JP2003007898A - Semiconductor device, method of manufacturing the same, flexible wiring board suitable for use in the semiconductor device, method of processing the same, and processing apparatus - Google Patents

Abstract

An object of the present invention is to provide a semiconductor device having an external connection electrode on the back surface which is slightly larger than a planar dimension of an integrated circuit chip and has a wide pitch, and a method of manufacturing the same. SOLUTION: The semiconductor device 50 according to the first embodiment of the present invention.
A plurality of wirings 32 in which a plurality of internal electrodes 321 are formed inward corresponding to the integrated circuit chip S bumps (electrodes) 1 and a plurality of wirings 32 in which external electrodes 322 connected to the internal electrodes 321 are formed outside are flexible. The bumps 1 of the integrated circuit chip S are electrically connected to the internal electrodes 321 respectively, and the external electrodes 322 are provided on the back side of the integrated circuit chip. The external connection electrodes are formed at a relatively wide pitch.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having an external connection electrode on the back surface, which is slightly larger than the planar size of an integrated circuit chip and has a wide pitch, a method for manufacturing the same, a flexible wiring board, and the same. The present invention relates to a processing method and a processing device.

[0002]

2. Description of the Related Art First, a conventional semiconductor device will be described with reference to FIGS.

FIG. 12 is a half sectional view showing a conventional semiconductor device having an external connection electrode formed on the back surface, and FIG. 13 is a half sectional view showing another semiconductor device having an external connection electrode formed on the back surface. 14 is a cross-sectional view of a stacked semiconductor device in which a plurality of semiconductor devices shown in FIG. 13 are stacked.

Conventionally, as a structure of a semiconductor device for electrically connecting an integrated circuit chip and a wiring substrate on the back side of the integrated circuit chip, US Pat. No. 5,216,278 and AS
IC & EDAP pages 9-15, March, 19
93 disclosed by Motorola "OMPA"
12 is a semiconductor device 600 such as that shown in a half cross section in FIG. 12. In this semiconductor device 600, an integrated circuit chip S is mounted on the surface of a printed wiring board 610 using an adhesive or the like. A plurality of upper lands 611 are provided on the front surface of the wiring board 610, and the external connection electrodes 6 are provided on the back surface.
In the integrated circuit chip S, bumps 1 such as solder and gold formed on a plurality of electrodes of the integrated circuit chip S are provided with metal wires such as gold on the corresponding upper land 611. It is electrically connected using 614. Then, in order to protect the integrated circuit chip S and the metal wire 114, the upper surface is sealed with a sealing material 615 such as epoxy resin. In addition, the external electrodes 612 on the back surface of the printed wiring board 610.
Are provided in a peripheral arrangement or a lattice arrangement.

However, in the structure of the semiconductor device 600, the distance between the integrated circuit chip S required for connection with the metal wire 614 and the end face of the semiconductor device 600 is required to be at least about 0.5 mm. . Therefore, there is a problem that the planar size of the semiconductor device 600 becomes larger than the planar size of the integrated circuit chip S by 1 mm or more.

In order to solve this problem, the No. No. filed by the present inventor and filed by the present applicant was applied. 01002717 &
No. There is a semiconductor device 700 disclosed in 01002718 (look up and fill in application number). In the semiconductor device 700 of this prior application, as shown in FIG. 13, an electrical insulating layer 2 is formed in advance on the back surface of the integrated circuit chip S, and a plurality of thin conductive wires are formed on the side surface of the integrated circuit chip S. 73
A thin U-shaped conductive component 730 in which 1 is hardened with a resin 732 is fitted and closely attached to the side surface of the conductive component 731 to correspond to the plurality of bumps 1 of the integrated circuit chip S.
Upper ends 233 of the conductive wires 731 are connected by a thin rod called a capillary (not shown) from the upper part of the conductive wires 731 by applying ultrasonic vibration and heat.
4 is provided on the back surface of the integrated circuit chip S.

As described above, in the semiconductor device 700, since the U-shaped conductive component 730 can be mounted along the outer peripheral surface of the integrated circuit chip S, the semiconductor device 700 itself can be made compact.

The semiconductor device 700 can also be used alone by mounting it on a printed wiring board incorporated in an electronic device. Further, as shown in FIG. 14, the conductive wire 231 of the lowermost semiconductor device 700A can be used. Upper tip 733
, The lower tip 734 of the conductive wire 731 of the semiconductor device 700B stacked above the semiconductor device 700A is directly connected to the semiconductor device 700A, and a plurality of semiconductor devices 700 stacked in the same manner are electrically connected in this manner. Semiconductor device 7
00 can be laminated in multiple stages and can be used as a laminated component.

[0009]

If the semiconductor device 700 having the above structure is used, the semiconductor device 6 shown in FIG.
The distance between the integrated circuit chip S and the end face of the semiconductor device 600, which was a structural problem of No. 00, can be shortened to about 0.05 mm. Conductive wire 73 to be a connection electrode
The lower tip 734 of No. 1 becomes only the peripheral array of the integrated circuit chip S, and the problem remains that a semiconductor device having a grid array of external connection electrodes in which the pitch of external connection electrodes can be designed wide cannot be realized.

Therefore, the present invention is intended to solve the above-mentioned problems in the semiconductor device of the prior art, and is an external device which is slightly larger than the planar size of the integrated circuit chip and has a wide pitch. An object of the present invention is to obtain a semiconductor device having a connection electrode on its back surface and a manufacturing method thereof.

[0011]

Therefore, in the flexible wiring board of the invention described in claim 1, a quadrilateral opening having an area into which the integrated circuit chip to be mounted can be inserted is formed in the central portion of the flexible insulating plate. The internal wiring corresponding to the electrode of the integrated circuit chip is formed on the opening side and the external wiring corresponding to the internal electrode is formed on the outside in a predetermined arrangement. And, a notch having a length corresponding to the thickness of the integrated circuit chip is formed in the peripheral portion of the opening.

According to a second aspect of the present invention, there is provided a flexible wiring board according to the first aspect, wherein a peripheral portion of the opening of the flexible wiring board has a height corresponding to a thickness of an integrated circuit chip to be mounted. It is characterized in that it is preliminarily bent perpendicularly to the side opposite to the side where the electric wiring is formed.

A flexible wiring board according to a third aspect of the present invention has an adhesive layer on the side of the flexible wiring board of the first or second side opposite to the side where the electric wiring is formed on the flexible insulating plate. A release film covering the adhesive layer is laminated.

Further, in the method for processing a flexible wiring board according to a fourth aspect, a quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted is formed in the central portion of the flexible insulating plate. A flexible wiring substrate is formed in which a predetermined arrangement of electric wirings is formed on the opening side with internal electrodes corresponding to the electrodes of the integrated circuit chip, and externally with external electrodes corresponding to the internal electrodes.
The opening is placed such that the center of the opening coincides with the center of the recess of the mold in which the recess corresponding to the opening shape of the opening is formed, and the peripheral portion of the opening of the flexible insulating plate is placed from above. And a side plate that covers the side surface of the integrated circuit chip is formed by bending downwardly with a width corresponding to the thickness of the integrated circuit chip perpendicular to the electric wiring formation surface.

Further, in the method for processing a flexible wiring board according to a fifth aspect, in the method for processing a flexible wiring board according to the fourth aspect, the mold is heated when the peripheral portion of the flexible insulating plate is bent, It is characterized by bending while heating at least the peripheral portion at a heating temperature.

Further, in a flexible wiring board processing apparatus according to a sixth aspect, a quadrilateral opening having an area into which an integrated circuit chip can be inserted is formed in a central portion of a flexible insulating plate, and the opening side is provided on the opening side. The internal electrodes corresponding to the electrodes of the integrated circuit chip, the electrical wiring on which the external electrodes corresponding to the internal electrodes are formed outward is formed in a predetermined array, and the peripheral portion of the opening is A processing apparatus for a flexible wiring board, which is vertically bent to a side opposite to a side on which the electric wiring is formed at a height corresponding to a thickness of an integrated circuit chip to be mounted, the flat mounting on which the flexible wiring board can be mounted. The surface and the side edges facing each other with an interval width wider than the opening width of the peripheral portion where the internal electrode is formed in the central portion of the flat mounting surface by twice the thickness of the flexible insulating plate are parallel to each other, One their cross section is right angle formed,
A fixed mold in which a peripheral portion of the opening of the flexible insulating plate facing each other is formed on the side edge, and a recess for supporting the external electrode side on a flat mounting surface outside the side edge is formed, A pair of holding plates for holding the two external electrode sides supported by flat mounting surfaces outside the both side edges from above, respectively, and a pair of holding plates located inside the both holding plates and placed on the both side edges. And a movable mold having a punch for vertically bending the peripheral portion from above to a side opposite to the side where the electric wiring is formed at a height corresponding to the thickness of the integrated circuit chip to be mounted. It is equipped and configured.

Further, in the semiconductor device according to the seventh aspect, an integrated circuit chip having a plurality of electrodes formed thereon, and a plurality of internal electrodes corresponding to the plurality of electrodes of the integrated circuit chip are provided inward. A flexible wiring board having external electrodes connected to the internal electrodes and formed externally on the same surface of a flexible insulating plate. The plurality of electrodes are electrically connected to the plurality of inner electrodes, respectively, and the plurality of external electrodes are formed as external connection electrodes on the back surface side of the integrated circuit chip.

Further, in a semiconductor device according to an eighth aspect, an integrated circuit chip having a plurality of electrodes formed thereon and a quadrangular opening having an area into which the integrated circuit chip can be inserted in a central portion of a flexible insulating plate. Part is formed,
An internal wiring corresponding to an electrode of the integrated circuit chip is formed on the opening side, and an external wiring corresponding to the internal electrode is formed on the outside of the flexible wiring substrate in a predetermined arrangement. The integrated circuit chip is inserted into the opening, the side surface of the integrated circuit chip is covered with a flexible insulating plate around the opening, and the back surface is formed with the plurality of external electrodes. It is characterized in that it is covered with an insulating plate and the plurality of outer portions are formed as external connection electrodes.

Further, according to a ninth aspect of the method of manufacturing a semiconductor device, a plurality of internal electrodes are formed on the inner side and external electrodes connected to the plurality of inner electrodes are formed on the same surface. A method of manufacturing a semiconductor device, wherein an integrated circuit chip having a plurality of electrodes formed on a front surface thereof is mounted on a flexible wiring substrate, and external connection electrodes are formed on a back surface of the integrated circuit chip. An electrode connecting step of electrically connecting the electrodes of the flexible wiring board to the internal electrodes of the flexible wiring board, and the outer portion of the flexible wiring board on which the plurality of external electrodes are formed is folded back to the back surface side of the integrated circuit chip. It is characterized by including a folding back step of fixing.

Furthermore, in the method of manufacturing a semiconductor device according to a tenth aspect of the present invention, a quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted is formed in the central portion of the flexible insulating plate. An electric wire having an internal electrode corresponding to the electrode of the integrated circuit chip on the opening side and an external electrode corresponding to the internal electrode on the outside is formed in a predetermined array on the surface, and The integrated circuit chip having a plurality of electrodes formed on the surface thereof is mounted on a flexible wiring board having a notch having a length corresponding to the thickness of the integrated circuit chip formed around the opening. In the method of manufacturing a semiconductor device, wherein external connection electrodes are formed on the back surface of the flexible wiring board, the front surface of the integrated circuit chip faces upward, and The flexible insulating plate, which is a free end due to the cut around the opening, is pushed up while being inserted into the opening, and the integrated circuit chip is positioned at a position where the free end covers the side surface of the integrated circuit chip. A positioning step, an electrode connecting step for respectively connecting the plurality of electrodes of the integrated circuit chip to the internal electrodes of the flexible wiring board, and the plurality of flexible wiring boards protruding from the positioned integrated circuit chip. A cutting step of cutting the outer portion so that the plurality of outer electrodes are located on the back surface side when the outer portion on which the outer electrode is formed is folded back to the back surface side of the integrated circuit chip; And a step of folding back the outer portion of the flexible wiring board to the back side of the integrated circuit chip to fix the same, and the integrated circuit chip. Characterized in that the said flexible wiring board portion covering the surface and side surfaces and an insulating coating step of coating with an insulating material.

Furthermore, in the method of manufacturing a semiconductor device according to the eleventh aspect, a quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted is formed in the central portion of the flexible insulating plate. An electric wire having an internal electrode corresponding to the electrode of the integrated circuit chip on the opening side and an external electrode corresponding to the internal electrode on the outside is formed in a predetermined array on the surface, and A flexible wiring board in which a flexible insulating plate in the peripheral portion of the opening is preliminarily bent at a height corresponding to the thickness of the integrated circuit chip to the side opposite to the side where the electric wiring is formed,
In a method of manufacturing a semiconductor device, wherein an integrated circuit chip having a plurality of electrodes formed on a surface thereof is mounted, and external connection electrodes are formed on a back surface of the integrated circuit chip, the flexible wiring with the surface of the integrated circuit chip facing upward. A positioning step of positioning the integrated circuit chip at a position on the opening from the front surface side to the back surface side of the substrate; and the plurality of electrodes of the positioned integrated circuit chip on the internal electrodes of the flexible wiring board. The electrode connecting step of connecting with a metal wire of a predetermined length, and the outer portion of the flexible wiring board protruding from the integrated circuit chip connected with the metal wire, the outer portion having the plurality of external electrodes formed thereon, The outer portion is cut so that the plurality of external electrodes are positioned on the back surface side when folded back to the back surface side of the integrated circuit chip. A cutting step, a step lifting of the flexible wiring board to lift the metal wire lifts the flexible wiring board is cut in a loop,
A reversing step of reversing the outer portion of the lifted flexible wiring substrate to the back surface side of the integrated circuit chip, and a fixing step of fixing the outer portion of the reversed flexible wiring substrate to the back surface of the integrated circuit chip, An insulating coating step of coating the surface of the integrated circuit chip and the portion of the flexible wiring board covering the side surface with an insulating material is provided.

Furthermore, a semiconductor device manufacturing method according to a twelfth aspect is the method for manufacturing a semiconductor device according to the ninth, tenth, or eleventh aspect, wherein the internal electrodes and the internal electrodes of the flexible wiring substrate are included. An adhesive layer is formed on a surface opposite to the surface on which the external electrode is formed.

Therefore, according to the invention of claim 1,
The presence of the opening and the notch makes it easy to position the integrated circuit chip on the flexible wiring board, and the periphery of the opening of the flexible insulating plate can be attached to the side surface of the integrated circuit chip as the inserting operation into the opening is performed.

According to the invention described in claim 2,
By bending the periphery of the opening of the flexible wiring board of the invention according to claim 1 in advance as described above, the integrated circuit chip can be easily mounted, and the flexible insulating plate around the folded opening is outwardly provided. Can be prevented from opening.

According to the invention of claim 3, the work of fixing the flexible insulating plate around the opening according to claim 1 or 2 to the integrated circuit chip can be easily performed.

Further, according to the invention described in claim 4, the flexible wiring board of the invention described in claim 2, that is, the flexible wiring board in which the flexible insulating plate around the opening is preliminarily bent vertically is facilitated. It can be processed into.

Further, according to the invention described in claim 5, by heating at least the flexible insulating plate around the opening, it is possible to perform bending work with less weight and in a short time.

Further, according to the invention as set forth in claim 6, while fixing the outer portion of the flexible wiring board by the restraining plate, the flexible insulating plate around the opening is lowered by the punch having a sufficient weight. Can be folded vertically to.

Further, according to the invention of claim 7, the side surface and the back surface of the mounted integrated circuit chip are covered with the flexible wiring substrate, so that the planar size of the semiconductor device can be made equal to that of the mounted integrated circuit chip. Can be formed in an area that is not much wider than the target size, does not occupy a mounting area, and can be formed in any array that can design the pitch of external connection electrodes to be wide,
Then, an external connection electrode can be provided on the back surface thereof.

Further, according to the invention of claim 8, it is easy to position and mount the integrated circuit chip by facing the opening in the central portion of the flexible wiring board, and the side surface of the mounted integrated circuit chip and By covering the back surface with a flexible wiring board, the planar dimensions of the semiconductor device can be formed in an area that is not much wider than the planar dimensions of the integrated circuit chip on which it is mounted. It can be formed in any possible arrangement, and can be provided with an external connection electrode on its back surface.

Further, according to the invention of claim 9, the side surface and the back surface of the mounted integrated circuit chip are covered with the flexible wiring substrate, and the planar dimension of the semiconductor device is mounted. Can be formed in an area that is not much wider than the planar dimension of the semiconductor device, can be formed in an arbitrary array that does not take up a mounting area, and the pitch of external connection electrodes can be designed wide, and a semiconductor device having external connection electrodes on its back surface can be easily formed. It can be manufactured.

According to the tenth aspect of the present invention, since the notch for bending the periphery of the opening upward is formed beforehand, the product circuit chip can be inserted into the opening from below. Thus, the integrated circuit chip can be automatically positioned and the peripheral portion of the flexible insulating plate, which is a free end, can be fixed to the side surface of the integrated circuit chip by the cut.

Further, according to the invention of claim 11, since the periphery of the opening is formed by bending it downward in advance, the integrated circuit chip is inserted into the opening from above. The chip can be positioned, and the side of the integrated circuit chip is attached to the bent insulating plate,
The semiconductor device can be formed in an arbitrary array that allows the semiconductor device to be formed in an area that is not much wider than that of the integrated circuit chip on which it is mounted, does not occupy a mounting area, and can be designed with a wide pitch of external connection electrodes. Then, a semiconductor device having an external connection electrode on its back surface can be easily manufactured.

Further, according to the invention of claim 12, the flexible wiring board is bent to the back surface of the integrated circuit chip by the adhesive layer provided on the flexible wiring board without using any special fixing means. The outer part of the can be adhered and fixed to the back surface, which improves productivity.

[0035]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Semiconductor devices according to various embodiments of the present invention and manufacturing methods thereof will be described below with reference to the drawings.

FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention, and FIG. 2 shows the shape of one unit of a flexible wiring board suitable for use in the semiconductor device shown in FIG. 1A is a plan view thereof, and FIG. 1B is a plan view of the back surface of the semiconductor device shown in FIG. 1 showing external connection electrodes formed by bending the external electrode portions of the flexible wiring board of FIG. 3 is a plan view showing the shape of a flexible wiring board of one unit according to the other three embodiments, and FIG. 4 shows external connection electrodes formed by bending the external electrode portions of the flexible wiring boards of various shapes shown in FIG. 5 is a plan view of the back surface of the semiconductor device shown in FIG. 5, FIG. 5 is a process drawing showing the first manufacturing method of the semiconductor device shown in FIG. 1, and FIG. 6 is a semiconductor device obtained by the manufacturing method of the semiconductor device shown in FIG. Process drawing showing a sealing method with an insulating material, 7 and the second semiconductor device shown in FIG. 1
FIG. 8 is a sectional view showing a method for manufacturing the same, FIG. 8 is a sectional view of an unfavorable structure of a semiconductor device of the present invention, FIG. 9 is a sectional view of a flexible wiring board of a second embodiment of the present invention, and FIG. 11 is a cross-sectional view of the flexible wiring board forming apparatus of the second embodiment, and FIG. 11 is a process diagram showing a third manufacturing method of a semiconductor device using the flexible wiring board of the second embodiment shown in FIG.

First, the structure of the semiconductor device according to the first embodiment of the present invention and the method for manufacturing the same will be described with reference to FIGS.

In FIG. 1, reference numeral 50 indicates a semiconductor device according to the first embodiment of the present invention. The semiconductor device 50 is composed of an integrated circuit chip S and a flexible wiring board 30A, the integrated circuit chip S is mounted on the flexible wiring board 30A, and the side surface and the back surface of the mounted integrated circuit chip S are The flexible wiring board 30A is covered, and the plurality of bumps (electrodes) 1 of the integrated circuit chip S are electrically connected to the internal electrodes 321 formed on the flexible wiring board 30A via ultrafine metal wires W such as gold. The external electrode 322 portion formed on the outer portion of the flexible wiring board 30A and communicating with the internal electrode 321 is arranged on the back surface of the integrated circuit chip S, and these are used as external connection electrodes, and bumps of the integrated circuit chip S are provided. The surface and the side surface on which 1 is formed are covered with a sealing material In such as epoxy resin. Reference numeral 34 indicates an insulating protective film that electrically and mechanically protects the wiring 32 portion excluding the internal electrode 321 and the external electrode 322.

By adopting such a structure, it is possible to obtain a semiconductor device having an outer dimension slightly larger than the planar dimension of the integrated circuit chip S. Further, such a structure of the semiconductor device can be realized with an electrode array in which the pitch of the plurality of external connection electrodes (external electrodes 322) can be designed wide.

On the surface of the integrated circuit chip S, bumps 1 of gold, solder, etc. are formed on a plurality of electrodes. The integrated circuit chip S may have a structure (dual in-line arrangement) in which a plurality of bumps (electrodes) 1 are arranged in a straight line at a predetermined interval along two opposite sides (predetermined intervals along four sides). It may have a quadrangular structure (quadrangular arrangement) arranged at regular intervals, or a so-called area array arrangement in which the entire surface of the integrated circuit chip S is arranged in a lattice pattern at predetermined intervals. It may have a structure.

As shown in FIGS. 1 and 2, the flexible wiring board 30A has an electric circuit formed on the surface of an insulating resin sheet such as polyimide or a tape (hereinafter, simply referred to as "flexible insulating plate") 31. A plurality of wirings 32 which are electrically conducting portions of the integrated circuit chip S in the central portion.
Is a substrate in which an opening portion 33 having a contour corresponding to the outer dimension thereof is formed so that the can be inserted. An inner electrode 321 is formed on the inner side (opening 33 side) of each wiring 32, and an outer electrode 322 is formed on the outer side (outer side of the flexible wiring substrate 30A) 311 and 312. The pitch of the adjacent external electrodes 322 can be widened and formed,
As shown in FIG. 2B, the integrated circuit chip S is folded on the back surface side to serve as an external connection electrode.

FIG. 2 shows one unit of various flexible wiring boards 30A on which one integrated circuit chip S is mounted. This flexible wiring board 30A has a plurality of electrodes (bumps).
1 is a flexible wiring board 30A suitable for application to an integrated circuit chip S having a structure in which the integrated circuit chip body is arranged in a straight line along two opposite sides of the integrated circuit chip body (dual in-line arrangement). An opening 33 having a shape substantially corresponding to the contour corresponding to the outer shape of the integrated circuit chip S is formed in the central portion of the flexible wiring board 30A, and the wiring 32 is formed at four corners of the opening 33. A notch 35 is formed on the extension of the edge of the opening 33 on the non-existing side.
Is inserted, and the dotted line connecting both ends thereof indicates the fold line La of the free end pieces 315, 316 of the flexible insulating plate 31 existing inside (on the side of the opening 33). That is, the length of the cut 35, in other words, the width up to the broken line La has a dimension corresponding to the thickness of the integrated circuit chip S to be mounted. These flexible insulating plates 31 are
As shown in FIG. 4B, the folding line La is bent vertically upward by inserting the integrated circuit chip S into the opening 33. The state of FIG. 2B represents the back surface of the semiconductor device 50 in which the outer portions 311 and 312 of the flexible wiring board 30A are folded into the back surface of the integrated circuit chip S as described above.

The shape of the flexible wiring board 30A may be the shape shown in FIG. 2A or the shape shown in FIGS. 3A, 3B and 3C. These are a structure in which a plurality of electrodes (bumps) 1 are arranged in a straight line along each side of the four sides of the integrated circuit chip body at a predetermined interval (quadrangular arrangement) or arranged in an area array form. It is a flexible wiring board 30A suitable for application to the integrated circuit chip S.

Notches 35 are also formed at the four corners of the opening 33 of each flexible wiring board 30A shown in FIGS. 3A, 3B and 3C, and the dotted lines connecting both ends thereof also indicate the fold line La.

In the flexible wiring board 30A shown in FIGS. 3A and 3C, the notches 35 are formed at the four corners of the opening 33.
Is formed by punching out a small quadrangular through hole, and the dotted line is the broken line La.

In the flexible wiring board 30A of FIG. 3B, the notches 35 are obliquely formed at the four corners of the opening 33, and the dotted line connecting the ends thereof is the broken line La.

The integrated circuit chip S is mounted in the opening 33 of each flexible wiring board 30A shown in FIGS. 3A, 3B and 3C, and the outer portion 31 is subjected to the steps described below.
When 1,312, 313, and 314 are folded into the back surface of the integrated circuit chip S, the folded shapes shown in FIGS. 4A, 4B, and 4C are obtained. Outer parts 311, 312,
As shown in FIGS. 4A and 4B, 313 and 314 may be cut to cover the entire back surface of the integrated circuit chip S,
As shown in FIG. 4C, you may cut | disconnect in the shape which exposes a part of back surface. Note that the illustration of the internal electrode 321 and the external electrode 322 is omitted in these figures.

Next, a method of manufacturing the semiconductor device 50 will be described with reference to FIGS. 2 and 5 to 7.

There are two types of manufacturing methods. First, referring to FIG.
A flexible wiring board 30A shown in A and an integrated circuit chip S in which a plurality of electrodes (bumps) 1 are formed in a dual in-line arrangement are used to refer to a first manufacturing method of a semiconductor device 50 with reference to FIG. explain.

First, as shown in FIG. 5A, the wiring 32 of the electric circuit is preliminarily formed on the surface, and the opening 33 having a size twice the thickness of the integrated circuit chip S is formed in the central portion. The flexible wiring board 30A is placed flat on the mounting table, the integrated circuit chip S is transferred below the opening 33, and the integrated circuit chip S is inserted into the opening 33 from below.

Then, since the notches 35 are formed in advance at the four corners of the opening 33, the free end pieces 315 and 316 inward from the fold line La of the flexible wiring board 30A shown in FIG. 2A are shown in FIG. 5B. As shown above, it is bent vertically upward.

Next, as shown in FIG. 5C, the bumps 1 of the integrated circuit chip S and the internal electrodes 321 of the flexible wiring board 30A are electrically connected to each other by a metal wire W such as gold.

In the subsequent step, the outer peripheral portion of the flexible wiring board 30A is cut as shown in FIG. This cutting is performed along the four single-dot chain lines Lb shown in FIG. 2A.

Next, as shown in FIG. 6E, the outer portions 311 and 312 of the flexible wiring board 30A protruding outside the left and right of the integrated circuit chip S are folded back to the back surface side of the integrated circuit chip S, It is fixed using a separately prepared liquid adhesive resin. When folding back on this back side,
Since the folding line La portions are located on both side edges of the back surface of the integrated circuit chip S on the flexible wiring board 30A, the outer portions 311 and 312 are easily folded back to the back surface side, and the workability is improved.

The outer peripheral portion of the flexible wiring board 30A is
As shown in FIG. 2A, the planar state of the back surface of the integrated circuit chip S of the outer portions 311 and 312 protruding from the integrated circuit chip S by cutting is as shown in FIG. 2B. The entire surface of the back surface of S is covered, and the external electrodes (external connection electrodes) 322 are arranged on the surface at a wide pitch.

Subsequently, as shown in FIG. 6, the metal wire W portion, the surface, and the side surface of the integrated circuit chip S are covered with an encapsulating material In such as an epoxy resin and cured by heating.
The semiconductor device 50 as shown in is completed. In FIGS. A and B, the flexible wiring board 30A portion bent along both side surfaces of the integrated circuit chip S is sealed with the sealing material In.
C shows the step of sealing the surface of the integrated circuit chip S, all the bumps 1 and the metal wires W with the sealing material In.

As described above, the semiconductor device 50 according to the first embodiment of the present invention can be formed in a plane size which is not so large as the plane size of the integrated circuit chip S on which it is mounted. Instead, the external connection electrodes can be formed in an arbitrary array in which the pitch of the adjacent external connection electrodes can be designed wide, and since the external connection electrodes are provided on the back surface thereof, it can be used in a structure in which a plurality of semiconductor devices are stacked. .

In manufacturing the semiconductor device 50 of the first embodiment, when the outer portions 311 and 312 of the flexible wiring board 30A folded back to the back surface of the integrated circuit chip S are fixed to the back surface thereof, a liquid prepared separately is used. Since a method of fixing using an adhesive resin or the like is adopted, man-hours for that are required.

To solve this problem, the manufacturing process shown in FIG. 7 may be adopted. First, in the step shown in FIG. 7A, the flexible wiring board 30B is prepared. The flexible wiring board 30B has an opening 33 formed in the center thereof, and the flexible insulating plate 31 has an internal electrode 321 on the surface facing the periphery of the opening 33 and an external electrode on the opposite side. The external electrodes 322 corresponding to the internal electrodes 321 are formed on the wiring 32 of a predetermined electronic circuit or the like.
Is formed, and the adhesive layer 36 is laminated on the back surface of the flexible insulating plate 31, and the release film 37 is laminated on the surface of the adhesive layer 36. The adhesive layer 36 is laminated on the entire back surface of the flexible insulating plate 31 except the central opening 33, and the peeling film 37 is laminated on the entire surface except the opening larger than the integrated circuit chip S. The flexible insulating plate 31 can also be formed by using an insulating material such as a polyimide resin.

Flexible wiring board 3 having such a structure
As shown in FIG. 7A, the flexible wiring board 30B is horizontally mounted on a mounting table (not shown) using 0B as shown in FIG. 7A, and the integrated circuit chip S is mounted from below.
Is inserted into the opening 33 of the flexible wiring board 30B, the state shown in FIG. The flexible wiring board 30B, like the flexible wiring board 30A,
A notch 35 is previously formed in a portion corresponding to a corner portion of the integrated circuit chip S. The presence of the cuts 35 facilitates insertion of the integrated circuit chip S. At this time, the free end piece 315 of the flexible wiring board 30B,
316 is automatically adhered to the side surface of the integrated circuit chip S by the adhesive layer 36 on the back surface.

Next, as shown in FIG. 7C, the electrodes (bumps) 1 of the integrated circuit chip S and the flexible wiring board 30.
The internal electrode 321 of the B wiring 32 is electrically connected by the metal wire 11, and the outer peripheral portion of the flexible wiring board 30B is cut as in the case of cutting the flexible wiring board 30A. Then, the flexible wiring board on which the integrated circuit chip S having the shape shown in FIG.

Then, the peeling film 37 on the back surface of the flexible wiring board 30B is peeled off, and the outer portion 3 of the flexible wiring board 30B protruding outside the integrated circuit chip S is removed.
When 11 and 312 are folded back to the back surface side of the integrated circuit chip S, the flexible insulating plate 31 is adhered to the side surface and the back surface of the integrated circuit chip S with the adhesive layer 36, and the outer portion 31
1, 312 can be easily fixed to the back surface of the integrated circuit chip S, and as shown in FIG.
A semiconductor device having a structure in which is formed as an external connection electrode is obtained.

Since the adhesive layer 36 is previously laminated on the flexible wiring board 30B as described above, the flexible wiring board 30B can be easily folded and fixed without using an adhesive resin such as a liquid. Become.

Next, in the semiconductor device thus obtained, the metal wire W portion and the surface of the integrated circuit chip S are sealed with an encapsulating material In such as epoxy resin by the method shown in FIG. The semiconductor device 50 as shown in FIG. 1 is obtained by heating and curing.

As described above, in the second manufacturing method, the integrated circuit chip S is formed by using the flexible wiring board 30B in which the adhesive layer 36 and the release film 37 are laminated on the back surface of the flexible insulating plate 31. When mounted on the flexible wiring board 30B, the inner portion of the flexible wiring board 30B is automatically adhered to the side surface of the integrated circuit chip S along with the upward movement of the integrated circuit chip S. The outer portion 311 of the flexible wiring board 30B can be easily formed without using an adhesive resin.
Since the 312 can be adhered to the back surface of the integrated circuit chip S, the manufacturing cost can be reduced.

By the way, in the semiconductor device 50, both the flexible wiring boards 30A and 30B have outer portions 3 thereof.
When the flexible insulating plate 31 has a high rigidity when the 11, 11 and 312 are folded back to the back surface of the integrated circuit chip S, the flexible insulating plate 31 is hard to bend along the integrated circuit chip S and is indicated by an arrow A as shown in FIG. The bases of the free end pieces 315, 316 are unlikely to be vertical, and the free end pieces 315, 3 shown by arrow B
The end portion of 16 is likely to open, and the metal wire W may be exposed even if it is sealed with the sealing material In.

What was invented in order to solve this problem is a semiconductor device constituted by using the flexible wiring board 30C of the third embodiment of the present invention shown in FIG.
This semiconductor device is a completed semiconductor device 50 shown in FIG.
The appearance and structure are the same.

As shown in FIG. 9, the flexible wiring board 30C has openings 315A and 316A corresponding to the free end pieces 315 and 316 of the flexible insulating plates 31 of the flexible wiring boards 30A and 30B on the opening 33 side. It is a substrate having a structure formed by being bent vertically downward in advance with respect to the horizontal planes of the outer portions 311 and 312.

Flexible wiring board 30C of this structure
Can be formed by using the flexible wiring board processing apparatus of the present invention as in the embodiment shown in FIG. 10 (hereinafter simply referred to as “processing apparatus”). That is,
This processing device 40 includes a fixed mold 4100 and a movable mold 420.
It is composed of 0 and 0.

The fixed mold 4100 has a flat mounting surface 4110 on which the flexible wiring board 30C can be mounted, and a flexible insulation from the opening width of the opening 33 of the flexible wiring board 30C at the center of the flat mounting surface 4110. Board 3
Side edges 4120 facing each other with a width twice as wide as 1
(Male types) are formed in parallel with each other and their cross sections are perpendicular to each other, and the peripheral portions of the opening 33 of the flexible insulating plate 31 facing each other are provided on the side edge 4120 and the external electrode 322.
A concave portion 4130 whose side can be supported by the flat mounting surface 4110 is formed. This concave portion 4130 is formed when processing the flexible wiring board used when the electrodes of the integrated circuit chip S are formed in the dual in-line arrangement.
It is formed in the shape of a groove and therefore has two side edges 41.
The structure 20 is formed.

One of the movable molds 4200 has the both side edges 4
When the both sides of the external electrode 322 of the flexible wiring board 30C are supported by the flat mounting surface 4110 outside 120,
A pair of restraining plates 4210 that restrain the external electrodes 322 from above, respectively, and the opening 3 that is placed inside the both restraining plates 4210 and placed on the both side edges 4120.
3 is provided with a punching mechanism 4220 that vertically bends the peripheral portion of the peripheral portion 3 from above to the side opposite to the surface on which the electric wiring 32 is formed at a height corresponding to the thickness of the integrated circuit chip S to be mounted. There is.

The lower surface of the restraining plate 4210 is formed with a pressing surface 4211 for pressing them in accordance with the inner peripheral portion of the flexible insulating plate 31, the wiring 32, or the step of the insulating protective film 34. Then, by a mechanism (not shown), the pressure decreases from the outside, and when the pressure disappears, the pressure rises and returns to the original position to stand by.

The punch mechanism 4220 has two processing punches 4
221, 4222 and a weight plate 4230. Further, two processing punches 4221 and 4222 are support arms 4223 and 4224, punches 4225 and 4226 formed at the tips thereof, and base end portions 4 thereof.
227, 4228 and support arms 4223, 4
224 are pivotally supported such that they intersect at their central portions and can pivot about an axis 4240, and their proximal ends 422.
Reference numerals 6 and 4227 are in contact with the lower surface of the weight plate 4230. The punches 4225 and 4226 are formed with a right-angled recess 4229 (female type) in a cross section that coincides with the right angle of both side edges 4120 so that the peripheral portions 315A and 316A of the flexible insulating plate 31 can be bent vertically downward.

The weight plate 4230 is a pair of holding plates 42.
It is supported so that it can move up and down in a horizontal state between 10 and is lowered by being pressed from above, and the base end portions 4227 and 4228 of the support arms 4223 and 4224 that are in contact with the back surfaces thereof are pushed down. Support arm 4223,
4224 punches 4225 about the axis 4240,
Open 226 to access both side edges 4120. When the pressing force from above disappears, the weighting plate 4230 rises by a mechanism (not shown), and the opening of the support arms 4223 and 4224 closes with this movement, thereby punching the punches 4225 and 4225.
226 separates from the side edges 4120 and returns to the standby position. The state shown in the figure is a state in which the punches 4225 and 4226 are pressing the peripheral portions 315A and 316A of the opening of the flexible insulating plate 31.

Next, the operation for bending the periphery 315A, 316A of the opening of the flexible insulating plate 31 using the processing device 40 constituted by the fixed mold 4100 and the movable mold 420 will be described. To do.

First, the movable mold 4200 and the both holding plates 42.
In the state where 10 is retracted to the upper standby position, the flexible wiring board 30C is positioned so that the opening 33 thereof coincides with the recess 4130 and the portion where the wiring 32 is formed is placed on the flat mounting surface 4110. Place it as you would.

Next, a pressing force C is applied to both holding plates 4210 to lower them, a flat flexible wiring board is held down, and a pressing force D is applied to the weight plate 4230 to lower them, and the punches 4225 and 4226 are fixed die 4100. Recessed portion 4130
Of the flexible insulating plate 31 and the peripheral portions 315A and 316A of the flexible insulating plate 31 are pressed. By this pressurization, the openings 315A and 316A are bent downward at a right angle. At the time of this bending process, the fixed mold 4100 and / or the movable mold 4200 are heated,
The flexible insulating plate 31 is heated at that temperature. By this heating, the flexible insulating plate 31 is softened, and the bending process can be performed with less pressing force (weight) D and in a short time.

When this bending process is completed, the pressing force D on the weight plate 4230 is released and the weight plate 42 is released.
The punches 4225 and 4226 are separated from the both side edges 4120 by raising 30 and waiting it in the original position. At the same time, the pressing force C of both holding plates 4210 is also released, and both holding plates 4
210 is raised and returned to the standby position.

The processed flexible insulating plate 31
When the heat of the above is removed, the bent flexible wiring board is removed from the fixed mold 4100.
The flexible wiring board 30C having the structure shown in FIG.

Next, a manufacturing method for manufacturing the semiconductor device 50 of the present invention using the thus-formed flexible wiring board 30C will be described with reference to FIG.

First, as shown in FIG. 11A, the integrated circuit chip S is brought into the opening 33 of the integrated circuit chip S which is horizontally mounted on a mounting table (not shown).
As shown in FIG. 11, the integrated circuit chip S is slightly inserted into the opening 33, and in this state, the bumps 1 of the integrated circuit chip S and the internal electrodes 321 of the flexible wiring board 30C are inserted as shown in FIG. Connect electrically.

Next, as shown in FIG. 11D, the outer portions 311 and 312 of the flexible wiring board 30C protruding from the outer peripheral portion of the integrated circuit chip S are cut into a predetermined shape.

Next, as shown in FIG. 11E, a pressing force E is applied to the outer portions 311 and 312 of the flexible wiring board 30C to raise the flexible wiring substrate 30C, and the periphery of the vertically bent openings 315A and 316A are bent. The lower edge hits the vicinity of the central portion of the side surface of the integrated circuit chip S, or is lifted to a position higher than that, and the metal wire W is lifted upward in a loop shape.

Next, as shown in FIG. 11F, in this state, the outer portions 311 and 312 are rotated downward as indicated by arrow F, and further rotated 180 degrees to the back surface of the integrated circuit chip S. Move and flip, as shown in FIG. 11G,
The back surface is fixed with an adhesive.

After that, as shown in FIG. 6, the front surface and the side surface of the integrated circuit chip S are sealed with the sealing material In, whereby the semiconductor device 50 of the present invention is completed.

Since the semiconductor device 50 is formed in a state where the openings 315A and 316A of the flexible wiring board 30C are bent at right angles in advance, the free end pieces 315 and 316 are integrated as shown in FIG. Circuit chip S
It does not rise from the side of the and is kept in close contact. Therefore, the metal wire W is not exposed from the sealing material In.

When the integrated circuit chip S to be mounted has the electrodes formed in the quad in-line arrangement or the area array arrangement, the periphery of the four side openings of the flexible wiring board must be bent vertically. I have to. In the case of performing this bending process, first, the two opposite sides are bent, then the flexible wiring board is removed from the fixed mold 4100 and rotated 90 degrees with respect to the fixed mold 4100. Then, it is placed again, and the remaining two opposite sides may be bent.

Even when a flexible wiring board having a structure such as the flexible wiring board 30C is used, in order to easily fix the outer parts 311 and 312 to the back surface of the integrated circuit chip S, the back surface of the back surface of the integrated circuit chip S can be easily fixed. The adhesive layer and the release film may be laminated together.

[0089]

As described above, according to the semiconductor device of the present invention, there is provided a semiconductor device having external connection electrodes on the back surface which are slightly larger than the planar size of the integrated circuit chip and have a wide pitch. Moreover, the side surface and the back surface of the integrated circuit chip are covered and protected by an insulating material or a flexible wiring board.

Further, according to the method of manufacturing a semiconductor device of the present invention for manufacturing the above-mentioned semiconductor device, the opening is formed in the central portion, and the notch is provided at the portion corresponding to the corner of the integrated circuit chip to be mounted. By using the flexible wiring board, it is possible to manufacture a semiconductor device having an external connection electrode on the back surface, which is slightly larger than the planar size of the integrated circuit chip and has a wide pitch.

Further, according to the flexible wiring board of the present invention, since the opening and the notch are formed in the central portion, it is easy to fix the peripheral portion of the opening to the side surface of the integrated circuit chip, and especially the opening is previously prepared. If the peripheral part is bent vertically downward and shaped, the integrated circuit chip can be easily inserted and is along the side surface of the integrated circuit chip. The wire can be sealed with a sealant. Furthermore,
By using the flexible wiring board having the adhesive layer formed on the back surface in advance, the flexible insulating plate can be automatically fixed to the side surface and the back surface of the integrated circuit chip, and the work efficiency is improved.

Further, according to the flexible wiring board processing apparatus of the present invention, it is possible to easily obtain a flexible wiring board which is formed by bending the periphery of the opening vertically downward in advance with a simple structure and configuration. By using a flexible wiring board having a different structure, it is possible to obtain a semiconductor device capable of preventing the metal wire from being exposed from the sealing material.

[Brief description of drawings]

FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention.

2A and 2B show the shape of one unit of a flexible wiring board suitable for use in the semiconductor device shown in FIG. 1. FIG. 2A is a plan view of the same, and FIG. FIG. 3 is a plan view of the back surface of the semiconductor device shown in FIG. 1, showing the external connection electrodes formed by bending the external electrode portions of the wiring board on the back surface.

FIG. 3 is a plan view showing the shape of one unit of a flexible wiring board according to other three embodiments.

FIG. 4 is a plan view of the back surface of the semiconductor device showing the external connection electrodes formed by bending the external electrode portions of the flexible wiring boards of various shapes shown in FIG.

5A to 5C are process diagrams showing a first manufacturing method of the semiconductor device shown in FIG.

6A to 6C are process diagrams showing a method for sealing a semiconductor device obtained by the method for manufacturing the semiconductor device shown in FIG. 5 with an insulating material.

FIG. 7 is a process drawing showing a second manufacturing method of the semiconductor device shown in FIG.

FIG. 8 is a cross-sectional view of an unfavorable structure of the semiconductor device of the present invention.

FIG. 9 is a sectional view of a flexible wiring board according to a second embodiment of the present invention.

10 is a cross-sectional view of the flexible wiring board forming apparatus of the second embodiment shown in FIG.

FIG. 11 is a process diagram showing a third manufacturing method of a semiconductor device using the flexible wiring board of the second embodiment shown in FIG. 9.

FIG. 12 is a half sectional view showing a semiconductor device in which an external connection electrode is formed on the back surface of a conventional technique.

FIG. 13 is a half cross-sectional view showing another semiconductor device in which an external connection electrode is formed on the back surface.

14 is a cross-sectional view of a stacked semiconductor device in which a plurality of semiconductor devices shown in FIG. 13 are stacked.

[Explanation of symbols]

1 ... Bump (electrode) of integrated circuit chip S, 30A, 30
B, 30C ... Flexible wiring board, 31 ... Flexible insulating plate, 311, 312 ... Outer part of flexible insulating plate 31, 32 ... Wiring, 321 ... Internal electrode, 322 ... External electrode (external connection electrode), 33 ... Opening part , 34 ... Insulating protective film, 35 ... Notch, 36 ... Adhesive layer, 37 ... Release film, 40 ... Flexible wiring board processing device, 410
0 ... Fixed mold, 4120 ... Side edge, 4130 ... Recessed portion, 42
00 ... Movable die, 4210 ... Suppression plate, 4220 ... Punch mechanism, 4221, 4222 ... Processing punch, 4230 ... Weighting plate, 50 ... Semiconductor device of the present invention, S ... Integrated circuit chip, In ... Insulating material, W ... Metal Wire, La ... Folded line

Claims (12)

[Claims] 1. A quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted is formed in a central portion of a flexible insulating plate, and an internal portion corresponding to an electrode of the integrated circuit chip is formed on the opening side. Electrodes are formed in a predetermined array on the outside in which an external wiring corresponding to the internal electrodes is formed, and a length corresponding to the thickness of the integrated circuit chip is formed around the opening. A flexible wiring board having a notch formed therein. 2. A peripheral portion of the opening is preliminarily bent vertically to a side opposite to a side where the electric wiring is formed at a height corresponding to a thickness of an integrated circuit chip to be mounted. The flexible wiring board according to claim 1. 3. An adhesive layer and a release film covering the adhesive layer are laminated on the side of the flexible insulating plate opposite to the side where the electric wiring is formed.
Alternatively, the flexible wiring board according to claim 2. 4. A quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted is formed in a central portion of a flexible insulating plate, and an internal portion corresponding to an electrode of the integrated circuit chip is formed on the opening side. An electrode is a flexible wiring board on which electric wirings having external electrodes corresponding to the internal electrodes formed outward are formed in a predetermined array, and the center of the opening corresponds to the opening shape of the opening. It is placed so that it coincides with the center of the concave portion of the mold in which the concave portion is formed, and the peripheral portion of the opening of the flexible insulating plate is weighted from above to correspond to the thickness of the integrated circuit chip. A method of processing a flexible wiring board, characterized in that a side plate that covers a side surface of the integrated circuit chip is formed by bending the electric wiring forming surface vertically downward with a width. 5. The flexible wiring board according to claim 4, wherein the mold is heated when the peripheral portion of the flexible insulating plate is bent, and the mold is bent while heating at least the peripheral portion at the heating temperature. Processing method. 6. A flexible insulating plate is provided with a quadrilateral opening having an area into which an integrated circuit chip can be inserted, and an internal electrode corresponding to an electrode of the integrated circuit chip is provided outside the opening. On the other hand, an electric wiring on which an external electrode corresponding to the internal electrode is formed is formed in a predetermined array, and the peripheral portion of the opening is provided with a height corresponding to the thickness of the integrated circuit chip to be mounted. In the processing device for a flexible wiring board that is bent vertically to the side opposite to the side where the electric wiring is formed, a flat mounting surface on which the flexible wiring board can be mounted,
The side edges facing each other are parallel to each other with an interval width wider than the opening width of the peripheral portion where the internal electrodes are formed in the central portion of the flat mounting surface by twice the thickness of the flexible insulating plate, and their cross sections are parallel to each other. Formed at right angles, the peripheral portions of the opening of the flexible insulating plate facing each other are formed on the side edges, and the external electrode side is formed with a concave portion that can be supported by a flat mounting surface outside the side edges. A fixed die, a pair of holding plates that hold the two external electrode sides supported by a flat mounting surface outside the both side edges from above, respectively, and a pair of holding plates that are located inside the two holding plates The peripheral portion mounted on the edge is provided with a punch that vertically bends from above to a side opposite to the side where the electric wiring is formed at a height corresponding to the thickness of the integrated circuit chip to be mounted. Flexible wiring board processing equipment with movable mold Place 7. An integrated circuit chip having a plurality of electrodes formed thereon, and a plurality of internal electrodes corresponding to the plurality of electrodes of the integrated circuit chip inward, and an external device connected to the plurality of internal electrodes. A plurality of electric wirings having electrodes formed on the outside, and a flexible wiring board having the flexible insulating plate formed on the same surface, wherein the plurality of electrodes of the integrated circuit chip serve as the plurality of inner electrodes. A semiconductor device, which is electrically connected to each other, wherein the plurality of external electrodes are formed as external connection electrodes on a back surface side of the integrated circuit chip. 8. An integrated circuit chip having a plurality of electrodes formed therein, and a quadrilateral opening having an area into which the integrated circuit chip can be inserted is formed in a central portion of a flexible insulating plate, and the opening side is provided on the side of the opening. The internal electrodes corresponding to the electrodes of the integrated circuit chip and the external electrodes corresponding to the internal electrodes are formed on the outside in the opening of the flexible wiring board in a predetermined arrangement. A circuit chip is inserted, a side surface of the integrated circuit chip is covered with a flexible insulating plate around the opening, and a back surface is covered with the flexible insulating plate on which the plurality of external electrodes are formed. And a plurality of outer portions are formed as external connection electrodes. 9. A flexible wiring board having a plurality of internal electrodes formed inwardly and an external electrode connected to the plurality of internal electrodes outwardly formed on the same surface, wherein the plurality of electrodes are formed on the surface. A method of manufacturing a semiconductor device, comprising: mounting an integrated circuit chip on which an external connection electrode is formed on a back surface of the integrated circuit chip; electrically connecting the plurality of electrodes of the integrated circuit chip to the internal electrodes of the flexible wiring board, respectively. And a folding step of folding and fixing the outer portion of the flexible wiring board on which the plurality of external electrodes are formed to the back surface side of the integrated circuit chip. Device manufacturing method. 10. A quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted is formed in a central portion of a flexible insulating plate, and an internal portion corresponding to an electrode of the integrated circuit chip is formed on the opening side. Electrodes are formed on the surface in a predetermined array on the outside of which external electrodes corresponding to the internal electrodes are formed, and in the periphery of the opening, the electric wiring corresponds to the thickness of the integrated circuit chip. In a method of manufacturing a semiconductor device, wherein an integrated circuit chip having a plurality of electrodes formed on a front surface is mounted on a flexible wiring substrate having a length cut, and an external connection electrode is formed on a back surface of the integrated circuit chip. While inserting the integrated circuit chip into the opening from the back side to the front side of the flexible wiring board with the front side facing upward, A positioning step of pushing up the flexible insulating plate which is the free end and positioning the integrated circuit chip at a position where the free end covers the side surface of the integrated circuit chip; and the plurality of electrodes of the integrated circuit chip. An electrode connecting step of connecting to each of the internal electrodes of the flexible wiring board, and an outer portion of the flexible wiring board, on which the plurality of external electrodes are formed, protruding from the positioned integrated circuit chip, the integrated circuit chip. A cutting step of cutting the outer portion so that the plurality of external electrodes are located on the back surface side when folded back to the back surface side of the integrated circuit chip. A folding step of folding back and fixing to the back side, and a flexible wiring board covering the front surface and the side surface of the integrated circuit chip. The method of manufacturing a semiconductor device, characterized in that an insulating coating step of coating a minute and with an insulating material. 11. A flexible insulating plate is formed with a quadrilateral opening having an area into which an integrated circuit chip to be mounted can be inserted, and an internal portion corresponding to an electrode of the integrated circuit chip is formed on the opening side. Electrodes are formed on the surface in a predetermined arrangement on the surface of which electrical wiring is formed on the outside of which external electrodes corresponding to the internal electrodes are formed, and a flexible insulating plate around the opening is formed on the integrated circuit chip. The integrated circuit chip having a plurality of electrodes formed on a surface thereof is mounted on a flexible wiring substrate that is preliminarily bent at a height corresponding to a thickness and is opposite to the side on which the electric wiring is formed. In a method for manufacturing a semiconductor device in which an external connection electrode is formed on the back surface of a chip, the integrated circuit chip is directed upward from the front surface side to the back surface side of the flexible wiring board. A positioning step of positioning the integrated circuit chip at a position on the opening, and connecting the plurality of electrodes of the positioned integrated circuit chip to the internal electrodes of the flexible wiring board with metal wires of a predetermined length, respectively. And a case where the outer portion of the flexible wiring board protruding from the integrated circuit chip connected with the metal wire and having the plurality of external electrodes is folded back to the back surface side of the integrated circuit chip. A cutting step of cutting the outer portion so that the plurality of external electrodes are located on the back surface side, and a lifting step of the flexible wiring board for lifting the cut flexible wiring board and lifting the metal wire in a loop shape. And flipping the outer part of the lifted flexible wiring board to the back side of the integrated circuit chip. An insulating material is provided between the step, the fixing step of fixing the outer portion of the inverted flexible wiring board to the back surface of the integrated circuit chip, and the portion of the flexible wiring board covering the front surface and the side surface of the integrated circuit chip. And an insulating coating step of coating with. 12. The adhesive layer is formed on the surface of the flexible wiring board opposite to the surface on which the internal electrodes and the external electrodes are formed, according to claim 9, Alternatively, the method of manufacturing a semiconductor device according to claim 11.