JP2003037325A - Light emitting module and method of assembling light emitting module - Google Patents

Abstract

(57) [Problem] To improve the durability by simplifying the structure, to reduce the manufacturing cost, and to cope with an increase in the output and lamination of laser diode bars. A laser diode bar (3), an insulating plate (4) juxtaposed to the laser diode bar (3), a conductive plate (6) provided on one end surface of the laser diode bar (3), and a conductive plate (6) provided on the insulating plate (4) A configuration including a conductive block 7 in contact with the plate 6 is adopted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting module having a laser diode bar and a method of assembling the light emitting module.

[0002]

2. Description of the Related Art FIG. 11 is a perspective view of a light emitting module according to a first conventional example. In the following description, the X direction is the front side and the Y direction is the upper side in the drawings. As shown in FIG. 11, a laser diode bar 112 having a plurality of laser emission points on the emission surface is joined to the upper surface of the conductive submount base 111 by soldering, and further,
The upper plate 113 is joined to the upper surface of the laser diode bar 112 by soldering. Upper plate 1
On the upper surface of 13, as shown by a broken line, an energizing electrode installation portion 113a for installing an energizing electrode is provided.

In the light emitting module as described above, in order to obtain a larger output, a plurality of light emitting modules may be stacked in the Y direction of FIG. When the light emitting modules are stacked, the upper light emitting module and the lower light emitting module are stacked via a conductive heat sink (not shown). However, when the current-carrying electrode of the upper plate is soldered to the heat sink, the laser diode bar 112 is subjected to a compressive force because it is soldered under pressure from the Y direction or the direction opposite to the Y direction. Therefore, there is a problem that the performance of the laser diode bar 112 is adversely affected.

In order to solve such a problem,
According to the conventional example of No. 3, a technique for avoiding applying a compressive force to the laser diode bar has been proposed.

FIG. 12 is a perspective view of a light emitting module according to a second conventional example. As shown in FIG. 12, the laser diode bar 122 is formed on the upper surface of the submount base 121.
And the insulating plate 123 are arranged side by side and joined by soldering,
The upper plate 124 is joined to the upper surface of the insulating plate 123 by soldering. Also, the laser diode bar 122
The upper plate 124 and the upper plate 124 are wire-bonded by using a gold wire 125 to establish electrical continuity. On the upper surface of the upper plate 124, as shown by a broken line, an energizing electrode installation portion 124a for installing an energizing electrode is provided.

FIG. 13 is a perspective view of a light emitting module according to a third conventional example. As shown in FIG. 13, the laser diode bar 132 and the insulating plate 133 are aligned and soldered on the upper surface of the submount base 131, and the upper plate is placed so as to cover the upper surfaces of the laser diode bar 132 and the insulating plate 133. 134 are joined by solder. Insulation plate 1 on the upper surface of the upper plate 134
As shown by a broken line, a portion directly above 33 is provided with an energizing electrode installation portion 134a for installing an energizing electrode.

[0007]

In the light emitting module according to the second conventional example, when the current-carrying electrode of the upper plate is soldered to the heat sink, the laser diode bar 1
Since no compressive force is applied to 12, the performance of the laser diode bar 112 is not adversely affected. However, the laser diode bar 122 and the upper plate 1
Since the diameter of the gold wire 125 for wire-bonding 24 and 24 cannot be made very large, there is a problem that the current that can be supplied to the laser diode bar 122 is limited. Further, it is necessary to connect the gold wire 125 to each laser diode, which increases the number of manufacturing processes, complicates the structure of the device, and raises the cost. Furthermore, disconnection may occur, and the possibility of failure increases.

Also, in the light emitting module according to the third conventional example, the compressive force is not applied to the laser diode bar 112 when the energizing electrode of the upper plate is soldered to the heat sink, so that the performance of the laser diode bar 112 is adversely affected. It never comes out. However, the thickness of the laser diode bar 132 and the thickness of the insulating plate 133 must be the same. FIG. 14A is a side view showing the first bonding state when the thickness of the laser diode bar 132 is thinner than the thickness of the insulating plate 133, and FIG.
The thickness of the laser diode bar 132 is equal to that of the insulating plate 133.
FIG. 6 is a cross-sectional view showing a first joining state in the case where the thickness is larger than the thickness of FIG. Further, FIG. 15A shows a laser diode bar 1
Second when the thickness of 32 is thinner than the thickness of the insulating plate 133
15B is a cross-sectional view showing the bonded state of FIG. 15B, and FIG. 15B is a cross-sectional view showing the second bonded state when the thickness of the laser diode bar 132 is thicker than the thickness of the insulating plate 133. When joined as shown in FIGS. 14A and 14B, since the upper plate 134 is joined while being inclined, a gap is created between the laser diode bar 132 and the insulating plate 133. As a result, the solder cannot be uniformly joined and a large current cannot be supplied. In addition, FIG.
When bonded as shown in (a) and (b), a gap is created on the upper surfaces of the laser diode bar 132 and the insulating plate 133, respectively. As a result, they cannot be evenly joined with solder and a large current cannot be supplied.

Further, FIG. 14 (a), FIG. 14 (b) and FIG.
When bonded as shown in FIG. 5 (b), even if the current-carrying electrode is installed in the portion 134a surrounded by the broken line on the upper surface of the upper plate 134 on the insulating plate 133 side, in the case of stacking the laser diode bar 132. Load is applied to. As a result, the laser diode bar 132 is distorted, which adversely affects the performance of the laser diode bar 132.

Further, in recent years, in particular, there has been a demand for a laser diode bar having a large output and a multilayer structure, and a light emitting module for a laser diode bar corresponding thereto has been demanded.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to improve durability by simplifying the structure and reduce the manufacturing cost. It is another object of the present invention to provide a light emitting module and a method for assembling the light emitting module, which can cope with an increase in output and stacking of the laser diode bar.

[0012]

According to a first aspect of the present invention, there is provided a laser diode bar, an insulating plate arranged in parallel with the laser diode bar, and a conductive plate provided on one end surface of the laser diode bar. And a conductive block provided on the insulating plate and in contact with the conductive plate.

As described above, since the conductive plate and the conductive block are used instead of the gold wire for conduction, the structure can be simplified, the durability is enhanced, and the manufacturing cost can be reduced. it can. Further, by disposing the conductive plate only on one end surface (upper surface) of the laser diode bar, the conductive plate is evenly joined by solder or the like without tilting on the upper surface of the laser diode bar.
As a result, a large current can be supplied, and a large output of the laser diode bar can be dealt with. Further, by disposing the conductive block on the insulating plate so as to abut the conductive plate, it is possible to install a current-carrying electrode on the surface of the conductive block opposite to the insulating plate or stack a plurality of light emitting modules. It is possible to avoid applying a compressive force to the laser diode bar.

The invention of the light emitting module according to claim 2 is
The laser diode bar, the insulating plate, the submount base on which the laser diode bar and the insulating plate are mounted, the conductive plate provided on the surface of the laser diode bar opposite to the submount base, and the insulating plate sub. The conductive block is provided on the surface opposite to the mount base and contacts the conductive plate.The distance from the end of the conductive block opposite the submount base to the submount base is the submount of the conductive plate. Use a configuration that is larger than the distance from the end opposite the base to the submount base.

Thus, the distance from the end of the conductive block opposite the submount base to the submount base is greater than the distance from the end of the conductive plate opposite the submount base to the submount base. Since it is large, it is possible to stack another light emitting module by installing another submount base on the surface of the conductive block opposite to the submount base. Further, since the conductive plate and the conductive block are used instead of using the gold wire for conduction, the structure can be simplified, the durability is enhanced, and the manufacturing cost can be reduced. Further, by disposing the conductive plate only on one end surface (upper surface) of the laser diode bar, the conductive plate is evenly joined by solder or the like without tilting on the upper surface of the laser diode bar. As a result, a large current can be supplied, and a large output of the laser diode bar can be dealt with. Further, by disposing the conductive block on the insulating plate so as to abut the conductive plate, it is possible to install a current-carrying electrode on the surface of the conductive block opposite to the insulating plate or stack a plurality of light emitting modules. It is possible to avoid applying a compressive force to the laser diode bar.

According to a third aspect of the present invention, in the light emitting module according to the first or second aspect, the conductive plate and the conductive block are formed so that a groove is formed at a portion where the conductive plate and the conductive block contact each other. At least one of them has an inclined surface that is inclined at an acute angle with respect to the insulating plate.

With this structure, since the groove is formed at the portion where the conductive plate and the conductive block are in contact with each other, it is possible to easily join the two by using solder or the like. Further, since the conductive plate is in contact with the conductive block, the position of the conductive plate does not shift in the horizontal direction when the solder or the like solidifies and contracts. Therefore, no distortion occurs in the laser diode bar.

According to a fourth aspect of the present invention, in the light emitting module according to the first or second aspect, the conductive plate has a bent portion whose one end is bent in a direction opposite to a surface having the laser diode bar, and the conductive plate is provided. The block has a configuration in which a portion of the block that abuts the bent portion of the conductive plate has an inclined surface that is inclined at an acute angle with respect to the insulating plate.

As described above, by using the conductive plate having the bent portion, the manufacturing cost can be reduced. Further, it is possible to cope with a large output of the laser diode bar without hindering supply of a large current.
Furthermore, if a flexible metal or a heat-treated oxygen-free copper plate is used for the conductive plate, even if a load is applied to the conductive block due to lamination or the like and the insulating plate is compressed, the conductive plate is deformed and its displacement is prevented. Since it absorbs, no distortion occurs in the laser diode bar. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate.

According to a fifth aspect of the present invention, in the light emitting module according to the first or second aspect, the conductive block is
The configuration is such that an opening having an L-shaped cross section is provided at a portion that comes into contact with the conductive plate.

As described above, since the conductive block is provided with the opening having an L-shaped cross section at the portion in contact with the conductive plate, it is possible to easily join the substantially rectangular conductive plate. If a flexible metal or a heat-treated oxygen-free copper plate is used for the conductive plate, even if a load is applied to the conductive block due to lamination or the like and the insulating plate is compressed, the conductive plate deforms and absorbs the displacement. Therefore, no distortion occurs in the laser diode bar. Therefore, instead of using a rigid body such as AlN for the insulating plate, silicone rubber,
An elastic body such as urethane rubber can also be used.

According to a sixth aspect of the present invention, in the light emitting module according to the first or second aspect, the conductive plate has a curved portion having an inverted U-shaped cross section at one end, and the conductive block is an insulating plate. A configuration is provided in which a concave portion is provided on the opposite surface, and the end portion of the curved portion and the concave portion abut.

As described above, by using the conductive plate having the curved portion having an inverted U-shaped cross section at one end, the manufacturing cost of the conductive plate can be reduced. Further, it is possible to cope with a large output of the laser diode bar without hindering supply of a large current. If a flexible metal or a heat-treated oxygen-free copper plate is used for the conductive plate, even if a load is applied to the conductive block due to lamination or the like and the insulating plate is compressed, the conductive plate deforms and absorbs the displacement. Therefore, no distortion occurs in the laser diode bar. In particular, the conductive plate has one end formed in an inverted U shape, and thus has a large property. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate.

According to a seventh aspect of the present invention, there is provided a method of assembling a light emitting module, the step of arranging a laser diode bar and an insulating plate side by side, the step of installing a conductive plate on one end surface of the laser diode bar, and the conductive plate. And a step of providing a conductive block on the insulating plate so as to abut.

According to an eighth aspect of the invention, in the method for assembling the light emitting module according to the seventh aspect, the method includes a step of providing the laser diode bar and the insulating plate on the submount base.

As described above, since the conductive plate and the conductive block are used instead of the gold wire for conduction, the structure can be simplified, the durability is enhanced, and the manufacturing cost can be reduced. it can. Further, by disposing the conductive plate only on one end surface (upper surface) of the laser diode bar, the conductive plate is evenly joined by solder or the like without tilting on the upper surface of the laser diode bar.
As a result, a large current can be supplied, and a large output of the laser diode bar can be dealt with. Further, by disposing the conductive block on the insulating plate so as to abut the conductive plate, it is possible to install a current-carrying electrode on the surface of the conductive block opposite to the insulating plate or stack a plurality of light emitting modules. It is possible to avoid applying a compressive force to the laser diode bar.

According to a ninth aspect of the present invention, in the method for assembling the light emitting module according to the seventh or eighth aspect, the conductive plate is formed so that a groove is formed at a portion where the conductive plate and the conductive block are in contact with each other. And a structure including a step of providing at least one of the conductive blocks with an inclined surface inclined at an acute angle with respect to the insulating plate.

With this structure, since the groove is formed at the portion where the conductive plate and the conductive block are in contact with each other, it is possible to easily join the two by using solder or the like. Further, since the conductive plate is in contact with the conductive block, the position of the conductive plate does not shift in the horizontal direction when the solder or the like solidifies and contracts. Therefore, no distortion occurs in the laser diode bar.

According to a tenth aspect of the present invention, in the method for assembling the light emitting module according to the seventh or eighth aspect,
A step of providing a bent portion that bends in a direction opposite to the surface having the laser diode bar at one end of the conductive plate;
And a step of providing an inclined surface that is inclined at an acute angle with respect to the insulating plate at a portion of the conductive block that comes into contact with the bent portion of the conductive plate.

As described above, by using the conductive plate having the bent portion, the manufacturing cost can be reduced. Further, it is possible to cope with a large output of the laser diode bar without hindering supply of a large current.
Furthermore, if a flexible metal or a heat-treated oxygen-free copper plate is used for the conductive plate, even if a load is applied to the conductive block due to lamination or the like and the insulating plate is compressed, the conductive plate is deformed and its displacement is prevented. Since it absorbs, no distortion occurs in the laser diode bar. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate.

The invention described in claim 11 is the method for assembling the light emitting module according to claim 7 or 8,
A configuration including a step of providing an opening having an L-shaped cross section at a portion of the conductive block that contacts the conductive plate is adopted.

As described above, since the conductive block is provided with the opening having an L-shaped cross section at the portion in contact with the conductive plate, it is possible to easily join the substantially rectangular conductive plate. If a flexible metal or a heat-treated oxygen-free copper plate is used for the conductive plate, even if a load is applied to the conductive block due to lamination or the like and the insulating plate is compressed, the conductive plate deforms and absorbs the displacement. Therefore, no distortion occurs in the laser diode bar. Therefore, instead of using a rigid body such as AlN for the insulating plate, silicone rubber,
An elastic body such as urethane rubber can also be used.

According to a twelfth aspect of the present invention, in the method for assembling the light emitting module according to the seventh or eighth aspect,
A step of providing a curved portion having an inverted U-shaped cross section at one end of the conductive plate, a step of providing a concave portion on the surface of the conductive block opposite to the insulating plate, and engaging the end portion of the curved portion with the concave portion. A configuration including a process is adopted.

As described above, by using the conductive plate having the curved portion having an inverted U-shaped cross section at one end, the manufacturing cost of the conductive plate can be reduced. Further, it is possible to cope with a large output of the laser diode bar without hindering supply of a large current. If a flexible metal or a heat-treated oxygen-free copper plate is used for the conductive plate, even if a load is applied to the conductive block due to lamination or the like and the insulating plate is compressed, the conductive plate deforms and absorbs the displacement. Therefore, no distortion occurs in the laser diode bar. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate. In particular, the conductive plate has one end formed in an inverted U shape, and thus has a large property. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate.

According to a thirteenth aspect of the present invention, in the method of assembling the light emitting module according to the twelfth aspect, the step of engaging the end portion of the curved portion with the concave portion is performed after the conductive block is installed on the insulating plate and then the curved portion is curved. The configuration includes one of a step of pressing the portion toward the concave portion or a step of placing the conductive block on the insulating plate after the concave portion is brought into contact with the end portion of the curved portion.

In this way, after the conductive block has been installed on the insulating plate in advance, the curved portion is pressed toward the concave portion, or after the concave portion is brought into contact with the end portion of the curved portion,
By disposing the conductive block on the insulating plate, it becomes possible to easily engage the end of the curved portion with the recess.

[0037]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In each figure, the same elements are designated by the same reference numerals, and overlapping description will be omitted. Further, the dimensional ratios in the drawings do not always match those described. In the following description, the X direction is the front side and the Y direction is the upper side in the drawings.

(Embodiment 1) Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of the light emitting module 1 according to the first embodiment.
The direction is the front side. 2 is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 3 is a cross-sectional view showing a state before joining the conductive blocks.

As shown in these drawings, the laser diode bar 3 and the insulating plate 4 are provided on the upper surface of the submount base 2.
And are arranged side by side with a gap 5 therebetween, and are respectively joined by solder. Here, since the submount base 2 sufficiently dissipates heat generated from the laser diode bar 3 and is electrically connected to the laser diode bar 3, a material having excellent thermal conductivity and electrical conductivity, such as copper, It is composed of copper tungsten, molybdenum, and the like. An upper plate 6 as a conductive plate made of, for example, copper is joined to the upper surface of the laser diode bar 3 by soldering. Further, a conductive block 7 made of copper or the like is installed on the upper surface of the insulating plate 4 so as to contact the upper plate 6 and joined by soldering.

When viewed from above, the submount base 2 has a substantially rectangular shape in which the lateral width is longer than the longitudinal width, and the lateral width is substantially the same as the lateral width of the laser diode bar 3. Further, the submount base 2 is joined by solder onto a heat sink or the like (not shown).

The laser diode bar 3 has a structure in which a plurality of laser diodes are connected to each other and a plurality of laser emission points are provided on the emission surface, and emits a laser beam in the X direction.

The insulating plate 4 has a substantially rectangular shape in which the left-right width is longer than the front-back width when viewed from above, and the left-right width is substantially the same as the left-right width of the laser diode bar 3. The height is smaller than the height of the laser diode bar 3.

The upper plate 6 has a substantially rectangular shape in which the left-right width is longer than the front-rear width when viewed from the upper surface. The left-right width is substantially the same as the left-right width of the laser diode bar 3, and the front-back width is longer than the combined front-back width of the laser diode bar 3 and the gap 5. Since the front end surface of the upper plate 6 is substantially aligned with the front end surface of the laser diode bar 3, the rear end surface 6a projects over the insulating plate 4 beyond the gap 5. In addition, the upper plate 6 includes a rear end surface 6
A slanted surface 6b formed by cutting out is provided over a. The lateral width of the inclined surface 6b is shorter than the lateral width of the upper plate 6.

The conductive block 7 has a substantially rectangular shape in which the left-right width is longer than the front-back width when viewed from above. The left-right width is substantially the same as the left-right width of the laser diode bar 3, and the front-back width is shorter than the left-right width of the insulating plate 4. Further, the conductive block 7 is provided with an inclined surface 7b formed by cutting out from the upper surface to the front end surface 7a. Further, when the conductive block 7 is installed on the upper surface of the insulating plate 4, the height of the upper surface of the conductive block 7 is higher than the height of the upper surface of the upper plate 6, and the height of the lower end of the inclined surface 7b of the conductive block 7 is The height of the lower end of the inclined surface 6b provided on the upper plate 6 is substantially the same. The lateral width of the inclined surface 7b is substantially the same as the lateral width of the inclined surface 6b.

Next, a method of connecting the conductive block 7 will be described with reference to FIGS. As shown in FIG. 3, in the conductive block 7, the front end face 7 a is directed in the direction of arrow A, and the front end face 7 a is located at the rear end face 6 of the upper plate 6.
It is installed on the upper surface of the insulating plate 4 so as to come into contact with a. As a result, the inclined surface 6b and the inclined surface 7b form a solder pool 8 having a V-shaped cross section in the left-right direction.

At this time, solder is vapor-deposited on the upper surface of the insulating plate 4 and the lower surface of the conductive block 7 in advance. Needless to say, the melting point of this solder is lower than the melting point of the solder used when joining the submount base 2, the laser diode bar 3, the insulating plate 4, and the upper plate 6. It is also possible to fix the upper surface of the insulating plate 4 and the lower surface of the conductive block 7 with an adhesive. In this case, solder 9
An adhesive that withstands the melting point of is necessary, but a Si-based adhesive is sufficient.

Next, as shown in FIG.
The solder 9 having a melting point substantially the same as that of the vapor-deposited solder is inserted and heated to join the conductive blocks 7. At this time, since the upper plate 6 is in contact with the front end surface 7a of the conductive block 7 at the rear end surface 6a, the position of the upper plate 6 does not shift in the horizontal direction when the solder 9 solidifies and contracts. Therefore, no distortion occurs in the laser diode bar 3. The solder 9 may have any shape such as a sphere, a wire, or a foil.

As described above, since the upper plate 6 and the conductive block 7 are used for conduction without using the gold wire, the structure can be simplified, the durability is enhanced, and the manufacturing cost can be reduced. it can. In addition, by disposing the upper plate 6 only on the upper surface of the laser diode bar 3, the upper plate 6 can be placed on the laser diode bar 3.
The solder is evenly joined without tilting on the upper surface of the. As a result, a large current can be supplied, and a large output of the laser diode bar 3 can be dealt with.
Further, by disposing the conductive block 7 on the upper surface of the insulating plate 4, even if an energizing electrode is installed on the upper surface of the conductive block 7 or a plurality of light emitting modules 1 are stacked, a compressive force is exerted on the laser diode bar 3. It is possible to avoid joining.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 4 shows the second
3 is a cross-sectional view of the light emitting module 10 according to the embodiment of FIG. The difference from the first embodiment shown in FIG. 1 is the shape of the upper plate.

The upper plate 16 has a rear end of approximately 90.
The metal plate is bent upward and formed in an L-shaped cross section in the left-right direction. The left-right width is shorter than the left-right width of the inclined surface 7b of the conductive block 7. The height of the lower surface of the upper plate 16 is higher than the height of the lower end of the inclined surface 7b of the conductive block 7, and the height of the rear edge is lower than the height of the upper surface of the conductive block 7.

As shown in FIG. 4, the conductive block 7 is installed on the upper surface of the insulating plate 4 so that the inclined surface 7b abuts on the bent portion of the upper plate 16, whereby the solder pool 18 is formed. Next, the solder 9 is inserted into the solder reservoir 18 and heated to join the conductive blocks 7.

As described above, by using the upper plate 16 made of a metal plate having an L-shaped cross section, the manufacturing cost of the upper plate can be further reduced. Further, since it is a metal plate, it does not prevent supply of a large current, and can cope with a large output of the laser diode bar 3. Furthermore, if a flexible metal or a heat-treated oxygen-free copper plate is used for the upper plate 16,
Even if a load is applied to the conductive block 7 due to lamination or the like and the insulating plate 4 is compressed, the upper plate 16 is deformed and absorbs the displacement, so that the laser diode bar 3 is not distorted. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate 4.

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIGS. Figure 5
6 is a cross-sectional view of the light emitting module 20 according to the third embodiment, and FIG. 6 is a cross-sectional view showing a state when solder is melted.
The difference from the first embodiment shown in FIG. 1 lies in the shape of the upper plate, the shape of the conductive block, and the connecting method thereof.

As shown in FIG. 5, the upper plate 26
Is a substantially rectangular metal plate whose right and left width is longer than the front and rear width when viewed from above, and the left and right width is shorter than the left and right width of the wall surface 27a of the conductive block 27 described later. Has become.

The conductive block 27, when viewed from above,
It has a roughly rectangular shape in which the left-right width is longer than the front-back width. The left-right width is substantially the same as the left-right width of the laser diode bar 3, and the front-back width is substantially the same as the front-back width of the insulating plate 4. Further, the conductive block 27 has a cutout portion 27c formed from a substantially vertical wall surface 27a and a substantially horizontal bottom surface 27b from the upper surface to the front end surface. Further, when the conductive block 27 is installed on the upper surface of the insulating plate 4, the height of the bottom surface 27b of the conductive block 27 is lower than the height of the lower surface of the upper plate 26, and the height of the upper surface of the conductive block 27. Is higher than the height of the upper surface of the upper plate 26.

Next, a method of connecting the conductive block 27 will be described with reference to FIG. As shown in FIG. 6, the conductive block 27 is installed on the upper surface of the insulating plate 4 so that the wall surface 27a contacts the rear edge of the upper plate 26, and the light emitting module 20 is tilted with the laser diode bar 3 facing upward. Hold in the state. As a result, the solder pool 28 is formed. Next, the solder 9 is inserted into the solder reservoir 28 and heated to join the conductive blocks 27.

As described above, by using the upper plate 26 of the substantially rectangular metal plate, the manufacturing cost of the upper plate can be further reduced. Also, because it is a metal plate, it does not prevent supplying a large current,
It is possible to cope with a large output of the laser diode bar 3. Further, if a flexible metal or a heat-treated oxygen-free copper plate is used for the upper plate 26, even if a load is applied to the conductive block 27 due to lamination or the like and the insulating plate is compressed, the upper plate 26 is deformed and its displacement is reduced. Therefore, the laser diode bar 3 is not distorted. Therefore, instead of a rigid body such as AlN, an elastic body such as silicon rubber or urethane rubber can be used for the insulating plate 4.

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described with reference to FIGS. Figure 7
[Fig. 8] is a sectional view of a light emitting module 30 according to a fourth embodiment, and Fig. 8 is a sectional view showing a state before deformation of an upper plate. The difference from the first embodiment shown in FIG. 1 lies in the shape of the upper plate, the shape of the conductive block, and the connecting method thereof.

As shown in FIG. 7, the upper plate 36
Is a metal plate whose rear end is formed in an inverted U-shape in cross section in the left-right direction.
Is shorter than the bottom surface 37b of the recess 37a.

The conductive block 37, when viewed from above,
It has a roughly rectangular shape in which the left-right width is longer than the front-back width. The left-right width is substantially the same as the left-right width of the laser diode bar 3, and the front-back width is substantially the same as the front-back width of the insulating plate 4. Further, the conductive block 37 has a recess 37a on the front side.
Have. The bottom surface 37b of the recess 37a is substantially horizontal,
It is lower than the height of the rear edge of the upper plate 36.

Next, a method of connecting the conductive block 37 will be described with reference to FIG. As shown in FIG. 8, the conductive block 37 is installed on the upper surface of the insulating plate 4. Then, a load is applied to the inverted U-shaped portion of the upper plate 36 in a substantially vertical downward direction in the direction of the arrow so that the rear edge of the upper plate 36 is deformed so as to contact the bottom surface 37b of the recess 37a of the conductive block 37. As a result, as shown in FIG.
8 is formed. At this time, the height of the vertex 36a of the inverted U-shaped portion of the upper plate 36 is lower than the height of the upper surface of the conductive block 37. Next, the solder 9 is inserted into the solder reservoir 38 and heated to join the conductive blocks 37.

As described above, by using the upper plate 36 made of a metal plate whose rear end is formed in an inverted U-shaped cross section, the manufacturing cost of the upper plate can be further reduced. Further, since it is a metal plate, it does not prevent supply of a large current, and can cope with a large output of the laser diode bar 3. Furthermore, the upper plate 3
If a flexible metal or a heat-treated oxygen-free copper plate is used for 6, even if a load is applied to the conductive block 37 due to lamination or the like and the insulating plate 4 is compressed, the upper plate 36 deforms and absorbs the displacement. So laser diode bar 3
There is no distortion. In particular, since the upper plate 36 is a metal plate whose rear end is formed in an inverted U shape, this property is large. Therefore, the insulating plate 4 is
An elastic body such as silicon rubber or urethane rubber may be used instead of a rigid body such as.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a sectional view of the light emitting module 40 according to the fifth embodiment, and FIG. 10 is a sectional view showing a connection state of the conductive blocks 37. The difference from the fourth embodiment shown in FIG. 7 lies in the shape of the upper plate, the shape of the insulating plate, and the method of connecting the upper plate and the conductive block.

As shown in FIG. 9, the upper plate 46
Is a metal plate whose rear end is formed in an inverted U-shaped cross section in the left-right direction, and the left-right width is the concave portion 3 of the conductive block 37.
It is shorter than the bottom surface 37b of 7a. Further, the height of the rear edge is substantially the same as the bottom surface 37b of the recess 37a when the conductive block 37 is installed on the upper surface of the insulating plate 44, and the height of the vertex 46a of the inverted U-shaped portion is It is lower than the height of the upper surface of the block 37.

The insulating plate 44 has a substantially rectangular shape in which the left-right width is longer than the front-back width when viewed from above, and the left-right width is substantially the same as the left-right width of the laser diode bar 3. The front-rear width is shorter than the front-rear width of the conductive block 37.

Next, a method of connecting the conductive block 37 will be described with reference to FIG. As shown in FIG. 10, the conductive block 37 is held so as to incline so that the front end face is downward, and the rear end edge of the upper plate 46 is made to slip into the recess 37 a of the conductive block 37. Next, the conductive block 37
Is rotated clockwise in the direction of the arrow and installed on the upper surface of the insulating plate 44. As a result, the rear edge of the upper plate 46 and the bottom surface 37b of the recess 37a of the conductive block 37 come into contact with each other to form the solder pool 48. Next, solder 9 in the solder pool 48
Insert and heat to join the conductive blocks.

As described above, by using the upper plate 46 made of a metal plate whose rear end is formed into an inverted U-shaped cross section, the manufacturing cost of the upper plate can be further reduced. Further, since it is a metal plate, it does not prevent supply of a large current, and can cope with a large output of the laser diode bar 3. Furthermore, the upper plate 4
If a flexible metal or a heat-treated oxygen-free copper plate is used for 6, the upper plate 46 deforms and absorbs the displacement even if a load is applied to the conductive block 37 due to lamination or the like and the insulating plate 44 is compressed. Therefore, no distortion occurs in the laser diode bar 3. Particularly, since the upper plate 46 is a metal plate whose rear end is formed in an inverted U shape, this property is large. Therefore, the insulating plate 44 is
Instead of a rigid body such as N, an elastic body such as silicon can be used.

In the above embodiment, the laser diode bar is bonded to the submount base. However, the laser diode bar is directly bonded to the heat sink without using the submount base. It is also possible to stack light emitting modules.

[0069]

The light emitting module according to the present invention is provided with a laser diode bar, an insulating plate arranged in parallel with the laser diode bar, a conductive plate provided on one end surface of the laser diode bar, and an insulating plate. , A conductive block that abuts the conductive plate.

As described above, since the conductive plate and the conductive block are used instead of the gold wire for conduction, the structure can be simplified, the durability is enhanced, and the manufacturing cost can be reduced. it can. Further, by disposing the conductive plate only on one end surface (upper surface) of the laser diode bar, the conductive plate is evenly joined by solder or the like without tilting on the upper surface of the laser diode bar.
As a result, a large current can be supplied, and a large output of the laser diode bar can be dealt with. Further, by disposing the conductive block on the insulating plate so as to abut the conductive plate, it is possible to install a current-carrying electrode on the surface of the conductive block opposite to the insulating plate or stack a plurality of light emitting modules. It is possible to avoid applying a compressive force to the laser diode bar.

[Brief description of drawings]

FIG. 1 is a perspective view of a light emitting module according to a first embodiment.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a cross-sectional view showing a state before joining the conductive blocks.

FIG. 4 is a sectional view of a light emitting module according to a second embodiment.

FIG. 5 is a sectional view of a light emitting module according to a third embodiment.

FIG. 6 is a cross-sectional view showing a state when solder is melted.

FIG. 7 is a sectional view of a light emitting module according to a fourth embodiment.

FIG. 8 is a cross-sectional view showing a state before the upper plate is deformed.

FIG. 9 is a sectional view of a light emitting module according to a fifth embodiment.

FIG. 10 is a cross-sectional view showing a connection state of conductive blocks.

FIG. 11 is a perspective view of a light emitting module according to a first conventional example.

FIG. 12 is a perspective view of a light emitting module according to a second conventional example.

FIG. 13 is a perspective view of a light emitting module according to a third conventional example.

FIG. 14 (a) is a side view showing the first joining state when the thickness of the laser diode bar is thinner than the thickness of the insulating plate. (B) It is sectional drawing which shows the 1st junction state when the thickness of a laser diode bar is thicker than the thickness of an insulating board.

FIG. 15A is a cross-sectional view showing a second bonding state when the thickness of the laser diode bar is thinner than the thickness of the insulating plate. (B) It is sectional drawing which shows the 2nd joining state when the thickness of a laser diode bar is thicker than the thickness of an insulating board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Light emitting module, 2 ... Submount base, 3 ... Laser diode bar, 4 ... Insulation plate, 5 ... Gap, 6 ... Upper plate, 6a ... Rear end surface, 6b ... Sloping surface, 7 ... Conductive block, 7a ... Front end surface , 7b ... Inclined surface, 8 ... Solder pool, 9 ... Solder, 10 ... Light emitting module, 16 ... Upper plate, 18 ... Solder pool, 20 ... Light emitting module, 2
6 ... Upper plate, 27 ... Conductive block, 27a ...
Wall surface, 27b ... Bottom surface, 27c ... Notch portion, 28 ... Solder pool, 30 ... Light emitting module, 36 ... Upper plate,
36a ... Apex, 37 ... Conductive block, 37a ... Recess, 3
7b ... bottom surface, 38 ... solder pool, 40 ... light emitting module,
44 ... Insulating plate, 46 ... Upper plate, 46a ... Apex, 48 ... Solder pool, 111 ... Submount base, 1
12 ... Laser diode bar, 113 ... Upper plate, 113a ... Energization electrode installation part, 121 ... Submount base, 122 ... Laser diode bar, 123 ... Insulation plate, 124 ... Upper plate, 124a ... Energization electrode installation part, 125 … Gold wire, 131… Submount base, 132… Laser diode bar, 133… Insulation plate,
134 ... upper plate, 134a ... energization electrode installation part.

Claims (13)

[Claims] 1. A laser diode bar, an insulating plate arranged in parallel with the laser diode bar, a conductive plate provided on one end surface of the laser diode bar, and a conductive plate provided on the insulating plate. A light-emitting module, comprising: a conductive block that abuts against. 2. A laser diode bar, an insulating plate, a submount base on which the laser diode bar and the insulating plate are mounted, and a surface of the laser diode bar opposite to the submount base. A conductive plate; and a conductive block provided on a surface of the insulating plate opposite to the submount base and abutting on the conductive plate. From an end of the conductive block opposite to the submount base. The light emitting module, wherein the distance to the submount base is greater than the distance from the end of the conductive plate opposite to the submount base to the submount base. 3. An inclined surface is provided on at least one of the conductive plate and the conductive block so that a groove is formed at a portion where the conductive plate and the conductive block contact each other. The light emitting module according to claim 1 or 2. 4. The conductive plate includes a bent portion whose one end is bent in a direction opposite to a surface having the laser diode bar, and the conductive block is inclined to a portion in contact with the bent portion of the conductive plate. A surface is provided, The surface is provided.
Alternatively, the light emitting module according to claim 2. 5. The light emitting module according to claim 1, wherein the conductive block is provided with an opening having an L-shaped cross section at a portion in contact with the conductive plate. 6. The conductive plate includes a curved portion having an inverted U-shaped cross section at one end, the conductive block includes a concave portion on a surface opposite to the insulating plate, and an end portion of the curved portion. The light emitting module according to claim 1 or 2, wherein the recess is in contact with the light emitting module. 7. A step of arranging a laser diode bar and an insulating plate side by side, a step of installing a conductive plate on one end face of the laser diode bar, and a step of insulating the conductive block so as to abut against the conductive plate. A method of assembling a light emitting module, comprising the step of providing on a plate. 8. The method for assembling a light emitting module according to claim 7, further comprising the step of providing the laser diode bar and the insulating plate on a submount base. 9. A step of providing an inclined surface on at least one of the conductive plate and the conductive block so that a groove is formed at a portion where the conductive plate and the conductive block contact each other. The method for assembling the light emitting module according to claim 7 or 8. 10. A step of providing a bent portion that bends in a direction opposite to a surface having the laser diode bar at one end of the conductive plate, and a portion of the conductive block that abuts the bent portion of the conductive plate, 9. The method for assembling a light emitting module according to claim 7, further comprising the step of providing an inclined surface. 11. The method for assembling a light emitting module according to claim 7, further comprising the step of providing an opening having an L-shaped cross section at a portion of the conductive block that abuts the conductive plate. . 12. A step of providing a curved portion having an inverted U-shaped cross section at one end of the conductive plate, a step of providing a concave portion on a surface of the conductive block opposite to the insulating plate, and a step of forming the curved portion. 9. The method for assembling a light emitting module according to claim 7, further comprising a step of engaging an end portion with the recess. 13. The step of engaging the end portion of the curved portion with the recessed portion, after the conductive block is installed on the insulating plate, pressing the curved portion toward the recessed portion, or the recessed portion 13. The method for assembling a light emitting module according to claim 12, further comprising one of the steps of placing the conductive block on the insulating plate after abutting the end of the curved portion.