JP2003031481A - Semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To prevent deposition of encapsulating metal in a light source lamp, to make the temperature of the light source lamp uniform, to prevent uneven illuminance and deterioration of illuminance as an apparatus, and to eliminate the cause of defective element production. SOLUTION: In order to cool a light source lamp 5, a plurality of cooling means are provided with nozzles 10, 11, 12 and respective temperature control sections 14, 15, 16 corresponding thereto, and a temperature distribution of the light source lamp 5 is measured. Temperature sensors 6 for
-9, the nozzles 10, 11, 12 and the temperature control unit 14,
Reference numerals 15 and 16 can be independently controlled based on the temperature distribution of the light source lamp 5, illuminate the original by transmission illumination using light generated from the light source lamp 5, and pattern the original using a projection lens system. Image on the substrate surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source for exposing a semiconductor manufacturing apparatus.

[0002]

2. Description of the Related Art In recent years, semiconductor devices have become more and more miniaturized. In the semiconductor manufacturing process, as the microfabrication progresses, semiconductor exposure equipment and semiconductor manufacturing equipment that manufacture semiconductors need an environment capable of further miniaturization. It is said that. Improvements in productivity and production efficiency of semiconductor exposure apparatuses are also being called for.

In such a situation, the semiconductor manufacturing apparatus uses a high-output light source device to manufacture the element by short-time exposure to improve the production efficiency, in order to improve the production efficiency.

As a means for realizing the high-output light source device, the output of the lamp itself which is the light source is increased. Looking at a high-powered lamp, its shape increases with the light output of the lamp, and its heat generation also increases.

Generally, when considering cooling of the lamp, the cooling capacity is maximized, and if the cooling is excessively performed, the metal filling the inside of the lamp is deposited, which causes reduction of illuminance and unevenness of illuminance. That is, for cooling the lamp, an appropriate temperature other than high temperature and low temperature at which deposition of the enclosed metal does not occur is required.

As a proposal for controlling the cooling means of the lamp based on such characteristics, the invention disclosed in Japanese Patent Laid-Open No. 8-162396 is disclosed.

[0007]

However, as described in the above-mentioned conventional example, the cooling of the lamp requires an appropriate temperature other than the high temperature and the low temperature so that the deposition of the enclosed metal does not occur. As a proposal for controlling the cooling means of the lamp, there is an invention according to Japanese Patent Application Laid-Open No. 8-162396. However, as described above, when a lamp having a high light output is confirmed, its shape becomes large according to the light output of the lamp, and The fever is also increasing. Therefore, even in the invention according to the above-mentioned patent publication that controls the cooling means of the lamp, it is impossible to adjust the temperature of the entire lamp to a constant temperature and to an appropriate temperature at which the enclosed metal does not deposit, and the lamp cap, When a part of the same lamp, such as the central part, is temperature-controlled to an appropriate temperature, a temperature difference such as a high temperature and a low temperature occurs in other parts. When the temperature difference occurs on the lamp, a part of the enclosed metal inserted in the lamp is deposited,
As a result of this precipitation, deterioration of illuminance and change of the bright spot of the lamp occur. Therefore, this phenomenon causes unevenness in illuminance, deterioration in illuminance, and the like in the device, which is a cause of defective element manufacturing.

An object of the present invention is to uniformly control the temperature of the light source lamp and to prevent the encapsulation metal in the light source lamp from depositing, and to prevent uneven illuminance and deterioration of illuminance as a device and to prevent defective elements. Eliminating the cause of manufacturing.

[0009]

In order to solve the above-mentioned problems, the present invention illuminates an original plate with light generated from a light source lamp, and the pattern of the original plate is projected onto a substrate surface using a projection lens system. In a semiconductor manufacturing device for imaging,
A plurality of cooling means are provided for cooling the light source lamp. It is desirable that the plurality of cooling means be independently controllable, and the plurality of cooling means are provided in at least one of a temperature distribution of the light source lamp, input power data of the light source lamp, and brightness data of the light source lamp. It is preferable to be independently controllable based on the above.

Further, in the semiconductor manufacturing apparatus according to the present invention,
It may have a plurality of coolers that operate independently for cooling the light source lamp, and at least one of a sensor for measuring the temperature distribution of the light source lamp and a sensor for measuring the brightness of the light source lamp. However, the air conditioner may be provided to circulate the air inside the housing of the light source lamp, and it is possible to have a controller that controls the refrigerator based on the output of the sensor.

In operating the device according to the present invention,
Turn on the light source lamp. In the light source lamp, the enclosed metal generally starts to vaporize and maintains a stable brightness. At this time, the temperature of the light source lamp rises, and in order to suppress the main temperature rise, the air cooled by the cooler is applied to the light source lamp.

Looking at the size of the light source of the light source lamp having a high light output, the size increases in proportion to the light output.
For this reason, using multiple outlets, the cooled air is
It is better to spray the light source lamp to control the temperature of the entire lamp. Regarding such a large-sized light source lamp, the temperature distribution of the lamp body changes depending on 1) input power and 2) how to attach the light source lamp. Therefore, by having a sensor that measures the input power to the light source lamp and the temperature distribution of the light source lamp, the initial cooling air temperature is adjusted based on the power input to the light source lamp, and then the light source lamp stabilizes. After that, the temperature distribution of the light source lamp is measured by the output of the temperature sensor. According to the temperature distribution in the light source lamp of the measurement data, the temperature of the cooling air is controlled independently, and the entire lamp can be cooled uniformly and within the range where the enclosed metal does not deposit, which is an object of the present invention. The temperature of the light source lamp is controlled to be uniform and the temperature of the light source lamp is controlled so that the enclosed metal in the lamp does not deposit, and it is possible to prevent uneven illuminance and deterioration of illuminance as a device and eliminate the cause of defective element manufacturing. Become.

Further, according to the present invention, a step of installing a manufacturing apparatus group for various processes including any one of the semiconductor manufacturing apparatuses in a semiconductor manufacturing factory, and manufacturing a semiconductor device by a plurality of processes using the manufacturing apparatus group It may be a method of manufacturing a semiconductor device including the step of: Connecting the manufacturing apparatus group with a local area network,
It is preferable that the method further comprises a step of performing data communication of information regarding at least one of the manufacturing apparatus group between the local area network and an external network outside the semiconductor manufacturing factory. A database provided is accessed via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or data communication is performed with the semiconductor manufacturing factory other than the semiconductor manufacturing factory via the external network. It is preferable to perform production control.

Further, according to the present invention, a manufacturing apparatus group for various processes including any one of the semiconductor manufacturing apparatuses described above, a local area network connecting the manufacturing apparatus groups, and an external network outside the factory from the local area network. It can also be applied to a semiconductor manufacturing factory that has a gateway that enables access and that enables data communication of information regarding at least one of the manufacturing apparatus groups.

Further, the present invention is a maintenance method for any one of the semiconductor manufacturing apparatus installed in a semiconductor manufacturing factory, wherein a vendor or a user of the semiconductor manufacturing apparatus is connected to an external network of the semiconductor manufacturing factory. A step of providing a maintenance database; a step of permitting access to the maintenance database from within the semiconductor manufacturing factory via the external network; and a step of manufacturing maintenance information accumulated in the maintenance database via the external network. It may be characterized by having a step of transmitting to the factory side.

Further, according to the present invention, in any one of the above semiconductor manufacturing apparatuses, a display, a network interface, and a computer that executes network software are further provided, and the maintenance information of the semiconductor manufacturing apparatus is transmitted via a computer network. It may be characterized by enabling data communication. The network software is connected to an external network of a factory in which the semiconductor manufacturing apparatus is installed, and provides a user interface on the display for accessing a maintenance database provided by a vendor or a user of the semiconductor manufacturing apparatus. It is preferable to be able to obtain information from the database via an external network.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment of Semiconductor Manufacturing Apparatus) A semiconductor manufacturing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a semiconductor manufacturing apparatus and an apparatus called a stepper according to an embodiment of the present invention.

As shown in FIG. 1, this semiconductor manufacturing apparatus 1
Has a light source lamp unit 4 for printing a semiconductor pattern, and the light emitted from the light source lamp unit 4 passes through an illumination optical system and is transmitted through the reticle 3 serving as an original plate.
Illuminate. The light that has passed through the reticle 3 passes through the exposure lens and is applied to the wafer W as a substrate placed on the XY stage 2, and the element pattern of the reticle 3 is transferred to the wafer W.
Expose on top. To continue the exposure operation, repeat XY
The stage 2 is moved below the lens to perform exposure, and the exposure operation is performed on the entire surface of the wafer.

FIG. 2 is a view showing a light source lamp section 4 which is a box to which the light source lamp is attached. The light source lamp unit 4 has a cathode base 5b and an anode base 5c therein, and the lamp 5 emits light for exposure from the lamp light emitting unit 5a.
In the case of the present embodiment, as a nozzle constituting cooling means for cooling the lamp 5, the optical system side nozzle 10 facing the cathode base 5b on the optical system side, and the lamp light emitting section 5 are provided.
It has three nozzles, a lamp emission side nozzle 11 directed to a and a mirror side nozzle 12 disposed near the elliptical mirror 13 and directed to the anode base 5c. Each of the nozzles is connected to a temperature control unit for controlling the temperature and the amount of temperature-controlled air blown from the nozzle.

The optical system side nozzle 10 has an optical system side temperature control unit 1
4. The nozzle 11 on the lamp light emitting part 5a side has a lamp light emitting part side temperature control part 15 on the lamp light emitting part 5a side and a mirror side nozzle 1.
A mirror-side temperature control unit 16 is attached to the nozzle 2, and these constitute a plurality of cooling means, and each nozzle 10, 11, 1
The temperature of the air blown from 2 and the air volume are controlled independently.

Further, four temperature sensors, that is, a cathode base temperature sensor 7, a cathode temperature sensor 6, an anode temperature sensor 8 and an anode base temperature sensor 9 are mounted on the lamp 5 in order to measure the temperature distribution of the lamp 5. ing. Each of the temperature sensors is connected to the temperature detection unit 17, and collects and processes the temperature distribution of each portion of the lamp 5 as data. Reference numeral 18 denotes a lamp power supply, which can monitor the input power to the lamp 5. The three temperature control units 14, 15, and 16, the lamp power supply unit 18, and the temperature detection unit 17 are the lamp temperature control unit 19
Is connected to each temperature sensor, and the temperature control unit and the temperature control unit operate in conjunction with each other.

Reference numeral 20 denotes a fan for exhausting the air inside the light source lamp section 4, and the fan 20 has an exhausting operation and a function of stirring the air inside the light source lamp section 4.

The operation of this semiconductor manufacturing apparatus will be specifically described with reference to FIGS. When exposing a semiconductor pattern, the light source lamp 5 in the light source lamp section 4 is used in a constantly lit state.

When the apparatus power is off, the lamp 5
Is off. In this off state, when the apparatus is started up, the lamp 5 is turned on to prepare for exposure. Before lighting, the lamp 5 has a uniform temperature distribution in a cold state, and the lamp 5 is lit by the input power input, and the temperature starts to rise. Usually, the temperature distribution of the lamp is determined by the anode, the cathode, and the light output direction. Immediately after lighting, the light of the lamp has little influence on the temperature distribution, and most of the temperature distribution is determined by the electric power supplied to the anode and the cathode. Therefore, in the initial state of lamp lighting, the temperature distribution is predicted based on the input power supplied from the lamp power supply 18 which is the power supply of the lamp 5, and the temperature of the temperature-controlled air from each nozzle 10, 11, 12 is predicted. And the air volume should be decided.

As described above, in the initial lighting state of the lamp, the lamp temperature control section 19 inputs the input power from the lamp power supply 18 to the lamp 5 in the form of data. The lamp temperature control unit 19 predicts the temperature distribution in the initial lighting state of the lamp 5 on the basis of the input power of the lamp 5 that has been input, and determines the temperature and the air volume of the air blown from each nozzle 10, 11, 12. . After the lamp 5 is turned on, the lamp 5 is air-conditioned based on the above prediction until it becomes stable.

In the present embodiment, as the determination of "until stabilization", it is determined that the lighting state of the lamp 5 is stable when the change in the lamp current value becomes small and a certain tolerance is entered. At this time, the temperature detection unit 17 measures the temperature distribution of the lamp 5 itself by using the temperature sensors 6, 7,
Measure using 8 and 9. Generally, heat generation due to the light amount factor is added depending on the position of the portion where the light is concentrated in addition to the power factor. Therefore, the lamp temperature control unit 19
Receives the measured temperature data from the temperature detection unit 17 and detects the temperature distribution state of the lamp 5.

In the lamp temperature control unit 19, the lamp 5
The temperature of the air blown out from each nozzle 10, 11, 12 and the air volume are set so that the temperature distribution of No. 1 is eliminated and the enclosed metal does not precipitate. Lamp temperature control unit 19
Is the cooling air of the set air volume and temperature is set for each nozzle 1
A command is issued as data to each of the temperature control units 14, 15 and 16 so that the temperature control units 14, 15 and 16 are blown out from 0, 11, and 12. According to the input data, the temperature control units 14, 15 and 16 start the operation to output the temperature-controlled air from the nozzles 10, 11 and 12, respectively. By performing the series of operations described above, lamp air conditioning can be performed in a direction in which the temperature distribution of the lamp 5 is canceled.

In the above embodiment of the present invention, a plurality of independently operating nozzles 10, 1 for cooling the light source lamp.
1, 12 and respective temperature control units 14, 15, 16 and a temperature sensor 6, for measuring the temperature distribution of the light source lamp 5.
7, 8, 9 and air conditioning equipment for circulating air in the housing of the light source lamp 5, and the nozzles 10, 11, 12 and the respective temperature control units 14, 15, 1 from the outputs of the sensors 6-9.
By having the lamp temperature control unit 19 for controlling 6,
The temperature of the cooling air is initially adjusted based on the electric power input to the light source lamp 5, and after the light source lamp 5 becomes stable, the temperature distribution of the light source lamp 5 is measured by the non-contact temperature sensors 6 to 9. Then, the temperature of the cooling air is controlled independently in the light source lamp 5 according to the temperature distribution, so that the entire lamp can be cooled uniformly and within the range in which the enclosed metal does not deposit.

In the present invention, a sensor for measuring the brightness of the light source lamp is provided in place of the temperature sensors 6 to 9, and the nozzles 10, 11, 12 and the respective temperature control units 14, 12 are set based on the brightness data of the light source lamp. You may control 15 and 16 independently.

(Embodiment of Semiconductor Production System) Next,
Semiconductor devices (ICs and LSs) using the apparatus according to the present invention
An example of a production system of a semiconductor chip such as I, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc. will be described. This is to perform maintenance services such as troubleshooting of a manufacturing apparatus installed in a semiconductor manufacturing factory, periodic maintenance, or software provision using a computer network outside the manufacturing factory.

FIG. 3 shows the whole system cut out from a certain angle. In the figure, 101 is a business office of a vendor (apparatus supplier) that provides a semiconductor device manufacturing apparatus. As an example of the manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing factory, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film forming equipment,
Flattening equipment, etc.) and post-process equipment (assembling equipment, inspection equipment, etc.) are assumed. In the business office 101, a host management system 10 that provides a maintenance database for manufacturing equipment is provided.
8, a plurality of operation terminal computers 110, and a local area network (LAN) 109 that connects these to construct an intranet or the like. Host management system 1
08 is provided with a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the office, and a security function for restricting access from the outside.

On the other hand, 102 to 104 are manufacturing factories of semiconductor manufacturers who are users of manufacturing equipment. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or may be factories belonging to the same manufacturer (for example, a factory for pre-process, a factory for post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 that connects them to construct an intranet, and a host as a monitoring apparatus that monitors the operating status of each manufacturing apparatus 106 are provided. A management system 107 is provided. Each factory 1
02-104 host management system 107
Is provided with a gateway for connecting the LAN 111 in each factory to the Internet 105 which is an external network of the factory. As a result, it becomes possible to access the host management system 108 on the side of the business office 101 of the vendor from the LAN 111 of each factory via the Internet 105, and the security function of the host management system 108 allows access to only a limited number of users. . Specifically, each manufacturing apparatus 1 is connected via the Internet 105.
In addition to notifying status information indicating the operating status of 06 (for example, a symptom of a manufacturing apparatus in which a trouble has occurred) from the factory side to the vendor side, response information corresponding to the notification (for example, information instructing a troubleshooting method, You can receive maintenance information such as software (data and data for handling), the latest software, and help information from the vendor side. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor's office 101 and data communication via the LAN 111 in each factory. . In addition,
Instead of using the Internet as an external network outside the factory, it is possible to use a leased line network (ISDN or the like) having high security without being accessed by a third party. Further, the host management system is not limited to one provided by a vendor, and a user may construct a database and place it on an external network to permit access from a plurality of factories of the user to the database.

Now, FIG. 4 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that shown in FIG. In the above example, a plurality of user factories each equipped with a manufacturing apparatus and a management system of a vendor of the manufacturing apparatus are connected by an external network, and production management of each factory or at least one unit is performed via the external network. The information of the manufacturing apparatus was data-communicated. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors and a management system of each vendor of the plurality of manufacturing equipments are connected by an external network outside the factory, and maintenance information of each manufacturing equipment is displayed. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturing maker), and a manufacturing apparatus for performing various processes is installed on a manufacturing line of the factory.
The film forming processing device 204 is introduced. Although only one manufacturing factory 201 is illustrated in FIG. 4, a plurality of factories are actually networked in the same manner. Each device in the factory is connected by LAN 206 to form an intranet,
The host management system 205 manages the operation of the manufacturing line.

On the other hand, the host management system 21 for performing remote maintenance of the supplied equipment is provided at each business office of the vendor (apparatus supply manufacturer) such as the exposure equipment manufacturer 210, the resist processing equipment manufacturer 220, and the film deposition equipment manufacturer 230.
1, 221, 231, which are provided with the maintenance database and the gateway of the external network as described above. A host management system 205 that manages each device in the user's manufacturing plant, and a vendor management system 2 for each device
11, 221, and 231 are connected to each other via the external network 200 such as the Internet or a dedicated line network. In this system, when trouble occurs in any of the series of production equipment on the production line,
Although the operation of the manufacturing line is suspended, it is possible to quickly respond by receiving remote maintenance via the Internet 200 from the vendor of the device in which the trouble has occurred, and the suspension of the manufacturing line can be minimized. .

Each manufacturing apparatus installed in the semiconductor manufacturing factory has a display, a network interface, and a computer for executing network access software and apparatus operating software stored in a storage device. The storage device is a built-in memory, a hard disk, or a network file server. The network access software includes a dedicated or general-purpose web browser, and provides a user interface with a screen, an example of which is shown in FIG. 5, on the display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the manufacturing equipment model 401, serial number 402, and subject 40 of the trouble.
3. Input information such as date of occurrence 404, urgency 405, symptom 406, coping method 407, and progress 408 in input items on the screen. The input information is transmitted to the maintenance database via the Internet, and the appropriate maintenance information as a result is returned from the maintenance database and presented on the display. In addition, the user interface provided by the web browser further has hyperlink functions 410 to 4 as shown in the figure.
12 enables operators to access more detailed information on each item, pull out the latest version of software used for manufacturing equipment from the software library provided by the vendor, and use the operation guide (help Information) can be withdrawn. Here, the maintenance information provided by the maintenance database includes the information about the present invention described above, and the software library also provides the latest software for implementing the present invention.

Next, a semiconductor device manufacturing process using the above-described production system will be described. FIG. 6 shows a flow of the whole manufacturing process of the semiconductor device. In step 1 (circuit design), the circuit of the semiconductor device is designed. In step 2 (mask manufacturing), a mask having the designed circuit pattern is manufactured. On the other hand, step 3
In (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by the lithography technique using the mask and the wafer prepared above. The next step 5 (assembly) is called a post-process, which is a process of forming a semiconductor chip using the wafer manufactured in step 4, and includes an assembly process (dicing, bonding), a packaging process (chip encapsulation), and the like. Including steps. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes and shipped (step 7). The front-end process and the back-end process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the remote maintenance system described above. Information for production management and device maintenance is also data-communicated between the front-end factory and the back-end factory via the Internet or the leased line network.

FIG. 7 shows a detailed flow of the wafer process. In step 11 (oxidation), the surface of the wafer is oxidized. In step 12 (CVD), an insulating film is formed on the wafer surface. In step 13 (electrode formation), electrodes are formed on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted in the wafer. Step 15
In (resist processing), a photosensitive agent is applied to the wafer. In step 16 (exposure), the circuit pattern of the mask is printed and exposed on the wafer by the exposure apparatus described above. In step 17 (development), the exposed wafer is developed. In step 18 (etching), parts other than the developed resist image are removed. In step 19 (resist stripping), the resist that is no longer needed after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented in advance, and even if troubles occur, quick recovery is possible, and semiconductor devices can be compared to conventional devices. Productivity can be improved.

[0038]

As described above, according to the present invention,
A plurality of independently controllable cooling means for cooling the light source lamp, either a temperature sensor for measuring the temperature distribution of the light source lamp or a sensor for measuring the brightness of the light source lamp, and By having an air-conditioning unit for circulating air and a control unit for controlling a cooling unit such as a refrigerator based on the output of the sensor, the temperature of the initial cooling air is adjusted based on the electric power input to the light source lamp. After that, after the light source lamp stabilizes, measure the temperature distribution of the light source lamp with the temperature sensor, and independently adjust the temperature of the cooling air according to the temperature distribution in the light source lamp, and evenly fill the entire lamp. It becomes possible to perform cooling within a range in which no metal is deposited, and the temperature of the light source lamp is made uniform so that the enclosed metal in the lamp, which is the object of the present invention, does not deposit,
In addition, by controlling the temperature, it is possible to prevent uneven illuminance and deterioration of illuminance as a device, and eliminate the cause of defective element manufacturing.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an entire semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing a light source unit of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a conceptual view of a semiconductor device production system using the semiconductor manufacturing apparatus according to the present invention viewed from a certain angle.

FIG. 4 is a conceptual view of a semiconductor device production system using the semiconductor manufacturing apparatus according to the present invention as viewed from another angle.

FIG. 5 is a specific example of a user interface.

FIG. 6 is a diagram illustrating a flow of a device manufacturing process.

FIG. 7 is a diagram illustrating a wafer process.

[Explanation of reference numerals] 1: semiconductor manufacturing apparatus, 2: XY stage, 3: reticle, 4: light source lamp section, 5: lamp, 5a: lamp light emitting section, 5b: cathode base, 5c: anode base, 6: cathode temperature Sensor, 7: Cathode base temperature sensor, 8: Anode temperature sensor,
9: Anode base temperature sensor, 10: Optical system side nozzle, 1
1: Nozzle on the lamp light emission side, 12: Nozzle on the mirror side, 13: Elliptical mirror, 14: Temperature control part on the optical system side, 15:
Lamp light emitting unit side temperature control unit, 16: Mirror side temperature control unit, 17:
Temperature detection unit, 18: Lamp power supply, 19: Lamp temperature control unit, 20: Fan for exhausting air inside the lamp unit, 101: Vendor office, 102, 103, 10
4: Manufacturing factory, 105: Internet, 106: Manufacturing apparatus, 107: Factory host management system, 108: Vendor side host management system, 109: Vendor side local area network (LAN), 110: Operating terminal computer, 111 : Factory local area network (LAN), 200: External network, 201:
Manufacturing apparatus Manufacturing factory of user, 202: Exposure apparatus, 20
3: resist processing device, 204: film forming processing device, 20
5: Factory host management system, 206: Factory local area network (LAN), 210: Exposure apparatus manufacturer, 211: Host management system of business office of exposure apparatus manufacturer, 220: Resist processing apparatus manufacturer, 221: Resist processing apparatus Host management system of maker's office,
230: film forming apparatus maker, 231: host management system of film forming apparatus maker's office, 401: manufacturing apparatus model,
402: serial number, 403: subject of trouble,
404: Date of occurrence, 405: Urgency, 406: Symptom, 40
7: Remedy, 408: Progress, 410, 411, 412:
Hyperlink function.

Claims (12)

[Claims] 1. A light source lamp is cooled in a semiconductor manufacturing apparatus in which light emitted from a light source lamp is used to illuminate an original plate and a pattern of the original plate is imaged on a surface of a substrate using a projection lens system. A semiconductor manufacturing apparatus having a plurality of cooling means for. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the plurality of cooling means can be independently controlled. 3. The plurality of cooling means can be independently controlled based on at least one of a temperature distribution of the light source lamp, input power data of the light source lamp, and brightness data of the light source lamp. The semiconductor manufacturing apparatus according to claim 1 or 2. 4. At least one of a plurality of temperature sensors for measuring the temperature distribution of the light source lamp and a sensor for measuring the brightness of the light source lamp is provided. The semiconductor manufacturing apparatus according to. 5. An air conditioning unit for circulating air in the housing of the light source lamp is provided.
4. The semiconductor manufacturing apparatus according to any one of 4. 6. A step of installing a manufacturing apparatus group for various processes including the semiconductor manufacturing apparatus according to claim 1 in a semiconductor manufacturing factory, and a semiconductor by a plurality of processes using the manufacturing apparatus group. And a step of manufacturing a device. 7. Data communication of information relating to at least one of the manufacturing apparatus group between the step of connecting the manufacturing apparatus group with a local area network and between the local area network and an external network outside the semiconductor manufacturing factory. The method for manufacturing a semiconductor device according to claim 6, further comprising: 8. A database provided by a vendor or a user of the semiconductor manufacturing apparatus is accessed through the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing different from the semiconductor manufacturing factory. The semiconductor device manufacturing method according to claim 7, wherein production management is performed by performing data communication with a factory via the external network. 9. A manufacturing apparatus group for various processes including the semiconductor manufacturing apparatus according to claim 1, a local area network connecting the manufacturing apparatus group, and a local area network outside the factory. A semiconductor manufacturing factory, comprising a gateway that enables access to an external network, and enabling data communication of information regarding at least one of the manufacturing apparatus group. 10. The method according to claim 1, wherein the semiconductor manufacturing factory is installed.
The maintenance method for a semiconductor manufacturing apparatus according to any one of 1 to 5, wherein a vendor or a user of the semiconductor manufacturing apparatus,
Providing a maintenance database connected to an external network of a semiconductor manufacturing plant, permitting access to the maintenance database from within the semiconductor manufacturing plant via the external network, and maintenance stored in the maintenance database And a step of transmitting information to the semiconductor manufacturing factory side via the external network. 11. The semiconductor manufacturing apparatus according to claim 1, further comprising a display, a network interface, and a computer that executes network software, and maintenance information for the semiconductor manufacturing apparatus is stored in a computer network. A semiconductor manufacturing apparatus, which enables data communication via a device. 12. The network software comprises:
A user interface for accessing a maintenance database provided by a vendor or a user of the semiconductor manufacturing apparatus connected to an external network of a factory in which the semiconductor manufacturing apparatus is installed is provided on the display, and the user interface is provided via the external network. The semiconductor manufacturing apparatus according to claim 11, wherein the information can be obtained from a database.