JP2003282768A - Auxiliary package for wiring - Google Patents

Abstract

(57) [Summary] PROBLEM TO BE SOLVED: To provide an electronic component when mounting it on a printed wiring board.
Easily remove signal lines from the center of the lower surface of the child component package
Malfunction of an electronic circuit taken out and mounted with electronic components
Motion and prevent radiation noise. SOLUTION: A wiring auxiliary package 5 is a semiconductor integrated circuit.
Formed in the center of the lower surface of electronic component packages such as circuits
External terminal 7 formed corresponding to the external terminal₁, 7 ₁When,
Formed corresponding to the external terminals formed on the outer periphery of the lower surface
External terminal 7₂, 7 ₂And external terminal 7₁, 7₂Connect between
Internal wiring circuits 6 and 6 are provided. Underside of electronic components
The external terminal at the center is a through-hole provided on the printed wiring board 3.
-External terminal 7 through hole 4₁Connected to the internal wiring
Circuit 6, external terminal 7₂And the signal line is taken out. next to
Conductive in the space between adjacent internal wiring circuits 6 and 6
A solid pattern 9 made of a material is formed.
Connected to ground.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring auxiliary package, and more particularly, to a printed wiring board for mounting an electronic component having an external terminal row not only on the outer peripheral portion of the package lower surface but also in the central portion. The present invention relates to a wiring auxiliary package for easily taking out external terminals at the center of the lower surface of a package that cannot be connected by a wiring board.

[0002]

2. Description of the Related Art Conventionally, in electronic parts such as semiconductor integrated circuits, in response to the demand for higher pin count and downsizing,
BGA (ball grid array), CSP (chip size packag
The development of thin, compact, multi-pin packages such as e) is progressing. However, the development of printed wiring boards corresponding to the evolution of semiconductor integrated circuits has not progressed so much, and the pin count is restricted as the downsizing of electronic component packages such as semiconductor integrated circuits progresses. When mounting a package that has an external terminal row on the bottom surface of a conventional general printed wiring board, even if pins are placed in the center of the bottom surface of the package due to the multi-pin array, the pins in the center of the bottom surface are Since the signal line cannot be drawn out, it was necessary to avoid arranging the external terminal row in the central portion of the lower surface of the package.

[0003] As a conventional example of means for solving the lead-out of signal lines from such a semiconductor package having a multi-pin array, Japanese Patent Laid-Open No. 11-68026 (wiring auxiliary package and printed circuit wiring board structure) is disclosed. The invention is known, and according to this wiring auxiliary package of the conventional example, it is possible to take out external terminals at the central portion of the lower surface of the package, which cannot be processed by a normal printed wiring board.

FIG. 4 is a longitudinal sectional view showing a usage state of the wiring auxiliary package described in Japanese Patent Laid-Open No. 11-68026. As shown in FIG. 4, the multilayer printed wiring board 3
A wiring auxiliary package 5 is provided at a position corresponding to the existing multi-pin semiconductor integrated circuit package 1 with the pin sandwiched therebetween. On the lower surface of the multi-pin semiconductor integrated circuit package 1, the external terminal rows 2 are arranged not only in the outer peripheral portion but also in the central portion. From the outer terminal row in the outer peripheral portion, signals are output using the surface layer and the second layer of the printed wiring board 3. Take out the line. Through holes 4 are provided in the multilayer printed wiring board 3 at positions corresponding to the external terminal rows 2 at the center of the semiconductor integrated circuit package 1. The auxiliary wiring package 5 has external terminal rows 7 arranged at the outer peripheral portion and the central portion of the surface facing the printed wiring board 3, and the internal circuit wiring is provided between the external terminal row at the central portion and the external terminal row at the outer peripheral portion. 6 is connected and the whole is held by the external mold package 8. That is, the wiring auxiliary package 5 is provided with only the internal circuit wiring 6 and the external terminal row 7 in the external molded package 8, and has a configuration in which arbitrary external terminals are connected to each other by the internal signal wiring. is there. With the structure of the auxiliary wiring package as described above, the signals output from the external terminal rows 2 at the central portion of the lower surface of the semiconductor integrated circuit package 1 are transmitted to the external terminal rows at the central portion of the auxiliary wiring package 5 through the through holes 4, respectively. From there, the signal line is taken out through the internal circuit wiring 6, the terminal row in the outer peripheral portion, and the surface layer and the second layer of the printed wiring board 3.

[0005]

In the conventional wiring auxiliary package, the external terminal at the central portion of the lower surface of the electronic component package which cannot be processed by the printed wiring board can be taken out from the back surface of the printed wiring board, and the printed wiring board is also provided. However, the internal circuit wiring was related to the connection of only the signal lines, though the wiring was densely packed to reduce the congestion. For this reason, the power supply and the ground (GND) system, which become the feedback loop of the signal current, are weakened, and there is a risk that the electronic circuit malfunctions due to the instability of the signal and the radiation noise is generated. . Therefore, according to the present invention, when an electronic component such as a semiconductor integrated circuit having an external terminal array also on the lower surface of the package is mounted on the printed wiring board, the external terminal array on the lower surface of the package cannot be processed by the printed wiring board. Wiring assistance that easily takes out the signal line from the outside and prevents the malfunction of the electronic circuit that mounts the electronic part that has the external terminal row in the center of the package bottom on the printed wiring board and prevents the generation of radiation noise. Intended to provide the package.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and the invention of claim 1 is directed to an external terminal row or an external lead of an electronic component mounted on a printed wiring board. In a wiring auxiliary package including an external terminal row connected to a wire and an internal circuit wiring connecting terminals of the external terminal row, a solid pattern of a power supply line or a ground line adjacent to the internal circuit wiring It is characterized by having.

According to a second aspect of the present invention, an external terminal row connected to an external terminal row or an external lead line of an electronic component mounted on a printed wiring board and an internal circuit wiring for connecting the terminals of the external terminal row to each other. In the auxiliary wiring package including :, the internal circuit wiring is formed on a multilayer substrate, and the multilayer substrate has a power supply layer and a ground layer.

According to a third aspect of the present invention, in the wiring auxiliary package of the first or second aspect, the external terminal row of the wiring auxiliary package has a power source terminal and a ground terminal, and the power source terminal and the ground terminal are the solid layers. It is characterized in that it is connected to a pattern or to the power supply layer and the ground layer.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to FIG.
~ Based on the embodiment shown in Fig. 3, description will be given with reference to the conventional example shown in Figs. (Embodiment 1) FIG. 1 is a plan view showing an internal wiring circuit of an auxiliary wiring package according to a first embodiment of the present invention, and FIG.
FIG. 1 shows internal circuit wiring of a conventional wiring auxiliary package.
It is a top view similar to. The conventional auxiliary wiring package 5 shown in FIG. 5 includes external terminals 7 ₁ , 7 ₁ formed corresponding to an external terminal row formed in the central portion of the lower surface of an electronic component package including a multi-pin semiconductor integrated circuit or the like. The required number of internal wiring circuits 6 and 6 for connecting the external terminals 7 ₂ and 7 ₂ formed corresponding to the external terminal row formed on the outer peripheral portion of the lower surface of the electronic component package and the external terminals 7 ₁ and 7 ₂ Similar to the conventional example shown in FIG. 4, the external terminals formed on the outer peripheral portion of the lower surface of the electronic component package have their signal lines taken out therefrom using the surface layer and the second layer of the printed wiring board.
External terminals formed on the bottom surface central portion is connected to the external terminals 7 ₁ of the wiring auxiliary package 5 via a through hole of a printed wiring board, the internal wiring circuit 6, the signal line is extracted through the external terminals 7 _2.

A conventional auxiliary wiring package 5 shown in FIG.
Then, adjacent internal wiring circuits 6 and 6 and external terminals 7 ₁ ,
7 ₁ while it is one which is a space portion, in the first embodiment the auxiliary package of wire of the present invention, as shown in FIG. 1, the space portion between the internal wiring circuit 6 cross a signal wire A solid pattern 9 made of a conductive material is formed in a portion adjacent to the space portion between the external terminals 7 ₁ and 7 ₁ . The internal wiring circuits 6 are formed in one layer or a plurality of layers. In the case of the wiring auxiliary package formed in a plurality of layers, the solid pattern 9 must be provided in the space portion between the internal wiring circuits 6 of all layers. However, it may be provided in one or more appropriate layers. Further, the solid pattern 9 can be formed of an appropriate conductive material by an appropriate means such as printing for forming a thin film. With such a configuration, it is possible to prevent malfunction of the electronic circuit mounted on the printed wiring board and prevent generation of radiation noise.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention.
Cross section showing the internal circuit wiring of the wiring auxiliary package
6 and 6 show the internal circuit layout of a conventional wiring auxiliary package.
FIG. 3 is a sectional view similar to FIG. 2, showing a line. As shown in Figure 6
In addition, the internal circuit wiring of the conventional auxiliary wiring package
6₁, 6_TwoIs a semiconductor integrated circuit isoelectric on the printed wiring board.
For external terminals formed in the center of the lower surface of the child part package
Corresponding external terminal 7₁, 7₁, Electronic parts
Installed corresponding to the external terminals formed on the center of the bottom surface of the cage.
Shielded external terminal 7_Two, 7_Two, And external terminal 7₁, 7_Two
Internal circuit wiring 6 connecting between₁, 6_TwoComposed of.
Internal circuit wiring 6_TwoIs the wiring formed on the auxiliary package for wiring.
It passes through the roux hole 4 and penetrates between the front and back surfaces. Na
2 and 6, the internal circuit wiring which is the signal wiring
6₁, 6_Two, External terminal 7 ₁, 7_TwoIs an auxiliary package for wiring
It seems that it is floating from J., but in reality it is a wiring
It is provided in close contact with the auxiliary package.

In the wiring auxiliary package of the second embodiment, as shown in FIG. 2, the printed wiring board constituting the wiring auxiliary package 5 is composed of a multi-layered substrate composed of three or more layers. At least one power source layer 10 and at least one ground layer (GND layer) 11 are provided on the inner layer of the multilayer substrate. Here, in the portion where the through hole 4 of the printed circuit board is formed, the power supply layer 10 and the ground layer (GND layer) 11 do not contact the through hole 4. With such a configuration, it is possible to prevent malfunction of the electronic circuit mounted on the printed wiring board and prevent generation of radiation noise.

(Embodiment 3) FIG. 3 shows wiring for the third embodiment.
Multi-pin semiconductor integrated circuit package using auxiliary package
Fig. 7 is a cross-sectional view showing the mounting state of the cable,
Mounting state of semiconductor integrated circuit package using package
FIG. 4 is a sectional view similar to FIG. 3 showing a state. Conventional example shown in FIG.
The wiring auxiliary package 5 is a multi-pin semiconductor integrated circuit package.
Formed in the center of the bottom surface of the electronic package such as package 1
External terminal 2 of the connected external terminal row₁Provided in correspondence with
External terminal 7₁, And on the outer periphery of the bottom surface of the electronic component package
External terminals 2 of the formed outer terminal row_Two, 2_TwoIn response to
External terminal 7 provided _Two, 7_TwoExternal terminal 7₁，
7_TwoThe internal circuit wiring 6 is connected to each other. Many
The outer end of the center of the lower surface of the pin semiconductor integrated circuit package 1
Child 2₁Is for through hole 4 of printed wiring board 3 and wiring
External terminal 7 of auxiliary package 5₁, Internal circuit wiring 6, outside
Part terminal 7_TwoThe signal line is taken out via.

On the other hand, in the wiring auxiliary package of the third embodiment, the power supply terminal 12 or the ground (GN) is provided outside the external terminal row provided on the surface facing the printed wiring board 3.
D) has a terminal 13 and has a power supply terminal 12 or a ground terminal 13
Is connected to the solid pattern 9 of the first embodiment or the power supply layer 10 or the ground layer 11 of the second embodiment. In addition, the power supply terminal 12 or the ground terminal 13 is connected to the power supply wiring 14 or the GND wiring 15 of the printed circuit board 3 on which the wiring auxiliary package 5 is mounted. In FIG. 3, the outermost black terminal of the external terminals 7 indicates the power supply terminal 12 or the GND terminal 13. With the above-described configuration, the power supply layer and the GND layer of the conventional wiring auxiliary package are reinforced, which leads to stabilization of signals and malfunctions.
Radiation noise can be prevented from occurring.

[0015]

As is apparent from the above description, according to the present invention, when an electronic component package such as a semiconductor integrated circuit having an external terminal row also on the lower surface of the package is mounted on a printed wiring board, it is printed. An electronic circuit in which a signal line can be easily taken out from an external terminal at the center of the lower surface of a package that cannot be processed by a wiring board, and an electronic component having an external terminal row at the central portion of the lower surface of the package is mounted on a printed wiring board. It is possible to prevent erroneous operation of and to prevent generation of radiation noise.

[Brief description of drawings]

FIG. 1 is a plan view showing an internal wiring circuit of a wiring auxiliary package of a first embodiment.

FIG. 2 is a cross-sectional view showing internal circuit wiring of a wiring auxiliary package of a second embodiment.

FIG. 3 is a cross-sectional view showing a mounted state of a multi-pin semiconductor integrated circuit using an auxiliary wiring package of a third embodiment.

FIG. 4 is a cross-sectional view showing a mounted state of a multi-pin semiconductor integrated circuit using a conventional wiring auxiliary package.

FIG. 5 is a plan view showing internal circuit wiring of a conventional wiring auxiliary package.

FIG. 6 is a cross-sectional view showing internal circuit wiring of a conventional wiring auxiliary package.

FIG. 7 is a cross-sectional view showing a mounted state of a multi-pin semiconductor integrated circuit using a conventional wiring auxiliary package.

[Explanation of symbols]

1 ... Semiconductor integrated circuit package, 2 ... External terminal pins, 3
... Printed wiring board, 4 ... Through hole, 5 ... Wiring auxiliary package, 6 ... Internal circuit wiring, 7 ... External terminal pin, 8
… External mold package, 9… Solid pattern, 10…
Power layer, 11 ... Ground layer, 12 ... Power terminal, 13 ... Ground (GND) terminal, 14 ... Power wiring, 15 ... Ground (GN)
D) Wiring.

Claims (3)

[Claims] 1. A wiring comprising an external terminal row of an electronic component mounted on a printed wiring board or an external terminal row connected to an external lead wire, and an internal circuit wiring connecting terminals of the external terminal row to each other. An auxiliary package for wiring, which has a solid pattern of a power supply line or a ground line adjacent to the internal circuit wiring. 2. A wiring having an external terminal row connected to an external terminal row or an external lead wire of an electronic component mounted on a printed wiring board, and an internal circuit wiring connecting the terminals of the external terminal row to each other. In the auxiliary package for wiring, the internal circuit wiring is formed on a multilayer substrate, and the multilayer substrate has a power supply layer and a ground layer. 3. The wiring auxiliary package according to claim 1, wherein an external terminal row of the wiring auxiliary package has a power supply terminal and a ground terminal, and the power supply terminal and the ground terminal are connected to the solid pattern. Or an auxiliary package for wiring, which is connected to the power supply layer and the ground layer.