JP2003168099A - IC chip package manufacturing equipment - Google Patents

Abstract

(57) Abstract: As an IC chip package manufacturing device using an electrostatic coupling method, an antenna provided with an IC chip and an IC label having a plurality of small-area antenna layers and an plurality of large-area antenna layers is provided. Provided is a device capable of automatically and efficiently adhering to a medium in a proper arrangement state and manufacturing a high-performance IC chip mounted body at a high yield. A transport path for intermittently feeding an antenna medium.
A label sticking apparatus 5 for sticking the IC label 3 onto the antenna medium 2 is installed, and the IC chip 3 is peeled off from the tape base material 30a fed from the label reel 30 through the peeling edge 52.
The label 3 is peeled off, and the IC label 3 is
Is sucked and held, and the bonding head 53 is moved down, so that the I medium is stopped on the antenna medium 2 in the intermittent feed stopped state.
The C label 3 is attached in such an arrangement that the corresponding antenna layers are electrostatically coupled to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for manufacturing an IC chip package in which information is recorded, rewritten, and read on an IC chip in a contactless manner via an electrostatic antenna.

[0002]

2. Description of the Related Art Conventionally, magnetic cards using magnetic recording such as telephone cards, prepaid cards used for transportation, highway cards used for payment of expressway tolls, merchandise cards such as point cards, etc. have been used in various fields. There is. These magnetic cards are generally formed by providing a magnetic recording layer containing a magnetic material such as barium ferrite on one surface of a polyester substrate having a thickness of 188 μm or 250 μm, and printing a required design on the opposite surface. Then, a concealment layer such as silver or white is provided on the magnetic recording layer to print the clause text or the like, or a heat-sensitive layer is provided on one side or both sides so that the used amount or the remaining amount can be recorded with a thermal head at any time. Alternatively, a rewritable heat-sensitive recording layer that can be repeatedly used is provided on the surface of a card, and a face photograph or the like is printed by a sublimation transfer method.

However, since these magnetic cards are easy to record, rewrite, and read information with a magnetic head, tampering and counterfeiting of the remaining balance and the number of times that can be used frequently occur, which is a big social problem. As a countermeasure, it is also possible to provide a plurality of magnetic recording layers with different coercive force to individually record information, or to specially provide a magnetic bar code having a unique magnetic signal that cannot be visually distinguished inside the card. However, if a magnetic head corresponding to these is obtained, it is relatively easy to distinguish the magnetic pattern, and physically the same card can be forged and used, so it is not a fundamental solution. . Further, for recording, reading, and rewriting of a magnetic card, it is necessary to apply a magnetic field generated from an electromagnet of a magnetic head in a state of almost contact,
There is also a drawback that there are large restrictions on the configuration side and usage form of the communication device.

For these reasons, in recent years, an IC carrier for recording, reading and rewriting information in a memory of an IC chip called a non-contact IC card or IC tag by using a communication device called a reader / writer. But JR
It is being used for railway commuter passes, bus tickets, subway tickets, etc. This IC carrier converts and saves data by a very complicated cryptographic process, so even if the data itself could be read, it is very difficult to grasp its contents, and it is forged with high security. It is difficult to change. The memory capacity of the IC chip is 1
Since it is 00 bytes or more and can input a large amount of information, it can be used in a wide range of application environments. Note that there is an ISO standard for non-contact IC cards (for example, the physical characteristics are ISO / IEC 144
43-1), and the JIS standardization is in progress.

However, conventional general IC cards and I
The C tag is formed by forming a copper or aluminum vapor deposition layer on a base material made of polyester resin such as PET for etching, or forming a winding of a conductive wire to form an antenna, and flipping the IC chip. It is manufactured by a procedure of bonding by bonding and the like, bonding a resin base material thereon by a laminating method or an injection molding method, and then punching into a card shape. For this reason, there is a problem that the number of steps required for manufacturing is large, the thickness is large, and the film can be repeatedly used, but the manufacturing cost per sheet is high.

On the other hand, recently, RFID (Radio Fr
I called "equency identification"
C carrier has appeared. This IC carrier is
Information can be transmitted in a non-contact manner with a reader antenna, and necessary information can be recorded in an IC chip, and information can be recorded, rewritten, and read by a communication device such as a reader / writer in a short time as needed. And, particularly in the case of adopting the electrostatic coupling method for communication, an electrostatic antenna layer for communication can be easily formed on the substrate by printing using a conductive ink or thermal transfer printing, and using a conductive adhesive. Since the terminals of the IC chip and the electrostatic antenna layer can be bonded to each other, and the bonding of the resin base material by the laminating method or the injection molding method is not necessary, and the manufacturing cost is low, it can be sufficiently used as, for example, a disposable IC card or an IC tag. It has the advantage that it can be used. And even with this IC carrier, 1
A large amount of information can be handled because the IC chip memory of 00 bytes or more can be used. Regarding the communication method by the electrostatic coupling method, for example, Japanese Patent Laid-Open No. 11-5135
No. 18, which is described in detail.

However, in such an RFID IC carrier, since the electrostatic antenna layer connected to the IC chip has a small area, the communicable distance by the antenna of the reader / writer is extremely short, for example, a pair of electrostatic antenna layers. Has a vertical and horizontal dimensions of 15 mm x 10 mm and is arranged in parallel at a distance of 1 mm, the communication distance is 5 mm or less, and it is necessary to keep the electrostatic antenna layer in close contact with the reader / writer when recording, writing and reading information. Yes,
Not only is it extremely troublesome to handle, but communication is often lost when the reader / writer's antenna is greatly displaced from the center point even in close contact. Therefore, the one provided with the IC chip and the electrostatic antenna layer (hereinafter referred to as IC
Separately from the label), a large-area electrostatic antenna layer is provided on a base material such as paper or a plastic film (hereinafter referred to as an antenna medium), and the IC label is provided on the antenna medium. A method has been proposed in which the electrostatic antenna layers are attached so that they are connected to each other to form an IC chip package in the form of a card or a tag. That is, according to this method, the communicable distance to the antenna of the reader / writer can be greatly expanded, for example, to several tens of centimeters. Therefore, information can be transmitted in a form where the card or tag is held away from the reader / writer. Recording, writing, and reading can be performed, and the practicability as an IC chip package is significantly improved.

FIGS. 1A and 1B show an example of an IC chip package composed of the above IC label and antenna medium. Antenna medium 2 in this IC chip mounting body 1
On the upper surface of the base material 21 such as paper or plastic film,
A pair of large-area antenna layers 22 and 22 [hatched areas in FIG. 1 (A)] are provided in the central portion of the base material 21 at a narrow interval so that they are not connected to each other. Then, the IC chip mounting body 1 has the upper surface 2 of the antenna medium 2.
1a, the IC label 3 has both large area antenna layers 12, 12
It is affixed while straddling it. As shown in FIGS. 2 (A) and 2 (B), the IC label 3 has a pair of small area antenna layers on the lower surface side (adhesive surface side to the antenna medium 1) of the base material 31 such as a plastic film. 32,
32 [hatched area in FIG. 2 (A)] is the base material 31.
The IC chip 33 is arranged so as to be disconnected from each other at a narrow interval in the central portion of the IC chip, and the IC chip 33 is arranged so as to straddle between the small area antenna layers 32, 32. 33a are respectively connected to one small area antenna layer 32 through a conductive adhesive layer 34, and a non-conductive adhesive layer 35 which has a bonding strength with respect to the antenna medium 2 is provided on the peripheral portion of the lower surface. At the same time, a conductive adhesive layer 36 is provided at the center of each small-area antenna layer 32 for electrically coupling the corresponding large-area antenna layer 22 of the antenna medium 2.

[0009]

In such an IC chip mounting body 1, when the IC label 3 is attached to the antenna medium 2, the corresponding antenna layers 22 and 32 are surely electrostatically coupled to each other. And the antenna layer 32 on the other side that does not correspond to the antenna layer 22 on the one side forming the pair
It is necessary to surely prevent the electrostatic coupling with the, and for that reason, the positional accuracy of the attachment is very important. Further, a large number of IC labels 3 are handled as label reels 30 (see FIG. 3A), which are rolls of tape base material 30a adhered at regular intervals via the adhesive layer 35. Often, such a label reel 30 has an IC label 3
Will be adhered to the antenna medium 2 after being peeled off one by one from the tape base material 30a. Therefore, in order to obtain such an IC chip package 1 at low cost, there has been a problem in productivity in the past.

In view of the above situation, the present invention provides a device for manufacturing an IC chip package using the electrostatic coupling method as described above, which is a peeling operation of an IC label from a label reel and an antenna medium of the peeled IC label. It is an object of the present invention to provide a product that can be manufactured as efficiently as possible, including a sticking operation to a sticker, a positioning operation in sticking, and the like, and can reduce the manufacturing cost by improving mass productivity and yield.

[0011]

In order to achieve the above object, the invention according to claim 1 is an IC having an electrostatic antenna for performing communication by electrostatic coupling, as shown by the reference numeral in the drawings. In the manufacturing apparatus of the chip mounting body 1, the IC chip 33 is provided on the carrier path 4 for intermittently feeding the antenna medium 2 in which the plurality of large area antenna layers 22 and 22 are provided on the base material 21.
And a plurality of small area antenna layers 32, 32 connected thereto
A label sticking device 5 for sticking the IC label 3 having the adhesive layers 35 and 36 onto the antenna medium 2 is installed. In the label sticking device 5, a large number of the IC labels 3 are the adhesive layers. Feeding means 51 for the label reel 30 which is adhered to the tape base material 30a at regular intervals via 35 and 36.
And a peeling edge 52 for peeling the IC labels 3 one by one from the tape substrate 30a by turning the fed tape substrate 30a into an acute angle, and the antenna medium 2 that receives the peeled IC labels 3 A sticking means 53 for sticking on the top and a winding means 54 for the tape base material 30a after peeling the IC label 2 are provided, and the sticking means 53 is used for the antenna medium 2 in the stopped state in the intermittent feeding. The IC label 3 is configured such that each small area antenna layer 32 is attached to the corresponding large area antenna layer 22 of the antenna medium 2 in an electrostatically coupled arrangement.

According to the above construction, the IC labels 3 are automatically separated from the label reel 30 one by one by the peeling edge 52, and the separated IC labels 3 are attached to each other by the attaching means 5.
The IC chip mounting body 1 can be manufactured by automatically adhering the carrier path 4 to the antenna medium 2 which is intermittently fed by 3.
Since the application of the IC label 3 is performed while the intermittently fed antenna medium 2 is stopped, the operation of the attaching means 53 and the intermittent feeding of the antenna medium 2 are controlled to set the timing of the attachment. , The antenna layers 2 and 32 of the antenna medium 2 and the IC label 3 which correspond to each other are surely electrostatically coupled, and the antenna layers 2 and 3 of which both do not correspond are electrostatically coupled to each other. Can be attached with high positional accuracy.

Incidentally, the electrostatic coupling is not limited to the state where the conductive substances are in contact with each other and electrically connected to each other, and the conductive substances are opposed to each other at a slight interval of, for example, 1 mm or less, and the paper or the like is interposed therebetween. It has been found that it can occur even when intervening non-conductive substances of. Therefore, the electrostatic coupling between the small-area antenna layer 32 of the IC label 3 and the corresponding large-area antenna layer 22 of the antenna medium 2 in the present invention means that both 32,
33 is directly bonded, both 32 and 33 are bonded through a conductive substance such as a conductive adhesive, both 32,
33 includes a configuration in which they are opposed to each other at a small interval.

According to a second aspect of the present invention, in the apparatus for manufacturing an IC chip package according to the first aspect, the antenna medium 2 has a long base 21 on which a large number of units of the large area antenna layers 22 and 22 are spaced at regular intervals. The long sheet 20 provided at a place is supplied to the conveyance path 4 and at the end of the conveyance path 4, the IC is attached.
A winding device 6 for winding the long sheet 20 having the label 3 attached thereto in a roll shape is provided. In this case, the IC label 2 can be continuously attached while the plurality of antenna media 2 ... Are intermittently moved simultaneously by intermittently feeding the long sheet 20, and the plurality of antenna media 2 ... Are arranged in the transport path 4. Since the pitch naturally becomes constant, it becomes very easy to set the timing of sticking by controlling the operation of the sticking means 53 and the intermittent feeding speed of the antenna medium 2.

According to a third aspect of the present invention, in the IC chip mounting body manufacturing apparatus according to the first or second aspect, the large area antenna layer 22 is provided on the base material 21 of the antenna medium 2 on the upstream side of the transport path 4. , 22 are formed by thermal transfer printing. In this case, the manufacturing process of the antenna medium 2 itself is incorporated into a series of automatic process lines for manufacturing the IC chip mounting body 1, so that the production efficiency of the IC chip mounting body 1 is further enhanced.

According to a fourth aspect of the present invention, in the apparatus for manufacturing an IC chip package according to any one of the first to third aspects, the base material 21 of the antenna medium 2 includes an adhesive layer 23 and a peeling layer 24.
The release sheet 25 is adhered to the lower surface side via the. With this configuration, the manufactured IC chip mounting body 1 can be easily attached to the surface of various articles by the adhesive layer 23.

According to a fifth aspect of the present invention, in the IC chip mounting body manufacturing apparatus according to any of the first to fourth aspects, the pasting means has a suction function by vacuum suction and is moved up and down from a pasting head 53. Then, the sticking head 53 sucks and holds the peeled IC label 3 at the rising position and lowers it, presses the IC label 3 onto the antenna medium 2 and releases the vacuum suction to stick the label. After that, it is configured to return to the raised position. In this case, the label sticking device 5 can surely stick the IC label 3 with a simple device configuration.

According to a sixth aspect of the invention, in the apparatus for manufacturing an IC chip package according to the fifth aspect, the sticking head 53 is provided.
However, the direction of the IC label 3 adsorbed and held is 90 in the horizontal plane.
The head turning mechanism 55 for changing the degree is provided. In this case, the direction in which the pair of large-area antenna layers 22, 22 are arranged in the antenna medium 2 supplied to the transport path 4 and the label reel 30 mounted on the label sticking device 5.
A pair of small area antenna layers 32 in the IC label 3 of
Even when the arrangement direction of 32 is different by 90 degrees, the IC label 3 peeled from the tape base material 30a of the label reel 30 via the peeling edge 52 is sucked and held by the sticking head 53, and then the head turning mechanism 55 is used. By changing the direction of the IC label 3 by 90 degrees, the IC label 3 can be attached to the antenna medium 2 in an appropriate arrangement.

According to a seventh aspect of the invention, in the manufacturing apparatus for an IC chip package according to any one of the first to sixth aspects, after the IC label 3 is attached, the IC label 3 is attached on the downstream side of the label attaching device 5 in the transport path 4. 2 in the antenna medium 2 along the transport direction
A slitter device 8 for inserting a is provided. In this case, the slitter device 8 causes the IC
The chip mounting body 1 can be set to have a width corresponding to the final product.

According to an eighth aspect of the invention, in the apparatus for manufacturing an IC chip package according to any one of the first to seventh aspects, after attaching the IC label 3 to the downstream side of the label attaching apparatus 5 in the transport path 4. 2b of the antenna medium 2 along the width direction
A cutting device 9 is provided for inserting the. In this case, the cutting device 9
The C chip mounting body 1 can be set to have a length corresponding to the final product.

According to a ninth aspect of the present invention, in the apparatus for manufacturing an IC chip package according to any one of the first to sixth aspects, after attaching the IC label 3 to the transport path 4 on the downstream side of the label attaching apparatus 5. The punching device for punching the antenna medium 2 into a predetermined outer shape is provided. In this case, the punching device can set the outer shape of the IC chip mounting body 1 corresponding to the final product.

According to a tenth aspect of the invention, in the apparatus for manufacturing an IC chip package according to any one of the first to ninth aspects, the optical sensor 10 for detecting the position of the large area antenna layer 22 of the conveyed antenna medium 2 is used. And this optical sensor 1
A feed control device for controlling intermittent feeding of the antenna medium 2 based on a detection signal of 0 is provided. In this configuration, since intermittent feeding of the antenna medium 2 is controlled based on the detection signal of the optical sensor 10, I
The stop position of the antenna medium 2 when the C label 3 is attached can be set with higher accuracy.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an IC chip package manufacturing apparatus according to the present invention will be specifically described below with reference to the drawings. FIG. 3 (A) is a side view showing a configuration example of the manufacturing apparatus, and FIG. 3 (B) is a plan view thereof.

In FIGS. 3A and 3B, 11 is an antenna medium supply device and 6 is a winding device.
A label sticking device 5, a slitter device 8, and a cutting device 9 are sequentially arranged from the upstream side along a conveyance path 4 formed between them.
Is installed.

The antenna medium supply device 11 also serves as a device for manufacturing the antenna medium 2 [see FIGS. 1 (A) and 1 (B)], and the sheet material 20a rolled into a roll is wound by the unwinding device 12. At the same time, the pair of the antenna medium 2 is placed on one side of the unwound sheet material 20a, which is the upper side in the conveying path 4, by the thermal transfer device 7 as shown in FIGS. 3 (B) and 4 (A). Large area antenna layers 22, 2
2 are formed at regular intervals, and a large number of units of the antenna medium 2 are configured to be supplied to the transport path 4 as a long sheet 20 arranged in the longitudinal direction at a constant pitch. Then, the base sheet 2 of the antenna medium 2 is used as the original sheet 20a.
A release sheet 25 is attached to the lower surface side of No. 1 via an adhesive layer 23 and a release layer 24 (see FIG. 5).

In the thermal transfer device 7 incorporated in the antenna medium supply device 11, the conductive ink applied to the thermal transfer ribbon 7a is applied to the sheet material 20a via the thermal head 7b.
Thermal transfer printing is performed on the surface of the, and by inputting the thermal transfer printing pattern to the control mechanism with a personal computer,
The large area antenna layer 22 to be formed can be set in an arbitrary shape. A commercially available thermal transfer printer can be used as the thermal transfer device 7, and an adhesive label roll paper can be used as the original sheet 20a.

Thus, although the long sheet 20 is drawn out from the antenna medium supplying device 11 and wound by the winding device 6, the nip roll 41 arranged in front of the winding device 6 is rotated. The long sheet 20 is intermittently fed on the conveyance path 4 by controlling it via a stepping motor or a servo motor. In order to allow a difference in the movement amount of the long sheet 20 due to the intermittent movement on the transport path 4 and the constant speed movement on the start end side and the end side, the vicinity of the exit of the antenna medium supply device 11 and the winding device 6 are allowed. The stock portion of the long sheet 20 is configured by interposing the swing rolls 42, 42 in the position immediately before. Reference numeral 43 is a guide roll arranged at a key place.

The label sticking device 5 is shown in FIG.
A large number of the IC labels 3 shown in (B) are attached to the tape base material 30a via the adhesive layer 35 at regular intervals, and the IC labels 3 are attached to the antenna medium 2 of the transport path 4. It is to be attached to. Then, on the front surface of the apparatus main body 5a of the label sticking apparatus 5, as shown in FIG. 7, the reel feeding section 51 for mounting the label reel 30 and the tape base material 3 fed from the label reel 30.
A stripping edge 52 for stripping the IC labels 3 one by one by turning 0a into an acute angle, a sticking head 5 provided with a vacuum suction mechanism and moving up and down via an air cylinder or the like.
3, a winding portion 54 for winding the tape base material 30a after peeling the IC label 3, a pair of left and right sheet holders 5 that move up and down
6, 56, sticking base plate 57, peeling edge 52 and winding section 5
4, a nip roll 58 for feeding the label reel 30 and a guide roll 59 interposed between the reel feeding part 51 and the peeling edge 52 are provided.

As shown in FIG. 7, the apparatus main body 5a is mounted on a support rack 5c on a vertical and horizontal slide type pedestal 5b, and has an X-axis adjusting handle 50a and a Y-axis adjusting handle 5a.
The position can be adjusted in the transport direction (X-axis direction) and the cross direction (Y-axis direction) of the transport path 4 by operating 0b, and the height can be adjusted by operating the Z-axis adjusting handle 50c. By adjusting the positions in the Y, Z directions, the long sheet 20 moving on the conveying path 4 is attached to the sticking base plate 57.
The height is set close to the upper surface of the sheet, and the central portion of the antenna medium 2 on the long sheet 20 is set so as to pass through a position directly below the sticking head 53.

At the peeling edge 52, when the tape base material 30a fed from the label reel 30 changes its direction in an acute angle and moves, the tape base material 30a adhered to the tape base material 30a.
The C label 3 is projected forward from the tip of the peeling edge 52 while peeling from the tape base material 30a. On the other hand, the sticking head 53 has a suction pad 53a by vacuum suction at the lower end.
The peeling edge 5 in its raised position.
The IC label 3 protruding from 2 is sucked and held, and then descends to press the IC label 3 onto the antenna medium 2 of the long sheet 20 on the sticking base plate 57, and at the same time suck the suction pad 53a. By stopping, Fig. 4 (B)
The IC label 3 is attached onto the antenna medium 2 as shown in FIG. At the time of this attachment, the long sheet 20 is in the stopped state in the intermittent feeding, and the pair of sheet pressers 56, 5
6 descends to press and fix the long sheet 20 on the sticking base plate 57 on both sides of the sticking position, and prevent the sticking position accuracy from being lowered due to the displacement of the long sheet 20.

Thus, the IC label 3 for the antenna medium 2
When the sticking is completed, the sticking head 53 and the sheet pressers 56, 56 both return to the original raised position, and the long sheet 20 has the second antenna medium 2 at the sticking position, that is, the sticking head 53. Move to the position directly below. On the other hand, from the time when the sticking head 53 sucks and holds the IC label 3,
After descending and sticking the IC label 3 on the antenna medium 2,
Until it returns to the raised position again, the nip roll 58
The feeding of the tape base material 30a due to is stopped. The operation of raising and lowering the sticking head 53, turning on / off the suction of the suction pad 53a, switching between rotation and stop of the nip roll 58, and the like are automatically controlled by input settings to a controller (not shown).

In the above label sticking, the IC label 3 and the antenna medium 2 are the same as the IC label 3 as described above.
The pair of small area antenna layers 32, 32 on the lower surface side of the
So that each of them is connected to the large area antenna layer 22 on the corresponding side of the antenna medium 2 through the conductive adhesive layer 36 and is not electrostatically coupled to the large area antenna layer 22 which does not correspond. Positioned precisely. Therefore, the tape reel 30 and the alignment direction of the pair of large-area antenna layers 22 and 22 corresponding to each antenna medium 2 of the long sheet 20.
There is no problem if the pair of small area antenna layers 32, 32 of each IC label 3 adhered to the tape base material 30a of No. 3 are aligned with each other, but thermal transfer printing on the long sheet 20 by the thermal transfer device 7 is performed. Depending on the setting of the pattern or the specifications of the tape reel 30 used, the large area antenna layers 22 and 22 of the former 2 and the small area antenna layer 3 of the latter 3 may be used.
In some cases, the arrangement directions of 2 and 32 are different by 90 degrees, and they cannot be attached to each other as they are.

Therefore, the sticking head 53 of the label sticking apparatus 5 is provided with a head turning mechanism 55 for changing the direction of the sucked and held IC label 3 by 90 degrees in the horizontal plane.
That is, as shown in FIGS. 8A and 8B, the sticking head 53 has a bush 53c at the lower end of a vertical elevating rod 53b.
The sticking head 5 is held rotatably via
3, a gear 55a as a pinion is fixedly installed, while a fluid pressure cylinder 55b is attached to a bracket 53d on the side of the lifting rod 53b.
The rack 55d fixed to the piston rod 55c meshes with the gear 55a, and the adhering head 53 is configured to rotate within an angle range of 90 degrees as the piston rod 55c moves back and forth.

Therefore, the direction in which the pair of large-area antenna layers 22, 22 in each antenna medium 2 are arranged is, for example, as shown in FIG.
As shown in (B) and FIG. 4 (A), when the long sheet 20 is in the longitudinal direction, the tape base 30 is the tape substrate 30 in which the pair of small area antenna layers 32, 32 of each IC label 3 are aligned. When the IC label 3 peeled off at the peeling edge 52 is sucked and held by the sticking head 53, the IC label 3 shown in FIG.
As shown in (A), it is not suitable for sticking,
As the sticking head 53 is turned 90 degrees by the operation of the head turning mechanism 55, as shown in FIG. 9B, the small-area antenna layers 32, 32 of the IC label 3 are arranged in a large area of the antenna medium 2. Since the antenna layers 22 and 22 are aligned with each other, the attachment head 53 can be lowered in this state for proper attachment.

Long sheet 20 to which the IC label 3 is attached
The slitter device 8 is used to
Two cuts 2 along the longitudinal direction of the long sheet 20 are formed in each antenna medium 2 in accordance with the width of the C chip mounting body 1.
a and 2a are formed. The slitter device 8 is configured such that a pair of disc-shaped blade bodies 8b, 8b are attached to a support shaft 8a extending along the width direction of the long sheet 20 and the support shaft 8a is moved up and down. The antenna sheet 2 is cut at a lower position within a predetermined movement range of each antenna medium 2 on the length sheet 20, but the peeling sheet 25 is provided with cuts 2a, 2a having a predetermined length at a non-cutting depth. Has been done. The positions and intervals of the two cuts 2a, 2a can be freely set by adjusting the positions of the two blades 8b, 8b on the support shaft 8a.

The long sheet 20 on which the slits 2a, 2a in the longitudinal direction have been formed by the slitter device 8 is then adjusted by the cutting device 9 on the downstream side to the length of the IC chip mounting body 1 to be manufactured. Then, as shown in FIG. 4C, two cuts 2b, 2b are formed in each antenna medium 2 along the width direction of the long sheet 20. In this cutting device 9, a pair of disc-shaped blades 9b, 9b are attached to a support shaft 9a extending along the longitudinal direction of a long sheet 20, and when the support shaft 8a is inoperative, for example, the solid line in FIG. While standing by at a position separated to one side of the long sheet 20 conveyed, the long sheet 20 is in a stopped state for sticking the IC label 3 by the label sticking device 5 described above. The long sheet 20 from the standby position while
5 in the width direction and to the standby position on the opposite side shown by the phantom line in the figure, the antenna medium 2 is cut as shown in FIG. 5, but the release sheet 25 is not cut. It is configured to receive 2b and 2b.
The positions and intervals of the cuts 2b, 2b can be freely set by adjusting the positions of the blades 9b, 9b on the support shaft 9a.

Long sheet 20 that has passed through the cutting device 9
Is wound into a roll by the winding device 6, and the manufacturing of the IC chip mounting body 1 is completed. In the thus wound long sheet 20, a pair of longitudinal and widthwise cuts 2a, 2a, 2b, 2 formed for each antenna medium 2 are formed.
b, the IC chip mounting body 1 is connected to the antenna medium 2 and the IC.
It can be easily peeled from the peeling sheet 25 in the form of an independent card or a tag formed of the label 3. Then, the peeled IC chip mounting body 1 has the adhesive layer 23 on the lower surface.
It can be attached to various articles via the. When the width of the finished IC chip mounting body 1 is set to be smaller than the width of the IC label 3, the IC label 3 is formed by slit processing.
It is sufficient to slit the antenna medium 2 including
The workability is greatly improved as compared with the case where the both sides of the C label 3 are cut.

In the manufacture of the above-mentioned IC chip mounting body 1, in order to accurately stick each IC label 3 to the proper position of each antenna medium 2 by the label sticking device 5, the long sheet 20 is intermittently fed. The center point of the antenna medium 2 at the time of stop (center of the separation portion of the large-area antenna layers 22 and 22) is
It is necessary to vertically match the central point of the IC label 3 sucked and held by the sticking head 53 (the center of the separation area of the small area antenna layers 32, 32 = the center of the IC chip 33). The slit position of the antenna medium 2 by the slitter device 8 and the cutting position of the antenna medium 2 by the cutting device 9 are based on the center point of the IC label 3 sucked and held by the sticking head 53, and the long sheet 20 is used.
Is calculated and set from the arrangement pitch of the antenna media 2 ... Therefore, it is required to precisely determine the timing of stopping the intermittent feeding of the long sheet 20.

Therefore, in the manufacturing apparatus of the present invention, the optical sensor 10 is provided at important places such as the label sticking apparatus 5 and its vicinity.
When a specific portion of the large-area antenna layers 22 and 22 of each antenna medium 2 on the moving long sheet 20 passes a reference position, the optical sensor 10 detects this and based on this detection signal. It is recommended to control the timing of the intermittent feed stop. When controlling the intermittent feeding of the long sheet 20 by using the optical sensor 10 as described above, the feeding speed is gradually or continuously reduced from the feeding state toward the stop, so that the feeding at the time of feeding stop is stopped. Prevents shift of stop position due to impact and inertia,
Therefore, it becomes possible to set the attaching position of the IC label 3 with respect to each antenna medium 2, and further the slit position and the cutting position with higher accuracy.

FIG. 6 shows an example of an intermittent feed control sequence using the optical sensor 10 described above. in this case,
Each antenna medium 2 in the long sheet 20 has a pair of large-area antenna layers 22A and 22B arranged in the longitudinal direction of the long sheet 20, and the large-area antenna layer 22A located on the feed front side of the sheet. When the front end reaches the detection position of the optical sensor 10, the feed speed becomes maximum, and from this time the feed speed decreases and the feed moves to a constant low speed, and when the rear end of the antenna layer 22A reaches the detection position. Decelerates toward the stop from the front end of the large-area antenna layer 22B on the feeding rear side to the detection position, and completely stops,
During this stop, the label attaching device 5 attaches the IC label 3 and the cutting device 9 performs cutting,
The feeding is restarted when these are normally completed, and the speed is continuously increased until the front end of the large-area antenna layer 22A of the next antenna medium 2 reaches the detection position.

According to the manufacturing apparatus having the above structure, the IC labels 3 are automatically separated from the label reel 30 one by one by the peeling edge 52, and the separated IC labels 3 are sucked and held by the sticking head 53. The conveyance path 4 is automatically attached to each antenna medium 2 of the long sheet 20 that is intermittently fed, and then slit processing and cutting processing are performed in the process of the intermittent feeding to obtain an IC having a desired size and shape. The chip mounting bodies 1 can be mass-produced extremely efficiently in a short time, and thus the cost of the IC chip mounting bodies 1 can be significantly reduced. Moreover, in this example configuration, the process of manufacturing the antenna medium 2 itself is incorporated into a series of automatic process lines for manufacturing the IC chip mounting body 1 by incorporating the thermal transfer device 7 in the antenna medium supply device 11, so that
The production efficiency of the chip mounting bodies 1 is further improved.

However, the IC label 3 is attached to the antenna medium 2 while the long sheet 20 that is intermittently fed is stopped, and the elevating operation of the attaching head 53 and the long sheet 2 are performed.
By controlling the intermittent feeding of 0 and setting the timing of sticking, the antenna medium 2 and the corresponding antenna layers 22 and 32 of the IC label 3 are reliably connected, and both
Since it is possible to attach the IC chip mounting body 1 with high positional accuracy so as not to contact the antenna layer 22 on one side and the antenna layer 32 on the other side which do not correspond to each other, the high quality IC chip mounting body 1 It can be manufactured with a high yield.

The antenna medium 2 may be supplied to the conveying path 4 in an independent form, instead of the long sheet 20 in which a large number of units are arranged in the longitudinal direction at a constant pitch as in the illustrated structure. It is possible. However, in this configuration, the transport path 4 itself is provided as a substantial structure, and the clamping means and the feed guide mechanism for holding the antenna medium 2 in a fixed posture on the transport path 4 and the transport path 4 for the antenna medium 2 are provided. It is necessary to provide a supply control means or the like for keeping the feeding pitch (arrangement interval of the antenna mediums 2) above constant, and when the step of forming the large area antenna layer 22 by the thermal transfer device 7 is incorporated, the thermal transfer is performed. A complicated system is required for feeding and discharging the substrate 21 in the device 7. On the other hand, the long sheet 20 does not need a transport path as a physical structure, and the IC label can be moved by intermittently moving a large number of antenna media 2 at the same time only by intermittently feeding the long sheet 20 itself. 2 can be pasted continuously and the arrangement pitch of a large number of antenna mediums 2 ... In the transport path 4 is naturally made constant. Therefore, as described above, the lifting operation of the pasting head 53 and the intermittent operation of the antenna medium 2 are intermittent. It becomes very easy to control the feeding speed and set the timing of sticking.

Further, in the exemplary configuration, as the long sheet 20, the one in which the release sheet 25 is adhered to the lower surface side of the base material 21 of the antenna medium 2 via the adhesive layer 23 and the release layer 24 is used. Although it can be attached to the surface of various articles, the long sheet 20 may be composed only of the base material 21 of the antenna medium 2 so that the IC chip mounting body 1 can be used by itself as a card or the like. Good.

An apparatus for manufacturing an IC chip package of the present invention is
The long sheet 20 is not limited to the configuration in which the thermal transfer device 7 is incorporated in the antenna medium supply device 11 as in the above-described exemplary configuration.
As the large-area antenna layers 22 and 2 of the antenna medium 2 in advance.
A configuration in which a large number of units 2 of 2 are formed on the base material 21 at regular intervals, and the roll-shaped one is unwound and directly supplied from the antenna medium supply device 11 to the transport path 4. Can be adopted. The large area antenna layers 22 ... In this case can be formed by a general screen printing method, flexographic printing, offset printing, gravure printing, or the like, or a printing method such as inkjet printing or thermal transfer printing.

Thus, when the large area antenna layer 22 of the antenna medium 2 is formed by thermal transfer printing as in the illustrated configuration, PET is used as the ink ribbon 7a of the thermal transfer device 7.
A substrate such as (polyethylene terephthalate) coated with conductive ink by gravure coating, three-roll coating, bar coating, etc. is used, and the conductive ink layer is adhered to the substrate 21 from the opposite side. Thermal head 7b
Then, the heating element is heated to raise the temperature, the conductive ink layer is melted and transferred to the base material 21, and then the ink ribbon 7a is peeled from the base material 21. Since the heating element is locally heated by the applied power, the ink ribbon 7
It is preferable to provide a heat-resistant protective layer made of a cellulose resin, a silicone resin, or the like on the portion of the ink ribbon 7a that comes into contact with the thermal head 7b so that the sticking phenomenon in which the base material of a is fused to the thermal head 7b does not occur.

On the other hand, in the illustrated configuration, slits 2a, 2a, 2b, 2b forming the four sides of the rectangle of the IC chip mounting body 1 are formed on the long sheet 20 after the IC label 3 is attached by the slitter device 8 and the cutting device 9. But
A punching device (not shown) is used in place of the slitter device 8 and the cutting device 9, and the antenna medium 2
May be punched in accordance with the outer shape of the final IC chip mounting body 1. In addition, these slitter devices 8,
After the antenna medium 2 is separated into units of the IC chip mounting body 1 by a cutting device 9, a punching device or the like, unnecessary portions of the antenna medium 2 are peeled off from the release sheet 25 and removed by winding, and the take-up device 6 is wound up. Release sheet 2
It is also possible that only the required IC chip mounting bodies 1 ...

Furthermore, the IC chip mounting body 1 including the slitter device 8, the cutting device 9, the punching device, etc.
Units are separated by the entire thickness of the long sheet 20, and the separated IC chip mounting bodies 1 with the release sheet 25 are pulled out from the long sheet 20 in a form having the release sheet 25 on the back surface and collected. It is also possible to adopt a configuration in which the long sheet 20 of FIG. Alternatively, only the slitting process by the slitter device 8 may be performed on the entire length of the long sheet 20, and the unnecessary portions on both sides may be wound by a winding device separately provided. Of course, in the manufacturing apparatus of the present invention, the long sheet 20 after the IC label 3 is attached may be wound up as it is, and one unit of the IC chip mounting body may be separated by post-processing separately.

However, the operation control of each part in such a manufacturing apparatus can be automatically performed by a procedure stored in a sequencer or a computer based on the obtained data by a test operation or the like. In addition, the timing of operation may be corrected based on the detection data of various sensors during operation. For example, the optical sensor 10 not only detects the position on the side of the antenna medium 2 but also the IC label 3 on the tape base material 30a fed from the label reel 30.
It may be installed separately for use in confirmation of the position of the label, feed control based on this, confirmation of the protruding position of the IC label 3 at the position of the peeling edge 32, and the like. Further, when the large-area antenna layer 22 of the antenna medium 2 is thermally transferred and printed by the thermal transfer device 7 as in the illustrated configuration, the position of the thermal head 7a and the IC label 3 of the thermal label 7a are set on the basis of the discharge speed from the thermal transfer device 7. It is desirable to adjust the position and the position of slit processing, cutting or punching in advance and perform leveling.

The necessary information is stored in the IC chip 33 before and after the manufacture of the IC label 3 and the label reel 3
Feeding process of tape base material 30a from 0, IC label 3
The process may be performed at any stage, such as a process of moving the long sheet 20 after being stuck in the transport path 4 or a separate process after being wound by the winding device 6.

In the illustrated configuration, the sticking head 53 that has a suction function by vacuum suction and moves up and down is used as the sticking means of the label sticking device 5, but an arm type robot is used instead of the sticking head 53. Other various attachment means such as the above can be adopted. However, the label sticking device 5 having the sticking head 53 has an advantage that it is structurally simple and that a device that is generally used as a labeler for sticking various labels can be used without significant modification. is there.

The illustrated IC label 3 has a pair of small area antenna layers 32, 32 corresponding to the two terminals 33a, 33a of the IC chip 33. However, when the number of terminals of the IC chip 33 is 3 or more, The number of small area antenna layers 32 corresponding to the terminals 33a is required, and the antenna medium 2 also has the same number of large area antenna layers 32 as the small area antenna layers 32 of the IC label 3. However, in the electrostatic coupling method, the IC chip 33 has two or more terminals 33a (usually two).
Therefore, the IC label 3 and the antenna medium 1 need to have at least one pair of antenna layers.

Generally, the size of the IC label 3 is preferably about 5 mm to 20 mm square because of its ease of manufacture.
Further, the mutual distance between the IC labels 3 on the label reel 30 is set to about 2 to 5 mm. On the other hand, the size of the antenna medium 2 is not particularly limited, but for example, an IC card of JISII type has a size of about 54 mm × 86 mm. The plurality of large-area antenna layers 22 in the antenna medium 2 are preferably set as large as possible in order to increase the communication distance with the reader / writer, but the intervals of 1 to 10 mm are set so that they are not bonded to each other. is necessary.

As a material for forming the large-area antenna layer 22 of the antenna medium 2 and the small-area antenna layer 32 of the IC label 3, conductive powder and a conductive ink containing a binder component and a solvent are mainly used. As the conductive powder, carbon black (particularly conductive carbon black)
A carbon-based powder such as graphite, a metal powder such as gold and silver, a conductive compound powder such as an antimony-doped tin oxide, and the like are used. Examples of the binder component include polyester resins, polyurethane resins, acrylic resins, vinyl chloride, vinyl chloride vinyl acetate copolymers, waxes, coumarone resins, rosin ester resins, polyamides, etc. It is necessary for the binder component of the conductive ink to melt or soften at 80 to 200 ° C. If necessary, the conductive ink may contain additives such as a dispersant, a defoaming agent, and a thickener, and auxiliaries.

The large area antenna layer 22 and the small surface
The conductivity of an electrostatic antenna layer, such as stacked antenna layer 32, is surface
Although it is specified by the resistivity, this surface resistivity is generally
Assuming that the measurement object is a rectangular parallelepiped, the opposite sides where the electrodes are applied
Is W [mm], and the distance between the two sides is L [m]
m], when the measured resistance between the electrodes is R [Ω],
The surface resistivity ρs = R × W ÷ L. Then,
In order to obtain sufficient communication characteristics, the large-area antenna layer 22 and the small-area antenna layer 22
The surface resistivity of the area antenna layer 32 is 1Ω / □ to 10 ^FourΩ
It is preferably / □. Therefore, the conductive layer
When preparing the tank, the surface resistivity should be within the above range.
Select the mixing ratio of conductive powder and binder component
Although it is necessary, the amount of conductive powder blended is usually ink solid.
It is set to a range that occupies about 5 to 45% by weight of the shape.
It

Generally, as the thickness of the large area antenna layer 22 and the small area antenna layer 32 increases, the surface low efficiency tends to decrease as the thickness increases, but the thickness that can be formed by printing or printing is limited, and thus is usually 0. It is set to about 0.5 to 20 μm. If it is necessary to increase the thickness, printing or printing may be repeated a plurality of times.

As the base material 21 in the antenna medium 2, suitable materials and thicknesses vary depending on the usage of the IC chip mounting body 1 to be manufactured, but in general, paper, synthetic paper, P
A synthetic resin such as ET (polyethylene terephthalate) having a thickness of 1 to 500 μm is used.
Then, an IC chip mounting body 1 used as an IC tag
Then, as in the above-described exemplary structure, an adhesive sheet in which a release sheet 25 is adhered to the back surface side of the base material 21 via the adhesive layer 23 and the release layer 24 is often used.

The conductive adhesive layer 34 connecting the terminals 33a of the IC chip 33 in the IC label 3 and the small area antenna layer 32 has ACF (anisotropic conductive film) or AC.
P (anisotropic conductive paste) or the like is used. Also, IC
When the label 3 is bonded to the antenna medium 2 via the non-conductive adhesive layer 35, the former small area antenna layer 32 and the latter large area antenna layer 22 are directly bonded, or both are bonded 32 without bonding. , 22 may be arranged opposite to each other at a small distance that allows sufficient electrostatic coupling, the conductive adhesive layers 36, 36 shown in FIG. 2 may be omitted.

In addition to these, in the present invention, for example,
The antenna layer 32, 2 of the IC label 3 and the antenna medium 2
2, the configuration of each functional unit in the label sticking device 5, the structure of the head turning mechanism 55 of the sticking head 53, the transport path 4 and the nip roll 41 in the label sticking device 5,
Other than the examples, various design changes can be made to the detailed configuration such as the disposition position of 58, the disposition position of the guide rolls 43, the feed control sequence of the long sheet 20, and the like.

[0060]

According to the first aspect of the present invention, as a device for manufacturing an IC chip package in which information is recorded, rewritten, and read on the IC chip in a non-contact manner via an electrostatic antenna, the IC chip and the IC chip The IC labels having a plurality of small area antenna layers corresponding to the above are automatically peeled one by one from the label reel, and the IC labels are attached to an antenna medium provided with a plurality of large area antenna layers for increasing the communication distance. To automatically and efficiently attach the small area antenna layers to the corresponding large area antenna layers in an appropriate arrangement state in which the small area antenna layers are reliably electrostatically coupled to each other to produce a high-performance IC chip package with a high yield. It is possible to provide a device that can significantly reduce the manufacturing cost of the IC chip package.

According to a second aspect of the present invention, in the above-described IC chip mounting body manufacturing apparatus, the antenna medium is a long sheet in which a large number of large-area antenna layers are provided at regular intervals on a long base material. Since a winding device is provided at the end of the conveyance path that winds the long sheet after the IC label is attached in a roll shape while being supplied to the conveyance path, a large number of antennas are provided by intermittent feeding of the long sheet. The IC label can be continuously applied while the medium is moved intermittently at the same time, and it is very easy to set the attaching timing by controlling the operation of the attaching means and the intermittent feeding speed of the antenna medium. Has the advantage that

According to the third aspect of the present invention, in the above-mentioned IC chip mounting body manufacturing apparatus, a large area is formed on the base material of the antenna medium by the thermal transfer device provided on the upstream side of the conveying path for intermittently feeding the antenna medium. Since the antenna layer is formed, the manufacturing process of the antenna medium itself is incorporated into a series of automatic process lines for manufacturing the IC chip mounting body,
Therefore, there is an advantage that the production efficiency of the IC chip mounted body is further enhanced.

According to the invention of claim 4, in the above-mentioned IC chip mounting body manufacturing apparatus, the base material of the antenna medium has a release sheet attached to the lower surface side via the adhesive layer and the release layer. Therefore, there is an advantage that the obtained IC chip package can be easily attached to the surface of various articles.

According to the fifth aspect of the present invention, in the above-mentioned IC chip mounting body manufacturing apparatus, as a sticking means for sticking the IC label peeled from the label reel to the antenna medium, it is provided with a suction function by vacuum suction, and ascending / descending operation. Since a sticking head that uses
There is an advantage that a C label can be attached and a general labeler as the label attaching device can be used without making a great change.

According to the invention of claim 6, in the above-mentioned IC chip mounting body manufacturing apparatus, the direction of the IC label sucked and held by the sticking head by the head turning mechanism can be changed by 90 degrees in a horizontal plane. From the above, even when the arranging direction of the pair of large area antenna layers in the antenna medium supplied to the transport path and the arranging direction of the pair of small area antenna layers in the IC label of the label reel are different by 90 degrees,
There is an advantage that the IC label can be attached to the antenna medium in an appropriate arrangement without any trouble.

According to the invention of claim 7, the above-mentioned IC chip mounting body manufacturing apparatus is provided with a slitter device for making a slit along the carrying direction in the antenna medium after the IC label is adhered. There is an advantage that the mounting body can be set to have a width corresponding to the final product.

According to the invention of claim 8, the above-mentioned IC chip package manufacturing apparatus is provided with a cutting device for making a slit along the width direction in the antenna medium after the IC label is adhered. There is an advantage that the mounting body can be set to have a length corresponding to the final product.

According to a ninth aspect of the invention, the above-mentioned IC chip mounting body manufacturing apparatus is provided with a punching device for punching out the antenna medium after the IC label is adhered to a predetermined outer shape. There is an advantage that can be set to the outer shape corresponding to the final product.

According to the tenth aspect of the invention, in the above-mentioned IC chip mounting body manufacturing apparatus, since the intermittent feeding of the antenna medium is controlled based on the detection signal of the optical sensor, the antenna at the time of attaching the IC label is controlled. There is an advantage that the stop position of the medium can be set with higher accuracy.

[Brief description of drawings]

1A and 1B show a configuration example of an IC chip mounting body to be manufactured in the present invention, where FIG. 1A is a plan view and FIG.
It is a longitudinal cross-sectional view which shows typically the cross section in the BB line of a figure.

2A and 2B show an example of the configuration of an IC label used for the same IC chip mounting body. FIG. 2A is a bottom view, and FIG. 2B is a vertical section that schematically shows a cross section taken along line BB in FIG. 2A. It is a side view.

3A and 3B show an example of the configuration of an IC chip mounting body manufacturing apparatus according to the present invention. FIG. 3A is a schematic front view and FIG. 3B is a schematic plan view.

4A and 4B show a long sheet of an antenna medium in a transport path of the manufacturing apparatus, where FIG. 4A is a plan view before attaching an IC label, FIG. 4B is a plan view after attaching an IC label, and FIG. ) The figure is a plan view at the stage after slit processing and cutting.

FIG. 5 is a vertical cross-sectional side view at a stage after slit processing and cutting of the long sheet.

FIG. 6 is an inset view showing the relationship between the arrangement of large-area antenna layers and the corresponding feed control sequence in the same long sheet.

FIG. 7 is a front view of a label sticking device used in the manufacturing apparatus.

FIG. 8 shows the vicinity of a sticking head in the label sticking apparatus, where (A) is a front view and (B) is a BB of (A).
It is a cross-sectional arrow view of a line.

9A and 9B show a suction holding state of an IC label by the sticking head, FIG. 9A is a bottom view before turning, and FIG. 9B is a bottom view after turning.

[Explanation of symbols]

1 IC chip assembly 2 antenna medium 20 long sheet 21 Base material 22 Large area antenna layer 23 Adhesive layer 24 Release layer 25 Release sheet 3 IC label 30 label reels 30a tape base material 31 Base material 32 small area antenna layer 33 IC chip 35 Non-conductive adhesive layer 36 Conductive adhesive layer 4 transport paths 41 nip roll 5 Labeling device 51 reel feeding section (feeding means) 52 Peeling edge 53 Sticking head (sticking means) 54 Winding unit (winding means) 55 head turning mechanism 58 nip roll 6 Winding device 7 Thermal transfer device 8 slitter device 9 Cutting device 10 Optical sensor

Continued front page    (72) Inventor Kiyoshi Furujo             2 Oji Paper Co., Ltd. 1 Tatsumi-cho, Anan City, Tokushima Prefecture             Ceremony Company Card Media Office (72) Inventor Toshiyuki Shimonishi             2 Oji Paper Co., Ltd. 1 Tatsumi-cho, Anan City, Tokushima Prefecture             Ceremony Company Card Media Office (72) Inventor Harumi Sato             Osaka Prefecture Osaka City Kita-ku Higashitenma 1-10-12             Tenma LD Building KS Systems Stock Association             Company Information Equipment Business Division (72) Inventor Motoki Matsubara             Kay, 4-3-4, Jokoji Temple, Amagasaki City, Hyogo Prefecture             S Systems Corporation Information Equipment Business Division             Within F-term (reference) 2C005 MA18 MA19 MB10 NA10 RA17                 5B035 AA04 BA05 BB09 CA23                 5F061 AA01 BA07 CA22 FA03

Claims (10)

[Claims] 1. A manufacturing apparatus of an IC chip mounting body equipped with an electrostatic antenna for performing communication by electrostatic coupling, comprising: a carrier path for intermittently feeding an antenna medium having a plurality of large-area antenna layers provided on a base material. , A label sticking device for sticking an IC label having an IC chip and a plurality of small-area antenna layers connected to the IC chip and an adhesive layer onto the antenna medium is installed. A large number of the label reels are attached to the tape base material at regular intervals via the adhesive layer, and the tape base material to be fed out is turned into an acute angle so that the IC label is transferred from the tape base material. Peeling edge for peeling one by one, sticking means for receiving the peeled IC label and sticking it on the antenna medium, and winding means for tape base material after peeling the IC label The IC label is attached to the antenna medium in a stopped state in intermittent feeding by the attaching means in an arrangement in which each small area antenna layer is electrostatically coupled to a corresponding large area antenna layer of the antenna medium. An apparatus for manufacturing an IC chip package, which is configured as described above. 2. The antenna medium is supplied to the transport path as a long sheet in which a large number of units of the large area antenna layer are provided at regular intervals on a long base material, and an IC label is provided at the end of the transport path. The IC according to claim 1, further comprising a winding device that winds the long sheet after the attachment in a roll shape.
Chip assembly manufacturing equipment. 3. The IC chip manufacturing according to claim 1, further comprising a thermal transfer device for forming the large-area antenna layer on the base material of the antenna medium by thermal transfer printing on the upstream side of the transport path. apparatus. 4. The manufacture of an IC chip package according to claim 1, wherein the base material of the antenna medium has a release sheet attached to the lower surface side via an adhesive layer and a release layer. apparatus. 5. The sticking means comprises a sticking head that moves up and down with a suction function by vacuum suction, and the sticking head sucks and holds the peeled IC label at a rising position, and lowers the sticking head. After pressing the IC label onto the antenna medium and releasing the vacuum suction to attach it,
The device according to any one of claims 1 to 4, which is configured to return to a raised position.
An apparatus for manufacturing an IC chip package according to any one of 1. 6. The manufacturing apparatus for an IC chip package according to claim 5, wherein the sticking head has a head turning mechanism for changing the direction of the sucked and held IC label by 90 degrees in a horizontal plane. 7. The slitter device for making a slit along the carrying direction in the antenna medium after the IC label is stuck is provided on the downstream side of the label sticking device in the transport path. The manufacturing apparatus of the described IC chip mounting body. 8. The cutting device according to claim 1, further comprising a cutting device for making a slit along the width direction in the antenna medium after the IC label is stuck, on the downstream side of the label sticking device in the transport path. The manufacturing apparatus of the described IC chip mounting body. 9. A punching device for punching out an antenna medium having an IC label attached thereto in a predetermined outer shape is provided on the downstream side of the label attaching device in the transport path.
7. The manufacturing apparatus for an IC chip package according to any one of 6 above. 10. An optical sensor for detecting the position of the large-area antenna layer of the conveyed antenna medium, and a feed control mechanism for controlling intermittent feeding of the antenna medium based on a detection signal of the optical sensor. Claim 1
9. The manufacturing apparatus for an IC chip package according to any one of 9 above.