JP2002361478A - Ag brazing material for joining and brazing method using the same - Google Patents
Ag brazing material for joining and brazing method using the sameInfo
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Abstract
(57)【要約】
【課題】 固相線温度および液相線温度が、800℃〜
900℃の範囲にあるAgろう材を提供する。
【解決手段】 接合用Agろう材は、1.0重量%〜1
0.0重量%のスズ(Sn)と、2.5重量%〜10重
量%の銅(Cu)と、残部がAgとから成る。このAg
ろう材の固相線温度は800℃以上であり、液相線温度
は、900℃以下である。必要に応じて、6.0重量%
以下のマンガン(Mn)、0.1〜2.5%のニッケル
(Ni)、あるいはこれら双方を含んでもよい。(57) [Summary] [Problem] A solidus temperature and a liquidus temperature are 800 ° C or more.
An Ag brazing material in the range of 900 ° C. is provided. SOLUTION: The Ag brazing material for joining is 1.0% by weight to 1% by weight.
It consists of 0.0% by weight of tin (Sn), 2.5% by weight to 10% by weight of copper (Cu), and the balance being Ag. This Ag
The solidus temperature of the brazing material is 800 ° C. or higher, and the liquidus temperature is 900 ° C. or lower. 6.0% by weight as required
The following manganese (Mn), 0.1 to 2.5% nickel (Ni), or both may be included.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、接合用Agろう材
およびこれを用いたろう付け方法に関し、特に、その固
相線温度が800℃以上、液相線温度が900℃以下で
あり、低コスト、かつ適用範囲の広い、接合性にすぐれ
たAgろう材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an Ag brazing material for joining and a brazing method using the same, and more particularly, it has a solidus temperature of 800.degree. C. or more and a liquidus temperature of 900.degree. The present invention relates to an Ag brazing material which is excellent in bonding properties and has a wide range of application.
【0002】[0002]
【従来の技術】Ag−Cu合金を主成分とする既存のA
gろう材(JIS、Z3261)は、そのろう付け温度
範囲が620℃〜900℃であり、固相線温度が605
℃〜780℃の範囲にある。このようなAg−Cuろう
材は、たとえば、セラミックベースへの金属の接合、ス
テンレス同士の接合、ステンレスに銅(Cu)製部品の
接合、あるいは銅部材同士の接合など、広く金属の接合
に用いられている。2. Description of the Related Art Existing A based on Ag-Cu alloy
g brazing material (JIS, Z3261) has a brazing temperature range of 620 ° C to 900 ° C and a solidus temperature of 605 ° C.
C. to 780.degree. Such an Ag-Cu brazing material is widely used for joining metals, for example, joining metals to a ceramic base, joining stainless steel, joining copper (Cu) parts to stainless steel, or joining copper members. Have been.
【0003】これらの既存のAg−Cuろう材は、その
種類によって、低いものでは605℃程度で溶融が開始
し、高いものでも、780℃で溶融が開始する。[0003] Depending on the type of these existing Ag-Cu brazing materials, melting starts at about 605 ° C at low temperatures and starts at 780 ° C at high temperatures.
【0004】接合箇所が1ヶ所のみの場合は、このよう
な既存のAgろう材で十分であるが、組み立て工程に応
じて、複数箇所を経時的に接合していく場合は、それぞ
れ融点の異なる複数種類のろう材を用いて、順次接合作
業を行なう。このようなろう付けをステップろう付け、
あるいは多段ステップろう付けという。通常は、先に融
点の高いろう材を用いて、ある箇所を接合し、その後、
より融点の低いろう材を用いて別の箇所を接合する。た
とえば、まず、融点が1000℃程度のNi系ろう材と
を用いて接合処理を行なったあと、別の箇所を上述した
Ag−Cu系のろう材で接合する。[0004] In the case where only one joining portion is used, such an existing Ag brazing material is sufficient, but in the case where a plurality of portions are to be joined with time according to the assembling process, the melting points are different. A joining operation is sequentially performed using a plurality of types of brazing materials. Step brazing such brazing,
Or multi-step brazing. Usually, first, using a brazing material with a high melting point, a certain point is joined, and then
Another part is joined using a brazing material having a lower melting point. For example, first, after performing a joining process using a Ni-based brazing material having a melting point of about 1000 ° C., another portion is joined with the above-described Ag-Cu-based brazing material.
【0005】しかし、Ni系の高融点ろう材を用いたス
テップ接合は、接合対象である部材が耐熱性の高い部材
である場合には問題はないが、ろう付け温度で軟化しや
すい部品、たとえば銅(Cu)製部品を基板上に接合搭
載する場合に、ろう付け作業中にCu製部品の母材軟化
が起こる。このような結晶軟化は、デバイス特性に影響
する。[0005] However, step joining using a Ni-based high melting point brazing material is not a problem when the member to be joined is a member having high heat resistance, but a component which is easily softened at the brazing temperature, for example, When a copper (Cu) component is bonded and mounted on a substrate, the base material of the Cu component softens during the brazing operation. Such crystal softening affects device characteristics.
【0006】そこで、BAg−8に代表される既存のA
gろう材の溶融温度よりは高く、かつ被接合部材の母材
軟化に影響しない程度の溶融温度を有するろう材、換言
すれば、その固相線温度が800℃以上、液相線温度が
900℃以下のAgろう材が望まれることになるが、現
状では、このような温度範囲のAg−Cuろう材は存在
しない。[0006] Therefore, existing A represented by BAg-8
g The brazing material having a melting temperature higher than the melting temperature of the brazing material and having a melting temperature that does not affect the softening of the base material of the member to be joined, in other words, its solidus temperature is 800 ° C. or more and its liquidus temperature is 900 ° C. Although an Ag brazing material having a temperature of not more than C is desired, there is no Ag-Cu brazing material in such a temperature range at present.
【0007】Ag−Cu系以外のろう材で800℃〜9
00℃の溶融温度範囲にあるろう材としては、パラジウ
ム(Pd)を用いたPd系ろう材(JIS,Z326
7)、金(Au)を用いたAu系ろう材(JIS,Z3
266)がある。しかし、Pd系ろう材やAu系ろう材
は、Agろう材と比較して素材的にきわめて高価格であ
り、製造コストが増大するという問題がある。[0007] 800 ° C. to 9 ° C.
As a brazing material having a melting temperature range of 00 ° C., a Pd-based brazing material using palladium (Pd) (JIS, Z326)
7) Au-based brazing material using gold (Au) (JIS, Z3
266). However, Pd-based brazing filler metal and Au-based brazing filler metal are extremely expensive in terms of material as compared with Ag brazing filler metal, and there is a problem that the manufacturing cost increases.
【0008】さらに別の問題点として、既存のAgろう
材は、ステンレス部材など表面に不動態被膜を持つ部材
を接合する場合には、前処理として被接合部材にニッケ
ル(Ni)メッキを施す必要がある。不動態膜のせいで
表面拡がり性、あるいはろう材の拡がり性が確保できな
いためである。すなわち、既存のろう材を用いると、N
iメッキを行なう分、余分に工程が必要となり、製造コ
ストも高くなる。Niメッキのかわりに、Niがあらか
じめ混合された既存のAgろう材(JIS)を用いるこ
とも考えられるが、BAg−13aやBAg−21は固
相線温度が800℃以下であり、低温側ろう付け時に再
溶融の不安がある。また、BAg−23はその固相線温
度が900℃をはるかに上回り、ろう付け温度が高くな
りすぎて好ましくない。Another problem is that the existing Ag brazing material needs to be plated with nickel (Ni) as a pre-treatment when joining a member having a passivation film on its surface such as a stainless member. There is. This is because the surface spreadability or the spreadability of the brazing material cannot be ensured due to the passivation film. That is, if the existing brazing material is used, N
An extra step is required for the i-plating, and the manufacturing cost is increased. Instead of Ni plating, it is conceivable to use an existing Ag brazing material (JIS) premixed with Ni. However, BAg-13a and BAg-21 have a solidus temperature of 800 ° C. or less and a low-temperature brazing material. There is a fear of re-melting when attaching. In addition, BAg-23 has an undesirably high solidus temperature much higher than 900 ° C. and an excessively high brazing temperature.
【0009】さらにまた別の問題点として、既存のAg
−Cuろう材のうち、ろう付け温度範囲が重複しない2
種類のAgろう材、たとえば、固相線温度が780℃の
ものと、液相線温度が780℃より低いもの(たとえば
BAg−3)とを組み合わせてステップろう付けを行な
う場合に、真空処理を行なうことができないという問題
がある。低融点のAg−Cu系ろう材は、亜鉛(Zn)
やカドミウム(Cd)を組成に含み、このようなろう材
を真空チャンバ内での接合処理に用いると、チャンバ内
を汚染するので、大気中での接合処理にせざるを得ない
のである。Still another problem is that the existing Ag
-Among brazing filler metals, brazing temperature ranges do not overlap 2
When step brazing is performed using a combination of Ag brazing materials, for example, those having a solidus temperature of 780 ° C. and those having a liquidus temperature of less than 780 ° C. (eg, BAg-3), a vacuum treatment is performed. There is a problem that can not be done. The low melting point Ag-Cu brazing material is zinc (Zn).
If such a brazing material is used in the bonding process in a vacuum chamber, the inside of the chamber will be contaminated, and the bonding process in the air must be performed in the atmosphere.
【0010】大気処理する場合は、被接合部材の表面が
酸化されるので、表面の酸化物をフラックス(融剤)で
除去しながら接合を行なうことになる。フラックスは接
合後に除去する必要があり、また、被接合物全体を洗浄
しなければならない。これでは、接合工程が増えるとと
もに、環境問題にも影響する。In the case of air treatment, the surface of the member to be joined is oxidized, so that the joining is performed while removing the oxide on the surface with a flux. The flux needs to be removed after joining, and the whole article must be cleaned. In this case, the number of joining steps increases, and this also affects environmental issues.
【0011】さらに、電子部品など、接合対象物の微細
化が進む中で、細部の接合が必要とされる場合や、真空
管、真空バルブなど気密封止を要する部材も多い。この
ような気密ろう付けや微細ろう付けでは、細かい隙間に
十分に入り込める浸透性が必要とされる。Further, as the objects to be joined are miniaturized, such as electronic parts, there are many cases in which detailed joining is required, and many members requiring hermetic sealing, such as vacuum tubes and vacuum valves. In such airtight brazing or fine brazing, it is necessary to have permeability that can sufficiently enter small gaps.
【0012】[0012]
【発明が解決しようとする課題】そこで、本発明の第1
の目的は、固相線温度が800℃以上、液相線温度が9
00℃以下である新規のAgろう材を提供することを目
的とする。Therefore, the first aspect of the present invention
The purpose of this is that the solidus temperature is 800 ° C or higher and the liquidus temperature is 9
An object of the present invention is to provide a new Ag brazing material having a temperature of 00 ° C. or lower.
【0013】本発明の第2の目的は、接合に先立ち、被
接合物(ステンレス鋼、セラミックスなど)にNiメッ
キを必要としない十分な拡がり性と浸透性を有するAg
ろう材を提供することにある。A second object of the present invention is to provide an Ag material having sufficient spreadability and permeability that does not require Ni plating on an object to be joined (stainless steel, ceramics, etc.) prior to joining.
To provide brazing filler metal.
【0014】本発明の第3の目的は、大気処理のみなら
ず、真空チャンバ内での接合処理にも適したAgろう材
を提供することにある。A third object of the present invention is to provide an Ag brazing material suitable not only for atmospheric treatment but also for joining treatment in a vacuum chamber.
【0015】本発明の第4の目的は、気密性の高い部材
や微細な電子部品の接合にも適する浸透性を備えたAg
ろう材を提供することにある。A fourth object of the present invention is to provide an Ag having a permeability suitable for bonding highly airtight members and fine electronic parts.
To provide brazing filler metal.
【0016】このようなAgろう材は、約800℃で溶
融が開始し、約900℃で溶融が完了する。したがっ
て、ろう材付け温度が620℃〜800℃程度の既存の
Agろう材や、ろう材付け温度が1000℃以上である
既存のNiろう材と組み合わせることによって、複数回
にわたる多段ステップろう付けが実現できる。Such an Ag brazing material starts melting at about 800 ° C. and completes melting at about 900 ° C. Therefore, by combining with an existing Ag brazing material having a brazing temperature of about 620 ° C. to 800 ° C. or an existing Ni brazing material having a brazing temperature of 1000 ° C. or more, multi-step brazing can be performed a plurality of times. it can.
【0017】本発明の新規のAgろう材は、接合対象物
の材質に関係なく、幅広い範囲の汎用接合ろう材として
用いられることを意図する。The novel Ag brazing material of the present invention is intended to be used as a wide range of general-purpose brazing material regardless of the material of the object to be joined.
【0018】[0018]
【課題を解決するための手段】上記目的を達成するため
に、第1の側面として、接合用Agろう材は、スズ(S
n)が1.0〜10.0重量%、銅(Cu)が2.5〜
10重量%を含み、残部が銀(Ag)から成る。In order to achieve the above object, as a first aspect, a joining Ag brazing material is made of tin (S
n) is 1.0 to 10.0% by weight, and copper (Cu) is 2.5 to
10% by weight, with the balance being silver (Ag).
【0019】このAgろう材の固相線温度は800℃以
上、液相線温度は900℃以下である。基本的に、Ag
とCuとの共晶を利用しており、Cuの組成を2.5重
量%〜10重量%(以下、場合に応じて単に「%」とす
る)の範囲にすることにより、Agろう材の溶融温度範
囲をおおまかに、800℃〜900℃に近い範囲に設定
することができる。これに、Snを添加することによ
り、液相線温度を低くすることができ、Agろう材の溶
融温度をターゲットである800℃〜900℃の範囲内
に制御することが可能になる。Snはまた、拡がり性を
改善する効果も有し、接合対象物が表面に不動態被膜を
有する場合でも、前処理としてNiメッキをほどこす必
要がなくなる。The solidus temperature of the Ag brazing material is 800 ° C. or more, and the liquidus temperature is 900 ° C. or less. Basically, Ag
The eutectic of Cu and Cu is used, and by setting the composition of Cu in the range of 2.5% by weight to 10% by weight (hereinafter, simply referred to as “%” depending on the case), the Ag brazing material The melting temperature range can be set roughly to a range close to 800 ° C to 900 ° C. By adding Sn to this, the liquidus temperature can be lowered, and the melting temperature of the Ag brazing material can be controlled within the target range of 800 ° C. to 900 ° C. Sn also has the effect of improving the spreadability, and eliminates the need to apply Ni plating as a pretreatment even when the object to be joined has a passivation film on the surface.
【0020】Cu量が2.5%以下では、Agろう材の
液相線温度を900℃以下に制御することが困難にな
り、10%以上では、固相線温度を800℃以上に制御
することが困難になる。If the Cu content is 2.5% or less, it is difficult to control the liquidus temperature of the Ag brazing material to 900 ° C. or less. If the Cu content is 10% or more, the solidus temperature is controlled to 800 ° C. or more. It becomes difficult.
【0021】Sn量が1.0%以下では、Agろう材の
液相線温度を900℃以下に制御する効果が低減され
る。Sn量が10.0%以上では、脆弱性が増し、Ag
とCuを主成分とするマトリックスの展延性を損なうこ
とになる。When the amount of Sn is 1.0% or less, the effect of controlling the liquidus temperature of the Ag brazing material to 900 ° C. or less is reduced. If the amount of Sn is 10.0% or more, the fragility increases, and Ag increases.
In this case, the extensibility of the matrix containing Cu and Cu as a main component is impaired.
【0022】このようなAgろう材は、低コストである
うえに浸透性に非常にすぐれ、良好な接合力を発揮す
る。Such an Ag brazing material is inexpensive, has excellent permeability, and exhibits good bonding strength.
【0023】本発明の第2の側面として、接合用Agろ
う材は、1.0重量%〜10.0重量%のスズ(Sn)
と、2.5重量%〜10重量%の銅(Cu)と、6.0
重量%以下のマンガン(Mn)と、残部が銀(Ag)と
から成る。6.0%以下のMnを添加することによっ
て、Agろう材の強度を向上するとともに、ステンレス
鋼やセラミックスに対する濡れ性あるいは拡がり性を向
上させる。Mn含有量が0.3%〜6.0%の場合に、
特に拡がり性にすぐれる。もっとも、上述したAgろう
材の浸透性自体は、Mnの含有量に関係なく非常に良好
であるため、Mn含有量が0.3%未満であっても、A
gろう材全体として適切な強度と良好な接合性を発揮す
る。Mn量が7.5%以上になると、ろう材が拡がりす
ぎて接合部分が不安定になり好ましくない。According to a second aspect of the present invention, the Ag brazing material for joining contains 1.0% to 10.0% by weight of tin (Sn).
2.5% to 10% by weight of copper (Cu), and 6.0% by weight.
It is composed of manganese (Mn) of not more than% by weight and the balance being silver (Ag). By adding 6.0% or less of Mn, the strength of the Ag brazing material is improved, and at the same time, the wettability or spreadability with respect to stainless steel and ceramics is improved. When the Mn content is 0.3% to 6.0%,
In particular, it has excellent spreadability. However, since the permeability of the Ag brazing material described above is very good regardless of the Mn content, even if the Mn content is less than 0.3%, A
gExhibits appropriate strength and good bonding properties as a whole brazing material. If the Mn content is 7.5% or more, the brazing filler metal spreads excessively, and the joining portion becomes unstable, which is not preferable.
【0024】接合する対象物によっては、Agろう材の
拡がり性よりも、浸透性のほうがむしろ重要視される場
合がある。たとえば真空気密を要する真空管や真空バル
ブ、微細部品を接合する場合である。浸透性が高いと、
ろう材が微細な間隙へも侵入することができ、接合の信
頼性を向上できる。特に、真空菅や微細部品の接合で
は、Mnを添加することによって得られる強度をそれほ
ど必要としないので、低MnあるいはMnフリーのAg
ろう材は、気密部材や微細部品を接合する用途に特に適
する。Depending on the object to be joined, the permeability may be more important than the spreadability of the Ag brazing material. For example, this is a case where a vacuum tube, a vacuum valve, or a fine component that requires vacuum sealing is joined. If the permeability is high,
The brazing material can also penetrate into the fine gaps, and the joining reliability can be improved. In particular, in joining vacuum tubes and fine parts, the strength obtained by adding Mn is not so required, so that low Mn or Mn-free Ag is used.
The brazing material is particularly suitable for use in joining airtight members and fine parts.
【0025】本発明の第3の側面では、接合用Agろう
材は、1.0重量%〜10.0重量%のスズ(Sn)
と、2.5重量%〜10重量%の銅(Cu)と、2.5
重量%以下のニッケル(Ni)と、残部が銀(Ag)と
から成る。2.5重量%以下のニッケル(Ni)を添加
することによって、ろう付け部分の濡れ性あるいは拡が
り性と、接合強度とを向上することができる。Ni含有
量が2.5%を超えると、液相線温度の高温化を招き、
Agろう材の液相線温度をターゲットである900℃以
下に制御することが困難になる。In a third aspect of the present invention, the Ag brazing material for joining contains 1.0% to 10.0% by weight of tin (Sn).
2.5% by weight to 10% by weight of copper (Cu);
It consists of nickel (Ni) of not more than% by weight and the balance of silver (Ag). By adding 2.5% by weight or less of nickel (Ni), the wettability or spreadability of the brazed portion and the joining strength can be improved. If the Ni content exceeds 2.5%, the liquidus temperature will increase,
It becomes difficult to control the liquidus temperature of the Ag brazing material to a target of 900 ° C. or lower.
【0026】これらのAgろう材において、Snの一部
またはすべてをインジウム(In)で置換してもよい。
Snの一部またはすべてをInで置換した場合にも、A
gろう材の固相線温度を800℃以上、液相線温度を9
00℃以下の範囲に制御することができる。同時に、A
gろう材の拡がり性あるいはろう付け部分の拡がり性を
向上させ、接合性の向上に寄与する。In these Ag brazing materials, part or all of Sn may be replaced with indium (In).
When part or all of Sn is replaced with In, A
g The solidus temperature of the brazing material is 800 ° C or more, and the liquidus temperature is 9
It can be controlled within the range of 00 ° C. or less. At the same time, A
(g) It improves the spreadability of the brazing material or the spreadability of the brazed portion, and contributes to the improvement of the joining property.
【0027】Agろう材がマンガン(Mn)を含む場合
は、Mnの一部またはすべてをチタン(Ti)で置換し
てもよい。Mnの一部またはすべてをTiで置換した場
合にも、同様の効果、すなわち、拡がり性の確保と接合
強さの向上を達成できる。被接合部分が不動態膜で覆わ
れている場合にも、ニッケルメッキを必要とせずにろう
付けすることができる。When the Ag brazing material contains manganese (Mn), part or all of Mn may be replaced with titanium (Ti). The same effect can be achieved even when part or all of Mn is replaced with Ti, that is, the spreadability is secured and the bonding strength is improved. Even when the portion to be joined is covered with a passivation film, brazing can be performed without the need for nickel plating.
【0028】上述したいずれのAgろう材も、固体状態
において、展延性を有するAgとCuを主成分とするマ
トリックスが、Snを含有する微細な析出化合物を取り
囲むように存在する。これにより、脆弱性を有するSn
含有化合物による亀裂の発生とその伝達を阻止し、Ag
ろう材製造時の加工性(すなわち鍛造、圧延、線引き)
を改善する。同時に、ろう付け後の接合層の脆弱化を保
護する。In any of the above-mentioned Ag brazing materials, in the solid state, a matrix containing Ag and Cu as main components having extensibility exists so as to surround a fine precipitation compound containing Sn. Thereby, the vulnerable Sn
Inhibits the generation and propagation of cracks by the compound containing
Workability during brazing material production (ie forging, rolling, drawing)
To improve. At the same time, it protects the bonding layer from weakening after brazing.
【0029】上述したSnの組成が10%を超える場合
に、Ag−Cuマトリックス中に析出するSn含有化合
物が巨大化し、ろう材自体が脆弱化することになる。ま
た、固相線温度が過度に低下するので、固体状態で析出
するSn化合物中のSn量は、5%〜60%(重量比)
が目安である。When the above-mentioned Sn composition exceeds 10%, the Sn-containing compound precipitated in the Ag-Cu matrix becomes large, and the brazing material itself becomes brittle. Further, since the solidus temperature is excessively lowered, the amount of Sn in the Sn compound precipitated in a solid state is 5% to 60% (weight ratio).
Is a guide.
【0030】このように、AgとCuは、ろう材全体の
材料物性に対して共働して作用し、特に固相線温度およ
び液相線温度、機械的強度を左右する。これとともに、
接合後の接合部に伝達される機械的衝撃を吸収し、亀裂
の発生と伝播を抑止する。また、Ag−Cuマトリック
スが析出するSn含有化合物を取り囲むので、Sn含有
化合物を起点とする亀裂の進展を阻止する効果も併せ持
つ。As described above, Ag and Cu act synergistically on the material properties of the entire brazing filler metal, and particularly affect the solidus temperature, liquidus temperature, and mechanical strength. With this,
Absorbs mechanical shock transmitted to the joint after joining, and suppresses crack generation and propagation. Further, since the Ag-Cu matrix surrounds the precipitated Sn-containing compound, the Ag-Cu matrix also has an effect of preventing the growth of a crack originating from the Sn-containing compound.
【0031】固相線温度、液相線温度の調整のために
は、Ag/(Ag+Cu)比率を、89.4%〜97.
5%にするのが好ましい。In order to adjust the solidus temperature and liquidus temperature, the ratio of Ag / (Ag + Cu) is set to 89.4% to 97.9%.
Preferably it is 5%.
【0032】上述したいずれのAgろう材においても、
その製造コストは従来のAgろう材と同程度であり、高
価なPd系ろう材(JIS,Z3267)やAu系ろう
材(JIS,Z3226)を使用しなくとも、既存のA
gろう材と組み合わせることによって、多段ステップろ
う付けが可能になる。結果として、最終製品の製造コス
トをも低減することができる。In any of the Ag brazing materials described above,
The production cost is almost the same as that of the conventional Ag brazing material, and the existing A brazing material can be used without using expensive Pd-based brazing material (JIS, Z3267) or Au-based brazing material (JIS, Z3226).
Combination with g brazing material enables multi-step brazing. As a result, the manufacturing cost of the final product can be reduced.
【0033】ろう付け作業温度での被接合部材の母材軟
化を抑制できるので、最終製品の動作特性の信頼性を維
持することができる。本発明のAgろう材の溶融温度範
囲が800℃〜900℃であることから、他方のろう材
の選択の幅が各段に広がる。なお、実際のろう付け接合
作業温度は、固相線温度と同等またはそれ以上の温度、
好ましくは、液相線温度よりも数十度高い温度で行な
う。Since the softening of the base material of the members to be joined at the brazing operation temperature can be suppressed, the reliability of the operating characteristics of the final product can be maintained. Since the melting temperature range of the Ag brazing material of the present invention is 800 ° C. to 900 ° C., the range of choice of the other brazing material is widened in each step. In addition, the actual brazing temperature is equal to or higher than the solidus temperature,
Preferably, it is performed at a temperature several tens degrees higher than the liquidus temperature.
【0034】また、Pb、Zn、Cdなどを組成に含ま
ないので、真空チャンバ内での接合処理に適しており、
大気処理で必要とされるフラックス(融剤)の使用およ
びその洗浄工程が不要になる。さらに、十分な拡がり性
と浸透性を持つことから、表面に不動態皮膜を有するス
テンレスなどを接合する場合にも、前処理としてのNi
メッキの必要がない。浸透性にすぐれ、気密性を要する
部材や微細な電子部品の接合に適している。Further, since Pb, Zn, Cd and the like are not contained in the composition, the composition is suitable for a bonding process in a vacuum chamber.
The use of the flux (flux) required for the air treatment and the cleaning step are not required. Furthermore, since it has sufficient spreading properties and permeability, even when joining stainless steel or the like having a passivation film on the surface, Ni as a pretreatment is used.
There is no need for plating. It has excellent permeability and is suitable for joining members requiring airtightness and fine electronic components.
【0035】本発明のその他の特徴、効果は、具体的な
実施例および比較例に基づく以下の詳細な説明により、
いっそう明確になるものである。The other features and effects of the present invention will be described in the following detailed description based on specific examples and comparative examples.
It will be even clearer.
【0036】[0036]
【発明の実施の形態】(試験用Agろう材の作製)直径
50mm、長さ400mmの各組成のインゴットを、真
空中約1050℃で真空溶解して得た後、350〜75
0℃の温度を選択した焼鈍と、3〜30%の加工率を選
択した圧延とを、必要な回数繰り返して、厚さを0.3
mmとした後、最終仕上げとしてスリッターにより所定
の幅(例えば30mm)の板状ろう材を得た。これを、
表1および2に示す試験用ろう材とした。BEST MODE FOR CARRYING OUT THE INVENTION (Preparation of Ag brazing material for test) An ingot of each composition having a diameter of 50 mm and a length of 400 mm is melted in a vacuum at about 1050 ° C., and then 350 to 75
Annealing at a temperature of 0 ° C. and rolling at a processing rate of 3 to 30% are repeated as many times as necessary to reduce the thickness to 0.3%.
mm, a plate-shaped brazing material having a predetermined width (for example, 30 mm) was obtained as a final finish by a slitter. this,
Test brazing materials shown in Tables 1 and 2 were used.
【0037】なお、線材を必要とする場合には、前記イ
ンゴットを押出機によって直径10mmに押出し、これ
を焼鈍(350〜750℃)と引抜き(加工率3〜30
%)とを必要回数繰り返して、直径0.1mmの線材を
得ることができる。When a wire is required, the ingot is extruded to a diameter of 10 mm by an extruder, which is annealed (350 to 750 ° C.) and drawn (working rate: 3 to 30).
%) Can be repeated the required number of times to obtain a wire having a diameter of 0.1 mm.
【0038】[0038]
【表1】 [Table 1]
【表2】 (評価方法、評価条件)図1に示すように、幅24mm
×長さ125mm×厚さ3mmのメッキなしのステンレ
ス板1を2枚用意し、その両端部の一部を図1の様に2
〜4mmほど重ね合わせ、重ね合わせた部分に、表1に
示した組成の試験用板状ろう材2を挟み込んだ。使用す
るろう材の液相線温度に応じて接合温度を選択し(たと
えば875℃〜925℃)、ろう付けを行った後、JI
S−Z−3192(ろう付け継手のせん断試験方法)に
よるろう付け性を評価した。なお、あらかじめNiメッ
キを施したステンレス板についても同様にろう付け接合
し、参考とした。[Table 2] (Evaluation method and evaluation conditions) As shown in FIG.
1. Prepare two unplated stainless steel plates 1 having a length of 125 mm and a thickness of 3 mm, and a part of both ends thereof as shown in FIG.
The test plate brazing material 2 having the composition shown in Table 1 was sandwiched between the overlapped portions by about 4 mm. The joining temperature is selected according to the liquidus temperature of the brazing material to be used (for example, 875 ° C. to 925 ° C.), and after brazing, the JI
The brazing property by S-Z-3192 (brazing joint shear test method) was evaluated. It should be noted that a stainless steel plate previously plated with Ni was similarly brazed and joined for reference.
【0039】各組成の試験用ろう材について、せん断
強さ(N/mm2)、拡がり性、浸透性をそれぞれ
測定、観察し、観察結果に基づいて総合評価を行なっ
た。その結果を表3および4に示す。なお、せん断強さ
の評価は、以下の基準で行なった。With respect to the test brazing material of each composition, the shear strength (N / mm 2 ), spreadability, and permeability were measured and observed, respectively, and comprehensive evaluation was performed based on the observation results. The results are shown in Tables 3 and 4. The evaluation of the shear strength was performed according to the following criteria.
【0040】 ・350N/mm2以上の場合:評価A(優良) ・150〜350N/mm2 :評価B(良好) ・150N/mm2未満の場合:評価C(不良) 拡がり性の評価は、直径15mmに打ち抜いた各組成の
試験用ろう材板を、メッキなしのSUS板上に搭載して
875〜925℃に加熱した時の、SUS板表面でのろ
う材の流れ(拡がり)状況を観察し、以下の基準で評価
した。[0040] · 350 N / mm 2 or more when: Evaluation A (excellent) · 150~350N / mm 2: Evaluation B (good) · 150 N / mm 2 less than in the case: the evaluation of the evaluation C (bad) spread properties, Observe the flow (spread) of the brazing material on the surface of the SUS plate when the test brazing plate of each composition punched to a diameter of 15 mm is mounted on an unplated SUS plate and heated to 875-925 ° C. And evaluated according to the following criteria.
【0041】 ・ 加熱時のろう材面積が直径30mm以上:評価A
(優良) ・ 加熱時のろう材面積が直径15〜30mm:評価
B(良好) ・ 拡がりなし(あるいは直径15mm未満):評価
C(不良) 浸透性の評価は、図1(b)に示すように、2枚に重ね
合わせた接合対象物1の約0.05mmの隙間のA地点
に、φ1.0のろう材をセットして溶融させ、溶融金属
の毛細管現象を利用して、反対側のB地点への到達度を
観察することにより、以下の基準で評価した。The brazing material area upon heating is 30 mm or more in diameter: Evaluation A
(Excellent)-Brazing material area during heating is 15 to 30 mm in diameter: Evaluation B (Good)-No spreading (or less than 15 mm in diameter): Evaluation C (Poor) The evaluation of permeability is shown in Fig. 1 (b). Then, at a point A of a gap of about 0.05 mm of the joining object 1 superposed on the two pieces, a brazing material of φ1.0 is set and melted, and the capillary on the opposite side is used by utilizing the capillary phenomenon of the molten metal. By observing the degree of arrival at the point B, the evaluation was made according to the following criteria.
【0042】 ・ 完全にB地点へ到達:評価A(優良) ・ ほぼB地点まで到達:評価B(良好) ・ B地点まで到達せず:評価C(不良) なお、せん断強さ、拡がり性、浸透性のすべてを満たす
ものであっても、本発明のろう材がターゲットとする温
度範囲、すなわち固相線温度が800℃以上、液相線温
度900以下という前提条件を満たさないものや、真空
チャンバの汚染を引き起こすものは、不適格とした。Completely arrived at point B: evaluation A (excellent). Reached almost point B: evaluated B (good). Not arrived at point B: evaluated C (poor). Even if it satisfies all of the permeability, it does not satisfy the prerequisite that the brazing material of the present invention has a target temperature range, that is, a solidus temperature of 800 ° C. or more and a liquidus temperature of 900 or less, or a vacuum. Anything that caused contamination of the chamber was disqualified.
【0043】[0043]
【表3】 [Table 3]
【表4】 [Table 4]
【0044】[0044]
【実施例および比較例】以下、表1および2に示す組成
のAgろう材の実施例および比較例を具体的に説明す
る。Examples and Comparative Examples Examples and comparative examples of Ag brazing materials having the compositions shown in Tables 1 and 2 will be specifically described below.
【0045】(実施例1〜4)Sn量を4.0%に設定
し、Mn量を0.1%、0.3%、2.5%、6.0%
と変化させたもので、ろう付け処理を行った後、せん断
強さを測定した。[Ag−Cu−Mn−Sn]合金中の
Mn量が0.1%、0.3%、2.5%、5.0%のい
ずれの場合も、せん断強さは150〜350N/mm2
の範囲にあり、評価Bと良好な強度を発揮した。(Examples 1 to 4) The amount of Sn was set to 4.0%, and the amount of Mn was set to 0.1%, 0.3%, 2.5%, and 6.0%.
After performing a brazing treatment, the shear strength was measured. When the amount of Mn in the [Ag-Cu-Mn-Sn] alloy is 0.1%, 0.3%, 2.5%, or 5.0%, the shear strength is 150 to 350 N / mm 2.
And exhibited good strength with evaluation B.
【0046】また、直径15mmに打ち抜いた各ろう材
をNiメッキなしSUS板上に載せて、ろう付け処理を
行った際の拡がり性の実験によれば、Mn含有量が0.
3%、2.5%、5.0%の場合(実施例2〜4)は、
15mm〜30mm程度の拡がりを示し、評価Bと良好
な拡がり性を発揮した。一方、Mn含有量が0.1%の
場合(実施例1)は、拡がり面積が15mm未満とな
り、評価Cであった。Further, according to an experiment on the spreadability when each brazing material punched to a diameter of 15 mm was placed on a SUS plate without Ni plating and brazing was performed, the Mn content was 0.1%.
In the case of 3%, 2.5%, and 5.0% (Examples 2 to 4),
It showed a spread of about 15 mm to 30 mm, and exhibited good spreadability as evaluated B. On the other hand, when the Mn content was 0.1% (Example 1), the spread area was less than 15 mm, and the evaluation was C.
【0047】浸透性の試験では、Mn含有量が、0.1
%、0.3%、2.5%、5.0%のいずれにおいて
も、ろう材は重ね合わせた2枚のステンレス板の微細な
隙間を浸透して、完全に反対側へ到達し、評価Aと良好
な接合具合を示した。In the permeability test, the Mn content was 0.1%.
%, 0.3%, 2.5%, and 5.0%, the brazing material penetrates the fine gap between the two stainless steel sheets that overlap each other, reaches the completely opposite side, and is evaluated. A and good joining condition were shown.
【0048】Mn含有量が0.1%の場合は、拡がり性
にやや欠けるものの、十分な浸透性を有するため、実際
の使用において、ろう材としての接合性は良好である。
特に、真空管の密封や微細な電子部品を接合する場合
は、ろう材の浸透性がより重要な要素となり、実施例1
のろう材は微細ろう付けや真空気密を要する用途に特に
適する。In the case where the Mn content is 0.1%, although the spreadability is slightly lacking, since it has a sufficient permeability, the bondability as a brazing material is good in actual use.
In particular, in the case of sealing a vacuum tube or joining fine electronic components, the permeability of the brazing material becomes a more important factor.
The brazing material is particularly suitable for applications requiring fine brazing or vacuum sealing.
【0049】なお、実施例1〜4のいずのろう材も、固
相線(溶融開始)温度が800℃以上、液相線温度が9
00度以下であり、ターゲットとする温度範囲を満たし
ている。The brazing materials of Examples 1 to 4 also have a solidus temperature (start of melting) of 800 ° C. or more and a liquidus temperature of 9 ° C.
00 degrees or less, and satisfies the target temperature range.
【0050】表1および2には示さないが、実施例1〜
4の組成のAgろう材を用いて、被接合部材としてNi
メッキを施したSUS板を選択した時には、更に安定し
たせん断強さ(ほぼ10〜50%向上)と良好な浸透性
を示し、拡がり性においても実施例1〜4のすべてにお
いて、拡がり面積がほぼ10〜30%向上した。Although not shown in Tables 1 and 2, Examples 1 to
4 using an Ag brazing material having a composition of
When a plated SUS plate is selected, more stable shear strength (approximately 10 to 50% improvement) and good permeability are exhibited, and the spread area is almost the same in all of Examples 1 to 4 in terms of spreadability. It improved by 10 to 30%.
【0051】(比較例1)比較例として、Sn含有量を
4.0%、Mn量を7.5%とした[Ag−Cu−Mn
−Sn]インゴットを製造し、厚さ0.1mmの板状の
ろう材を作製した。この板状ろう材を、図1のように2
枚のメッキなしSUS板の間にはさみ、ろう付け処理を
行った後、同様にせん断強さを測定した。150〜35
0N/mm 2のせん断強さが得られ、評価Bと、良好な
強度を発揮した。Comparative Example 1 As a comparative example, the Sn content was
[Ag-Cu-Mn] with 4.0% and Mn content of 7.5%
-Sn] to produce an ingot, and to form a plate having a thickness of 0.1 mm.
A brazing material was produced. This plate-shaped brazing material is
Sandwich between two unplated SUS plates and brazing
After performing, the shear strength was measured similarly. 150-35
0N / mm TwoIs obtained.
Demonstrated strength.
【0052】次に、直径15mmに打ち抜いた比較例1
(Mn量7.5%)のろう材をメッキなしSUS板上に
載せてろう付け処理を行った拡がり性の実験によれば、
15mm以上〜30mm程度の拡がり性(評価B)を示
し、強度、拡がり性ともに良好である。さらに浸透性も
良好であり、全体としての接合性はまずまずである。し
かし、Mn含有量が増えることによって、蒸気圧の高い
Mnの蒸発量が多くなり、接合対象物や炉内が汚染され
るという問題が生じた。さらに、ろう付け条件によって
は、Agろう材が拡がりすぎ、接合の安定性に欠ける場
合も生じる。ろう材製造時のろう材品質にもばらつきが
生じ、品質の安定性に欠けるという問題もあった。Next, Comparative Example 1 punched out to a diameter of 15 mm
According to the spreadability experiment in which a brazing material (Mn content: 7.5%) was placed on an unplated SUS plate and subjected to brazing treatment,
It shows a spreadability of 15 mm or more to about 30 mm (evaluation B), and both strength and spreadability are good. Furthermore, the permeability is good, and the bonding property as a whole is reasonable. However, an increase in the Mn content causes an increase in the amount of Mn having a high vapor pressure to evaporate, thereby causing a problem that the object to be joined and the inside of the furnace are contaminated. Further, depending on the brazing conditions, the Ag brazing material may spread too much, resulting in a lack of bonding stability. There has also been a problem that the quality of the brazing material during the production of the brazing material varies, and the stability of the quality is lacking.
【0053】これらの実施例および比較例から、Mn量
が0.1%〜6%の範囲で、良好な接合性を示すことが
わかる。From these examples and comparative examples, it can be seen that good bonding properties are exhibited when the Mn content is in the range of 0.1% to 6%.
【0054】(実施例5、6)実施例1〜4,および比
較例1では、Mnを添加することの効果を示したが、M
nと所定量内のTiとが共存しても同等の効果を発揮す
る。実施例5および6では、Mn量を1.5%とし、T
iをそれぞれ0.5%,2.0%とした[Ag−Cu−
Mn−Sn−Ti]インゴットを得た後、厚さ0.1m
mの板状のろう材を製造した。これらの板状ろう材を図
1のように2枚のメッキなしSUS板の間に挟み、ろう
付け処理を行った後、同様にせん断強さを測定した。
0.5%のTiを含む場合は、350N/mm2以上の
せん断強さ(評価A)と150〜350N/mm2のせ
ん断強さ(評価B)を示す場合があり、2.0%のTi
を含む場合は、150〜350N/mm2のせん断強さ
(評価B)を示し、ともに良好な強度を発揮した。(Examples 5 and 6) In Examples 1 to 4 and Comparative Example 1, the effect of adding Mn was shown.
Even if n and Ti in a predetermined amount coexist, the same effect is exhibited. In Examples 5 and 6, the Mn content was set to 1.5%, and T
i was 0.5% and 2.0%, respectively.
[Mn-Sn-Ti] ingot, and then 0.1 m thick
m plate-shaped brazing material was manufactured. These plate-shaped brazing materials were sandwiched between two unplated SUS plates as shown in FIG. 1, and after performing a brazing treatment, the shear strength was measured in the same manner.
If containing 0.5% Ti, it may indicate 350 N / mm 2 or more Shear Strength (Evaluation A) and 150~350N / mm 2 Shear strength (Evaluation B), 2.0 percent Ti
, A shear strength of 150 to 350 N / mm 2 (evaluation B) was exhibited, and both exhibited good strength.
【0055】また、直径15mmに打ち抜いた各ろう材
をメッキなしSUS板上に載せて、同時にろう付け処理
を行った拡がり性実験によれば、双方のろう材で15m
m以上〜30mm程度の拡がり(評価B)を示し、良好
な拡がり性を発揮した。毛細管現象を利用した浸透性の
観察結果も優良であった。According to the spreadability experiment in which each brazing material punched to a diameter of 15 mm was placed on an unplated SUS plate and subjected to a brazing treatment at the same time, it was found that both brazing materials had a length of 15 m.
A spread of not less than m to about 30 mm (evaluation B) was exhibited, and good spreadability was exhibited. The results of observation of permeability using capillary action were also excellent.
【0056】なお、参考として、Mn量が同じ1.5%
でも、Ti量が5%になると、巨大なCuTi化合物が
生成されて加工性が低下し、板状や線状に加工する工程
が複雑となり工業的でないことが判明した。For reference, the same Mn content of 1.5%
However, it has been found that when the Ti content is 5%, a huge CuTi compound is generated, the workability is reduced, and the step of processing into a plate or a line becomes complicated, which is not industrial.
【0057】(実施例7〜10および比較例2)実施例
1〜6、および比較例1では、[Ag−Cu−Mn−S
n]合金において、Mn量が0.1%〜6.0%、ある
いはその一部をTiに置換した場合に、良好な接合強度
(せん断強さ)と拡がり性を発揮することを示した。実
施例7〜10では、実施例1〜4の合金系に対してさら
にNiを1.0%添加した場合のせん断強さ、拡がり性
を評価した。結果は、表3に示すとおり、せん断強さで
約10〜40%の向上が見られ(評価A〜B)、拡がり
性(濡れ性)も一層安定化する。浸透性はMnあるいは
Tiの含有量にかかわらず優良であった。(Examples 7 to 10 and Comparative Example 2) In Examples 1 to 6 and Comparative Example 1, [Ag-Cu-Mn-S
n] In the alloy, when the Mn content was 0.1% to 6.0%, or when a part of the Mn content was replaced with Ti, it was demonstrated that good bonding strength (shear strength) and spreadability were exhibited. In Examples 7 to 10, the shear strength and spreadability when Ni was further added to the alloy system of Examples 1 to 4 by 1.0% were evaluated. As a result, as shown in Table 3, the shear strength is improved by about 10 to 40% (evaluation AB), and the spreading property (wetting property) is further stabilized. The permeability was excellent regardless of the content of Mn or Ti.
【0058】一方、比較例2としてMn量が7.5%で
ある場合は、比較例1と同様に、ろう付け後のせん断強
さ、拡がり性、浸透性のいずれも合格基準に達している
ものの、Mnの蒸発量が多くなり、炉内の汚染が生じて
好ましくないことが確認された。On the other hand, when the Mn content is 7.5% as Comparative Example 2, as in Comparative Example 1, all of the shear strength after brazing, the spreading property, and the permeability have reached the acceptance criteria. However, it was confirmed that the evaporation amount of Mn increased and contamination in the furnace occurred, which was not preferable.
【0059】(実施例11〜12および比較例3〜4)
実施例1〜10および比較例1、2では、[Ag−Cu
−Mn−Sn]合金中のSn量を4.0%とした場合
の、せん断強さ、拡がり性、浸透性について示したが、
実施例11および12では、Sn量をそれぞれ1.0%
と10%に変更した場合にも、良好な接合効果を発揮す
ることを実証した。すなわち、Sn量が1.0%と10
%のろう材を製造し、これらの板状ろう材を、図1のよ
うに2枚のメッキなしSUS板の間に挟んで、ろう付け
処理を行った。その後、せん断強さを測定したところ、
Sn量が1.0%,10%では、いずれも150〜35
0N/mm2のせん断強さ(評価B)を示し、良好な強
度を発揮した。また、直径15mmに打ち抜いた各ろう
材をメッキなしSUS板上に載せて、同時にろう付け処
理を行った拡がり性実験によれば、Sn量が1.0%の
場合(実施例9)には15mm以上〜30mm程度の拡
がり(評価B)を示し、良好な拡がり性を発揮した。S
n量が10%の場合(実施例10)には、30mm以上
の拡がり(評価A)を示し、拡がり性はさらに向上し
た。浸透性は、Sn量の変化にかかわらず、最良であっ
た。(Examples 11 to 12 and Comparative Examples 3 and 4)
In Examples 1 to 10 and Comparative Examples 1 and 2, [Ag-Cu
-Mn-Sn] The shear strength, spreadability, and permeability when the amount of Sn in the alloy was 4.0% were shown.
In Examples 11 and 12, the amount of Sn was 1.0%, respectively.
It was proved that a good joining effect was exhibited even when it was changed to 10%. That is, when the amount of Sn is 1.0% and 10%.
% Brazing material was manufactured, and these plate-shaped brazing materials were brazed between two unplated SUS plates as shown in FIG. After that, when the shear strength was measured,
When the amount of Sn is 1.0% and 10%, both are 150 to 35.
It exhibited a shear strength of 0 N / mm 2 (evaluation B) and exhibited good strength. In addition, according to the spreadability experiment in which each brazing material punched to a diameter of 15 mm was placed on an unplated SUS plate and subjected to a brazing treatment at the same time, when the Sn amount was 1.0% (Example 9), Spreading of about 15 mm or more to about 30 mm (evaluation B) was exhibited, and good spreading properties were exhibited. S
When the amount of n was 10% (Example 10), the spread was 30 mm or more (evaluation A), and the spreadability was further improved. The permeability was the best irrespective of the change in the amount of Sn.
【0060】Snの含有量を、1.0%〜10%の間で
調整することによって、Agろう材の接合性を良好に維
持したまま、固相線温度、液相線温度をターゲットであ
る800℃〜900℃の範囲内に制御することが可能に
なる。By adjusting the Sn content between 1.0% and 10%, the solidus temperature and the liquidus temperature can be set as targets while maintaining good bonding of the Ag brazing material. It becomes possible to control within the range of 800 ° C to 900 ° C.
【0061】これに対して、比較例3においてSn量を
0.1%とした場合には、せん断強さは350N/mm
2以上(評価A)、拡がり面積も15〜30mm未満
(評価B)と、いずれの特性も良好であった。しかし、
Agろう材の液相線温度を900℃以下とすることがで
きず、本発明の第1の目的が達成できないので、好まし
くない。また、比較例6としてSn量を20%とした場
合では、拡がり性実験によれば、15mm以上〜30m
m程度の拡がり性を示し(評価B)、合格範囲内にあっ
たにもかかわらず、せん断強さの測定結果では、150
N/mm2未満(評価C)となり、接合強度に劣ること
がわかった。顕微鏡的組織調査によれば、巨大化したS
n化合物の生成が原因と考えられる。On the other hand, when the amount of Sn was 0.1% in Comparative Example 3, the shear strength was 350 N / mm.
All the characteristics were good when 2 or more (evaluation A) and the spread area was less than 15 to 30 mm (evaluation B). But,
The liquidus temperature of the Ag brazing material cannot be reduced to 900 ° C. or lower, and the first object of the present invention cannot be achieved. When the amount of Sn was set to 20% as Comparative Example 6, according to the expansibility test, it was 15 mm or more to 30 m or more.
m, and showed a spreadability of about m (evaluation B).
It was less than N / mm 2 (evaluation C), indicating that the bonding strength was inferior. According to microscopic microscopic examination, the huge S
The cause is considered to be the formation of the n compound.
【0062】(実施例13〜14)実施例11〜12お
よび比較3〜4においてSn量の適切な範囲を示した
が、Snと所定量内のInとが共存しても同等の効果が
得られる。実施例13および14では、Sn量を4%と
し、In量をそれぞれ1.0%,5.0%とした[Ag
−Cu−Mn−Sn−In]インゴットを得た後、厚さ
0.1mmの板状のろう材を製造した。これらの板状ろ
う材を図1のように2枚のメッキなしSUS板の間に挟
み、ろう付け処理を行った後、同様にせん断強さを測定
した。実施例13および14ともに、150〜350N
/mm2のせん断強さを示し(評価B)、良好な強度を
発揮した。また、直径15mmに打ち抜いた各ろう材を
メッキなしSUS板上に載せて、同時にろう付け処理を
行った拡がり性実験によれば、メッキなしSUS板上で
15mm以上〜30mm程度の拡がりを示し(評価
B)、良好な拡がり性を発揮した。(Examples 13 and 14) In Examples 11 and 12 and Comparative Examples 3 and 4, the appropriate range of the amount of Sn was shown, but the same effect was obtained even when Sn and In within a predetermined amount coexisted. Can be In Examples 13 and 14, the amount of Sn was set to 4%, and the amount of In was set to 1.0% and 5.0%, respectively.
[Cu-Mn-Sn-In] ingot, and a plate-shaped brazing material having a thickness of 0.1 mm was manufactured. These plate-shaped brazing materials were sandwiched between two unplated SUS plates as shown in FIG. 1, and after performing a brazing treatment, the shear strength was measured in the same manner. In both Examples 13 and 14, 150 to 350 N
/ Mm 2 (evaluation B), and exhibited good strength. Further, according to the spreadability experiment in which each brazing material punched to a diameter of 15 mm was placed on a SUS plate without plating and subjected to a brazing treatment at the same time, the spread of about 15 mm to 30 mm on the SUS plate without plating was shown ( Evaluation B) Good spreadability was exhibited.
【0063】なお、表には示さないが、参考としてSn
の量を4.0%に維持したままInの量を10%にまで
増やした場合は、加工性が著しく低下し、板状や線状に
加工する工程が複雑となり工業的でないことがわかっ
た。Although not shown in the table, for reference, Sn
When the amount of In was increased to 10% while maintaining the amount of 4.0%, the workability was remarkably reduced, and the step of processing into a plate or a line became complicated, which was not industrial. .
【0064】(実施例15〜16および比較例5)実施
例7〜10および比較例2においては、[Ag−Cu−
Mn−Sn−Ni]合金中のNi量を1.0%とした場
合の、せん断強さ、拡がり性に及ぼす好適なMn量につ
いて示した。実施例15および16では、Sn量を4.
0%、Mn量を1.5%とし、Ni量を変化させてその
効果を確認した。すなわち、Ni量をそれぞれ0.1%
(実施例13)と、2.5%(実施例14)とした[A
g−Cu−Mn−Sn−Ni]インゴットを得た後に、
厚さ、厚さ0.1mmの板状のろう材を製造した。これ
らの板状ろう材を図1のように2枚のメッキなしSUS
板の間に挟み、ろう付け処理を行った後、同様にせん断
強さを測定した。いずれの実施例においても、150〜
350N/mm2のせん断強さ(評価B)を示し、良好
な強度を発揮した。また、直径15mmに打ち抜いた各
ろう材をメッキなしSUS板上に載せて、同時にろう付
け処理を行った拡がり性実験を行なったところ、双方と
もにメッキなしSUS板上で30mm以上の拡がりを示
し(評価A)、良好な拡がり性を発揮した。なお、前記
インゴットを押出機によって直径10mmに押出し、こ
れを焼鈍(350〜750℃)と引抜き(加工率3〜3
0%)とを必要回数繰り返して直径0.1mmの線材を
得て、同様のせん断強さを測定、拡がり性評価を実施し
たが、同等のNi量の範囲に於いて、良好な特性を発揮
した。また、浸透性も最良であった。(Examples 15 to 16 and Comparative Example 5) In Examples 7 to 10 and Comparative Example 2, [Ag-Cu-
[Mn-Sn-Ni] The preferred amount of Mn that affects the shear strength and spreadability when the amount of Ni in the alloy is 1.0% is shown. In Examples 15 and 16, the amount of Sn was set to 4.
The effect was confirmed by changing the amount of Ni to 0% and the amount of Mn to 1.5%. That is, each of the Ni contents is 0.1%
(Example 13) and 2.5% (Example 14) [A
g-Cu-Mn-Sn-Ni] ingot.
A plate-shaped brazing material having a thickness of 0.1 mm was manufactured. As shown in FIG. 1, these plate-shaped brazing materials are made of two sheets of unplated SUS.
After sandwiching between the plates and performing brazing treatment, the shear strength was measured in the same manner. In any of the examples, 150 to
It exhibited a shear strength of 350 N / mm 2 (evaluation B) and exhibited good strength. In addition, when each brazing material punched to a diameter of 15 mm was placed on an unplated SUS plate and subjected to a brazing treatment at the same time to perform a spreadability experiment, both showed a spread of 30 mm or more on the unplated SUS plate ( Evaluation A), good spreadability was exhibited. The ingot was extruded to a diameter of 10 mm by an extruder, and this was annealed (350 to 750 ° C.) and drawn (working rate: 3 to 3).
0%) was repeated the required number of times to obtain a wire rod having a diameter of 0.1 mm, and the same shear strength was measured and the spreadability was evaluated. However, good characteristics were exhibited in the same Ni content range. did. The permeability was also the best.
【0065】一方、比較例5として、Ni量を5.0%
に増加し、同様のろう付け処理を行ったところ、接合後
のせん断強さは150〜350N/mm2(評価B)、
拡がり性実験によれば、直径15mmに打ち抜いたろう
材は、メッキなしSUS板上で15mm以上〜30mm
程度の拡がり(評価B)を示し、浸透性も最良であっ
た。しかし、液相線温度が上昇し、900℃以下に制御
することができなくなるので好ましくない。On the other hand, as Comparative Example 5, the Ni content was 5.0%.
When the same brazing treatment was performed, the shear strength after joining was 150 to 350 N / mm 2 (evaluation B).
According to the extensibility test, the brazing material punched to a diameter of 15 mm is 15 mm or more to 30 mm on a SUS plate without plating.
The degree of spread (evaluation B) was shown, and the permeability was also the best. However, the liquidus temperature rises and cannot be controlled to 900 ° C. or less, which is not preferable.
【0066】以上のように、ろう材中のNi量は2.5
%以下において、接合強度(せん断強さ)、拡がり性、
浸透性のすべてを備え、かつ、液相線温度を900℃以
下に制御することが可能になる。As described above, the amount of Ni in the brazing material is 2.5
%, The bonding strength (shear strength), spreadability,
It is possible to provide all the permeability and to control the liquidus temperature to 900 ° C. or less.
【0067】(実施例17〜18および比較例6〜7)
実施例17、18では、[Ag−Cu−Mn−Sn]合
金、または[Ag−Cu−Mn−Sn−Ni]合金中の
適切なCu量について実証する。Agろう材に含まれる
Cuの量は、Agの含有量とともに合金の固相線温度、
液相線温度を所定値内に調整するのに重要である。(Examples 17-18 and Comparative Examples 6-7)
In Examples 17 and 18, an appropriate amount of Cu in the [Ag-Cu-Mn-Sn] alloy or the [Ag-Cu-Mn-Sn-Ni] alloy is demonstrated. The amount of Cu contained in the Ag brazing material depends on the solidus temperature of the alloy together with the Ag content,
It is important to adjust the liquidus temperature within a predetermined value.
【0068】実施例17において、Cu量が2.5%
(Mn量が1.5%、Snが4.0%)、Ag量が9
2.0%(Ag+Cu=94.5%、Ag/(Ag+C
u)=97.4%)とした。ろう付け処理を行った後の
せん断強さは、150〜350N/mm2(評価B)、
15mm以上〜30mm程度の拡がり(評価B)を示
し、ろう材が接合対象物の間隙において完全に反対側ま
で浸透し、すべてにおいて良好な特性を示すことがわか
った。さらに、ろう材の固相線温度、液相線温度を80
0〜900℃の範囲に制御することができた。In Example 17, the Cu content was 2.5%
(Mn content 1.5%, Sn 4.0%), Ag content 9
2.0% (Ag + Cu = 94.5%, Ag / (Ag + C
u) = 97.4%). The shear strength after performing the brazing treatment is 150 to 350 N / mm 2 (evaluation B),
It showed a spread of 15 mm or more to about 30 mm (evaluation B), and it was found that the brazing material completely penetrated to the opposite side in the gap between the objects to be joined, and all exhibited good characteristics. Further, the solidus temperature and liquidus temperature of the brazing material are set to 80
Control could be performed in the range of 0 to 900 ° C.
【0069】実施例18において、Cu量が10.0
%、Ag量が84.5%(Ag+Cu=94.5%、A
g/(Ag+Cu)=89.4%)とした場合には、ろ
う付け処理を行った後のせん断強さは、150〜350
N/mm2(評価B)であった。拡がり性テストでは、
15mm以上〜30mm程度の拡がり(評価B)を示
し、浸透性も最良であり、この組成においても、すべて
において良好な特性を示すことがわかった。また、固相
線温度、液相線温度を800〜900℃の範囲に制御す
ることができた。In Example 18, the Cu content was 10.0
%, The amount of Ag is 84.5% (Ag + Cu = 94.5%, A
g / (Ag + Cu) = 89.4%), the shear strength after brazing is 150 to 350.
N / mm 2 (evaluation B). In the spreadability test,
A spread of 15 mm or more to about 30 mm (evaluation B) was shown, and the permeability was also the best, and it was found that all of the compositions exhibited good characteristics. Further, the solidus temperature and the liquidus temperature could be controlled in the range of 800 to 900 ° C.
【0070】これに対し、比較例6として、Cu量が
1.0%、Ag量が93.5%(Ag+Cu=94.5
%、Ag/(Ag+Cu)=98.9%)のAgろう材
を準備した。ろう付け処理を行った後のせん断強さは、
150〜350N/mm2(評価B)、拡がり性実験で
は、直径15mmに打ち抜いたろう材がメッキなしSU
S板上で30mm以上の極めて良好な拡がり性(評価
A)を示し、両特性とも良好であった。また、浸透性に
もすぐれていた。しかし、この組成では、液相線温度を
900℃以下に制御することができなかった。On the other hand, in Comparative Example 6, the Cu content was 1.0% and the Ag content was 93.5% (Ag + Cu = 94.5).
%, Ag / (Ag + Cu) = 98.9%) was prepared. The shear strength after brazing is
150 to 350 N / mm 2 (evaluation B), in the expansibility test, the brazing material punched to a diameter of 15 mm was not plated with SU.
Very good spreadability (evaluation A) of 30 mm or more was shown on the S plate, and both properties were good. In addition, it had excellent permeability. However, with this composition, the liquidus temperature could not be controlled to 900 ° C. or less.
【0071】さらに、比較例7として、Cu量が20.
0%、Ag量が74.5%(Ag+Cu=94.5%、
Ag/(Ag+Cu)=78.8%)とした場合には、
ろう付け処理を行った後のせん断強さは、150〜35
0N/mm2(評価B)を示し、良好な強度を発揮し、
拡がり性試験では、メッキなしSUS板上で15mm〜
30mmの拡がり(評価B)を示した。浸透性も最良で
あった。しかし、固相線温度を800℃以上に制御する
のが困難であった。Further, as Comparative Example 7, the amount of Cu was 20.
0%, the amount of Ag is 74.5% (Ag + Cu = 94.5%,
When Ag / (Ag + Cu) = 78.8%),
The shear strength after brazing is 150 to 35.
0N / mm 2 (evaluation B), exhibiting good strength,
In the spreadability test, 15mm ~ on SUS plate without plating
A spread of 30 mm (evaluation B) was shown. The permeability was also the best. However, it has been difficult to control the solidus temperature to 800 ° C. or higher.
【0072】(実施例19および比較例8)実施例19
では、Cu量を2.5%(Mn量が0.5%、Snが
1.0%)とし、Ag量を96.0%に増やした(Ag
+Cu=98.5%、Ag/(Ag+Cu)=97.5
%)。この組成で、ろう付け処理を行った後のせん断強
さは、350N/mm2以上(評価A)、拡がり性は1
5mm以上〜30mm程度の拡がり(評価B)を示し、
浸透性にもすぐれていた。また、固相線温度、液相線温
度を800〜900℃の範囲に制御することができた。(Example 19 and Comparative Example 8)
In this example, the Cu content was set to 2.5% (Mn content was 0.5% and Sn was 1.0%), and the Ag content was increased to 96.0% (Ag
+ Cu = 98.5%, Ag / (Ag + Cu) = 97.5
%). With this composition, the shear strength after brazing treatment is 350 N / mm 2 or more (evaluation A), and the spreadability is 1
Showing a spread of 5 mm or more to about 30 mm (evaluation B),
It had excellent permeability. Further, the solidus temperature and the liquidus temperature could be controlled in the range of 800 to 900 ° C.
【0073】これに対して、比較例8では、Cu量を
0.5%(Mn量が0.5%、Snが1.0%)、Ag
量を98.0%(Ag+Cu=98.5%、Ag/(A
g+Cu)=99.5%)とした。ろう付け処理を行っ
た後のせん断強さは、350N/mm2以上(評価A)
で、浸透性にもすぐれていたが、拡がり性は15mm以
下(評価C)であった。さらに、液相線温度が900℃
を上回り好ましくないことがわかった。On the other hand, in Comparative Example 8, the Cu content was 0.5% (Mn content was 0.5%, Sn was 1.0%), and Ag content was 0.5%.
98.0% (Ag + Cu = 98.5%, Ag / (A
g + Cu) = 99.5%). Shear strength after brazing is 350 N / mm 2 or more (evaluation A)
And also excellent in permeability, but spreadability was 15 mm or less (evaluation C). Furthermore, the liquidus temperature is 900 ° C
Was found to be more unfavorable.
【0074】(実施例20〜23)実施例20〜23で
は、Agロウ材のCu含有量を6.0%とし、Snの含
有量を1.0%、4.0%、7.0%、10.0%と変
化させ、残りをAgとした場合の接合性を測定した。こ
れらの組成において、Mnを含まないため、拡がり性の
測定においては、15mm未満となりやや劣るが、せん
断強さの評価はB、浸透性も最良であり、ろう材の接合
性を示す総合的な評価は良好であった。また、ターゲッ
トである固相線温度が800℃以上、液相線温度が90
0℃以下を満たしている。これらの組成のAgロウ材
は、単一平面上での拡がり性よりも、2つの接合対象物
の間隙への浸透性が重視される場合、たとえば、微細部
品の接合や、蒸発金属元素含有をきらう真空管など気密
性が要求される場合に適する。(Examples 20 to 23) In Examples 20 to 23, the Cu content of the Ag brazing material was set to 6.0%, and the Sn content was set to 1.0%, 4.0%, and 7.0%. , 10.0%, and the bondability when the remainder was Ag was measured. In these compositions, since Mn is not included, in the measurement of the spreadability, it is less than 15 mm, which is slightly inferior. However, the evaluation of the shear strength is B, the permeability is also the best, and the comprehensiveness indicating the bondability of the brazing material is shown. The evaluation was good. The target has a solidus temperature of 800 ° C. or higher and a liquidus temperature of 90 ° C.
0 ° C or less is satisfied. The Ag brazing material having these compositions is important when the permeability into the gap between two objects to be bonded is more important than the spreadability on a single plane. It is suitable when airtightness is required such as a vacuum tube.
【0075】(実施例24〜26)実施例24〜26で
は、Snの含有量を4.0%、Cuの含有量を6.0%
とし、Niの含有量を0.5%、1.5%、2.5%と
変化させ、残りをAgとした場合の接合性を測定した。
これらの組成において、せん断強さ、拡がり性、浸透性
すべてにおいて良好な特性を示し、接合性にすぐれてい
ることがわかる。Examples 24 to 26 In Examples 24 to 26, the Sn content was 4.0% and the Cu content was 6.0%.
, And the bondability was measured when the content of Ni was changed to 0.5%, 1.5%, and 2.5%, and the balance was Ag.
It can be seen that these compositions show good properties in all of the shear strength, spreadability, and permeability, and have excellent bondability.
【0076】(実施例27〜29)実施例27〜29で
は、本発明のAgろう材がSUSに限らず幅広い部材に
適用されることを実証する。すなわち、実施例26まで
は、接合対象物としてメッキを施さないSUS(ステン
レス)のみを選択した例について示したが、実施例27
〜29において、接合する対象物として、メッキなしS
USとアルミナ、メッキなしSUSとCu、CuとCu
をそれぞれ選択した。いずれの場合も、良好なせん断強
さ、拡がり性、浸透性を示した。なお、表には示してい
ないが、メッキなしSUSに代わって、メッキ付きSU
Sとした場合に、さらに安定したせん断強さ、拡がり
性、浸透性を示した。(Examples 27 to 29) In Examples 27 to 29, it is demonstrated that the Ag brazing material of the present invention is applied not only to SUS but also to a wide range of members. That is, up to the twenty-sixth embodiment, an example in which only SUS (stainless steel) that is not plated is selected as an object to be joined is described.
No. 29, No plating S
US and alumina, unplated SUS and Cu, Cu and Cu
Was selected respectively. In each case, good shear strength, spreadability, and permeability were exhibited. Although not shown in the table, in place of unplated SUS, plated SU
In the case of S, more stable shear strength, spreadability, and permeability were exhibited.
【0077】次に、本発明のAgろう材と、既存のAg
ろう材とを組み合わせて、異なる接合箇所を順次接合す
るステップろう付けについて説明する。Next, the Ag brazing material of the present invention and the existing Ag
Step brazing in which different joining portions are sequentially joined by combining with a brazing material will be described.
【0078】たとえば、図2に示すように、ステンレス
基板3上に、融点が1083℃であるCu部品5を接合
し、このCu部品5にセラミックス、アルミナ等の任意
の部材4を接合して覆う場合を考える。このとき、Cu
部品5を下部のステンレス基板3と、上部の部材4とに
同時に接合することはできない。Cu部品5の接合面を
上向きにしたまま接合を行なうと、ろう材が流れ落ち
て、Cu部品5、さらには、下部のステンレス基板3を
汚染してしまうからである。For example, as shown in FIG. 2, a Cu component 5 having a melting point of 1083 ° C. is bonded on a stainless steel substrate 3, and an arbitrary member 4 such as ceramics or alumina is bonded and covered on the Cu component 5. Consider the case. At this time, Cu
The component 5 cannot be joined to the lower stainless substrate 3 and the upper member 4 at the same time. If the joining is performed with the joining surface of the Cu component 5 facing upward, the brazing material will flow down and contaminate the Cu component 5 and further the lower stainless steel substrate 3.
【0079】したがって、Cu部品5の接合面が常に下
向きになるように、まず一方の面を接合し、次にCu部
品5を逆向きにして、他方の面を接合することになる。Therefore, one surface is first joined, the Cu component 5 is turned in the opposite direction, and the other surface is joined so that the joining surface of the Cu component 5 always faces downward.
【0080】図2に示す例では、表面に不動態被膜を有
するステンレス基板3とCu部品5の接合に、本発明の
Agろう材2を用いる。ステンレス基板3と、所定の位
置に配置したCu部品5との間に、スライスされた本発
明のAgろう材片を挿入し、920℃〜925℃の雰囲
気に加熱し、ろう付けを行なう。作業温度がこの範囲に
あるので、Cu部品5の母材軟化への悪影響を回避する
ことができる。また、本発明のAgろう材は拡がり性に
すぐれているので、接合に先立ちステンレス基板3への
Niメッキ処理は必要ない。In the example shown in FIG. 2, the Ag brazing material 2 of the present invention is used for joining a stainless steel substrate 3 having a passivation film on its surface and a Cu component 5. The sliced Ag brazing material piece of the present invention is inserted between the stainless steel substrate 3 and the Cu component 5 arranged at a predetermined position, and is heated to an atmosphere of 920 ° C. to 925 ° C. to perform brazing. Since the working temperature is in this range, an adverse effect on the softening of the base material of the Cu component 5 can be avoided. In addition, since the Ag brazing material of the present invention has excellent spreadability, it is not necessary to perform Ni plating on the stainless steel substrate 3 prior to joining.
【0081】次に、本発明のAgろう材の固相線温度よ
りも低い溶融温度の既存のAgろう材7を用いて、Cu
部品5の他方の面に、たとえばアルミナ基板4を接合す
る。このとき、Cu部品5の接合面が下向きになるよう
に、先にステンレス基板3に接合したアセンブリを逆向
きにする。そして、800℃以下の作業温度でアセンブ
リ全体を加熱処理し、ろう付けを行なう。Next, using the existing Ag brazing material 7 having a melting temperature lower than the solidus temperature of the Ag brazing material of the present invention,
For example, an alumina substrate 4 is bonded to the other surface of the component 5. At this time, the assembly previously joined to the stainless steel substrate 3 is reversed so that the joining surface of the Cu component 5 faces downward. Then, the entire assembly is heated at a working temperature of 800 ° C. or less, and brazing is performed.
【0082】この一連のろう付け処理は、大気中で行な
うことも、真空チャンバ内で行なうこともできる。This series of brazing processes can be performed in the air or in a vacuum chamber.
【0083】以下、実施例30〜33により、本発明の
Agろう材を用いたステップろう付けの効果を実証す
る。Hereinafter, the effects of the step brazing using the Ag brazing material of the present invention will be demonstrated by Examples 30 to 33.
【0084】(実施例30)第1の接合箇所を、あらか
じめ本発明のAgろう材によって接合した。次に、第2
の接合箇所に、公知の共晶Agろう材[72%Ag−残
部Cu](固相線温度780℃、液相線温度780℃)
を配置し、前記第1の接合箇所に用いた本発明のAgろ
う材が溶融しない温度を選択して、第1の接合箇所とと
もに加熱処理した。接合完了後、第1の接合箇所につい
て、せん断強さ、浸透性、拡がり性の評価を行なったと
ころ、浸透性は評価A、せん断強さと拡がり性について
は、評価A〜Bを得た。(Example 30) The first joint was joined in advance with the Ag brazing material of the present invention. Next, the second
Eutectic Ag brazing material [72% Ag-remainder Cu] (solidus temperature 780 ° C, liquidus temperature 780 ° C)
Was arranged, and a temperature at which the Ag brazing material of the present invention used for the first joint was not melted was selected and subjected to heat treatment together with the first joint. After the joining was completed, the first joint was evaluated for shear strength, permeability, and spreadability. As a result, the permeability A was evaluated, and the shear strength and spreadability were evaluated A and B.
【0085】(実施例31)第1の接合箇所を、既存の
ろう材JIS Z3265.BNi−2(固相線温度9
95℃、液相線温度1000℃)により接合した。次
に、第2の接合箇所を、本発明のAgろう材で接合し
た。さらに、第3の接合箇所に、公知の共晶Agろう材
(固相線温度780℃、液相線温度780℃)を配置し
た。前記第2の接合箇所に用いた本発明のAgろう材の
固相線温度と、第3の接合箇所に用いた共晶Agろう材
の液相線温度との間の温度で、第1の接合箇所、第2の
接合箇所ともども加熱処理を行ない、多段ステップろう
付けを完了した。その後、第2の接合箇所について、浸
透性、せん断強さ、拡がり性を評価した。浸透性はA、
せん断強さと拡がり性については評価A〜Bを得た。(Example 31) The first joint was formed by using an existing brazing material JIS Z3265. BNi-2 (solidus temperature 9
95 ° C., liquidus temperature 1000 ° C.). Next, the second joint was joined with the Ag brazing material of the present invention. Further, a known eutectic Ag brazing material (solidus temperature 780 ° C, liquidus temperature 780 ° C) was arranged at the third joint. The temperature between the solidus temperature of the Ag brazing material of the present invention used for the second joint and the liquidus temperature of the eutectic Ag brazing material used for the third joint is the first temperature. Heat treatment was performed on both the joint and the second joint to complete the multi-step brazing. Thereafter, the second joint was evaluated for permeability, shear strength, and spreadability. The permeability is A,
Evaluations A and B were obtained for the shear strength and spreadability.
【0086】(変形例)実施例30〜31では、被接合
物は主としてメッキなしステンレス板同士を用いたが、
あらかじめNiメッキを施したステンレスの接合に使用
しても、せん断強度、浸透性、拡がり性すべてにおいて
良好な結果を得た。図2に示すように、一方又は両方が
Cuなど他の金属、合金の場合、あるいはアルミナなど
の非金属の場合においても、接合箇所に良好なせん断強
度、浸透性、拡がり性を得た。(Modification) In the embodiments 30 to 31, the non-plated stainless steel plates are mainly used as the objects to be joined.
Even when used for joining of Ni-plated stainless steel, good results were obtained in all of the shear strength, permeability, and spreadability. As shown in FIG. 2, even when one or both of the other metal or alloy such as Cu, or the non-metal such as alumina, good shear strength, permeability, and spreadability were obtained at the joint.
【0087】[0087]
【発明の効果】本発明により、従来存在しておらず、そ
の存在が望まれていた800℃〜900℃の固相線温度
および液相線温度を持つ、Agろう材が提供されること
になる。しかも、高価なPdを使用しないので低コスト
接合が可能になる。According to the present invention, there is provided an Ag brazing material having a solidus temperature and a liquidus temperature of 800 ° C. to 900 ° C., which have not been present and whose existence has been desired. Become. In addition, since expensive Pd is not used, low-cost joining is possible.
【0088】多段ステップろう付けにおける一方のろう
材として本発明のAgろう材を用いた場合に、他方のろ
う材の選択幅および接合作業温度の選択が大幅に広が
る。When the Ag brazing material of the present invention is used as one of the brazing materials in the multi-step brazing, the selection range of the other brazing material and the selection of the joining operation temperature are greatly widened.
【0089】実施例27〜29では、本発明のAgろう
材がSUSに限らず幅広い部材に適用されることを実証
する。すなわち、実施例26までは、被接合物としてメ
ッキを施さないSUS(ステンレス)のみを選択した例
について示したが、実施例27〜29において、接合す
る対象物として、メッキなしSUSとアルミナ、メッキ
なしSUSとCu、CuとCuをそれぞれ選択した。い
ずれの場合も、良好なせん断強さ、拡がり性、浸透性を
示した。なお、表には示していないが、メッキなしSU
Sに代わって、メッキ付きSUSとした場合に、さらに
安定したせん断強さ、拡がり性、浸透性を示した。In Examples 27 to 29, it is demonstrated that the Ag brazing material of the present invention is applied not only to SUS but also to a wide range of members. That is, up to Example 26, an example in which only SUS (stainless steel) not plated was selected as an object to be joined, but in Examples 27 to 29, SUS without plating, alumina, and plating were used as objects to be joined. None SUS and Cu, Cu and Cu were selected. In each case, good shear strength, spreadability, and permeability were exhibited. Although not shown in the table, SU without plating was used.
When SUS with plating was used instead of S, more stable shear strength, spreadability, and permeability were exhibited.
【0090】特に、母材軟化が起きやすい部品を接合す
る場合の多段ステップろう付けにおける一方のろう材と
して、効果的に用いることができる。In particular, it can be effectively used as one of the brazing materials in a multi-step brazing for joining components that are likely to be softened in the base material.
【0091】被接合物の材質を問わず広く適用すること
ができ、ステンレス等の表面にNiメッキを施さなくて
も良好なろう付けが可能になる。The present invention can be widely applied regardless of the material of the object to be joined, and good brazing can be performed without applying Ni plating to the surface of stainless steel or the like.
【0092】大気処理のみならず、真空チャンバ内での
接合処理にも適しており、FLUX溶剤処理が不要にな
る。The present invention is suitable not only for atmospheric treatment but also for joining treatment in a vacuum chamber, and eliminates the need for a FLUX solvent treatment.
【図1】本発明の効果を実証するためのせん断強さおよ
び浸透性試験用の試験片の図である。FIG. 1 is a diagram of a test piece for a shear strength and permeability test to demonstrate the effect of the present invention.
【図2】本発明のAgろう材を用いた多段ステップろう
付けを説明するための図である。FIG. 2 is a view for explaining multi-step brazing using the Ag brazing material of the present invention.
1 被接合部材 2 本発明のAgろう材 3 ステンレス基板 4 アルミナ基板 5 Cu部品 7 既存のろう材 DESCRIPTION OF SYMBOLS 1 Joining member 2 Ag brazing material of the present invention 3 Stainless steel substrate 4 Alumina substrate 5 Cu part 7 Existing brazing material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 奥富 功 東京都府中市東芝町1番地 芝府エンジニ アリング株式会社内 (72)発明者 海田 博 兵庫県西宮市小松北町1−1−21 (72)発明者 山本 佳克 兵庫県西宮市小松東町1−3−52 (72)発明者 草野 貴史 東京都府中市東芝町1番地 株式会社東芝 府中事業所内 (72)発明者 山本 敦史 東京都府中市東芝町1番地 株式会社東芝 府中事業所内 (72)発明者 長部 清 東京都府中市東芝町1番地 株式会社東芝 府中事業所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Isao Okutomi 1 Toshiba-cho, Fuchu-shi, Tokyo Inside Shibafu Engineering Co., Ltd. (72) Inventor Hiroshi Kaida 1-1-21 Komatsukita-cho, Nishinomiya-shi, Hyogo (72) Inventor Yoshikatsu Yamamoto 1-3-52 Komatsu Higashicho, Nishinomiya City, Hyogo Prefecture No. 1 Toshiba Corporation Fuchu Plant (72) Inventor Kiyoshi Nagano 1 Toshiba Town Fuchu City Tokyo Prefecture Toshiba Corporation Fuchu Plant
Claims (13)
(Sn)と、2.5重量%〜10重量%の銅(Cu)
と、残部が銀(Ag)とから成ることを特徴とする接合
用Agろう材。1. 1.0% to 10.0% by weight of tin (Sn) and 2.5% to 10% by weight of copper (Cu)
And a balance of silver (Ag).
(Sn)と、2.5重量%〜10重量%の銅(Cu)
と、6.0重量%以下のマンガン(Mn)と、残部が銀
(Ag)とから成ることを特徴とする接合用Agろう
材。2. 1.0% to 10.0% by weight of tin (Sn) and 2.5% to 10% by weight of copper (Cu)
And a manganese (Mn) of 6.0% by weight or less and a balance of silver (Ag).
(Sn)と、2.5重量%〜10重量%の銅(Cu)
と、2.5重量%以下のニッケル(Ni)と、残部が銀
(Ag)とから成ることを特徴とする接合用Agろう
材。3. A method according to claim 1, wherein 1.0% to 10.0% by weight of tin (Sn) and 2.5% to 10% by weight of copper (Cu).
And 2.5% by weight or less of nickel (Ni) and the balance being silver (Ag).
さらに含むことを特徴とする請求項2に記載の接合用A
gろう材。4. The bonding A according to claim 2, further comprising 2.5% by weight or less of nickel (Ni).
g brazing material.
てをチタン(Ti)で置換したことを特徴とする請求項
2または4に記載の接合用Agろう材。5. The Ag brazing material according to claim 2, wherein a part or all of the manganese (Mn) is replaced with titanium (Ti).
インジウム(In)で置換したことを特徴とする請求項
1〜5のいずれかに記載の接合用Agろう材。6. The Ag brazing material according to claim 1, wherein a part or all of said tin (Sn) is replaced with indium (In).
u)とを主成分とするマトリックスが、スズ(Sn)を
含有する微細な析出化合物を取り囲んで存在することを
特徴とする請求項1〜6のいずれかに記載の接合用Ag
ろう材。7. The Ag brazing material comprises silver (Ag) and copper (C).
The bonding Ag according to any one of claims 1 to 6, wherein a matrix mainly comprising u) is present surrounding a fine precipitation compound containing tin (Sn).
Brazing material.
以上、液相線温度は900℃以下であることを特徴とす
る請求項1〜6のいずれかに記載の接合用Agろう材。8. The solidus temperature of the Ag brazing material is 800 ° C.
The joining brazing material according to any one of claims 1 to 6, wherein the liquidus temperature is 900 ° C or less.
(Sn)と、2.5重量%〜10重量%の銅(Cu)
と、残部がAgとから成り、その固相線温度が800℃
以上である第1の接合用Agろう材を調整するステップ
と、 前記第1の接合用Agろう材を用いて、任意の部材の第
1部分をろう付けするステップと、 前記第1の接合用Agろう材の固相線温度よりも低い液
相線温度を有する第2の接合用ろう材を用いて、前記部
材の第2部分をろう付けするステップとを含むことを特
徴とする多段ステップろう付け方法。9. 1.0% to 10.0% by weight of tin (Sn) and 2.5% to 10% by weight of copper (Cu)
And the balance is Ag, and its solidus temperature is 800 ° C.
Adjusting the first brazing Ag brazing material as described above; brazing a first part of an arbitrary member using the first brazing Ag brazing material; Brazing the second part of the member with a second joining brazing material having a liquidus temperature lower than the solidus temperature of the Ag brazing material. Attachment method.
(Sn)と、2.5重量%〜10重量%の銅(Cu)
と、残部がAgとから成り、その液相線温度が900℃
以下である第1の接合用Agろう材を調整するステップ
と、 前記第1の接合用Agろう材の液相線温度よりも高い固
相線温度を有する第2の接合用ろう材を用いて、任意の
部材の第1部分をろう付けするステップと、 前記第1の接合用Agろう材を用いて、前記部材の第2
部分をろう付けするステップと、 を含むことを特徴とする多段ステップろう付け方法。10. 1.0% to 10.0% by weight of tin (Sn) and 2.5% to 10% by weight of copper (Cu)
And the balance is Ag, and its liquidus temperature is 900 ° C.
Adjusting the first joining Ag brazing material, and using the second joining brazing material having a solidus temperature higher than the liquidus temperature of the first joining Ag brazing material. Brazing a first portion of any member; and a second member of the member using the first joining Ag brazing material.
Brazing a portion; and a multi-step brazing method.
テップは、6%以下のマンガン(Mn)をさらに含ませ
ることを特徴とする請求項9または10に記載の多段ス
テップろう付け方法。11. The multi-step brazing method according to claim 9, wherein the step of adjusting the first joining Ag brazing material further includes 6% or less of manganese (Mn).
テップは、2.5重量%以下のニッケル(Ni)をさら
に含ませることを特徴とする請求項9または10に記載
の多段ステップろう付け方法。12. The multi-step brazing apparatus according to claim 9, wherein the step of adjusting the first brazing filler metal further includes nickel (Ni) of 2.5% by weight or less. Attachment method.
テップは、6重量%以下のマンガン(Mn)と、2.5
重量%以下のニッケル(Ni)をさらに含ませることを
特徴とする請求項9または10に記載の多段ステップろ
う付け方法。13. The step of adjusting the first brazing Ag brazing material comprises: manganese (Mn) of 6% by weight or less;
The multi-step brazing method according to claim 9 or 10, further comprising nickel (Ni) of not more than weight%.
Priority Applications (2)
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|---|---|---|---|
| JP2001390150A JP2002361478A (en) | 2001-03-26 | 2001-12-21 | Ag brazing material for joining and brazing method using the same |
| CN 02106267 CN1196563C (en) | 2001-03-26 | 2002-03-07 | Ag solder for welding and soldering method using it |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-87623 | 2001-03-26 | ||
| JP2001087623 | 2001-03-26 | ||
| JP2001390150A JP2002361478A (en) | 2001-03-26 | 2001-12-21 | Ag brazing material for joining and brazing method using the same |
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| Publication Number | Publication Date |
|---|---|
| JP2002361478A true JP2002361478A (en) | 2002-12-18 |
Family
ID=26612044
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| JP2009113089A (en) * | 2007-11-07 | 2009-05-28 | Toshiba Corp | Bonding materials for vacuum valves |
| JP2009283313A (en) * | 2008-05-22 | 2009-12-03 | Toshiba Corp | Joining material for vacuum bulb |
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| CN100439029C (en) * | 2006-08-18 | 2008-12-03 | 贵研铂业股份有限公司 | Silver-based alloy solder and application thereof in vacuum circuit breaker step soldering |
| CN102328157A (en) * | 2011-09-09 | 2012-01-25 | 合肥工业大学 | Method for manufacturing SnAgCu lead-free solder |
| CN103406684B (en) * | 2013-08-01 | 2016-01-06 | 中国航空工业集团公司北京航空材料研究院 | A kind of silver-copper-indium-nickel middle temperature brazing material |
| CN108340094B (en) * | 2017-01-23 | 2020-11-17 | 北京有色金属与稀土应用研究所 | Ag-Cu-In-Sn-Ti alloy solder and preparation method and application thereof |
| CN107214437A (en) * | 2017-07-31 | 2017-09-29 | 安徽华众焊业有限公司 | It is a kind of without silver-base solder of the indium without cadmium |
| CN107234369A (en) * | 2017-07-31 | 2017-10-10 | 安徽华众焊业有限公司 | A kind of high temperature is without copper silver-base solder |
| CN112605556A (en) * | 2020-12-22 | 2021-04-06 | 无锡日月合金材料有限公司 | Brazing filler metal for multistage brazing of vacuum device and preparation method thereof |
-
2001
- 2001-12-21 JP JP2001390150A patent/JP2002361478A/en active Pending
-
2002
- 2002-03-07 CN CN 02106267 patent/CN1196563C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005209578A (en) * | 2004-01-26 | 2005-08-04 | Neis Co Ltd | Vacuum circuit breaker and brazing material |
| JP2009113089A (en) * | 2007-11-07 | 2009-05-28 | Toshiba Corp | Bonding materials for vacuum valves |
| JP2009283313A (en) * | 2008-05-22 | 2009-12-03 | Toshiba Corp | Joining material for vacuum bulb |
| JP7550074B2 (en) | 2021-02-15 | 2024-09-12 | シチズンファインデバイス株式会社 | Method for manufacturing a fluid spray plate and a fluid spray plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1377753A (en) | 2002-11-06 |
| CN1196563C (en) | 2005-04-13 |
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