JP2003168892A - Verification method for mounting accuracy, method and device for mounting, and fixture for verifying mounting accuracy - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for verifying mounting accuracy and a fixture for verifying mounting accuracy used therefor by which mounting accuracy of a part for a material body, on which the part is mounted, is easily verified in a short time. <P>SOLUTION: On a fixture 1 for verifying mounting accuracy that is mounted at a region on a stage 800 of a mounting device where a circuit board is mounted, positions of mounting reference points A and B provided on the surface for mounting parts B1 and B2 under the mounted state, and positions of mounting position verifying points P1 and P2 are recognized with an electronic microscope. The positional relationship between the mounting position recognition points P1 and P2 and the mounting reference points A and B is measured with a two-dimensional measuring instrument 3, to obtain the amount of deviation from the positional relationship between the mounting position recognition points P1 and P2 and the mounting reference points A and B in the case where the parts B1 and B2 are accurately mounted at specified part-mounting positions of the circuit board. Based on the data of the amount of deviation, whether each part of B1, B2 is accurately mounted at the specified part- mounting position is easily verified in a short period of time. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting accuracy confirmation method, a mounting method and apparatus, and a mounting accuracy confirmation jig. For example, an IC chip which is a component on a tray or an expand sheet is picked up by a pick-up nozzle (adsorption) of a mounting head. A mounting method and device for picking up by a nozzle) and mounting at a predetermined component mounting position of a mounted body such as a circuit board or a mounting board mounted on a stage, and mounted on the mounted body of the mounting apparatus. The present invention relates to a mounting accuracy confirmation method for confirming the mounting accuracy of a component, and a mounting accuracy confirmation jig used when confirming the position accuracy by the mounting accuracy confirmation method.

[0002]

2. Description of the Related Art In recent years, BGA (ball grid array)
In addition, mounting by flip bonding such as flip chip represented by MCM (multi-chip module) and CSP (chip size package) enables miniaturization of a mounted object such as a circuit board as compared with mounting by wire bonding. Therefore, it is becoming mainstream in the field of semiconductor packaging.

A mounting apparatus for carrying out this kind of semiconductor mounting is equipped with a mounting head having a plurality of suction nozzles for sucking and holding components such as flip chips. The mounting head is mounted on an XY robot, and is horizontally moved in the XY directions by driving the XY robot. In addition, each suction nozzle of the above mounting head is
It is configured to be vertically moved in the axial direction and rotationally moved in the θ direction about the Z axis.

In such a mounting apparatus, when mounting of a component is started, first, a component supply device for supplying the component or a tape feeder delivers the component to be mounted to a predetermined pickup portion. And
The mounting head is horizontally moved in the XY directions by driving the XY robot. The movement of the mounting head is sequentially stopped in a state where the suction nozzles face above the components corresponding to the suction nozzles sent to the pickup portion. The component suction position of each suction nozzle is previously input as NC data. In this state, each suction nozzle descends along the Z-axis direction and suction-holds the corresponding component.

In this way, when the respective suction nozzles suction and hold the corresponding components, the mounting head moves again, and the first recognition is arranged so as to face the movement path of each suction nozzle. The camera continuously and collectively recognizes the shape of each component. Then, the amount of deviation between the center of the first recognition camera that has recognized the component and the center of the recognized component is corrected. This correction amount is reflected in the NC data.

On the other hand, a circuit board as a mounted body on which the above-mentioned components are mounted is placed on a stage so as to face a predetermined mounting portion. In this state, the mounting head is X-
It moves in the Y direction, and the second mounted on this mounting head
The recognition camera recognizes the component mounting position of the circuit board placed on the mounting site on the stage. And
The movement amount of each suction nozzle is controlled based on the recognition result of each of the first recognition camera and the second recognition camera.

As a result, each component sucked by each suction nozzle faces the mounting position of the corresponding component on the circuit board placed on the mounting portion on the stage, while the mounting head moves. The movement is sequentially stopped. In this state, the suction nozzles descend along the Z-axis direction, and the components are mounted at the component mounting positions on the circuit board.
In this way, the components mounted at the component mounting positions on the circuit board are reflowed by the reflow device and fixed on the circuit board.

[0008]

By the way, in the mounting apparatus of this type, as described above, the first component recognition is performed.
Of the mounting camera by correcting the displacement amount between the center of the recognition camera and the center of the recognized component, and reflecting the correction amount in the NC data to control the movement amount of the mounting head. Is configured to increase.

However, in this type of conventional mounting apparatus, even if the mounting accuracy of the component on the mounted body is improved by controlling the movement amount of the mounting head as described above, There was a case where the component was displaced from the predetermined component mounting position. It is considered that one of the causes of the displacement of the mounting position of the component is the inclination of the Z axis of the suction nozzle. That is, when the Z axis of the suction nozzle is tilted, the suction nozzle moves up and down along the Z axis, so that the XY center of the tip of the suction nozzle is obtained.
The coordinates change. Therefore, the calculated XY coordinates indicating the center points of the component and the mounted body, which are recognized and calculated by the second recognition camera, and the X of the tip center of the suction nozzle.
Even if the movement amount of the mounting head in the XY direction is controlled so that the −Y coordinate exactly matches, the vertical movement of the suction nozzle at the pickup portion and the mounting portion causes
The center of the tip of the suction nozzle is displaced.

Therefore, in such a mounting apparatus, when the component is mounted at the component mounting position of the mounted body by the suction nozzle, the component is mounted on the component based on the XY coordinate data recognized by each recognition camera. Predetermined component mounting on the mounted object, even though the component is controlled so as to be correctly mounted at the predetermined component mounting position on the mounted object by correcting the posture and the movement amount of the suction nozzle. There was a case where a defective product was generated because the component was mounted in a position out of the position.

In order to prevent the occurrence of such a defective product, the equipment is managed and operated while periodically checking whether or not the component is correctly mounted on the mounted body,
It is necessary to guarantee the mounting accuracy of the component on the mounted body. However, under the present circumstances, BGA and CP are applied to the mounted body.
Tools and methods for checking in advance whether or not components such as S are accurately mounted have not been established. Therefore, until now, the mounting accuracy of the component on the mounted body has been confirmed by X-ray, and the equipment has been managed and operated.

However, in the method using X-rays as described above, it takes a considerably long time to confirm the mounting accuracy. Also, such a mounting accuracy confirmation work needs to be performed every time the type of the mounted component or the mounted body is switched. Therefore, in this type of mounting apparatus, a large amount of time is wasted to start up the equipment, the facility operating rate is extremely lowered, and the product yield is very likely to be significantly deteriorated.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a mounting accuracy confirmation method for easily and quickly confirming the mounting accuracy of a component on an object to be mounted. A mounting method and apparatus that can manage and operate the equipment while maintaining the current equipment operation rate at a minimum by the mounting accuracy confirmation method to guarantee the mounting accuracy of the component on the mounted body, and the mounting accuracy confirmation method as described above. It is to provide a mounting accuracy confirmation jig used for confirming the mounting accuracy of a component on a mounting body.

[0014]

In order to achieve the above object, the invention according to claim 1 mounts a component picked up by a pickup nozzle at a predetermined component mounting position of a mounted object placed on a stage. A mounting accuracy confirmation method for confirming the mounting accuracy of the component on the mounted body when mounting by mounting, for identifying the component mounting position of the component picked up by the pickup nozzle with respect to the mounted body. The mounting accuracy confirmation jig provided with the mounting position recognition point is mounted on the stage at a portion where the mounted body is mounted, and the component picked up by the pickup nozzle is mounted on the mounted body. In the same manner as when mounting, with the mounting accuracy confirmation jig mounted and fixed, the position of the mounting position recognition point of the mounting accuracy confirmation jig and the mounting The mounting position recognition point of the mounting accuracy confirmation jig, which is recognized by the recognition means, by recognizing the position with respect to the mounting reference point provided on the mounting surface of the component mounted and fixed on the degree confirmation jig. And the mounting reference point of the component are measured by a two-dimensional measuring instrument, and the positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring instrument and the predetermined component of the mounted body It is possible to confirm the mounting accuracy of the component on the mount object by the amount of deviation between the mounting position recognition point and the mounting reference point when the component is mounted correctly at the mounting position. It is a feature.

In this mounting accuracy confirmation method, first,
The mounting accuracy confirmation jig is mounted on the stage where the mounted body is mounted. Then, the component picked up by the pickup nozzle is mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body. In this state, the position of the mounting position recognition point of the mounting accuracy confirmation jig,
The recognizing means recognizes the position of the component mounted and fixed on the mounting accuracy confirmation jig and the mounting reference point provided on the mounting surface. Then, the two-dimensional measuring device measures the positional relationship between the mounting position recognition point of the mounting accuracy confirmation jig recognized by the recognition means and the mounting reference point of the component. The positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring device, and the mounting position recognition point and the mounting reference when the component is correctly mounted at a predetermined component mounting position of the mounted body. The mounting accuracy of the component on the mounted body is confirmed based on the amount of deviation from the positional relationship with the point. Here, the mounting reference point on the mounting surface of the component is provided in advance according to the type of the component mounted on the mounted body, and for example, a recess (counterbore) provided on the mounting surface of the component. Part). Further, the positions of the mounting position recognition point of the mounting accuracy confirmation jig and the mounting reference point of the component, which are recognized by the recognition means, are the center coordinates of each point. Therefore, the positional relationship between the mounting position recognition point and the mounting reference point when the component is correctly mounted and mounted at the predetermined component mounting position of the mounted body, and the mounting measured by the two-dimensional measuring device. By comparing the positional relationship between the position recognition point and the mounting reference point, it is possible to confirm whether or not the component is correctly mounted at the predetermined component mounting position of the mounting accuracy confirmation jig. By performing such confirmation work prior to mounting the component on the mounted body, it is possible to confirm whether or not the component is correctly mounted and mounted at a predetermined component mounting position on the mounted body during actual component mounting. Therefore, it becomes possible to easily and quickly confirm the information.

According to a second aspect of the present invention, in the mounting accuracy confirmation method according to the second aspect, the component is an electronic component mounted by bumps on a circuit board as the mounted body, and is measured by the two-dimensional measuring device. The mounting reference point is a bump of the electronic component.

As one of the methods for positioning and mounting the electronic component at the component mounting position of the mounted body, the package shape of the electronic component and the mounting reference points such as recesses and printing points provided in the package are set. A method of recognizing and specifying the mounting position of the electronic component on the mounted body is known. However, the size of the package of this kind of electronic component is not always constant, and even if the same type, the package size is slightly different depending on the manufacturer and the manufacturing lot. On the other hand, the bumps of this type of electronic component are formed at predetermined positions regardless of the manufacturer or the manufacturing lot. Therefore, in this type of electronic component, the mounting reference point provided on the package and the bump do not necessarily have a predetermined positional relationship. Therefore, in the above method, if the bump position is misaligned with respect to the package of the electronic component, the bump of the electronic component is accurately positioned with respect to the component mounting position of the mounted body and cannot be mounted. In the mounting accuracy confirmation method of the present invention, the bump of the electronic component is recognized as a mounting reference point, and the mounting position of the electronic component on the mounted body is specified. As described above, the bumps of this electronic component are provided at extremely precise positions predesigned according to the type of electronic component to be mounted. It does not differ depending on the production lot or the production lot. Therefore, in this mounting accuracy confirmation method, since the positional relationship between the mounting position recognition point and the mounting reference point is measured by the two-dimensional measuring device using such a bump as the mounting reference point, the actual mounting of the component In, it becomes possible to confirm in advance whether or not the component is correctly mounted at a predetermined component mounting position on the mounted body, in advance.

According to a third aspect of the present invention, there is provided a mounting method for mounting a component picked up by a pickup nozzle at a predetermined component mounting position of a mounted object placed on a stage, the picking up nozzle picking up the component. A mounting accuracy confirmation jig provided with a mounting position recognition point for identifying a component mounting position of the mounted component with respect to the mounted body is mounted on the stage where the mounted body is mounted, and The position of the mounting position recognition point of the mounting accuracy confirmation jig, with the component picked up by the pickup nozzle mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body. And the position of the mounting reference point provided on the mounting surface of the component are recognized by the recognizing means, and the mounting accuracy is confirmed by the recognizing means. The positional relationship between the mounting position recognition point of the group and the mounting reference point of the component is measured by a two-dimensional measuring instrument, and the positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring instrument and the above-mentioned target The amount of deviation between the mounting position recognition point and the positional relationship between the mounting reference point and the mounting reference point when the above component is correctly mounted at the predetermined component mounting position of the mounting body is the tolerance of the mounting accuracy of the component on the mounted body. After confirming that the deviation amount is within the error range, mounting of the component on the mounted body is started.

According to a fourth aspect of the present invention, there is provided a pickup nozzle for picking up a component, a stage for mounting a mounted body on which the component is mounted, a pickup portion for picking up a corresponding component by the pickup nozzle, and the stage. Nozzle moving means for reciprocating the pick-up nozzle between a mounting part for mounting the component on the mounted body mounted on the substrate, and a first recognition for recognizing the shape of the component picked up at the pick-up part. Means, second recognizing means for recognizing the component mounting position of the mounted body placed on the mounting site on the stage, and the recognition results of the first recognizing means and the second recognizing means. Nozzle movement amount control for controlling the movement amount of the pickup nozzle so as to mount a component corresponding to a predetermined component mounting position of the mounted body based on In mounting apparatus and a stage,
A mounting accuracy confirmation jig provided with a mounting position recognition point for specifying a component mounting position of the component picked up by the pickup nozzle with respect to the mounted body is mounted on the stage where the mounted body is mounted. The mounting position of the mounting accuracy confirmation jig in a state where the mounted component is picked up by the pickup nozzle and mounted and fixed on the mounting precision confirmation jig in the same manner as when mounting the component on the mounted body. Third recognizing means for recognizing the position of the recognition point and the position of the mounting reference point provided on the mounting surface of the component mounted and fixed on the mounting accuracy confirmation jig, and the third recognizing means. A two-dimensional measuring device that measures a positional relationship between a mounting position recognition point of the mounting accuracy confirmation jig that is more recognized and a mounting reference point of the component. That.

In this mounting method and mounting apparatus, first, the mounting accuracy confirmation jig is mounted on the stage where the mounted body is mounted. Then, the component picked up by the pickup nozzle is mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body. In this state, the position of the mounting position recognition point of the mounting accuracy confirmation jig and the position of the mounting reference point provided on the mounting surface of the component mounted and fixed on the mounting accuracy confirmation jig are recognized. Be more aware. Then, the two-dimensional measuring device measures the positional relationship between the mounting position recognition point of the mounting accuracy confirmation jig recognized by the recognition means and the mounting reference point of the component. The positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring device, and the mounting position recognition point and the mounting reference when the component is correctly mounted at a predetermined component mounting position of the mounted body. From the amount of deviation from the positional relationship with the point, it becomes possible to confirm the mounting accuracy of the above-mentioned component on the mounted body. It becomes possible to predict in advance whether or not a non-defective product may occur. Then, for example, mounting of the component on the mounted body is started only when the deviation amount is within the allowable error range, and when the deviation amount is outside the allowable error range, the deviation amount is outside the allowable error range. By managing and operating the equipment while keeping the current equipment operation rate at a minimum so as to cancel the mounting of the component on the mounting body, it becomes possible to guarantee the mounting accuracy of the component on the mounted body.

According to a fifth aspect of the present invention, when the component picked up by the pickup nozzle is mounted and mounted at a predetermined component mounting position of the mounted body mounted on the stage,
A mounting accuracy confirmation jig used for confirming the mounting accuracy of the component on the mounted body, the mounting for identifying a component mounting position of the component picked up by the pickup nozzle with respect to the mounted body. A position recognition point is provided, and the component mounted on the stage where the mounted body is mounted and picked up by the pickup nozzle is the same as when mounting the component on the mounted body. It is characterized in that the mounting reference point provided on the mounting surface of the component can be seen through in a mounted and fixed state.

As described in claim 1, the mounting accuracy confirmation jig is mounted on the mounted body mounting portion on the stage where the mounted body is mounted. Then, the component picked up by the pickup nozzle is mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body. In this state,
The position of the mounting position recognition point of the mounting accuracy confirmation jig and the position of the mounting reference point provided on the mounting surface of the component mounted and fixed on the mounting accuracy confirmation jig are recognized by the recognition means. . Then, the two-dimensional measuring device measures the positional relationship between the mounting position recognition point of the mounting accuracy confirmation jig recognized by the recognition means and the mounting reference point of the component. From the positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring device, the mounting position recognition point and the mounting reference when the component is correctly mounted at the predetermined component mounting position of the mounted body. The amount of deviation with respect to the positional relationship with the point can be known. As described above, by using the mounting accuracy confirmation jig, the mounting accuracy of the component on the mounted body can be confirmed easily and in a short time. The mounting accuracy confirmation jig can be formed of, for example, a transparent acrylic plate.

According to a sixth aspect of the present invention, in the mounting accuracy confirmation jig according to the fifth aspect, the mounting position recognition point is SU.
A mounting reference point formed on a mounting surface of the component, which is formed by a through hole formed in a flat plate made of S and is mounted and fixed in the same manner as when the component is mounted on the mounted body. It is characterized in that it has an opening for exposing.

The recognition of the mounting position recognition point and the mounting reference point by the recognition means, and the measurement of the mounting position recognition point position and the mounting reference point position by the two-dimensional measuring device are as described above. In addition, it is performed in a state where the component is mounted and fixed on the mounting accuracy confirmation jig mounted on the stage. Therefore, the recognition of each point by the recognition means and the measurement of each point position by the two-dimensional measuring device are performed on the side opposite to the surface (front surface) on which the parts of the mounting accuracy confirmation jig are mounted and fixed. It is necessary to perform from the back side of the mounting accuracy confirmation jig. Therefore, this mounting accuracy confirmation jig is configured so that the mounting reference point on the mounting surface of the component can be seen through. However, the mounting accuracy confirmation jig having the above-mentioned mounting position recognition point on the transparent acrylic plate is greatly expanded and contracted or deformed due to the influence of the heat of the use environment, and the mounting position recognition point is displaced. It is easy to occur. The mounting position recognition point of the mounting accuracy confirmation jig is a point that serves as an index when mounting the component picked up by the pickup nozzle on the mounted body, as described above. Therefore, if a deviation occurs in the position of the mounting position recognition point, even if the component is correctly mounted at a predetermined component mounting position of the mounting accuracy confirmation jig, a predetermined amount of the mounted object is actually mounted at the time of mounting the component. The component may not be mounted correctly at the component mounting position. Further, the mounting position recognition point is formed by an extremely small point having a diameter of 1 mm ± 0.05, for example.
It is extremely difficult to directly form such a mounting position recognition point on the transparent acrylic plate. Therefore, in the mounting accuracy confirmation jig made of the acrylic plate, first, a relatively large square white base portion is formed on the acrylic plate, and the mounting position recognition point is formed on the white base portion. I was doing. However, when the mounting position recognizing point is formed on the white background portion in this manner, the mounting position recognizing point cannot be recognized from the back side of the acrylic plate. Therefore, when a mounting accuracy confirmation jig made of such an acrylic plate is used, when the mounting position recognition point and the mounting reference point are recognized by the recognition means, the mounting position is determined. It is necessary to recognize the recognition points from the front surface side of the mounting accuracy confirmation jig and to recognize the mounting reference points from the rear surface side of the mounting accuracy confirmation jig, which causes a troublesome recognition work. On the other hand, in the mounting accuracy confirmation jig of the present invention, the mounting position recognition point is formed by a through hole formed in a flat plate made of SUS. The mounting accuracy confirmation jig made of SUS is
Compared to the mounting accuracy confirmation jig made of the acrylic plate, there is less expansion and contraction or deformation due to the effect of heat in the operating environment, and the positional deviation due to the thermal effect of the mounting position recognition point is an error in the diameter of the mounting position recognition point. It will be within the range. Further, in the mounting accuracy confirmation jig according to the present invention, the mounting position recognition point is formed by the through hole, and the mounting reference point on the mounting surface of the component is exposed from the opening. The positions of the points can be recognized collectively from the back surface side of the mounting accuracy confirmation jig, and the recognition work does not take time and effort.

According to a seventh aspect of the invention, in the mounting accuracy confirmation jig according to the fifth aspect, the mounting position recognition point is formed by a vapor deposition body vapor-deposited on a transparent glass plate. .

In this mounting accuracy confirmation jig, since the mounting position recognition point is formed by a vapor deposition body deposited on a transparent glass plate, in the case of the mounting accuracy confirmation jig made of a flat plate of SUS according to claim 6. Similarly, the expansion and contraction and the deformation due to the influence of the heat of the use environment are small, and the positional deviation due to the influence of the mounting position recognizing point due to the heat is within the error range of the diameter of the mounting position recognizing point. Also,
Since the mounting accuracy confirmation jig of the present invention is made of a transparent glass plate, the mounting point on the mounting surface of the component is exposed like the mounting accuracy confirmation jig made of the SUS flat plate. Since it is not necessary to provide the opening, it can be constructed at a relatively low cost. Furthermore, since the mounting position recognition point can be directly formed by the vapor deposition body by configuring the transparent glass plate, it is possible to mount the mounting position on the acrylic plate like a mounting accuracy confirmation jig made of the acrylic plate. It is not necessary to form the white background portion of the position recognition point.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be described with reference to BGA (ball bump array) and MCM (multi-chip module).
An embodiment applied to a mounting device for mounting a flip chip such as a CSP (chip size package) will be described. FIG. 1 shows an example of the mounting apparatus.
The mounting apparatus 100 includes a plurality of (four in this example) suction nozzles 2 for sucking and holding components such as flip chips.
Mounting head 20 having 01, 202, 203, 204
It has 0. The mounting head 200 is the XY robot 3
The XY robot 300 is driven to move horizontally in the XY directions. Also, the mounting head 2
00 suction nozzles 201, 202, 203, 204
Is vertically moved in the Z-axis direction by driving a cylinder (not shown), and is rotationally moved in the θ direction about the Z-axis by driving a servo motor (not shown) (see FIG. 2).

In FIG. 1, when mounting of components is started, first, a component supply device 400 disposed on the back side of the mounting device 100 or a tape feeder disposed on the front side of the mounting device 100. By 500, the component to be mounted is delivered to a predetermined pickup site. Then, the mounting head 200 is used as the XY robot 300.
Is horizontally moved in the XY directions. The movement of the mounting head 200 is performed by each suction nozzle 201, 202, 20.
3, 204 are sequentially stopped in a state of facing above the parts corresponding to the respective suction nozzles sent to the pickup portion. These suction nozzles 201, 202, 203, 2
The 04 component suction position is previously input as NC data. In this state, each suction nozzle 201, 20
2, 203, and 204 descend along the Z-axis direction to suck and hold corresponding parts.

In this way, the suction nozzles 201, 201
02, 203, 204, corresponding parts B1, B
When 2, B3 and B4 are respectively suction-held, the mounting head 200 moves again as shown in FIG. 2, and the first heads are arranged to face the movement paths of the respective suction nozzles 201, 202, 203 and 204. The recognition camera 600A continuously recognizes the shapes of the components B1, B2, B3, and B4 all at once. Then, the amount of deviation between the center of the first recognition camera 600A and the centers of the recognized parts B1, B2, B3, B4 is corrected. This correction amount is reflected in the NC data.

On the other hand, a circuit board 700 as a mounted body on which the above-mentioned components are mounted is conveyed by driving a conveyor and placed on a stage 800 while facing a predetermined mounting site. In this state, the mounting head 200 moves to X
By moving in the Y direction, the second recognition camera 600B mounted on the mounting head 200 recognizes the component mounting position of the circuit board 700 mounted on the mounting site on the stage 800. Then, the first recognition camera 600A
And based on the recognition results of the second recognition camera 600B,
The movement amount of each suction nozzle 201, 202, 203, 204 is controlled by a nozzle movement amount control means including a positioning controller, a servo driver, a servo motor, and the like (not shown).

As a result, each suction nozzle 201, 20
Parts B1, B2, B sucked by 2, 203, 204
The movement of the mounting head 200 is sequentially stopped in a state where B3 and B4 face above the respective component mounting positions of the circuit board 700 mounted on the mounting site on the stage 800.
In this state, each suction nozzle descends along the Z-axis direction,
The components B1, B2, B3, B4 are mounted at the component mounting positions on the circuit board 700, respectively. In this manner, the components B1, B2, B3, B4 mounted at the component mounting positions of the circuit board 700 are conveyed to the reflow device (not shown) by the drive of the conveyor and reflowed, thereby the circuit board 700. Fixed on top.

By the way, the mounting apparatus 1 having the above-mentioned configuration
In 00, as described above, the deviation amount between the center of the recognized first recognition camera 600A and the recognized center of the component is corrected, and the correction amount is reflected in the NC data, and the mounting head 200 It is configured to increase the mounting accuracy of the components to be mounted by controlling the movement amount of. The mounting accuracy of the components mounted on the circuit board 700 is improved. However, in this way, the circuit board 70
Even if the mounting accuracy of the component to 0 is increased, the Z of the suction nozzles 201, 202, 203, and 204 as described above is
The picked-up component may be mounted out of position from a predetermined component mounting position on the circuit board 700 due to an axis inclination or the like.

In order to prevent the occurrence of defective products due to the positional displacement of the components when mounting the components on the circuit substrate 700, the circuit substrate 700 has been hitherto used by X-rays.
The equipment is managed and operated while periodically checking the mounting accuracy of the components to ensure the mounting accuracy of the components on the circuit board 700. However, in such a method using X-rays, it takes a considerable time to confirm the mounting accuracy, and it is necessary to perform the check every time the type of the mounted component or the circuit board 700 is changed. There is a high possibility that a large amount of time is wasted in starting the mounting apparatus 100, the facility operation rate is extremely lowered, and the product yield is extremely deteriorated.

The present invention proposes a mounting accuracy confirmation method for solving the above-mentioned problems, in which the mounting accuracy of a component on the circuit board 700 is confirmed using a mounting accuracy confirmation jig. FIG. 3 shows an example of a mounting accuracy confirmation jig used in this mounting accuracy confirmation method. The mounting accuracy confirmation jig 1 shown in FIG. 3 is composed of a transparent acrylic plate, and the surface of the mounting accuracy confirmation jig 1 is a component B1 to be confirmed which is picked up by the suction nozzles 201 and 202. A mounting position confirmation point P1 for specifying a component mounting position of the circuit board 700 of B2,
P2 is formed.

In the mounting accuracy confirmation method of the present invention, first, the mounting accuracy confirmation jig 1 described above is mounted on the stage 800 of the mounting apparatus 100 where the circuit board 700 is mounted. Next, the components B1 and B2 to be confirmed which are picked up by the suction nozzles 201 and 202 are mounted and fixed on the mounting accuracy confirmation jig 1 in the same manner as when mounting the components on the circuit board 700. To do. Here, in order to mount and fix each component on the mounting accuracy confirmation jig 1, a double-sided tape is attached in advance to the mounting surface of each component B1, B2 facing the surface of the mounting accuracy confirmation jig 1. deep.

As shown in FIG. 4, with the components B1 and B2 mounted and fixed on the mounting accuracy confirmation jig 1, the mounting position recognition points P1 and P2 of the mounting accuracy confirmation jig 1 are shown in FIG. And the positions of the mounting reference points A and B provided on the mounting surfaces of the components B1 and B2 mounted and fixed on the mounting accuracy confirmation jig 1 are recognized by the electron microscope 2 as a recognition means. To do. Since the mounting accuracy confirmation jig 1 is placed on the stage 800 of the mounting apparatus 100, the recognition of each point position by the electron microscope 2 needs to be performed from the upper side of the mounting accuracy confirmation jig 1. Here, for the position recognition by the electron microscope 2 of the mounting position recognition points P1 and P2 formed on the surface of the mounting accuracy confirmation jig 1, as shown in FIG. 4A, the respective components B1 and B2 are fixed. It can be performed from the front side of the mounting accuracy confirmation jig 1 in the state of being kept. However, the positions of the mounting reference points A and B provided on the mounting surfaces of the components B1 and B2 are
It is necessary to see through from the back side of the mounting accuracy confirmation jig 1 with the components B1 and B2 fixed. Therefore, the position recognition of the mounting reference points A and B provided on the mounting surfaces of the respective components B1 and B2 by the electron microscope 2 is performed by the surface of the mounting accuracy confirmation jig 1 as shown in FIG. 4B. With the components B1 and B2 fixed, the mounting accuracy confirmation jig 1 is turned upside down.
At this time, if the mounting accuracy confirmation jig 1 placed upside down on the stage 800 may tilt due to differences in the shape of each component, the stage 800 and the mounting accuracy confirmation jig 1 are A spacer (not shown) is arranged between them.

The mounting position recognition points P1 and P2 of the mounting accuracy confirmation jig 1 recognized by the electron microscope 2 are detected.
And the positional relationship between the mounting reference points A and B of the components B1 and B2 are measured by the two-dimensional measuring device 3. As the two-dimensional measuring device 3, for example, a universal tool microscope (TUM-220ES) manufactured by TOPCON Co., Ltd. can be used. The two-dimensional measuring device 3 of this example recognizes the mounting position of the mounting accuracy confirmation jig 1 in which the coordinates of the mounting reference points A and B of the components B1 and B2 recognized by the electron microscope 2 are the origin (0, 0). It is configured to measure the coordinates (X, Y) of the points P1 and P2. Then
The positional relationship between the mounting position recognition points P1 and P2 and the mounting reference points A and B measured by the two-dimensional measuring device 3 and these components B1 and B2 are correctly mounted at predetermined component mounting positions on the circuit board 700. When the mounting position recognition points P1 and P2 and the mounting reference points A and B are misaligned,
Calculate with 4. Then, the calculation result of this PC4 is
The printer 5 makes a graph and outputs it. Here, the mounting reference points A and B on the mounting surfaces of the components B1 and B2 are
For example, a recess (counterbore) provided in advance in a package of a component mounted on the circuit board 700 can be used.
In addition, the mounting position recognition point P of the mounting accuracy confirmation jig 1
1, P2 and mounting reference points A and B for the components B1 and B2
The position recognized by the electron microscope 2 is defined as the center coordinate of each point.

In this way, the positional relationship between the mounting position recognition points P1 and P2 measured by the two-dimensional measuring device 3 and the mounting reference points A and B, and the predetermined mounting positions of the components on the circuit board 700 are shown. Predetermination of the mounting accuracy confirmation jig 1 by graphing and comparing the amount of deviation between the mounting position recognition points P1 and P2 and the mounting reference points A and B when the components B1 and B2 are mounted correctly. Whether or not the components B1 and B2 are correctly mounted at the component mounting position can be easily and quickly confirmed. Therefore, such confirmation work should be performed on the circuit board 7.
By mounting the components B1 and B2 on the circuit board 00 before mounting the components B1 and B2 on the circuit board 700, it is possible to determine whether or not the components B1 and B2 are correctly mounted and mounted at predetermined component mounting positions on the circuit board 700. Therefore, it becomes possible to easily and quickly confirm the information. In addition, by this method, other parts B
Needless to say, the mounting accuracy of B3 and B4 can be confirmed easily and in a short time.

By the way, the size of the package of each of the components B1, B2, B3, B4 mounted on the circuit board 700 is not always constant, and even if they are of the same type, they differ slightly depending on the manufacturer and the manufacturing lot. ing. On the other hand, the bumps of the respective components B1, B2, B3, B4 are formed at predetermined positions regardless of the manufacturer or the manufacturing lot. Therefore, as described above, each component B1,
When the mounting accuracy is confirmed by using the recesses (counterbore portions) provided in the packages B2, B3, B4 as the mounting reference points A and B, there is a displacement between the mounting reference points A and B and the bump position. Then, the bumps of the respective components are accurately positioned with respect to the component mounting positions of the circuit board 700, and are not mounted.

Therefore, in the above mounting accuracy confirmation method, it is preferable to specify the mounting position of each component on the circuit board 700 using the bumps of each component B1, B2, B3, B4 as the mounting reference points. As described above, the bumps of each component are provided at extremely precise positions designed in advance according to the type of the component to be mounted. It does not differ depending on the manufacturing lot. Therefore, by using the bump as a mounting reference point and measuring the positional relationship between the mounting position recognition point and the mounting reference point by the two-dimensional measuring device 3,
Whether or not each component is properly mounted at a predetermined component mounting position on the circuit board 700 during actual component mounting can be reliably and accurately confirmed in advance.

As described above, the positional relationship between the mounting position recognition points P1 and P2 measured by the two-dimensional measuring device 3 and the mounting reference points A and B, and the mounting position of these components on the circuit board 700 are determined. By checking the deviation amount between the mounting position recognition points P1 and P2 and the mounting reference points A and B when B1 and B2 are correctly mounted, the components B1, B2 and B3 to the circuit board 700 are confirmed. , B4
It becomes possible to predict in advance whether or not a defective product may occur before starting the mounting of. Therefore, for example, when the deviation amount is within the allowable error range, mounting of each component on the circuit board 700 is started, and when the deviation amount is outside the allowable error range, the circuit is started. The mounting of each component on the board 700 is stopped. In this way, by managing and operating the equipment while maintaining the current equipment operation rate at a minimum, it becomes possible to guarantee the mounting accuracy of each component on the circuit board 700.

By the way, in the mounting accuracy confirmation method, as described above, the positions of the mounting reference points A and B provided on the mounting surfaces of the components B1 and B2 are set to the positions of the components B1 and B1, respectively.
It is necessary to see through from the back side of the mounting accuracy confirmation jig 1 with B2 fixed. Therefore, in this mounting accuracy confirmation method, the mounting accuracy confirmation jig 1 is made of a transparent acrylic plate or the like. However, the mounting accuracy confirmation jig 1 configured such that the mounting position recognition points P1 and P2 are provided on such a transparent acrylic plate is greatly expanded and contracted or deformed due to the influence of the heat of the use environment, and the mounting position recognition points P1 and P2 are large. Is likely to be misaligned. The mounting position recognition points P1 and P2 of the mounting accuracy confirmation jig 1 are the circuit board 700 for the components picked up by the suction nozzle.
It is a point that becomes an index when implementing in. Therefore, if the mounting position recognition points P1 and P2 are displaced from each other, even if each component is correctly mounted at a predetermined component mounting position on the mounting accuracy confirmation jig 1, the circuit board 700 is actually mounted. The component may not be correctly mounted at the predetermined component mounting position of.

Further, the mounting position recognition points P1 and P
2 is formed at a very small point with a diameter of 1 mm ± 0.005, for example. It is extremely difficult to directly form such mounting position recognition points P1 and P2 on a transparent acrylic plate. Therefore, in the mounting accuracy confirmation jig 1 made of this acrylic plate, as shown in FIG.
A relatively large square white base portion 6 is formed on the acrylic plate, and the mounting position recognition points P1 and P2 are formed on the white base portion 6. However, in this way, the mounting position recognition point P1,
When P2 is formed, this mounting position recognition point P
Jig 1 for mounting accuracy confirmation of P1 and P2 through an acrylic plate
You will not be able to recognize it from the back side of. Therefore, when the mounting accuracy confirmation jig 1 made of such an acrylic plate is used, the mounting position recognition points P1 and P2 are recognized as shown in FIG.
4B, it is necessary to recognize the mounting reference points A and B from the rear surface side of the mounting accuracy confirmation jig 1, as shown in FIG. 4B, and it takes a lot of time to recognize each point. .

FIG. 5 shows a jig 1 for confirming such mounting accuracy.
An example of a mounting accuracy confirmation jig 10 in which the above problem is resolved is shown. In the mounting accuracy confirmation jig 10, a plurality of mounting position recognition points P corresponding to the mounting centers of the respective parts are SUS.
It is formed by a small through hole formed in a flat plate made of (stainless steel). Around each mounting position recognition point P formed on the mounting accuracy confirmation jig 10, the mounting surface of each component fixed on the mounting accuracy confirmation jig 10 with the mounting position recognition point P as the mounting center. Relatively large openings 11, 12, 13, 14 for exposing the bumps b1, b2, b3, b4 located at the upper four corners are formed. Fig. 6 shows the target 1 of the mounting accuracy.
Mounting position recognition point P corresponding to the mounting center of one component
And each bump b located at the four corners on the mounting surface of this component
Each opening 11, 12, 1 exposing 1, b2, b3, b4
3 and 14 are enlarged views.

The mounting accuracy confirmation of each component using the mounting accuracy confirmation jig 10 is performed as follows. First,
Circuit board 70 on stage 800 of mounting apparatus 100
The mounting accuracy confirmation jig 1 described above is mounted on the part where 0 is placed.
Place 0. Next, as shown in FIG. 7, each component B1 to B1 as a confirmation target picked up by the suction nozzles 201 and 202 on the mounting accuracy confirmation jig 10.
2 is mounted and fixed so that the mounting centers of the components B1 to B12 coincide with the mounting position recognition points P in the same manner as when mounting the component on the circuit board 700. Fixing of each component on the mounting accuracy confirmation jig 10 is performed by a double-sided tape attached in advance to the mounting surface of each component B1 to B12.

In this way, the mounting accuracy confirmation jig 10 is provided.
With each component B1 to B12 mounted and fixed thereon, the position of each mounting position recognition point P of the mounting accuracy confirmation jig 10 and the mounting, as in the case of the mounting accuracy confirmation method shown in FIG. The positions of the bumps b1, b2, b3, b4 at the four corners as the mounting reference points of the components B1 to B12 mounted and fixed on the accuracy confirmation jig 10 are recognized by the electron microscope 2 as the recognition means. As described above, since the mounting accuracy confirmation jig 1 is placed on the stage 800 of the mounting apparatus 100, the recognition of each point position by the electron microscope 2 is performed from the upper side of the mounting accuracy confirmation jig 1. .

Here, when the mounting accuracy confirmation jig 1 shown in FIG. 1 is used, the position recognition of each mounting position recognition point by the electron microscope 2 is performed as shown in FIG. As shown in FIG. 4B, the position of the mounting reference point provided on the mounting surface of each component is recognized from the front side of the accuracy confirmation jig 1, and the mounting accuracy confirmation jig 1
Since it is necessary to reverse the front and back, it is troublesome.
On the other hand, the mounting accuracy confirmation jig 1 made of SUS
When 0 is used, each mounting position recognition point P is formed by a through hole, and therefore the position recognition of each mounting position recognition point P by the electron microscope 2 and each component B1 to B1 are performed.
The bumps b1 and b at the four corners, which are the mounting reference points of 2
Jig 1 for mounting accuracy confirmation for position recognition of 2, b3, b4
It becomes possible to do it all at once from the back side of 0,
The recognition work does not take time and effort. Further, the mounting accuracy confirmation jig 10 is less likely to expand and contract or deform due to the effect of heat in the use environment, as compared with the mounting accuracy confirmation jig 1 made of the acrylic plate, and the thermal effect of each mounting position recognition point P. The positional deviation due to is within the error range of the diameter of the through hole forming each mounting position recognition point P.

Next, each mounting position recognition point P of the mounting accuracy confirmation jig 10 recognized by the electron microscope 2 and each component B1 exposed through each opening 11, 12, 13, 14 of the mounting accuracy confirmation jig 10. The positional relationship with the bumps b1, b2, b3, b4 at the four corners, which are the mounting reference points of B12 to B12, is measured by the two-dimensional measuring device 3. Then, the bumps b1 of the components B1 to B12 whose origins are the mounting position recognition points P measured by the two-dimensional measuring device 3,
For each of the components B1 to B12 whose origin is the mounting position recognition point P when these components B1 to B12 are correctly mounted at the predetermined component mounting positions on the circuit board 700 at the position coordinates of b2, b3, and b4. Each bump b1, b2, b3,
A deviation amount from the position coordinate of b4 is calculated by the PC (personal computer) 4. Then, the calculation result of the PC 4 is graphed and output by the printer 5.

Here, the bumps b1, b2, b of the components B1 to B12 whose origins are the mounting position recognition points P, respectively.
As shown in FIG. 8, the deviation amount of the position coordinates of 3 and b4 is as follows.
The amount of deviation of the mounting command coordinates in the X-axis direction with respect to the mounting center line of each bump b1, b2, b3, b4, and the mounting command coordinate with respect to the mounting center line of each bump b1, b2, b3, b4 as shown in FIG. Is the amount of deviation in the Y-axis direction. Figure 10
Parts (A1), (b), (c) and (d) have respective parts B1 to B1.
The mounting angle of each of the bumps b1, b2, b4, b3 of 2 is 0.
The graph of the shift amount of the X-axis direction coordinate in the case of degrees is shown. Further, in FIGS. 11A, 11B, 11C, and 11D, the Y-axis direction coordinates of the bumps b1, b2, b4, and b3 of the components B1 to B12 when the mounting angle is 0 degree. The graph of the amount of gap is shown. Furthermore, FIGS. 12 (a), (b), (c), (d)
The bumps b1, b2, b4 of the components B1 to B12,
The graph of the shift amount of the coordinate of the X-axis direction of b3 when the mounting angle is 180 degrees is shown. 13 (a), (b),
(C), (d), each bump b of each component B1 ~ B12
The graph of the shift amount of the Y-axis direction coordinate of 1, b2, b4, and b3 when the mounting angle is 180 degrees is shown.

In each of these graphs, the above-mentioned amount of deviation is shown by a white prism, and the upper side a of each prism is the maximum measured value, and the lower side b of each prism is the minimum measured value. , The bar c that penetrates the center of each prism up and down is the standard deviation (± 3
σ; however, according to a simplified standard deviation calculation formula) (see FIG. 12A). In addition, each graph shown in FIGS. 10 to 13 is divided into an upper plus region and a lower minus region with a horizontal axis having a shift amount of “0” as a boundary, and each of the bumps b1 and b2 can be simply described. , B3, b4, the mounting positions are known. That is, the plus area of each graph is the bumps b1, b2, b in FIGS.
It is shown that the centers of 3 and b4 are mounted at positions outside the mounting command coordinates, and the minus area of each graph is shown in FIG.
Further, in FIG. 9, the centers of the bumps b1, b2, b3, b4 are shown to be mounted at positions inside the mounting command coordinates.

For example, in FIG. 8, when the mounting position of the bump b1 falls within the minus region, as shown in FIG. 14, the prism that indicates the deviation amount of the bump b1 in the X-axis direction coordinate falls within the minus region. Is output. Therefore, from the graph of FIG. 14, the actual mounting position of the bump b1 of the component to be confirmed is more negative than the mounting command position.
It is possible to know that it will be mounted at a position shifted by α mm. On the contrary, in FIG. 8, when the mounting position of the bump b1 is in the plus area, a graph in which a prism showing the deviation amount of the coordinate of the bump b1 in the X-axis direction is in the plus area is output, It can be seen from this graph that the actual mounting position of the bump b1 of the component to be mounted is displaced by + α mm from the mounting command position.
Similarly, in FIG. 9, when the mounting position of the bump b1 is in the plus region, as shown in FIG. 15, the rectangular column indicating the deviation amount of the coordinate of the bump b1 in the Y-axis direction is in the minus region. The graph is output. And this Figure 1
From the graph of 5, it can be known that the actual mounting position of the bump b1 of the component to be confirmed is mounted at a position shifted by + α mm from the mounting command position. On the contrary, in FIG. 9, when the mounting position of the bump b1 is in the negative region, a graph in which the prism showing the deviation amount of the coordinates of the bump b1 in the Y-axis direction is in the negative region is output,
The actual mounting position of the bump b1 of the component to be confirmed is
It can be known from this graph that the mounting is performed at a position shifted by -αmm from the mounting command position. Here, the graph showing the mounting accuracy is expressed separately in the X-axis direction and the Y-axis direction, as shown in FIGS. 10 to 13, even for components having the same mounting angle. This is because two axes of X axis and Y axis cannot be displayed in one graph.

As described above, each component is mounted on the mounting accuracy confirmation jig 10, and each bump b1 of each component whose origin is the mounting position recognition point P measured by the two-dimensional measuring device 3 is used.
The bumps b having the positions of b2, b3, b4 and the mounting position recognition points P when these components are correctly mounted at the predetermined component mounting positions of the circuit board 700 as origins.
By comparing the amounts of deviation with the positions of 1, b2, b3, and b4 in a graph and comparing them, it is possible to easily and easily determine whether or not each component is correctly mounted at a predetermined component mounting position of the mounting accuracy confirmation jig 10. You will be able to check in time. Therefore, by performing such confirmation work prior to mounting the components B1 and B2 on the circuit board 700, each component is correctly mounted at a predetermined component mounting position on the circuit board 700 during actual component mounting. It becomes possible to easily and quickly confirm whether or not it is mounted.

FIG. 16 shows an example of an action when the mounting deviation amount of the graph obtained by the mounting accuracy confirmation method reaches the maximum value. In FIG. 16, when the mounting deviation amount reaches the maximum value, first, as shown in step S1, a splint adjustment for adjusting the mounting accuracy is performed. Here, when the adjustment is impossible, the amount of mounting deviation has not reached the limit value, so mounting is performed for the time being. Then, when the above-mentioned offset adjustment is "OK", the mounting apparatus 100 is taught (step S2) and the mounting accuracy is confirmed (step S3). If the offset adjustment in step S3 is "NG", the process returns to step S2 and teaching is performed again. Then, in step S3, "OK"
Then, the parameter change point is found, and the mechanical portion of the mounting apparatus 100 related to the value is observed (step S4).

FIG. 17 shows an example of an action when the mounting deviation amount of the graph obtained by the mounting accuracy confirmation method is out of the standard. In FIG. 17, when the deviation amount out of the standard is confirmed, first, as shown in step S1, the fact is notified to the relevant section (assembly / standard) of the mounting line, and the line is stopped. (Step S2). Also,
In parallel with this, a request for adjustment of the mounting apparatus 100 is made (step S3), and equipment teaching is performed (step S4). When the adjustment is completed and "OK" is displayed, the parameter change point is found and the part related to the item is observed (step S5). Then, the production is restarted and the changed items are watched (step S6). Note that step S
Adjustment is not possible during teaching of the equipment of 4
If it is determined to be "G", the maker (manufacturer) of the mounting apparatus 100 is contacted to take measures (step S7). In this way, by managing and operating the equipment while maintaining the current equipment operation rate at a minimum, it becomes possible to guarantee the mounting accuracy of the components on the circuit board 700.

FIG. 18 shows another mounting accuracy confirmation jig 20 used in the mounting accuracy confirmation method. The mounting accuracy confirmation jig 20 is made of a transparent glass plate, and the mounting position recognition point is formed by a large number of vapor deposition bodies 21 vapor-deposited on the glass plate. In this mounting accuracy confirmation jig 20, since the mounting position recognition points are formed by a large number of vapor deposition bodies 21 vapor-deposited on a transparent glass plate, the mounting accuracy confirmation jig 10 made of a flat plate of SUS as described above is used. Similarly to the case, expansion and contraction and deformation due to the heat of the use environment are small, and the positional deviation due to the heat effect of the mounting position recognition point is within the error range of the diameter of each vapor deposition body 21. Also, this mounting accuracy confirmation jig 20
Is made of a transparent glass plate.
Like the mounting accuracy confirmation jig 10 made of a flat plate, it is not necessary to provide the openings 11, 12, 13, 14 for exposing the bumps at the four corners on the mounting surface of the component to be confirmed, and the structure is relatively inexpensive. it can. Further, since the mounting accuracy confirmation jig 20 is formed of a transparent glass plate, the mounting position recognition point can be directly formed by the vapor deposition body 21. Therefore, the mounting accuracy confirmation of the acrylic plate as described above is performed. It is not necessary to form the white base portion 6 of the mounting position recognition point on the acrylic plate as in the jig 1 for use.

[0056]

According to the first and second aspects of the present invention, the positional relationship between the mounting position recognition point and the mounting reference point when the component is correctly mounted and mounted at a predetermined component mounting position of the mounted body By comparing the mounting position recognition point measured by the two-dimensional measuring instrument and the positional relationship between the mounting reference point and the mounting reference point, it is possible to check whether the above components are correctly mounted at the predetermined component mounting positions of the mounting accuracy confirmation jig. You can check. By performing such confirmation work prior to mounting the component on the mounted body, it is possible to confirm whether or not the component is correctly mounted and mounted at a predetermined component mounting position on the mounted body during actual component mounting. There is an excellent effect that the confirmation can be performed easily and in a short time.

In particular, according to the second aspect of the invention, since the positional relationship between the mounting position recognition point and the mounting reference point is measured by the two-dimensional measuring device using the bump as the mounting reference point, the actual component mounting is performed. There is an excellent effect that it becomes possible to surely and accurately confirm beforehand whether or not the component is properly mounted at a predetermined component mounting position on the mounted body.

According to the third and fourth aspects of the invention, the positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring device, and the component is correctly mounted at the predetermined component mounting position on the mounted body. When the mounting position recognition point and the mounting reference point are misaligned, it is possible to check the mounting accuracy of the component to the mounted body, and to confirm the mounting accuracy of the component to the mounted body. Before starting the mounting, it becomes possible to predict in advance whether or not a defective product may occur. Then, for example, mounting of the component on the mounted body is started only when the deviation amount is within the allowable error range, and when the deviation amount is outside the allowable error range, the deviation amount is outside the allowable error range. It will be possible to guarantee the accuracy of component mounting on the mounted body by managing and operating the facility while maintaining the current facility operating rate at a minimum so that mounting of the component on the mounted body will be canceled. It has an excellent effect.

According to the fifth, sixth and seventh aspects of the present invention, it is possible to provide a mounting accuracy confirmation jig capable of easily and quickly confirming the mounting accuracy of the above components on the mounted body. is there.

In particular, according to the invention of claim 6, since the mounting accuracy confirmation jig is made of SUS, compared to the mounting accuracy confirmation jig made of an acrylic plate, expansion and contraction due to the influence of the heat of the use environment. There is little deformation, and the positional deviation due to the thermal effect of the mounting position recognition point is within the error range of the diameter of the mounting position recognition point. Further, since the mounting position recognition point is formed by the through hole and the mounting reference point on the mounting surface of the component is exposed from the opening, the recognition of the position of each point by the recognition means is performed to confirm the mounting accuracy. This has an excellent effect that the recognition jig can be performed collectively from the back side of the working jig, and the recognition work does not take time.

Further, according to the invention of claim 7, since the mounting position recognizing point is formed by the vapor deposition body vapor-deposited on the transparent glass plate, as in the case of the mounting accuracy confirmation jig made of the SUS flat plate. The expansion and contraction and the deformation due to the heat of the use environment are small, and the positional deviation due to the heat effect of the mounting position recognition point is within the error range of the diameter of the mounting position recognition point. Further, unlike the jig for confirming the mounting accuracy made of the SUS flat plate described above, it is not necessary to provide an opening for exposing the mounting point on the mounting surface of the component, and the structure can be relatively inexpensive. Furthermore, since the mounting position recognition point can be directly formed on the transparent glass plate by the vapor deposition body, like the mounting accuracy confirmation jig made of an acrylic plate, the white background portion of the mounting position recognition point is formed on the acrylic plate. There is an excellent effect that it is not necessary to form

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an overall configuration of a mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic view showing a state in which components are suction-held by each suction nozzle of a mounting head in the mounting apparatus.

FIG. 3 is a schematic plan view showing an example of a mounting accuracy confirmation jig used in the mounting accuracy confirmation method of the present invention.

FIG. 4A is a schematic perspective view showing a state in which a mounting position recognition point is recognized from the front surface side of the mounting accuracy confirmation jig mounted on the stage of the mounting apparatus. (B)
FIG. 4 is a schematic perspective view showing a state in which a mounting reference point is recognized from the back surface side of the mounting accuracy confirmation jig.

FIG. 5 is a schematic plan view showing an example of a mounting accuracy confirmation jig made of SUS used in the mounting accuracy confirmation method of the present invention.

FIG. 6 is an enlarged view of a main part of a mounting accuracy confirmation jig made of SUS described above.

FIG. 7 is a schematic plan view showing a state in which a component to be confirmed is mounted and fixed on the mounting accuracy confirmation jig made of SUS.

FIG. 8 is a schematic diagram for explaining a deviation amount in the X-axis direction of mounting command coordinates with respect to a mounting center line of each bump of a component fixed on a mounting accuracy confirmation jig made of SUS.

FIG. 9 is a schematic diagram for explaining a shift amount in the Y-axis direction of mounting command coordinates with respect to a mounting center line of each bump of a component fixed on a mounting accuracy confirmation jig made of SUS.

10 (a), (b), (c) and (d) are the above S.
X when the mounting angle of each of the bumps at the four corners of each component mounted and fixed on the mounting accuracy confirmation jig made of US is 0 degree
The graph which shows the gap amount of an axial coordinate.

11 (a), (b), (c) and (d) are the above S.
Y when the mounting angle of each of the bumps at the four corners of each component mounted and fixed on the mounting accuracy confirmation jig made of US is 0 degree
The graph which shows the gap amount of an axial coordinate.

12 (a), (b), (c), and (d) are the above S.
6 is a graph showing the amount of deviation in the X-axis direction coordinates of the bumps at the four corners of each component mounted and fixed on a mounting accuracy confirmation jig made of US when the mounting angle is 180 degrees.

13 (a), (b), (c), and (d) are the above S.
The graph which shows the shift amount of the Y-axis direction coordinate in case the mounting angle of each bump of the four corners of each component mounted and fixed to the mounting accuracy confirmation jig made of US is 180 degrees.

FIG. 14 is a graph showing a state in which a prism, which indicates the amount of displacement of the X-axis direction coordinate of the bump of the component, is included in the minus region.

FIG. 15 is a graph showing a state in which a prism, which indicates the amount of deviation in the Y-axis direction coordinate of the bump of the component, is in the plus area.

FIG. 16 is a flowchart showing an example of an action when the mounting deviation amount of the graph obtained by the mounting accuracy confirmation method of the present invention reaches the maximum value.

FIG. 17 is a flowchart showing an example of an action when the mounting deviation amount of the graph obtained by the mounting accuracy confirmation method of the present invention is out of the standard.

FIG. 18 is a schematic plan view showing another mounting accuracy confirmation jig used in the mounting accuracy confirmation method of the present invention.

[Explanation of reference signs] 1, 10, 20 Jig for confirming mounting accuracy 2 Electron microscope 3 Two-dimensional measuring device 4 Personal computer (PC) 5 Printer 6 White base portion 11, 12, 13, 14 of mounting position confirmation point Each of parts Opening of mounting accuracy confirmation jig 21 for exposing bumps Evaporated body 100 mounted on the mounting accuracy confirmation jig as a mounting position recognition point 100 Mounting device 200 Mounting heads 201, 202, 203, 204 Suction nozzle 300 XY robot 400 Component feeder 500 Tape feeder 600A First recognition camera 600B Second recognition camera 700 Circuit board 800 Stages A, B Mounting reference points B1 to B12 of components to be confirmed Components to be confirmed b1, b2, b3, b4 Check the mounting accuracy of the bumps P, P1, P2 at the four corners of the part to be checked. Mounting position recognition point of use jig

Claims (7)

[Claims] Claims: 1. When mounting a component picked up by a pick-up nozzle at a predetermined component mounting position of a mounted body mounted on a stage and mounting the mounted body, the mounting accuracy of the mounted body on the mounted body is confirmed. A mounting accuracy confirmation method for providing a mounting accuracy confirmation jig provided with a mounting position recognition point for specifying a component mounting position of a component picked up by the pickup nozzle with respect to the mounted body, on the stage. The component picked up by the pick-up nozzle was placed on the mounting portion of the mounted body and mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body. In this state, the position of the mounting position recognition point of the mounting accuracy confirmation jig and the mounting provided on the mounting surface of the component mounted and fixed on the mounting accuracy confirmation jig. The position of the reference point is recognized by the recognition means, and the positional relationship between the mounting position recognition point of the mounting accuracy confirmation jig and the mounting reference point of the component recognized by the recognition means is measured by a two-dimensional measuring device, The positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring device, and the mounting position recognition point and the mounting reference when the component is correctly mounted at a predetermined component mounting position of the mounted body. A mounting accuracy confirmation method characterized by confirming the mounting accuracy of the component on the mounted body based on the amount of deviation from the positional relationship with the point. 2. The mounting accuracy confirmation method according to claim 2, wherein the component is an electronic component mounted by bumps on a circuit board as the mounted body, and the mounting reference point measured by the two-dimensional measuring device. Is a bump of the electronic component. 3. A mounting method for mounting a component picked up by a pick-up nozzle at a predetermined component mounting position on a mounted body mounted on a stage, wherein the component picked up by the pick-up nozzle is mounted on the stage. A mounting accuracy confirmation jig provided with a mounting position recognition point for specifying the mounting position of the component with respect to the mounting body was mounted on the stage where the mounted body is mounted and picked up by the pickup nozzle. With the component mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body, the position of the mounting position recognition point of the mounting accuracy confirmation jig and the mounting of the component. The position of the mounting reference point provided on the surface is recognized by the recognition means, and the mounting position of the mounting accuracy confirmation jig recognized by the recognition means is recognized. The positional relationship between the point and the mounting reference point of the component is measured by a two-dimensional measuring instrument, and the positional relationship between the mounting position recognition point and the mounting reference point measured by the two-dimensional measuring instrument and a predetermined value of the mounted body are determined. The amount of deviation between the mounting position recognition point and the positional relationship between the mounting reference point when the above component is correctly mounted at the component mounting position is within the tolerance of the mounting accuracy of the above component to the mounted body. After confirming that the amount is the amount, mounting of the component on the mounted body is started. 4. A pickup nozzle for picking up a component, a stage for mounting a mounted body on which the component is mounted, a pickup portion for picking up a corresponding component by the pickup nozzle, and a stage mounted on the stage. Nozzle moving means for reciprocating the pickup nozzle between a mounting portion for mounting the component on the mounted body, first recognizing means for recognizing the shape of the component picked up at the pickup portion, and the stage Second recognizing means for recognizing the component mounting position of the mounted body placed on the upper mounting site, the first recognizing means, and the second recognizing means.
And a nozzle movement amount control means for controlling the movement amount of the pickup nozzle so as to mount a component corresponding to a predetermined component mounting position of the mounted body based on each recognition result of In the mounting accuracy confirmation jig provided with a mounting position recognition point for specifying a component mounting position of the component picked up by the pickup nozzle with respect to the mounted body, the mounted body on the stage is mounted. The component placed on the part and picked up by the pickup nozzle is mounted and fixed on the mounting accuracy confirmation jig in the same manner as when mounting the component on the mounted body, and the mounting precision confirmation jig is fixed. Recognize the position of the mounting position recognition point and the position of the mounting reference point provided on the mounting surface of the component mounted and fixed on the mounting accuracy confirmation jig. And a two-dimensional measuring device that measures a positional relationship between a mounting position recognition point of the mounting accuracy confirmation jig recognized by the third recognizing unit and a mounting reference point of the component. Mounting device characterized by. 5. When the component picked up by a pick-up nozzle is mounted and mounted at a predetermined component mounting position of the mounted body mounted on the stage, the mounting accuracy of the mounted component on the mounted body is confirmed. It is a mounting accuracy confirmation jig that is used when mounting, and is provided with a mounting position recognition point for specifying the component mounting position of the component picked up by the pickup nozzle with respect to the mounted body, and on the stage. Mounting the component in a state where the component is mounted on the mounting portion and picked up by the pickup nozzle is mounted and fixed in the same manner as when mounting the component on the mounting target. A jig for confirming the mounting accuracy, which has a structure capable of seeing through a mounting reference point provided on the surface. 6. The mounting accuracy confirmation jig according to claim 5, wherein the mounting position recognition point is formed by a through hole formed in a flat plate made of SUS, and the component is mounted on the mounted body. Similarly, a mounting accuracy confirmation jig having an opening provided on a mounting surface of the component to expose a mounting reference point in a mounted and fixed state. 7. The mounting accuracy confirmation jig according to claim 5, wherein the mounting position recognition point is formed by a vapor deposition body deposited on a transparent glass plate.