Dancer Roller
30,110 defective pattern inspection device
32,111 microscope
34 Tape irradiation device
36 Guide member
37, 37 'irradiation unit
38, 38 'reflector
38a, 38a 'inner surface
39a, 39b Side guide
39c, 39d step
39e void
40,112 Marking device
42 Back tension roller
44 Drive gear
50,114 winding device
52,116 Rewind drive shaft
60 control device
T, 102 Film carrier tape for mounting electronic components
R, 104, 118 reel
S spacer
T1, T2 side end
120 Ring Light
122 Guide member
126 Wiring pattern
128 Solder resist

Claims (8)

An inspection device including a defective pattern detection device for inspecting a defect of a wiring pattern of a film carrier tape for electronic component mounting,
The defective pattern detection device,
A guide member that is provided along the transport direction of the electronic component mounting film carrier tape and guides the tape to a predetermined inspection position,
An irradiating unit disposed at a predetermined distance in the upper outer direction from both edges of the guide member,
The irradiation unit irradiates light to the electronic component mounting film carrier tape guided to a predetermined inspection position by the guide member, and detects a defective wiring pattern of the tape by reflected light on the surface of the wiring pattern of the tape. And a detection unit disposed above the guide member. The irradiating section is arranged to reflect light irradiated from the irradiating section on the surface of the wiring pattern covered with the solder resist layer, and to cause the detecting section to detect a defect of the wiring pattern by the reflected light. The inspection device for a film carrier tape for mounting electronic components according to claim 1, wherein: The inspection apparatus for a film carrier tape for mounting electronic components according to claim 1, wherein the defective pattern detection apparatus includes a reflection plate provided outside the irradiation apparatus. 4. The apparatus according to claim 3, wherein the reflector has a substantially L-shaped cross section. 5. An inspection method for inspecting a defect of a wiring pattern of a film carrier tape for mounting electronic components,
Both ends of the electronic component mounting film carrier tape are guided to a predetermined inspection position by a guide member provided along a transport direction of the tape,
Irradiate light to the tape at a predetermined inspection position from an irradiation unit disposed at a predetermined distance in the upper outer direction from both edges of the guide member,
A method of inspecting a film carrier tape for mounting electronic components, comprising detecting a reflected light from a surface of a wiring pattern of the tape by a detection unit disposed above the guide member to detect a defect of the wiring pattern. 6. The method according to claim 5, wherein the light reflected on the surface of the wiring pattern is light reflected on the surface of the wiring pattern covered with a solder resist layer. A reflection plate is provided outward of the irradiation unit, and the reflection plate reflects light from the irradiation device, and at least a part of the reflected light irradiates the surface of the electronic component mounting film carrier tape. The method for inspecting a film carrier tape for mounting electronic components according to claim 5, wherein the inspection is performed. The method according to claim 7, wherein the reflector has a substantially L-shaped cross section.

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