JP2003078234A - Printed wiring board and method of manufacturing the same - Google Patents
Printed wiring board and method of manufacturing the sameInfo
- Publication number
- JP2003078234A JP2003078234A JP2001264148A JP2001264148A JP2003078234A JP 2003078234 A JP2003078234 A JP 2003078234A JP 2001264148 A JP2001264148 A JP 2001264148A JP 2001264148 A JP2001264148 A JP 2001264148A JP 2003078234 A JP2003078234 A JP 2003078234A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- forming
- pattern
- plating
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、セミアディティブ
法によりプリント配線板およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and a method for manufacturing the same by a semi-additive method.
【０００２】[0002]
【従来の技術】プリント配線板を形成するにはサブトラ
クティブ法が広く用いられている。しかし、近年、電子
機器の小型化、高密度実装化及び高性能化（高速化）に
伴い、配線板自体の高密度化、即ち導体パターンの微細
化が求められているにつれて、サブトラクティブ法で対
応しきれなくなっているのが現状である。更なる微細な
パターンを形成する有効な手段としてセミアディティブ
法が用いられている。2. Description of the Related Art The subtractive method is widely used for forming a printed wiring board. However, in recent years, with the miniaturization, high-density mounting, and high performance (high speed) of electronic devices, as the wiring board itself is required to have a higher density, that is, a finer conductor pattern, a subtractive method is used. The current situation is that we are no longer able to respond. The semi-additive method is used as an effective means for forming a finer pattern.
【０００３】これまで、セミアディティブ法でプリント
配線板を作製するには、先ず絶縁性基板上にスパッタあ
るいは無電解めっきで薄い下地銅層を形成し、次に前記
下地銅層の表面にめっき用のフォトレジストのマスクパ
ターンを形成する。次に電解めっき法で銅配線パターン
を形成し、フォトレジストのマスクパターンを剥離す
る。最後に、ソフトエッチングで下地銅層の不要となっ
た部分を除去することによって銅配線パターンを形成す
ることができる。To manufacture a printed wiring board by the semi-additive method, a thin copper base layer is first formed on an insulating substrate by sputtering or electroless plating, and then the surface of the copper base layer is plated. Forming a photoresist mask pattern. Next, a copper wiring pattern is formed by electrolytic plating, and the photoresist mask pattern is peeled off. Finally, a copper wiring pattern can be formed by removing unnecessary portions of the underlying copper layer by soft etching.
【０００４】[0004]
【発明が解決しようとする課題】セミアディティブ法で
サブトラクティブ法より微細なパターンを形成すること
ができるが、問題もある。まず、下地銅層をスパッタや
無電解めっきで形成するために密着強度が得られないこ
とである。さらにソフトエッチング工程でも問題があ
る。即ち下地銅層の不要となった部分を除去すると同時
に銅配線パターンにもダメージを与えてしまうことであ
る。本発明では、セミアディティブ法を生かしながら、
密着強度が得られ、ソフトエッチングする時に下地銅層
の不要部分を除去すると同時に銅配線パターンにダメー
ジを与えないプリント配線板およびその製造方法を提供
するものである。Although a finer pattern can be formed by the semi-additive method than by the subtractive method, there is a problem. First, the adhesion strength cannot be obtained because the underlying copper layer is formed by sputtering or electroless plating. Furthermore, there is a problem in the soft etching process. That is, the unnecessary portion of the underlying copper layer is removed, and at the same time, the copper wiring pattern is damaged. In the present invention, while utilizing the semi-additive method,
(EN) Provided are a printed wiring board which can obtain adhesion strength, remove unnecessary portions of a base copper layer at the time of soft etching, and at the same time do not damage a copper wiring pattern, and a method for manufacturing the same.
【０００５】[0005]
【課題を解決するための手段】請求項１としては、銅箔
付き絶縁基板上にセミアディティブ法により銅配線パタ
ーンを形成するプリント配線板の製造方法において、化
学研磨液で絶縁基板上に形成した銅箔を薄くし、電解め
っき導通用の下地銅層を形成する工程と、下地銅層が形
成された絶縁基板上に銅配線パターンをめっきで形成す
るためのマスクパターンを形成する工程と、電解めっき
法でマスクパターン以外の露出した部分に銅めっき被膜
を形成する工程と、剥離液でマスクパターンを剥離する
工程と、ソフトエッチングにより不要となった下地銅層
を除去し、所要の配線パターンを形成することを特徴と
するプリント配線板の製造方法である。請求項２として
は、銅箔付き絶縁基板上にセミアディティブ法により銅
配線パターンを形成するプリント配線板の製造方法にお
いて、化学研磨液で絶縁基板上に形成した銅箔を薄く
し、電解めっき導通用の下地銅層を形成する工程と、下
地銅層が形成された絶縁基板上に銅配線パターンをめっ
きで形成するためのマスクパターンを形成する工程と、
電解めっき法でマスクパターン以外の露出した部分に銅
めっき被膜を形成する工程と、銅配線パターンをソフト
エッチング工程から保護するために、引き続きめっき法
で前記銅めっき被膜の表面に銅以外の金属保護層を形成
する工程と、剥離液でマスクパターンを剥離する工程
と、ソフトエッチングにより不要となった下地銅層を除
去し、所要の配線パターンを形成することを特徴とする
プリント配線板の製造方法である。請求項３としては、
銅箔付き絶縁基板上にセミアディティブ法により銅配線
パターンを形成するプリント配線板の製造方法におい
て、化学研磨液で絶縁基板上に形成した銅箔を薄くし、
電解めっき導通用の下地銅層を形成する工程と、下地銅
層が形成された絶縁基板上に銅配線パターンをめっきで
形成するためのマスクパターンを形成する工程と、電解
めっき法でマスクパターン以外の露出した部分に銅めっ
き被膜を形成する工程と、剥離液でマスクパターンを剥
離する工程と、銅配線パターンをソフトエッチング工程
から保護するために、めっき法で前記銅配線パターンの
露出面に銅以外の金属保護層を形成するためのマスクパ
ターンを形成する工程と、めっき法で前記銅めっき被膜
の露出面に銅以外の金属保護層を形成する工程と、剥離
液でマスクパターンを剥離する工程と、ソフトエッチン
グにより不要となった下地銅層を除去し、所要の配線パ
ターンを形成することを特徴とするプリント配線板の製
造方法である。請求項４としては、前記絶縁基板がポリ
イミド、液晶ポリマなどから選ばれたものであることを
特徴とするプリント配線板の製造方法である。請求項５
としては、前記銅以外の金属がＮｉ、Ｃｒ、Ａｕから選
ばれたものであることを特徴とするプリント配線板の製
造方法である。請求項６としては、前記下地銅層の厚み
は０．１〜３μｍであることを特徴とするプリント配線
板の製造方法である。請求項７としては、前記金属保護
層の厚みは０．１〜１０μｍであることを特徴とする請
求項１〜３に記載のプリント配線板の製造方法である。
請求項８としては、化学研磨された銅箔付き絶縁基板上
にセミアディティブ法により銅配線パターンを形成した
ことを特徴とするプリント配線板である。請求項９とし
ては、前記銅配線パターンに銅以外の金属保護層を形成
したことを特徴とする請求項８記載のプリント配線板で
ある。According to a first aspect of the present invention, in a method for manufacturing a printed wiring board in which a copper wiring pattern is formed on a copper foil-insulating substrate by a semi-additive method, the copper wiring pattern is formed on the insulating substrate with a chemical polishing liquid. Thinning the copper foil, forming a base copper layer for electroplating conduction, forming a mask pattern for forming a copper wiring pattern by plating on the insulating substrate on which the base copper layer is formed, and electrolytic The step of forming a copper plating film on the exposed portion other than the mask pattern by the plating method, the step of peeling the mask pattern with a peeling solution, and the unnecessary underlying copper layer are removed by soft etching to obtain the required wiring pattern. It is a manufacturing method of a printed wiring board characterized by forming. According to a second aspect of the present invention, in a method for manufacturing a printed wiring board in which a copper wiring pattern is formed on an insulating substrate with a copper foil by a semi-additive method, a copper foil formed on the insulating substrate is thinned with a chemical polishing liquid, and electrolytic plating is performed. A step of forming a common underlying copper layer, a step of forming a mask pattern for forming a copper wiring pattern by plating on the insulating substrate on which the underlying copper layer is formed,
In order to protect the copper wiring pattern from the step of forming a copper plating film on the exposed part other than the mask pattern by the electrolytic plating method and the soft etching process of the copper wiring pattern, the plating method is continuously used to protect the surface of the copper plating film from metal other than copper. A method of manufacturing a printed wiring board, which comprises forming a layer, a step of peeling a mask pattern with a peeling solution, and removing an unnecessary underlying copper layer by soft etching to form a required wiring pattern. Is. As claim 3,
In a method for manufacturing a printed wiring board in which a copper wiring pattern is formed by a semi-additive method on an insulating substrate with a copper foil, a copper foil formed on the insulating substrate is thinned with a chemical polishing liquid,
A step of forming a base copper layer for electroplating continuity, a step of forming a mask pattern for forming a copper wiring pattern by plating on an insulating substrate on which the base copper layer is formed, and a step other than the mask pattern by the electroplating method. A step of forming a copper plating film on the exposed portion of the copper wiring, a step of peeling the mask pattern with a peeling solution, and a copper plating method on the exposed surface of the copper wiring pattern to protect the copper wiring pattern from the soft etching step. Other than the step of forming a mask pattern for forming a metal protective layer, a step of forming a metal protective layer other than copper on the exposed surface of the copper plating film by a plating method, and a step of peeling the mask pattern with a peeling liquid And a method for manufacturing a printed wiring board, characterized in that the unnecessary underlying copper layer is removed by soft etching to form a required wiring pattern. A fourth aspect of the present invention is a method for manufacturing a printed wiring board, wherein the insulating substrate is selected from polyimide, liquid crystal polymer, and the like. Claim 5
In the method for producing a printed wiring board, the metal other than copper is selected from Ni, Cr, and Au. According to a sixth aspect of the present invention, there is provided a method of manufacturing a printed wiring board, wherein the underlying copper layer has a thickness of 0.1 to 3 μm. A seventh aspect of the present invention is the method for manufacturing a printed wiring board according to the first to third aspects, wherein the metal protective layer has a thickness of 0.1 to 10 μm.
A eighth aspect of the present invention is a printed wiring board, wherein a copper wiring pattern is formed by a semi-additive method on a chemically polished insulating substrate with a copper foil. A ninth aspect of the present invention is the printed wiring board according to the eighth aspect, wherein a metal protective layer other than copper is formed on the copper wiring pattern.
【０００６】[0006]
【発明の実施の形態】以下、本発明を図１〜３を使い製
造工程に従って詳細に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to FIGS.
【０００７】本発明における絶縁基板としては、例えば
予め３００ｇｆ／ｃｍ以上の密着強度を有する銅箔付き
ポリイミド、液晶ポリマ等を使用することができる。As the insulating substrate in the present invention, it is possible to use, for example, polyimide with a copper foil, liquid crystal polymer or the like having an adhesion strength of 300 gf / cm or more beforehand.
【０００８】本発明は、まず絶縁基板上に張り付けた銅
箔を化学研磨で薄くし、電気めっき導通用の下地銅層を
形成する（図１（１）参照）。下地銅層の厚みは０．１
〜３μｍで、１μｍ以下が好ましい。また、化学研磨に
用いられる薬液としては、過酸化水素水＋硫酸又は過硫
酸アンモニウムが使用できる。In the present invention, first, a copper foil attached on an insulating substrate is thinned by chemical polishing to form a base copper layer for conducting electroplating (see FIG. 1 (1)). The thickness of the underlying copper layer is 0.1
˜3 μm, preferably 1 μm or less. Further, as the chemical liquid used for chemical polishing, hydrogen peroxide solution + sulfuric acid or ammonium persulfate can be used.
【０００９】次に、絶縁基板／下地銅層基板上にドライ
フィルムをラミネートし、露光・現像などの工程を経て
から、銅配線パターンを形成するためのめっき用マスク
パターンを形成する（図１（２）参照）。ドライフィル
ムの厚みは１０〜３０μｍで、好ましいのは１５μｍで
ある。Next, a dry film is laminated on the insulating substrate / underlying copper layer substrate, and after undergoing steps such as exposure and development, a plating mask pattern for forming a copper wiring pattern is formed (see FIG. 1 ( See 2)). The thickness of the dry film is 10 to 30 μm, preferably 15 μm.
【００１０】銅配線パターンと下地銅層との密着性をよ
くするために電解銅めっきをする前に酸性クリーナーと
希硫酸溶液にめっき用マスクパターンを形成したポリイ
ミド／下地銅層基板を浸漬する処理を行う。Treatment for dipping a polyimide / underlying copper layer substrate on which a plating mask pattern is formed in an acidic cleaner and dilute sulfuric acid solution before electrolytic copper plating in order to improve the adhesion between the copper wiring pattern and the underlying copper layer I do.
【００１１】次に、電解銅めっき法で下地銅層の露出す
る部分にめっき被膜を形成し（図１（３）参照）、剥離
液でドライフィルムのマスクパターンを剥離してから
（図１（４）参照）、ソフトエッチングで不要となった
下地銅層を除去し、所要の銅配線パターンを形成する
（図１（５）参照）。Next, a plating film is formed on the exposed portion of the underlying copper layer by electrolytic copper plating (see FIG. 1C), and the mask pattern of the dry film is peeled off with a stripping solution (see FIG. 1 ( 4)), the unnecessary underlying copper layer is removed by soft etching, and a required copper wiring pattern is formed (see FIG. 1 (5)).
【００１２】しかし、ソフトエッチング時に銅配線パタ
ーンに与えるダメージが大きいため、本発明ではこのダ
メージを軽減するために別の工程を提案する。これは電
解めっき法で下地銅層の露出する部分にめっき被膜を形
成した後に更にめっき法で銅のソフトエッチング液と反
応しにくい金属保護層を銅めっき被膜の表面に形成する
ことである（図２（１）参照）。However, since damage to the copper wiring pattern is large during soft etching, the present invention proposes another process for reducing this damage. This is to form a plating film on the exposed part of the underlying copper layer by the electrolytic plating method, and then to form a metal protective layer on the surface of the copper plating film that is hard to react with the copper soft etching solution by the plating method (Fig. 2 (1)).
【００１３】電解銅めっきで形成した銅めっき被膜の表
面に金属保護層を形成することがソフトエッチング時に
銅配線パターンに与えるダメージを軽減することができ
るが、サイドエッチングを防ぐことができないので、銅
配線パターンを完全に保護することができない。そこで
本発明は更に別の工程を提案する。これは、電解銅めっ
き法で下地銅層の露出する部分にめっき被膜を形成して
から（図１（３）参照）、一旦剥離液でドライフィルム
のマスクパターンを剥離し（図１（４）参照）、その後
めっき銅被膜を形成したポリイミド／下地銅層基板上に
めっきで銅配線パターンの露出面（両側面と表面）に保
護層を形成するためのドライフィルムマスクパターンを
形成してから（図３（１）参照）、めっきで銅のソフト
エッチング液と反応しにくい金属保護層を銅配線パター
ン露出面（両側面と表面）に形成する（図３（２）参
照）ことである。Forming a metal protective layer on the surface of a copper plating film formed by electrolytic copper plating can reduce damage to the copper wiring pattern during soft etching, but cannot prevent side etching. The wiring pattern cannot be completely protected. Therefore, the present invention proposes another step. This is because the plating film is formed on the exposed portion of the underlying copper layer by the electrolytic copper plating method (see FIG. 1 (3)), and then the mask pattern of the dry film is once peeled with a peeling liquid (FIG. 1 (4)). Then, form a dry film mask pattern for forming a protective layer on the exposed surface (both sides and surface) of the copper wiring pattern by plating on the polyimide / underlying copper layer substrate on which the plated copper film has been formed (see 3 (1)), a metal protective layer that is hard to react with the copper soft etching solution by plating is formed on the exposed surface (both sides and surface) of the copper wiring pattern (see FIG. 3 (2)).
【００１４】このような金属はＮｉ、Ｃｒ、Ａｕ、Ａｌ
などから選ぶことができる。Such metals are Ni, Cr, Au and Al.
You can choose from
【００１５】最後に、剥離液でドライフィルムのマスク
パターンを剥離してから（図２（２）と図３（３）参
照）、ソフトエッチングで不要となった下地銅層を除去
し、所要の配線パターンを形成する（図２（３）と図３
（４）参照）。Finally, after removing the mask pattern of the dry film with a stripping solution (see FIGS. 2 (2) and 3 (3)), the unnecessary underlying copper layer is removed by soft etching to obtain the required layer. A wiring pattern is formed (FIG. 2C and FIG.
(See (4)).
【００１６】[0016]
【実施例】＜実施例１＞まず、過酸化水素水と硫酸から
なるソフトエッチング液でポリイミド２の表面に張り付
けた銅箔を化学研磨することによって、１μｍまで薄く
し、電気めっき導通用の下地銅層１を形成した（図１
（１）参照）。[Examples] <Example 1> First, a copper foil attached to the surface of a polyimide 2 was chemically polished with a soft etching solution containing hydrogen peroxide and sulfuric acid to a thickness of 1 μm, and a base for electroplating conduction was formed. Copper layer 1 was formed (Fig. 1
(See (1)).
【００１７】次に、ポリイミド／下地銅層基板の表面に
膜厚１５μｍドライフィルム（ニチゴーモートン製、Ｎ
ＩＴ）を１００℃、圧力３ｋｇ／ｃｍ2でラミネートを
行い、約５０ｍＪ／ｃｍ2の紫外線で選択的に露光し、
３０℃１％の炭酸ナトリウム溶液で約１０秒間現像を行
うことにより銅配線パターンを形成するためのめっきマ
スクパターン３を形成した（図１（２）参照）。Next, a 15 μm thick dry film (Nichigo Morton, N
(IT) at 100 ° C. and a pressure of 3 kg / cm 2 , and is selectively exposed to ultraviolet light of about 50 mJ / cm 2 ,
A plating mask pattern 3 for forming a copper wiring pattern was formed by performing development with a 1% sodium carbonate solution at 30 ° C. for about 10 seconds (see FIG. 1 (2)).
【００１８】次に、めっき用マスクパターンを形成した
ポリイミド／下地銅層基板をアトテック製の酸性クリー
ナーＦＲＸ溶液に４０℃４分間浸漬し、その後１０％の
希硫酸に１２０秒間浸漬を行ってから、硫酸銅電解めっ
き法で、下地銅層の露出する部分に高さ１０μｍの銅め
っき被膜４を形成してから（図１（３）参照）、マスク
パターン３を５０℃の３％炭酸ナトリウム溶液で剥離し
た（図１（４）参照）。Next, the polyimide / underlying copper layer substrate on which the plating mask pattern is formed is dipped in an acid cleaner FRX solution manufactured by Atotech at 40 ° C. for 4 minutes and then dipped in 10% dilute sulfuric acid for 120 seconds. After forming a copper plating film 4 having a height of 10 μm on the exposed portion of the underlying copper layer by the copper sulfate electrolytic plating method (see FIG. 1 (3)), the mask pattern 3 is formed with a 3% sodium carbonate solution at 50 ° C. It was peeled off (see FIG. 1 (4)).
【００１９】前記化学研磨時と同じ薬液でソフトエッチ
ングを行い、不要となった下地銅層を除去し、所要の銅
配線パターン５を形成した（図１（５）参照）。Soft etching was performed with the same chemical solution as that used for the chemical polishing, the unnecessary underlying copper layer was removed, and the required copper wiring pattern 5 was formed (see FIG. 1 (5)).
【００２０】＜実施例２＞硫酸銅電解めっき法で、下地
銅層の露出する部分に高さ１０μｍの銅めっき被膜４を
形成するまでは実施例と同じ工程であった（図１（１）
〜（３）参照）。その後更に銅めっき被膜の表面に電気
Ｎｉめっきで厚み１μｍのＮｉからなる金属保護層６を
形成した（図２（１）参照）。<Embodiment 2> The same steps as those of the embodiment were carried out until the copper plating film 4 having a height of 10 μm was formed on the exposed portion of the underlying copper layer by the copper sulfate electrolytic plating method (FIG. 1 (1)).
(See (3)). Thereafter, a metal protective layer 6 made of Ni and having a thickness of 1 μm was formed on the surface of the copper plating film by electric Ni plating (see FIG. 2 (1)).
【００２１】最後に、５０℃の３％炭酸ナトリウム溶液
でドライフィルムマスクパターン３を剥離してから（図
２（２）参照）、前記化学研磨時と同じ薬液でソフトエ
ッチングで不要となった下地銅層を除去し、所要の銅配
線パターン７を形成した（図２（３）参照）。Finally, since the dry film mask pattern 3 was peeled off with a 3% sodium carbonate solution at 50 ° C. (see FIG. 2 (2)), a base material which was unnecessary by soft etching with the same chemical solution as the chemical polishing was used. The copper layer was removed and the required copper wiring pattern 7 was formed (see FIG. 2C).
【００２２】＜実施例３＞硫酸銅電解めっき法で、下地
銅層の露出する部分に高さ１０μｍの銅めっき被膜４を
形成してから、マスクパターン３を５０℃の３％炭酸ナ
トリウム溶液で剥離するまでの工程は実施例１と同じで
あった（図１（１）〜（４）参照）。<Embodiment 3> A copper plating film 4 having a height of 10 μm is formed on an exposed portion of a base copper layer by a copper sulfate electrolytic plating method, and then a mask pattern 3 is formed with a 3% sodium carbonate solution at 50 ° C. The steps until peeling were the same as in Example 1 (see FIGS. 1 (1) to 1 (4)).
【００２３】次に、図１（４）の銅めっき被膜４の間に
めっき法で金属保護層を形成するためのドライフィルム
マスクパターン８を形成した（図３（１）参照）。Next, a dry film mask pattern 8 for forming a metal protective layer was formed between the copper plating films 4 of FIG. 1 (4) by a plating method (see FIG. 3 (1)).
【００２４】次に、銅めっき被膜４の露出面（両側面と
表面）に電気Ｎｉめっきで厚み１μｍの金属保護層９を
形成した（図３（２）参照）。Next, a metal protective layer 9 having a thickness of 1 μm was formed on the exposed surface (both side surfaces and surface) of the copper plating film 4 by electric Ni plating (see FIG. 3 (2)).
【００２５】最後に、５０℃の３％炭酸ナトリウム溶液
でドライフィルムマスクパターン８を剥離してから（図
３（３）参照）、前記化学研磨時と同じソフトエッチン
グ液で不要となった下地銅層を除去し、所要の銅配線パ
ターン１０を形成した（図３（４）参照）。Finally, since the dry film mask pattern 8 was peeled off with a 3% sodium carbonate solution at 50 ° C. (see FIG. 3 (3)), the same copper base copper that was no longer needed with the same soft etching solution as that used during the chemical polishing was used. The layers were removed to form the required copper wiring pattern 10 (see FIG. 3 (4)).
【００２６】[0026]
【発明の効果】本発明によれば、セミアディティブ法に
よる銅配線パターンを形成する時に、銅配線パターンの
露出面の一部或いは全部を薄いＮｉなどからなる金属保
護層で覆うことによって、ソフトエッチングにおける銅
配線パターンへのダメージを大きく軽減、或いはゼロに
することができる。したがって、微細な銅配線パターン
の間の不要となった下地銅層も十分のソフトエッチング
時間が取れるため完全に除去できることによって微細な
銅配線パターンを形成することができる。According to the present invention, when a copper wiring pattern is formed by the semi-additive method, a part or all of the exposed surface of the copper wiring pattern is covered with a metal protective layer made of thin Ni or the like, whereby soft etching is performed. The damage to the copper wiring pattern can be greatly reduced or even reduced to zero. Therefore, the unnecessary underlying copper layer between the fine copper wiring patterns can be completely removed because a sufficient soft etching time can be taken, so that a fine copper wiring pattern can be formed.
【００２７】[0027]
【図１】セミアディティブ法によるプリント基板の製造
工程の説明図。FIG. 1 is an explanatory view of a manufacturing process of a printed circuit board by a semi-additive method.
【図２】本発明のプリント配線板の製造工程の説明図。FIG. 2 is an explanatory view of a manufacturing process of the printed wiring board of the present invention.
【図３】本発明のプリント配線板の製造工程の説明図。FIG. 3 is an explanatory view of a manufacturing process of the printed wiring board of the present invention.
１ 下地銅層
２ ポリイミド基板
３ 銅めっき用のドライフィルムのマスクパターン
４ 銅めっき被膜
５ 銅配線パターン
６ 金属保護層
７ 銅配線パターン
８ 金属保護層めっき用のドライフィルムのマスクパタ
ーン
９ 金属保護層
１０ 銅配線パターンDESCRIPTION OF SYMBOLS 1 Base copper layer 2 Polyimide board 3 Mask pattern 4 of dry film for copper plating 4 Copper plating film 5 Copper wiring pattern 6 Metal protective layer 7 Copper wiring pattern 8 Mask pattern 9 of dry film for metal protective layer plating 9 Metal protective layer 10 Copper wiring pattern
フロントページの続き Ｆターム(参考） 4E351 AA02 AA04 BB01 BB30 BB33 BB35 BB38 CC06 DD04 DD06 DD17 DD19 DD54 GG02 5E339 AB02 BC02 BE13 CD05 CE17 GG02 5E343 AA02 AA12 AA16 AA18 BB12 BB14 BB16 BB23 BB24 BB38 BB44 BB67 BB71 DD43 DD76 GG06 GG11 Continued front page F term (reference) 4E351 AA02 AA04 BB01 BB30 BB33 BB35 BB38 CC06 DD04 DD06 DD17 DD19 DD54 GG02 5E339 AB02 BC02 BE13 CD05 CE17 GG02 5E343 AA02 AA12 AA16 AA18 BB12 BB14 BB16 BB23 BB24 BB38 BB44 BB67 BB71 DD43 DD76 GG06 GG11
Claims (9)
により銅配線パターンを形成するプリント配線板の製造
方法において、化学研磨液で絶縁基板上に形成した銅箔
を薄くし、電解めっき導通用の下地銅層を形成する工程
と、下地銅層が形成された絶縁基板上に銅配線パターン
をめっきで形成するためのマスクパターンを形成する工
程と、電解めっき法でマスクパターン以外の露出した部
分に銅めっき被膜を形成する工程と、剥離液でマスクパ
ターンを剥離する工程と、ソフトエッチングにより不要
となった下地銅層を除去し、所要の配線パターンを形成
することを特徴とするプリント配線板の製造方法。1. A method for manufacturing a printed wiring board, wherein a copper wiring pattern is formed on an insulating substrate with a copper foil by a semi-additive method, wherein the copper foil formed on the insulating substrate is thinned with a chemical polishing liquid to conduct electroplating. The step of forming the underlying copper layer, the step of forming a mask pattern for forming a copper wiring pattern by plating on the insulating substrate on which the underlying copper layer is formed, and the exposed portion other than the mask pattern by electrolytic plating A printed wiring board characterized in that a step of forming a copper plating film on the substrate, a step of peeling a mask pattern with a peeling liquid, and a step of soft etching to remove an unnecessary underlying copper layer to form a required wiring pattern. Manufacturing method.
により銅配線パターンを形成するプリント配線板の製造
方法において、化学研磨液で絶縁基板上に形成した銅箔
を薄くし、電解めっき導通用の下地銅層を形成する工程
と、下地銅層が形成された絶縁基板上に銅配線パターン
をめっきで形成するためのマスクパターンを形成する工
程と、電解めっき法でマスクパターン以外の露出した部
分に銅めっき被膜を形成する工程と、銅配線パターンを
ソフトエッチング工程から保護するために、引き続きめ
っき法で前記銅めっき被膜の表面に銅以外の金属保護層
を形成する工程と、剥離液でマスクパターンを剥離する
工程と、ソフトエッチングにより不要となった下地銅層
を除去し、所要の配線パターンを形成することを特徴と
するプリント配線板の製造方法。2. A method for manufacturing a printed wiring board in which a copper wiring pattern is formed on an insulating substrate with a copper foil by a semi-additive method, wherein the copper foil formed on the insulating substrate is thinned with a chemical polishing liquid to conduct electroplating. The step of forming the underlying copper layer, the step of forming a mask pattern for forming a copper wiring pattern by plating on the insulating substrate on which the underlying copper layer is formed, and the exposed portion other than the mask pattern by electrolytic plating A step of forming a copper plating film on the surface, a step of forming a metal protective layer other than copper on the surface of the copper plating film by a plating method in order to protect the copper wiring pattern from the soft etching step, and a mask with a stripping solution. Printed wiring characterized by forming a required wiring pattern by removing the unnecessary underlying copper layer by a process of peeling the pattern and soft etching The method of production.
により銅配線パターンを形成するプリント配線板の製造
方法において、化学研磨液で絶縁基板上に形成した銅箔
を薄くし、電解めっき導通用の下地銅層を形成する工程
と、下地銅層が形成された絶縁基板上に銅配線パターン
をめっきで形成するためのマスクパターンを形成する工
程と、電解めっき法でマスクパターン以外の露出した部
分に銅めっき被膜を形成する工程と、剥離液でマスクパ
ターンを剥離する工程と、銅配線パターンをソフトエッ
チング工程から保護するために、めっき法で前記銅配線
パターンの露出面（両側面と表面）に銅以外の金属保護
層を形成するためのマスクパターンを形成する工程と、
めっき法で前記銅めっき被膜の露出面（両側面と表面）
に銅以外の金属保護層を形成する工程と、剥離液でマス
クパターンを剥離する工程と、ソフトエッチングにより
不要となった下地銅層を除去し、所要の配線パターンを
形成することを特徴とするプリント配線板の製造方法。3. A method for manufacturing a printed wiring board in which a copper wiring pattern is formed on a copper foil-insulating substrate by a semi-additive method, wherein the copper foil formed on the insulating substrate is thinned with a chemical polishing liquid to conduct electroplating. The step of forming the underlying copper layer, the step of forming a mask pattern for forming a copper wiring pattern by plating on the insulating substrate on which the underlying copper layer is formed, and the exposed portion other than the mask pattern by electrolytic plating To form a copper plating film on the surface, a step of peeling the mask pattern with a peeling solution, and an exposed surface (both sides and surface) of the copper wiring pattern by a plating method in order to protect the copper wiring pattern from the soft etching step. A step of forming a mask pattern for forming a metal protective layer other than copper,
Exposed surface of copper plating film by plating method (both sides and surface)
A step of forming a metal protective layer other than copper, a step of removing the mask pattern with a remover, and a step of removing the unnecessary underlying copper layer by soft etching to form a required wiring pattern. Manufacturing method of printed wiring board.
どから選ばれたものであることを特徴とする請求項１〜
３の何れかに記載のプリント配線板の製造方法。4. The insulating substrate is selected from polyimide, liquid crystal polymer and the like.
4. The method for manufacturing a printed wiring board according to any one of 3 above.
選ばれたものであることを特徴とする請求項１〜４の何
れかに記載のプリント配線板の製造方法。5. The method for manufacturing a printed wiring board according to claim 1, wherein the metal other than copper is selected from Ni, Cr, and Au.
ることを特徴とする請求項１〜３の何れかに記載のプリ
ント配線板の製造方法。6. The method for manufacturing a printed wiring board according to claim 1, wherein the underlying copper layer has a thickness of 0.1 to 3 μm.
であることを特徴とする請求項１〜３の何れかに記載の
プリント配線板の製造方法。7. The thickness of the metal protective layer is 0.1 to 10 μm.
4. The method for manufacturing a printed wiring board according to claim 1, wherein
アディティブ法により銅配線パターンを形成したことを
特徴とするプリント配線板。8. A printed wiring board having a copper wiring pattern formed by a semi-additive method on a chemically polished insulating substrate with a copper foil.
を形成したことを特徴とする請求項８記載のプリント配
線板。9. The printed wiring board according to claim 8, wherein a metal protective layer other than copper is formed on the copper wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001264148A JP2003078234A (en) | 2001-08-31 | 2001-08-31 | Printed wiring board and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001264148A JP2003078234A (en) | 2001-08-31 | 2001-08-31 | Printed wiring board and method of manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003078234A true JP2003078234A (en) | 2003-03-14 |
Family
ID=19090800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001264148A Pending JP2003078234A (en) | 2001-08-31 | 2001-08-31 | Printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003078234A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120667A (en) * | 2004-10-19 | 2006-05-11 | Fujitsu Ltd | Printed circuit board manufacturing method and printed circuit board |
| JP2008263026A (en) * | 2007-04-11 | 2008-10-30 | Sumitomo Metal Mining Package Materials Co Ltd | COF wiring board and manufacturing method thereof |
| JP2013125820A (en) * | 2011-12-14 | 2013-06-24 | Chuan-Ling Hu | Method for manufacturing plastic metalization three-dimensional wiring |
| JP2015032625A (en) * | 2013-07-31 | 2015-02-16 | 新光電気工業株式会社 | Coil substrate, manufacturing method thereof, and inductor |
| JP2017005052A (en) * | 2015-06-08 | 2017-01-05 | 株式会社日立パワーソリューションズ | Substrate and method of manufacturing circuit board |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| WO2020110552A1 (en) * | 2018-11-27 | 2020-06-04 | 日東電工株式会社 | Wiring circuit board and method for manufacturing same |
| JP2020202343A (en) * | 2019-06-13 | 2020-12-17 | 凸版印刷株式会社 | Wiring board and method for manufacturing the same |
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| JP2006120667A (en) * | 2004-10-19 | 2006-05-11 | Fujitsu Ltd | Printed circuit board manufacturing method and printed circuit board |
| JP2008263026A (en) * | 2007-04-11 | 2008-10-30 | Sumitomo Metal Mining Package Materials Co Ltd | COF wiring board and manufacturing method thereof |
| JP2013125820A (en) * | 2011-12-14 | 2013-06-24 | Chuan-Ling Hu | Method for manufacturing plastic metalization three-dimensional wiring |
| JP2015032625A (en) * | 2013-07-31 | 2015-02-16 | 新光電気工業株式会社 | Coil substrate, manufacturing method thereof, and inductor |
| JP2017005052A (en) * | 2015-06-08 | 2017-01-05 | 株式会社日立パワーソリューションズ | Substrate and method of manufacturing circuit board |
| CN108419376A (en) * | 2018-05-14 | 2018-08-17 | 星河电路（福建）有限公司 | A kind of production method of the high thick copper pcb board of selective local plating |
| WO2020110552A1 (en) * | 2018-11-27 | 2020-06-04 | 日東電工株式会社 | Wiring circuit board and method for manufacturing same |
| JP2020088188A (en) * | 2018-11-27 | 2020-06-04 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
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| CN113170578A (en) * | 2018-11-27 | 2021-07-23 | 日东电工株式会社 | Wired circuit board and method for manufacturing same |
| KR20210095144A (en) * | 2018-11-27 | 2021-07-30 | 닛토덴코 가부시키가이샤 | Wiring circuit board and manufacturing method thereof |
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| JP2020202343A (en) * | 2019-06-13 | 2020-12-17 | 凸版印刷株式会社 | Wiring board and method for manufacturing the same |
| JP7456097B2 (en) | 2019-06-13 | 2024-03-27 | Ｔｏｐｐａｎホールディングス株式会社 | Wiring board and wiring board manufacturing method |
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