JP2003119540A - Aluminum alloy to be film-formed, aluminum alloy material superior in corrosion resistance and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an aluminum alloy to be film-formed having strength and corrosion resistance in a high-temperature heat cycle and corrosive atmosphere, and to provide an aluminum alloy material. SOLUTION: The aluminum alloy to be film-formed comprises 4.0-5.0 wt.% Mg, 0.02-0.1 wt.% Cr, impurities of Si, Fe, Cu, Mn, Zn and Ni, of which each content is regulated to 0.1 wt.% or less, and the balance Al with other impurities. The aluminum alloy material superior in corrosion resistance has corrosion resistant films such as an anodized film, a fluorinated film, a composite film formed by Ni-P plating and fluorination, and a composite film formed by anodizing and fluorination, on the surface of the base alloy material with the above composition. The above aluminum alloy and alloy material are suitable for materials used in a CVD apparatus, a PVD apparatus, an LCD manufacturing apparatus, and a semiconductor manufacturing device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor,
The present invention relates to an aluminum alloy that is preferably used as a material for a manufacturing device such as an LCD (liquid crystal display) and that has excellent corrosion resistance by a film forming treatment, an aluminum alloy material that has excellent corrosion resistance, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Aluminum alloys, especially Al--Si J
A wrought material or a cast material made of an IS5052 aluminum alloy or an Al-Si-Mg-based JIS 6061 aluminum alloy is often used. In addition, since these manufacturing equipment is used at high temperature and in a corrosive gas atmosphere such as silane (SiH ₄ ) or halogen gas such as fluorine or chlorine, the surface of each member is anodized. A hard anodic oxide film is formed on the to improve corrosion resistance.

However, even if such a surface treatment is performed, the surface deterioration occurs early depending on the use environment and the frequency of use, and it is necessary to update the surface treatment. In particular, in a CVD or PVD processing apparatus, since the operating temperature is in a wide range from room temperature to about 400 ° C. and thermal stress is repeatedly applied, cracks may occur due to the difference in thermal deformability between the base material and the anodic oxide film. . In addition, during long-term use, the anodic oxide film may wear due to contact with the surface of the apparatus when processing a work piece, without any noticeable damage.

Therefore, as a material for manufacturing devices such as semiconductors,
For example, in JP-A-11-43734, Mn, C
Aluminum alloys containing u and Fe have been proposed. This aluminum alloy produces a thermally stable intermetallic compound by adding a heavy metal, and a double-structured anodic oxide film that acts as a buffer when the thermal cycle is applied. And to improve the corrosion resistance in a corrosive environment.

Further, Japanese Patent Laid-Open No. 8-92684 proposes an Al-Mg alloy for fluorination treatment. This aluminum alloy has improved corrosion resistance due to a fluorinated passivation film formed by fluorination treatment.

[0006]

However, in the aluminum alloy described in Japanese Unexamined Patent Publication No. 11-43734 mentioned above, the intermetallic compound such as Al--Fe system in the base material is corrosive gas due to the defect of the anodic oxide film. Is released in response to
Alternatively, there is a problem that the intermetallic compound in the anodized film is gradually released by evaporation or precipitation. When such an aluminum alloy is used, for example, in a film forming apparatus for an insulating film such as a semiconductor, the inside of the processing chamber is contaminated with the released intermetallic compound, and thus the generated insulating film is contaminated with the intermetallic compound and the film quality is deteriorated. There was a problem that it decreased.

Further, the aluminum alloy described in JP-A-8-92684 also has insufficient corrosion resistance due to the formed fluorinated passivation film, and further improvement in corrosion resistance is required.

In view of the above technical background, the present invention provides an aluminum alloy for film forming treatment which is excellent in strength and corrosion resistance under a high temperature heat cycle and a corrosive atmosphere, and an aluminum alloy material excellent in corrosion resistance and a method for producing the same. To aim.

[0009]

In order to achieve the above object, the aluminum alloy for film forming treatment of the present invention is M
g: 4.0-5.0 wt% and Cr: 0.02-0.1
containing wt%, Si, Fe, Cu, M as impurities
The basic gist is that the respective contents of n, Zn and Ni are regulated to 0.1 wt% or less, and the balance consists of Al and other impurities.

In the aluminum alloy for film forming treatment, the Mg content is 4.3 to 4.7 wt%, the Cr content is 0.04 to 0.08 wt%, Si, Fe, Cu, Mn, Z.
The respective contents of n and Ni are preferably regulated to 0.05 wt% or less.

The aluminum alloy for film forming treatment is preferably used as an aluminum alloy for a CVD device, an aluminum alloy for a PVD device, an aluminum alloy for a liquid crystal display (LCD) manufacturing device, and an aluminum alloy for a semiconductor manufacturing device.

The aluminum alloy material excellent in corrosion resistance according to the present invention is Mg: 4.0 to 5.0 wt% and Cr: 0.0.
2 to 0.1 wt% of Si, Fe as impurities,
The Cu, Mn, Zn, and Ni contents are each 0.
The basic gist is that a corrosion resistant film is formed on the surface of an aluminum alloy base material that is regulated to 1 wt% or less and the balance is Al and other impurities.

In the above-mentioned aluminum alloy material having excellent corrosion resistance, it is preferable that the corrosion resistant film is a single film of anodized film or fluorinated film, or a composite film formed by Ni-P plating and fluorination. Alternatively, a composite film formed by anodizing treatment and fluorination treatment is preferable.

In the aluminum alloy base material, the Mg content is 4.3 to 4.7 wt% and the Cr content is 0.0.
It is preferable that the content of each of Si, Fe, Cu, Mn, Zn and Ni is regulated to 4 to 0.08 wt% and 0.05 wt% or less.

Further, an aluminum alloy material having excellent corrosion resistance is suitable as an aluminum alloy material for CVD equipment, an aluminum alloy material for PVD equipment, an aluminum alloy material for liquid crystal display (LCD) manufacturing equipment, and an aluminum alloy material for semiconductor manufacturing equipment. used.

The method for producing an aluminum alloy material excellent in corrosion resistance according to the present invention is Mg: 4.0 to 5.0 wt% and C.
r: 0.02-0.1 wt%, S as an impurity
Performing a corrosion-resistant film forming treatment on the surface of the aluminum alloy base material in which the contents of i, Fe, Cu, Mn, Zn and Ni are each regulated to 0.1 wt% or less, and the balance is Al and other impurities. Is the basic gist.

The aluminum alloy material having excellent corrosion resistance is preferably used as an aluminum alloy material for CVD equipment, an aluminum alloy material for PVD equipment, an aluminum alloy material for liquid crystal display (LCD) manufacturing equipment, and an aluminum alloy material for semiconductor manufacturing equipment. To be done.

In the chemical composition of the aluminum alloy for film forming treatment of the present invention and the aluminum alloy base material of the aluminum alloy material having excellent corrosion resistance, the significance of addition of each element and the significance of regulation are as follows.

Mg is an element that improves the alloy strength.
When the Mg content is less than 4.0 wt%, the strength improving effect is poor, and when it exceeds 5.0 wt%, the workability is deteriorated.
The content is 4.0 to 5.0 wt%. Furthermore, Mg has the effect of forming a fluorinated passivation film together with fluorine when it is subjected to a fluorination treatment, and improving the machinability. The preferable Mg content is 4.3 to 4.7 wt%.

Cr is an element that refines the alloy structure to improve the surface treatment property, and has the effect of improving the adhesion between the base material and the film to promote the corrosion resistance due to the film formation. If the Cr content is less than 0.02 wt%, the above effect is poor, and if it exceeds 0.1 wt%, a coarse structure is formed and workability deteriorates. A preferable Cr content is 0.04 to 0.0
It is 8 wt%.

Heavy metals Si, Fe as impurities,
When Cu, Mn, Zn, and Ni are contained in a large amount, the amount of Al-Fe-based intermetallic compound in the base material and the film is increased, and the intermetallic compound is released from the film defect by evaporation or precipitation. Alternatively, it reacts with a corrosive gas such as a halogen gas and is released from the metal structure by dropping. It is also released as a single heavy metal. Further, when the heavy metal content and the amount of the intermetallic compound increase, defects of the film increase, and the heavy metal and the intermetallic compound are easily released. This aluminum alloy or aluminum alloy material is, for example, CV
When used as a material for D device, a material for PVD device, a material for LCD manufacturing device, a material for semiconductor manufacturing device,
The released heavy metals and intermetallic compounds contaminate LCDs, semiconductors, etc. to be processed or manufactured and deteriorate product quality. Further, in order to add Mg and Cr in the above range for improving strength and surface treatment property, it is necessary to regulate heavy metals as impurities for forming intermetallic compounds. Therefore, each heavy metal element is 0.1 wt%
It is necessary to regulate the amount below to suppress the amount of intermetallic compounds produced and reduce film defects. The preferable content of each of these heavy metal elements is 0.05 wt% or less.

The aluminum alloy material excellent in corrosion resistance according to the present invention has a corrosion resistant film formed on the surface of the aluminum alloy base material having the above-mentioned composition. Since the coating is formed into a coating with few defects by controlling the composition of the base alloy as described above, high-temperature heat cycle, heavy metals and intermetallic compounds are less likely to be released even under a corrosive environment,
It has excellent corrosion resistance, especially gas corrosion resistance, and by extension, excellent corrosion resistance as an alloy material. Even when the base material is exposed due to cracking or wear of the coating due to long-term use deterioration, the amount of heavy metal contained in the base material itself is regulated, so the amount released is small, and the adverse effect of contamination on semiconductors etc. Also few.

As the corrosion resistant film, a single film of anodized film or fluorinated film, or Ni-P is used.
A composite coating formed by plating treatment and fluorination treatment or a composite coating formed by anodic oxidation treatment and fluorination treatment can be exemplified, and any of the above-mentioned excellent corrosion resistance can be obtained. Of these, a single coating is recommended because it is easy to form a coating, and a composite coating is recommended because it can synergistically improve corrosion resistance by combining different coatings.

An alloy material having excellent gas corrosion resistance due to such a film exhibits excellent corrosion resistance against water.

In the above-mentioned method for producing an aluminum alloy material having excellent corrosion resistance, each corrosion resistant film forming treatment may be carried out according to a conventional method, and the conditions are not limited.

The anodizing treatment is carried out with a sulfuric acid bath, an oxalic acid bath or the like. For example, when an aluminum alloy material is used as a material for manufacturing devices such as semiconductors, the liquid composition: 10% H
₂ SO ₄ , liquid temperature 0 +/- 2 ℃, current density: DC2-4.5A
/ Dm ² , voltage: 23 to 120 V, and treatment time: 60 minutes, a hard anodized film of about 50 μm can be formed.

The fluorination treatment can be exemplified by a method in which fluorine gas or fluoride gas is brought into contact with the surface of the aluminum alloy base material under heating, or liquid fluoride is brought into contact therewith, and a fluorinated passivation film is formed. be able to.

When forming a composite film by Ni-P plating treatment and fluorination treatment, for example, a Ni-P plating treatment is performed using a nickel sulfate bath using hypophosphite as a reducing agent to form a plating coating. After that, the above-mentioned fluorination treatment is performed. As a result, a composite film of the Ni-P plated film and the fluorinated passive film is formed.

When forming a composite film by anodizing treatment and fluorinating treatment, the above-mentioned anodizing treatment is applied to form the anodizing coating, and then the above-mentioned fluorinating treatment is applied. As a result, a composite film of the anodized film and the fluorinated passive film is formed.

In any case, degreasing cleaning, etching, surface polishing, and the like as post-treatments for the film-forming treatment, and cleaning, drying, and heating as post-treatments are appropriately performed.

The processing into the required shape is not particularly limited as long as it is in accordance with the usual method, but when used as a material for manufacturing equipment such as semiconductors in a high temperature thermal cycle and in a corrosive environment, residual stress during cutting, grinding and joining is removed. Therefore, it is preferable to perform heat treatment at 350 to 380 ° C. after each processing.

The aluminum alloys and alloy materials of the present invention are alloys and alloy materials suitable for all members exposed to high temperature and corrosive gas atmospheres, particularly for CVD equipment, PVD equipment, and liquid crystal display (LCD). It is preferably used as an aluminum alloy material for manufacturing equipment and semiconductor manufacturing equipment.

[0033]

EXAMPLES For the aluminum alloys having the respective compositions shown in Table 1 below, the ingots DC-cast according to the conventional method were used in the range of 450 to 6
A homogenization treatment was performed at 00 ° C., and then hot rolling and cold rolling were performed to produce an aluminum alloy plate having a thickness of 4 mm.

A film was formed on each aluminum alloy plate cut into 50 mm × 50 mm under the following conditions. However, Comparative Example 14 was not subjected to the film forming treatment. (Formation of sulfuric acid anodic oxide film) Bath composition: 15% H ₂ SO ₄ ,
Anodization treatment was performed at a bath temperature of 25 ° C., a voltage of 20 V, and a treatment time of 20 minutes to form a film having a thickness of 20 μm. (Formation of oxalic acid anodized film) Bath composition: 4% (COOH)
₂ · 2H ₂ O, bath temperature: 25 ° C., Voltage: 30 V, treatment time:
Anodizing treatment was performed for 30 minutes to form a film having a film thickness of 15 μm. (Formation of fluorinated film) After chemical polishing was performed as a pretreatment, the film was held at 260 ° C. for 24 hours in a chamber in which 20% fluorine gas (F ₂ ) + 80% N ₂ was introduced, and the film thickness was 5 μm.
A fluorinated passivation film of m was formed. (Formation of composite film of Ni-P plating treatment and fluorination treatment)
In a chamber containing 20% fluorine gas (F ₂ ) + 80% N ₂ after electroless Ni-P plating to form a 5 μm plating film in a nickel sulfate bath using hypophosphite as a reducing agent It was kept at 260 ° C. for 24 hours to form a composite film of a Ni—P plated film and a fluorinated passivation film. The film thickness of this composite film was 30 μm. (Formation of composite film of anodizing treatment and fluorination treatment) After forming a 20 μm sulfuric acid anodizing film by the above-mentioned method,
% Fluorine gas (F ₂ ) + 80% N ₂ was maintained in a chamber at 260 ° C. for 24 hours to form a composite film of a sulfuric acid anodized film and a fluorinated passivation film. The film thickness of this composite film was 15 μm.

Then, a gas corrosion resistance test and a strength test were carried out on the aluminum alloy plate on which each film was formed by the following methods. [Gas Corrosion Resistance Test] The aluminum alloy plate was placed in a processing chamber of a device for forming an insulating film in a semiconductor manufacturing process, and the time until the occurrence of insulation failure of the semiconductor insulating film was measured. The silicon wafer used for the test has a diameter of 200 mm, a thickness of 700 μm, and the chamber size is a width of 400.
mm × depth 400 mm × height 200 mm, the insulating film is formed by plasma CVD (400 ° C., corrosive gas: SiH ₄
-N ₂ O, was carried out by plasma excitation atmosphere).

In the insulation film forming test, the insulation failure is caused by a heavy metal contained as an impurity in the aluminum alloy or an intermetallic compound formed by the heavy metal contaminating the insulation film and diffusing into Si or SiO ₂ . It is presumed that this is because the coefficient became large. Therefore, it can be evaluated that the amount of heavy metal and intermetallic compound released from the aluminum alloy base material or each film is smaller as the time until insulation failure, in other words, the longer the film formation time is. The evaluation results are shown in Table 1.

In the aluminum alloys of Examples 9 and 10 having the same composition, the fact that the oxalic acid anodized film could be formed longer than the sulfuric acid anodized film was supposed to be due to the heat resistance of the oxalic acid anodized film. It

Further, two kinds of aluminum alloy plates (Examples 12 and 13) on which a composite film is formed are anodized films or fluorinated films (Examples 1 to 1).
The reason why the film formation time is longer than that in 1) is considered to be that the gas corrosion resistance is synergistically improved by the combination of different kinds of films. [Strength test] Using the same sample as the gas corrosion resistance test, JI
A tensile test was performed based on S Z2201 to compare the strength. The evaluation results are shown in Table 1.

[0039]

[Table 1]

From the results shown in Table 1, the aluminum alloys in which the content of heavy metals is regulated and the aluminum alloy plates on which the respective corrosion resistant films are formed have a long insulating film formation time under high temperature and corrosive atmosphere, This proves that the amount of heavy metals and intermetallic compounds released from each film is small. Further, due to the regulation of the content of heavy metals, in addition to the small amount of metal compounds produced, a film with few defects is formed, and it is difficult to release heavy metals and intermetallic compounds, which also contributes to the extension of the film formation time. Presumed to be. Further, by containing a predetermined amount of Mg, excellent strength can be obtained.

From these results, the aluminum alloy for film forming treatment and the aluminum alloy plate on which a film is formed of each example are excellent in strength and corrosion resistance, and are suitable for CVD device materials, PVD device materials and LCD manufacturing device. It is suitable as a material and a material for semiconductor manufacturing equipment.

[0042]

As described above, the aluminum alloy for film forming treatment of the present invention is Mg: 4.0-5.0 wt.
% And Cr: 0.02 to 0.1 wt%, the contents of Si, Fe, Cu, Mn, Zn and Ni as impurities are regulated to 0.1 wt% or less, and the balance is A.
Since it is composed of 1 and other impurities, the content of heavy metals in the base material and the film formed and the amount of intermetallic compounds formed by these heavy metals are small. In addition, since the amount of these components is small, a film with few defects can be formed, the corrosion resistance is excellent, and the amount of heavy metals and intermetallic compounds released from the film defects is small even under a high temperature heat cycle and a corrosive environment. Further, by containing Mg, excellent strength can be obtained, and by containing Cr, excellent surface treatability can be obtained.

In the aluminum alloy for film forming treatment, particularly excellent strength is obtained when the Mg content is 4.3 to 4.7 wt%, and the Cr content is 0.04 to 0.0.
When it is 8 wt%, a particularly excellent surface treatment property can be obtained.

When the content of each of Si, Fe, Cu, Mn, Zn and Ni is regulated to 0.05 wt% or less, a coating film containing a small amount of these heavy metals and an intermetallic compound is formed. Can be formed.

Further, the aluminum alloy material of the present invention having excellent corrosion resistance has the above-mentioned chemical composition as the base material, and the content of heavy metals and the amount of intermetallic compounds formed by these heavy metals are small. Therefore, the corrosion-resistant coating formed on the surface is excellent in corrosion resistance with few defects, and the amount of heavy metals and intermetallic compounds released from the coating defects is small even under a high temperature thermal cycle and a corrosive environment. Also, Mg
The inclusion of Cr provides excellent base material strength, and the inclusion of Cr provides excellent surface treatment properties, which in turn improves the adhesion between the coating and the base material and promotes corrosion resistance due to coating formation.

Therefore, as a material for a CVD apparatus, a PVD apparatus, an LCD manufacturing apparatus, a semiconductor manufacturing apparatus or the like used in a high temperature heat cycle or a corrosive environment, the aluminum alloy for film forming treatment of the present invention or the aluminum alloy excellent in corrosion resistance. By using the material, it is possible to suppress the contamination of the products processed or manufactured by these devices with heavy metals and intermetallic compounds and improve the product quality. Further, even when the corrosion-resistant coating is cracked or abraded to expose the base material due to long-term use deterioration, the heavy metal content itself is regulated, so that the release amount is small and the adverse effect due to contamination of the product is also small.

In particular, when the corrosion resistant film is a single film of anodized film or fluorinated film, the film forming treatment is easy. Further, the corrosion-resistant coating is Ni-
In the case of a composite film formed by P plating and fluorination, or a composite film formed by anodic oxidation and fluorination,
Particularly excellent corrosion resistance can be obtained by combining different kinds of films.

The method for producing an aluminum alloy material having excellent corrosion resistance according to the present invention comprises subjecting the alloy base material having the above-mentioned composition to each film forming treatment, and the aluminum alloy material having excellent corrosion resistance according to the present invention. Can be manufactured.

Further, since the aluminum alloy and alloy material of the present invention have excellent corrosion resistance, they are suitable for all member materials exposed to a high temperature and corrosive gas atmosphere. Especially for CVD equipment, PVD equipment, etc. used in such an environment,
It is possible to configure these devices which are suitable as an aluminum alloy material for liquid crystal display (LCD) manufacturing devices and semiconductor manufacturing devices and have excellent corrosion resistance.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C23C 28/00 C23C 28/00 C C25D 11/04 C25D 11/04 EF term (reference) 4K022 AA02 AA43 BA14 BA16 BA32 DA01 EA04 4K026 AA01 AA09 AA11 AA25 BA01 BB08 CA16 CA28 DA00 4K029 DA01 4K030 KA08 KA46 4K044 AA06 AB05 BA06 BA13 BA20 BB01 BB03 BC02 CA15 CA16 CA17

Claims (23)

[Claims] 1. Mg: 4.0-5.0 wt% and Cr:
Si as an impurity, containing 0.02 to 0.1 wt%
An aluminum alloy for film forming treatment, wherein each content of Fe, Cu, Mn, Zn, and Ni is regulated to 0.1 wt% or less, and the balance consists of Al and other impurities. 2. The aluminum alloy for film-forming treatment according to claim 1, wherein the Mg content is 4.3 to 4.7 wt%. 3. The aluminum alloy for film forming treatment according to claim 1, wherein the Cr content is 0.04 to 0.08 wt%. 4. Si, Fe, Cu, Mn, Zn and N
The aluminum alloy for film-forming treatment according to claim 1, wherein each content of i is regulated to 0.05 wt% or less. 5. The aluminum alloy for a film forming treatment is an aluminum alloy for a CVD apparatus.
The aluminum alloy for film formation treatment according to any one of 1. 6. The aluminum alloy for film formation treatment is an aluminum alloy for PVD equipment.
The aluminum alloy for film formation treatment according to any one of 1. 7. The aluminum alloy for film formation treatment according to claim 1, wherein the aluminum alloy for film formation treatment is an aluminum alloy for liquid crystal display (LCD) manufacturing equipment. 8. The aluminum alloy for film forming treatment is an aluminum alloy for semiconductor manufacturing equipment.
The aluminum alloy for film-forming treatment according to any one of to 4. 9. Mg: 4.0-5.0 wt% and Cr:
Si as an impurity, containing 0.02 to 0.1 wt%
The content of each of Fe, Cu, Mn, Zn and Ni is regulated to 0.1 wt% or less, and a corrosion resistant film is formed on the surface of the aluminum alloy base material containing the balance of Al and other impurities. Aluminum alloy material with excellent corrosion resistance. 10. The aluminum alloy material having excellent corrosion resistance according to claim 9, wherein the corrosion resistant film is a single film of an anodized film or a fluorinated film. 11. The aluminum alloy material having excellent corrosion resistance according to claim 9, wherein the corrosion resistant film is a composite film formed by Ni—P plating treatment and fluorination treatment, or a composite film formed by anodic oxidation treatment and fluorination treatment. 12. The M in the aluminum alloy base material
The aluminum alloy material having excellent corrosion resistance according to any one of claims 9 to 11, wherein a g content is 4.3 to 4.7 wt%. 13. C in the aluminum alloy base material
The r content is 0.04 to 0.08 wt%.
2. An aluminum alloy material having excellent corrosion resistance according to any one of 2 above. 14. S in the aluminum alloy base material
The respective contents of i, Fe, Cu, Mn, Zn and Ni are regulated to 0.05 wt% or less, respectively.
3. An aluminum alloy material having excellent corrosion resistance according to any one of 3 above. 15. The aluminum alloy material having excellent corrosion resistance is an aluminum alloy for a CVD apparatus.
14. An aluminum alloy material having excellent corrosion resistance according to any one of 14 above. 16. The aluminum alloy material excellent in corrosion resistance is an aluminum alloy material for a PVD device.
An aluminum alloy material having excellent corrosion resistance according to any one of items 1 to 14. 17. The aluminum alloy material having excellent corrosion resistance according to claim 9, wherein the aluminum alloy material having excellent corrosion resistance is an aluminum alloy material for a liquid crystal display (LCD) manufacturing device. 18. The aluminum alloy material for film forming treatment according to claim 9, wherein the aluminum alloy material having excellent corrosion resistance is an aluminum alloy material for semiconductor manufacturing equipment. 19. Mg: 4.0-5.0 wt% and C
r: 0.02-0.1 wt%, S as an impurity
Performing a corrosion-resistant film forming treatment on the surface of the aluminum alloy base material in which the contents of i, Fe, Cu, Mn, Zn and Ni are each regulated to 0.1 wt% or less, and the balance is Al and other impurities. And a method for producing an aluminum alloy material having excellent corrosion resistance. 20. The aluminum alloy material excellent in corrosion resistance is an aluminum alloy material for a CVD apparatus.
9. The method for producing an aluminum alloy material having excellent corrosion resistance according to 9. 21. The aluminum alloy material having excellent corrosion resistance is an aluminum alloy material for PVD devices.
9. The method for producing an aluminum alloy material having excellent corrosion resistance according to 9. 22. The method of manufacturing an aluminum alloy material having excellent corrosion resistance according to claim 19, wherein the aluminum alloy material having excellent corrosion resistance is an aluminum alloy material for a liquid crystal display (LCD) manufacturing apparatus. 23. The method for producing an aluminum alloy material having excellent corrosion resistance according to claim 19, wherein the aluminum alloy material having excellent corrosion resistance is an aluminum alloy material for a semiconductor manufacturing apparatus.