JP2002324750A - Device manufacturing equipment - Google Patents

Abstract

(57) [Problem] To provide a device manufacturing apparatus capable of manufacturing a device with higher accuracy than ever before. SOLUTION: An exposure apparatus, a chamber 1 in which the exposure apparatus is disposed, and an air conditioner room 10 for performing air conditioning of the chamber 1 are provided. Temperature-regulated air supply devices 16W and 16R, which are cleaned through the filter 14 and the dust removal filter 15 and supplied to the main body of the exposure apparatus, are arranged, and the resistors 19W and 19R for uniformizing the wind speed distribution are connected to the temperature-regulated air supply devices. 16
W, 16R mounted on the air blowing surface and the resistor 1
9W and 19R have many fine holes.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads,
The present invention relates to a device manufacturing apparatus suitably used for manufacturing a device such as a micromachine.

[0002]

2. Description of the Related Art In the process of manufacturing semiconductor devices such as ICs, LSIs, and liquid crystal panels, many processes are performed on substrates (semiconductor wafer substrates and glass substrates). This is an important process that is the key to manufacturing. Exposure apparatuses (steppers, scanners, etc.) are known as apparatuses for performing this process.

When a resist applied to a substrate such as a wafer is exposed to ionizing radiation (ultraviolet rays, X-rays, electron beams, etc.), a polymer film which causes a chemical reaction efficiently and a catalyst (acid) are generated by exposure, By baking (PEB), it can be roughly classified into a chemically amplified resist in which an image is formed by a catalyst. Chemically amplified resists are commonly used in recent years as resists for excimer laser light, for which it is easy to achieve high sensitivity due to image formation using a catalyst and for which it is difficult to obtain illuminance. On the other hand, the catalyst generated by the exposure diffuses in the air or on the wafer surface, and the baking treatment (PEB) accelerates the catalyst work and degrades the image profile. It is necessary to control chemical contamination to basic gases such as amines and amides in an environmental atmosphere through baking treatment (PEB).

On the other hand, the light emitted from the light source is
Optical system that irradiates the reticle surface with
Various optical members such as lenses and mirrors are used. Obedience
In recent years, with the shortening of the exposure wavelength in recent years, this exposure light has become transparent.
Excessive / irradiated optical member fogged and reached the wafer surface
There is a problem that the amount of exposure to light decreases. This cloudy
The material of the substance causing the cause is an organic compound or ammonium sulfate (NH_Four )_Two 
SO_Four The cause is the ammonium present in the air
Mion (NH_Four )⁺ And sulfate ions (SO_Four ) ^2-Or
These compounds or organic gases are exposed to exposure light.
Is thought to be due to photochemical reaction to adhere to optical members
Can be

In order to solve the problems of the surface insolubilization of the chemically amplified resist and the fogging of the optical members, an impurity gas removal filter is mounted in an environment chamber for controlling the temperature and humidity of the surrounding environment surrounding the exposure apparatus main body or dust. Conventionally, substances such as a basic gas, a sulfuric acid gas, and an organic compound gas present in the atmosphere have been removed.

As the impurity gas removal filter, for example, a chemical filter using ion exchange fibers, an activated carbon filter using activated carbon particles or activated carbon fibers, and a chemical filter in which an acidic substance or an alkaline substance is impregnated on these activated carbons are used. . However, it is desirable to select an optimal filter in consideration of the type of gas to be removed and the characteristics of the filter. Further, when removing a plurality of types of gases, an optimal filter for each of the gases may be used in an overlapping manner.

FIG. 11 is an overall configuration diagram of a device manufacturing apparatus according to a conventional example. In FIG. 11, 1 is a chamber for performing air conditioning of the apparatus main body, 10 is an air conditioner room for adjusting the temperature of air, 20 is a filter box for filtering fine foreign matters and forming a uniform flow of clean air, and 30 is an apparatus environment. The booths that are isolated from the outside are shown.

Reference numeral 11 denotes a cooler, and reference numeral 12 denotes a base heater, which controls the temperature of air. 17 is a return port that takes in the air supplied into the booth 30 again into the air conditioner room 10;
18 is an outside air inlet for taking in outside air into the air conditioner room 10;
4 'indicates a chemical filter for the outside air inlet.
13 is a blower, 14 is a chemical filter, 12B is a reheat heater for strict temperature adjustment, and 15 is a dust filter.

Reference numeral 28 denotes a temperature sensor, 25 denotes a wafer stage space of the exposure apparatus main body, and 28W denotes a wafer stage space 2.
5, a reticle stage space 26 of the exposure apparatus main body, and 28R a reticle stage space 2
6 shows the temperature sensors provided in each of FIGS. 12W is a reheat heater for the wafer stage space 25, 16W is a temperature control air supply device for supplying air strictly temperature-controlled by the reheat heater 12W to the wafer stage space 25, 15W
Indicates a dust filter. 12R is a reheat heater for the wafer stage space 25, and 16R is a reheat heater 12R.
A temperature control air supply device for supplying air whose temperature is more strictly adjusted to the wafer stage space 25, and 15R denotes a dust filter. 27 is each temperature sensor 28, 28
W, 28R based on the detected value from
5 shows a temperature controller that performs temperature control of W and 12R.
Note that arrows in FIG. 11 indicate the flow of air inside the device manufacturing apparatus.

As shown in FIG. 11, a general environmental chamber is provided with a dust filter 15 (ULPA or the like) on the ceiling.
Downflow in the chamber 1. On the other hand, in the exposure apparatus main body, an interferometer is used for accurate positioning and drive control of a stage on which a photosensitive substrate such as a wafer or an original such as a reticle is mounted. This interferometer detects position information by using an interference phenomenon of laser light emitted from a laser light source mounted on the interferometer. However, since the wavelength of the laser beam changes due to a temperature change, the laser beam path of the interferometer and each of the stage spaces 25 and 26 must be maintained at a uniform temperature in order to perform accurate stage position control. For this purpose, a temperature control air supply device 16W, which supplies temperature-controlled air to each of the stage spaces 25, 26,
16R is arranged near each of the stage spaces 25 and 26. In addition, the temperature control air supply devices 16W and 16R include:
Dust filters 15W and 15R are mounted.

In general, in places where high-precision temperature control is required, a dust filter is arranged at a blow-off portion which is the most downstream in the air supply path. The reason is that it is possible to remove dust entering from the air supply path, and to make the wind speed distribution on the blowout surface uniform due to the laminar flow effect of the filter medium.

[0012]

With the recent increase in wafer size and miniaturization of exposure patterns, it has been required to control the temperature of the stage space in a more uniform and stable state than ever before. However, the stage space has been expanded due to the increase in wafer size, and it has become difficult to control the temperature of the entire stage space with higher precision than before.
The following can be considered as this factor.

[0013] Obstacles that hinder the flow of temperature-regulated air existing in the stage space The air blown out from the temperature-regulated air supply device flows downstream, but if there is an obstacle in the path, the flow is obstructed. I will. For this reason, a pool of air is generated on the downstream side of the obstacle, and the temperature of the portion is higher than the ambient temperature. As a countermeasure, it is only necessary to remove obstacles that impede air flow from the stage space to improve the flow, but it is actually difficult.

Heat Source Existing Around Stage Space Radiation heat from a heat source existing around the stage space enters the stage space, causing a non-uniform temperature distribution in the stage space. Further, it is difficult to control the temperature during operation because the amount of heat generated varies in the operation state of the exposure apparatus.

Change in position of heat source due to movement of stage The stage generates heat under the influence of exposure heat or a linear motor for driving, and moves in the stage space, so that the position of the heat source changes. Therefore, since the temperature distribution changes at the moving position of the stage, it is difficult to control the temperature at each moving position of the stage.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and has as its object to provide a device manufacturing apparatus capable of manufacturing a device with higher precision than ever before.

[0017]

In order to achieve the above object, a device manufacturing apparatus according to the present invention comprises a chamber, an air conditioner room for air-conditioning the chamber, and an exposure unit for exposing a pattern of an original onto a substrate. In the device manufacturing apparatus comprising: a temperature adjustment unit that adjusts the temperature of the gas, and a temperature control gas supply unit that cleans the gas whose temperature has been adjusted by the temperature adjustment unit through a filter and supplies the gas to the exposure unit. The temperature control gas supply unit is characterized in that the temperature control gas supply unit has a plurality of fine openings on a gas blowing surface and a resistor for adjusting a wind speed distribution of the gas on the gas blowing surface.

By adopting the above configuration, the device manufacturing apparatus of the present invention can provide an obstacle obstructing the flow of temperature-regulated air existing in the stage space, a heat source existing around the stage space, and a change in the position of the heat source due to the stage movement. Due to the above-mentioned problems, the temperature of the stage space can be controlled with higher accuracy than before. In addition, dynamic temperature control of the stage space can be performed in response to further higher precision of temperature control in the future.

Further, with the above configuration, it is possible to improve the alignment performance by improving the measurement accuracy of the interferometer in the device manufacturing apparatus, and to provide a device manufacturing apparatus capable of manufacturing a device with higher accuracy than ever before. it can.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION According to a preferred embodiment of the present invention, the device manufacturing apparatus determines the shape of all or a part of fine holes of the resistor and the number of all or part of the holes. Control means for arbitrarily setting and controlling the aperture ratio and the wind speed distribution from the gas outlet surface by changing the aperture ratio. Here, the control means adjusts the shape of all or some of the openings and the number of all or some of the openings in accordance with the temperature state in the exposure section. Further, the control means controls an opening ratio of fine openings of the resistor and an in-plane wind speed distribution in accordance with an operation state of the exposure unit. Further, the control means changes the opening ratio of fine openings of the resistor according to the positions of the substrate stage and the original stage of the exposure unit, and adjusts the in-plane wind speed distribution.

In the present embodiment, the opening is formed in the resistor by etching. Further, the filter is a dust filter and / or a chemical filter. Further, the exposure section has an interferometer.

[0022]

Next, an embodiment of the present invention will be described in detail with reference to the drawings. [First Embodiment] FIG. 1 is an overall configuration diagram of a device manufacturing apparatus provided with an exposure apparatus (scanner) according to a first embodiment. A chamber 1 is used for air conditioning of the exposure apparatus main body. The chamber 1 is mainly composed of an air conditioner room 10 for adjusting the temperature of air, a filter box 20 for filtering fine foreign substances to form a uniform flow of clean air, and a booth 30 for shutting off the environment of the apparatus from the outside. I have. In the chamber 1, air whose temperature is adjusted by a cooler 11 and a base heater 12 in an air conditioner room 10 is strictly adjusted in temperature by a reheater 12B through a chemical filter 14 by a blower 13, and a dust filter It is supplied to the booth 30 through 15. The air supplied to the booth 30 is taken into the air conditioner room 10 again through the return port 17 and circulates in the chamber 1. Usually this chamber 1
Is not strictly a complete circulatory system. In order to always maintain the inside of the booth 14 at positive pressure, about 10% of the circulating air amount in the booth 30 is taken in from the outside air inlet 18 provided in the air conditioner room 10 and the outside air inlet chemical filter 14 ′. ,
It is introduced through a cooler 11, a base heater 12, and a blower 13. The reason why the booth 30 is maintained at a positive pressure is to prevent minute foreign substances from entering the booth 30 from outside the booth 30 through the minute gaps in the booth 30.

In the wafer stage space 25, a temperature control air supply device 16W for supplying air whose temperature is strictly controlled by a dedicated reheater 12W is arranged near the stage space 25. The temperature control air supply device 16W includes a resistor 1 for uniformizing the wind speed distribution on the blowing surface.
9W is mounted on the air blowing surface of the dust filter 15W. Similarly, a temperature-regulated air supply device 16R that supplies air whose temperature is strictly controlled by the dedicated reheat heater 12R to the reticle stage space 26 is also arranged near the stage space. Similarly, the resistor 19R is mounted on the air blowing surface of the dust filter 15R. Further, the reheat heaters 12W, 12R are provided with temperature sensors 28, 28W,
Temperature control is performed by the temperature controller 27 based on the detected value of 28R and the like.

FIG. 2 is a detailed view of the temperature control air supply device of FIG. 1, wherein FIG. 2 (a) is an overall view and FIG. 2 (b) is a detailed view showing an example of a resistor. As shown in FIGS. 1 and 2, the resistor 19 for adjusting the wind speed distribution of the air supplied from the temperature control air supply device 16 through the dust removal filter 15 has many fine holes. The shape and number of holes can be arbitrarily set and controlled by the control means according to the temperature condition of 26. Thereby, each stage space 25,
A large aperture is set in advance for the location of the interferometer laser beam path, which is affected by obstacles obstructing the flow of the temperature-regulated air and heat sources from the surroundings. It is possible to locally adjust the air flow (distribution adjustment) in the temperature control area, such as increasing the temperature.

As described above, not only the opening ratio of the entire air outlet surface can be arbitrarily set, but also the partial opening ratio of the air outlet surface can be set arbitrarily. Can be set arbitrarily in all directions. Here, as a method of adjusting the opening ratio, for example, a method of changing the shape of the opening portion (opening area) or the number of opening portions can be considered.

[Second Embodiment] FIG. 3 is an overall configuration diagram of a device manufacturing apparatus provided with an exposure apparatus (scanner) according to a second embodiment. The present embodiment has a variable function that can change the aperture ratio of each resistor in accordance with the operation state of the exposure apparatus and the respective movement positions of the wafer stage and the reticle stage. Except for the exposure apparatus control system 21 for variably controlling the aperture ratio, the aperture ratio controller 22, and the aperture ratio variable device 23,
The configuration is similar to that of the embodiment.

First, an exposure apparatus control system 21 outputs a status signal of the exposure apparatus to detect the operating state of the exposure apparatus. This status signal includes machine status (flow) information in the exposure process, wafer stage,
Each position information of the reticle stage is included.

Next, the aperture ratio controller 22 receives the status signal, and controls the temperature-regulated air supply devices 16W, 1 in the wafer stage space 25 and the reticle stage space 26.
Each resistor 19W, 1 mounted on 6R air blowing surface
Calculate the opening rate of 9R. The calculated aperture ratio is changed using the aperture ratio variable device 23.

The aperture ratio variable device 23 automatically changes a plurality of resistors having different aperture ratios by using a robot or the like, or changes the aperture ratio by overlapping these resistors.
A method using control means for adjusting the wind speed distribution in the blowing surface can be considered.

As a result, the influence of the amount of heat generated in the operating state of the exposure apparatus and the change in the position of the heat source due to the movement of the wafer stage and the reticle stage are reduced, and the dynamic temperature control of each stage space 25, 26 can be performed. Therefore, the temperature control can be performed with higher accuracy.

Here, the resistor is made of, for example, a punched plate formed by punching an opening shape in a plate material by a press machine, a mesh material in which wires are braided vertically and horizontally, or a fine granular material / powder is sintered. A sintering material formed by etching, an etching plate that forms an opening by etching, and the like can be considered. However, for example, the blowing air volume of the temperature control air supply device is 10 m ³ / min, and the blowing area is 0.
In the case of 3 m ² , it is necessary to set the pressure difference before and after the resistor to about 100 Pa in order to make the wind speed distribution on the blowing surface uniform. In this case, the opening ratio becomes about 10%, and openings having a diameter of 0.2 mm and a pitch of about 0.5 mm are formed in the resistor. Further, considering that it is necessary to arbitrarily form an opening shape and a number at an arbitrary place in the resistor, the etching process is optimal. further,
Etching can process fine different shapes simultaneously,
It does not require expensive molds and the manufacturing man-hour is short, so the cost merit is high.

The temperature control gas supply unit in the present invention is
It includes not only the temperature-controlled air supply device in each of the above-described embodiments but also all of the temperature-adjusted gas blowing surfaces.

[Third Embodiment] FIGS. 4 and 5 show a third embodiment.
FIG. 3 is a detailed view of a temperature-regulated air supply device in an exposure apparatus (scanner) according to the example. Here, FIG. 4 (a) shows an overall view, FIG. 4 (b) shows an example of the resistor of FIG. 4 (a), and FIG. 5 (b) shows the temperature distribution in the temperature control space (the vertical axis is the temperature, and the horizontal axis is the blowing position). FIGS. 12 and 13 are detailed views of a temperature-regulated air supply device in an exposure apparatus according to a conventional example. Here, FIG. 12 (a) shows an overall view, FIG. 12 (b) shows the temperature control air blowing surface of FIG. 12 (a), and FIG. 13 (a) shows the air volume of the temperature control air blowing surface of FIG. (Wind speed) distribution (the vertical axis is the air volume, the horizontal axis is the blowing position), and FIG. 13B shows the temperature distribution in the temperature control space (the vertical axis is the temperature, and the horizontal axis is the blowing position).

Air volume adjustment (distribution adjustment) in the stage space of the exposure apparatus according to the temperature distribution in the stage space.
12 (a), (b), and FIG.
As shown in (a) and (b), a plurality of temperature control air supply boxes are provided, and the flow rate of air supplied to each temperature control air supply box is adjusted, or the inside of the temperature control air supply box is partitioned by several walls. The only option was to adjust the flow rate of air supplied to each room. For this reason, the air volume (wind speed) of the blowing surface changes abruptly at the boundary of the temperature, and precise air volume adjustment (distribution adjustment) is very difficult. Further, since a plurality of temperature control air supply boxes and a plurality of air supply systems are required, the scale of the apparatus has been expanded.

On the other hand, FIGS. 4A and 4B and FIG.
As shown in (a) and (b), the porosity of the resistor is set in advance in accordance with the temperature distribution in the stage space, and the porosity of the blowing surface near the temperature boundary is gradually changed. In addition, the gap amount of the air volume (wind speed) at the boundary becomes small, and continuous and precise air volume adjustment (distribution adjustment) becomes possible. In addition, the temperature control air supply box and air supply system can be minimized, which leads to space saving of the device. Note that the distribution of the air volume (wind speed) in the blowing surface can be arbitrarily adjusted not only in the left and right directions but also in all directions such as up and down and oblique.

[Embodiment of Semiconductor Production System] Next, devices such as semiconductors (semiconductor chips such as IC and LSI, liquid crystal panels, C
An example of a production system of a CD, a thin-film magnetic head, a micromachine, and the like will be described. In this method, maintenance services such as troubleshooting and periodic maintenance of a manufacturing apparatus installed in a semiconductor manufacturing factory or provision of software are performed using a computer network outside the manufacturing factory.

FIG. 6 shows the whole system cut out from a certain angle. In the figure, reference numeral 101 denotes a business establishment of a vendor (apparatus supply maker) that provides a semiconductor device manufacturing apparatus. As an example of a manufacturing apparatus, a semiconductor manufacturing apparatus for various processes used in a semiconductor manufacturing plant, for example,
Pre-process equipment (lithography equipment such as exposure equipment, resist processing equipment, etching equipment, heat treatment equipment, film formation equipment,
It is assumed that flattening equipment and the like and post-processing equipment (assembly equipment, inspection equipment, etc.) are used. In the business office 101, a host management system 10 for providing a maintenance database of manufacturing equipment
8. It has a plurality of operation terminal computers 110 and a local area network (LAN) 109 connecting these to construct an intranet or the like. Host management system 1
Reference numeral 08 includes a gateway for connecting the LAN 109 to the Internet 105, which is an external network of the business office, and a security function for restricting external access.

On the other hand, 102 to 104 are semiconductor manufacturers (semiconductor device manufacturers) as users of the manufacturing apparatus.
Is a manufacturing factory. The manufacturing factories 102 to 104 may be factories belonging to different manufacturers or factories belonging to the same manufacturer (for example, a factory for a pre-process, a factory for a post-process, etc.). In each of the factories 102 to 104, a plurality of manufacturing apparatuses 106, a local area network (LAN) 111 connecting them to construct an intranet or the like, and a host as a monitoring apparatus for monitoring the operation status of each manufacturing apparatus 106 are provided. A management system 107 is provided. The host management system 107 provided in each of the factories 102 to 104 includes a gateway for connecting the LAN 111 in each of the factories to the Internet 105 which is an external network of the factory. As a result, access from the LAN 111 of each factory to the host management system 108 on the vendor 101 side via the Internet 105 is possible, and only users limited by the security function of the host management system 108 are permitted to access. Specifically, via the Internet 105,
In addition to the status information indicating the operation status of each manufacturing apparatus 106 (for example, the symptom of the manufacturing apparatus in which the trouble has occurred) is notified from the factory side to the vendor side, the response information corresponding to the notification (for example, an instruction method for the trouble) Information
Software and data for coping), the latest software, and maintenance information such as help information can be received from the vendor. A communication protocol (TCP / IP) generally used on the Internet is used for data communication between each of the factories 102 to 104 and the vendor 101 and data communication with the LAN 111 in each of the factories. In addition,
Instead of using the Internet as an external network outside the factory, it is also possible to use a leased line network (such as ISDN) that is inaccessible from a third party and has high security. In addition, the host management system is not limited to the one provided by the vendor, and a user may construct a database and place it on an external network, and permit access to the database from a plurality of factories of the user.

FIG. 7 is a conceptual diagram showing the entire system of this embodiment cut out from an angle different from that of FIG. In the above example, a plurality of user factories each having a manufacturing device and a management system of a vendor of the manufacturing device are connected via an external network, and the production management of each factory and at least one device are connected via the external network. Data communication of the information of the manufacturing apparatus. On the other hand, in this example, a factory equipped with manufacturing equipment of a plurality of vendors is connected to a management system of each of the plurality of manufacturing equipments via an external network outside the factory, and maintenance information of each manufacturing equipment is stored. It is for data communication. In the figure, reference numeral 201 denotes a manufacturing plant of a manufacturing apparatus user (semiconductor device manufacturer), and a manufacturing line for performing various processes, for example, an exposure apparatus 202, a resist processing apparatus 203;
A film forming apparatus 204 is introduced. Although only one manufacturing factory 201 is illustrated in FIG. 7, a plurality of factories are actually networked similarly. Each device in the factory is connected by a LAN 206 to form an intranet or the like, and a host management system 205 manages the operation of the production line. On the other hand, an exposure apparatus maker 210, a resist processing apparatus maker 220, a film forming apparatus maker 230, etc.
Each business establishment of the vendor (device supply maker) is provided with a host management system 211, 221, 231 for remote maintenance of the supplied equipment, and these are provided with the maintenance database and the gateway of the external network as described above. . The host management system 205 that manages each device in the user's manufacturing factory and the vendor management systems 211, 221, and 231 of each device are connected to the external network 20.
0 or a dedicated line network. In this system, if a trouble occurs in any of a series of manufacturing equipment in the manufacturing line, the operation of the manufacturing line is stopped, but remote maintenance is performed from the vendor of the troubled equipment via the Internet 200. As a result, quick response is possible, and downtime of the production line can be minimized.

Each of the manufacturing apparatuses installed in the semiconductor manufacturing factory includes a display, a network interface, and a computer that executes network access software and apparatus operation software stored in a storage device. The storage device is a built-in memory, a hard disk, a network file server, or the like. The network access software includes a dedicated or general-purpose web browser, and provides, for example, a user interface having a screen as shown in FIG. 8 on a display. The operator who manages the manufacturing equipment at each factory refers to the screen and refers to the model (4
01), serial number (402), subject of trouble (403), date of occurrence (404), urgency (405), symptom (406), remedy (407), progress (408), etc. on the screen. Fill in the input fields. The entered information is sent to the maintenance database via the Internet,
The resulting appropriate maintenance information is returned from the maintenance database and presented on the display. Further, the user interface provided by the web browser further realizes a hyperlink function (410, 411, 412) as shown in the figure, so that the operator can access more detailed information of each item, and can access from the software library provided by the vendor. The latest version of software used for the manufacturing apparatus can be extracted, and an operation guide (help information) for reference by a factory operator can be extracted. Here, the maintenance information provided by the maintenance database includes the information on the present invention described above, and the software library also provides the latest software for realizing the present invention.

Next, a manufacturing process of a semiconductor device using the above-described production system will be described. FIG.
1 shows a flow of an overall semiconductor device manufacturing process. In step 1 (circuit design), the circuit of the semiconductor device is designed. Step 2 is a process for making a mask on the basis of the circuit pattern design. On the other hand, in step 3 (wafer manufacturing), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and an assembly process (dicing, dicing,
Bonding), an assembly process such as a packaging process (chip encapsulation) and the like. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7). The pre-process and the post-process are performed in separate dedicated factories, and maintenance is performed for each of these factories by the above-described remote maintenance system. Also, between the pre-process factory and the post-process factory,
Information and the like for production management and device maintenance are communicated via the Internet or a dedicated line network.

FIG. 10 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. In step 15 (resist processing), a photosensitive agent is applied to the wafer.
Step 16 (exposure) uses the device manufacturing apparatus, such as the above-described exposure apparatus, to print and expose the circuit pattern of the mask onto the wafer. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. Step 19
In (resist removal), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer. Since the manufacturing equipment used in each process is maintained by the remote maintenance system described above, troubles can be prevented beforehand, and if troubles occur, quick recovery is possible. Productivity can be improved.

[0043]

As described above, according to the present invention,
A temperature control section for controlling the temperature of the gas, a temperature control gas supply section for supplying the purified gas to the exposure section, and a plurality of fine openings on a gas discharge surface of the gas from the temperature control gas supply section. By providing a resistor that makes the wind speed distribution (air volume distribution) of the gas uniform on the surface, the temperature of the entire stage space can be controlled in a uniform and stable state, and device manufacturing with higher precision than before can be manufactured. An apparatus can be provided.

Further, by changing all or a part of the shape and the number of the openings of the resistor by the control means, the opening ratio of the openings of the resistor can be arbitrarily set, and the in-plane wind speed distribution can be changed up and down. It can be set arbitrarily in all directions such as left and right. Therefore, local air volume adjustment in the temperature control area is possible.

Further, since the opening ratio of the opening of the resistor and the in-plane air velocity distribution thereof can be changed by the control means in accordance with the operating state of the exposure section, dynamic temperature control of the stage space becomes possible. Further high-precision temperature control becomes possible.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram of a device manufacturing apparatus according to a first embodiment of the present invention.

FIG. 2 is a detailed view of the temperature control air supply device of FIG. 1,
(A) is an overall view, and (b) is a detailed view showing an example of a resistor.

FIG. 3 is an overall configuration diagram of a device manufacturing apparatus according to a second embodiment of the present invention.

FIGS. 4A and 4B are detailed views of a temperature control air supply device in an exposure apparatus (scanner) according to a third embodiment, where FIG. 4A is an overall view and FIG. One example is shown below.

5A and 5B are detailed views of a temperature control air supply device in an exposure apparatus (scanner) according to a third embodiment, and FIG. 5A shows a distribution of an air volume (wind speed) of a blowing surface of a resistor in FIG. (B) shows the temperature distribution in the temperature control space (vertical axis is temperature, horizontal axis is the blowing position).

FIG. 6 is a conceptual view of a semiconductor device production system including a device manufacturing apparatus according to an embodiment of the present invention as viewed from a certain angle.

FIG. 7 is a conceptual diagram of a semiconductor device production system including a device manufacturing apparatus according to an embodiment of the present invention, as viewed from another angle.

FIG. 8 is a diagram showing a specific example of a user interface in a semiconductor device production system including a device manufacturing apparatus according to one embodiment of the present invention.

FIG. 9 is a diagram illustrating a flow of a device manufacturing process by the device manufacturing apparatus according to one embodiment of the present invention.

FIG. 10 is a diagram illustrating a wafer process by the device manufacturing apparatus according to one embodiment of the present invention.

FIG. 11 is an overall configuration diagram of a device manufacturing apparatus according to a conventional example.

12A and 12B are detailed views of a temperature control air supply device in an exposure apparatus according to a conventional example, wherein FIG. 12A is an overall view and FIG.

13A and 13B are detailed diagrams of a temperature-regulated air supply device in an exposure apparatus according to a conventional example, in which FIG. 13A shows an air volume (wind speed) distribution on a temperature-regulated air blowing surface in FIG. (B) and (b) show the temperature distribution in the temperature control space (the vertical axis is the temperature, and the horizontal axis is the blowing position).

[Explanation of symbols]

1: chamber, 10: air conditioner room, 11: cooler, 12:
Base heater, 12B: reheat heater (for booth), 12
W: reheat heater (for wafer stage space), 12R: reheat heater (for reticle stage space), 13: blower,
14: chemical filter (for circulation), 14 ': chemical filter (for outside air inlet), 15: dust filter, 15
W: Dust filter (for wafer stage space), 15R:
Dust filter (for reticle stage space), 16W: Temperature control air supply device (for wafer stage space), 16R:
Temperature control air supply device (for reticle stage space), 1
7: return port, 18: outside air inlet, 19W: resistor (for wafer stage space), 19R: resistor (for reticle stage space), 20: filter box, 21: exposure apparatus control system, 22: aperture ratio Controller, 23: aperture ratio variable device, 25: wafer stage space, 26: reticle stage space, 27: temperature controller, 28, 28
W, 28R: temperature sensor, 30: booth.

Claims (15)

[Claims] 1. A device manufacturing apparatus comprising: a chamber; an air conditioner room for air-conditioning the chamber; and an exposure unit for exposing a pattern of an original onto a substrate; a temperature adjustment unit for adjusting a temperature of gas; A temperature-controlling gas supply unit that cleans the gas temperature-controlled by the temperature control unit through a filter and supplies the gas to the exposure unit, wherein the temperature-controlling gas supply unit has a fine opening in the gas blowing surface. A device manufacturing apparatus comprising: a plurality of resistors for adjusting a wind speed distribution of the gas on the blowing surface. 2. Changing the shape of all or a part of the fine holes of the resistor and the number of all or a part of the holes to change the hole ratio and the wind speed from the gas blowing surface. The device manufacturing apparatus according to claim 1, further comprising a control unit configured to arbitrarily set and control the distribution. 3. The method according to claim 1, wherein the control unit adjusts the shape of all or a part of the opening and the number of all or part of the opening in accordance with a temperature condition in the exposure unit. The device manufacturing apparatus according to claim 2. 4. The apparatus according to claim 1, wherein said control means controls an aperture ratio of fine apertures of said resistor and an in-plane wind speed distribution in accordance with an operation state of said exposure unit. Item 4. The device manufacturing apparatus according to item 2 or 3. 5. The control means changes the porosity of fine holes of the resistor according to the positions of a substrate stage and an original stage of the exposure unit, and adjusts an in-plane wind speed distribution. 3. The method according to claim 2, wherein
The device manufacturing apparatus according to any one of claims 4 to 4. 6. The device manufacturing apparatus according to claim 1, wherein the resistor has the opening formed by etching. 7. The filter according to claim 1, wherein the filter is a dust filter and / or a dust filter.
The device manufacturing apparatus according to claim 1, wherein the device manufacturing apparatus is a chemical filter. 8. The device manufacturing apparatus according to claim 1, wherein the exposure unit has an interferometer. 9. The device manufacturing apparatus according to claim 1, further comprising a display, a network interface, and a computer that executes network software, and stores maintenance information of the device manufacturing apparatus. A device manufacturing apparatus which enables data communication via a computer network. 10. The network software,
Provided on the display is a user interface for accessing a maintenance database provided by a vendor or a user of the device manufacturing apparatus connected to an external network of a factory where the device manufacturing apparatus is installed, and providing the user interface via the external network. 10. The device manufacturing apparatus according to claim 9, wherein information can be obtained from a database. 11. A step of installing a group of manufacturing apparatuses for various processes including the device manufacturing apparatus according to claim 1 in a semiconductor manufacturing factory, and a plurality of processes using the group of manufacturing apparatuses. Manufacturing a semiconductor device by using the method. 12. A step of connecting the manufacturing equipment group via a local area network, and data communication between at least one of the manufacturing equipment group between the local area network and an external network outside the semiconductor manufacturing plant. 12. The method of manufacturing a semiconductor device according to claim 11, further comprising: 13. A method for accessing a database provided by a vendor or a user of the device manufacturing apparatus via the external network to obtain maintenance information of the manufacturing apparatus by data communication, or a semiconductor manufacturing apparatus different from the semiconductor manufacturing factory. 13. The semiconductor device manufacturing method according to claim 12, wherein production control is performed by performing data communication with a factory via the external network. 14. A manufacturing apparatus group for various processes including the device manufacturing apparatus according to claim 1, a local area network connecting the manufacturing apparatus group, and a plant from the local area network. A semiconductor manufacturing plant, comprising: a gateway enabling access to an external external network; and capable of performing data communication of information on at least one of the manufacturing apparatus groups. 15. The semiconductor device according to claim 1, which is installed in a semiconductor manufacturing plant.
11. The method for maintaining a device manufacturing apparatus according to any one of claims 10 to 10, wherein a vendor or a user of the device manufacturing apparatus provides a maintenance database connected to an external network of a semiconductor manufacturing plant; Having a step of permitting access to the maintenance database from within the manufacturing factory via the external network, and a step of transmitting maintenance information stored in the maintenance database to the semiconductor manufacturing factory via the external network. A method for maintaining a device manufacturing apparatus, comprising: