JP2009032863A - Cement resistor attaching structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cement resistor attaching structure such that a cement resistor which is mounted with a main body portion generating heat apart from a wiring board is stably attached to the wiring board without using any special member. <P>SOLUTION: Disclosed is a cement resistor attaching structure for attaching the cement resistor having the main body portion connected to tips of a pair of terminals formed in a flat shape in a state wherein the cement resistor stands upright on the wiring board, and the cement resistor attaching structure has a support portion in a flat plate shape and an engagement portion projecting from the side portion of the support portion, wherein the engagement portion is inserted into a through-hole formed in a terminal and a surface where the engagement portion is formed is brought into contact with a terminal portion. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a cement resistance mounting mechanism that supports a terminal of cement resistance so that a main body portion is stably separated from a wiring board.

  Electronic devices such as display devices and optical disk devices have a wiring board on which electronic components are mounted. The wiring board is formed of a metal thin film on one surface, and is fixed by inserting a metal terminal of an electronic component from the other surface side and soldering to the thin film.

  Many of the electronic components mounted on the wiring board are usually mounted in contact with or close to the board. In this case, the electronic component is stably mounted on the wiring board. On the other hand, in the case of a large amount of heat generation such as cement resistance, in order to suppress the heat from acting on the wiring board and other electronic components mounted, the terminal is lengthened and the main body is removed from the wiring board. It can be installed in a remote state or with heat countermeasures.

  In ordinary electronic equipment, when installing a cement resistor with a large amount of heat generation, if there is not enough space in the interior, take measures against heat (install a heat insulating member or install a heat radiating member) and install it. When there is a margin, there are many cases where the terminal of the cement resistance is extended and the main body which is the heating element of the cement resistance is fixed to the substrate so as to be separated from the wiring substrate.

  In this way, in the case of cement resistance supported only by the terminal, since the main body, which is a heavy object, is supported by a thin terminal, when vibration is applied to the wiring board and / or the cement resistance. The terminal is bent, and the main body comes into contact with or approaches the wiring board or the mounted electronic component. As described above, when the main body comes into contact with or approaches the wiring board or the mounted electronic component, the heat generated from the main body has an adverse effect on the wiring board or the mounted electronic component. It can happen.

  In view of this, the invention described in Japanese Patent Application Laid-Open No. 6-260737 discloses a holding device that holds an electronic component and that is mounted by engaging the holding device with the wiring board. In the case of this holding device, since the lead terminal wire is held by the resin holding device, even if an external force is applied to the electronic component, the holding device receives the force, so that the lead terminal wire is broken. Generation | occurrence | production can be suppressed.

  Similarly, the invention described in Japanese Patent Laid-Open No. 2002-50847 also shows an electronic component mounting holder for mounting an electronic component (LED) by speaking from a wiring board. The electronic component mounting holder of the present invention has a through hole, and the lead terminal is disposed so as to penetrate the through hole, and the protruding portion protruding from the through hole is fixed to the wiring board and mounted. Is. In the case of this electronic component mounting holder, the electronic component can be arranged at a position away from the wiring board.

JP-A-6-260737 Japanese Patent Laid-Open No. 2002-50847

  However, when the invention described in JP-A-6-260737 is applied to cement resistance, since the main body of the cement resistance is also housed inside the resin holding device, it is necessary to take measures against heat generation. , The cost will be higher. In addition, since most of the lead terminal wires are arranged inside the holding device, it is difficult to adjust the arrangement of the tip portions of the lead terminal wires. That is, a holding device having a shape that matches the shape of the electronic component and the wiring board to which the electronic component is attached (for example, when there are two lead terminal wires, the arrangement of through holes and the interval between the through holes) is required. When the shape of the wiring board is shifted due to manufacturing errors or the like, there may be a problem that the lead terminal wires cannot be attached.

  Similarly, in the invention described in Japanese Patent Application Laid-Open No. 2002-50847, since the lead terminal of the electronic component is held by the electronic component mounting holder, the electronic component mounting for each shape of the wiring board to which the lead terminal is attached is provided. A holder must be prepared. In addition, since the electronic component mounting holder holds the lead terminals, the handling of the lead terminals is limited, and the lead terminals cannot be attached to the wiring board when the shape of the wiring board is shifted. May occur.

  Accordingly, an object of the present invention is to provide a cement resistance mounting structure capable of stably mounting a cement resistor for mounting a heat generating main body portion away from a wiring board to the wiring board without using a special member. To do.

  In order to achieve the above object, the present invention is a cement resistance mounting mechanism for mounting a cement resistor having a main body connected to the tips of a pair of terminals formed in a flat plate shape while standing on a wiring board. The cement resistance mounting mechanism has a flat plate-like support portion and an engagement portion protruding from a side portion of the support portion, and the engagement portion is inserted into a through hole formed in the terminal. And the surface in which the said engaging part is formed is contacting the said terminal part.

  According to this configuration, a member having a simple configuration is used and can be easily attached, and heat from the main body is effectively attached to the wiring board and the wiring board without much effort and time. The cement resistor can be attached to the wiring board while suppressing influence on the electronic device.

  Thereby, it can suppress that the cost of attachment of cement resistance rises.

  The said structure WHEREIN: The said cement resistance attachment mechanism may be manufactured by cutting out the part in which the metal thin film is formed among the remaining waste substrates which manufactured the said wiring board. According to this configuration, since the cement resistance mounting mechanism is formed using what has been discarded, it is possible to eliminate waste and reduce the manufacturing cost of the cement resistance mounting mechanism.

  The said structure WHEREIN: The said support part may be in contact with the said main-body part and the said wiring board. According to this configuration, the cement resistance can be fixed more stably.

  In the above configuration, a connection part is formed at an end of the support part on the previous wiring board side, and the connection part penetrates a through hole formed in the wiring board and protrudes from the through hole. May be fixed to the wiring board by soldering.

  The said structure WHEREIN: The said support part is independently contacted and attached to each of a pair of said terminal, and the said support part is more than the surface on the opposite side to the surface facing the other terminal of the said pair of terminals. The engaging part may be penetrated through the through hole.

  The said structure WHEREIN: The said support part is a flat plate formed in square shape, the said engaging part protrudes in the mutually opposite direction from the side part which the said square shape opposes, The edge | side where the said engaging part does not protrude One of the portions is in contact with the wiring board, and two side portions from which the engaging portions protrude are individually in contact with the mutually facing surfaces of the pair of terminals. It may be a thing.

  ADVANTAGE OF THE INVENTION According to this invention, the cement resistance attachment structure which can attach to the said wiring board stably the cement resistance which leaves | separates and mounts the main-body part which heat | fever-generates from a wiring board can be provided, without using a special member.

  Embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view when cement resistance is mounted using the cement resistance mounting mechanism according to the present invention, FIG. 2 is a front view of the cement resistance shown in FIG. 1, and FIG. 3 is a cement resistance shown in FIG. FIG.

  As shown in FIG. 1, the cement resistor 1 has a rectangular parallelepiped main body portion 11 and a pair of terminal portions 12 protruding from the lower surface of the main body portion 11. Although the inside of the main body portion 11 is not shown, it has a winding structure, and the electric power supplied via the terminal portion 12 is converted into heat by the winding structure portion, so that the voltage and / or (or ) The current is adjusted. The terminal portion 12 has a flat plate shape that is orthogonal to the longitudinal direction of the main body portion 11, and is arranged side by side in the longitudinal direction of the main body portion 11. A rectangular through hole 121 is formed in the terminal portion 2. Although two through holes 121 are formed side by side in the longitudinal direction of the terminal portion 12, the present invention is not limited to this.

  The terminal portion 12 is disposed so as to penetrate the through hole 21 formed in the wiring board 2. As shown in FIG. 2 or 3, the tip 12 t protruding from the through hole 21 and the wiring pattern (not shown) that is a metal thin film formed on the wiring board 2 are soldered, so that the wiring board 2 is fixed.

  As shown in FIGS. 1, 2, and 3, when the cement resistor 1 is mounted on the wiring board 2, the terminal portion 12 is disposed in a state where it stands up with respect to the wiring board 2. Thereby, it can suppress that the heat which generate | occur | produces in the main-body part 11 of the cement resistance 1 affects the other electronic components mounted in the wiring board 2 and / or the wiring board 2. FIG.

  The attachment member 3 is manufactured from the remaining substrate material (waste substrate) obtained by molding the wiring board 2, and has a rectangular support portion 31 and an engagement portion 32 that protrudes from one long side of the support portion 31. And have. As shown in FIGS. 1 and 2, the engaging portion 32 is formed so as to be flush with the support portion 31. The engaging portion 32 has a rectangular shape and is formed in a portion near the upper end portion 31 u of the support portion 31.

  The mounting of the cement resistor 1 on the wiring board 2 using the mounting member 3 will be described. The engaging portion 32 of the mounting member 3 is inserted from the outside of the terminal portion 21 into the through hole of the terminal portion 21 of the cement resistor 1. By inserting the engaging portion 32, the upper end portion 31u of the support portion 31 is in contact with the main body portion 11 of the cement resistor 1, and the support portion 31 is at a predetermined angle (right angle here) with respect to the terminal portion 12. And is arranged in contact with the terminal portion 12. The front end portion 12 t of the terminal portion 12 and the lower end portion 31 t of the support portion 31 of the attachment member 3 are penetrated through the through hole 21 of the wiring board 2. Here, a metal thin film is formed at least on the surface of the lower end portion 31 t of the support portion 31 similarly to the wiring substrate 2.

  As shown in FIG. 2 or FIG. 3, the portion protruding from the through hole 21 at the tip end portion 12 t of the terminal portion 12 and the lower end portion 31 t of the support portion 31 and the metal film on the back surface of the wiring board 2 are soldered. Thus, the main body 11 of the cement resistor 1 is fixed in a state of being separated from the wiring board 2.

  Thus, since the cement resistor 1 is attached to the wiring board 2 using the attachment member 3, the longitudinal direction of the main body 11 of the cement resistor 1 (the direction indicated by the arrow Ar1 in FIGS. 1 and 2), in other words, For example, even if a vibration that cannot be suppressed by the thickness of the terminal portion 12 acts in the thickness direction of the terminal portion 12, the vibration is suppressed by the support portion 31, and the main body portions 11 and ( Or) It can suppress that the terminal part 12 shakes, and can suppress that the malfunction which the terminal part 12 bends or bends generate | occur | produces.

  Next, the manufacturing method of the attachment member 3 is demonstrated. FIG. 4 is a view showing a manufacturing process of an attachment member forming the cement resistance attachment mechanism according to the present invention. The resin substrate Bp is a rectangular resin thin plate, and a thin film Th of metal (metal having high conductivity, here, copper, aluminum, etc.) is formed on at least one surface of the resin substrate Bp. As shown in FIG. 4, the metal thin film Th is formed slightly smaller than the resin substrate Bp.

  A portion surrounded by a one-dot chain line on the resin substrate Bp on which the metal thin film Th is formed is an area used as the wiring substrate 2. The resin substrate Bp is formed in accordance with the shape of the wiring substrate 2 (in accordance with the one-dot chain line). Disconnected. Conventionally, the remaining part of the resin substrate Bp cut out of the wiring substrate 2 has been conventionally discarded as waste material. The attachment member 3 is formed by cutting the portion of the discarded substrate Bq, which has been discarded as waste material, into the shape of the attachment member 3.

  Since the mounting member 3 can be formed by cutting the discarded substrate Bq in this way, since the previously discarded member is used without using a new material, it is possible to reduce waste. is there. In addition, soldering is performed when the cement resistor 1 is mounted and mounted on the wiring board 2, but a metal thin film that can be soldered to the mounting member 3 in advance is formed by using the discard board Bq. It is possible to perform the soldering simultaneously with the soldering of the portion 12. This eliminates the need for using a separate member for fixing the attachment member 3, and the process can be performed in a series of steps, thereby reducing costs. Further, since the metal thin film is formed, heat can be transferred to the metal thin film (for example, the main body part 11 and the terminal part 12 are brought into contact with the metal thin film), so that the heat radiation area can be increased. It is possible to increase the heat dissipation effect.

  FIG. 5 is a front view of another example of a cement resistance mounting mechanism according to the present invention. The attachment member 4 shown in FIG. 5 includes a rectangular support portion 41 and two engagement portions 42 that individually protrude from one long side of the support portion 41. The engaging portion 42 is inserted into each of two through holes 121 formed in the terminal portion 12. The attachment member 4 is formed such that the upper end 41 u of the support 41 is in contact with the lower surface of the main body 11 of the cement resistor 1 with the engaging portion 42 inserted into the through-hole 121.

  In this state, the tip end portion 12 t of the terminal portion 12 is inserted into the through hole 21. When the distal end portion 12 t is inserted into the through hole 21, the lower end portion 41 t of the support portion 41 of the attachment member 4 comes into contact with the upper surface of the wiring board 2. And the cement resistor 4 is attached by soldering the part which protruded from the through hole 21 of the front-end | tip part 12t of the terminal part 12 to a wiring pattern (illustration omitted).

  Even if the cement resistor 1 is vibrated by the mounting member 4, the terminal portion 12 is suppressed from being bent or broken. Further, since the lower end portion 41t of the support portion 41 abuts on the upper surface of the wiring board 2 at the time of attachment, it is not necessary to provide a hole through which the support portion 41 penetrates the wiring board 2, and the degree of freedom of wiring is increased. Can be saved.

  Further, by adjusting the length from the lower end portion 41t of the support portion 41 to the engagement portion 42 to an appropriate length, the distance between the main body portion 11 of the cement resistor 1 and the upper surface of the wiring board 2 is automatically set. Therefore, it is possible to mount the cement resistor 1 quickly and accurately.

  In each of the above-described embodiments, the pair of mounting members 3 and 4 is described as an example of mounting from the surface opposite to the facing surface of the pair of terminal portions 12, but is not limited thereto. At least one of the pair of attachment members 3 and 4 may be attached to the mutually opposing surface sides of the terminal portion 12. It is preferable to adjust the mounting position according to the shape of the wiring board 2.

  Still another example of the cement resistance mounting mechanism according to the present invention will be described. FIG. 6 is a front view of still another example of the cement resistance mounting mechanism according to the present invention. The mounting member 5 shown in FIG. 6 is formed so as to form the same surface as the support portion 51 from the rectangular support portion 51 disposed between the pair of terminal portions 12 of the cement resistor 1 and both ends of the support portion 51. And two engaging portions 52 projecting from each other.

  In the support portion 51, two engagement portions 52 formed at both ends are inserted into through holes 121 formed in the pair of terminal portions 12, respectively. As described above, the two engaging portions 52 are inserted into the through holes 121 of the different terminal portions 12, so that the length between the terminal portions 12 can be easily kept constant. Thus, even when the pair of terminal portions 12 are inserted into the through holes 21 of the wiring board 2, they can be easily and reliably inserted.

  Furthermore, since the engaging part 52 is inserted in the through-hole 121 formed in each of the pair of terminal parts 12, the insertion amount of the tip part 12t of the terminal part 12 can be adjusted appropriately. Thereby, the distance between the cement resistor 1 and the substrate 2 can be easily adjusted. Further, since the attachment member 5 holds the lower portions of both of the pair of terminal portions 12, the terminal portion 12 is bent or bent, and the distance between the main body portion 11 of the cement resistor 1 and the wiring board 2 is shortened. , It is possible to suppress heat from adversely affecting other electronic components.

  In the above-described embodiment, the terminal portions 12 are mounted so as to be parallel to each other and orthogonal to the wiring board. However, the present invention is not limited to this, and the approach from the wiring board 2 toward the main body 11 is performed. The mounting members 3, 4 are also formed on the ones formed so as to be separated, the ones formed so as to be separated from each other, the ones which are balanced but formed at an angle not perpendicular to the wiring board, and the like. 5 can be used. In these cases, mounting is possible by forming the support part and the engaging part so that the shape of each terminal part is not a rectangular shape, but a shape that matches the mounting angle (for example, a parallelogram, trapezoid, etc.) It is.

  As mentioned above, although embodiment of invention was described concretely, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary.

  The present invention can be applied to attachment of a cement resistor attached to a wiring board used in an electronic device.

It is a perspective view when a cement resistance is mounted using the cement resistance mounting mechanism according to the present invention. It is a front view book of the cement resistance shown in FIG. It is a side view of the cement resistance shown in FIG. It is a top view which shows the state which forms the attachment mechanism concerning this invention. It is a front view of the other example of the attachment mechanism of the cement resistance concerning this invention. It is a front view of the further another example of the cement resistance attachment mechanism concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Cement resistance 11 Main-body part 12 Terminal part 2 Wiring board 21 Through hole 3, 4, 5 Mounting member

Claims (6)

A cement resistance mounting mechanism for mounting a cement resistor having a main body connected to the tip of a pair of terminals formed in a flat plate shape in a standing state on a wiring board,
The cement resistance mounting mechanism has a flat plate-like support portion, and an engagement portion protruding from a side portion of the support portion,
The cement resistance mounting mechanism, wherein the engaging portion is inserted into a through-hole formed in the terminal and a surface on which the engaging portion is formed is in contact with the terminal portion.   The cement resistance mounting mechanism according to claim 1, wherein the cement resistance mounting mechanism is manufactured by cutting out a portion on which a metal thin film is formed from the remaining waste board from which the wiring board is manufactured.   The cement resistance attachment mechanism according to claim 1, wherein the support portion is in contact with the main body portion and the wiring board. A connection part is formed at an end of the support part on the wiring board side,
The cement resistor according to claim 1 or 2, wherein the connecting portion penetrates a through hole formed in the wiring board, and a portion protruding from the through hole is fixed to the wiring board by soldering. Mounting mechanism. The support part is attached in contact with each of the pair of terminals independently,
5. The support portion is configured such that the main body portion is in contact with a surface opposite to a surface facing the other terminal of the pair of terminals, and the engaging portion is penetrated through the through hole. A cement resistance mounting mechanism according to any one of the above. The support part is a flat plate formed in a quadrilateral shape, and the engagement part protrudes in opposite directions from the opposing side parts of the square shape,
One of the side portions from which the engaging portion does not protrude is in contact with the wiring board, and the two side portions from which the engaging portion protrudes are opposed to each other of the pair of terminals. The cement resistance mounting mechanism according to claim 1, which is in contact with each other separately.

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