JP2003298266A - Power supply - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power supply wherein even when a large heat sink is installed, the size of the whole of the power supply is not increased, and a work to install a power semiconductor device is facilitated. <P>SOLUTION: The power supply comprises a heat sink having a protrusion at a predetermined position on a flat plate, an electric power semiconductor device fixed to the protrusion, and a substrate which is installed substantially in parallel to a base surface of the substrate excepting the protrusion of the same, and which includes a scooped portion at a position corresponding to the protrusion, and further to which a terminal of the electric power semiconductor device is connected. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a power supply.

[0002]

2. Description of the Related Art A conventional power source is provided with a power semiconductor element. Since this power semiconductor element has a large power loss, a large heat dissipation plate is required.

When a large radiator is installed on the board on which the power semiconductor element is provided, other electric parts cannot be mounted on the board, and accordingly, a new board is provided and the electric parts are mounted. To do. This causes a problem that the shape of the entire power supply becomes large.

If a large radiator is bent in a zigzag shape instead of being a flat plate, the area for mounting other electric components on the substrate increases, but still, The problem remains that the overall shape of the power supply is large.

[0005]

On the other hand, in order to prevent the overall shape of the power supply from becoming large, a flat heat sink and a substrate are arranged in parallel, and the power semiconductor element is fixed to the heat sink. The terminal may be connected to the substrate. That is, the substrates are arranged in parallel on the flat heat dissipation plate, the heat dissipation plate and the substrate are spaced apart, the power semiconductor element is fixed to the heat dissipation plate, and the terminals of the power semiconductor element are set on the substrate. It is possible to connect.

In this case, the terminal of the power semiconductor element is bent upward, a through hole is provided at a substrate position corresponding to the tip of the bent terminal, and the tip of the bent terminal is passed through the through hole. It is conceivable to connect the tips of the terminals to the substrate.

However, in this case, when the positions of the through holes provided in the substrate and the tips of the terminals of the power semiconductor element are aligned, the tips of the terminals of the power semiconductor element are placed under the substrate. Since the terminals of the power semiconductor element are present and cannot be visually recognized, there is a problem that it is difficult to align the through hole provided in the substrate with the tip of the terminal of the power semiconductor element.

According to the present invention, even if a large heat sink is installed in the power source, the shape of the entire power source does not become large, and moreover,
An object of the present invention is to provide a power supply in which a power semiconductor element can be easily installed.

[0009]

According to the present invention, there is provided a heat dissipation plate having a convex portion, a power semiconductor element fixed to the convex portion, and a cutout portion at a portion corresponding to the convex portion. And a substrate to which the terminals of the power semiconductor element are connected.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a perspective view showing a power supply PS1 which is an embodiment of the present invention.

FIG. 2 is a vertical sectional view taken along the line II-II 'of FIG.

FIG. 3 is a perspective view showing the heat dissipation plate 10 in the above embodiment.

FIG. 4 is a perspective view showing the substrate 30 in the above embodiment.

The power source PS1 has a heat sink 10, a power semiconductor element 20, a printed circuit board 30, and a fixture 40.

The heat dissipation plate 10 has a flat plate-shaped base surface 11, a convex portion 12, an inclined portion 13, and a window 14. The convex portion 12 may be formed integrally by processing the heat dissipation plate 10 itself, but it is formed by processing a separate metal plate having good heat conduction and is bonded to the heat dissipation plate 10. Good.

The convex portion 12 is provided at a predetermined position on the flat plate-shaped base surface 11, and the inclined portion 13 is a portion existing between the base surface 11 and the convex portion 12. The window 14 is provided on the inclined portion 13.

The main body of the power semiconductor element 20 is fixed to the convex portion 12, and the terminal 21 thereof is connected to the substrate 30.

The substrate 30 has a convex portion 12 in the heat sink 10.
Is installed almost parallel to the base surface 11 (base) except the
2 has a cutout portion 31 at a position corresponding to 2, and the electric component mounting surface of the substrate 30 to which the terminal 21 of the power semiconductor element 20 is connected and the top surface of the convex portion 12 are substantially at the same height. is there.

The fixture 40 fixes the heat sink 10 and the substrate 30 to each other while maintaining a predetermined distance therebetween.

In FIG. 1, among the electric components mounted on the power supply PS1, the electric components other than the power semiconductor element 20 are omitted.

Further, a window 14 is provided in the inclined portion 13 provided between the flat surface portion of the convex portion 12 of the heat dissipation plate 10 and the base surface 11 of the heat dissipation plate 10, and the terminal of the power semiconductor element 20 is provided. A window 14 is provided near 21.

Further, in the heat radiating plate 10, a convex portion 12 is formed by hitting a predetermined position of the flat plate including the base surface 11.

Next, a method of manufacturing the power supply PS1 will be described.

The substrate 30 has thin slits formed in advance along the cut-out portion 31, and the substrate portion corresponding to the cut-out portion 31 is joined to another substrate portion at two or four positions to form a cut-out portion. By applying an external force to the substrate surface corresponding to 31, the joint portion is easily broken, only that portion is removed, and the cutout portion 31 is formed.

First, the surface-mounted components of the printed circuit board 30 are mounted and fixed by reflow soldering. next,
The power semiconductor element 20 and other discrete components are fixed to the printed circuit board 30 by flow soldering.
At this time, the flow soldering is performed while temporarily fixing the main body of the power semiconductor element 20 to a predetermined position on the substrate surface corresponding to the cutout portion 31 with a temporary fixing pin (not shown). After that, the temporary fixing pin is removed, an external force is applied to the substrate surface corresponding to the cutout portion 31, and only that portion is deleted to form the cutout portion 31.

Then, a surface mount component (not shown) is placed on the substrate 30 and connected by reflow soldering.

Next, the radiator plate 10 and the substrate 30 are fixed to each other by the fixture 4.
Fixed to each other via 0. Prior to this fixing, first, in FIG. 1, a fixing tool 40 is set up in four pin insertion holes (not shown) formed at four corners and predetermined positions of the heat dissipation plate 10,
Fix it.

Then, the printed circuit board 30 is mounted,
The tip of each fixture 40 is inserted into a pin insertion hole (not shown) of the printed circuit board 30 and fixed. The fixing tool 40 has a diameter reduced by a length portion having both ends, and only the portion having a small diameter is inserted into the insertion holes (not shown) of the heat sink 10 and the printed circuit board 30, respectively, and further inserted. There is no such thing.

Therefore, the gap between the heat sink 10 and the printed circuit board 30 is kept constant, and in this state, the top surface of the convex portion 12 is at substantially the same height as the upper surface of the printed circuit board 30. . Further, in this state, the convex portion 1
The through holes for screwing (not shown) formed on the top plane of 2 and the through holes (not shown) formed in the main body of the power semiconductor element 20 substantially coincide with each other, and The main body can be easily fixed to the top surface of the convex portion 12 with screws.

According to the above-described embodiment, a large heat sink 10 can be installed in parallel with the substrate 30, and the overall shape of the power source PS1 does not become large, and the power semiconductor element 20 is mounted on the substrate 30. When it is connected to, the power semiconductor element 20 can be easily installed because it can be visually recognized.

A window 14 is provided in the inclined portion 13 provided between the flat surface portion of the convex portion 12 of the heat dissipation plate 10 and the base surface 11 of the heat dissipation plate 10, and the terminal of the power semiconductor element 20 is provided. Since the window 14 is provided in the vicinity of 21,
In the state shown in (1), the state where the terminal 21 of the semiconductor element 20 is connected to the substrate 30 can be visually recognized from the lower side (from the lower side of the heat dissipation plate 10).

Further, in the heat dissipation plate 10, since the flat plate 11 is hit at a predetermined position to form the convex portion 12, the heat conduction is superior to that in the case where the heat dissipation plates are welded to each other.

If the top surface of the convex portion 12 is flat, it may rise vertically or in an arc shape.
The top surface of the convex portion 12 does not necessarily have to be substantially equal to the upper surface of the printed circuit board 30, and may be somewhat higher.
It may be low.

Further, in the above embodiments, the example in which the power semiconductor element is fixed to the top surface of the convex portion 12 is described, but in addition to the single or plural main switching semiconductor elements and the rectifying diode, If necessary, other electrical components that generate a large amount of heat such as resistors may be fixed to the top surface of the convex portion 12.

Furthermore, a plurality of convex portions 12 and hollow portions 31 may be provided, and another printed circuit board exists between the heat sink 10 and the printed circuit board 30, and the printed board thereof is provided. The electric component mounted on the circuit board and the power semiconductor element 20 may be connected.

[0036]

According to the present invention, even if a large heat sink is installed in the power supply, the shape of the entire power supply does not become large,
Moreover, there is an effect that the power semiconductor element can be easily installed.

According to the invention described in claim 5, since the top surface of the convex portion and the top surface of the substrate are on substantially the same surface, mounting of the power semiconductor element and soldering are performed by another discrete electric device. This has the advantage that it can be carried out with parts and therefore does not complicate the manufacturing process.

[Brief description of drawings]

FIG. 1 is a perspective view showing a power supply PS1 which is an embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view taken along the line II-II ′ of FIG.

FIG. 3 is a perspective view showing a heat dissipation plate 10 in the above embodiment.

FIG. 4 is a perspective view showing a substrate 30 in the above embodiment.

[Explanation of symbols]

PS1 ... power supply, 10 ... Heat sink, 11 ... Base surface, 12 ... convex portion, 13 ... Inclined part, 14 ... windows, 20 ... Semiconductor element for electric power, 21 ... Terminal, 30 ... substrate, 31 ... the cut-out section, 40 ... A fixture.

Continued front page    (72) Inventor Mitsuhiko Someya             Oriji, 1-1-18 Takada, Toshima-ku, Tokyo             N Denki Co., Ltd. F-term (reference) 5E322 AA11 AB02 AB07                 5F036 AA01 BB05 BC03 BC33

Claims (5)

[Claims] 1. A heat dissipation plate having a convex portion at a predetermined position of a flat plate; a power semiconductor element fixed to the convex portion;
Of the heat dissipation plate, the substrate is installed substantially parallel to the base surface excluding the convex portion, and has a cutout portion at a position corresponding to the convex portion, and the terminal of the power semiconductor element is A power source having a substrate connected thereto. 2. The inclined portion provided between the flat surface portion of the convex portion of the heat dissipation plate and the base surface of the heat dissipation plate, and in the vicinity of the terminal of the power semiconductor element according to claim 1. The power supply is characterized in that it is provided with a window. 3. The heat radiating plate according to claim 1, wherein the predetermined position of the flat plate is processed,
A power source, which is a heat dissipation plate on which the convex portion is formed. 4. The power source according to claim 1, wherein the metal plate having a convex portion formed by processing a metal plate separate from the heat dissipation plate is adhered to the heat dissipation plate. . 5. The fixture according to claim 1, further comprising a fixture for supporting the substrate on the heat dissipation plate so that a top surface of the convex portion and an upper surface of the substrate are substantially flush with each other. Power supply.