JP2003034780A - Adhesive tape for laser dicing - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive tape for use in laser dicing that can be extensible and maintains linearity on extension without melting, breaking and scattering of an element when cutting and separating (dicing) a silicon wafer, a ceramic, glass and a metal with a water jet and a laser. SOLUTION: A pressure sensitive adhesive tape for use in laser dicing, in which a laser is guided by a water jet, is provided. A nonradiation curable pressure sensitive adhesive layer and a radiation curable pressure sensitive adhesive layer are formed on one surface of the tape substrate. The substrate can be penetrated by a jet water flow of the water jet, and the nonradiation curable pressure sensitive adhesive layer is set between the substrate and the radiation curable pressure sensitive adhesive layer.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an adhesive tape for laser dicing.

[0002]

2. Description of the Related Art Conventionally, when a semiconductor wafer on which a circuit pattern is formed is cut and divided into element pieces, that is, when so-called dicing processing is performed, the semiconductor wafer is previously attached to a radiation curable adhesive tape and then fixed. This wafer is cut along the element shape with a diamond blade (rotary round blade), and radiation such as light such as ultraviolet rays or ionizing radiation such as an electron beam is irradiated from the back surface of the adhesive tape to A method of shifting to the pickup process has been proposed.

The radiation-curable pressure-sensitive adhesive tape used in this system is a pressure-sensitive adhesive tape comprising a radiation-transmissive base material and a radiation-curable pressure-sensitive adhesive layer coated on the base material. This pressure-sensitive adhesive tape has a strong adhesive strength before irradiation with radiation and a property that the adhesive strength is significantly reduced after irradiation with radiation. Therefore, in the above method, it is easy to cut and separate the semiconductor wafer into element pieces in the dicing step, and even in the pick-up step after irradiation with radiation, regardless of the size of the element pieces, even a large element of, for example, 25 mm ² or more is used. There is an advantage that it can be picked up easily. Such adhesive tapes are disclosed in JP-A-60-196956 and JP-A-60-201.
642, JP-A-61-28572, JP-A 1-25
1737, JP-A-2-187478 and the like.

By the way, the conventional dicing apparatus is a method of cutting while rotating a diamond blade.
Therefore, when cutting into very small elements of 1 mm or less, the blade thickness is made as thin as possible to narrow the width of the scribe line, thereby increasing the number of elements that can be obtained from one wafer. However, even then, the cutting width becomes about 40 μm and the chipping (chip) of the element generated at the time of cutting has been a serious problem. Further, since the blade is thin, the service life is shortened, and the blade is easily damaged, which increases the running cost. On the contrary, when trying to cut thick metal, it is necessary to lengthen the blade edge, resulting in a blade thickness of 250 μm.
However, there was a limit to maintaining the strength of the blade. Moreover, when trying to cut a hard material such as glass, the cutting speed was very slow at 1 to 5 mm / s. Furthermore, since the diamond blade is a rotary round blade, the cutting shape is fixed and it cannot be cut into a free shape.

On the other hand, in recent years, a new processing apparatus utilizing a laser microjet method has been developed in which a water microjet and a laser are combined to cut a metal material. A processing device using such a laser / microjet system is, for example, SYNNOVA.
Laser Microjet (trade name) manufactured by the company can be used. When this device is used for semiconductor wafer dicing, an effect superior to that of the conventional dicing using a diamond blade is obtained. That is, by using a laser, it was expected that chipping of the element does not occur, the service life is long, there is no problem of quality deterioration due to blade damage, and even thick materials can be cut at high speed with a narrow scribe line.

However, when a laser microjet type device is used for semiconductor wafer dicing,
Conventional adhesive tapes have not always sufficiently solved the above problems.

[0007]

DISCLOSURE OF THE INVENTION According to the present invention, when a silicon wafer, ceramic, glass, metal or the like is cut and separated (dicing) together with a water jet by a laser, it does not melt and does not break, and the element does not fly. An object of the present invention is to provide a pressure-sensitive adhesive tape for laser dicing, which can be stretched and in which the material maintains straightness during stretching.

[0008]

Means for Solving the Problems As a result of intensive studies to achieve the above-mentioned object, the inventors of the present invention have used a non-radiation-curing film as a base material for a tape, using a film through which water (water jet) penetrates. It has been found that providing a mold adhesive layer between the substrate and the radiation-curable adhesive layer leads to a solution to the above problem. That is, the present invention is (1) an adhesive tape used for laser dicing in which a laser is guided by a water jet, wherein a non-radiation-curable adhesive layer and a radiation-curable adhesive layer are provided on one surface of a base material of the tape. And a non-radiation-curable pressure-sensitive adhesive layer provided between the base material and the radiation-curable pressure-sensitive adhesive layer. (2) An adhesive tape for laser dicing according to item (1), which is capable of transmitting a water stream having a width of at least 50 μm, and (3) a base material having a mesh structure. And the fiber diameter is 10 μm or more and less than 50 μm, the pressure-sensitive adhesive tape for laser dicing according to any one of (1) to (2), and (4) the structure of the base material. There porous, and wherein the pore size is 10 to 50 [mu] m (1)
To (3), the adhesive tape for laser dicing according to any one of (3), and (5) the base material is a rubber-like elastic body, (1) to (4). The adhesive tape for laser dicing is provided.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive tape for laser dicing of the present invention will be described in detail below. The adhesive tape of the present invention is an adhesive tape used for laser dicing in which a laser is guided by a water jet. The water micro jet method is a method of controlling a laser by using a water jet as a guide. When laser irradiation is performed in the air, the light diffuses, but when water is used as a medium, the laser light travels while refracting in the medium, so that the laser can be efficiently irradiated. The pressure of the water jet is preferably 30 to 70 MPa and is not limited to this, but if the water jet pressure is too small, it may be insufficient as a laser guide and the quality of the cut surface may deteriorate, and it is too large. When the product collides with a work (cutting object) or tape, the impact is too strong, causing blurring (flapping), which may also deteriorate the quality of the cut surface.

The pressure-sensitive adhesive tape of the present invention uses as a base material a film through which water (jet water flow) permeates. The diameter of the water jet that the base material passes through is the nozzle diameter used for the jetting (usually 50, 75, 100, 150, 200 μ
m). In the present invention, the preferred diameter of the water stream permeated by the substrate is 30 to 200 μm, more preferably 30 to 100 μm, and particularly preferably 50 to 100 μm. By using such a base material, the water of the water jet can flow out from the adhesive tape without accumulating between the adhesive tape and the wafer, and the problem that the tape melts and breaks can be solved.

In order for such a substrate to permeate water, the structure of the substrate is preferably mesh-like or porous. Examples of the substrate include non-woven fabric, hollow fiber, woven fabric, fibrous material such as polyamide (nylon) mesh used for electromagnetic wave shielding of PDP, and rubber-like elastic body, and non-woven fabric is particularly preferable. Even in the case of a non-woven fabric, it is desirable that the non-woven fabric exhibits non-oriented stretchability. The rubber-like elastic body may have a honeycomb structure.

When a fibrous material is used as the substrate, the fiber diameter is preferably 10 μm or more and less than 50 μm. A base material having a fiber diameter of 50 μm or more is not preferable because the flat portion is melted and fused to the chucking table. Further, if the diameter of the folded portion of the fiber is 50 μm or more, that portion will be melted, which is not preferable.

Further, the heat resistance of the substrate used is appropriately selected depending on the conditions of laser dicing such as cutting speed, laser output and water amount. What is necessary is to use a material that does not melt due to the heat during laser dicing.

The material of the substrate is polyethylene, polypropylene, ethylene-propylene copolymer, polybutene-
1, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, homopolymer or copolymer of α-olefin such as ionomer, polyethylene terephthalate, polycarbonate, engineering plastics such as polymethylmethacrylate, nylon-6 Polyamides such as nylon-6,6, nylon-12, and aramid, or thermoplastic elastomers such as polyurethane, styrene-ethylene-butene or pentene copolymers. Also, a mixture of two or more selected from these groups may be used, and can be arbitrarily selected depending on the adhesiveness to the pressure-sensitive adhesive layer. Of these, polypropylene, polyethylene terephthalate and nylon-6,6 are particularly preferable.

The thickness of the base material is preferably thin so as to prevent vibration of the material, and the base material is preferably thin as long as extensibility can be maintained because the base material is not cut. Therefore,
The thickness of the substrate is usually 30 to 300 μm, preferably 30 to 200 μm, and more preferably 50 to 20.
It is 0 μm, and particularly preferably 100 μm.

One side of the pressure-sensitive adhesive tape is composed of a pressure-sensitive adhesive layer obtained by applying a solution of an acrylic pressure-sensitive adhesive and drying it as in the conventional product. Such a pressure-sensitive adhesive layer includes a radiation-curable pressure-sensitive adhesive layer and a non-radiation-curable pressure-sensitive adhesive layer. The radiation referred to in the present invention means a light ray such as ultraviolet ray or an ionizing radiation such as an electron beam.

The acrylic pressure-sensitive adhesive contains a (meth) acrylic copolymer and a curing agent as essential components. The (meth) acrylic copolymer is obtained by, for example, copolymerizing a monomer (A) such as an acrylic acid alkyl ester and a monomer (B) having a functional group capable of reacting with a curing agent described later by a solution polymerization method according to a conventional method. It is obtained by polymerizing. The acrylic pressure-sensitive adhesive may be a copolymer of two or more kinds of monomers (A).

Examples of the monomer (A) include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate and 2-ethylhexyl methacrylate. These may be used alone or in combination of two or more.

As the monomer (B), acrylic acid, methacrylic acid, itaconic acid, mesaconic acid, citraconic acid,
Examples include fumaric acid, maleic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide and the like. These may be used alone or in combination of two or more.

The curing agent is used to react with the functional group of the (meth) acrylic copolymer to adjust the adhesive force and cohesive force. For example, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, 1,3-bis (N, N-diglycidylaminomethyl) toluene, 1,3-bis (N, N-diglycidylaminomethyl) ) Benzene, N, N, N ', N'-tetraglycidyl-m-xylenediamine, and other epoxy compounds having two or more epoxy groups in the molecule, 2,4-tolylene diisocyanate, 2,6-tolylene Diisocyanate, 1,3-xylylene diisocyanate, 1,4
-Xylene diisocyanate, diphenylmethane-4,
Isocyanate compounds having two or more isocyanate groups in the molecule such as 4′-diisocyanate, tetramethylol-tri-β-aziridinyl propionate,
Trimethylol-tri-β-aziridinylpropionate, trimethylolpropane-tri-β-aziridinylpropionate, trimethylolpropane-tri-β-
Examples thereof include (2-methylaziridine) propionate and other aziridine compounds having two or more aziridinyl groups in the molecule.

The addition amount of the curing agent may be adjusted according to the desired adhesive strength, and is preferably 0.1 to 5.0 parts by mass with respect to 100 parts by mass of the (meth) acrylic copolymer.

The adhesive strength is JIS Z 0237 (199).
The value measured according to 1) (90 ° peeling method, peeling speed 50 mm / min test plate: silicon wafer) was 0.
It is preferably about 2 to 1.3 N / 25 mm.

Examples of the solvent for the acrylic adhesive include ethyl acetate, toluene, xylene, acetone, methyl ethyl ketone, n-hexane, cyclohexane and the like.

The radiation-curable pressure-sensitive adhesive is generally composed mainly of an acrylic pressure-sensitive adhesive and a radiation-polymerizable compound. Examples of the radiation-polymerizable compound used in the radiation-curable pressure-sensitive adhesive include intramolecular compounds that can be three-dimensionally reticulated by light irradiation as disclosed in JP-A-60-196956 and JP-A-60-223139. Widely used are low molecular weight compounds having at least two photopolymerizable carbon-carbon double bonds, and specifically, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate. , Dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,
6-hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, etc. are used.

Further, as the radiation-polymerizable compound, a urethane acrylate-based oligomer may be used in addition to the above-mentioned acrylate-based compound. The urethane acrylate-based oligomer is, for example, a polyester type or polyether type polyol compound and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,
3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) is added to the terminal isocyanate urethane prepolymer obtained by reaction, and an acrylate or methacrylate having a hydroxyl group (for example, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2
-Hydroxypropyl methacrylate, polyethylene glycol acrylate, polyethylene glycol methacrylate, etc.).

The compounding ratio of the acrylic pressure-sensitive adhesive and the radiation-polymerizable compound in the radiation-curable pressure-sensitive adhesive is 50 to 20 with respect to 100 parts by weight of the acrylic pressure-sensitive adhesive.
It is preferably used in an amount of 0 parts by mass, more preferably 50 to 150 parts by mass, and particularly preferably 70 to 120 parts by mass. In this case, the pressure-sensitive adhesive sheet obtained has a large initial adhesive force, and the adhesive force is significantly reduced after irradiation with radiation. Therefore, the peeling at the interface between the wafer and the radiation-curable pressure-sensitive adhesive layer after the back surface grinding is facilitated.

The radiation-curable pressure-sensitive adhesive may be formed of a radiation-curable copolymer having a radiation-polymerizable group in its side chain. Such a radiation-curable copolymer has the property of having both tackiness and radiation-curability. Radiation-curable copolymers having a side-chain radiation-polymerizable group are disclosed in, for example, JP-A-5-32946 and JP-A-8-27.
The details are described in Japanese Patent No. 239, etc.

Further, the radiation-curable pressure-sensitive adhesive includes, for example, α
-A photopolymerization initiator such as hydroxycyclohexyl phenyl ketone may be contained.

The above-mentioned acrylic radiation-curable pressure-sensitive adhesive has a sufficient adhesive force to the wafer before the irradiation with radiation and the adhesive force remarkably decreases after the irradiation with radiation. That is, the surface of the adhesive sheet can be protected by adhering the adhesive sheet and the wafer with a sufficient adhesive force before the irradiation with radiation, and can be easily separated from the ground wafer after the irradiation with radiation.

The thickness of the radiation-curable pressure-sensitive adhesive layer is appropriately set depending on the adherend to be applied within a range not impairing the gist of the present invention, and is usually 500 μm or less, preferably 1 to
The thickness is 200 μm, more preferably 3 to 100 μm, and particularly preferably 5 to 20 μm.

The laser-dicing pressure-sensitive adhesive tape of the present invention has a non-radiation-curable pressure-sensitive adhesive layer as an intermediate layer between the radiation-curable pressure-sensitive adhesive layer and the substrate. Providing such a non-radiation-curable pressure-sensitive adhesive layer is preferable from the following points, for example.

(1) Prevention of Curing Inhibition (No N ₂ Purging Step Required) When a porous substrate or a network-structured substrate (hereinafter collectively referred to as a porous substrate etc.) is used ,
By providing the non-radiation-curable pressure-sensitive adhesive layer between the substrate and the radiation-curable pressure-sensitive adhesive layer, the contact between the radiation-curable pressure-sensitive adhesive and oxygen can be blocked. Therefore, curing inhibition due to oxygen radicals does not occur, so that the adhesive strength is sufficiently reduced after irradiation with radiation such as ultraviolet rays. Therefore, peeling is easy at the time of pickup. In this case, it is not necessary to perform N ₂ purge at the time of irradiation of radiation in order to prevent generation of oxygen radicals, and irradiation can be performed in the atmosphere, so workability is good.

(2) Increasing contact area and improving adhesion between substrate and pressure-sensitive adhesive layer When a porous substrate or the like is used, the substrate and the radiation-curable pressure-sensitive adhesive layer are in a point contact state. There is. When a non-radiation-curable pressure-sensitive adhesive layer is provided as an intermediate layer between the base material and the radiation-curable pressure-sensitive adhesive layer, the non-radiation-curable pressure-sensitive adhesive is slightly penetrated into the base material, and the intermediate layer and the base material are It is firmly joined. As a result, the intermediate layer and the radiation-curable pressure-sensitive adhesive layer are in surface contact with each other. For this reason, the adhesiveness is improved, and at the time of peeling, no interfacial peeling (adhesive residue) between the substrate and the radiation-curable pressure-sensitive adhesive layer does not occur.

(3) Preventing Adhesion of Adhesive (Glue) to Back Side of Substrate A non-radiation-curable adhesive layer is provided between the substrate and the radiation adhesive layer so that the adhesive to the substrate side is provided. Can be prevented from seeping out. This is more remarkable when the substrate is a porous substrate or the like. Thus, the hardness of the non-radiation-curable pressure-sensitive adhesive layer provided as the intermediate layer can be changed and adjusted regardless of properties such as hardness required for the adhesive tape. It is preferable to prevent it by providing it. In order to prevent exudation of the pressure-sensitive adhesive, it may be considered to make the hardness of the radiation-curable pressure-sensitive adhesive hard (that is, to reduce the adhesive strength before irradiation of radiation such as initial ultraviolet rays). However, the pressure-sensitive adhesive tape thus obtained is not satisfactory in terms of hardness and the like, and the adhesiveness to the substrate is also reduced, which is not practical. Although the exudation of the pressure-sensitive adhesive can be eliminated by adjusting the laminating pressure and the like when laminating the radiation-curable pressure-sensitive adhesive layer with the substrate, the operation becomes complicated.

In the present invention, the material of the non-radiation curable pressure sensitive adhesive is not particularly limited, and any conventionally known general acrylic pressure sensitive adhesive can be applied.

As such an acrylic adhesive,
It contains a (meth) acrylic copolymer and a curing agent as essential components. The (meth) acrylic copolymer is, for example, a polymer having a (meth) acrylic acid ester as a polymer constituent unit, a (meth) acrylic polymer of a (meth) acrylic acid ester copolymer, or a functional group. Examples thereof include copolymers with monomers, and mixtures of these polymers.
The weight average molecular weight of these polymers is 50.
A polymer having a high molecular weight of about 10,000 to 1,000,000 is generally applied.

Examples of the curing agent are the same as those mentioned in the description of the radiation-curable pressure-sensitive adhesive. The amount of the curing agent added may be adjusted according to the desired adhesive strength,
0. 0 to 100 parts by weight of the (meth) acrylic copolymer.
1 to 5.0 parts by mass is preferable.

In the present invention, the non-radiation-curable pressure-sensitive adhesive may be the same as the radiation-curable pressure-sensitive adhesive except that it does not contain a radiation-polymerizable compound or a photopolymerization initiator.

The thickness of the non-radiation-curable pressure-sensitive adhesive layer provided between the radiation-curable pressure-sensitive adhesive layer and the substrate is not particularly limited, but is preferably in the range of 1 to 100 μm. If this thickness is too thin, coating may be relatively difficult. Further, if the thickness is too thick, the drainage of the water serving as a guide becomes poor, which may cause difficulty in cutting, and may also cause adhesive residue on the workpiece or chip surface after peeling. The thickness of the intermediate layer is more preferably 3 to 20 μm.
m, more preferably 5 to 10 μm.

In the present invention, the radiation-curable pressure-sensitive adhesive layer is preferably obtained by directly coating the radiation-curable pressure-sensitive adhesive on the non-radiation-curable pressure-sensitive adhesive layer of the substrate provided with the non-radiation-curable pressure-sensitive adhesive layer. As a result, it is formed on the base material. Alternatively, the radiation-curable pressure-sensitive adhesive layer is provided by transfer coating in which a conventionally known liner film is coated with the radiation-curable pressure-sensitive adhesive, and immediately after drying, the non-radiation-curable pressure-sensitive adhesive layer is laminated with a substrate. Is also preferable. Generally, when a radiation-curable pressure-sensitive adhesive layer is formed by using a porous substrate or the like and not providing an intermediate layer (non-ultraviolet curable pressure-sensitive adhesive layer), the adhesiveness is improved. In some cases, it is necessary to adjust the laminating pressure and the like at the time of laminating with the base material in order to prevent the bleeding out, and in these cases, the work becomes complicated.

The non-radiation-curable pressure-sensitive adhesive layer may be formed by coating, but after the radiation-curable pressure-sensitive adhesive layer and the non-radiation-curable pressure-sensitive adhesive layer are separately formed by using a liner film or the like, both layers are formed. Method of laminating layers (transfer coating)
The adhesive tape of the present invention may be obtained according to. As a method for forming the radiation-curable pressure-sensitive adhesive layer and the non-radiation-curable pressure-sensitive adhesive layer by coating, simultaneous coating in which a multi-layer pressure-sensitive adhesive is simultaneously coated is used, and another layer is coated after coating one layer. It may also be applied repeatedly. As a method of forming each of the layers by transfer coating, for example, the following method may be mentioned. First, a non-radiation-curable pressure-sensitive adhesive is applied on a liner film and dried to form the non-radiation-curable pressure-sensitive adhesive coating. Immediately after the drying, the coating and the substrate are bonded to each other on the non-radiation-curable pressure-sensitive adhesive coating side. The material is laminated so as to be laminated with the material to obtain an adhesive sheet. Aside from this,
A radiation-curable pressure-sensitive adhesive is applied on a liner film and dried to form the radiation-curable pressure-sensitive adhesive coating, and immediately after the drying, the pressure-sensitive adhesive sheet and the radiation-curable pressure-sensitive adhesive coating are prepared as described above. The non-radiation-curable pressure-sensitive adhesive coating side and the radiation-curable pressure-sensitive adhesive coating may be laminated so as to be laminated while the liner film is peeled off to obtain the pressure-sensitive adhesive tape of the present invention.

In the pressure-sensitive adhesive tape obtained by the transfer coating, the liner film on the surface of the pressure-sensitive adhesive layer can be peeled off before use, and the liner film should not be peeled off after the transfer coating and before use. It is usually done.

Hereinafter, another preferred embodiment of the present invention will be described.

(I) In the present invention, it is also preferable to pre-cut the adhesive tape with a preheated blade. For example, the adhesive tape of the present invention is pre-cut according to the shape (diameter) of the dicing frame with a blade (for example, a metal blade) heated to about 150 ° C. By cutting with a heated blade, the cut surface of a substrate such as a non-woven fabric is heat-sealed, and no fiber waste is generated from the cut surface.

(II) In the present invention, it is also preferable that the adhesive tape is mounted on the dicing frame and then cut with a laser beam instead of a blade. By cutting the adhesive tape with a laser beam, even if it is a base material such as a nonwoven fabric, the cut surface is heat-sealed, and no fiber waste is generated from the cut surface.

(III) In the present invention, it is also preferable to use, as the base material of the pressure-sensitive adhesive tape, a base material whose entire surface is previously heat-sealed. The method of heat-sealing the base material is not particularly limited, and flame treatment or hot pressing may be used as long as the heat treatment is sufficient to heat-bond the entire surface of the base material. As such a substrate, a non-woven fabric whose entire surface is previously heat-sealed, for example,
Kureha Tech's PET6030A (trade name) or the like can be used. According to the pressure-sensitive adhesive tape having the base material whose entire surface is heat-sealed, no fiber waste is generated from the cut surface even in the tape cutting method using a normal blade.

In the cases (II) and (III), after the adhesive tape is attached to the wafer frame, the tape is cut into a predetermined shape, for example, a step of piercing into the shape of a dicing frame, The cut end of the base material will not be frayed to generate fiber waste. Further, in the case of (I), since such a step of hollowing out is not necessary, the cut end of the base material is not frayed and fiber waste is not generated. Therefore, in any of these cases, it is possible to prevent the fiber waste from scattering in the clean room when the semiconductor chip is formed. Further, in the case of (III), the adhesive tape is irradiated with radiation after the dicing process, and in the pickup step of peeling the tape from the workpiece or chip, the base material is broken, and the adhesive and the broken base material are Part of it does not transfer to the surface of the work piece or chip. The above (I) to (III) are not limited to the pressure-sensitive adhesive tape in which the non-radiation-curable pressure-sensitive adhesive layer of the present invention is provided between the substrate and the radiation-curable pressure-sensitive adhesive layer, and the radiation-curable pressure-sensitive adhesive layer is a substrate. It can be preferably applied also to a known adhesive tape such as an adhesive tape provided directly on the above.

[0048]

The present invention will be described in more detail based on the following examples, but the invention is not intended to be limited thereto.

[0049]Example 1 Acrylic ester copolymer 100 parts by mass, as a curing agent
Polyisocyanate compound (manufactured by Nippon Polyurethane Company,
Product name Coronate L) 2 parts by mass of non-radiation (UV
Line) a curable adhesive of 38 μm thick liner film
After coating 10μm thick on one side, 110 ℃
And dried for 2 minutes. Immediately after drying, non-woven fabric as a base material
(Kuha Tech Co., Ltd. (trade name: Bonden) CX2602
6, fiber diameter 10μm or more, less than 50μm, thickness 140μ
m) is laminated on the above coating to produce an adhesive sheet
Got Separately from this, acrylic adhesive (2-ethyl
Coexistence of hexyl acrylate and n-butyl acrylate
Polyisocyanate compound (day)
This polyurethane company makes, brand name: Coronate L) 3 mass
, Tris-2-acrylate as an isocyanurate compound
60 parts by mass of roxyethyl isocyanurate and photopolymerization
Α-Hydroxycyclohexyl phenyl keto as the initiator
Radiation (ultraviolet) curing type viscosity mixture prepared by adding and mixing 1 part by mass of
The adhesive was applied to one side of a 38 μm thick liner film by 10
After coating to a thickness of μm, dry at 110 ° C for 2 minutes.
Dried Immediately after drying,
The adhesive sheet consisting of the radiation-curable adhesive layer is
On top of the curable adhesive coating, liner the adhesive sheet
-While peeling off the film,
Coating side and the radiation-curable adhesive coating
For laser dicing by laminating to stack
An adhesive tape was obtained. This adhesive tape is mounted on the frame
The liner film was peeled off before use.

[0050]Example 2 Apply a non-radiation curable adhesive on one side of the liner film.
Same as Example 1 except coated with a thickness of μm
Then, an adhesive tape for laser dicing was obtained.

[0051]Example 3 Acrylic ester copolymer 100 parts by mass, curing agent 1 quality
Implemented except using non-radiation curable adhesive consisting of parts
In the same manner as in Example 1, adhesive tape for laser dicing
Obtained.

[0052]Comparative Example 1 Acrylic adhesive (2-ethylhexyl acrylate
Copolymer with n-butyl acrylate) 100 parts by mass
Polyisocyanate compound (Nippon Polyurethane Co., Ltd.
Product name Coronate L) 3 parts by mass, isocyanurate compound
As tris-2-acryloxyethyl isocyanurate
60 parts by mass and α-hydroxysilane as a photopolymerization initiator
Add 1 part by weight of chlorhexyl phenyl ketone and mix.
38 μm thick liner fill with radiation curable adhesive
Coated on one side with a thickness of 5 μm, then 110
It was dried at 0 ° C for 2 minutes. Immediately after drying, as a porous substrate
Non-woven fabric (Kureha Tech Co., Ltd. (trade name: Bonden) CX26
026, thickness 140 μm) on top of the coating
Laminate to obtain adhesive tape for laser dicing
It was

[0053]Comparative example 2 1 of polyisocyanate compound in radiation-curable adhesive
The mass of the radiation-curable adhesive is 50 μm.
Except that the coating was performed in the same manner as in Comparative Example 1.
An adhesive tape for laser dicing was obtained.

[0054]Comparative Example 3 Comparison of laminating pressure when obtaining the adhesive tape of Comparative Example 2
Adjust to 0.5 times that of Example 2 and use an adhesive tape for laser dicing.
I got a loop.

[0055]Comparative Example 4 The laser dicing tape obtained in Comparative Example 1 was diced.
After the completion of the irradiation, ultraviolet irradiation was performed in a nitrogen atmosphere.

[0056]Comparative Example 5 The laser dicing tape obtained in Comparative Example 3 was diced.
After the completion of the irradiation, ultraviolet irradiation was performed in a nitrogen atmosphere.

The following evaluations were carried out for Examples 1 to 3 and Comparative Examples 1 to 5.

Presence / absence of curing inhibition, adhesion between the base material and the adhesive layer A 6-inch silicon wafer having a thickness of 100 μm is attached and fixed to each 6-inch ring frame by using an adhesive tape for laser dicing. did. This was installed in a laser microjet dicing device (trade name: Laser Microjet, manufactured by SYNOVA), and a cutting size of 2 mm x 2 mm under conditions of a cutting speed of 100 mm / s and a laser beam diameter (water jet diameter) of 40 μm. Diced into After the dicing was completed, the diced chips were irradiated with ultraviolet rays in the air and a nitrogen atmosphere. Further, with respect to the obtained chip, the pickup property and the adhesiveness between the base material and the pressure-sensitive adhesive layer were confirmed. The pick-up property was evaluated by the degree of adhesive strength after irradiation of ultraviolet rays depending on the presence or absence of curing inhibition. As a result of ultraviolet irradiation, when the adhesive strength of the adhesive tape was sufficiently reduced due to the curing of the adhesive agent and peeling from the adhesive tape was easy, “○” (good), the adhesive strength was not sufficiently reduced due to curing inhibition. The case where the peeling from the adhesive tape was hindered was defined as "x" (defective). Further, the adhesiveness was evaluated as "◯" when the interface peeling did not occur between the base material and the pressure-sensitive adhesive layer, and "x" when the interface peeling occurred.

Workability The workability during ultraviolet irradiation and workability during lamination were evaluated. When it was possible to work in the atmosphere during UV irradiation without the need for nitrogen purging, and when adjusting the laminating pressure when laminating the adhesive sheets, it was marked as "○", and nitrogen purging was necessary during UV irradiation, or the pressure was too high. The case where it was necessary to adjust the laminating pressure at the time of laminating the sheets was designated as "x". Furthermore, when both the nitrogen purge and the lamination pressure adjustment were required, the workability was particularly poor and the result was designated as "XX".

Confirmation of bleeding state of pressure-sensitive adhesive The presence of bleeding of the pressure-sensitive adhesive was confirmed by visually observing the substrate side of the pressure-sensitive adhesive tape for laser dicing obtained by laminating.

Table 1 shows the test results of the above evaluation items.

[0062]

[Table 1]

[0063]Evaluation results Examples 1-3: Staining of the pressure-sensitive adhesive when observed after lamination
No release was confirmed. Also, pick after dicing
Up property is not affected by curing inhibition, so it is sufficient even in air
The adhesive strength was lowered, and good pick-up property was exhibited. Well
Also, the adhesiveness between the base material and the adhesive is good, leaving no adhesive residue on the work.
There was nothing. Also, the nitrogen purge and the
It is not necessary to adjust the laminating pressure at the time of applying, and workability is improved.
Was good. Comparative Example 1: Adhesive pressure-sensitive adhesive was sufficiently cured by UV irradiation in the atmosphere.
The adhesion did not decrease, and the adhesion between the base material and the adhesive was poor.
Therefore, interfacial peeling occurred between the base material and the adhesive layer. Comparative Example 2: The exudation of the pressure-sensitive adhesive to the substrate side was observed. Comparative Example 3: There was no exudation of the pressure-sensitive adhesive on the substrate side. Da
UV irradiation in the air after icing
The adhesive strength did not decrease. Also, when coating,
I had to adjust the mine pressure and the workability was poor. Comparative Example 4: UV irradiation in a nitrogen atmosphere after dicing
By doing so, the adhesive strength was sufficiently reduced, but the base material and adhesive
Due to poor adhesion, some adhesive residue may occur on the work piece side.
It was Also, nitrogen must be purged during UV irradiation.
The workability was poor. Comparative Example 5: In the observation after lamination, the adhesive oozes out.
Was not confirmed. Also, pick-up after dicing
The adhesiveness is sufficiently reduced to show good picking
did. However, do not adjust the laminating pressure during laminating.
In addition, a nitrogen purge should be performed at the time of UV irradiation.
Workability was very bad because I had to
It was

[0064]

The adhesive tape for laser dicing of the present invention has a high cutting speed and does not melt or break when a silicon wafer, ceramic, glass or metal is finely cut and divided (dicing) by laser. The dicing product (chip) can be prevented from jumping or chipping of the element especially at the end portion, and can be appropriately stretched, and the excellent effect that the material maintains straightness during stretching can be obtained. Play. Further, the present invention, by providing a non-radiation-curable pressure-sensitive adhesive layer between the substrate and the radiation-curable pressure-sensitive adhesive layer,
It is possible to further improve the adhesion between the base material and these pressure-sensitive adhesive layers, prevent the pressure-sensitive adhesive from seeping out to the base material side, and further prevent curing inhibition during irradiation of radiation.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Toru Morita             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. (72) Yuuri Tamagawa             2-6-1, Marunouchi, Chiyoda-ku, Tokyo             Kawa Electric Industry Co., Ltd. F-term (reference) 4J004 AA01 AA02 AB06 BA03 CA03                       CA06 CB01 CC02 FA05 FA08                 4J040 DF031 FA131 FA271 FA281                       FA291 GA05 GA07 GA22                       JB07 KA16 KA23 MA04 NA20

Claims (5)

[Claims] 1. An adhesive tape used for laser dicing in which a laser is guided by a water jet, comprising a non-radiation curable adhesive layer and a radiation curable adhesive layer on one surface of a base material of the tape. The substrate is permeable to the jet water stream of the water jet, and a non-radiation-curable pressure-sensitive adhesive layer is provided between the substrate and the radiation-curable pressure-sensitive adhesive layer. Adhesive tape for laser dicing. 2. The pressure-sensitive adhesive tape for laser dicing according to claim 1, which is permeable to a water stream having a width of at least 50 μm. 3. The base material has a mesh structure and a fiber diameter of 1
The adhesive tape for laser dicing according to claim 1, wherein the adhesive tape has a thickness of 0 μm or more and less than 50 μm. 4. The substrate has a porous structure and a pore size of 10
The adhesive tape for laser dicing according to claim 1, wherein the pressure-sensitive adhesive tape is 50 μm to 50 μm. 5. The adhesive tape for laser dicing according to claim 1, wherein the base material is a rubber-like elastic body.