WO2002095674A1

WO2002095674A1 - Ic chip mounting element, production method therefor and thermal transfer film used in the production method

Info

Publication number: WO2002095674A1
Application number: PCT/JP2002/004831
Authority: WO
Inventors: Hitoshi Fujii; Kiyoshi Kojo; Toshiyuki Shimonishi; Akihiro Tanaka; Toshio Hayashida; Shinsuke Matsumoto
Original assignee: Oji Paper Co., Ltd.; Naigai Carbon Ink Co., Ltd.
Priority date: 2001-05-21
Filing date: 2002-05-17
Publication date: 2002-11-28

Abstract

A pair of electrostatic antennas (4a, 4b) are formed on a synthetic-paper substrate (3) by thermal transfer printing, and an IC chip mounting element (1) is joined onto the antennas (4a, 4b). The antenna (4a, 4b) each consist of a conductive layer that in turn consists of a conductive matter mainly containing graphite and carbon black and contains a heat-fusible matter containing wax and resin. The IC chip mounting element (1) is also provided with a pair of electrostatic antennas that are joined together facing each other.

Description

Specification

IC chip mounted body, its manufacturing method and used in its manufacturing method

Thermal transfer film technical field

The present invention relates to an IC chip mounted body, a method for manufacturing the same, and a thermal transfer film used in the method.

The IC chip mounted body of the present invention can be used as a transportation card such as a bank card, a commuter pass, a management card used for entry / exit management, a telephone card, a distribution management tag attached to a home delivery service, and the like. It is used for non-contact IC cards or non-contact IC tags.

These IC chip mounts store the information necessary for the IC chip, and the information can be recorded, rewritten and read in a short time with a reader / writer as needed, and RFID (Radio Frequency IDentif i cat ion) : Wireless automatic identification) It is possible to carry out an information carrier in a non-contact manner away from a reader / writer as an IC carrier, also called an automatic wireless identification.

The IC chip used in the present invention is coupled to a conductive antenna, and the antenna provided on the carrier and the reader / writer antenna perform electrostatic coupling to exchange signals. IC carriers may be used as they are in the form of a card, or may be used as a label and attached to luggage, etc., and the shape can be arbitrarily designed according to the usage conditions . Background art

As a method of transmitting information in the form of a card or a tag, for example, there is a method using magnetic recording. This is often used for prepaid cards, tickets, air tickets, etc. However, in general, a magnetic recording layer containing a magnetic material such as barium ferrite is provided by coating on a base material such as paper or a plastic film. The necessary information is written (encoded) using a magnetic reader / writer on this magnetic recording layer, and the information is read and the record is rewritten using a reader / writer provided in a ticket gate. Such a reader / writer mainly has a so-called minute electromagnet called a magnetic head, and the magnetic recording medium is almost the same as the magnetic head for recording and reading. It is in the form of contact. For this reason, for example, when used as a ticket gate, there is the inconvenience that the card put in the wallet must be taken out of the wallet and passed through the ticket gate machine.In addition, an IC carrier called a contact type IC card In recent years, it has been used in banks, etc., but has the same inconveniences as magnetic cards. However, the information that can be recorded on an IC is usually several times to several thousand times that of a magnetic recording medium, and has the merit that it can be used in various applications, that is, in various applications. For this reason, non-contact IC carriers are being considered for commuter passes and bus tickets, and are currently being used. In the logistics field, optical bar codes such as JAN (Japan Article Number) code and code 39 are printed or directly printed on printers, provided on slips of products and luggage, etc. Used for management. However, the information meaning of the barcode is fixed at the time of printing or printing, and cannot be rewritten except for the rewrite type barcode. Also, the amount of information that can be recorded is small. When reading barcodes, it is necessary to use a barcode scanner or the like, and the reading range is limited. Even if a rewrite-type thermal barcode is used, it is necessary to use a thermal head to rewrite the barcode, so once the barcode is formed on the product, it will be rewritten. There are drawbacks that the rewriting by the thermal head becomes very difficult because the media for performing the rewriting is in various forms.

The Ic chip mounted body of the electrostatic coupling system to which the present invention is directed can communicate with a reader or reader / writer without contact, and can read or rewrite information. Since the IC chip is used, the amount of information alone can utilize 100 bytes or more of the memory of the IC chip. The antenna can be formed by a general printing or printing method only by providing a conductive layer. The communication method of the IC chip mounting body using such an electrostatic coupling method is described in detail in, for example, Japanese Patent Application Laid-Open No. H11-135185.

Regarding the antenna formation, the printing method is fixed by the plate in the printing method, so when changing the pattern, it is necessary to make a plate. The ink jet printing method is used in the printing method, but the ink jet printing method uses a water-soluble ink, and thus has poor water resistance.

A first object of the present invention is to provide an IC chip mounted body having excellent water resistance.

A second object of the present invention is to provide a method capable of easily manufacturing an IC chip mounted body. Disclosure of the invention

The present invention relates to an IC chip mounted body including an IC chip and an antenna electrically connected to a terminal of the IC chip, at least a part of the antenna is formed by a conductive layer formed on a support. The conductive layer is made of at least one conductive material whose main component is selected from graphite, carbon black, conductive metal and conductive compound, and further contains a heat-fusible material containing wax. Contains. An antenna formed of such a conductive layer has excellent water resistance because it contains wax.

In the IC chip mounted body of the present invention, the conductive ink layer of the thermal transfer film provided with the conductive ink layer is pressed against a support, and the thermal transfer film is heated to a predetermined pattern by a thermal head, and the heat transfer film is heated to a predetermined pattern. A process of thermally transferring a conductive ink layer onto the support to form an antenna; and mounting the IC chip on the support so that terminals of the IC chip are connected to the antenna. can do.

Although described in the examples, the base material for forming the antenna is not limited to a single layer such as paper, and can be printed on a label paper with an adhesive layer interposed between the base material. Thus, an antenna label can be directly attached to a product or baggage, and can be used for various purposes.

The antenna is not limited to a single antenna. For example, a first antenna formed on a first support on which an IC chip is mounted and connected to an IC chip, and a second antenna different from the first support on a second support larger than the first antenna A second antenna having a size and electrically connected to the first antenna can be provided. In this case, the second antenna is formed using the above conductive layer containing a conductive substance and wax.

In order to manufacture an IC chip package having two antennas, the IC chip is mounted on a first support having a first antenna, and a conductive adhesive is applied on the first antenna. The second antenna is formed on the second support by thermal transfer, and the IC chip is mounted on the support by bonding the first antenna to the second antenna with the conductive adhesive. can do.

The form of the IC chip in the present invention is electrically connected to the conductive antenna layer. In this way, it is necessary to use a conductive adhesive such as ACF (anisotropic conductive film) and ACP (anisotropic conductive paste) for the micro-antenna. Then, a conductive adhesive is coated on the micro-antenna, and if it is used as a micro-tag label, the information is stored on the IC chip before the IC chip is used for limited use as an IC carrier. Recording, rewriting, and reading are convenient. Using such a small evening label, encoding it at the tag issue site, and attaching it to the antenna label or the product on which the antenna is formed, the tag can be issued immediately, which is convenient.

According to the manufacturing method of the present invention by thermal transfer printing, an antenna is formed at the time of tag issuance, and an ID number capable of individually identifying a chip is encrypted as it is, or encoded as a bar code or the like. If it can be printed together, it is very convenient in case of an IC chip breakage. Of course, other visual information can also be printed as necessary.Moreover, by allowing the thermal transfer printer to also input information with the IC chip read / write device, the above information can be printed automatically. It is also possible to let them.

In the present invention, an antenna is formed by a thermal transfer printing method. In this thermal transfer printing method, a conductive layer of a conductive and heat-fusible 'I' having conductivity is made of PET (polyethylene terephthalate) or PEN (polyethylene). A method in which a thermal transfer ripon provided on a heat-resistant base material such as a naphthate) is printed by a transfer device having a heating head such as a thermal head on a base material on which an antenna is formed. It is characterized by using a conductive heat-fusible transfer ink for the layer.

Generally, the thickness of the substrate used as the thermal transfer ribbon is preferably from 2 m to 10 m. If the substrate is thinner than this, The ripon is liable to be damaged during heating, and if it is thicker than this, the applied energy required for transfer is too large to be practical.

Such conductive heat-fusible transfer inks are mainly composed of (1) conductive substances, (2) heat-fusible substances, and these are composed of the following materials (1) Conductive substances:

Examples thereof include carbon black (preferably a conductive carbon black such as Ketjen black), graphite, a conductive metal such as gold and silver, and a conductive compound such as an oxide of indium and tin.

② Thermo-fusible substance:

Waxes with melting points of 40 ° C to 150 ° C, such as paraffin wax and carnauba wax; vinyl resins, such as ethylene-vinyl acetate copolymer; acrylic resins, such as ethylene ethyl acrylate; Coumarone resin, petroleum resin, phenol resin, maleic acid resin, polyamide resin, cell mouth resin, epoxy resin, ketone resin, etc. In the present invention, the heat-fusible substance contains wax as an essential component.

The proportion of these materials in the thermal transfer layer is 1 to 60% by weight of the conductive substance and 40 to 9.9% by weight of the heat fusible substance. More preferably, the conductive material is 25 to 45% by weight, and the heat fusible material is 55 to 75% by weight. The conductivity of the conductive layer is defined by its surface resistivity. In general, the surface resistivity is defined as a rectangular parallelepiped, and the length of the side facing the electrode is W [mm]. , Where the distance between the two sides is L [mm] and the measured resistance between the electrodes is R [Ω], the surface resistivity ioS = RXW 、 L In the present invention, it is preferable that the surface resistivity of the conductive layer is 1 Ω / port to 100 Ω / port in order to obtain sufficient communication characteristics. In the material of the transfer layer of the present invention, the surface resistivity is It is difficult to reduce the distance, and if the surface resistivity is higher than this, it is difficult to achieve a sufficient communication distance.

When a heat fusible transfer ink is provided on a thermal transfer ripon, sufficient communication characteristics cannot be obtained if the thickness of the ink layer is too small, and if the ink layer is too thick, thermal transfer occurs when performing thermal transfer. With the applied energy supplied to the head, the ink layer is not completely transferred to the substrate to be transferred, that is, a so-called transfer failure occurs. Therefore, the thickness of the transfer ink layer is 0.1 in! It is preferably from 100 m to 100 m, and in order to exhibit a sufficient function as an antenna, it is preferably from 0.5 m to 20 / im.

In addition to transferring the thermal transfer ink layer to the substrate to be transferred in one printing, it is also possible to perform a printing method of so-called multiple printing, in which the thermal transfer ink layer is partially transferred in several times.

In the present invention, in order to facilitate peeling of the transfer layer at the time of thermal transfer, it is preferable to provide an anchor layer between the base material such as PET and the conductive thermal transfer layer in the thermal transfer lip. The anchor layer mainly contains the conductive material (1) and the heat-fusible material (2), but is set so that when heated by a heating head, the melting point is lower than that of the conductive transfer layer, for example. In addition, it is necessary to elaborate the characteristics so that peeling can be easily performed during heating and melting, for example, the melting point is similar to that of the conductive transfer layer, but the melt viscosity is low. For example, when making a difference in the melting point, the ink is designed so that the melting point of one anchor layer is lower than the melting point of the conductive thermal transfer layer by 10 or more, preferably 20 ° C. or more. When making a difference in the melt viscosity, it is preferable to design so that the amount of the wax component of one anchor layer is larger than that of the conductive transfer layer. In the event that peeling occurs inside the amplifier layer or at the substrate interface during transfer, a conductive substance is added to the anchor layer to reduce the surface resistance of the antenna. Is preferred. This anchor layer, In order to sufficiently transfer the conductive transfer layer, it is preferable that the thickness of the anchor layer is set to 0.1 to 10 m so that the conductive transfer layer can be melted by a part of the energy applied to the thermal head.

In the present invention, the thermal transfer layer is not limited to a conductive transfer layer or a layer structure further including an anchor layer. For example, when the surface roughness of the substrate to be transferred is large, the transferability can be enhanced. In addition, at least one overcoat layer can be provided in order to enhance the adhesiveness to the substrate to be transferred. In this case, it is preferable to add a conductive agent to the overcoat layer in order to improve the communication characteristics of the electrostatic antenna.

The use of EVA (ethylene vinyl acetate copolymer) for the thermal transfer layer including the anchor coat layer and the overcoat layer improves the adhesion to the conductive adhesive of the IC chip mounting body 1 described below. It is preferable in doing. In particular, it is more preferable to use it for the anchor coat layer.

In order to provide a conductive layer including such a conductive thermal transfer layer and an anchor layer on a base material, the above-mentioned materials are dissolved, mixed, and dispersed in a solvent, or heated and melted to obtain a liquid state. In general, a method of coating the substrate with a gravure coater, bar coater, or mouth coater is used. The ink used to melt and apply the ink is called hot melt iron. Ink application by such a method can continuously apply the base material in a roll state, and can be mass-produced and the production cost is low. It is necessary to make the ink liquid in order to apply it all at once, but this is done by dissolving, mixing, dispersing or heat-melting the constituent materials of the transfer layer in an attritor, pole mill, sand mill, It is prepared by mixing or kneading with a roll mill. At this time, for example, a powdery material such as a conductive carbon black is finely ground and dispersed to a predetermined particle size. In the present invention, workability during coating of the ink layer and uniformity of the conductive layer are ensured. There is no limitation on the addition of auxiliaries and additives necessary for this purpose. For example, a surfactant or the like may be added to improve dispersibility during the preparation of the ink. The average particle size of the powder material in the final ink is preferably 50 ^ m or less, more preferably 20 zm or less, in order to make the surface of the ink layer after coating uniform. An antifoaming agent for eliminating foam generated during coating may be added.

The raw material coated with the transfer layer etc. in a roll state is cut into small pieces by slitting it to the appropriate size for use in a thermal transfer printer. Eventually, the small roll is subjected to thermal transfer printing. At this time, it is usually preferable to use a thermal transfer printer that can print in an arbitrary shape and can print ID numbers and the like. In this thermal transfer printer, the thermal transfer lipon and the substrate to be transferred are overlapped, current is supplied to the thermal head, and the temperature of the head element is raised to a temperature equal to or higher than the melting point of the transfer layer. This is a device that transfers to the material layer. At this time, the amount of heat flowing from the thermal head into the thermal transfer ripon partially scatters in addition to the melting of the transfer layer due to irregularities of the substrate. Therefore, it is necessary to apply extra energy to the thermal head, and the temperature of the thermal head may greatly exceed the melting temperature of the transfer layer. At that time, the so-called "stating" phenomenon may occur, in which the surface of the substrate of the thermal transfer ripon softens or melts and tends to stick to the general head. When this occurs, the transfer pattern may be unclear, or in severe cases, the film may be damaged and torn off. In order to prevent such troubles, a heat-resistant layer may be provided on the side of the thermal transfer lipon that contacts the thermal head. This heat-resistant layer is provided by coating a material such as a silicone resin, an epoxy resin, a melamine resin, a phenol resin, a fluorine resin, a polyimide resin, or nitrocellulose on a base material. In the present invention, in order to manufacture the same pattern in large quantities, in addition to using the thermal transfer printer described above, a mold having a certain pattern is heated and pressed against a thermal transfer ripon to conduct conductive thermal transfer onto a substrate to be transferred. The method of transferring layers, so-called hot stamping, may be employed.

As the substrate to be transferred, the above-mentioned paper, synthetic paper, non-woven fabric, plastic film, and those obtained by processing an adhesive label thereof are used. However, in order to improve thermal transferability, the transfer layer and the transfer layer are heated. A receiving layer for enhancing the adhesiveness of the conductive transfer layer and sufficiently transferring the conductive transfer layer may be provided. In general, the receiving layer is formed by coating or laminating a thermoplastic resin such as a vinyl resin on the surface of the transfer-receiving substrate on which the transfer is performed.

Further, an absorption receiving layer for enhancing absorption and fixing of the conductive thermal transfer layer may be provided. The absorption receiving layer is formed by dispersing a porous pigment such as silica in a thermoplastic resin such as a vinyl resin on the surface of the transfer-receiving substrate on which the transfer is performed.

In the present invention, the transfer pattern of the conductive layer can be designed as desired by a computer in a thermal transfer printer, but the conductive heat transfer layer is colored to change the impression when the antenna is exposed on the tag surface. It is also possible to add an agent. For example, when carbon black is used as a conductive material, the color of the antenna becomes black, but the image of the antenna can be changed by changing the color tone by adding an additive of a desired color. Good. Of course, it is needless to say that the color of the antenna can be easily adjusted by using a transparent conductive material (for example, ITO (indium oxide)).

According to the present invention, the conductive antenna of the IC mounted body of the electrostatic coupling type used as such a card or tag label is electrically connected. At least two graphic patterns drawn in a linear circuit, and between them are insulated graphic patterns. In addition to being used for the intended purpose of the mounted body, the antenna pattern can be used for design purposes or for information transmission. In addition, since the circuit is composed of a substantially linear circuit, that is, the circuit is composed of straight and curved lines, although the width is wide and narrow, the amount of ink used is smaller than in the case of solid printing on the entire surface, and economical It is possible to provide. The conductive antenna forming such a linear circuit is preferably formed as the above-described second antenna because it is easy in manufacturing and is preferable. However, if only the first antenna is used, an antenna that forms such a linear circuit is formed as the first antenna, and the IC chip is mounted using a general method, for example, using an adhesive such as ACF. It is also possible to combine with.

That is, the linear circuit constituting the graphic pattern is a linear circuit drawn so as to roughly cover the graphic pattern, and the degree of the roughness is defined as a flat surface having no concave portion with respect to the graphic pattern. Considering a solid figure with no depressed portion with an outer periphery as the edge, the ratio of the area of the figure pattern to the area of the figure is set to 0.1% or more, so that the performance as an antenna is hardly reduced. An antenna that is economically and design-excellent can be constructed. The solid figure having no concave portion with its outer periphery as an edge is called an outer edge diagram. For example, even when an antenna having a grid pattern of 10 mm square was formed by a line having a line width of 0.1 mm, almost the same sensitivity as that of a solid-printed antenna having the same area as the antenna was obtained. The upper limit of the numerical value of the above area ratio differs depending on the shape of the graphic pattern. That is, if the figure pattern itself has a concave portion, this numerical value is naturally less than 100%. If the pattern does not have a concave portion, it becomes 100% when the figure becomes 100%. In such a case, the upper limit is less than 100%. At least two graphic patterns drawn in such a substantial linear circuit, and the graphic patterns insulated between them are, in addition to barcode patterns, grid patterns, spider webs Pattern, logo-like pattern, tree-like pattern, hieroglyph-like pattern, human-like pattern, butterfly-like pattern, and a combination thereof _{(in the} present specification, a barcode having one meaning has been described. A set of bars is called a bar code pattern, so a bar code can be a bar code pattern.

The lattice pattern includes patterns such as vertical and horizontal grids composed of vertical and horizontal lines and diagonal lattices composed of diagonal lines. An example of this pattern is shown in the figure. FIG. 3 is a plan view showing an example in which two graphic patterns are constituted by vertical and horizontal lattice patterns. In the figure, the lattice patterns are the antennas 4a and 4b, which are formed on the support 3 and the figures shown by the dotted lines show the minute IC tag label 1 and the first antennas 22a and 22b. In this case, the minute IC label is stuck vertically. In the following patterns, members having the same reference numerals represent the same members, and therefore, the description thereof is omitted. The connecting portions of the antennas 4a and 4b are also formed by printing or thermal transfer printing. In this example, this connection part has a form that can be connected to each of the two antennas of the minute IC tag label 1.However, if the IC chip is directly connected, the form is suitable for that. Needless to say.

The spider web pattern is a radial pattern, and an example of this pattern is shown in FIG. FIG. 4 is a plan view showing an example in which two graphic patterns are formed by a spider web-shaped pattern. The small IC tag label 1 is attached horizontally at the center of the figure.

The logo pattern is a pattern that expresses the company name, company emblem, product name, etc. Things. An example of this pattern is shown in FIG. FIG. 5 is a plan view showing an example in which two graphic patterns are formed by a chin-like pattern. The figure shown by the dotted line in the figure shows the small IC tag label 1 and the first antennas 22a and 22b.

Further, FIG. 6 shows an example of an outer edge diagram which is a solid figure without a concave portion having an outer periphery as an edge as described above using the logo-shaped pattern as an example. The hatched area around the logo on the right side of Fig. 6 is indicated by the dashed line and the hatched area.

The tree-like pattern is a pattern such as a tree or leaf pattern. An example of this pattern is shown in FIG. FIG. 7 is a plan view showing an example in which two graphic patterns are constituted by tree-like patterns. The figure shown by the dotted line in the figure shows the minute IC tag label 1 and the first antennas 22a and 22b.

A hieroglyphic pattern is a pattern composed of pictogram-like shapes of ancient Egyptians called hierographs. An example of this pattern is shown in FIG. FIG. 8 is a plan view showing an example in which two graphic patterns are constituted by a hierographic pattern. The dotted line in the figure shows the minute IC tag label 1 and the first antennas 22a and 22b.

The human-shaped pattern is a pattern imitating a human shape. An example of this pattern is shown in FIG. FIG. 9 is a plan view showing an example in which two figure patterns are configured by a humanoid pattern. The dotted line in the figure shows the small IC label 1 and the first antennas 22a and 22b. As a variation of this pattern, a pattern imitating the shape of an animal can be cited.

The butterfly wing pattern is a pattern like a butterfly wing pattern. This party FIG. 10 shows an example of such a case. FIG. 10 is a plan view showing an example in which two figure patterns are constituted by butterfly-like patterns. The figure shown by the dotted line in the figure shows the small IC label 1 and the first antennas 22a and 22b.

In general, an optical barcode is used as the barcode pattern.

As optical barcodes, for example, JAN (Japan Article Number), code 39, NW-7, code 128, industrial 2 of 5, code 93, EAN-1228, etc. Known patterns may be used.

Also, it is possible to use not only one-dimensional barcodes but also two-dimensional barcodes. However, two-dimensional barcodes usually have a square barcode shape, and there are many places where each par is not connected. Provision It is necessary to provide connection parts for IC chip and IC chip connection label. For example, when one two-dimensional bar code is arranged, a connection part is made so as to surround the outer circumference of the two-dimensional bar code. It is necessary to take measures such as joining chip mounting labels. Also, when two 2D barcodes are juxtaposed at a certain interval, a frame of a certain width is provided to surround each barcode, and each frame is connected to the IC chip mounting label. This constitutes an IC chip package.

As the type of the two-dimensional barcode, generally used ones may be used. For example, QR code model 1, QR code model 2, microphone port QR, PDF 4 17 are used.

Now, the optical barcodes used as these conductive antennas are: It is preferable to adjust the contrast between the bar part and the other part as necessary so that it can be read by a general optical barcode reader. In the present invention, when conductive carbon black is used as the conductive compound, for example, the color of carbon black is essentially black, so that this contrast can be easily obtained, which is suitable for the use of the present invention.

There are two major examples of optical barcode patterns. One example is as follows. At least two of the graphic patterns are bar code patterns, and the bars constituting one bar code are divided into at least two groups to form the at least two graphic patterns, and each of the graphic patterns is formed. In this example, the bars are electrically connected to each other. An example of this pattern is shown in FIG. Fig. 11 shows two figures

FIG. 9 is a plan view showing an example in which the pattern is constituted by a bar code pattern. The dotted line in the figure shows the small IC tag label 1 and the first antennas 22a and 22b.

Another example is the one described below. In this example, the graphic pattern is at least two barcodes, the barcodes constitute at least two graphic patterns, and the bars constituting each graphic pattern are electrically connected to each other. An example of this pattern is shown in FIG. FIG. 12 is a plan view showing an example in which two graphic patterns are respectively constituted by bar codes. The dotted line in the figure shows a small IC label 1 and the first antennas 22a and 22b.

In the embodiment shown in FIGS. 11 and 12, the position where the bars are electrically connected to each other in each of the graphic patterns is preferably at the end of the bar, but the function as a bar code is not hindered. If not, other parts may be used.

Although each of the patterns described above shows an example in which almost two figure patterns are symmetric, it is more preferable that the area is substantially the same, It does not need to be typographical. For example, characters such as names and initials can be used as they are in the pattern regardless of one or more characters. Note that a conductive antenna composed of at least two graphic patterns drawn in a substantially linear circuit electrically connected as described above and insulated between them is referred to as an antenna. When considering only the effects described above, such as the ability to use the pattern of the present invention for design purposes or for information transmission purposes, the figure pattern as a conductive antenna can be used for screen printing, flexographic printing, offset printing, etc. It is also possible to form by a printing method or a general printing method such as ink jet printing or laser printing.

In the IC chip mounted body of the present invention, at least a part of the antenna has at least one kind of conductive material selected from graphite, a force pump rack, a conductive metal and a conductive compound formed on a support. Since it is made of a conductive layer containing a liquid crystal and a hexagon, it is superior in water resistance to an antenna layer formed by ink jet printing using a water-soluble ink. In the ink jet system, it is generally necessary to provide an absorbing layer for absorbing ink, but the antenna of the present invention can also be formed on plain paper itself.

The antenna is formed on the first support on which the IC chip is mounted and is connected to the IC chip.The first antenna is mounted on a second support separate from the first support and is larger than the first antenna. A second antenna formed and electrically connected to the first antenna is provided, and the second antenna is formed by a conductive layer, so that the antenna is enlarged to increase the communication distance. Will be easier.

By printing individual information that can identify the IC chip mounted on the IC chip mounting body on the support on which the antenna is formed, the IC chip can be printed. Even if the chip breaks during use, the damaged IC carrier can be identified. "

In the production method of the present invention, the conductive ink layer of the thermal transfer film provided with the conductive ink layer is pressed against a support, and the thermal transfer film is heated to a predetermined pattern by a thermal head to form the conductive ink layer. The method includes a step of forming an antenna by thermal transfer onto the support, and a step of mounting the IC chip on the support so that terminals of the IC chip are connected to the antenna. The pattern is fixed by the plate, and it is necessary to make a plate when changing the pattern. However, in the printing method of the present invention using a thermal head, the pattern is created by a computer or the like, and the print head having the thermal head is used. By printing the pattern in the evening, the pattern can be changed at any time.

Also, the ID number, name, product name, etc. can be printed at the same time as the antenna. Since thermal transfer printing is used, printing on synthetic paper, nonwoven fabric, plastic film, etc., in addition to general paper materials, is also possible.

The IC chip to be mounted is mounted on a first support having a small first antenna, mounted in advance with a conductive adhesive applied to the first antenna, and transferred to another support by thermal transfer. After forming the second antenna, if the first antenna is bonded to the second antenna with the conductive adhesive, the manufacture of the IC chip mounted body is further facilitated. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic cross-sectional view showing an IC chip mounted body of one embodiment. FIG. 2 is a schematic cross-sectional view showing a mounted body provided with a small antenna and mounted with an IC chip for use in the embodiment. Fig. 3 is a plan view showing an example where two figure patterns are composed of vertical and horizontal lattice patterns, and Fig. 4 is a figure showing two figure patterns. Fig. 5 is a plan view showing an example in which two figure patterns are formed by a logo-like pattern, and Fig. 6 is an example of an outer edge view using a logo-like pattern as an example. Fig. 7 is a plan view showing an example in which two figure patterns are constituted by tree-like patterns, and Fig. 8 is a plane view showing an example in which two figure patterns are constituted by a hierography-like pattern. Fig. 9, Fig. 9 is a plan view showing an example in which two figure patterns are constituted by humanoid patterns, Fig. 10 is a plan view showing an example in which two figure patterns are constituted by butterfly-shaped patterns, Fig. 1 FIG. 1 is a plan view showing an example in which two figure patterns are constituted by bar code patterns, and FIG. 12 is a plan view showing an example in which two figure patterns are constituted by per code. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the present invention will be described more specifically with reference to examples. However, needless to say, the present invention is not limited thereto.

As shown in FIG. 1, the IC chip mounting body 2 forms the electrostatic antennas 4 a and 4 b on the base material 3 by thermal transfer printing, and places the IC chip on the electrostatic antennas 4 a and 4 b. It was formed by bonding the mounting body 1 including the metal.

Formation of IC chip mounting body 1:

As shown in Fig. 2, 100 mm x 10 mm square loop-shaped electrostatic antennas 22 a and 22 b are mixed on a 100 m thick paper base 20 as shown below. The two terminals 26a, 26 of the IC chip 24, 1.5mm x 2.0mm in size, are provided in parallel at 5mm intervals by flexographic printing (topographic printing) using the conductive ink of 1. b was joined to both electrostatic antennas 22a and 22b by ACP (anisotropic conductive base) 28a and 28b. In addition, the two electrostatic antennas 22a and 22b have conductive particles containing silver particles. The adhesives 30a and 3Ob were applied, and this was used as the IC chip mounted body 1. The electrostatic antennas 22a and 22b shown in FIG. 2 are called first antennas, and the electrostatic antennas 4a and 4 shown in FIG. 1 are called second antennas. (Formulation 1)

Conductive carbon black 15 layers: Polyester resin (Byron: a product of Toyobo Co., Ltd.)

20 layers:; part Nonionic dispersant 2 layers:; section Cyclohexanone 20 layers:; section Isophorone 40 layers:; section Thermal transfer film formation:

4. paint (following formulation 2) constituting the en force one layer was applied to 0. 5 gZm ² by 5 m Darabiya scheme polyester film having a thickness of, after drying, further coating (following formulation constituting the conductive ink layer 3) was applied to 1.6 gZ m ² and dried to form a slit having a width of 110 mm. The preparation method of the paint constituting the anchor layer and the paint constituting the conductive ink layer is shown below.

[Formulation 2]: Anchor layer ink composition

Nonionic dispersant

Conductive f raw carbon black

(Ketjen Black EC: Lion's product)

Ethylene vinyl acetate copolymer ^L part Coumarone resin; part Polyethylene wax — part Carnauba wax

60 parts by weight N 2: Part

[Formulation 3]: Conductive layer ink composition

Nonionic dispersant 2 parts by weight Rikibon graphite

Conductive carbon black 10 layers:;

(Ketjen Black EC: Lion product)

Coumarone resin 6 layers:; part Vinyl chloride vinyl acetate copolymer 1 layer:; part Carnauba wax single layer:; part Memethytyl leetityl lekeketontone 36 parts by weight Ethyl acetate 20 parts by weight

10 parts by weight Isopropanol 10 parts by weight Preparation of anchor layer and conductive layer:

Add the resin to the solvent and stir to form a uniform resin liquid.Add solid components such as nonionic dispersant, graphite, wax, etc., and stir to form a uniform dispersion, disperse and uniform with an attritor. The liquid mixture was a good one.

Formation of the electrostatic antennas 4a and 4b:

A synthetic paper label (Upo Hyper Label: a product of Upo Corporation) bonded to the release paper through an adhesive layer on the synthetic paper base material 3 is applied to the thermal transfer printer (stock). Thermal transfer printing was performed by L-200-08) manufactured by Ishida Co., Ltd. to form loop-shaped electrostatic antennas 4a and 4b (a pair at 5mm intervals) with dimensions of 35mm x 70mm.

Formation of IC chip mounted body 2:

The above-mentioned IC chip is attached to the electrostatic antennas 4a and 4b formed by the thermal transfer printing. The chip mount 1 was joined to form an IC chip mount 2. This bonding is performed by connecting one of the electrostatic antennas 4 a and 4 b formed by thermal transfer printing to one of the electrostatic antennas 22 a and 22 b of the IC chip mounting body 1. This was performed by joining the other antenna of the electrostatic antennas 4a and 4b to the other of the 2b.

Characteristics of IC chip mounted body 2:

When communication was performed on the IC chip mounted body 2 formed as described above using a communication device (one reader), communication was possible up to a distance of 75 mm from the reader antenna to the electrostatic antenna 4a _: 4b. . By the way, communication is possible even with the IC chip mounting body 1, but static electricity from the reader / antenna:

It can communicate only up to 5 mm from 22 a and 22 b.

A remarkable increase in the communication distance due to 4a and 4b was observed.

The surface resistivity of the electrostatic antennas 4a and 4b was measured by the method described above, and was found to be 300 Ω / port. Industrial applicability

The IC chip mounted body of the present invention can be used for transportation such as bank cards, commuter passes, management cards used for entry / exit management, telephone input, home delivery, etc. It is suitable to be used for non-contact IC cards such as management tags or so-called non-contact IC tags.

Claims

The scope of the claims

1. An IC chip mounted body comprising an IC chip and an antenna electrically connected to a terminal of the IC chip,

At least a part of the antenna is a conductive layer formed on a support,

The conductive layer is mainly composed of at least one conductive material selected from graphite, carbon black, conductive metal and conductive compound, and further contains a heat-fusible material including wax. An IC chip mounted body characterized in that:

2. The antenna is formed on a first support on which the IC chip is mounted and connected to the IC chip, and the first antenna is mounted on a second support different from the first support. A second antenna formed in a size larger than the antenna and electrically connected to the first antenna, wherein the second antenna is formed by the conductive layer. IC chip mounted body.

3. The conductive layer contains 1 to 60% by weight of a conductive substance, 40 to 99% by weight of a heat-fusible substance,

The heat-fusible materials include waxes with a melting point of 40 ° C to 150 ° C, coumarone resin, vinyl resin and its copolymer, acrylic resin, phenol resin, maleic acid resin, polyamide resin, 3. The IC chip mounted body according to claim 1, wherein the IC chip mounted body contains at least one compound selected from the group consisting of a cellulose resin, a petroleum resin, an epoxy resin, and a ketone resin.

4. The IC chip mounted body according to any one of claims 1 to 3, wherein the surface resistivity of the conductive layer is 1 Ω / port to 100 000 Ω / port.

5. The method according to any one of claims 2 to 4, wherein individual information for identifying an IC chip mounted on the IC chip mounting body is printed on the second support. IC chip mounted body.

6. The conductive layer constitutes at least two graphic patterns drawn in a substantially linear circuit electrically connected, and is insulated between the graphic patterns. 6. The IC chip mounted body according to any one of items 1 to 5.

7. The graphic pattern is selected from a bar code pattern, a lattice pattern, a spider web pattern, a logo pattern, a tree pattern, a hierography-shaped pattern, a human-shaped pattern and a butterfly-shaped pattern. 7. The IC chip package according to claim 6, wherein the package includes at least one pattern or a combination thereof.

8. At least two of the graphic patterns are bar code patterns, and bars constituting one bar code are divided into at least two groups to form the at least two graphic patterns, and each of the graphic patterns 8. The IC chip mounted body according to claim 7, wherein bars constituting the IC chip are electrically connected to each other.

9. The graphic pattern is at least two barcodes, and 8. The IC chip package according to claim 7, wherein the barcodes constitute the at least two graphic patterns, and pars constituting the respective graphic patterns are electrically connected to each other.

10. The conductive ink layer of the thermal transfer film provided with the conductive ink layer is pressed against a support, and the thermal transfer film is heated in a predetermined pattern by a thermal head to support the conductive ink layer. Heat transfer onto the body to form an antenna;

Mounting the IC chip on the support so that a terminal of the IC chip is connected to the antenna.

11. The IC chip is mounted on a first support provided with a first antenna according to claim 2, and is mounted in advance with a conductive adhesive applied to the first antenna. ,

The antenna formed by thermal transfer is a second antenna according to claim 2, the support forming the antenna is a second support according to claim 2,

The manufacturing of the IC chip mounted body according to claim 10, wherein the step of mounting the IC chip on the support is a step of bonding the first antenna to the second antenna with the conductive adhesive. Method.

12. The thermal transfer film used in the production method according to claim 10, wherein:

At least one conductive substance selected from graphite, carbon black, conductive metal and conductive compound on the substrate, and wax A thermal transfer film comprising a conductive ink layer containing:

13. The thermal transfer film according to claim 12, wherein an anchor layer is interposed between the base material and the conductive ink layer.

14. The thermal transfer film according to claim 12, wherein an overcoat layer is provided on the conductive ink layer.