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JP2004332068A - Clad aluminum alloy substrate for magnetic disk, and its production method - Google Patents

Clad aluminum alloy substrate for magnetic disk, and its production method Download PDF

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Publication number
JP2004332068A
JP2004332068A JP2003131595A JP2003131595A JP2004332068A JP 2004332068 A JP2004332068 A JP 2004332068A JP 2003131595 A JP2003131595 A JP 2003131595A JP 2003131595 A JP2003131595 A JP 2003131595A JP 2004332068 A JP2004332068 A JP 2004332068A
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Japan
Prior art keywords
mass
aluminum alloy
core material
magnetic disk
alloy substrate
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JP2003131595A
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Japanese (ja)
Inventor
Yoshinori Kato
良則 加藤
Hidetoshi Umeda
秀俊 梅田
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Kobe Steel Ltd
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Kobe Steel Ltd
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Priority to JP2003131595A priority Critical patent/JP2004332068A/en
Publication of JP2004332068A publication Critical patent/JP2004332068A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost clad aluminum alloy substrate for a magnetic disk which can deal with the increase of recording density, and has satisfactory polishability, and to provide its production method. <P>SOLUTION: Aluminum for a core material having a purity of ≤99.9% and aluminum for a surface material having a purity of ≥99.94% are separately dissolved, prescribed elements are added thereto, and thereafter, casting and homogenizing heat treatment are performed so as to be a core material and a surface material. The core material and the surface material are subjected to hot cladding and rolling. The clad plate is cold-rolled and blanked, and is subjected to press sintering in the temperature range of 250 to 450°C. Thus, the clad aluminum alloy substrate for a magnetic disk in which the central part of the core material comprises, by mass, 3.5 to 6% Mg, ≤0.8% Cu and 1% Zn, and the balance Al with inevitable impurities, and the surface layer part of the surface material comprises 0.01 to 0.1% Cu, 0.1 to 0.6% Zn, <2% Mg and 0.05 to 0.3% Cr, and the balance Al with inevitable impurities is obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、磁気ディスク用クラッドアルミニウム合金基板及びその製造方法に関する。
【0002】
【従来の技術】
外部記録装置の1つである磁気ディスク装置(Hard Disk Drive)には、情報を記録(保存)するための磁気ディスクと、この磁気ディスクに対して情報の書き込み及び再生を行う磁気ヘッドとが設けられている。近年、このような磁気ディスク及び磁気ヘッドの性能が大幅に向上し、近い将来には、面記録密度100Gb/inが達成されようとしている。このような磁気ディスク装置は、一般に、パソコン用の外部記録装置として使用されているが、最近では、テレビ用録画機等家電製品へも搭載され始めており、1ビット当たりの記録単価の低減が強く求められている。そのため、磁気ディスク用アルミニウム合金基板にも更なる低コスト化が要求されている。
【0003】
従来、磁気ディスク用基板としては、軽量及び非磁性であると共に加工性が優れたアルミニウム合金が使用されている。しかしながら、前記アルミニウム合金は表面硬度が低いため、磁気ヘッドが磁気ディスクに衝突した際に記録層が破壊されやすい。また、磁気ディスクの記録密度を高めるためには、磁気ヘッドを低浮上量で安定浮上させる必要があるが、そのために要求されている基板の高平滑性がアルミニウム合金単独では得られ難いという問題もある。このため、一般に磁気ディスク用基板としては、アルミニウム合金基板の表面に硬度が高い無電解NiPめっき膜を10μm程度形成したNiPめっきアルミニウム合金基板(以下、NiPめっきAl基板という)が使用されている。
【0004】
前述のNiPめっきAl基板は、例えば、以下の方法で作製される。先ず、溶解、鋳造、均質化熱処理及び圧延により所望の合金種、調質及び板厚に調整されたアルミニウム合金板を打ち抜きプレスにより所定のドーナツ状に打ち抜く。次に、このドーナツ状のアルミニウム合金を、基板内で均一な特性を持たせるためにO材化を行い、更に、平坦度を向上させるために平坦度が高いスペーサーの間に積み付けして全体を加圧しながら焼鈍する(加圧焼鈍)。一般に、加圧焼鈍後のドーナツ状のアルミニウム合金をブランクいう。その後、ブランクの内外径端部に、所定の端面加工を施す。
【0005】
次に、前述の端面加工が施されたブランクを、例えば、自動両面研削機に予めセットされたキャリアのポケット内にセットし、砥石により目標の板厚になるまで研削加工する。このようにして得られたアルミニウム合金基板の表面は、中心線平均粗さ(Ra)が100Å程度と非常に平滑であるが、磁気ディスク用基板としての要求仕様は満足していない。そこで、更に、アルミニウム合金基板の全面にジンケート処理(亜鉛置換処理;例えば、特許文献1参照)を施し、無電解NiPめっき膜を形成した後、Raが10Å以下になるようにNiPめっき膜の表面を研磨して磁気ディスク用基板にしている。
【0006】
一般的な磁気ディスクにおいては、上述の無電解NiPめっき膜が形成されたアルミニウム合金基板上に、磁気特性を高めるための下地膜、Co系合金からなる磁性膜及びCからなり磁性膜を保護する保護膜をスパッタリングにより形成する。
【0007】
【特許文献1】
特開平6−131659号公報 (第3頁)
【0008】
【発明が解決しようとする課題】
しかしながら、上述の従来の技術により磁気ディスク用アルミニウム合金基板の低コスト化を実現するためには以下に示す問題点がある。現在、高記録密度の磁気ディスクを作製するためには、不純物元素が少なく、例えば、99.94質量%以上の高純度のアルミニウム地金が使用されているが、磁気ディスク用アルミニウム合金基板を低コスト化するためには、純度の低いアルミニウム地金で高記録密度を実現しなければならないという問題がある。また、磁気ディスク用アルミニウム合金基板の低コスト化には、研削性の向上も有効であるが、ブランク表面には約100乃至150Åの厚さの酸化皮膜が形成されているため、研削性が低下するという問題もある。この酸化皮膜の中でも、特にMgOが研削性に影響を及ぼすため、酸化皮膜の厚さはできるだけ薄くしなければならない。
【0009】
本発明はかかる課題に鑑みてなされたものであって、高記録密度化に対応でき、研削性が良好であり、低コストな磁気ディスク用クラッドアルミニウム合金基板及びその製造方法を提供することを目的とする。
【0010】
【課題を解決するための手段】
本願第1発明に係る磁気ディスク用クラッドアルミニウム合金基板は、芯材の両面に皮材をクラッドし、焼鈍が施された磁気ディスク用クラッドアルミニウム合金基板において、前記皮材の厚さが30乃至150μmであり、最終焼鈍後における前記皮材の表層部がCu:0.01乃至0.1質量%、Zn:0.1乃至0.6質量%、Mg:2質量%未満、Cr:0.05乃至0.3質量%を含有し、残部がAl及び不可避的不純物からなり、前記芯材の厚さ方向における中央部がMg:3.5乃至6質量%を含有し、残部がAl及び不可避的不純物からなり、前記Mgの含有量が表層になるに従い減少することを特徴とする。
【0011】
本発明においては、添加物の組成を限定することにより強度を高めた芯材と、添加物の組成を限定することにより表面性を向上させた皮材とを貼り合わせたクラッド材を使用することにより、優れた無電解NiPめっき性が得られる。また、Mgの含有量に濃度勾配を形成することにより、表面研削性が向上する。これにより、低コストで、高密度化が実現できる。
【0012】
前記芯材の厚さ方向における中央部では、例えば、Cu:0.8質量%以下、Zn:1質量%以下を含有していてもよい。芯材にCu及びZnを添加すると、熱処理によりこれらの元素が皮材方向へ拡散するため、無電解NiPめっきが施される皮材表面において、ジンケート処理時のZnの析出を均一化することができる。これにより、耐食性を低下させずに、無電解NiPめっき性を向上することができる。
【0013】
本願第2発明に係る磁気ディスク用クラッドアルミニウム合金基板の製造方法は、純度が99.9質量%以下の芯材用アルミニウムと、純度が99.94質量%以上の皮材用アルミニウムとを夫々別々に溶解し、前記芯材用アルミニウム及び前記皮材用アルミニウムに夫々所定の元素を添加した後、鋳造及び均質化熱処理を行って芯材及び皮材にする工程と、前記芯材及び前記皮材を熱間にて貼り合わせた後圧延してクラッド板にする工程と、前記クラッド板を冷間圧延して打ち抜いた後に250乃至450℃の温度範囲で加圧焼鈍することにより、前記芯材の中央部をMg:3.5乃至6質量%、Cu:0.8質量%以下、Zn:1質量%を含有し、残部がAl及び不可避的不純物からなる組成にし、前記皮材の表層部をCu:0.01乃至0.1質量%、Zn:0.1乃至0.6質量%、Mg:2質量%未満、Cr:0.05乃至0.3質量%を含有し、残部がAl及び不可避的不純物からなる組成にする工程と、を有することを特徴とする。
【0014】
本発明においては、250乃至450℃の温度範囲で加圧焼鈍することにより、表面が平坦化され、更に、芯材から皮材へMgが拡散して芯材に向かうに従いMgの含有量が増加する濃度勾配が形成される。これにより、表面の研削性が向上するため、製造コストを低減することができる。
【0015】
【発明の実施の形態】
以下、本発明について詳細に説明する。本発明者等は、磁気ディスク用アルミニウム合金基板の低コスト化を実現するため、クラッド(貼り合わせ)アルミニウム合金基板に注目して鋭意実験研究を進めた。その結果、アルミニウム純度が低く、強度が高いアルミニウム合金を芯材とし、アルミニウム純度が高く、欠陥原因となる金属間化合物が形成されないアルミニウム合金を皮材とすることにより、高記録密度化が可能な磁気ディスク用クラッドアルミニウム合金基板が得られることを見出した。また、アルミニウム合金基板表面に形成される酸化皮膜、特に主成分であるMgOを減少させることにより、研削速度が飛躍的に向上することも見出した。
【0016】
そこで、本発明に係る磁気ディスク用クラッドアルミニウム合金基板は、芯材の両面に皮材をクラッドし、焼鈍を施すことにより得られ、最終焼鈍後における皮材の表層部の組成はCu:0.01乃至0.10質量%、Zn:0.1乃至0.6質量%、Mg:2質量%未満、Cr:0.05乃至0.30質量%、残部がAl及び不可避的不純物であり、芯材の厚さ方向における中央部(以下、芯材の中央部という)の組成はMg:3.5乃至6質量%、残部がAl及び不可避的不純物であるか、又はMg:3.5乃至6質量%、Cu:0.8質量%以下、Zn:1質量%以下、残部がAl及び不可避的不純物である。
【0017】
次に、本発明の磁気ディスク用クラッドアルミニウム合金基板の皮材の表層部における各成分の限定理由について詳細に説明する。
【0018】
Cu:0.01乃至0.10質量%
皮材の表層部に含まれるCuは、ジンケート処理においてZnの析出形態に影響を及ぼす元素であり、このZnの析出形態により無電解NiPめっき膜表面の品質(例えば、ピットの発生等)が決定される。Cu含有量が0.01質量%未満では、ジンケート処理によるZnの析出が基板表面内で不均一となり、無電解NiPめっき膜の表面に微小な凹凸が生じる等の問題が発生する。また、Cu含有量が0.1質量%を超えるとジンケート処理で生じたピットに起因して、無電解NiPめっき膜表面にもピットが発生する。このため、最終焼鈍後の皮材の表層部におけるCu含有量は、0.01乃至0.10質量%とする。
【0019】
Zn:0.1乃至0.6質量%
皮材の表層部に含まれるZnは、Cuと同様にジンケート処理においてZnの析出形態に影響を及ぼし、これにより、無電解NiPめっき膜表面の品質(例えば、ピットの発生)が決定される。Zn含有量が0.1質量%未満では、ジンケート処理におけるZnの析出が基板表面内で不均一となり、無電解NiPめっき膜の表面に微小な凹凸が発生する等の問題が発生する。また、Zn含有量が0.6質量%を超えるとジンケート処理で生じたピットに起因して、無電解NiPめっき膜表面にもピットが発生する。更に、アルミニウム合金結晶粒界中にAl−Mg−Zn系金属間化合物を形成しやすくなる。よって、最終焼鈍後の皮材の表層部におけるZn含有量は、0.1乃至0.6質量%とする。
【0020】
Mg:2質量%未満
皮材の表層部に含まれるMgは、強度に影響する元素である。このMg含有量が2質量%以上では、表面にMgOからなる厚い酸化皮膜が生成して、研削性が低下する。このため、最終焼鈍後の皮材の表層部におけるMg含有量は、2質量%未満とする。
【0021】
Cr:0.05乃至0.30質量%
皮材表層部のCr含有量が0.05質量%より少ないと、最大長が50μmを超えるような粗大な結晶粒が生成しやすくなる。このような粗大な結晶粒が存在すると、ジンケート処理においてZnの析出が不均一となる。また、Cr含有量が0.3質量%を超えると、Al−Cr系の粗大な金属間化合物(例えば、CrAl等)が生成するため、無電解NiPめっき膜表面にピット等の欠陥が生じる。このため、最終焼鈍後の皮材の表層部におけるCr含有量は、0.05乃至0.30質量%とする。
【0022】
次に、本発明の磁気ディスク用クラッドアルミニウム合金基板の芯材の中央部における各成分の限定理由について説明する。
【0023】
Mg:3.5乃至6質量%
芯材に含まれるMgは、強度向上に有効な元素である。芯材の中央部におけるMg含有量が3.5質量%未満の場合、強度が低く、また、皮材方向へ十分な濃度勾配が形成されず、無電解NiPめっきを行う表面部のMg濃度も低いため、研削後に行う無電解NiPめっきの前処理工程において疵がつきやすくなる。また、Mg含有量が6質量%を超えると、芯材の高強度化が進んで圧延時に割れ等の問題が発生する。このため、芯材に含有されるMgは3.5乃至6質量%とする。
【0024】
Cu:0.8質量%以下
芯材の表面は皮材により被覆されるが、端部は露出している。この芯材の端部における無電解NiPめっき性を高めるためには、Cuの添加が有効である。但し、Cu含有量が0.8質量%を超えると芯材としての耐食性を大幅に低下させるため、芯材にCuを添加する場合は、Cu含有量が0.8質量%以下になるようにする。
【0025】
Zn:1質量%以下
芯材に含まれるZnは、前述のCuと同様に無電解NiPめっき性に影響する元素である。但し、Znが1質量%を超えて含有されてもこれ以上の効果は得られないため、芯材にZnを添加する場合は、Znの含有量が1質量%以下になるようにする。
【0026】
なお、本発明の磁気ディスク用クラッドアルミニウム合金基板における不可避的不純物としては、例えば、Si、Fe、Mn及びTi等が挙げられるが、芯材においてはこれらの元素を含有していても問題はない。一方、皮材においては、これらの元素は必須元素であるAl及びMgと金属間化合物を生成し、無電解NiPめっき膜形成時にピット又はノジュールの発生原因となるため、夫々0.05質量%以下にすることが好ましい。
【0027】
また、本発明の磁気ディスク用クラッドアルミニウム合金基板における皮材の厚さは、30乃至150μmである。一般に、所定の寸法のブランクに打ち抜かれた後、加圧焼鈍され、研削砥石により研削加工が行われる。この際、研削条件によっては表面から数十μmが除去される。従って、その後に無電解NiPめっき処理を行う場合には無電解NiPめっき性を確保するために、ブランクの状態で30μm以上の皮材が必要である。また、皮材の厚さが150μmを超えても無電解NiPめっき性等には関係なく、コスト面で不利であり、本発明の目的から外れる。従って、ブランクの状態で、芯材の両表面に形成される皮材の厚さは30乃至150μmとする。
【0028】
更に、本発明の磁気ディスク用クラッドアルミニウム合金基板は、Mg含有量が表層部になるに従い減少する濃度勾配を有する。皮材に含まれるMgは、芯材側になるに従いその量が増加するような濃度勾配を持つ。このため、最終焼鈍後の皮材の表層部におけるMgが少なく、MgOの酸化皮膜が生成されにくい。これにより、研削速度が飛躍的に向上するため、低コストな磁気ディスク用クラッドアルミニウム合金基板を得ることができる。また、研削工程により表面層が除去されると、表面層におけるMgの含有量が増加するため、より硬く、疵つきにくい皮材となる。
【0029】
次に、本発明の磁気ディスク用クラッドアルミニウム合金基板の製造方法について説明する。先ず、芯材用のAl含有量が99.9質量%以下である低純度のアルミニウム地金又はリサイクル屑と、皮材用のAl含有量が99.94質量%以上である高純度のアルミニウム地金とを、夫々別々に溶解して各種元素を添加することにより、所望の組成のアルミニウム合金にする。この芯材用及び皮材用のアルミニウム合金を鋳造した鋳塊を均質化熱処理した後、熱間にて貼り合わせ圧延してクラッド板にする。次に、このクラッド板を冷間圧延し、所定のドーナツ状に打ち抜いた後、250乃至450℃の温度範囲で加圧焼鈍を行う。そして、従来の磁気ディスク用アルミニウム合金基板と同様の方法で、端面加工及び研削を行い、クラッドアルミニウム合金基板にする。
【0030】
本発明の磁気ディスク用クラッドアルミニウム合金基板の製造方法においては、前述のクラッド板を打ち抜いた後に250乃至450℃の温度範囲で加圧焼鈍を行う。表面の平坦性を向上し、皮材に含まれるMgに濃度勾配を持たせるためには、250℃以上の温度条件下での焼鈍が必要である。焼鈍温度が250℃未満では、良好な平坦性が得られない。また、芯材から皮材へMgが拡散しないため、Mgの濃度勾配が形成されず、研削後の皮材表面が軟らかくなり疵つきやすくなる。一方、450℃を超える温度で加圧焼鈍すると、Mgが皮材の表層部まで拡散し、MgOからなる酸化皮膜が厚くなり、研削速度が低下する。また、ブランク同士が剥離し難くなり、平坦性が悪化する。このため、加圧焼鈍の温度範囲は250乃至450℃とする。
【0031】
なお、本発明の磁気ディスク用クラッドアルミニウム合金基板の製造方法においては、圧延条件及び加圧焼鈍条件等を変更することにより、磁気ディスク用クラッドアルミニウム合金基板の板厚及び皮材用アルミニウム合金におけるMgの濃度勾配を変更することができる。
【0032】
【実施例】
以下、本発明の実施例について、本発明の範囲から外れる比較例と比較して具体的に説明する。本発明の実施例及び比較例として、以下の製造工程により、板厚が1.25mmである3.5インチタイプの磁気ディスク用クラッドアルミニウム合金基板を作製した。先ず、純度が99.8質量%の芯材用のアルミニウムと、純度が99.96質量%である皮材用のアルミニウムを夫々別々に溶解した後、所定の組成になるように添加元素を加えて鋳造した。その鋳塊を面取りした後、540℃で8時間加熱して均質化処理して、皮材及び芯材とした。この皮材及び芯材を貼り合わせて、最終板厚が3mmになるように熱間圧延した。その後、板厚が1.3mmになるように冷間圧延を行い、3.5インチサイズ(外径95mm、内径25mm)のドーナツ状に打ち抜いた。このドーナツ状のクラッドアルミニウム合金板を300℃で8時間加圧焼鈍した後、端面加工し、最終板厚が1.25mmになるように研削して、クラッドアルミニウム合金基板にした。表1に本実施例及び比較例における皮材の表層部及び芯材の中央部における組成並びに皮材の厚さを示す。なお、表1に示す最終的な皮材の厚さは、貼り合わせ時に皮材の厚さを変えることにより調整した。
【0033】
【表1】

Figure 2004332068
【0034】
前述の工程により製造された本実施例及び比較例のクラッドアルミニウム合金基板について、下記の方法により各種評価を実施した。
【0035】
1.引張り強さ
冷間圧延後のアルミニウム合金板を340℃にてO材化処理した後、引張り方向が圧延方向と平行になるようにJIS5号による引張り試験片を作製した。その後、引張り試験を実施して引張り強さを求めた。なお、引張り強さは、230N/mm以上であれば、磁気ディスク用基板として問題なく使用することができる。
【0036】
2.酸化皮膜の平均膜厚
酸化皮膜の平均膜厚の測定は、オージェ電子分析装置(VG SCIENTIFIC 型式310D)により、各クラッドアルミニウム合金基板の皮材の最表面から深さ方向の酸素濃度を測定し、相対的な酸素濃度が20%になる深さを酸化皮膜の厚さとみなした。この測定を、各クラッドアルミニウム合金試料片に対して場所を変えて5箇所で行い、その平均を酸化皮膜の平均膜厚とした。
【0037】
3.Mgの濃度勾配
EPMA(Electron Probe X−ray Micro−Analyzer;電子プローブX線マイクロアナライザー,(株)島津製作所 EPMA−8705)を使用し、各クラッドアルミニウム合金基板の深さ方向の断面でMgの線分析を行い、濃度勾配の有無を観察した。その際、皮材側から芯材側にかけてMg量が増加する濃度勾配が見られたものを○、濃度勾配が見られなかったものを×とした。
【0038】
4.研削速度
3.5インチサイズに打ち抜き、所定の端面加工が施されたブランクについて、両面研削機(スピードファム−18B)を使用して、ドレッシングを行った後、表2に示す条件にて研削を行った。なお、研削速度は、2次圧での研削時間を測定し、1分間当りの研削量から求めた。
【0039】
【表2】
Figure 2004332068
【0040】
5.ジンケート処理によるZnの析出形態
実施例及び比較例のクラッドアルミニウム合金基板を60℃で2分間アルカリ脱脂した後水洗し、65℃で2分間酸エッチングして水洗した。次に、室温で1分間硝酸デスマットを施して水洗した後、1次ジンケートして水洗した。そして、硝酸剥離して水洗した後、2次ジンケートを行い、水洗して乾燥した。前述のジンケート処理を行ったクラッドアルミニウム合金基板について、表面におけるZnの析出形態及びピットの発生状況をSEM(Scanning Electron Microscope:走査型電子顕微鏡)により調査した。その際、Znの析出形状は、皮膜状に析出していたものを○、粒状に析出していたものを×、皮膜状と粒状の中間のものを△とした。また、ピットについては、数が少なく小さかったものを○、数が多く大きかったものを×、これらの中間の場合は△とした。
【0041】
6.耐疵付き性
研削後のクラッドアルミニウム合金基板を洗浄し、専用カセットに挿入した後、表面の目視観察を行って、ハンドリングダメージによる表面疵等の有無を確認し、耐疵付き性を評価した。その際、表面疵が見られなかったものを○、表面疵が見られたものを×とした。
【0042】
上述の方法により実施例1乃至7及び比較例1乃至9のクラッドアルミニウム合金基板を評価した結果を表3に示す。
【0043】
【表3】
Figure 2004332068
【0044】
表3に示すように、皮材の厚さが薄い比較例1のクラッドアルミニウム合金基板は、Znの析出が不均一でピットも発生していた。一方、皮材の厚さが厚い比較例2のクラッドアルミニウム合金基板は、引張り強さが劣っていた。また、皮材の組成が本発明の範囲から外れた比較例3乃至6のクラッドアルミニウム合金基板は、Znの析出が不均一又はピットの発生等ジンケート処理面に問題があった。更に、皮材のMg含有量が多い比較例7のクラッドアルミニウム合金基板は、皮材表層部の酸化皮膜の厚さが厚いため、研削速度が遅くなった。更にまた、芯材の添加元素含有量が少ない比較例8のクラッドアルミニウム合金基板は、引張り強さが低く、耐疵付き性も劣っていた。一方、本発明の範囲内で作製した実施例1乃至7のクラッドアルミニウム合金基板は、引張り強さ及び耐疵付き性に優れ、研削速度が速かった。また、ジンンケート処理後もZnの析出が均一で、ピットの発生もなく、無電解NiPめっき性が優れていた。なお、比較例9のクラッドアルミニウム合金は、引張り強さ及び耐疵付き性に優れ、研削速度も速かったが、芯材を圧延する際に割れ等が生じやすいため製造が困難であり、実用的ではない。
【0045】
【発明の効果】
以上詳述したように、本発明によれば、低純度のアルミニウムに所定の元素を添加して作製した芯材と、高純度のアルミニウムに所定の元素を添加して作製した皮材とを貼り合わせることにより、表面酸化皮膜の薄膜化及び優れた無電解NiPめっき性を実現することができるため、低純度のアルミニウムを使用しても高記録密度化に対応でき、研削速度が速く、低コスト化が可能な磁気ディスク用クラッドアルミニウム合金基板が得られる。[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a clad aluminum alloy substrate for a magnetic disk and a method for manufacturing the same.
[0002]
[Prior art]
A magnetic disk device (Hard Disk Drive), which is one of the external recording devices, includes a magnetic disk for recording (storing) information, and a magnetic head for writing and reproducing information on and from the magnetic disk. Have been. In recent years, the performance of such magnetic disks and magnetic heads has been greatly improved, and in the near future, an areal recording density of 100 Gb / in 2 will be achieved. Such a magnetic disk device is generally used as an external recording device for a personal computer. However, recently, it has begun to be mounted on home electric appliances such as a television recorder, and the reduction in the recording unit price per bit has been strongly reduced. It has been demanded. Therefore, there is a demand for further lowering the cost of the aluminum alloy substrate for magnetic disks.
[0003]
Conventionally, as a substrate for a magnetic disk, an aluminum alloy that is lightweight, non-magnetic, and excellent in workability has been used. However, since the aluminum alloy has a low surface hardness, the recording layer is easily broken when the magnetic head collides with the magnetic disk. Also, in order to increase the recording density of the magnetic disk, it is necessary to stably fly the magnetic head with a low flying height, but there is also a problem that the high smoothness of the substrate required for it is difficult to obtain with an aluminum alloy alone. is there. For this reason, a NiP-plated aluminum alloy substrate (hereinafter, referred to as a NiP-plated Al substrate) in which a high hardness electroless NiP plating film is formed on the surface of an aluminum alloy substrate to a thickness of about 10 μm is generally used as a magnetic disk substrate.
[0004]
The above-described NiP-plated Al substrate is produced, for example, by the following method. First, an aluminum alloy plate adjusted to a desired alloy type, temper and thickness by melting, casting, homogenizing heat treatment and rolling is punched out into a predetermined donut shape by a punching press. Next, this donut-shaped aluminum alloy is converted into an O material so as to have uniform properties within the substrate, and further stacked between spacers having a high flatness to improve the flatness. Is annealed while applying pressure (pressure annealing). Generally, a donut-shaped aluminum alloy after pressure annealing is referred to as a blank. Thereafter, predetermined end face processing is performed on inner and outer diameter ends of the blank.
[0005]
Next, the blank having been subjected to the end face processing described above is set, for example, in a pocket of a carrier previously set in an automatic double-sided grinding machine, and is ground by a grindstone until a target thickness is obtained. The surface of the aluminum alloy substrate thus obtained has a very smooth center line average roughness (Ra) of about 100 °, but does not satisfy the required specifications as a magnetic disk substrate. Then, after further performing zincate treatment (zinc substitution treatment; see, for example, Patent Document 1) on the entire surface of the aluminum alloy substrate to form an electroless NiP plating film, the surface of the NiP plating film is adjusted so that Ra becomes 10 ° or less. Is polished to form a magnetic disk substrate.
[0006]
In a general magnetic disk, a base film for improving magnetic properties, a magnetic film made of a Co-based alloy, and a magnetic film made of C are protected on an aluminum alloy substrate on which the above-described electroless NiP plating film is formed. A protective film is formed by sputtering.
[0007]
[Patent Document 1]
JP-A-6-131659 (page 3)
[0008]
[Problems to be solved by the invention]
However, in order to reduce the cost of the aluminum alloy substrate for a magnetic disk by the above-described conventional technology, there are the following problems. At present, in order to manufacture a magnetic disk having a high recording density, a high-purity aluminum ingot having a small amount of impurity elements, for example, 99.94% by mass or more is used. In order to increase the cost, there is a problem that a high recording density must be realized with aluminum metal having low purity. In order to reduce the cost of the aluminum alloy substrate for magnetic disks, it is effective to improve the grindability. However, since an oxide film having a thickness of about 100 to 150 mm is formed on the blank surface, the grindability is reduced. There is also the problem of doing. Among these oxide films, MgO particularly affects the grindability, so that the thickness of the oxide film must be as small as possible.
[0009]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a low-cost clad aluminum alloy substrate for a magnetic disk, which can cope with high recording density, has good grindability, and a method of manufacturing the same. And
[0010]
[Means for Solving the Problems]
The clad aluminum alloy substrate for a magnetic disk according to the first invention of the present application is a clad aluminum alloy substrate for a magnetic disk in which a cladding material is clad on both sides of a core material, and the thickness of the cladding material is 30 to 150 μm. After the final annealing, the surface layer portion of the skin material has Cu: 0.01 to 0.1% by mass, Zn: 0.1 to 0.6% by mass, Mg: less than 2% by mass, and Cr: 0.05. To 0.3% by mass, the balance consisting of Al and inevitable impurities, the center in the thickness direction of the core material containing 3.5 to 6% by mass of Mg, and the balance being Al and inevitable impurities. It is characterized by being composed of impurities and decreasing as the content of Mg becomes closer to the surface.
[0011]
In the present invention, a core material having increased strength by limiting the composition of the additive, and a clad material in which a skin material having improved surface properties by limiting the composition of the additive are used. Thereby, excellent electroless NiP plating properties can be obtained. Further, by forming a concentration gradient in the content of Mg, the surface grindability is improved. Thereby, high density can be realized at low cost.
[0012]
The center portion of the core material in the thickness direction may contain, for example, Cu: 0.8% by mass or less and Zn: 1% by mass or less. When Cu and Zn are added to the core material, these elements are diffused in the direction of the skin material by the heat treatment, so that the precipitation of Zn during zincate treatment can be uniformized on the surface of the skin material on which electroless NiP plating is performed. it can. Thereby, the electroless NiP plating property can be improved without lowering the corrosion resistance.
[0013]
In the method for manufacturing a clad aluminum alloy substrate for a magnetic disk according to the second invention of the present application, aluminum for a core having a purity of 99.9% by mass or less and aluminum for a skin having a purity of 99.94% by mass or more are separately provided. After adding predetermined elements to the aluminum for the core material and the aluminum for the skin material, respectively, performing casting and homogenizing heat treatment to obtain a core material and a skin material, and the core material and the skin material Hot-laminated and then rolled to form a clad plate, and cold-rolled and punched out of the clad plate, followed by pressure annealing in a temperature range of 250 to 450 ° C. The central portion contains 3.5 to 6% by mass of Mg, 0.8% by mass or less of Cu, and 1% by mass of Zn, and the balance is made up of Al and unavoidable impurities. Cu: 0.01 Composition containing 0.1% by mass, Zn: 0.1 to 0.6% by mass, Mg: less than 2% by mass, Cr: 0.05 to 0.3% by mass, with the balance being Al and unavoidable impurities And a step of:
[0014]
In the present invention, the surface is flattened by pressure annealing in a temperature range of 250 to 450 ° C., and furthermore, Mg is diffused from the core material to the skin material, and the content of Mg increases toward the core material. A concentration gradient is formed. As a result, since the surface grindability is improved, the manufacturing cost can be reduced.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail. The inventors of the present invention have focused on a clad (bonded) aluminum alloy substrate and have conducted intensive experimental research in order to reduce the cost of the aluminum alloy substrate for a magnetic disk. As a result, high recording density can be achieved by using an aluminum alloy having low aluminum purity and high strength as a core material and an aluminum alloy having high aluminum purity and not forming an intermetallic compound causing defects as a skin material. It has been found that a clad aluminum alloy substrate for a magnetic disk can be obtained. Further, they have also found that the reduction of the oxide film formed on the surface of the aluminum alloy substrate, particularly MgO, which is the main component, dramatically improves the grinding speed.
[0016]
Thus, the clad aluminum alloy substrate for a magnetic disk according to the present invention is obtained by cladding a cladding material on both sides of a core material and performing annealing, and the composition of the surface layer portion of the cladding material after final annealing is Cu: 0. 01 to 0.10% by mass, Zn: 0.1 to 0.6% by mass, Mg: less than 2% by mass, Cr: 0.05 to 0.30% by mass, the balance being Al and inevitable impurities, The composition of the central portion in the thickness direction of the material (hereinafter referred to as the central portion of the core material) is Mg: 3.5 to 6% by mass, the balance being Al and inevitable impurities, or Mg: 3.5 to 6 % By mass, Cu: 0.8% by mass or less, Zn: 1% by mass or less, the balance being Al and unavoidable impurities.
[0017]
Next, the reasons for limiting each component in the surface layer of the cladding aluminum alloy substrate for a magnetic disk of the present invention will be described in detail.
[0018]
Cu: 0.01 to 0.10 mass%
Cu contained in the surface layer of the skin material is an element that affects the form of Zn deposition in the zincate treatment, and the quality of the surface of the electroless NiP plating film (for example, generation of pits) is determined by the form of Zn deposition. Is done. If the Cu content is less than 0.01% by mass, the precipitation of Zn due to the zincate treatment becomes non-uniform on the substrate surface, causing problems such as generation of minute irregularities on the surface of the electroless NiP plating film. If the Cu content exceeds 0.1% by mass, pits also occur on the surface of the electroless NiP plating film due to pits generated by the zincate treatment. Therefore, the Cu content in the surface layer of the skin material after the final annealing is set to 0.01 to 0.10% by mass.
[0019]
Zn: 0.1 to 0.6% by mass
Zn contained in the surface layer of the skin material affects the form of Zn deposition in the zincate treatment similarly to Cu, whereby the quality (for example, generation of pits) of the surface of the electroless NiP plating film is determined. If the Zn content is less than 0.1% by mass, the deposition of Zn in the zincate treatment becomes non-uniform on the substrate surface, causing problems such as generation of minute irregularities on the surface of the electroless NiP plating film. If the Zn content exceeds 0.6% by mass, pits also occur on the surface of the electroless NiP plating film due to pits generated by the zincate treatment. Further, an Al-Mg-Zn intermetallic compound is easily formed in the aluminum alloy crystal grain boundary. Therefore, the Zn content in the surface layer of the skin material after the final annealing is 0.1 to 0.6% by mass.
[0020]
Mg: less than 2% by mass Mg contained in the surface layer of the skin material is an element that affects the strength. When the Mg content is 2% by mass or more, a thick oxide film made of MgO is formed on the surface, and the grindability is reduced. Therefore, the Mg content in the surface layer of the skin material after the final annealing is set to less than 2% by mass.
[0021]
Cr: 0.05 to 0.30 mass%
When the Cr content in the surface layer portion of the skin material is less than 0.05% by mass, coarse crystal grains having a maximum length exceeding 50 μm are easily generated. When such coarse crystal grains are present, the precipitation of Zn becomes uneven in the zincate treatment. If the Cr content exceeds 0.3% by mass, coarse Al-Cr intermetallic compounds (for example, CrAl 7 ) are generated, and defects such as pits are generated on the surface of the electroless NiP plating film. . For this reason, the Cr content in the surface layer portion of the skin material after the final annealing is set to 0.05 to 0.30% by mass.
[0022]
Next, the reasons for limiting each component at the center of the core material of the clad aluminum alloy substrate for a magnetic disk of the present invention will be described.
[0023]
Mg: 3.5 to 6% by mass
Mg contained in the core material is an element effective for improving the strength. When the Mg content in the central portion of the core material is less than 3.5% by mass, the strength is low, a sufficient concentration gradient is not formed in the direction of the skin material, and the Mg concentration in the surface portion on which electroless NiP plating is performed is also low. Due to the low hardness, flaws are easily formed in the pretreatment step of electroless NiP plating performed after grinding. On the other hand, if the Mg content exceeds 6% by mass, the strength of the core material is increased, and problems such as cracks occur during rolling. Therefore, the content of Mg in the core material is set to 3.5 to 6% by mass.
[0024]
Cu: 0.8% by mass or less The surface of the core material is covered with a skin material, but the ends are exposed. In order to enhance the electroless NiP plating property at the end of the core material, the addition of Cu is effective. However, if the Cu content exceeds 0.8% by mass, the corrosion resistance as the core material is significantly reduced. Therefore, when Cu is added to the core material, the Cu content is set to 0.8% by mass or less. I do.
[0025]
Zn: 1% by mass or less Zn contained in the core material is an element that affects the electroless NiP plating property, similarly to the aforementioned Cu. However, even if Zn is contained in more than 1% by mass, no further effect can be obtained. Therefore, when Zn is added to the core material, the content of Zn should be 1% by mass or less.
[0026]
The inevitable impurities in the clad aluminum alloy substrate for a magnetic disk of the present invention include, for example, Si, Fe, Mn, and Ti, but there is no problem even if the core material contains these elements. . On the other hand, in the skin material, these elements generate intermetallic compounds with Al and Mg, which are essential elements, and cause pits or nodules when forming an electroless NiP plating film. Is preferable.
[0027]
The thickness of the skin material in the clad aluminum alloy substrate for a magnetic disk of the present invention is 30 to 150 μm. Generally, after being blanked into a blank of a predetermined size, the blank is pressed and annealed, and a grinding process is performed with a grinding wheel. At this time, several tens of μm is removed from the surface depending on the grinding conditions. Therefore, when the electroless NiP plating is performed thereafter, a blank of 30 μm or more is required in a blank state in order to secure the electroless NiP plating property. Further, even if the thickness of the skin material exceeds 150 μm, it is disadvantageous in terms of cost irrespective of the electroless NiP plating property and the like, and departs from the object of the present invention. Therefore, in the blank state, the thickness of the skin material formed on both surfaces of the core material is set to 30 to 150 μm.
[0028]
Furthermore, the clad aluminum alloy substrate for a magnetic disk of the present invention has a concentration gradient in which the Mg content decreases as the surface layer portion increases. Mg contained in the skin material has a concentration gradient such that its amount increases toward the core material. Therefore, the amount of Mg in the surface layer of the skin material after the final annealing is small, and an oxide film of MgO is not easily formed. As a result, the grinding speed is dramatically improved, and a low-cost clad aluminum alloy substrate for a magnetic disk can be obtained. Further, when the surface layer is removed by the grinding step, the content of Mg in the surface layer increases, so that the skin material becomes harder and less likely to be damaged.
[0029]
Next, a method for manufacturing a clad aluminum alloy substrate for a magnetic disk according to the present invention will be described. First, low-purity aluminum ingot or recycled scrap having an Al content of 99.9% by mass or less for a core material, and high-purity aluminum ingot having an Al content of 99.94% by mass or more for a skin material. By separately melting gold and adding various elements, an aluminum alloy having a desired composition is obtained. The ingot obtained by casting the aluminum alloy for the core material and the skin material is subjected to a homogenizing heat treatment, and then hot-bonded and rolled to form a clad plate. Next, the clad plate is cold-rolled, punched into a predetermined donut shape, and then subjected to pressure annealing in a temperature range of 250 to 450 ° C. Then, in the same manner as the conventional aluminum alloy substrate for a magnetic disk, the end face is processed and ground to obtain a clad aluminum alloy substrate.
[0030]
In the method for manufacturing a clad aluminum alloy substrate for a magnetic disk according to the present invention, after the above-described clad plate is punched, pressure annealing is performed in a temperature range of 250 to 450 ° C. In order to improve the flatness of the surface and give Mg contained in the skin material a concentration gradient, annealing under a temperature condition of 250 ° C. or more is necessary. If the annealing temperature is lower than 250 ° C., good flatness cannot be obtained. In addition, since Mg does not diffuse from the core material to the skin material, a concentration gradient of Mg is not formed, and the surface of the skin material after grinding becomes soft and easily scratched. On the other hand, when pressure annealing is performed at a temperature exceeding 450 ° C., Mg diffuses to the surface layer of the skin material, the oxide film made of MgO becomes thick, and the grinding speed is reduced. Further, the blanks are hardly peeled off from each other, and the flatness is deteriorated. Therefore, the temperature range of the pressure annealing is set to 250 to 450 ° C.
[0031]
In the method for manufacturing a clad aluminum alloy substrate for a magnetic disk of the present invention, the thickness of the clad aluminum alloy substrate for a magnetic disk and the Mg in the aluminum alloy for a cladding material are changed by changing the rolling conditions and the pressure annealing conditions. Can be changed.
[0032]
【Example】
Hereinafter, examples of the present invention will be specifically described in comparison with comparative examples that are out of the scope of the present invention. As an example and a comparative example of the present invention, a 3.5-inch type clad aluminum alloy substrate for a magnetic disk having a thickness of 1.25 mm was manufactured by the following manufacturing process. First, aluminum for a core material having a purity of 99.8% by mass and aluminum for a skin material having a purity of 99.96% by mass are separately dissolved, and then an additional element is added so as to have a predetermined composition. Cast. After chamfering the ingot, it was heated at 540 ° C. for 8 hours and homogenized to obtain a skin material and a core material. The skin material and the core material were bonded to each other and hot-rolled so that the final thickness became 3 mm. Thereafter, cold rolling was performed so that the plate thickness became 1.3 mm, and punching was performed into a 3.5-inch (outer diameter 95 mm, inner diameter 25 mm) donut shape. The doughnut-shaped clad aluminum alloy plate was pressure-annealed at 300 ° C. for 8 hours, processed for an end face, and ground to a final plate thickness of 1.25 mm to form a clad aluminum alloy substrate. Table 1 shows the composition and the thickness of the skin material in the surface layer portion and the center portion of the core material in the present embodiment and the comparative example. Note that the final thickness of the skin material shown in Table 1 was adjusted by changing the thickness of the skin material during bonding.
[0033]
[Table 1]
Figure 2004332068
[0034]
Various evaluations were performed on the clad aluminum alloy substrates of the present example and the comparative example manufactured by the above-described steps by the following methods.
[0035]
1. Tensile strength After the cold-rolled aluminum alloy sheet was subjected to an O-material treatment at 340 ° C, a tensile test piece according to JIS No. 5 was prepared so that the tensile direction was parallel to the rolling direction. Thereafter, a tensile test was performed to determine the tensile strength. If the tensile strength is 230 N / mm 2 or more, it can be used as a magnetic disk substrate without any problem.
[0036]
2. Measuring the average thickness of the average thickness <br/> oxide film of oxide film by Auger electron spectrometer (VG SCIENTIFIC Model 310D), the oxygen concentration in the depth direction from the outermost surface of the skin material of the clad Aluminum alloy substrate Was measured, and the depth at which the relative oxygen concentration became 20% was regarded as the thickness of the oxide film. This measurement was performed at five locations on each clad aluminum alloy specimen at different locations, and the average was taken as the average thickness of the oxide film.
[0037]
3. Using a concentration gradient EPMA (Electron Probe X-ray Micro-Analyzer; an electron probe X-ray microanalyzer, Shimadzu Corporation EPMA-8705), a Mg line was used in the cross section in the depth direction of each clad aluminum alloy substrate. Analysis was performed to observe the presence or absence of a concentration gradient. At that time, the sample was evaluated as ○ when a concentration gradient in which the amount of Mg increased from the skin material side to the core material side was observed, and as × when the concentration gradient was not observed.
[0038]
4. A blank having a punching rate of 3.5 inches and a predetermined end face processing was dressed using a double-sided grinding machine (Speed Fam-18B), and then ground under the conditions shown in Table 2. went. The grinding speed was determined by measuring the grinding time at the secondary pressure and the amount of grinding per minute.
[0039]
[Table 2]
Figure 2004332068
[0040]
5. Deposition form of Zn by zincate treatment The clad aluminum alloy substrates of Examples and Comparative Examples were alkali-degreased at 60 ° C for 2 minutes, washed with water, and acid-etched at 65 ° C for 2 minutes and washed with water. Next, nitric acid desmut was applied at room temperature for 1 minute, washed with water, and then washed with primary zincate. Then, after peeling off with nitric acid and washing with water, secondary zincate was performed, washed with water and dried. With respect to the clad aluminum alloy substrate that had been subjected to the above-described zincate treatment, the precipitation form of Zn and the generation state of pits on the surface were examined by SEM (Scanning Electron Microscope: scanning electron microscope). At this time, Zn was deposited in the form of a film in the form of ○, Zn was precipitated in the form of a grain, and X was in the middle between the film and the grain. Regarding the pits, those with small numbers and small numbers were marked with “○”, those with many numbers with large numbers were marked with “x”, and those between these numbers were marked with “△”.
[0041]
6. Scratch resistance <br/> After washing the clad aluminum alloy substrate after grinding and inserting it into a special cassette, visual observation of the surface is performed to confirm the presence or absence of surface flaws, etc. due to handling damage. Was evaluated. At that time, those with no surface flaws were rated as ○, and those with surface flaws were rated as x.
[0042]
Table 3 shows the results of evaluating the clad aluminum alloy substrates of Examples 1 to 7 and Comparative Examples 1 to 9 by the above method.
[0043]
[Table 3]
Figure 2004332068
[0044]
As shown in Table 3, in the clad aluminum alloy substrate of Comparative Example 1 in which the skin material was thin, the precipitation of Zn was uneven and pits were also generated. On the other hand, the clad aluminum alloy substrate of Comparative Example 2 having a large skin material had poor tensile strength. In addition, the clad aluminum alloy substrates of Comparative Examples 3 to 6 in which the composition of the skin material was out of the range of the present invention had a problem in the zincate treated surface such as uneven deposition of Zn or generation of pits. Furthermore, in the clad aluminum alloy substrate of Comparative Example 7 in which the Mg content of the skin material was large, the grinding speed was slow because the thickness of the oxide film on the surface portion of the skin material was large. Furthermore, the clad aluminum alloy substrate of Comparative Example 8 in which the content of the additive element in the core material was small had low tensile strength and poor scratch resistance. On the other hand, the clad aluminum alloy substrates of Examples 1 to 7 produced within the scope of the present invention were excellent in tensile strength and scratch resistance, and had a high grinding speed. In addition, even after the zincate treatment, the deposition of Zn was uniform, no pits were generated, and the electroless NiP plating property was excellent. The clad aluminum alloy of Comparative Example 9 was excellent in tensile strength and scratch resistance, and had a high grinding speed. However, cracking and the like were likely to occur when the core material was rolled, which made production difficult and practical. is not.
[0045]
【The invention's effect】
As described in detail above, according to the present invention, a core material prepared by adding a predetermined element to low-purity aluminum and a skin material prepared by adding a predetermined element to high-purity aluminum are attached. By combining them, it is possible to reduce the thickness of the surface oxide film and achieve excellent electroless NiP plating properties, so that even if low-purity aluminum is used, it is possible to cope with a high recording density, a high grinding speed, and a low cost. Thus, a clad aluminum alloy substrate for a magnetic disk that can be manufactured can be obtained.

Claims (3)

芯材の両面に皮材をクラッドし、焼鈍が施された磁気ディスク用クラッドアルミニウム合金基板において、前記皮材の厚さが30乃至150μmであり、最終焼鈍後における前記皮材の表層部がCu:0.01乃至0.1質量%、Zn:0.1乃至0.6質量%、Mg:2質量%未満、Cr:0.05乃至0.3質量%を含有し、残部がAl及び不可避的不純物からなり、前記芯材の厚さ方向における中央部がMg:3.5乃至6質量%を含有し、残部がAl及び不可避的不純物からなり、前記Mgの含有量が表層になるに従い減少することを特徴とする磁気ディスク用クラッドアルミニウム合金基板。In a clad aluminum alloy substrate for a magnetic disk in which a cladding material is clad on both sides of a core material and annealed, the thickness of the cladding material is 30 to 150 μm, and the surface layer of the cladding material after final annealing is Cu. : 0.01 to 0.1% by mass, Zn: 0.1 to 0.6% by mass, Mg: less than 2% by mass, Cr: 0.05 to 0.3% by mass, with the balance being Al and inevitable The central part in the thickness direction of the core material contains 3.5 to 6% by mass of Mg, and the rest consists of Al and unavoidable impurities, and the content of Mg decreases as the surface layer becomes higher. A clad aluminum alloy substrate for a magnetic disk. 前記芯材の厚さ方向における中央部が、更に、Cu:0.8質量%以下、Zn:1質量%以下を含有することを特徴とする請求項1に記載の磁気ディスク用クラッドアルミニウム合金基板。2. The clad aluminum alloy substrate for a magnetic disk according to claim 1, wherein a central portion in the thickness direction of the core material further contains 0.8% by mass or less of Cu and 1% by mass or less of Zn. . 純度が99.9質量%以下の芯材用アルミニウムと、純度が99.94質量%以上の皮材用アルミニウムとを夫々別々に溶解し、前記芯材用アルミニウム及び前記皮材用アルミニウムに夫々所定の元素を添加した後、鋳造及び均質化熱処理を行って芯材及び皮材にする工程と、前記芯材及び前記皮材を熱間にて貼り合わせた後圧延してクラッド板にする工程と、前記クラッド板を冷間圧延して打ち抜いた後に250乃至450℃の温度範囲で加圧焼鈍することにより、前記芯材の中央部をMg:3.5乃至6質量%、Cu:0.8質量%以下、Zn:1質量%を含有し、残部がAl及び不可避的不純物からなる組成にし、前記皮材の表層部をCu:0.01乃至0.1質量%、Zn:0.1乃至0.6質量%、Mg:2質量%未満、Cr:0.05乃至0.3質量%を含有し、残部がAl及び不可避的不純物からなる組成にする工程と、を有することを特徴とする磁気ディスク用クラッドアルミニウム合金基板の製造方法。Aluminum for a core material having a purity of 99.9% by mass or less and aluminum for a skin material having a purity of 99.94% by mass or more are separately melted, and are respectively prescribed to the aluminum for the core material and the aluminum for the skin material. After the addition of the elements, a step of performing a casting and homogenizing heat treatment to make a core material and a skin material, and a step of hot rolling the core material and the skin material, followed by rolling into a clad plate, After the clad plate was cold-rolled and punched, the core was subjected to pressure annealing in a temperature range of 250 to 450 ° C. so that the center of the core material was 3.5 to 6 mass% of Mg and Cu was 0.8. % By mass, Zn: 1% by mass, the balance being Al and unavoidable impurities, and the surface layer of the skin material is Cu: 0.01 to 0.1% by mass, Zn: 0.1 to 0.1% by mass. 0.6% by mass, Mg: less than 2% by mass, Cr: 0 05 or contained 0.3 wt%, the production method of cladding an aluminum alloy substrate for a magnetic disk and having a step of the composition balance of Al and unavoidable impurities, the.
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JP2008021950A (en) * 2006-07-14 2008-01-31 Fujitsu Ltd Semiconductor device and manufacturing method thereof
CN104109783A (en) * 2013-04-19 2014-10-22 株式会社神户制钢所 Aluminium alloy substrate used for magnetic disc, and method of manufacturing the same
JP2023032363A (en) * 2021-08-26 2023-03-09 株式会社Uacj Method for producing aluminum alloy ingot for magnetic disk, method for producing aluminum alloy plate for magnetic disk using the aluminum alloy ingot, method for producing aluminum alloy substrate for magnetic disk using the aluminum alloy plate, and magnetic disk using the aluminum alloy substrate

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008021950A (en) * 2006-07-14 2008-01-31 Fujitsu Ltd Semiconductor device and manufacturing method thereof
CN104109783A (en) * 2013-04-19 2014-10-22 株式会社神户制钢所 Aluminium alloy substrate used for magnetic disc, and method of manufacturing the same
CN104109783B (en) * 2013-04-19 2016-11-23 株式会社神户制钢所 Aluminium alloy base plate for magnetic disk and manufacture method thereof
JP2023032363A (en) * 2021-08-26 2023-03-09 株式会社Uacj Method for producing aluminum alloy ingot for magnetic disk, method for producing aluminum alloy plate for magnetic disk using the aluminum alloy ingot, method for producing aluminum alloy substrate for magnetic disk using the aluminum alloy plate, and magnetic disk using the aluminum alloy substrate
JP7752006B2 (en) 2021-08-26 2025-10-09 株式会社Uacj Method for manufacturing an aluminum alloy ingot for magnetic disks, method for manufacturing an aluminum alloy plate for magnetic disks using the aluminum alloy ingot, and method for manufacturing an aluminum alloy substrate for magnetic disks using the aluminum alloy plate

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