JP2003188039A - Laminated electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a laminated electronic component in which directional properties can be identified not only in packaging but also in a manufacturing process, and at the same time the front and rear of a laminate can be identified. <P>SOLUTION: In the laminated electronic component, laminated are ceramic sheets 6a and 6b having directionality identification patterns 7a and 7b on the front and rear surfaces of an electric circuit layer 1 having a built-in circuit element. The patterns 7a and 7b are used for identifying directional properties in the packaging of an electronic component, and are provided at an eccentricity position other than the center section so that the patterns are overlapped in a laminated state and in a see-through plan view. A ceramic sheet for protection, through which the patterns 7a and 7b can be seen, may be laminated outside the sheets 6a and 6b. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a laminated electronic component,
In particular, the present invention relates to a laminated electronic component in which an internal circuit element such as an inductor or a capacitor is interposed between insulating layers to form a laminated body.

[0002]

2. Description of the Related Art Conventionally, multilayer electronic components such as filters are
Various types of sheets are provided in which sheets made of a dielectric or magnetic material and internal circuit elements such as inductors and capacitors are laminated to form a laminate, and external electrodes for mounting are provided on the surface of the laminate.

In this type of laminated electronic component, for example, electrodes serving as internal circuit elements are applied on a ceramic sheet by printing, these sheets are stacked and pressure-bonded, and then external electrodes are provided on the side surfaces of the laminated body. It was prepared by providing and firing.

By the way, in this type of laminated electronic component, there are various forms of the arrangement of the external electrodes provided on the four side surfaces of the laminated body depending on the type of the internal circuit. For example, as shown in FIG. 12 (A), the input electrode 25 and the output electrode 26 are arranged on both sides of the laminate 20, and the ground electrodes 27 are arranged on both ends, as shown in FIG. 12 (B). In which the ground electrodes 27 are arranged on both sides of the laminate 20, and the input electrodes 25 and the output electrodes 26 are arranged on both ends, respectively, as shown in FIG.
The input electrode 25, the output electrode 26, and the ground electrode 27 are arranged on one side of 0, and the ground electrode 28 is arranged on the other side.

[0005]

However, as shown in FIG.
In the multilayer electronic component including the external electrodes arranged as shown in (A), (B), and (C), the external electrodes are arranged when mounted on the printed circuit board even if they have the same outer shape and size. However, there is a problem in that the predetermined characteristics cannot be obtained if the mounting is performed in a different direction.

For example, when the laminated body 20 is mounted with its right and left reversed (see arrow a), the input electrode 25 and the output electrode 26 are switched in the electrode arrangement shown in FIGS. Will change. The electrode arrangement shown in FIG. 12C cannot be used because the input electrode 25 and the output electrode 26 are replaced with the ground electrode 28.

When the laminated body 20 is mounted with its front and back reversed (see arrow b), the input electrode 25 and the output electrode 26 are replaced in the electrode arrangement shown in FIG. I will end up. In the electrode arrangement shown in FIG. 12B, the electrodes 25, 26, 27 are not interchanged, but the internal ground electrode is upside down, so the shield characteristics change. The electrode arrangement shown in FIG. 12C cannot be used because the input electrode 25 and the output electrode 26 are replaced with the ground electrode 28.

For that purpose, a directional identification mark is applied to the laminated body, but the identification mark is provided by
Since it is usually performed after firing the laminated body, it is not possible to identify the directionality in the middle of the manufacturing process. For example, once each laminated body separated from the mother block is separated, the directionality is aligned. It was extremely difficult.

Therefore, the first object of the present invention is not only to identify the directionality at the time of mounting, but also to identify the directionality even during the manufacturing process, and to identify the front and back surfaces of the laminate. To provide a mold type electronic component.

A second object of the present invention is to provide a laminated electronic component in which the identification pattern is protected by an outer layer in addition to the first object.

A third object of the present invention is to provide the above first or second object.
In addition to the above purpose, it is to provide a laminated electronic component that does not need to turn over the insulating layer sheet having the identification pattern.

A fourth object of the present invention is to provide the above-mentioned first or second
In addition to the above purpose, it is to provide a laminated electronic component that does not require a special process to form an identification pattern.

A fifth object of the present invention is to provide the above-mentioned first or second
In addition to the above-mentioned purpose, it is to provide a laminated electronic component capable of identifying the type in addition to the directionality.

[0014]

In order to achieve the above object, a laminated electronic component according to the present invention comprises a laminated body in which an insulating layer and an internal circuit element are laminated to form a laminated body. In a multilayer electronic component having external electrodes provided on its side surfaces, an identification pattern for identifying directionality may be overlapped on the front and back surfaces of the laminate or in the vicinity of the front and back surfaces, respectively, in a state where the laminate is seen through in a plan view. It is characterized by being provided.

In the laminated electronic component having the above-mentioned structure, the orientation of the laminated body can be identified by the identification pattern with the naked eye or by a pattern recognition sensor or the like, and the error of mounting the orientation incorrectly can be avoided. it can.
In particular, since the identification patterns provided on the front and back sides are provided so as to overlap each other when the laminate is seen through in a plan view, it is possible to easily distinguish the front and back even if the laminate has the same outer shape and size. At the same time, the direction can be identified. Moreover, since the identification patterns are provided on the front and back surfaces of the laminate or in the vicinity of the front and back surfaces, respectively, that is, the identification patterns are provided on the insulating layers located on the uppermost and lowermost surfaces of the laminate, or on the insulating layer one layer below. Since it is provided, the direction can be identified even during the manufacturing process. Usually, the insulating layer has a light-transmitting property, and can be recognized if it is an identification pattern below the first and second layers.

In the laminated electronic component according to the present invention, the identification pattern is formed of a conductor paste or a resistor paste, but it may be formed of a via hole.
Since the via hole is formed so as to penetrate the front and back surfaces of the insulating layer, it is possible to omit the step of inverting the insulating layer between the step of forming the via hole in the insulating layer and the step of laminating the insulating layer.

If the identification pattern is formed of a conductor paste or a resistor paste, it may be formed in the same step as the folded portion of the external electrode or on the same surface as the internal circuit element. By forming the identification pattern in the same process as the external electrode and the internal circuit element, a special process for forming the identification pattern is unnecessary. For the same reason,
The identification pattern may also have a function as an internal circuit element, or the identification pattern may be formed by a partial lack portion provided in the internal circuit element.

Furthermore, if the identification pattern is formed by a partial cutout provided in the internal circuit element, the cutout may be formed as a character, a symbol or a pattern. Based on such characters, symbols, or patterns, it is possible to identify the type in addition to the directionality.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a laminated electronic component according to the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a laminated electronic component as a first embodiment. In the first embodiment, ceramic sheets 6a and 6b provided with identification patterns 7a and 7b are laminated on the front surface and the back surface of the electric circuit layer 1, respectively.

The electric circuit layer 1 has a large number of ceramic sheets laminated therein, including internal circuit elements such as inductors and capacitors, to form a well-known filter circuit.

The identification patterns 7a and 7b are provided at eccentric positions other than the central portions of the ceramic sheets 6a and 6b and so as to overlap each other in a laminated state when the laminated body is seen through in a plan view. The patterns 7a and 7b may be the same as the conductor paste or resistor paste used for the internal circuit elements, or may be a dedicated paste.

The identification patterns 7a and 7b are not limited to the screen printing method, but may be formed by a vapor deposition method, a sputtering method, a photolithography method, a transfer method or the like. The forming method may be the same as or different from the method for forming the internal circuit element.

The electric circuit layer 1 is produced by coating electrodes on a ceramic sheet by printing or the like, stacking the sheets and press-bonding them, then providing external electrodes and firing. In the first embodiment, when the electric circuit layer 1 is laminated, the ceramic sheets 6a and 6b provided with the identification patterns 7a and 7b are laminated on the front and back surfaces thereof, and then external electrodes are provided and fired.

In the first embodiment having the above configuration, the directionality of the laminated body can be identified by the naked eyes or by the pattern recognition sensor or the like by the identification patterns 7a and 7b, and the error in mounting the directionality incorrectly can be avoided. can do. In particular, since the identification patterns 7a and 7b are provided at eccentric positions so as to overlap each other when the laminate is seen through in a plan view, even if the front and back and the left and right are mistaken, they are recognized at different positions and immediately the front and back and the left and right are recognized. You can determine the mistake.
Moreover, since the identification patterns 7a and 7b are provided in advance on the sheets 6a and 6b, the directionality can be identified even during the manufacturing process.

Here, the identification patterns 7a and 7b are provided so as to overlap each other. When the identification patterns 7a and 7b are overlapped so as to be completely coincident with each other, when one is overlapped so as to cover the other, they are partially overlapped. Including cases such as However, in the case where they partially overlap, it is necessary that they overlap to the extent that they have a function as an identification pattern.

The reason why the front and back of the laminate and the right and left can be distinguished is as follows. In FIG. 1, when the identification patterns 7a and 7b are located on the upper left side in plan view in the correct direction of the laminated body, for example, the identification patterns 7a and 7b are seen on the lower right side in plan view. If it is located, it can be seen that the front and back are correct and the left and right are reversed. Further, if the identification patterns 7a and 7b are located on the lower left side in plan view, it is understood that the left and right are correct and the front and back are opposite. Further, the identification patterns 7a, 7 are provided on the upper right side in plan view.
When b is located, it can be seen that the left and right sides and the front and back sides are opposite. That is, if the stacked body is arranged in a certain direction, the correctness of the arrangement can be determined at that time, and if it is wrong, the change of the posture to be corrected is also indicated at the same time.

FIG. 2 shows a laminated electronic component as a second embodiment. In the second embodiment, similar to the first embodiment, the identification pattern 7 is formed on the front and back surfaces of the electric circuit layer 1.
Ceramic sheets 6a and 6b provided with a and 7b are laminated, and further ceramic sheets 8a and 8b are laminated thereon. The ceramic sheets 8a and 8b are thin layers and have a light-transmitting property, and the identification patterns 7a and 7b are recognized through the sheets 8a and 8b.

The operation and effect of the second embodiment is the same as that of the first embodiment, and further, the identification patterns 7a and 7b are covered with the ceramic sheets 8a and 8b and protected, and the patterns 7a and 7b are provided. There is no danger of disappearing due to contact with other objects.

In the first and second embodiments, the identification pattern 7b on the back surface side is shown as being provided on the outer surface side of the ceramic sheet 6b, but it may be provided on the inner surface side. If the sheet 6b is provided on the inner surface side, it is possible to omit the trouble of turning over the sheet 6b in the middle of manufacturing and previously providing the identification pattern 7b on the lower side of the sheet 6b.

In the first and second embodiments, the shape of the identification patterns 7a and 7b is arbitrary and may be any shape such as square, rectangle, circle and ellipse, and a plurality of identification patterns may be provided on one surface. Good. The circular identification pattern 7 in FIG.
Indicates.

The identification patterns 7a and 7b may be formed by providing via holes in the ceramic sheets 6a and 6b. FIG. 4 shows an example in which a via hole 7 is provided in the ceramic sheet 6 to form an identification pattern. Of course,
The via hole 7 may have any shape other than a circular shape, and a plurality of via holes 7 may be provided. When a plurality of via holes 7 are provided, a plurality of via holes 7 may be provided in the vicinity of one of the four corners of the laminated body in plan view, or one or a plurality of via holes 7 may be provided in two corners or three corners. Good. The via hole 7 is not limited to one formed in each of the ceramic sheets 6a and 6b, but may be formed in a plurality of ceramic sheets and connected in the thickness direction.

Since the via holes 7 are formed so as to penetrate the front and back surfaces of the ceramic sheet 6, the labor of inverting the ceramic sheet 6 can be omitted in the via hole forming step and the laminating step.

Further, as shown in FIGS. 5 and 6, the folded portions of the external electrodes 10, 11, 12 may be formed on the ceramic sheet 6 in advance. In this case, the external electrode 1
The identification pattern 7 may be simultaneously applied using the same paste in the step of applying 0, 11, and 12.

FIG. 7 shows the capacitor electrode 3 on the ceramic sheet 2 laminated on the uppermost surface or the lowermost surface of the electric circuit layer 1.
Next, an example in which the identification pattern 7 is formed by using the same paste as the electrode 3 is shown. In this case, the ceramic sheet 2
A protective sheet is further laminated thereon, and the identification pattern 7 is recognized through the protective sheet.

Although the identification pattern 7 shown in FIG. 7 is provided on the uppermost or lowermost ceramic sheet 2, if it can be seen through from the sheet 2, it will be below the uppermost surface or above the lowermost surface. It may be provided on the ceramic sheet located.

FIG. 8 shows an example in which the capacitor electrode 4 formed on the ceramic sheet 2 laminated on the uppermost surface or the lowermost surface of the electric circuit layer 1 functions as an identification pattern.
In other words, the identification pattern also functions as an internal circuit element. In this case as well, a protective sheet is further laminated on the ceramic sheet 2, and the electrode 4 as the identification pattern is recognized through the protective sheet.

As shown in FIGS. 5, 6, 7, and 8,
If the identification pattern 7 is formed on the same sheet as the external electrodes 10, 11, 12 and the capacitor electrode 3 using the same material, or if the capacitor electrode 4 itself functions as the identification pattern, a special pattern is formed. The step of can be omitted.

In FIG. 9, a partial cutout 5a is formed in the shield electrode 5 provided on the ceramic sheet 2 laminated on the uppermost surface or the lowermost surface of the electric circuit layer 1, and the cutout 5a is used as an identification pattern. Here is an example of making it work. This notch 5
By forming a, the shield electrode 5 is left-right asymmetric. The shape of the notch 5a is arbitrary as long as it has distinctiveness.

Further, in FIG. 10, a circular notch 5b is formed at an arbitrary position of the shield electrode 5, and the notch 5 is formed.
An example in which b is made to function as an identification pattern is shown.

Further, FIG. 11 shows an example in which the character "M" is formed by providing a plurality of circular notches 5b in the shield electrode 5, and the character is made to function as an identification pattern.

As shown in FIGS. 9 and 10, if the identification pattern is formed as the cutouts 5a and 5b of the shield electrode 5, a special step of forming the identification pattern can be omitted.

In the example of FIGS. 10 and 11, the notch 5b
The shape may be various shapes other than the circular shape, and may be a symbol or a pattern other than the character. If the identification pattern is formed as characters, symbols or patterns, it is possible to identify not only the directionality of the front and back of the electronic component, but also the type of the electronic component.

(Other Embodiments) The multilayer electronic component according to the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various modifications can be made within the scope of the invention.

In particular, the present invention can be widely applied to multilayer capacitors, multilayer inductors, multilayer LC filters, multilayer noise filters, multilayer high frequency modules, multilayer substrates and the like.

[0046]

As is apparent from the above description, according to the present invention, the identification pattern for identifying the directionality is seen through the laminate in plan view on the front and back surfaces of the laminate or near the front and back surfaces thereof. Since they are provided so as to overlap with each other in the above-described state, not only the directionality at the time of mounting can be identified, but also the directionality can be identified even during the manufacturing process, and the front and back surfaces of the laminate can be identified. Further, if the identification pattern is provided near the front and back of the laminated body, the identification pattern is protected by the outermost layer.

Particularly, if the identification pattern is formed in the insulating layer sheet by a via hole, the identification pattern (via hole)
Since it is not necessary to turn the insulating layer sheet upside down in the step of forming and the subsequent laminating step, the manufacturing process is simplified.

Further, if the identification pattern is formed on the same surface as the internal circuit element or has a function as an internal circuit element, a special process for forming the identification pattern can be omitted. Further, even if the identification pattern is formed by a partial lack portion provided in the internal circuit element, a special process for forming the identification pattern can be omitted.

Further, if the identification pattern is formed as characters, symbols or patterns, it becomes possible to identify not only the directionality but also the type of electronic component.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a laminated electronic component that is a first embodiment of the present invention.

FIG. 2 is an exploded perspective view showing a laminated electronic component that is a second embodiment of the present invention.

FIG. 3 is a plan view showing an example of an identification pattern.

FIG. 4 is a plan view showing an example in which an identification pattern is formed by a via hole.

FIG. 5 is a plan view showing an example in which an identification pattern is formed in the same step as a folded portion of an external electrode.

FIG. 6 is a plan view showing another example in which an identification pattern is formed in the same step as a folded portion of an external electrode.

FIG. 7 is a plan view showing an example in which an identification pattern is formed on the same surface as a capacitor electrode.

FIG. 8 is a plan view showing an example in which an identification pattern is also used as a capacitor electrode.

FIG. 9 is a plan view showing an example in which an identification pattern is formed as a cutout portion of a shield electrode.

FIG. 10 is a plan view showing another example in which an identification pattern is formed as a cutout portion of a shield electrode.

FIG. 11 is a plan view showing an example in which an identification pattern is formed as characters.

FIG. 12 is a bottom view showing a conventional laminated electronic component.

[Explanation of symbols]

1 ... Electric circuit layer 2 ... Ceramic sheet 3, 4 ... Capacitor electrodes 5 ... Shield electrode 5a, 5b ... Notches 6, 6a, 6b ... Ceramic sheet 7, 7a, 7b ... Identification pattern 10, 11, 12 ... External electrodes

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tomoko Saito             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F term (reference) 5E082 AA01 AB03 BB01 BC38 BC39                       EE23 FF05 FG06 FG26 FG46                       MM22                 5E338 AA03 AA18 DD12 DD18 DD22                       DD32 EE32

Claims (7)

[Claims] 1. In a laminated electronic component in which an insulating layer and an internal circuit element are laminated to form a laminated body, and an external electrode is provided on a side surface of the laminated body, an identification pattern for identifying directionality is provided. A laminated electronic component, wherein the laminated body is provided on the front and back surfaces or in the vicinity of each of the front and back surfaces thereof so as to be overlapped with each other in a plan view perspective. 2. The multilayer electronic component according to claim 1, wherein the identification pattern is formed by a via hole. 3. The multilayer electronic component according to claim 1, wherein the identification pattern is formed in the same step as the folded portion of the external electrode. 4. The laminated electronic component according to claim 1, wherein the identification pattern is formed on the same surface as the internal circuit element. 5. The laminated electronic component according to claim 1, wherein the identification pattern also has a function as an internal circuit element. 6. The multilayer electronic component according to claim 1, wherein the identification pattern is formed by a partial lack portion provided in the internal circuit element. 7. The laminate according to claim 1, wherein the identification pattern is formed as a character, a symbol or a pattern by a partial lack portion provided in the internal circuit element. Mold electronic components.