JP2000141078A - Leadless solder - Google Patents
Leadless solderInfo
- Publication number
- JP2000141078A JP2000141078A JP11054716A JP5471699A JP2000141078A JP 2000141078 A JP2000141078 A JP 2000141078A JP 11054716 A JP11054716 A JP 11054716A JP 5471699 A JP5471699 A JP 5471699A JP 2000141078 A JP2000141078 A JP 2000141078A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead
- glass
- ceramics
- free solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 22
- 239000000463 material Substances 0.000 abstract description 16
- 239000000919 ceramic Substances 0.000 abstract description 14
- 239000000203 mixture Substances 0.000 abstract description 11
- 239000000853 adhesive Substances 0.000 abstract description 6
- 230000001070 adhesive effect Effects 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 5
- 238000002844 melting Methods 0.000 abstract description 5
- 230000008018 melting Effects 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 231100000956 nontoxicity Toxicity 0.000 abstract description 2
- 230000007423 decrease Effects 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 9
- 239000005357 flat glass Substances 0.000 description 9
- 239000010949 copper Substances 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910018137 Al-Zn Inorganic materials 0.000 description 1
- 229910018573 Al—Zn Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910009071 Sn—Zn—Bi Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、低温で作業可能な
セラミックス、ガラス等の酸化物材料接合用の無鉛ハン
ダに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead-free solder for joining oxide materials such as ceramics and glass which can be operated at a low temperature.
【０００２】[0002]
【従来の技術】従来、セラミックス、ガラス等の酸化物
材料のハンダ付けのために、予め金メッキ、銅メッキ、
ニッケルメッキ等の電気メッキおよび無電解メッキを行
う方法は周知であるが、メッキ面に対するハンダ付けは
高価、複雑であり、より経済的にハンダ付けを行うこと
が要望されている。2. Description of the Related Art Conventionally, gold plating, copper plating, and the like have been used for soldering oxide materials such as ceramics and glass.
Methods for performing electroplating such as nickel plating and electroless plating are well known, but soldering to a plated surface is expensive and complicated, and there is a demand for more economical soldering.
【０００３】この要望に応えるべく、例えば特公昭４９
−２２２９９号公報や特公昭５２−２１９８０号公報に
は、ガラス、セラミックスに直接ハンダ付けできるＰｂ
−Ｓｎ系ハンダについて開示されている。[0003] In order to meet this demand, for example,
Japanese Patent Publication No. 22299 and Japanese Patent Publication No. 52-21980 disclose Pb that can be directly soldered to glass and ceramics.
-Sn-based solder is disclosed.
【０００４】しかし、鉛は毒性の強い金属であり、近
年、鉛の健康・環境への影響が懸念され、生態系への悪
影響や汚染が問題視されつつあり、ハンダを無鉛化する
動きが急速に広まりつつある。[0004] However, lead is a highly toxic metal. In recent years, there has been a concern that lead will have an effect on health and the environment, adverse effects on ecosystems and pollution have been regarded as problems, and there has been a rapid movement to lead-free solder. Is spreading.
【０００５】[0005]
【発明が解決しようとする課題】上記した特公昭４９−
２２２９９号公報に開示されているハンダは、ガラス、
セラミックス等の酸化物膜材料へ直接ハンダ付け可能な
Ｐｂ−Ｓｎ−Ｃｄ−Ｓｂハンダであるが、このハンダは
有害物質の鉛を含有しているため、これらのハンダを用
いた製品の廃棄物が酸性雨にさらされると鉛が大量に溶
出し、その毒性は非常に深刻な問題となる。[Problems to be solved by the invention]
The solder disclosed in Japanese Patent No. 22299 is glass,
Pb-Sn-Cd-Sb solder that can be directly soldered to oxide film materials such as ceramics. However, since this solder contains lead, a harmful substance, waste of products using these solders is low. When exposed to acid rain, a large amount of lead is eluted, and its toxicity becomes a very serious problem.
【０００６】また、上記した特公昭５２−２１９８０号
公報に開示されたハンダは、ガラス、セラミックス等の
酸化物材料の接合に使用可能な稀土類金属含有ハンダで
あるが、このハンダも主成分は鉛であり、同様の問題を
有している。The solder disclosed in Japanese Patent Publication No. 52-21980 is a rare earth metal-containing solder that can be used for joining oxide materials such as glass and ceramics. It is lead and has similar problems.
【０００７】一方、無鉛ハンダとしては、主に電子部品
実装用として盛んに研究がなされている。例えば、特開
平９−３２６５５４号公報にはＳｎ−Ａｇ−Ｉｎハンダ
について開示されており、また特開平８−１６４４９５
号公報にはＳｎ−Ｚｎ−Ｂｉハンダについて開示されて
いるが、いずれもガラス、セラミックス等の酸化物材料
に対するハンダ付けにおいては、ハンダの接合強度が十
分ではないという問題点を有している。On the other hand, lead-free solder has been actively studied mainly for mounting electronic components. For example, JP-A-9-326554 discloses a Sn-Ag-In solder, and JP-A-8-164495.
In this publication, Sn-Zn-Bi solder is disclosed, but all of them have a problem that soldering strength is not sufficient in soldering an oxide material such as glass and ceramics.
【０００８】さらに、金属酸化物に対してハンダ付け可
能な無鉛ハンダとして、例えば特公昭５５−３６０３２
号公報にはＳｎ−Ａｇ−Ａｌ−Ｚｎハンダについて開示
されているが、被接合体として金属を選択しているた
め、熱膨張係数の大きく異なるガラス、セラミックス等
の酸化物材料に対して使用した場合に、剥離し易いとい
う問題点を有している。Further, as a lead-free solder which can be soldered to a metal oxide, for example, Japanese Patent Publication No. 55-36032
The publication discloses Sn-Ag-Al-Zn solder, but since a metal is selected as an object to be joined, it is used for oxide materials such as glass and ceramics which have significantly different coefficients of thermal expansion. In this case, there is a problem that it is easy to peel off.
【０００９】本発明は上記従来の実状に鑑みてなされた
ものであって、有害物質の鉛を含まず、ガラス、セラミ
ックス等の酸化物材料に対して十分な接合強度を有する
無鉛ハンダを提供することを目的とする。The present invention has been made in view of the above-mentioned conventional situation, and provides a lead-free solder that does not contain lead, which is a harmful substance, and has sufficient bonding strength to oxide materials such as glass and ceramics. The purpose is to:
【００１０】[0010]
【課題を解決するための手段】本発明は、ガラス、セラ
ミックス等の酸化物を接合するためになされたものであ
って、Ｓｎを主成分とするハンダにＡｌ、Ｉｎ、Ａｇ、
Ｃｕ、Ｚｎを含有する組成としたものである。SUMMARY OF THE INVENTION The present invention has been made to join oxides such as glass and ceramics.
The composition contains Cu and Zn.
【００１１】すなわち、本発明の無鉛ハンダは重量％で
表示して、０．０１〜３．０％のＡｌ、０．１〜５０％
のＩｎ、０．１〜６．０％のＡｇ、０〜６．０％のＣ
ｕ、０〜１０．０％のＺｎおよび残部がＳｎからなるこ
とを特徴とする。That is, the lead-free solder of the present invention is expressed in terms of% by weight, such as 0.01 to 3.0% Al, 0.1 to 50%
In, 0.1-6.0% Ag, 0-6.0% C
u, 0 to 10.0% of Zn and the balance Sn.
【００１２】ここで、本発明の無鉛ハンダは、その成分
として、０．０１〜１．０％のＡｌを含有することが好
ましい。Here, it is preferable that the lead-free solder of the present invention contains 0.01 to 1.0% of Al as a component thereof.
【００１３】また、本発明の無鉛ハンダは、その成分と
して、０．１〜３０％のＩｎを含有することが好まし
い。Further, the lead-free solder of the present invention preferably contains 0.1 to 30% of In as a component thereof.
【００１４】さらに、本発明の無鉛ハンダは、その成分
として、０．１〜３．５％のＡｇを含有することが好ま
しい。Further, the lead-free solder of the present invention preferably contains 0.1 to 3.5% of Ag as a component thereof.
【００１５】さらに、本発明の無鉛ハンダは、その成分
として、０．１〜１．０％のＣｕを含有することが好ま
しい。Further, the lead-free solder of the present invention preferably contains 0.1 to 1.0% of Cu as a component thereof.
【００１６】さらに、本発明の無鉛ハンダは、その成分
として、０．０１〜７．０％のＺｎを含有することが好
ましい。Further, the lead-free solder of the present invention preferably contains 0.01 to 7.0% of Zn as a component thereof.
【００１７】また、本発明の無鉛ハンダは、Ｓｂ、Ｔ
ｉ、ＳｉまたはＢｉのうちから選択される１種類以上の
元素を合計１０％以下の範囲で含有することが好まし
い。Further, the lead-free solder of the present invention comprises Sb, T
It is preferable that one or more elements selected from i, Si and Bi are contained in a total amount of 10% or less.
【００１８】以下に、本発明の無鉛ハンダの組成限定理
由について説明する。但し、以下の組成は重量％で表示
したものである。The reasons for limiting the composition of the lead-free solder of the present invention will be described below. However, the following compositions are expressed by weight%.
【００１９】Ｓｎは毒性がなく、被接合体に対する濡れ
を得るという作用を有するため、ハンダには必須の成分
である。Since Sn has no toxicity and has an effect of obtaining wettability to an object to be joined, it is an essential component for solder.
【００２０】Ａｌは、非常に酸化され易い元素である
が、酸化物との接合においては結合をつくり易いという
利点がある。Ａｌ添加量が０．０１％未満ではその効果
が低く、３．０％を超えるとハンダ自身の硬さが増し、
耐ヒートサイクル性を確保するのが難しいとともに融点
が高く、作業性が悪化する。より好ましい添加量は、
０．０１〜１．０％の範囲である。Al is an element which is very easily oxidized, but has an advantage that it is easy to form a bond in bonding with an oxide. If the amount of Al added is less than 0.01%, the effect is low, and if it exceeds 3.0%, the hardness of the solder itself increases,
It is difficult to ensure heat cycle resistance and the melting point is high, resulting in poor workability. A more preferable addition amount is
It is in the range of 0.01 to 1.0%.
【００２１】Ｉｎはハンダの融点を低下させるばかりで
なく、濡れ性を向上させ、ハンダ自身を柔らかくすると
いう作用を有する。Ｉｎ添加量が０．１％未満ではその
効果が低く、５０％を超えると逆にハンダ自身の強度確
保が困難となるだけでなく、コスト的にもかなり高価と
なる。より好ましい添加量の範囲は、０．１〜３０％で
ある。In has an effect of not only lowering the melting point of the solder, but also improving the wettability and softening the solder itself. If the In content is less than 0.1%, the effect is low, and if it exceeds 50%, it becomes difficult to secure the strength of the solder itself, and the cost becomes considerably high. A more preferable range of the addition amount is 0.1 to 30%.
【００２２】Ａｇは添加することによりハンダの機械的
強度の向上に優れた効果を発揮する。Ａｇ添加量が０．
１％未満ではその効果が低く、機械的強度の向上が得ら
れず、６．０％を超えると融点が高くなるとともにＳｎ
との金属間化合物が多量に発生し、機械的強度が逆に低
下することが問題となる。より好ましい添加量の範囲
は、０．１〜３．５％である。Ag is effective in improving the mechanical strength of the solder when added. When the amount of Ag added is 0.
If it is less than 1%, the effect is low, and improvement in mechanical strength cannot be obtained. If it exceeds 6.0%, the melting point is increased and Sn is increased.
A large amount of the intermetallic compound is generated, and the mechanical strength is disadvantageously reduced. A more preferable range of the addition amount is 0.1 to 3.5%.
【００２３】Ｃｕは上記したＡｇと同様に、添加するこ
とによりハンダの機械的強度の向上に優れた効果を発揮
する。Ｃｕ添加量が６．０％を超えるとＡｇと同様に融
点が高くなるとともにＳｎとの金属間化合物が多量に発
生し、機械的強度が逆に低下することが問題となる。よ
り好ましい添加量の範囲は、０．１〜１．０％である。Cu, like Ag, exhibits an excellent effect of improving the mechanical strength of the solder when added. If the added amount of Cu exceeds 6.0%, the melting point becomes high as in the case of Ag, and a large amount of intermetallic compounds with Sn is generated. A more preferable range of the addition amount is 0.1 to 1.0%.
【００２４】Ｚｎはガラス、セラミックス等の酸化物材
料に対する接着力を付与するためにハンダに添加され
る。Ｚｎ添加量が１０．０％を超えるとハンダが脆くな
る傾向が顕著となり、実用上好ましくない。より好まし
い添加量の範囲は、０．０１〜７．０％であり、さらに
望ましい範囲は０．５〜５．０％である。Zn is added to the solder to provide an adhesive force to oxide materials such as glass and ceramics. If the amount of Zn exceeds 10.0%, the solder tends to be brittle, which is not practically preferable. A more preferable range of the addition amount is 0.01 to 7.0%, and a still more preferable range is 0.5 to 5.0%.
【００２５】本発明の無鉛ハンダにおいては、Ｓｂ、Ｔ
ｉ、ＳｉまたはＢｉのうち１種類以上の元素を１０％以
下の範囲で適宜添加することができる。Ｓｂはハンダ付
け外観を良好にし、クリープ抵抗を増大させる。Ｔｉ、
Ｓｉ、Ｂｉはハンダの濡れ性を改善させることができ
る。また、その他Ｆｅ、Ｎｉ、Ｃｏ、Ｇａ、Ｇｅ、Ｐな
どの元素を微量添加してもハンダとしての特性、すなわ
ち無鉛の他、ハンダ付け性および機械的強度を高めるこ
とできる。In the lead-free solder of the present invention, Sb, T
One or more elements of i, Si or Bi can be appropriately added in a range of 10% or less. Sb improves the soldering appearance and increases the creep resistance. Ti,
Si and Bi can improve the wettability of the solder. In addition, even if a small amount of an element such as Fe, Ni, Co, Ga, Ge, or P is added, the properties as solder, that is, lead-free, solderability and mechanical strength can be improved.
【００２６】なお、本発明の無鉛ハンダは、ガラス、セ
ラミックス等の酸化物材料の他、アルミニウム、チタ
ン、ジルコニウム等の酸化被膜を有する難ハンダ付け金
属に直接ハンダ付け可能である。また、難ハンダ付け材
料にハンダ付けする場合、ハンダ付けの際に、ハンダに
超音波振動を付加できるような装置を用いることが好ま
しい。It should be noted that the lead-free solder of the present invention can be directly soldered to a difficult-to-be-soldered metal having an oxide film such as aluminum, titanium and zirconium, in addition to oxide materials such as glass and ceramics. Also, when soldering to a difficult soldering material, it is preferable to use a device that can apply ultrasonic vibration to the solder at the time of soldering.
【００２７】[0027]
【発明の実施の形態】以下、本発明の実施形態を具体的
な実施例を挙げて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to specific examples.
【００２８】（実施例１〜１４）被接合材としてソーダ
石灰ガラス（５０×５０×３ｍｍ）を用い、その板ガラ
ス上に、表１、２に示した組成からなる無鉛ハンダを、
６０ｋＨｚの周波数でこて先が振動する超音波ハンダご
てを使用して溶解接着し、本実施例のサンプルを作成し
た。表中の組成は、いずれも重量％表示である。(Examples 1 to 14) Soda-lime glass (50 × 50 × 3 mm) was used as a material to be joined, and a lead-free solder having the composition shown in Tables 1 and 2 was placed on the plate glass.
An ultrasonic soldering iron whose tip vibrates at a frequency of 60 kHz was melt-bonded to prepare a sample of this example. All compositions in the table are expressed in weight%.
【００２９】板ガラスと無鉛ハンダの接着性の評価は、
板ガラス表面に接着された無鉛ハンダ層をナイフで削っ
た際の無鉛ハンダの剥離度合いにより行った。表１、２
中の接着性の欄において○印はハンダ層の半分以上が剥
離せずに板ガラス上に残留したもの、×印はハンダ層が
すべて剥離してしまったものである。The evaluation of the adhesion between the sheet glass and the lead-free solder is as follows.
The measurement was performed based on the degree of peeling of the lead-free solder when the lead-free solder layer adhered to the surface of the sheet glass was cut with a knife. Tables 1 and 2
In the column of adhesiveness in the middle, the mark ○ indicates that at least half of the solder layer remained on the plate glass without peeling, and the mark × indicates that the solder layer had completely peeled off.
【００３０】[0030]
【表１】 [Table 1]
【００３１】[0031]
【表２】 [Table 2]
【００３２】表１、２から明らかなように、本実施例の
サンプルは、請求項１に示されるようにＡｌ、Ｉｎ、Ｚ
ｎ、Ａｇ、Ｃｕ等の成分を適切に含有させることによ
り、ガラスとの接着強度を増大させるだけでなく、ハン
ダ自身の機械的強度、冷却時のガラス−ハンダ界面の歪
み緩和などハンダとガラスを強固に接着させるために必
要な種々の特性を有するため、ガラス同士をハンダで強
固に接合することができ、ハンダ付け後の衝撃等による
剥離の問題は何ら生じない。As is clear from Tables 1 and 2, the samples of the present embodiment were made of Al, In, Z
By appropriately containing components such as n, Ag, and Cu, not only increase the adhesive strength with the glass, but also the mechanical strength of the solder itself, the relaxation of the glass-solder interface during cooling, etc. Since it has various characteristics necessary for firm bonding, it is possible to firmly join the glasses with solder, and there is no problem of peeling due to impact after soldering.
【００３３】（比較例１ないし３）表２に、本発明に対
する比較例の組成と接着性を示す。組成は重量％表示で
ある。(Comparative Examples 1 to 3) Table 2 shows the composition and adhesiveness of Comparative Examples for the present invention. Compositions are given in weight percent.
【００３４】比較例１ないし３は、いずれもＡｌの添加
量が本発明の範囲外であり、さらに、比較例２、３はＩ
ｎの添加量が本発明の範囲外である。このため、比較例
の無鉛ハンダにおいては板ガラスとの接着強度が低く、
ハンダ層がすべて剥離してしまった。In Comparative Examples 1 to 3, the addition amount of Al was out of the range of the present invention in all cases.
The amount of n added is outside the scope of the present invention. For this reason, in the lead-free solder of the comparative example, the adhesive strength with the sheet glass is low,
All the solder layers have peeled off.
【００３５】（実施例１５〜２４）被接合材としてソー
ダ石灰ガラス（５０×５０×３ｍｍ）を用い、その板ガ
ラス上に、表３に示した組成からなる無鉛ハンダを、６
０ｋＨｚの周波数でこて先が振動する超音波ハンダごて
を使用して溶解接着し、本実施例のサンプルを作成し
た。表中の組成は、いずれも重量％表示である。(Examples 15 to 24) Soda-lime glass (50 × 50 × 3 mm) was used as a material to be joined, and a lead-free solder having the composition shown in Table 3 was placed on the sheet glass by 6%.
An ultrasonic soldering iron whose tip vibrates at a frequency of 0 kHz was melt-bonded to prepare a sample of this example. All compositions in the table are expressed in weight%.
【００３６】板ガラスとハンダの接着性の評価は、前記
実施例１〜１４の場合と同様に、板ガラス表面に接着さ
れたハンダ層をナイフで削った際の無鉛ハンダの剥離度
合いにより行った。表３中の接着性の欄において○印は
ハンダ層の半分以上が剥離せずに板ガラス上に残留した
もの、×印はハンダ層がすべて剥離してしまったもので
ある。The evaluation of the adhesion between the sheet glass and the solder was performed based on the peeling degree of the lead-free solder when the solder layer bonded to the surface of the sheet glass was scraped off with a knife, as in Examples 1 to 14. In the column of adhesiveness in Table 3, the mark ○ indicates that at least half of the solder layer did not peel off and remained on the plate glass, and the mark す べ て indicates that the solder layer had completely peeled off.
【００３７】[0037]
【表３】 [Table 3]
【００３８】表３から明らかなように、本実施例のサン
プルは、請求項１に示される成分の他、請求項７に示さ
れるような成分およびＦｅ、Ｎｉ、Ｃｏ、Ｇａ、Ｇｅ、
Ｐの微量添加成分を適切に添加することにより、ガラス
との接着強度を増大させるだけでなく、ハンダ自身の機
械的強度、冷却時のガラス−ハンダ界面の歪み緩和など
ハンダとガラスを強固に接着させるために必要な種々の
特性を有するため、ガラス同士をハンダで強固に接合す
ることができ、ハンダ付け後の衝撃等による剥離の問題
は何ら生じない。As can be seen from Table 3, the sample of the present embodiment has the components described in claim 7 as well as the components described in claim 7 and Fe, Ni, Co, Ga, Ge,
By properly adding a small amount of P, not only increases the adhesive strength with glass, but also the solder and glass firmly, such as the mechanical strength of the solder itself and the relaxation of the glass-solder interface during cooling. Since the glass has various characteristics necessary for the soldering, it is possible to firmly join the glasses with solder, and there is no problem of peeling due to an impact or the like after soldering.
【００３９】[0039]
【発明の効果】以上説明したように、本発明の無鉛ハン
ダは有害物質の鉛を含まず、請求項１に示される成分を
含有し、また請求項７に示されるような成分およびＦ
ｅ、Ｎｉ、Ｃｏ、Ｇａ、Ｇｅ、Ｐの微量添加成分を適切
に添加することにより、ガラスとの接着強度を増大させ
るだけでなく、ハンダ自身の機械的強度、冷却時のガラ
ス−ハンダ界面の歪み緩和などハンダとガラスなどの酸
化物材料を強固に接着させるために必要な種々の特性を
有するため、ガラス、セラミックス等の酸化物材料同士
をハンダで強固に接合することができ、しかもハンダ付
け後に剥離を生じ難いという優れた効果を有するもので
ある。As described above, the lead-free solder of the present invention does not contain lead, which is a harmful substance, and contains the components described in claim 1 and the components and F as described in claim 7.
e, Ni, Co, Ga, Ge, and P by appropriately adding a small amount of a component, not only increases the adhesive strength with glass, but also the mechanical strength of the solder itself, and the glass-solder interface at the time of cooling. Oxide materials such as glass and ceramics can be firmly joined together with solder because they have various characteristics required for firmly bonding solder and oxide materials such as glass, such as strain relaxation. It has an excellent effect that peeling hardly occurs later.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 中垣 茂樹 大阪府大阪市中央区道修町３丁目５番11号 日本板硝子株式会社内 (72)発明者 菅沼 克昭 大阪府茨木市美穂ヶ丘８番１号 大阪大学 産業科学研究所内 Ｆターム(参考） 4G026 BA02 BB33 BF11 BF13 BF24 BG02 4G061 CA02 CB12 CD12 DA24 DA42 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shigeki Nakagaki 3-5-11 Doshumachi, Chuo-ku, Osaka-shi, Osaka Inside Nippon Sheet Glass Co., Ltd. (72) Katsuaki Suganuma 8-1, Mihogaoka, Ibaraki-shi, Osaka No. Osaka University Research Institute for Industrial Science F-term (reference) 4G026 BA02 BB33 BF11 BF13 BF24 BG02 4G061 CA02 CB12 CD12 DA24 DA42
Claims (7)
のＡｌ、０．１〜５０％のＩｎ、０．１〜６．０％のＡ
ｇ、０〜６．０％のＣｕ、０〜１０．０％のＺｎ、およ
び残部がＳｎからなることを特徴とする無鉛ハンダ。1. 0.01 to 3.0% by weight%
Al, 0.1-50% In, 0.1-6.0% A
g, 0 to 6.0% Cu, 0 to 10.0% Zn, and the balance Sn.
のＡｌを含有する請求項１に記載の無鉛ハンダ。2. 0.01% to 1.0% by weight.
2. The lead-free solder according to claim 1, comprising: Al.
ｎを含有する請求項１または２に記載の無鉛ハンダ。3. An amount of 0.1 to 30% of I expressed in% by weight.
The lead-free solder according to claim 1, which contains n.
Ａｇを含有する請求項１ないし３のいずれかに記載の無
鉛ハンダ。4. The lead-free solder according to claim 1, which contains 0.1 to 3.5% of Ag, expressed in terms of% by weight.
０．１〜１．０％のＣｕを含有する請求項１ないし４の
いずれかに記載の無鉛ハンダ。5. The lead-free solder according to claim 1, which contains 0.1 to 1.0% by weight of Cu, expressed as% by weight.
のＺｎを含有する請求項１ないし５のいずれかに記載の
無鉛ハンダ。6. 0.01% to 7.0% by weight.
The lead-free solder according to any one of claims 1 to 5, further comprising:
たはＢｉのうちから選択される１種類以上の元素を合計
１０％以下の範囲で含有する請求項１ないし６のいずれ
かに記載の無鉛ハンダ。7. The method according to claim 1, wherein one or more elements selected from Sb, Ti, Si and Bi are contained in a range of 10% or less in terms of% by weight. Lead-free solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11054716A JP2000141078A (en) | 1998-09-08 | 1999-03-02 | Leadless solder |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10-253852 | 1998-09-08 | ||
| JP25385298 | 1998-09-08 | ||
| JP11054716A JP2000141078A (en) | 1998-09-08 | 1999-03-02 | Leadless solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000141078A true JP2000141078A (en) | 2000-05-23 |
Family
ID=26395521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11054716A Withdrawn JP2000141078A (en) | 1998-09-08 | 1999-03-02 | Leadless solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000141078A (en) |
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