JP2005234115A - Non-contact IC label. - Google Patents

Abstract

【Task】
It is an object of the present invention to provide a non-contact IC label that can be easily peeled off and collected after a non-contact IC label is attached to an adherend.
[Solution]
As shown in FIG. 2, the non-contact IC label main body 11 is attached to an adherend 20, for example, a cardboard box, with an adhesive 2. When the non-contact IC label main body 11 is to be peeled off from the adherend 20 in recycling the adherend 20, the surface of the pseudo adhesive layer 4 that contacts the sticking substrate 3 is peeled off from the peel start portion 12. . Therefore, the non-contact IC body 7 is peeled off as the peeling portion 15 while being sandwiched between the surface base material 9 and the adhesive layer 8 and the pseudo adhesive layer 4, and the adherend 20 has the adhesive layer 2. And the sticking base material 3 will be in the state which remained as the sticking part 16. FIG. Therefore, the non-contact IC label main body 11 can be separated into a peeling portion 15 including the non-contact IC main body 7 that needs to be separated and a sticking portion 16 similar to a general adhesive label.
[Selection] Figure 2

Description

The present invention relates to a non-contact IC label including a non-contact IC main body composed of an IC chip and an antenna capable of writing and erasing data by wireless communication, and in particular, the non-contact IC main body can be peeled off and collected. This relates to a non-contact IC label.

Conventionally, in product management in manufacturing, distribution, sales, etc., an automatic recognition system using a barcode in which predetermined information is encoded is used. This barcode can instantaneously read predetermined information encoded by a barcode reader. For this reason, for example, merchandise management is performed by attaching a bar code label in which merchandise information is encoded and printed. However, the amount of information that can be encoded by a barcode is limited, a large amount of information cannot be encoded, and information such as writing new information and erasing unnecessary information cannot be updated.

For this reason, recently, a system called automatic recognition by non-contact communication called RFID (Radio Frequency Identification) has attracted attention. In this system, information is stored in an IC chip, and an antenna for transmitting and receiving information is connected to the IC chip to form a non-contact IC body. The non-contact IC main body and the reader / writer antenna communicate with each other by radio waves, and exchange data and update the stored information of the IC chip.

The non-contact IC main body forms a loop coil antenna by transferring a copper foil or an aluminum foil or printing a copper paste or a silver paste on one surface of a plastic film or the like, and an IC is formed on the loop coil antenna. A chip is connected. Currently, the manufacturing cost of the non-contact IC main body is high, but if the production volume increases and the manufacturing cost becomes low in the future, it will be used in large quantities like the current barcode label and discarded as it is. It is predicted that However, since the non-contact IC main body is composed of an IC chip and an antenna made of a metal material, it is largely classified as a non-combustible material as waste. Therefore, the non-contact IC body attached to the adherend of the combustible material must be separated from the adherend of the combustible material and separated as an incombustible material.

However, a non-contact IC label provided with such a non-contact IC main body uses a strong adhesive to prevent troubles that peel off from the adherend. It was difficult to do. For this reason, there is a problem that peeling the non-contact IC label from the adherend is troublesome and troublesome.

A non-contact type characterized in that an IC circuit having an antenna unit and an information storage unit for transmitting and receiving data in a non-contact manner is included in a base sheet, an adhesive portion is formed on the back surface, and held on a release mount. There are the following publications as formula IC labels.

Japanese Patent Application Laid-Open No. 11-134460.

The present invention has been made in view of the above problems. A non-contact IC label that can be easily peeled off and collected after a non-contact IC label is attached to an adherend. The issue is to provide.

In order to solve the above problems, the present invention has the following configuration.
The gist of the invention of claim 1 is formed on a release paper, an adhesive layer formed on the release paper, an adhesive substrate provided on the adhesive layer, and the adhesive substrate. A pseudo-adhesive layer that loses its adhesiveness once peeled off, a non-contact IC body comprising an IC chip and an antenna capable of writing and erasing data by wireless communication provided on the pseudo-adhesive layer, and at least the above-mentioned The present invention relates to a non-contact IC label formed by laminating an adhesive layer formed on a non-contact IC body and a surface base material provided on the adhesive layer.
The gist of the invention described in claim 2 is that a peeling start portion is formed by applying a printing layer to the surface of the adhesive base material to weaken the adhesive force between the surface of the adhesive base material and the pseudo adhesive layer. The non-contact IC label according to claim 1, wherein the non-contact IC label is provided.
The gist of the invention described in claim 3 is that the pseudo adhesive layer is peeled off from the surface of the adhesive substrate by applying a cut from the surface of the surface substrate to the surface of the adhesive substrate. The non-contact IC label according to claim 1, further comprising a peeling start portion.

The present invention includes a release paper, a pressure-sensitive adhesive layer formed on the release paper, a sticking base material provided on the pressure-sensitive adhesive layer, and once peeled once formed on the sticking base material. A pseudo-adhesive layer that loses power, a non-contact IC body that is provided on the pseudo-adhesive layer and can be written and erased by wireless communication, and an antenna, and at least on the non-contact IC body Since the non-contact IC label is formed by laminating the formed adhesive layer and the surface base material provided on the adhesive layer, after peeling the release paper and sticking it to the adherend It can be easily peeled off from the pseudo adhesive layer, and the non-contact IC main body located above the pseudo adhesive layer can be peeled and recovered.

Next, the non-contact IC label according to the present invention will be described with reference to FIGS. First, a first embodiment of a non-contact IC label according to the present invention will be described with reference to FIGS. FIG. 1 is a schematic sectional view of a non-contact IC label according to the first embodiment. FIG. 2 is a schematic cross-sectional view in which the non-contact IC label of the first embodiment is attached to an adherend.

A non-contact IC label 10 shown in FIG. 1 includes a release paper 1, an adhesive layer 2 formed on the release paper 1, an adhesive substrate 3 provided on the adhesive layer 2, and the adhesive A pseudo adhesive layer 4 that loses its adhesiveness once peeled once formed on the base material 3, and an IC chip 5 and an antenna provided on the pseudo adhesive layer 4 and capable of writing and erasing data by wireless communication 6, a non-contact IC main body 7 composed of 6, at least an adhesive layer 8 formed on the non-contact IC main body 7, and a surface base material 9 provided on the adhesive 8 layer. When sticking to an adherend (not shown), the release paper 1 is peeled off and the non-contact IC label main body 11 is attached.

Each configuration will be described below. As the base material of the release paper 1, glassine paper or kraft paper is generally used, but when printing on the surface base material 9, glassine paper having high strength and excellent smoothness is suitable. Further, on one surface of the release paper 1 that is in contact with the pressure-sensitive adhesive layer 2, a release agent layer mainly using silicone is provided for release treatment.

The pressure-sensitive adhesive layer 2 can be an emulsion-based, solvent-based, or hot-melt-based pressure-sensitive adhesive. The material can be any material such as acrylic or rubber, and can be formed using a suitable combination of pressure-sensitive adhesives. In addition, the strength of the pressure-sensitive adhesive is such that it is used for applications that do not need to be peeled off once applied (JIS Z 0237 180 ° peeling method, 700 g / 25 mm or more). A pressure-sensitive adhesive called strong viscosity is used.

The base material 3 is a synthetic paper that is processed into a fiber like paper by adding a filler to paper such as fine paper, coated paper or art paper, films such as polypropylene or polyester (polyethylene terephthalate), polyethylene or polypropylene, etc. Paper, simple substances, laminates, and composite materials can be used.

The pseudo-adhesive layer 4 is composed of an adhesive base material 3 located in a lower layer thereof, a non-contact IC main body 7 located in an upper layer thereof, and an adhesive layer 8 in the periphery thereof made of a thermoplastic resin such as polyurethane or polyester. It is temporarily bonded by thermal fusion, and once peeled, it loses its adhesiveness and will not be bonded again.

As described above, the non-contact IC body 7 forms the loop coil antenna 6 by transferring copper foil or aluminum foil or printing copper paste or silver paste on one surface of a plastic film or the like. An IC chip 5 including a storage unit, a power supply rectification unit, a transmission unit, a reception unit, and the like is connected to the loop coil antenna 6.

The adhesive layer 8 is made of a general adhesive such as a synthetic resin such as polyvinyl acetate, chloroprene rubber, urea resin, and epoxy resin, or a synthetic rubber, and the same adhesive as the adhesive layer 2 described above. It may be formed.

The surface base material 9 can be the same as the above-mentioned pasting base material 3, and when printing using an ink ribbon, a surface coat suitable for receiving the ink ribbon is applied, It is also possible to use a heat-sensitive substrate provided on the surface with a heat-sensitive color-developing layer that develops color when added.

The non-contact IC label main body 11 from which the release paper 1 located at the lowermost layer is peeled off from the non-contact IC label 10 is attached to an adherend 20 such as a cardboard box by the adhesive layer 2 as shown in FIG. When the non-contact IC label main body 11 is to be peeled off from the adherend 20 in recycling the adherend 20, the surface of the pseudo adhesive layer 4 that contacts the sticking substrate 3 is peeled off from the peel start portion 12. . Therefore, the non-contact IC body 7 is peeled off as the peeling portion 15 while being sandwiched between the surface base material 9 and the adhesive layer 8 and the pseudo adhesive layer 4, and the adherend 20 has the adhesive layer 2. And the sticking base material 3 will be in the state which remained as the sticking part 16. FIG. Therefore, the non-contact IC label main body 11 can be separated into a peeling portion 15 including the non-contact IC main body 7 that needs to be separated and an adhesive portion 16 similar to a general adhesive label.

Next, a second embodiment of the non-contact IC label according to the present invention will be described with reference to FIGS. FIG. 3 is a schematic cross-sectional view of the non-contact IC label main body according to the second embodiment attached to an adherend. FIG. 4 is a schematic cross-sectional view of the peeling portion peeled from the non-contact IC label main body of the second embodiment. In addition, the same code | symbol is attached | subjected to the part same as previous embodiment, and detailed description is abbreviate | omitted.

Compared with the non-contact IC label main body 11 of the first embodiment, the non-contact IC label main body 21 of the second embodiment shown in FIG. 3 has a printing layer 13 on the surface of the sticking substrate 3. The peeling start part 22 which applied and weakened the adhesive force between the surface of the said adhesion | attachment base material 3 and the said pseudo adhesive layer 4 is provided.

The printing layer 13 can be formed using printing ink or varnish, and can be formed by solid printing or various net printing using the printing ink or varnish. By forming the printing layer 13 by the solid printing, the adhesion between the surface of the sticking substrate 3 and the pseudo adhesive layer 4 can be completely blocked. Moreover, the adhesive force between the surface of the sticking base material 3 and the pseudo adhesive layer 4 can be weakened by forming the printing layer 13 by the said various net printing. In other words, the effect of blocking the adhesive force can be adjusted by printing with the halftone dots varied. In addition, although the position which forms the said printing layer 13 may be either the side part or corner | angular part of the non-contact IC label main body 21, a corner | angular part is more preferable from the ease of peeling. In addition, a message such as “please peel from here” indicating that it is the peeling start portion 22 may be printed on the surface of the surface base material 9.

In this way, the non-contact IC label main body 21 weakens the adhesive force between the surface of the adhesive base 3 and the pseudo adhesive layer 4 by applying the printing layer 13 to the surface of the adhesive base 3. Since the peeling start portion 22 is provided, the surface of the pseudo adhesive layer 4 in contact with the printing layer 13 is peeled from the peeling start portion 22 as shown in FIG. Therefore, the non-contact IC body 7 is peeled off as the peeling portion 15 while being sandwiched between the surface base material 9 and the adhesive layer 8 and the pseudo adhesive layer 4, and the adherend 20 has the adhesive layer 2. And the sticking base material 3 will be in the state which remained as the sticking part 16. FIG.

Therefore, the non-contact IC label main body 21 according to the second embodiment is configured such that the printing layer 13 is applied to the surface of the sticking base material 3 and the surface of the sticking base material 3 and the pseudo adhesive layer 4. Since the peeling start part 22 with weakened adhesive strength is provided, the surface where the pseudo adhesive layer 4 is in contact with the printing layer 13 can be easily peeled from the peeling start part 22, and the pseudo adhesive layer 4 is continuously applied. The surface bonded to the landing base 3 can be peeled off. Further, the printing layer 13 is halftone printing, so that the effect of blocking the adhesive force can be adjusted. Therefore, the non-contact IC label main body 21 can be separated into the peeling portion 15 including the non-contact IC main body 7 that needs to be separated and the sticking portion 16 similar to a general adhesive label.

Next, a third embodiment of the non-contact IC label according to the present invention will be described with reference to FIGS. FIG. 5 is a schematic cross-sectional view of the non-contact IC label main body according to the third embodiment attached to an adherend. FIG. 6 is a schematic cross-sectional view of the peeling portion peeled from the non-contact IC label main body according to the third embodiment. FIG. 7 is a schematic cross-sectional view in which the non-contact IC label main body according to the third embodiment of another example is attached to an adherend.

The non-contact IC label main body 31 of the third embodiment shown in FIG. 5 is compared with the non-contact IC label main body 11 of the first embodiment from the surface of the surface base 9 to the sticking base. The peeling start part 32 at the time of peeling the said pseudo-adhesive layer 4 from the surface of the said sticking base material 3 by giving the cut | interruption 14 which reaches the surface of 3 is provided.

The cut line 14 extends from the surface of the surface base material 9 to the surface of the sticking base material 3 and penetrates through the pseudo adhesive layer 4 which is the lowermost surface when the peeling portion 15 shown in FIG. 6 is peeled off. Must be. Further, the position where the cut 14 is formed may be either a side part or a corner part from the surface of the surface base material 9 to the surface of the sticking base material 3 of the non-contact IC label main body 31. The corner portion is preferred for ease of use. In addition, a message such as “please peel from here” indicating the peeling start portion 32 may be printed on the surface of the surface base material 9.

In this way, the non-contact IC label main body 31 is provided with a cut 14 extending from the surface of the surface base material 9 to the surface of the sticking base material 3, and from the surface of the sticking base material 3 to the pseudo adhesive layer. Since the peeling start part 32 at the time of peeling 4 is provided, as shown in FIG. 6, the surface where the pseudo adhesive layer 4 contacts the sticking base material 3 is peeled from the peeling start part 32. Therefore, the non-contact IC body 7 is peeled off as the peeling portion 15 while being sandwiched between the surface base material 9 and the adhesive layer 8 and the pseudo adhesive layer 4, and the adherend 20 has the adhesive layer 2. And the adhesive base material 3 remain as the adhesive part 16, and the surface base material 9, the adhesive layer 8, and the pseudo adhesive layer separated by a cut 14 in a part of the adhesive part 16. 4 is also left.

Further, as shown in FIG. 7, a non-contact IC label main body 31 is formed in a state in which a cut 14 extending from the surface of the surface base material 9 to the surface of the sticking base material 3 is made and the residual portion 17 is removed in advance. It can also be. In this way, by removing the residual portion 17 in advance, the peeling start portion 32 becomes clear and the peeling portion 15 can be easily peeled off. Further, similarly to the second embodiment described above, a printing layer 13 (not shown) is applied to the surface of the sticking substrate 3 so that the surface of the sticking substrate 3 and the pseudo adhesive layer 4 are between. However, the peeling portion 15 can be peeled off more easily with this configuration.

As described above, the non-contact IC label main body 31 according to the third embodiment is provided with a cut 14 extending from the surface of the surface base material 9 to the surface of the adhesive base material 3. Since the peeling start part 32 at the time of peeling the said pseudo adhesive layer 4 from the surface was provided, the surface which the pseudo adhesive layer 4 adhere | attached on the sticking base material 3 from this peeling start part 32 is peeled easily. be able to. Therefore, the non-contact IC label main body 21 can be separated into the peeling portion 15 including the non-contact IC main body 7 that needs to be separated and the sticking portion 16 similar to a general adhesive label.

As described above, the non-contact IC label according to the present invention includes a non-contact IC label main body attached to an adherend, a peeling portion including a non-contact IC main body that needs to be separated from the pseudo adhesive layer, Since it can be separated into an adhesive part similar to an adhesive label, for example, if it is configured as a delivery slip that collects and collects a receipt stamp after delivery, it will inevitably be used as a shipping label for the transportation industry It can be collected separately. In addition to delivery labels, it can be used for general labels such as process management labels and content display labels. By adopting the configuration of the present invention, a peeling portion including a non-contact IC main body and a sticker similar to a general adhesive label are used. It can be separated into a landing part.

  In addition, this invention is not limited to the said embodiment, Embodiment can be changed suitably in the range of the technical idea of this invention. In addition, the number, position, shape, and the like of the constituent members are not limited to the above-described embodiment, and can be set to a suitable number, position, shape, and the like in practicing the present invention.

It is a non-contact IC label schematic sectional drawing of a 1st embodiment. It is the schematic sectional drawing which affixed the non-contact IC label main body of 1st Embodiment to the to-be-adhered body. It is the schematic sectional drawing which affixed the non-contact IC label main body of 2nd Embodiment to the to-be-adhered body. It is the schematic sectional drawing which peeled the peeling part from the non-contact IC label main body of 2nd Embodiment. It is the schematic sectional drawing which affixed the non-contact IC label main body of 3rd Embodiment to the to-be-adhered body. It is the schematic sectional drawing which peeled the peeling part from the non-contact IC label main body of 3rd Embodiment. It is the schematic sectional drawing which affixed the non-contact IC label main body of 3rd Embodiment of another example to the to-be-adhered body.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Release paper 2 Adhesive layer 3 Adhesive base material 4 Pseudo-adhesive layer 5 IC chip 6 Antenna 7 Non-contact IC main body 8 Adhesive layer 9 Surface base material 10 Non-contact IC label 11, 21, 31 Non-contact IC label main body 12, 22, 32 Peeling start part 13 Print layer 14 Cut 15 Peeling part 16 Adhering part 17 Residual part 20 Substrate

Claims (3)

Release paper, pressure-sensitive adhesive layer formed on the release paper, adhesive substrate provided on the adhesive layer, and pseudo-adhesion that loses adhesive properties once peeled off on the adhesive substrate An adhesive layer formed on the pseudo-adhesive layer, a non-contact IC body including an IC chip and an antenna capable of writing and erasing data by wireless communication, and an adhesive formed on at least the non-contact IC body A non-contact IC label formed by laminating an agent layer and a surface base material provided on the adhesive layer. The peeling start part which gave the printing layer to the surface of the said sticking base material, and weakened the adhesive force between the surface of the said sticking base material and the said pseudo-adhesive agent layer was provided. Non-contact IC label. It is characterized by providing a peeling start part when peeling the pseudo adhesive layer from the surface of the sticking substrate by giving a cut from the surface of the surface base material to the surface of the sticking substrate. The non-contact IC label according to claim 1.

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