CN116140819A - Screen cutting method and cutting system - Google Patents

Abstract

The disclosure discloses a screen cutting method and a cutting system, which belong to the technical field of electronic products. The screen cutting method uses a cutting system to cut the screen to be cut; the cutting system includes: a laser and a liquid device; the liquid in the liquid device is controlled to flow toward the screen to be cut to form a liquid column; the laser beam emitted by the laser is incident into the liquid column, Conduct the laser beam along the liquid column; use the laser beam to cut the screen to be cut at the position where the liquid column contacts the screen to be cut. The flexible screen cutting method of the present disclosure adopts a cutting system to cut the screen to be cut; the laser beam emitted by the laser is incident into the liquid column, and is transmitted along the liquid column; the laser beam is at the position where the liquid column contacts the screen to be cut Cutting can effectively reduce the heat-affected area of the screen to be cut, and the process angle is small, which is conducive to reducing the frame width of the electronic device.

Description

Screen cutting method and cutting system

technical field

The present disclosure relates to the technical field of electronic products, in particular to a screen cutting method and a cutting system.

Background technique

Flexible screen (OLED flexible display), also known as flexible OLED, is widely used with the continuous development of electronic devices such as personal smart terminals due to its low power consumption and bendable characteristics.

In the production process of flexible screens, in order to meet the needs of products such as electronic equipment of different sizes, it is necessary to cut and process the flexible screens into various application sizes. Laser cutting technology is generally used in related technologies, but laser cutting energy is relatively large, and the edges of the flexible screen are easily damaged.

Contents of the invention

The present disclosure provides a screen cutting method and a cutting system, which can solve the problem that the edge of a flexible screen is easily damaged due to high laser cutting energy.

Described technical scheme is as follows:

On the one hand, a screen cutting method is provided, which uses a cutting system to cut the screen to be cut; the cutting system includes: a laser and a liquid device;

controlling the liquid in the liquid device to flow toward the screen to be cut to form a liquid column;

injecting the laser beam emitted by the laser into the liquid column, so that the laser beam is transmitted along the liquid column;

The screen to be cut is cut by using the laser beam at the position where the liquid column contacts the screen to be cut.

In some embodiments, the liquid components in the liquid device include isopropanol and ethanol.

In some embodiments, the mass ratio of the isopropanol to ethanol is 2:8˜4:6.

In some embodiments, scattering particles are provided in the liquid, and materials of the scattering particles include: polymethyl methacrylate particles, polycarbonate particles, and polystyrene particles.

In some embodiments, the diameter of the liquid column is D, and the particle size of the scattering particles is d, wherein the range of d/D is 1/10˜1/30.

In some embodiments, the volume percentage concentration of the scattering particles in the liquid is 0.35%-1.5%.

In some embodiments, before injecting the laser beam emitted by the laser into the liquid column and conducting the laser beam along the liquid column, further comprising:

The laser beam emitted by the laser is controlled to pass through the lens assembly to shape the laser beam.

In some embodiments, the controlling the laser beam emitted by the laser to pass through the lens assembly to shape the laser beam includes:

controlling the laser beam emitted by the laser to pass through the first lens, so that the laser beam is converged;

The converged laser beam is controlled to pass through the second lens, so that the laser beam is diverged, and the laser beam is evenly distributed along the cross-section of the liquid column.

In some embodiments, after cutting the screen to be cut with a laser beam at the position where the liquid column is in contact with the screen to be cut, further comprising:

Said liquid flowing down the cutting site is recovered and recycled.

In some embodiments, said recovering and recycling said liquid flowing down from the cutting site comprises:

collecting said liquid flowing down the cutting site;

After the liquid is filtered by the filter device, it is transported back to the liquid device through the recovery pump.

In another aspect, a cutting system is provided, which adopts the screen cutting method described in any one of the foregoing; the cutting system includes: a laser and a liquid device;

The liquid device includes a liquid storage tank and liquid stored in the liquid storage tank, the liquid storage tank is provided with a liquid outlet hole facing the side of the screen to be cut, and the liquid flows along the liquid outlet hole to the Describe the screen to be cut to form a liquid column;

The laser is located above the liquid device, the laser is facing the liquid storage tank, and the laser beam emitted by the laser can be incident into the liquid column and transmitted along the liquid column to the to-be-cut The screen is used to cut the position where the liquid column is in contact with the screen to be cut.

In some embodiments, the components of the liquid include, but are not limited to: isopropanol, ethanol.

In some embodiments, the mass ratio of the isopropanol to ethanol is 2:8˜4:6.

In some embodiments, scattering particles are provided in the liquid, and materials of the scattering particles include but are not limited to: polymethyl methacrylate particles, polycarbonate particles, and polystyrene particles.

In some embodiments, the diameter of the liquid column is D, and the particle size of the scattering particles is d, wherein the range of d/D is 1/10˜1/30.

In some embodiments, the volume percentage concentration of the scattering particles in the liquid is 0.35%˜1.5%.

In some embodiments, the cutting system further includes: a lens assembly; the lens assembly includes a first lens and a second lens;

The first lens is used to converge the laser beam; the second lens is used to diverge the laser beam so that the laser beam is evenly distributed along the cross section of the liquid column.

In some embodiments, the cutting system further includes: a recovery circulation assembly; the recovery circulation assembly includes a sump, a liquid return pipe, a recovery pump and a filter device;

The liquid collection tank is located below the screen to be cut, and is used to collect the liquid flowing down from the cutting position; the first end of the liquid return pipe is connected to the liquid collection tank, and the second end is connected to the liquid storage box;

The recovery pump and the filtering device are located on the liquid return pipe.

The beneficial effects brought by the technical solutions provided by the present disclosure at least include:

The screen cutting method of the present disclosure adopts a cutting system to cut the screen to be cut; the cutting system includes: a laser and a liquid device; the liquid in the liquid device flows toward the screen to be cut to form a liquid column; the laser beam emitted by the laser is incident into the liquid column, And conduct along the liquid column; the laser beam cuts the screen to be cut at the position where the liquid column contacts the screen to be cut, which can effectively reduce the heat-affected area of the screen to be cut, and the process angle is small, which is conducive to reducing the frame of the electronic device width.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

FIG. 1 is a schematic flow diagram of a cutting method provided by an embodiment of the present disclosure;

Fig. 2 is a schematic flow chart of a cutting method provided by another embodiment of the present disclosure;

Fig. 3 is a schematic flow chart of a cutting method provided by another embodiment of the present disclosure;

4 is a schematic structural diagram of a cutting system provided by an embodiment of the present disclosure;

5 is a schematic diagram of laser beam transmission in a liquid column according to an embodiment of the present disclosure;

6 is a schematic diagram of laser beam transmission in a liquid column according to another embodiment of the present disclosure;

7 is a schematic diagram of the heat-affected zone and the process angle when the cutting method of the embodiment of the present disclosure is adopted;

Fig. 8 is a schematic diagram of a film packaging structure of a flexible screen in the related art;

Fig. 9 is a schematic diagram of black spots on the edge after the package failure of the flexible screen in the related art;

Fig. 10 is a schematic diagram of heat-affected zones and process angles during flexible screen cutting in the related art.

The reference signs in the figure represent respectively:

10. Cutting system; 20. Screen to be cut; 30. Heat-affected zone;

1. Laser; 11. Laser beam; 2. Liquid device; 21. Liquid; 22. Liquid column; 23. Scattering particles; 24. Liquid storage tank; 241. Liquid outlet; 3. Lens assembly; 31. First lens ; 32, the second lens; 4, the recovery cycle assembly; 41, the liquid collection tank; 42, the liquid return pipe; 43, the recovery pump; 44, the filter device.

Detailed ways

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present disclosure as recited in the appended claims.

It should be understood that the orientation nouns involved in the embodiments of the present disclosure, such as "upper", "lower", "top", "bottom", "front", "rear", "side", etc., refer to the position of the cutting system The layout orientation is used as the reference, where the orientation of the laser is the top or the top, the orientation of the screen to be cut is the bottom or the bottom, and the part between the top and the bottom is the side. The orientation terms used in the embodiments of the present disclosure are only used to describe structures and the relationship between structures more clearly, not to describe absolute orientations, and thus should not be construed as limitations on the present disclosure.

Unless otherwise defined, all technical terms used in the embodiments of the present disclosure have the same meanings as commonly understood by those of ordinary skill in the art.

Flexible screen (OLED flexible display), also known as flexible OLED, due to its low power consumption and bendable characteristics, flexible screen will be widely used with the continuous penetration of electronic devices such as personal smart terminals.

In the production process of flexible screens, in order to meet the needs of products such as electronic equipment of different sizes, the flexible screens need to be cut and processed. Since the flexible screen uses a flexible polyimide (Polyimide, PI) substrate, it cannot be cut and polished with hard tools such as punching, cutting or knife wheels like hard screens (such as glass screens); and the processing accuracy of flexible screens The general requirements are higher, and the required process parameters are more precise. Therefore, in related technologies, laser cutting technology with high precision and good processing technology is usually used to cut the flexible screen, but the cost is relatively high.

However, the use of lasers to cut flexible screens still has the following technical problems:

1. The heat-affected area of cutting is large. Due to the high laser energy, the temperature in the cutting area is high. During the cutting process, the width of the area affected by the laser on the flexible screen body is large, which is not conducive to controlling the cutting accuracy. The impact caused by the cutting of the edge of the flexible screen or the position of the hole may cause the packaging failure of the flexible screen and cause black spots on the edge.

Specifically, as shown in Figures 8 and 9, the Thin-Film Encapsulation (TFE) of the flexible screen generally has three layers, and the upper, middle and lower are respectively the second chemical deposition layer (such as CVD2 layer, the material is SiOx) , a physical deposition layer (such as an IJP layer, the material is organic matter) and a first chemical deposition layer (CVD1 layer, the material is SiNx). In the heat-affected zone of the laser, the two CVD layers and the IJP layer will have a certain probability of separation, resulting in the failure of the water and oxygen barrier function, and black spots will appear on the flexible screen.

2. The angle of the laser cutting process is too large. As shown in FIG. 10 , since the material of the screen 20 ′ to be cut will vaporize or melt during the processing, this phenomenon will have a tendency that is more serious closer to the upper surface (the direction in which the laser beam 11 ′ is incident), and the heat-affected zone 30 The larger the 'is, the laser cut surface is inverted V-shaped, so the process angle α' is relatively large, resulting in an increase in the invalid area at the edge of the flexible screen (coverage of the process angle α'), and it is necessary to increase the frame width of the display module Covering and blocking the invalid area, the proportion of the display area of the display module with the same external size is relatively small, thereby reducing the competitiveness of the product.

Therefore, the present disclosure proposes a screen cutting method, which uses a cutting system to cut the screen to be cut; the laser beam cuts the screen to be cut at the position where the liquid column contacts the screen to be cut, which can effectively reduce the heat-affected area of the screen to be cut , the process angle is small, which is beneficial to reduce the frame width of electronic equipment.

In order to make the purpose, technical solution and advantages of the present disclosure clearer, the implementation manners of the present disclosure will be further described in detail below in conjunction with the accompanying drawings.

FIG. 1 is a schematic flowchart of a cutting method provided by an embodiment of the present disclosure; FIG. 4 is a schematic structural diagram of a cutting system provided by an embodiment of the present disclosure.

On the one hand, as shown in Figures 1 and 4, this embodiment provides a screen cutting method, using a cutting system to cut the screen to be cut; the cutting system 10 includes: a laser 1 and a liquid device 2;

S1 controls the liquid 21 in the liquid device 2 to flow toward the screen 20 to be cut to form a liquid column 22 .

In some embodiments, the components of the liquid 21 in the liquid device 2 include but not limited to: isopropanol and ethanol. Among them, isopropanol is an organic compound with a molecular formula of C ₃ H ₈ O. It is an isomer of n-propanol. It is also known as dimethylmethanol and 2-propanol. It is also called IPA in the industry. Color transparent liquid. Ethanol is an organic compound with a simplified structural formula of CH ₃ CH ₂ OH or C ₂ H ₅ OH and a molecular formula of C ₂ H ₆ O, commonly known as alcohol.

The isopropanol, ethanol or the mixed liquid used in this embodiment has the advantages of good fluidity, viscosity close to water, low price and low cost; it also has the characteristics of low boiling point, easy to volatilize, and easy to clean, which is convenient for cutting after the cutting process. Treat cut screen cleanup. Compared with water, the mixed liquid of isopropanol and ethanol used in this embodiment can effectively prevent water and oxygen from corroding the organic light-emitting layer of the screen to be cut and ensure the quality of the screen to be cut.

In some embodiments, the mass ratio of isopropanol to ethanol is 2:8˜4:6. The mixed liquid that satisfies this mass ratio has the best effect.

It can be understood that the mass ratio of isopropanol to ethanol is, for example, 2:8, 2.5:7.5, 3:7, 3.5:6.5, 4:6, etc.

S3 injects the laser beam 11 emitted by the laser 1 into the liquid column 22 , so that the laser beam 11 is transmitted along the liquid column 22 .

The liquid 21 has a refractive index greater than 1 for light, while air has a refractive index very close to 1 for light. According to the principle of total reflection, when light enters a medium with a lower refractive index (such as the air outside the liquid column 22) from a medium with a higher refractive index (such as the liquid column 22), if the incident angle is greater than a certain critical angle (the light is away from normal), the refracted rays will disappear, and all incident rays will be reflected without entering the medium with a low refractive index. Therefore, as shown in FIG. 5 , through the total reflection of the laser beam 11 in the liquid column 22 , the laser beam 11 is transmitted along the liquid column 22 and is limited to the cross-sectional range of the liquid column 22 . The laser beam 11 can be accurately, locally and uniformly transmitted to the cutting position of the screen 20 to be cut by the liquid column 22 .

In some embodiments, the liquid 21 is provided with scattering particles 23, and the materials of the scattering particles 23 include but are not limited to: polymethyl methacrylate (polymethyl methacrylate, PMMA) particles, polycarbonate (Polycarbonate, PC) particles, poly Styrene (Polystyrene, PS) particles.

Above-mentioned three kinds of material granules, have transparency height (as, PMMA granule light transmittance reaches 90%～92%, PS granule light transmittance reaches 88%～92%), high refractive index (as, PS granule refractive index 1.59～ 1.60) advantage.

In the cutting method of this embodiment, when the scattering particles 23 are not added, since the laser beam 11 is totally reflected in the liquid column 22, the uniform distribution in the cross-sectional direction of the liquid column 22 can be realized, which can reduce the difficulty of the cutting process (refer to FIG. 5 ). After the scattering particles 23 are added in the liquid 21 of the liquid device 2, the scattering particles 23 can have optical effects such as reflection, refraction, and scattering on the laser beam 11, so that the laser beam 11 is also uniformly distributed in the flow direction of the liquid column 22, thereby The laser beam 11 is evenly distributed in both the flow direction of the liquid column 22 and the cross-sectional direction of the liquid column 22, which further reduces the difficulty of the cutting process and improves the process accuracy (refer to FIG. 6 ).

In some embodiments, the diameter of the liquid column 22 is D, and the particle size of the scattering particles 23 is d, wherein the range of d/D is 1/10˜1/30. When the particle size of the scattering particles 23 and the diameter of the liquid column 22 in this embodiment meet the above value ranges, the scattering particles 23 can achieve a better scattering effect without affecting the fluidity of the liquid 21 .

Exemplarily, the value of d/D is, for example, 1/10, 1/15, 1/20, 1/10, 1/25, 1/30 and so on.

In some embodiments, the volume percentage concentration of the scattering particles 23 in the liquid 21 is 0.35%˜1.5%. When the volume percentage concentration of the scattering particles 23 and the liquid 21 in this embodiment satisfies the above value range, the scattering particles 23 can achieve a better scattering effect and ensure that the fluidity of the liquid 21 is not affected.

Exemplarily, the value of volume percentage concentration is, for example, 0.35%, 0.4%, 0.45%, 0.5%, 0.55%, 0.6%, 0.65%, 0.7%, 0.75%, 0.8%, 0.85%, 0.9%, 0.95% , 1.0%, 1.05%, 1.1%, 1.15%, 1.2%, 1.25%, 1.3%, 1.35%, 1.4%, 1.45%, 1.5%, etc.

S4 uses the laser beam 11 to cut the screen 20 to be cut at the position where the liquid column 22 contacts the screen 20 to be cut.

The laser beam 11 is bound within the range of the liquid column 22, and the heat generated by the laser beam 11 is taken away in time by the liquid 21 in the liquid column 22, so as to avoid heat accumulation and cause adverse effects on the edge of the screen 20 to be cut, such as encapsulation failure, The process angle is large and so on. Referring to FIG. 7 , the heat-affected zone 30 generated by the laser beam 11 is small, and the inclination angle of the edge of the screen 20 to be cut is small, that is, the process angle α is small, which is beneficial to reduce the thickness of the frame of the electronic device.

As shown in FIG. 2, in some embodiments, step S3 injects the laser beam 11 emitted by the laser 1 into the liquid column 22, and before the laser beam 11 is transmitted along the liquid column 22, it also includes:

S2 controls the laser beam 11 emitted by the laser 1 to pass through the lens assembly 3 to shape the laser beam 11 .

Since the shape of the laser beam 11 in the laser 1 may not meet the requirements of the cutting process, the lens assembly 3 may be used to shape the laser beam 11 . On the one hand, the lens assembly 3 can adjust the shape of the laser beam 11 (eg, spot shape, spot diameter, etc.), and on the other hand, it can even the laser beam 11 to make the processing more efficient and accurate.

In some embodiments, step S2 controls the laser beam 11 emitted by the laser 1 to pass through the lens assembly 3 to shape the laser beam 11, including:

S21 controls the laser beam 11 emitted by the laser 1 to pass through the first lens 31 to converge the laser beam 11; for example, the first lens 31 is a convex mirror, and the convex mirror has a condensing effect.

S22 controls the converged laser beam 11 to pass through the second lens 32 to make the laser beam 11 diverge, and the laser beam 11 is evenly distributed along the cross section of the liquid column 22 . Exemplarily, the second lens 32 is a concave mirror, which has an astigmatism effect.

In the cutting method of the present embodiment, the laser beam 11 emitted by the laser device 1 is first converged by the first lens 31 to reduce the spot diameter of the laser beam 11 so that the laser beam 11 can pass through a smaller opening, which is convenient for the laser beam 11 Transfer to the liquid column 22; the second lens 32 is used to diverge the laser beam 11, so that the laser beam 11 is evenly distributed in the cross section of the liquid column 22, and the laser beam 11 can be incident on the liquid column 22 along the flow direction in parallel In the liquid column 22, the laser beam 11 is in uniform contact with the surface of the screen 20 to be cut to ensure the uniformity of the cutting surface.

In some other possible implementation manners, the first lens 31 converges the laser beam 11 and directly enters the liquid column 22 . After focusing, the laser beam 11 is directly incident into the liquid column 22 , and transmitted to the screen 20 to be cut by means of the total reflection of the liquid column 22 .

As shown in FIG. 3 , in some embodiments, step S4 utilizes the laser beam 11 to cut the screen 20 to be cut at the position where the liquid column 22 is in contact with the screen 20 to be cut, and further includes:

S5 recovers and recycles the liquid 21 flowing down from the cutting position.

During the cutting process, the liquid device 2 needs to continuously and stably output the liquid 21 to the screen 20 to be cut to form a stable liquid column 22 , and this process consumes a large amount of liquid 21 . In the cutting method of this embodiment, the liquid 21 in the liquid column 22 after participating in the cutting process is recovered and recycled, which is beneficial to saving production resources and reducing production costs.

In some embodiments, step S5 recovers and recycles the liquid 21 flowing down from the cutting position, including:

S51 collects the liquid 21 flowing down from the cutting position; for example, a structure such as a liquid collection tank 41 capable of collecting the liquid 21 is arranged below the screen 20 to be cut or the cutting position, and the liquid 21 is collected;

S52 is to transport the liquid 21 back into the liquid device 2 through the recovery pump 43 after being filtered by the filter device 44 . Since debris and other impurities may be mixed in the cutting liquid 21 , it needs to be filtered before being transported back to the liquid device 2 and used to form the liquid column 22 again.

In other possible implementations, the step S5 reclaims and recycles the liquid 21 flowing down from the cutting position, which also includes:

S53 cools the liquid 21 and transports it back into the liquid device 2 through the recovery pump 43 . Since most of the heat generated by cutting with the laser beam 11 is taken away by the liquid 21 , this part of the heat will cause the temperature of the liquid 21 to rise. If the temperature of the liquid 21 is too high, its cooling effect will be affected, so the liquid 21 is cooled during the recovery and circulation process. Exemplarily, methods for cooling the liquid 21 include but not limited to water cooling, air cooling, and liquid cooling.

The flexible screen cutting method of the present disclosure adopts a cutting system 10 to cut the screen 20 to be cut; the cutting system 10 includes: a laser 1 and a liquid device 2; the liquid 21 in the liquid device 2 flows toward the screen 20 to be cut to form a liquid column 22; the laser 1 The emitted laser beam 11 is incident into the liquid column 22 and is transmitted along the liquid column 22; the laser beam 11 cuts the screen 20 to be cut at the position where the liquid column 22 contacts the screen 20 to be cut, which can effectively reduce the size of the screen to be cut. 20 heat-affected zone (refer to FIG. 7 ), the process angle α is small, which is beneficial to reduce the frame width of the electronic device and improve the competitiveness of the product.

The liquid-guided laser cutting method of this embodiment has the following advantages:

Due to the cooling effect of the liquid column 22, the cutting heat-affected zone is small, the thermal residual stress is small, and there are few microcracks. The scouring action of the liquid 21 produces fewer burrs due to the accumulation of molten products, which reduces the surface roughness of the processed surface. The laser beam 11 is in the shape of a cylinder, no need to consider focusing and has a long processing distance. It can guide the laser in the workpiece material or guide the laser to the bottom of the workpiece. It can cut complex surface materials and multi-layer materials, and the kerf has no taper. The traditional laser is in the shape of a cone, and the kerf has a taper. Most of the products generated by processing flow into the recovery device with the liquid 21, which has little environmental pollution. However, the traditional laser uses a lot of auxiliary gas and processing gas, which pollutes the environment. The present disclosure can also improve the laser energy distribution in the processing area, and the energy in the section of the liquid column 22 is uniformly distributed instead of Gaussian, which can effectively improve the processing accuracy. The action area of the liquid column 22 is small, and compared with the gas-assisted laser cutting, the force on the screen 20 to be cut is small, so as to avoid the pressure deformation of the flexible screen and reduce the cutting quality. During traditional laser processing, processing sparks will often damage the protective lens, but the laser beam 11 of this embodiment is transmitted to a distant position through the liquid column 22, so there is no such problem.

The screen cutting method of the present embodiment is applicable to the screen cutting of portable electronic devices, such as: smart phones, tablet computers, MP3 players (Moving Picture Experts Group Audio Layer III, moving picture experts compression standard audio level 3), MP4 (Moving Picture Experts Group Audio Layer IV, dynamic image expert compression standard audio layer 4) player, laptop or desktop computer, etc.

The screen cutting method of this embodiment is also applicable to other products, such as electric shavers, electric toothbrushes, point-of-service terminals, wearable devices, and automobiles, medical and industrial products, and the like.

On the other hand, as shown in FIG. 4 , this embodiment provides a cutting system 10, which adopts any one of the above screen cutting methods; the cutting system 10 includes: a laser 1 and a liquid device 2; the liquid device 2 includes a liquid storage The tank 24 and the liquid 21 stored in the liquid storage tank 24, the liquid storage tank 24 is provided with a liquid outlet 241 towards the side of the screen 20 to be cut, and the liquid 21 flows along the liquid outlet 241 to the screen 20 to be cut to form a liquid column 22; The laser 1 is located above the liquid device 2, and the laser 1 faces the liquid storage tank 24. The laser beam 11 emitted by the laser 1 can be incident into the liquid column 22, and is transmitted to the screen 20 to be cut along the liquid column 22. The position where the screen 20 contacts is to be cut is cut.

The flexible screen cutting system 10 of the present disclosure can cut the screen 20 to be cut; the cutting system 10 includes: a laser 1 and a liquid device 2; the liquid 21 in the liquid device 2 flows toward the screen 20 to be cut to form a liquid column 22; the laser 1 emits The laser beam 11 is incident into the liquid column 22 and propagates along the liquid column 22 .

Thus, the laser beam 11 cuts the screen 20 to be cut at the position where the liquid column 22 is in contact with the screen 20 to be cut, which can effectively reduce the heat-affected zone of the screen 20 to be cut, and prevent the film packaging of the flexible screen from failing, resulting in the appearance of the flexible screen. dark spots.

In addition, since the liquid 21 is continuously washed away, excess heat can be taken away, the vaporization or melting of the material during the processing is relatively small, the upper and lower directions of the cutting surface are basically vertical, and the process angle is relatively small, so there is no need to increase the frame width of the display module. The display area of the display module with the same external dimension is larger, so that the competitiveness of the product can be improved.

In some embodiments, the components of the liquid 21 include but not limited to: isopropanol, ethanol. The isopropanol, ethanol or the mixed liquid of the two used in this embodiment has the advantages of good fluidity, viscosity close to water, low price, and low cost; in addition, it has the characteristics of low boiling point, easy to volatilize, and easy to clean, which is convenient for cutting Cleaning of the screen 20 to be cut after the process.

In some embodiments, the mass ratio of isopropanol to ethanol is 2:8˜4:6. The mixed liquid 21 that satisfies this mass ratio has the best effect.

It can be understood that the mass ratio of isopropanol to ethanol is, for example, 2:8, 2.5:7.5, 3:7, 3.5:6.5, 4:6, etc.

4 and 6, in some embodiments, the liquid 21 is provided with scattering particles 23, and the materials of the scattering particles 23 include but are not limited to: polymethyl methacrylate particles, polycarbonate particles, polystyrene particles wait.

Above-mentioned three kinds of material granules, have transparency height (as, PMMA granule light transmittance reaches 90%～92%, PS granule light transmittance reaches 88%～92%), high refractive index (as, PS granule refractive index 1.59～ 1.60) advantage.

In the cutting system of this embodiment, when the scattering particles 23 are not added, the laser beam 11 is totally reflected in the liquid column 22, and the energy is uniformly distributed in the cross-sectional direction of the liquid column 22, which can reduce the difficulty of the cutting process. Adding scattering particles 23 in the liquid 21 of the liquid device 2 can make the laser beam 11 evenly distributed in the flow direction of the liquid column 22, so that the laser beam 11 can be distributed in two directions: the flow direction of the liquid column 22 and the cross-sectional direction of the liquid column 22 Evenly distributed, further reducing the difficulty of the cutting process and improving the precision of the process.

In some embodiments, the diameter of the liquid column 22 is D, and the particle size of the scattering particles 23 is d, wherein the range of d/D is 1/10˜1/30. When the particle size of the scattering particles 23 and the diameter of the liquid column 22 in this embodiment meet the above value ranges, the scattering particles 23 can achieve a better scattering effect without affecting the fluidity of the liquid 21 .

Exemplarily, the value of d/D is, for example, 1/10, 1/15, 1/20, 1/10, 1/25, 1/30 and so on.

In some embodiments, the volume percentage concentration of the scattering particles 23 in the liquid 21 is 0.35%˜1.5%. When the volume percentage concentration of the scattering particles 23 and the liquid 21 in this embodiment satisfies the above value range, the scattering particles 23 can achieve a better scattering effect and ensure that the fluidity of the liquid 21 is not affected.

Exemplarily, the value of volume percentage concentration is, for example, 0.35%, 0.4%, 0.45%, 0.5%, 0.55%, 0.6%, 0.65%, 0.7%, 0.75%, 0.8%, 0.85%, 0.9%, 0.95% , 1.0%, 1.05%, 1.1%, 1.15%, 1.2%, 1.25%, 1.3%, 1.35%, 1.4%, 1.45%, 1.5%, etc.

As shown in FIG. 4 , in some embodiments, the cutting system 10 further includes: a lens assembly 3; the lens assembly 3 includes a first lens 31 and a second lens 32; the first lens 31 is used for converging the laser beam 11; the second The lens 32 is used to diverge the laser beam 11 so that the laser beam 11 is evenly distributed along the cross section of the liquid column 22 .

In the cutting system 10 of this embodiment, the laser beam 11 emitted by the laser device 1 is first converged by the first lens 31 to reduce the spot diameter of the laser beam 11, so that the laser beam 11 can pass through a smaller opening, which is convenient for the laser The beam 11 is transmitted to the liquid column 22; the second lens 32 is used to diverge the laser beam 11, so that the laser beam 11 is evenly distributed along the cross section of the liquid column 22, and the laser beam 11 can be incident parallel to the flow direction of the liquid column 22 into the liquid column 22, so that the laser beam 11 is in uniform contact with the surface of the screen 20 to be cut, ensuring the uniformity of the cutting process surface.

In some other possible implementation manners, the lens assembly 3 includes at least one of the first lens 31 and the second lens 32 . The beam shaping of the laser beam 11 by the lens assembly 3 can be accomplished only through one of convergence or divergence. For example, the lens assembly 3 only includes the first lens 31 , which can converge the laser beam 11 , and the converged laser beam 11 is directly incident into the liquid column 22 , and transmitted to the screen 20 to be cut by the total reflection of the liquid column 22 .

"Several" and "at least one" mentioned herein refer to one or more, and "multiple" and "at least two" refer to two or more. "And/or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B may indicate: A exists alone, A and B exist simultaneously, and B exists independently. The character "/" generally indicates that the contextual objects are an "or" relationship.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

As shown in FIG. 4 , in some embodiments, the cutting system 10 further includes: a recovery circulation assembly 4; the recovery circulation assembly 4 includes a sump 41, a return pipe 42, a recovery pump 43 and a filter device 44; the sump 41 Located below the screen 20 to be cut, it is used to collect the liquid 21 flowing down from the cutting position; the first end of the liquid return pipe 42 is connected to the sump 41, and the second end is connected to the liquid storage tank 24; the recovery pump 43 and the filter device 44 are located at On the liquid return pipe 42.

The cutting system 10 of this embodiment, considering that during the cutting process, the liquid device 2 needs to continuously and stably output the liquid 21 to the screen 20 to be cut, so that it forms a stable liquid column 22, and this process needs to consume a large amount of liquid 21 . Therefore, in this embodiment, the liquid 21 in the liquid column 22 after participating in the cutting process is recovered and recycled, which is beneficial to saving production resources and reducing production costs.

In some other possible implementation manners, the recovery cycle assembly 4 further includes a cooling device; the cooling device is located on the liquid return pipe 42 , and the cooling device is used to cool down the liquid 21 in the recovery cycle. Since most of the heat generated by cutting with the laser beam 11 is taken away by the liquid 21 , this part of the heat will cause the temperature of the liquid 21 to rise. If the temperature of the liquid 21 is too high, its cooling effect will be affected, so the liquid 21 is cooled during the recovery and circulation process. Exemplarily, methods for cooling the liquid 21 include but not limited to water cooling, air cooling, and liquid cooling.

It should be pointed out that in the description of the present disclosure, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it may be a fixed connection, It can also be a detachable connection or an integral connection; it can be a mechanical connection; it can be a direct connection or an indirect connection through an intermediary; it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present disclosure according to specific situations.

It should be pointed out that in the present disclosure, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, and may also include the first feature being in direct contact with the second feature. The first and second features are not in direct contact but are in contact through another feature between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

In the description of this specification, references to the terms "certain embodiments," "one embodiment," "some embodiments," "exemplary embodiments," "examples," "specific examples," or "some examples" To describe means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure.

The above descriptions are only examples of the present disclosure, and are not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure. Inside.

Claims (18)

1. A screen cutting method, characterized in that, a cutting system (10) is used to cut the screen (20) to be cut; the cutting system (10) comprises: a laser (1) and a liquid device (2); controlling the liquid (21) in the liquid device (2) to flow toward the screen to be cut (20) to form a liquid column (22); injecting the laser beam (11) emitted by the laser (1) into the liquid column (22), so that the laser beam (11) is transmitted along the liquid column (22); The screen to be cut (20) is cut by using the laser beam (11) at the position where the liquid column (22) contacts the screen (20) to be cut. 2. The screen cutting method according to claim 1, characterized in that, the composition of the liquid (21) in the liquid device (2) includes isopropanol and ethanol. 3. The screen cutting method according to claim 2, characterized in that the mass ratio of the isopropanol to ethanol is 2:8˜4:6. 4. The screen cutting method according to claim 1, characterized in that, the liquid (21) is provided with scattering particles (23), and the material of the scattering particles (23) comprises: polymethyl methacrylate particles , Polycarbonate particles, polystyrene particles. 5. The screen cutting method according to claim 4, characterized in that, the diameter of the liquid column (22) is D, and the particle size of the scattering particles (23) is d, wherein the value range of d/D 1/10 to 1/30. 6. The screen cutting method according to claim 4, characterized in that, the volume percentage concentration of the scattering particles (23) in the liquid (21) is 0.35%-1.5%. 7. The screen cutting method according to claim 1, characterized in that, the laser beam (11) emitted by the laser (1) is incident into the liquid column (22), so that the laser beam (11) Before conducting along the liquid column (22), it also includes: The laser beam (11) emitted by the laser (1) is controlled to pass through the lens assembly (3), so as to shape the laser beam (11). 8. The screen cutting method according to claim 7, characterized in that, the laser beam (11) emitted by the laser (1) is controlled to pass through the lens assembly (3), so that the laser beam (11) Plastic surgery, including: controlling the laser beam (11) emitted by the laser (1) to pass through the first lens (31), so that the laser beam (11) is converged; Controlling the converged laser beam (11) to pass through the second lens (32) to diverge the laser beam (11), the laser beam (11) is uniform along the cross-section of the liquid column (22) distributed. 9. The screen cutting method according to any one of claims 1-8, characterized in that, the laser beam (11) is utilized at the point where the liquid column (22) contacts the screen to be cut (20) After cutting the screen (20) to be cut, it also includes: Said liquid (21) flowing down from the cutting site is recovered and recycled. 10. The screen cutting method according to claim 9, characterized in that said recovering and recycling the liquid (21) flowing down from the cutting position comprises: collecting said liquid (21) flowing down the cutting site; After the liquid (21) is filtered by the filter device (44), it is transported back to the liquid device (2) by the recovery pump (43). 11. A cutting system, characterized in that it is adapted to the screen cutting method described in any one of claims 1-10; the cutting system (10) comprises: a laser (1) and a liquid device (2); The liquid device (2) includes a liquid storage tank (24) and the liquid (21) stored in the liquid storage tank (24), and the liquid storage tank (24) faces the side of the screen to be cut (20). A liquid outlet hole (241) is provided on the side, and the liquid (21) flows to the screen (20) to be cut along the liquid outlet hole (241) to form a liquid column (22); The laser (1) is located above the liquid device (2), the laser (1) faces the liquid storage tank (24), and the laser beam (11) emitted by the laser (1) can be incident on the liquid storage tank (24). in the liquid column (22), and conduct to the screen to be cut (20) along the liquid column (22), the position where the liquid column (22) contacts with the screen to be cut (20) is cutting. 12. The cutting system according to claim 11, characterized in that the composition of the liquid (21) comprises isopropanol and ethanol. 13. The cutting system according to claim 12, characterized in that the mass ratio of the isopropanol to ethanol is 2:8˜4:6. 14. The cutting system according to claim 11, characterized in that, the liquid (21) is provided with scattering particles (23), and the material of the scattering particles (23) comprises: polymethyl methacrylate particles, Polycarbonate pellets, polystyrene pellets. 15. The cutting system according to claim 14, characterized in that, the diameter of the liquid column (22) is D, and the particle size of the scattering particles (23) is d, wherein the value range of d/D is 1/10～1/30. 16. The cutting system according to claim 14, characterized in that, the volume percentage concentration of the scattering particles (23) in the liquid (21) is 0.35%-1.5%. 17. The cutting system according to claim 11, characterized in that, the cutting system (10) further comprises: a lens assembly (3); the lens assembly (3) comprises a first lens (31) and a second lens (32); The first lens (31) is used to converge the laser beam (11); the second lens (32) is used to diverge the laser beam (11), so that the laser beam (11) The cross section of the liquid column (22) is evenly distributed. 18. The cutting system according to claim 11, characterized in that, the cutting system (10) further comprises: a recovery circulation assembly (4); the recovery circulation assembly (4) includes a liquid collection tank (41), a return Liquid pipe (42), recovery pump (43) and filtering device (44); The liquid collecting tank (41) is located below the screen to be cut (20), and is used to collect the liquid (21) flowing down from the cutting position; the first end of the liquid return pipe (42) communicates with the collecting tank. a liquid tank (41), the second end of which is connected to the liquid storage tank (24); The recovery pump (43) and the filtering device (44) are located on the liquid return pipe (42).

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