JP2004078768A - Non-contact IC card mounting method - Google Patents

Abstract

The present invention can perform trimming (fine adjustment) of a tuning circuit without a device for cutting a capacitor pattern.
According to the present invention, a tuning capacitor for trimming is electrically open before mounting an LSI, and a plurality of capacitors having different capacities are provided at different positions. By changing the mounting location according to the trimming tuning capacitor, various resonance frequencies can be set, and the target trimming tuning capacitor can be electrically connected to the tuning capacitor by a connector provided in the LSI. It was made.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method for mounting a non-contact IC card having a portable wireless communication function, for example.
[0002]
[Prior art]
In recent years, a wireless card as a contactless IC card having a portable wireless communication function has been put to practical use.
During operation of such a contactless card, it is necessary to synchronize the transmission frequency from the radio transceiver (R / W) with a circuit (comprising an LSI, a capacitor, and a coil) in the contactless card to receive power supply. .
[0003]
A common method of tuning is to change the capacitance of the capacitor. By cutting a part of the capacitor formed by sandwiching the front and back of the base material with a pattern, the capacitance can be changed (decreased), or multiple capacitor patterns can be used. Are connected by a conductor to change (increase) the capacitance.
[0004]
Conventionally, as a means for causing the tuning circuit of a contactless card to resonate at a specific frequency, a device for cutting a part of the pattern when changing (decreasing) the capacitance by cutting a part of the wiring of the pattern capacitor. It became necessary, and it was difficult to correct (reconnect) after pattern cutting.
Conversely, when a plurality of electrically independent capacitor patterns are connected by a conductor to change (increase) the capacitance, there is a disadvantage that a connecting member is required and the cost is increased.
[0005]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a non-contact IC card mounting method capable of performing trimming (fine adjustment) of a tuning circuit without a device for cutting a capacitor pattern.
[0006]
[Means for Solving the Problems]
The non-contact IC card of the present invention has a tuning circuit composed of an antenna, a tuning capacitor, and a tuning capacitor for trimming on a substrate, and has an LSI electrically connected to the tuning circuit and mounted on the substrate. In a configuration in which a resonance circuit is formed by the tuning circuit and the LSI, the trimming tuning capacitor is electrically open before mounting the LSI, and a plurality of capacitors having different capacities are provided at different positions. When mounting the above-mentioned LSI, various resonance frequencies are set by selectively changing the mounting location according to the trimming tuning capacitor, and the target trimming tuning capacitor is set by the pad provided on the LSI. It is electrically connected to the tuning capacitor.
[0007]
The contactless IC card according to the present invention includes an antenna, a tuning capacitor provided between both ends of the antenna, at least one first connection terminal connected to one connection point between the antenna and the tuning capacitor, At least one second connection terminal connected to the other connection point between the antenna and the tuning capacitor; at least one third connection terminal provided in non-contact with the second connection terminal; A substrate connected between the first connection terminal and the third connection terminal and including at least one trimming tuning capacitor for correcting a predetermined resonance frequency; and a circuit having a wireless communication function. LSI having first and second antenna connection pads respectively connected to both ends of a circuit and a third pad connected to the second pad by wiring Wherein a first pad of the LSI is connected to one of first connection terminals of the substrate, and a second pad of the LSI is connected to the first pad of the substrate. A third connection terminal connected to a second connection terminal corresponding to the first connection terminal, and a third pad of the LSI corresponding to a second connection terminal to which the second pad of the substrate is connected; To selectively mount an LSI on a trimming tuning capacitor substrate having a different capacity.
[0008]
A non-contact IC card according to the present invention comprises: an antenna; a tuning capacitor provided between both ends of the antenna; a first connection terminal connected to one connection point between the antenna and the tuning capacitor; A second connection terminal connected to the other connection point with the capacitor; and at least one connection terminal connected to the other connection point between the antenna and the tuning capacitor via a trimming tuning capacitor for correcting a predetermined resonance frequency. A board having three third connection terminals, a circuit having a wireless communication function, and first and second antenna connection pads respectively connected to both ends of the circuit; An LSI having at least one third pad connected by wiring, wherein the first pad of the LSI is Connecting the second pad of the LSI to a second connection terminal of the substrate, and selectively connecting the third pad of the LSI to a third connection terminal of the substrate. Accordingly, trimming tuning capacitors having different capacities are mounted.
[0009]
A non-contact IC card according to the present invention comprises: an antenna; a tuning capacitor provided between both ends of the antenna; a first connection terminal connected to one connection point between the antenna and the tuning capacitor; A circuit board having a plurality of second connection terminals connected to the other connection point of the capacitor and a circuit having a wireless communication function, and first and second antenna connection terminals respectively connected to both ends of the circuit; An LSI comprising a second pad and at least one third pad connected to the second pad via a trimming tuning capacitor for correcting a predetermined resonance frequency; Connecting a first pad of the LSI to a first connection terminal of the substrate, connecting a second pad of the LSI to one of the second connection terminals of the substrate, By selectively connecting the third pad to the second connection terminal that is not connected to said second pad of said substrate is for mounting a trimming tuning capacitor of a different capacity.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
(1st Embodiment)
Hereinafter, a non-contact IC card according to an embodiment of the present invention will be described with reference to the drawings.
The non-contact IC card 1 is a portable wireless card having a wireless communication function, and is a wireless card conforming to ISO / IEC14443.
As shown in FIGS. 1 and 2, the non-contact IC card 1 has a tuning circuit 8 composed of an antenna 3, a tuning capacitor 4, and tuning capacitors (pattern capacitors) 5, 6 and 7 for trimming on a substrate 2. An LSI 9 electrically connected to the tuning circuit 8 and mounted on the substrate 2 is provided, and the tuning circuit 8 and the LSI 9 constitute a resonance circuit.
[0011]
The trimming tuning capacitors 5, 6, and 7 are electrically open before mounting the LSI 9, and a plurality of capacitors having different capacities are provided at different positions, and are used for correcting a predetermined resonance frequency. is there.
[0012]
When the LSI 9 is mounted, various resonance frequencies are set by selectively changing the mounting location according to the tuning capacitors 5, 6, and 7 for trimming, and the target is provided by a connector provided in the LSI 9. The trimming tuning capacitors (5, 6, 7) are electrically connected to the tuning capacitor 4.
[0013]
The base material of the substrate 2 is made of polyethylene terephthalate (PET) having a thickness of 0.025 mm, and a conductor is formed of aluminum foil having a thickness of 0.02 mm. The wiring is formed by etching an aluminum foil.
The tuning capacitor 4 has a capacitance by sandwiching PET, which is a dielectric, between the aluminum electrodes 4a and 4b. In this embodiment, the capacitance is about 20 PF with an electrode area of 0.25 cm ² .
[0014]
The trimming tuning capacitors 5, 6, and 7 have capacitance by sandwiching PET, which is a dielectric, between aluminum electrodes 5a, 5b, 6a, 6b, 7a, and 7b, respectively. Each of the aluminum electrodes 4a, 4b, 5a, 5b, 6a, 6b, 7a, 7b is a wiring pattern of the substrate 2.
[0015]
In this embodiment, the tuning capacitor 5 for trimming has a capacitance of about ² PF with an electrode area of 0.025 cm ² , the tuning capacitor 6 for trimming has a capacity of about 4 PF with an electrode area of 0.05 cm ² , and the tuning capacitor 7 for trimming has an electrode area of 0 0.075 cm ² has a capacity of about 6 PF.
In this embodiment, the front and back conductors are of the same type (for example, aluminum), but may be a combination of copper foil and aluminum foil.
[0016]
One end of the antenna 2 is connected to the electrode 4a of the tuning capacitor 4 and the connection terminals PAD1, 2, and 3, and the other end of the antenna 2 is connected to the electrode 4b of the tuning capacitor 4 and the PADs 4, 5, and 6. PADs 7, 8, and 9 are provided in non-contact with PADs 4, 5, and 6, respectively. The PAD1 is wired with the aluminum electrode 5a of the trimming tuning capacitor 5, the PAD7 is wired with the aluminum electrode 5b of the trimming tuning capacitor 5, the PAD2 is wired with the aluminum electrode 6a of the trimming tuning capacitor 6, and the PAD8. Is connected to the aluminum electrode 6b of the trimming tuning capacitor 6, the PAD3 is wired to the aluminum electrode 7a of the trimming tuning capacitor 7, and the PAD9 is wired to the aluminum electrode 7b of the trimming tuning capacitor 7.
[0017]
At this time, PADs 1, 7, 4, PADs 2, 8, 5, PADs 3, 9, and 6 are arranged in a row.
As shown in FIG. 2, the LSI 9 is provided with an antenna PAD10, an antenna PAD11, and a trimming capacitor connection PAD12 wired to the antenna PAD11 and aluminum. The PADs 10, 11, and 12 are configured by gold bumps. At this time, the PADs 10, 12, and 11 are arranged in a row.
[0018]
Thus, the mounting position of the LSI 9 is such that the PADs 1, 4, and 7 face the PADs 10, 11, and 12, as shown in FIG. 3, and the PADs 2, 5, and 8 are, as shown in FIG. As shown in FIG. 5, the PADs 3, 6, and 9 can be mounted at three opposing positions. By mounting this LSI 9, a wireless inlet is created. This wireless inlet is operable with the LSI 9 mounted on the board 2.
[0019]
At this time, a flip chip in which the PADs 10, 11, 12 as the gold bumps and any of the PADs 1, 4, 7, or PADs 2, 5, 8, or PADs 3, 6, 9 as the wiring pattern of the substrate 2 are bonded with an adhesive. The LSI 9 is mounted on the board 2 by the method.
[0020]
When the PADs 1, 11, and 12 of the LSI 9 are mounted in a state where the PADs 1, 4, and 7 of the substrate 2 face each other as shown in FIG. 3, an equivalent circuit as shown in FIG. A small capacitance (2 pf) for correction of the tuning capacitor 5 for trimming is added to the capacitance of 4 (20 pf). The capacitance of the tuning capacitor 4 is a value obtained by subtracting the variation in the capacitance of the capacitor inside the LSI 9 from the capacitance required for the resonance frequency f.
[0021]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 2 + C))
It becomes.
[0022]
As shown in FIG. 4, when the PADs 2, 5, and 8 of the substrate 2 are mounted so as to face the PADs 10, 11, and 12 of the LSI 9, an equivalent circuit as shown in FIG. A small capacitance (4 pf) for correction of the tuning capacitor 6 for trimming is added to the capacitance of 4 (20 pf).
[0023]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 4 + C))
It becomes.
[0024]
When the PADs 10, 11, and 12 of the LSI 9 are mounted in a state where the PADs 1, 4, and 7 of the substrate 2 face each other as shown in FIG. 5, an equivalent circuit as shown in FIG. A small capacitance (6 pf) for correction of the trimming tuning capacitor 7 is added to the capacitance of 4 (20 pf).
[0025]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 6 + C))
It becomes.
As described above, the wireless card 1 is made by making an inlet, arranging resin sheets on the front and back sides, integrating them by hot pressing, and punching into a card shape.
[0026]
The LSI 9 includes a power generation unit 21, a demodulation circuit 22, a control logic circuit 23, a modulation circuit 24, a memory 25, and a clock generation circuit 26, as shown in FIG.
[0027]
A signal from the card reader / writer is received by the tuning circuit 8. The received signal is demodulated by the demodulation circuit 22 and sent to the control logic circuit 23, where command analysis is performed. As a result, the control logic circuit 23 writes data to or reads data from the memory 25 according to the contents of the command. The control logic circuit 23 reads data from the memory 25 and sends the data to the modulation circuit 24. The modulation circuit 24 modulates the data and transmits it to the card reader / writer by the tuning circuit 8.
[0028]
The power generation unit 21 generates power to be consumed in the wireless card 1 based on the reception signal from the tuning circuit 8.
The clock generation circuit 26 generates a clock necessary for operating each circuit based on the reception signal of the tuning circuit 8, and the clock is generated by the demodulation circuit 22, the modulation circuit 24, and the control logic circuit. 23.
[0029]
Therefore, the wireless card 1 converts radio waves supplied from the outside of the card (card reader / writer) into electric power to operate the LSI 9, returns a response with the remaining electric power, and performs non-contact data communication.
[0030]
In order to trim the wireless card 1 to a specific resonance frequency, the position of mounting the LSI 9 on the substrate 2 is changed to select and connect the capacitance of the tuning capacitors 5, 6, and 7 for trimming. Is changed.
Here, the capacitance value of the capacitor for trimming is measured in advance by applying probes to the PADs 10 and 11 of the LSI 9 to determine the correction value.
In this embodiment, the mounting method of the LSI is the flip-chip method, but other methods may be used.
[0031]
As described above, for example, since the capacitance of the capacitor inside the LSI 9 slightly varies depending on the production lot of the LSI 9 and the like, the resonance frequency deviates from the target resonance frequency f due to the influence.
The trimming tuning capacitors 5, 6, and 7 are selected and connected for the purpose of correcting the variation in the capacitor capacity inside the LSI 9 and resonating at a predetermined frequency.
[0032]
In the above example, the case where the connection positions of the LSIs are determined by measuring the variation of the resonance frequency of the first several LSIs in lot units has been described. However, the variation of the resonance frequency of each LSI is measured. Thus, the mounting position of the LSI may be determined.
[0033]
(Second embodiment)
In the first embodiment, the LSI trimming capacitor connection PAD is one. However, as a second embodiment, a case in which a plurality of LSI trimming capacitor connections PAD are provided will be described. In this case, the description of the same parts as in the first embodiment will be omitted.
[0034]
That is, as shown in FIG. 10, one end of the antenna 2, the electrode 4a of the tuning capacitor 4, the aluminum electrode 5a of the trimming tuning capacitor 5, the aluminum electrode 6a of the trimming tuning capacitor 6, and the PAD 21 are wired. 2, the electrode 4b of the tuning capacitor 4 and the PAD 22 are wired, the PAD 21 and the aluminum electrode 7a of the tuning capacitor 7 for trimming are wired, and the aluminum electrode 7b of the tuning capacitor 7 for trimming and the PAD 23 are wired. The aluminum electrode 5b of the trimming tuning capacitor 5 is wired to the PAD 24, and the aluminum electrode 6b of the trimming tuning capacitor 6 is wired to the PAD25.
At this time, the PADs 21, 23, 25, 24, 22 are arranged in rows.
[0035]
As shown in FIG. 11, the LSI 9 is provided with an antenna PAD10, an antenna PAD11, and three trimming capacitor connections PAD31, 32, and 33 that are aluminum-wired to the antenna PAD11. At this time, the PADs 10, 33, 32, 31, 11 are arranged in a row.
[0036]
Thereby, when mounting the LSI 9 on the substrate 2, as shown in FIG. 12, the PADs 21, 23, 25, 24, and 22 of the substrate 2 are mounted so as to face the PADs 10, 33, 32, 31, and 11, respectively. The PADs are selectively connected by wire bonding.
[0037]
As shown in FIG. 13, by connecting the PAD10 and the PAD21, the PAD11 and the PAD22, and the PAD31 and the PAD24 by wire bonding, an equivalent circuit as shown in FIG. 14 is obtained, and the trimming tuning is performed to the capacity (20pf) of the tuning capacitor 4. A small capacitance (2 pf) for correction of the capacitor 5 is added. The capacitance of the tuning capacitor 4 is a value obtained by subtracting the variation in the capacitance of the capacitor inside the LSI 9 from the capacitance required for the resonance frequency f.
[0038]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 2 + C))
It becomes.
[0039]
As shown in FIG. 15, by connecting the PAD10 and the PAD21, the PAD11 and the PAD22, and the PAD32 and the PAD25 by wire bonding, an equivalent circuit as shown in FIG. 16 is obtained, and the tuning (4 pf) of the tuning capacitor 4 is tuned for trimming. A small capacitance (4 pf) for correction of the capacitor 6 is added. The capacitance of the tuning capacitor 4 is a value obtained by subtracting the variation in the capacitance of the capacitor inside the LSI 9 from the capacitance required for the resonance frequency f.
[0040]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 4 + C))
It becomes.
[0041]
As shown in FIG. 17, by connecting the PAD10 and the PAD21, the PAD11 and the PAD22, and the PAD33 and the PAD23 by wire bonding, an equivalent circuit as shown in FIG. 18 is obtained, and the tuning (4 pf) of the tuning capacitor 4 is tuned for trimming. A small capacitance (6 pf) for correction of the capacitor 7 is added. The capacitance of the tuning capacitor 4 is a value obtained by subtracting the variation in the capacitance of the capacitor inside the LSI 9 from the capacitance required for the resonance frequency f.
[0042]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 6 + C))
It becomes.
[0043]
Further, the capacitance of the trimming tuning capacitors 5, 6, and 7 is set to 2 pf each, and PAD10 and PAD21, PAD11 and PAD22, PAD31 and PAD24, and PAD32 and PAD25 are connected by wire bonding, so that the correction capacitance is 4 pf. You may do it. The correction capacitance may be set to 6pf by connecting the PAD10 and the PAD21, the PAD11 and the PAD22, the PAD31 and the PAD24, the PAD32 and the PAD25, and the PAD33 and the PAD23 by wire bonding.
[0044]
In this embodiment, the correction values are determined by applying probes to the PADs 10 and 11 of the LSI 9 in advance, and the PADs 24, 25 and 23 having the required capacity and the PADs 31, 32 and 33 are connected by wire bonding in accordance with the correction values.
Another method is to connect all the PADs 21, 22, 24, 25, and 23 to the corresponding PADs 10, 11, 31, 32, and 33, and remove the wires while measuring the resonance frequency to set the tuning frequency to the target value. You may trim it.
[0045]
(Third embodiment)
In the first and second embodiments, the case where the trimming capacitor is provided on the substrate side is described. However, as the third embodiment, the case where the trimming capacitor is provided on the LSI side will be described. In this case, the description of the same parts as those of the first and second embodiments will be omitted.
That is, as shown in FIG. 19, one end of the antenna 2 is wired with the electrode 4a of the tuning capacitor 4 and the PADs 41, 42, 43, 44, and the other end of the antenna 2 is wired with the electrode 4b of the tuning capacitor 4 and the PAD 45. Wired.
[0046]
As shown in FIG. 20, the LSI 9 is provided with an antenna PAD10, an antenna PAD11, and three trimming capacitor connections PAD51, 52, 53 that are not in contact with the antenna PAD10. At this time, the PADs 10, 51, 52, 53, 11 are arranged in a row. At this time, the capacitance of each of the trimming capacitors 5, 6, and 7 is 2 pf.
[0047]
The PAD 11 and the aluminum electrodes 5b, 6b, 7b of the trimming tuning capacitors 5, 6, 7 are wired, the aluminum electrode 5a of the trimming tuning capacitor 5 and the PAD 53 are wired, and the aluminum electrode of the trimming tuning capacitor 6 is wired. 6a and PAD52 are wired, and the aluminum electrode 7a of the trimming tuning capacitor 7 and PAD51 are wired.
[0048]
For example, as shown in FIG. 21, the PAD10 and PAD41, the PAD11 and PAD45, the PAD51 and PAD42, the PAD53 and PAD44 are connected by wire bonding, so that the trimming tuning capacitors 5, 7 are added to the capacity of the tuning capacitor 4 (20pf). Is added (2 + 2 pf). The capacitance of the tuning capacitor 4 is a value obtained by subtracting the variation in the capacitance of the capacitor inside the LSI 9 from the capacitance required for the resonance frequency f.
[0049]
In this case, assuming that the capacitance of the LSI 9 is C, the resonance frequency f is
f = 1 / 2π√ (L (20 + 2 + 2 + C))
It becomes.
[0050]
Further, by connecting the PAD10 and the PAD41, the PAD11 and the PAD45, and the PAD51 and the PAD42 by wire bonding, a small capacitance (2pf) for correcting the trimming tuning capacitor 5 is added to the capacity of the tuning capacitor 4 (20pf).
[0051]
Also, by connecting PAD10 and PAD41, PAD11 and PAD45, PAD51 and PAD42, PAD52 and PAD43, PAD53 and PAD44 by wire bonding, the capacitance (20pf) of the tuning capacitors 4 and 6 and 7 A small capacitance (2 + 2 + 2pf) for correction is added.
In this embodiment, the substrate 2 is not provided with a trimming capacitor, but may be used in combination.
[0052]
Hereinafter, features of the present invention will be described.
[0053]
1. A plurality of selectively connectable pattern capacitors (tuning capacitors for trimming) are provided on a substrate of a wireless card.
[0054]
2. The capacitor is electrically open before mounting the LSI.
[0055]
3. The capacitor selecting means changes the mounting location of the LSI according to the capacitor.
[0056]
4. A desired resonance frequency can be obtained by selecting and connecting the capacitor.
[0057]
5. The LSI is characterized in that a PAD for selecting a circuit constant (capacitor capacity) is provided.
[0058]
6. The circuit constant selection PAD has a characteristic of changing the resonance frequency of the card by being connected to the capacitor terminal of the substrate.
[0059]
7. The PAD for selecting a circuit constant is electrically connected to at least one of the antenna PADs of the LSI directly or with a circuit constant interposed therebetween.
[0060]
7. The following is the case where a trimming capacitor is also provided on the LSI side. A plurality of capacitors having different or identical capacities are provided on an LSI of a wireless card, and a plurality of PADs corresponding to respective capacities are provided.
[0061]
9. The plurality of capacitors PAD are electrically open before the LSI is mounted, and are closed when connected to a substrate to change the resonance frequency of the card.
Thus, the capacitance of the trimming capacitor can be selected by changing the LSI mounting position.
[0062]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to provide a non-contact IC card mounting method capable of performing trimming (fine adjustment) of a tuning circuit without a device for cutting a capacitor pattern.
[Brief description of the drawings]
FIG. 1 is a diagram showing a schematic configuration of a non-contact IC card for explaining an embodiment of the present invention.
FIG. 2 is a diagram for explaining a PAD provided in an LSI.
FIG. 3 is a diagram for explaining a mounting position of an LSI on a substrate.
FIG. 4 is a diagram for explaining a mounting position of an LSI on a substrate.
FIG. 5 is a diagram for explaining a mounting position of an LSI on a substrate.
FIG. 6 is a view for explaining an equivalent circuit at the mounting position in FIG. 3;
FIG. 7 is a view for explaining an equivalent circuit at the mounting position in FIG. 4;
FIG. 8 is a view for explaining an equivalent circuit at the mounting position in FIG. 5;
FIG. 9 is a block diagram showing an internal configuration of an LSI.
FIG. 10 is a diagram showing a schematic configuration of a non-contact IC card.
FIG. 11 is a diagram illustrating a PAD provided in an LSI.
FIG. 12 is a diagram for explaining an LSI mounted state on a substrate.
FIG. 13 is a diagram for explaining a mounting state of an LSI on a substrate.
FIG. 14 is a view for explaining an equivalent circuit in the mounting state of FIG. 13;
FIG. 15 is a diagram illustrating a PAD provided in an LSI.
FIG. 16 is a view for explaining an equivalent circuit in the mounting state of FIG. 15;
FIG. 17 is a diagram illustrating a PAD provided in an LSI.
FIG. 18 is a view for explaining an equivalent circuit in the mounting state of FIG. 17;
FIG. 19 is a diagram showing a schematic configuration of a non-contact IC card.
FIG. 20 is a diagram illustrating a PAD provided in an LSI.
FIG. 21 is a view for explaining an LSI mounted state on a substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Contactless IC card (wireless card), 2 ... Board, 3 ... Antenna, 4 ... Tuning capacitor, 5, 6, 7 ... Tuning tuning capacitor, 8 ... Tuning circuit, 9 ... LSI, PAD1, ... connection terminal .

Claims (11)

The board has a tuning circuit composed of an antenna, a tuning capacitor, and a tuning capacitor for trimming, and has an LSI electrically connected to the tuning circuit and mounted on the board, and a resonance is generated by the tuning circuit and the LSI. In a contactless IC card having a circuit,
The tuning capacitors for trimming are electrically open before mounting the LSI, and a plurality of capacitors having different capacities are provided at different positions.
When mounting the above-mentioned LSI, various resonance frequencies are set by selectively changing the mounting location according to the trimming tuning capacitor, and the target trimming tuning capacitor is set by the pad provided on the LSI. A method for mounting a non-contact IC card, which is electrically connected to a tuning capacitor. 2. The method for mounting a non-contact IC card according to claim 1, wherein the LSI is mounted on the substrate by a flip chip method. 2. The method according to claim 1, wherein the LSI includes a power generation unit, a demodulation circuit, a control logic circuit, a modulation circuit, a memory, a clock generation circuit, and the like. An antenna, a tuning capacitor provided between both ends of the antenna, at least one first connection terminal connected to one connection point between the antenna and the tuning capacitor, and another connection between the antenna and the tuning capacitor At least one second connection terminal connected to a point, at least one third connection terminal provided in a non-contact manner with the second connection terminal, the first connection terminal, and the third connection terminal. A substrate connected between the connection terminal and the at least one trimming tuning capacitor for correcting a predetermined resonance frequency;
A circuit having a wireless communication function is built in, and first and second pads for antenna connection are respectively connected to both ends of the circuit, and a third pad connected to the second pad by a wiring is provided. Contactless IC card comprising an LSI having
A first pad of the LSI is connected to one of first connection terminals of the substrate, and a second pad of the LSI corresponds to a first connection terminal to which the first pad of the substrate is connected. And connecting the third pad of the LSI to a third connection terminal of the substrate corresponding to the second connection terminal to which the second pad is connected. A method for mounting a non-contact IC card, comprising mounting an LSI on a tuning capacitor substrate for trimming having different capacities. 5. The method for mounting a non-contact IC card according to claim 4, wherein the LSI is mounted on the substrate by a flip chip method. Separate rows of first, second, and third connection terminals are provided for each of the trimming tuning capacitors having various capacities on the substrate, and the first, second, and third pads of the LSI are also arranged in rows. And selectively mounting the first, second, and third pad rows of the LSI on one of the first, second, and third connection terminal rows of the trimming tuning capacitor. 5. The non-contact IC card mounting method according to claim 4, wherein the resonance frequency is set to various values. 5. The method for mounting a non-contact IC card according to claim 4, wherein the LSI includes a power generation unit, a demodulation circuit, a control logic circuit, a modulation circuit, a memory, a clock generation circuit, and the like. An antenna, a tuning capacitor provided between both ends of the antenna, a first connection terminal connected to one connection point between the antenna and the tuning capacitor, and a connection terminal connected to the other connection point between the antenna and the tuning capacitor And at least one third connection terminal connected to the other connection point between the antenna and the tuning capacitor via a trimming tuning capacitor for correcting a predetermined resonance frequency. Board and
A first and a second pad for antenna connection, which are each provided with a circuit having a wireless communication function and are connected to both ends of the circuit, and at least one third pad connected to the second pad by wiring A non-contact IC card composed of an LSI having a pad and
A first pad of the LSI is connected to a first connection terminal of the substrate, a second pad of the LSI is connected to a second connection terminal of the substrate, and a third pad of the LSI is connected to the substrate. A trimming tuning capacitor having a different capacity by selectively connecting to the third connection terminal. 9. The method for mounting a non-contact IC card according to claim 8, wherein the LSI is mounted on the substrate by connecting the connection terminals on the substrate and the pads of the LSI by a wire bonding method. An antenna, a tuning capacitor provided between both ends of the antenna, a first connection terminal connected to one connection point between the antenna and the tuning capacitor, and a connection terminal connected to the other connection point between the antenna and the tuning capacitor A plurality of second connection terminals,
A first and a second pad for antenna connection, each having a built-in circuit having a wireless communication function and connected to both ends of the circuit, and a trimming tuning capacitor for correcting the second pad and a predetermined resonance frequency. A contactless IC card comprising an LSI having at least one third pad connected through
Connecting a first pad of the LSI to a first connection terminal of the substrate, connecting a second pad of the LSI to one of second connection terminals of the substrate, and connecting a third pad of the LSI Characterized by selectively connecting to a second connection terminal of the substrate to which the second pad is not connected, thereby mounting a trimming tuning capacitor having a different capacity. . 11. The method for mounting a non-contact IC card according to claim 10, wherein the LSI is mounted on the substrate by connecting the connection terminals on the substrate and the pads of the LSI by a wire bonding method.

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