JP2003158414A - Package with IC tag and method of manufacturing package with IC tag - Google Patents

Abstract

[57] [Problem] To provide a package with an IC tag in which a non-contact IC tag does not peel off in the distribution process and a method for manufacturing the same. A package 1 with an IC tag according to the present invention is a package with an IC tag having a non-contact communication function, wherein an antenna made of conductive ink is optional on at least a part of a base film or sheet. It is printed in a pattern, and the IC tag label 2 is mounted on the printed surface of the antenna, and further comprises a laminate in which a sealant film is laminated on the IC tag label surface. The method for producing a package with an IC tag of the present invention is characterized in that a sealant film is laminated after an IC tag label is attached to a base film or sheet.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a package with an IC tag and a method for manufacturing the same. More specifically, it is a technology for attaching an IC tag having a non-contact communication function to a package such as food or beverage, and instead of individually attaching the IC tag label to the package after filling the non-contact IC tag with the contents. , A technique for in-line mounting in the manufacturing process of a package.

[0002]

2. Description of the Related Art A "contactless IC tag" capable of recording and reading information in a contactless manner (generally, "contactless data carrier", "wireless IC tag", "contactless IC", "contactless I").
It may be expressed as “C label” or the like. ) Has come to be widely used for information management of goods and merchandise, logistics management, and the like. Even in the field of packages such as foods, non-contact IC tags are being attached to be used for distribution, quality control, expiration date management and the like.

Conventionally, when a non-contact IC tag is attached to a package, the labeled non-contact IC tag is generally attached to the bag or the like after completion of the bag or the box or filling of the contents. Is. Therefore, the IC tag is easily peeled off, and in many cases, the IC tag is peeled off during the distribution process to fail to achieve the intended purpose.
It is considered that this is because the packaging body holding the IC tag in the constituent layers of the packaging body has not been realized, and the manufacturing technology has not been established.

Here, considering the form of the non-contact IC tag, (1) a form in which a winding-shaped planar antenna pattern is formed on a label base material and an IC chip is directly attached thereto, and (2) a base material or An antenna pattern is printed on the surface of the packaging material with conductive ink, and an IC in the form of an interposer is printed on this.
There is a form of attaching a tag label. In the case of (1), the antenna pattern is also provided on the label substrate surface, so that the IC
Although the tag label is relatively expensive, if the antenna pattern can be continuously printed on the packaging material or the like, the embodiment of (2) in which the IC tag label is mounted and used has a cost advantage. Suitable for mass consumption applications.

FIG. 4 is a diagram for explaining an embodiment of a non-contact IC tag. 4A is a plan view in which the IC tag label 2 is attached so as to be connected to both the antenna patterns 11 and 12 of the package base material, and FIG. 4B shows the IC tag label 2 from the antenna patterns 11 and 12. FIG. 4C shows a partially peeled state, and FIG.
It is a figure which shows the cross section expanded in the line. In the case of this embodiment, the non-contact IC tag 10 prints the antenna pattern directly on the package base material, and the antenna pattern 1
The IC tag label 2 is attached to the terminals 1 and 12.

The shape of the antenna pattern is not particularly limited as long as it is a pattern separated into two pieces (arbitrary shape such as circular, rectangular, triangular, or rhombic), and the IC can be electrically connected to this pattern. Attach the tag label. The reason why the antenna pattern is divided into two pieces is that either one antenna side functions as a ground side.

Incidentally, the IC tag label 2 is an IC which is provided with an integrated circuit and / or a memory on a silicon substrate.
It means a state in which the C chip 5 is tack-labeled so that it can be attached to the antenna patterns 11 and 12, and the label itself has a small antenna part 21 connected to the IC chip 5,
22 (see FIG. 4C). The antenna portion and the antenna patterns 11 and 12 are adhered to each other with an anisotropic conductive adhesive 6 (portion indicated by x in FIG. 4C),
The continuity between the antennas is obtained. However, it has been confirmed that the antennas 11 and 21, 12 and 22 can function as an antenna by electrostatic coupling even if they are not electrically connected directly, as long as the distance between the surfaces of the antennas 11 and 21 and 12 and 22 is several 100 μm with a dielectric substance interposed therebetween. Has been done. Therefore, it is possible to mount the antennas 11 and 21, 12 and 22 so as to face each other via the IC tag label base material. Further, the bumps (not shown) of the IC chip 5 are connected to the antenna parts 21 and 22 (see FIG. 4B), but the antenna parts 21 and 22 are connected.
The IC chip 5 and the IC chip 5 are not necessarily formed on the same surface of the IC tag label. There is a commercially available product of such an IC tag label, and specifically, an interposer form for "BiStatix" (trademark) manufactured by Motorola is used.

[0008]

According to the present invention, such an IC tag label is mounted in a base material in the manufacturing process of a package,
It is intended to complete the package by performing necessary subsequent processing. The package will be supplied to the market after recording necessary data on the IC tag or after filling the contents with the data. However, an appropriate structure of the package with an IC tag has not been found, and a technique for efficiently manufacturing the package with an IC tag using a conventional manufacturing facility has not been established. Therefore, in the present invention, a non-contact IC tag is attached inline to a packaging material, and then research is conducted to efficiently produce an IC tag-equipped packaging body using a conventional manufacturing facility, and the following invention is completed. Is.

[0009]

The first aspect of the present invention for solving the above-mentioned problems is an IC having a non-contact communication function.
A package with a tag attached, wherein an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet, and an IC tag label is attached to the antenna printing surface, and the IC tag label A package with an IC tag, which comprises a laminate having a sealant film laminated on its surface. Since it is such a package with an IC tag, it is not necessary to attach the IC tag after the package is completed.

In this case, the sealant film can be laminated via an adhesive or an anchor coating agent, and the laminated film is laminated by an extrusion coating method, a dry laminating method, or a combination thereof. The base film or sheet may be made of paper, polyester, polyamide, polyolefin, or a laminate of two or more kinds of these films.

A second aspect of the present invention for solving the above problems is a method for producing a package in which an IC tag having a non-contact communication function is attached, in which at least a part of the base film or sheet is electrically conductive. With an IC tag, which is characterized by printing an antenna made of functional ink in an arbitrary pattern, mounting an IC tag label on the antenna printing surface, and laminating a sealant film on the IC tag label surface via an adhesive or anchor coat agent. The method for manufacturing a package is in. Since it is a method of manufacturing such a package with an IC tag,
Can be manufactured efficiently.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION In the case of a flexible packaging material or a carton, a packaging body with an IC tag is used in the case of a flexible packaging material or a carton from the viewpoint of omitting the work of sticking the IC tag after filling the contents such as foods and preventing the packaging material from falling off during distribution. It is advantageous to hold the IC tag between the laminated films or between the paper and the film. In this case, the non-contact IC tag is printed with the antenna pattern on the base film or sheet as described above, and the antenna pattern is I-shaped.
In general, a C tag label is attached and then a sealant film is laminated via an adhesive or an anchor coat agent.

The package with an IC tag of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an example of a package with an IC tag of the present invention. FIG. 1A is a plan view of the package, and shows a state after the bag is made and the contents are filled. However, the package with an IC tag of the present invention does not mean only the state after bag making or box making, and may be a laminated film or sheet which has a form such as a roll shape before bag making or box making. It shall be included. FIG. 1B is the same as FIG.
It is the sectional view expanded in the AA line of (A). Figure 1
As described above, in the package 1, the antenna patterns 11 and 12 are printed on the package base 1b, and the IC tag label 2 is attached to the antenna pattern. The IC tag label 2 and the antenna patterns 11 and 12 form a non-contact IC tag 10. The position where the antenna pattern is provided on the package is not particularly limited, but a position where the reader / writer can easily read is preferable.

As shown in the sectional view of FIG.
In the C-tag package 1, the label base material 2b of the IC tag label is usually mounted so as to face the sealant film 3 side, and the IC chip 5 is mounted so as to face the base film or sheet surface of the package body. The IC chip 5 is the label base material 2b.
The bumps (not shown) of the IC chip are connected to the small antennas 21 and 22 printed on the antennas 21 and 22 and the antenna patterns 11 and 12 are connected by the anisotropic conductive adhesive 6 or the like. It is as described above. However, as described above, it is not essential that the package base material and the label antenna are electrically connected to each other. Therefore, the IC chip 5 can be mounted so as to face the sealant film side. An adhesive or an anchor coat (AC) agent is interposed between the base film or sheet of the package and the sealant film 6, but the illustration in FIG. 1B is omitted. The IC tag label 2 is mounted on the antenna patterns 11 and 12 by using an automatic label sticking machine or the like on a traveling package base material with reference to a positioning mark printed at the same time as the antenna pattern.

FIG. 2 is a view showing a state in which the package with an IC tag of the present invention is processed. The state where the IC tag label 2 is attached to the base film or sheet and the adhesive 4 is applied to the surface of the base film or sheet containing the IC tag label is shown. Generally, when laminating a sealant film on a base material, the base material is passed between an impression cylinder composed of a metal roll 7 and a rubber roll 8 to apply the adhesive 4 to the surface of the base material film or sheet. After that, a sealant film is supplied and passed through nip rolls (not shown) to form a laminated film. In the figure, 9 is an adhesive supply pan, and solvent type or hot melt type adhesive is used for the adhesive 4, and the type is not particularly limited. In the case of FIG. 2, the IC chip 5 of the mounted IC tag label faces the base film or sheet surface, but the IC chip 5 can also be mounted so that the IC chip 5 faces the sealant film side.

FIG. 3 is a view showing another state in which the package with an IC tag of the present invention is processed. FIG. 3 shows a case of an extrusion coater machine (EC machine), but when the melted polyethylene 13 or the like is applied to the base material film or sheet, the base material is supplied from the nip roll 14 side which is a rubber roll, Extruded molten polyethylene from the T-die 16 to form a base film or sheet and molten polyethylene 1
The integrated sheet of No. 3 is pressed against the chill roll 15 which is a metal roll and laminated. When the anchor coat (AC) agent is applied in the previous step, the adhesion of the molten polyethylene can be made strong.

Next, materials used in the present invention will be described. As the base material of the package, papers such as carton paper, paperboard, high-quality paper, polyesters such as PET and PBT, polyamides such as nylon 6, nylon 66, and barrier films such as inorganic vapor deposition film and EVOH are used as sealant films. Polyolefin such as PE or PP or a film laminate of two or more kinds thereof can be used for the above. The IC tag label base material 2b used for the IC tag label 2 is paper,
Various materials such as PET, polypropylene, polyethylene, polystyrene, nylon and polyolefin can be used. In the case of paper, it is preferable to use paper that has been subjected to water resistance treatment and has high insulation. A thickness of 15 to 300 μm can be used, but it is 20 to 200 in terms of strength, processing workability, cost, etc.
μm is more preferable. Conductive ink is used for printing the antenna patterns 11 and 12, and printing can be performed by offset, gravure, silk screen printing, or the like. As the conductive ink, carbon, graphite, silver powder, aluminum powder, or an ink in which a mixture of these is dispersed in a vehicle is used. Alternatively, a transparent conductive ink using tin oxide, titanium oxide powder or the like may be used although the cost of the ink is relatively high.

The IC chip is a silicon substrate on which an integrated circuit and a memory are formed.
The size is within about mm × 2 mm, and the thickness is within 0.5 mm. 1024 for IC memory
With Bits, 128 characters can be recorded, and it can be applied to the minimum information recording as an ordinary package. If it is several kilobits, it is possible to display a two-dimensional barcode or more, and there is an advantage that writing and erasing can be freely performed after shipping. When changing the price display at the distribution stage or recording the date and time of storage, a non-contact IC tag that can be written and erased is preferable.

<Non-contact IC Tag Reader> A non-contact IC tag reader is also called a scanner and transmits a radio wave of a constant frequency to a non-contact data carrier to search for a response wave.
For communication with the reader, generally 125 kHz, 13.
The frequency band of 56 MHz, 2.45 GHz, 5.8 GHz (microwave) will be used. The non-contact IC tag often uses 13.56 MHz, and various readers and reader / writers are commercially available.

[0020]

Example 1 A 12 μm thick polyethylene terephthalate (PET) film (“E5100” manufactured by Toyobo Co., Ltd.) was gravure printed with an antenna pattern using conductive ink (“Carbon Ink 5067” manufactured by DuPont). A printing substrate film was created. Next, an IC tag label (manufactured by Motorola, product name: IC chip mounting label “BiStatix”) is attached to the antenna printed surface side.
The IC chip side was attached using a label sticking machine so that the printed surface of the antenna faced. In addition, "BiStati
A paper base material having a thickness of about 200 μm is used as the label base material of “x”. Next, using a single EC machine, IC
AC (anchor coat) agent on the tag label side (Takeda Pharmaceutical Co., Ltd., A3210 / A3075, solid content 5%)
After coating and drying, extruded PE with a resin temperature of 320 ° C
(“Mirason 16P” manufactured by Mitsui Chemicals, Inc.); a lamination film was produced by extrusion lamination with a PE film (“SKL film” manufactured by Dainippon Resin Co., Ltd.) having a thickness of 40 μm and an extrusion thickness of 20 μm. In addition,
The AC agent coating roller and the EC machine chill roller were chrome-plated iron rolls.

The constitution of the laminated film produced by the above steps is as follows: (Table) PET 12 μm / Antenna pattern printing / IC tag label / AC / PE 20 μm / PE film 40 μm
(Back).

Example 2 A 12 μm-thick polyethylene terephthalate (PET) film (“E5100” manufactured by Toyobo Co., Ltd.) was gravure-printed with an antenna pattern using a conductive ink to prepare a printing substrate film. Next, an IC tag label (manufactured by Motorola, product name: IC chip mounting label "BiStati" is provided on the antenna printed surface side.
x ”) was mounted using a labeling machine so that the IC chip side faces the antenna printed surface. Next, using a dry lamination (DL) machine, a DL adhesive (Dainippon Ink and Chemicals, Inc. "LX7
03 / KR90 ", solid content 45%) at 3 g / m ² (dr
y) After being applied and dried, a PE film having a thickness of 60 μm (“SKS film” manufactured by Dainippon Resin Co., Ltd., single-sided treatment) was pressure-bonded to produce a laminated film. After the production, the lamination film was aged at 40 ° C. for 3 days. The structure of the laminated film produced by the above process was as follows: PET 12 μm / antenna pattern printing / IC tag label / DL / PE film 60 μm (back).

Comparative Example A 12 μm-thick polyethylene terephthalate (PET) film (“E5100” manufactured by Toyobo Co., Ltd.) was gravure-printed with an antenna pattern using a conductive ink to prepare a printing substrate film. That P
60μm thick due to dry lamination on ET side
The polyethylene (PE) film (“SKS film” manufactured by Dainippon Plastics Co., Ltd.) was adhered. Then PE
An IC tag label (manufactured by Motorola, product name: IC chip mounting label “BiStati” on the front side antenna printed surface of T
x ”) was mounted using a labeling machine so that the IC chip side faces the antenna printed surface side.

Using the laminated films (wrapping bodies) of Examples 1 and 2 and Comparative Example, a packaging material for snack confectionery was prepared. As a confirmation item, after recording predetermined data on the non-contact IC tag 10, as a reading device,
Motorola BiStatix Reader "WAVE"
When an information reading test was conducted using the above, it was confirmed that the reading and writing can be performed in each of the examples without any trouble. However, in the case of the comparative example, since the IC tag label was directly attached to the surface of the packaging material, the label was peeled off due to rubbing, and the data could not be read in some cases.

The present invention can be applied not only to the soft packaging material but also to a carton or the like in which paper-film and the like are laminated, and does not exclude a box-shaped packaging body.

[0026]

As described above, in the package with the IC tag of the present invention, the non-contact IC tag is mounted between the base film or sheet and the sealant film, so that the bag body before filling the contents or Since it does not take time and effort to attach the IC tag label to the bag body after filling, it can contribute to labor saving. Further, since the IC tag label is not peeled off during the distribution process, the writing and reading of data can be always ensured.

[Brief description of drawings]

FIG. 1 is a diagram showing an example of a package with an IC tag of the present invention.

FIG. 2 is a diagram showing a state of processing the package with an IC tag of the present invention.

FIG. 3 is a diagram showing another state of processing the package with an IC tag of the present invention.

FIG. 4 is a diagram illustrating an embodiment of a non-contact IC tag.

[Explanation of symbols]

1 Package with IC tag 1b Package base material, base film 2 IC tag label 2b IC tag label base material 3 sealant film 4 adhesive 5 IC chip 6 Anisotropically conductive adhesive 7 metal roll 8 rubber rolls 9 Adhesive supply pan 10 Non-contact IC tag 11,12 antenna pattern 21,22 Small antenna

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G06K 19/077 H01Q 1/22 Z 5J047 G09F 3/00 1/38 H01Q 1/22 G06K 19/00 K 1 / 38 H F-term (reference) 2C005 MA19 MB06 NA09 3E067 AB01 AB26 BA12A BA19 BB14A BB26 CA24 EA04 EA06 EA32 EA35 EB22 EC22 EE33 EE41 EE60 FC01 GD10 3E075 BA42 CA02 DE09 DE23 GA07 5B035 BA03 BB09 CA01 CA23 5J046 AA01 AA06 AA14 AB12 PA07 QA02 5J047 AA01 AA06 AA14 AB12 EF04 EF05

Claims (5)

[Claims] 1. A package in which an IC tag having a non-contact communication function is mounted, and an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet. IC on the surface
A package with an IC tag, comprising a laminate on which a tag label is attached and a sealant film is laminated on the surface of the IC tag label. 2. The package with an IC tag according to claim 1, wherein the sealant film is laminated via an adhesive or an anchor coat agent. 3. The package with an IC tag according to claim 1 or 2, wherein the laminated body is laminated by an extrusion coating method, a dry laminating method, or a combination thereof. . 4. The package with an IC tag according to claim 1, wherein the base film or sheet is made of paper, polyester, polyamide, polyolefin or a laminate of two or more kinds of these films. . 5. A method of manufacturing a package in which an IC tag having a non-contact communication function is attached, wherein an antenna made of conductive ink is printed in an arbitrary pattern on at least a part of a base film or sheet, and the antenna is printed. I on the print side
A method for producing a package with an IC tag, comprising mounting a C tag label and laminating a sealant film on the surface of the IC tag label via an adhesive or an anchor coating agent.