JP2003031345A - Surface heating element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface heating element with no fear of damaging conductive film or heating element in the production process by assuring insulation safety on use and securing the peripheral dimension so as to close to that of a mirror and the effective heating area to be large enough to heat evenly, and produceable quickly compared in the past. SOLUTION: A conductive film 11 that is a little smaller than the base plate 1 is adhered on the plate 1 of a prescribed peripheral dimension. The insulating film 61 is mounted on the film 11. The conductive band 12, one of the ends of which is connected to the electrode 65 of the film 11, is mounted to the insulating film 61. 62 is an adhesive layer and 63 is the external cover made of synthetic resin. The surface heating element employs the structure of forming layer of each member sequential.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet heating element which is attached to a mirror or window glass of a bathroom to prevent its surface from fogging.

[0002]

2. Description of the Related Art A sheet heating element which is attached to a mirror or window glass of a bathroom to prevent its fog has been widely used.

In recent years, with the increase in size of mirrors installed in bathrooms, there is an increasing demand for a sheet heating element having a large heating area for raising the temperature of the entire surface to prevent fogging.

In order to meet such demand, the applicant of the present application can provide a connecting portion between the sheet heating element and the power cord at a desired position on the back surface side of the sheet heating element, and attach the surface to the mirror. A sheet heating element having a structure capable of increasing the effective heating area on the surface side of the sheet heating element has been proposed and already registered (Japanese Patent No. 2987698).

9 to 11 are views showing the construction of a sheet heating element which has already been registered. FIG. 9 is a plan view seen from the back side, FIG. 10 is a longitudinal sectional view thereof, and FIG. It is an enlarged view of the principal part of FIG.

As shown in FIG. 11, a conductive film 11 having a heat generating layer formed thereon is adhered in layers on the front surface side (lower side in the drawing) of the substrate 1. The heating element a made of 11 is covered with an outer cover b. The end of the conductive band 12 attached to the heat generating layer of the conductive film 11 is connected to the lead wire 3 for power supply. 41 is a terminal cover body, 42 is an inner frame, 51 is an internal filler having a strong adhesive force, 52 is an excellent adhesive property with the covering material of the lead wire 3, and the performance of protecting the internal filler 51 from moisture and humidity. Is an external filler having Reference numeral 30 denotes an upper lid of a rubber terminal cover.

As shown in FIG. 10, in this planar heating element, one end is connected to the heating layer formed on the conductive film 11 on the front surface side (lower side in FIG. 10) of the substrate 1. The conductive bands 12 of the book are bent along the edge portions of the substrate 1 and are disposed on the back surface side (upper side in FIG. 10) of the substrate 1. The ends of the two conductive bands 12 located on the back surface side are arranged in close proximity to each other, and at this position, they are connected to the lead wire 3 as shown in FIG.

As described above, in this planar heating element, the conductive band 12 is bent along the edge of the substrate 1 to dispose the conductive band 12 on the back surface side of the substrate 1. 1
By selecting the length of 2 and the arrangement position, the conductive wire connecting portion can be easily provided at the position on the substrate 1 desired by the user.

Reference numeral 20 is a protective cover that covers the tip portion of the conductive band 12 in a state where only the connecting portion with the lead wire 3 is exposed. This protective cover 20 is made of polypropylene,
It is made of a synthetic resin film made of a hard material such as polyester, and is bonded to the conductive band 12 and the substrate 1 with an adhesive, a double-sided tape or the like. In this way, the end of the conductive band 12 located on the back surface side is protected by the protective cover 20.
Since it is firmly fixed to the substrate 1 by the outer cover b
The end portion of the conductive band 12 does not move from the predetermined position during the manufacturing process such as the mounting process.

[0010]

The conventional sheet heating element configured as described above is highly evaluated in the market because of its performance.

However, in this conventional sheet heating element, the conductive film 11 is adhered to the front surface side of the substrate 1 in the manufacturing process, and then the substrate 1 is turned upside down so that the back surface side of the substrate 1 is electrically conductive. The step of disposing the band 12 was necessary. Then, in this step, the conductive film 11 is positioned below the substrate 1, and the conductive film 1
1 is exposed, the conductive film 1
Since it is necessary to pay close attention to prevent 1 from being damaged, this step has been an obstacle to improving work efficiency.

The object of the present invention is to ensure the insulation safety during use, to secure a heating effective area that generates heat as close as possible to the peripheral dimension of the mirror and to evenly generate heat, and to damage the conductive film that is a heating element during the manufacturing process. An object of the present invention is to provide a planar heating element that does not have this and can be manufactured more quickly than in the past.

[0013]

In order to achieve the above-mentioned object, the present invention has a method in which a conductive film having a peripheral dimension smaller than that of the substrate is laminated in layers on a substrate having a predetermined peripheral dimension. An insulating film having a peripheral dimension smaller than that of the substrate is arranged in layers on the conductive film so as to cover the conductive film, and one end of the electrode of the conductive film is provided on the insulating film. Two conductive bands connected to each other are provided, and an adhesive layer or an adhesive layer having the same peripheral dimension as the substrate covers the insulating film on the conductive band and the insulating film, and A synthetic resin film or synthetic resin sheet, which is formed in a layer so as to overlap with the substrate and has the same peripheral dimensions as the substrate, is formed on the pressure-sensitive adhesive layer or the adhesive layer. A planar heating element arranged in layers so as to overlap with the adhesive layer, wherein the other ends of the two conductive bands are connected to a power source via an electric wire for wiring. To do.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention.
2 is a cross-sectional view showing the configuration of FIG. 2, and FIG. 2 is an enlarged view of the end portion thereof.

In FIGS. 1 and 2, a conductive film 11 having a peripheral dimension smaller than that of the substrate 1 is attached on a substrate 1 having a predetermined peripheral dimension. An insulating film 61 having a peripheral dimension smaller than that of the substrate 1 is arranged so as to cover the conductive film 11.

On the insulating film 61, two conductive bands 12 whose one end is connected to the electrode 65 of the conductive film 11 are arranged. The tip of the conductive band 12 is an adhesive layer
Insulating film 6 with protective cover 20 having 20a
It is fixed at a predetermined position on the position 1, and the two conductive bands 12 are connected to the power source through the electric wire 66 for wiring at this predetermined position.

The terminal cover upper lid 30, the terminal cover body 4
The configurations of 1, the inner frame 42, the outer filler 52, and the inner filler 51 are the same as those of the conventional example.

Conductive band 12 and insulating film 6 around it
1, an adhesive layer 62 is formed so as to cover the insulating film 61. The peripheral dimension of the adhesive layer 62 is the same as the peripheral dimension of the substrate 1, and the adhesive layer 62 is formed so as to overlap the substrate 1.

Here, the adhesive layer 20a or the adhesive layer 62
May be an adhesive layer.

An outer cover 63 made of a synthetic resin film or a synthetic resin sheet having the same peripheral dimensions as the substrate 1 is disposed on the adhesive layer 62 so as to overlap with the adhesive layer 62.

Reference numeral 64 is an adhesive layer for attaching this embodiment to the back surface of the mirror M.

Next, the manufacturing method of the first embodiment configured as described above will be described with reference to FIGS.

First, a substrate 1 having a predetermined peripheral dimension is prepared (FIG. 3 (a)), and a conductive film 11 having a small peripheral dimension is attached to the substrate 1 (FIG. 3 (b)). An electrode 65 is formed on the end portion by using an electrode material (see FIG. 3).
(C)).

Next, one ends of the two conductive bands 12 are connected to the electrode 65, and the insulating film 61 is arranged so as to cover the conductive film 11 (FIG. 4A).

The tips of the two conductive bands 12 are placed on the insulating film 61 at predetermined positions (FIG. 4B), and the tips are placed at the predetermined positions by the protective cover 20 having the adhesive layer 20a. Fix (Fig. 4 (c)). Here the protective cover 20
Is selected to have a size capable of adhering to both the tip of the conductive band 12 and the insulating film 61,
A part of the conductive band 12 is cut off so that a part of the tip part thereof is exposed.

Next, the adhesive layer 62 is applied to the insulating film 6
1 so as to cover the substrate 1 and overlap the substrate 1 (see FIG.
(A)), the outer cover 63 is disposed on the pressure-sensitive adhesive layer 62 so as to overlap with the pressure-sensitive adhesive layer 62 (FIG. 5 (b)).

In this state, the outer cover 63 and the adhesive layer 62 in a predetermined portion where the tip of the conductive band 12 is located are cut off to form the window 60 (FIG. 6A).

In this window portion 60, an electric wire 66 for wiring
Is connected to the tip of the conductive band 12 with solder or the like (see FIG. 6).
(B)), as shown in FIG. 2, the connection portion is protected by the same method as the conventional method, and the production of the planar heating element is completed (FIG. 6).
(C)).

In the present embodiment manufactured by the steps described above, the conductive film 11 is adhered onto the substrate 1,
Immediately after connecting the conductive band 12 to the electrode 65 at the end portion, the insulating film 61 for protecting the conductive film 11 is provided on the conductive film 11, so that the conductive film 11 may be damaged in the manufacturing process. There is no Further, since it is not necessary to work the substrate 1 upside down, the work of wiring the conductive band 12 and the like can be performed more quickly than in the conventional example.

In this embodiment, when the outer cover 63 is cut off and the window 60 is provided, the tip of the conductive band 12 is protected by the hard protective cover 20, so that the window 60 is formed. Therefore, the conductive band 12 is not cut.

Further, in the present embodiment, the conductive film 11 and the conductive band 12 covered with the insulating film 61 having a peripheral dimension smaller than that of the substrate 1 are attached to the adhesive layer having the same peripheral dimension as the substrate 1. Since it is configured to be covered with the outer cover 62 and the outer cover 63, it is possible to secure the insulation required during use.

(Second Embodiment) Next, a second embodiment of the present invention will be described.

In the manufacturing process of the first embodiment described above, when the electric wire 66 is soldered to the tip of the conductive band 12, the insulating film 61 and the conductive film 11 are deformed by heat conduction, or the conductive film 11 is electrically conductive. The film 11 may be broken.

The second embodiment is a planar heating element having a structure in which the insulating film 61 and the conductive film 11 are not adversely affected by heat conduction during the soldering work of the conductive band 12 and the electric wire 66.

The configuration of the second embodiment is shown in FIG. In FIG. 7, the same reference numerals as those in FIG. 2 showing the configuration of the first embodiment indicate the same components.

Reference numeral 22 denotes a lower protective cover disposed at a predetermined position on the insulating film 61, and 21 denotes an upper protective cover disposed on the surface of the lower protective cover 22.

Upper protective cover 21 and lower protective cover 22
Both are made of materials such as polyester and polyimide having heat resistance, low thermal conductivity and hardness. Further, a part of the upper protective cover 21 is cut off so that a part of the tip of the conductive band 12 covered by the upper protective cover 21 is exposed.

As described above, in the second embodiment, the leading end of the conductive band 12 has the upper protective cover 21 and the lower protective cover 22.
The structure is narrowed by.

Reference numeral 21a denotes an adhesive layer provided on the upper protective cover 21, and 22a denotes an adhesive layer provided on the lower protective cover 22. This adhesive layer 21a, 22a
May be an adhesive layer.

The manufacturing process of the second embodiment having the above-described structure is different from the manufacturing process of the first embodiment, as shown in FIG. 8, the insulating film 61 is arranged on the conductive film 11. After installation (FIG. 8A), the lower protective cover 22 is fixed at a predetermined position of the insulating film 61, and the tip of the conductive band 12 is placed on the lower protective cover 22 (see FIG. 8B). )), The tip of the conductive band 12 is fixed by the upper protective cover 21 (FIG. 8C).
The other manufacturing process is the same as that of the first embodiment, and thus the description thereof is omitted.

In the second embodiment thus constituted, in addition to the effect obtained in the first embodiment, the lower protective cover 22 having heat resistance, low thermal conductivity and hardness is arranged. It is possible to obtain the effect that the insulating film 61 and the conductive film 11 are not adversely affected by heat conduction during the soldering work.

In the first and second embodiments described above, the conductive wire connecting portion is composed of the terminal cover body 41, the inner frame 42, the inner filler 51 and the outer filler 52. However, the conductive line connecting portion may have any configuration.

Furthermore, in the first and second embodiments described above, the mirror M on the side of the substrate 1 opposite to the conductive film 11 is formed.
The thermal conductivity to the mirror M can be increased by arranging a multi-layer composite film including a layer made of aluminum foil having no moisture permeability, water permeability and gas permeability, or a metal plate on the side surface in a layered manner. it can. In addition, moisture permeability including a layer made of aluminum foil,
If a multilayer composite film having neither water permeability nor gas permeability, or a metal plate is arranged in layers between the pressure-sensitive adhesive layer 62 and the outer cover 63, the conductive film 11 will not be affected by gases such as water vapor and oxygen. Can be prevented.

[0045]

As described above, according to the present invention, it is possible to secure the insulation safety in use and the heating effective area that generates heat evenly and as close as possible to the peripheral dimension of the mirror, and the heating element is used in the manufacturing process. It is possible to provide a planar heating element having a structure that can be manufactured more quickly than before without fear of damaging a certain conductive film.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration of a first embodiment of the present invention.

FIG. 2 is an enlarged view of an end portion according to the first embodiment of the present invention.

FIG. 3 is an explanatory diagram of the manufacturing method according to the first embodiment of the present invention.

FIG. 4 is an explanatory diagram of the manufacturing method according to the first embodiment of the present invention.

FIG. 5 is an explanatory diagram of the manufacturing method according to the first embodiment of the present invention.

FIG. 6 is an explanatory diagram of the manufacturing method according to the first embodiment of the present invention.

FIG. 7 is a sectional view showing a configuration of a second exemplary embodiment of the present invention.

FIG. 8 is an explanatory diagram of the manufacturing method according to the second embodiment of the present invention.

FIG. 9 is a plan view showing the configuration on the back surface side of a conventional sheet heating element.

10 is a vertical cross-sectional view of the sheet heating element shown in FIG.

11 is an enlarged view of a main part of the vertical cross-sectional view of FIG.

[Explanation of symbols]

1 substrate 11 Conductive film 12 Conductive band 20 Protective cover 20a, 21a, 22a Adhesive layer 21 Top protection cover 22 Lower protective cover 30 Terminal cover top cover 41 Terminal cover body 42 Inner frame 51 Internal filler 52 External filler 60 window 61 Insulating film 62, 64 adhesive layer 63 Outer cover 65 electrodes 66 electric wire M mirror

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 3B111 AA01                 3K034 AA15 BA02 BA08 BA13 BB08                       BB13 CA32 HA10                 3K092 PP20 QA05 QB31 QB59 QB65                       QC16 RF02 RF13 RF26 VV12                       VV33                 4F100 AB01E AB10E AB33E AK01E                       AR00A AR00C AR00E AT00A                       AT00E BA05 BA07 DB10                       DC22D GB48 JD04E JG01B                       JG01D JG04 JG04C JJ06                       JL11E

Claims (4)

[Claims] 1. A conductive film having a peripheral dimension smaller than that of the substrate is laminated in layers on a substrate having a predetermined peripheral dimension, and the conductive film has a peripheral dimension smaller than that of the substrate on the conductive film. An insulating film is arranged in layers so as to cover the conductive film, and two conductive bands, one end of which is connected to an electrode of the conductive film, are arranged on the insulating film. On the strip and the insulating film, a pressure-sensitive adhesive layer or an adhesive layer having the same peripheral dimensions as the substrate is formed in a layer shape so as to cover the insulating film and overlap the substrate, the pressure-sensitive adhesive layer or the On the adhesive layer, a synthetic resin film or synthetic resin sheet having the same peripheral dimension as that of the substrate is arranged in layers so as to overlap the adhesive layer or the adhesive layer. A planar heating element, which is a heating element, wherein the other ends of the two conductive bands are connected to a power source through an electric wire for wiring. 2. A predetermined position on the insulating film,
A lower protective cover having heat resistance, low thermal conductivity, and hardness is fixed by an adhesive or an adhesive, and the other end sides of the two conductive bands are arranged on the lower protective cover, On the surface of the lower protective cover including the other end side of the conductive band of, with the upper protective cover that has the same performance as the lower protective cover and is fixed to the surface of the lower protective cover by an adhesive or an adhesive. And an upper protective cover is provided to cover the other end side of the two conductive bands, leaving a connecting portion between the other ends of the two conductive bands and the electric wire for wiring. The sheet heating element according to claim 1. 3. A multilayer composite film having a moisture-permeable, water-permeable, and gas-impermeable layer including a layer made of an aluminum foil on the surface of the substrate opposite to the surface on which the conductive film is adhered, or The sheet heating element according to claim 1 or 2, wherein the metal plates are arranged in layers. 4. A multi-layer composite film having a moisture-permeable, water-permeable, and gas-impermeable layer including an aluminum foil layer between the pressure-sensitive adhesive layer or the adhesive layer and the synthetic resin film or the synthetic resin sheet. Alternatively, the sheet heating element according to any one of claims 1 to 3, wherein the metal plates are arranged in layers.