JP2002344113A - Electronic circuit board and method of manufacturing electronic circuit board - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide an electronic circuit board capable of recording serial numbers and ID information at a low cost without labor and easily reading the recorded serial numbers and ID information. A module board according to the present invention includes a CPU for executing a predetermined function of the module board.
(Central Processing Unit) 11, a wiring area 12 having a wiring pattern 12a for recording a serial number or ID information as a product number of the module substrate 10, and a CP.
An interface circuit 13 that allows the wiring pattern 12a of the wiring region 12 to be referenced from U11, and a fixed wiring 14 that is drawn into the wiring region 12 from the interface circuit 13.
And

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board such as a module board having a predetermined function and a method of manufacturing the electronic circuit board, and more particularly to an electronic circuit for expressing a serial number, an ID number, etc. of the module board. The present invention relates to an electronic circuit board in which part or all of the electronic circuit board is wired by using an ink jet printer, and a method for manufacturing an electronic circuit board.

[0002]

2. Description of the Related Art FIG. 4 is a diagram showing a module board which is a conventional electronic circuit board and a method of manufacturing the same. In FIG. 4, a conventional module substrate 100 includes a CPU (Cent) for executing a predetermined function of the module substrate 100.
ral processing unit) 110 and a flash ROM (flash read only memory) 120 for recording a serial number or ID information which is a product number of the module substrate 100.
And an I / O (Input / Output) connector 130 for writing information to the FlashROM 120 from the outside.

FIG. 4 shows the module board 10.
0 to produce a serial number and ID information
The ID generation device 210 and the serial number and ID information generated by the serial number / ID generation device 210
A FlashROM writer 220 for recording in the shROM 120 is shown.

FIG. 5 is a flowchart showing a method of recording a serial number, which is a product number of the module substrate 100, and ID information in the FlashROM 120 of the module substrate 100, which is a conventional electronic circuit substrate.

In FIG. 4 and FIG.
Serial number and ID information which are the product numbers of FlashRO
When recording in M120, first, the serial number / ID generation device 210 generates a serial number and ID information (step 50).
1).

Next, the FlashROM writing device 2 connected to the I / O connector 130 of the module substrate 100
20, the serial number and ID information generated by the serial number / ID generation device 210 are stored in the FlashRO of the module substrate 100.
It is recorded in M120 (step 502).

As described above, the serial number, which is the product number of the module substrate 100, and the ID information are recorded in the FlashROM 120 of each module substrate 100.

[0008]

However, in the conventional electronic circuit board and the method of manufacturing the electronic circuit board, the F
There is a problem that the flash ROM 120 itself is expensive and costly.

Further, a FlashROM writing device 220 for writing information to the FlashROM 120,
There is a problem that the I / O connector 130 is required on the module substrate 100, which increases the cost.

The flash ROM writing device 2 connected to the I / O connector 130 of the module board 100
20, the serial number and ID information generated by the serial number / ID generation device 210 are stored in the FlashRO of the module substrate 100.
M120, it takes time to write to the FlashROM 120, and the I / O connector 130 and the Flash
There is a problem that it takes time to connect the shROM writing device 220.

[0011] Further, on the module substrate 100, Flash
A space for mounting the hROM 120 and the I / O connector 130 is required, and it is difficult to make the module substrate 100 compact.

Further, in order to refer to the information written in the Flash ROM 120, the module of the module
Information must be read from the ROM 120, which is troublesome.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic circuit board and an electronic circuit board which can record serial numbers and ID information at a low cost and can easily read the recorded serial numbers and ID information. Is to provide a method of manufacturing the same.

[0014]

In order to solve the above problems, an electronic circuit board according to the present invention is an electronic circuit board having a predetermined function and having a wiring pattern corresponding to a predetermined product number or ID number. A wiring area and an interface circuit for detecting a wiring pattern in the wiring area are provided, and the wiring pattern is formed by being printed on the wiring area by an inkjet printer.

Further, the wiring pattern can be formed by printing on the wiring area with metal particles coated with an organic material by an ink jet printer.

Further, the wiring pattern may be formed by printing the wiring region with metal particles coated with an organic material by an ink-jet printer, and firing at a predetermined temperature and time.

According to another aspect of the present invention, there is provided a method of manufacturing an electronic circuit board having a predetermined function.
(A) A wiring pattern corresponding to a predetermined product number or ID number is generated, and (B) a wiring pattern is printed and formed on a predetermined area of the electronic circuit board.

Here, in the step (B), the wiring pattern may be formed by printing on a predetermined area of the electronic circuit board by an ink jet printer.

In the step (B), the wiring pattern is printed on a predetermined area of the electronic circuit board with metal particles coated with an organic material by an ink jet printer, and baked at a predetermined temperature and time to form the wiring pattern. Can be formed.

Since a wiring pattern corresponding to a predetermined product number or ID number is formed by an ink-jet printer, serial numbers and ID information are recorded at a low cost without trouble, and the recorded serial numbers and ID information can be easily recorded. Can be read out.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of an electronic circuit board and a method of manufacturing an electronic circuit board according to the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing a module substrate, which is an electronic circuit substrate of the present invention, and a method for manufacturing the same. In FIG. 1, a module substrate 10 of the present invention includes a CPU (Centra) for executing predetermined functions of the module substrate 10.
l Processing Unit) 11 and the module substrate 10
A wiring area 12 having a wiring pattern 12a for recording a serial number or ID information, which is a product number, an interface circuit 13 that allows the CPU 11 to refer to the wiring pattern 12a of the wiring area 12, and a wiring area 12 And a fixed wiring 14 that is drawn into the wiring 12.

FIG. 1 shows this module substrate 10.
To produce a serial number and ID information to manufacture
A D generation device 21 and a wiring printer 22 that prints a wiring pattern 12a indicating a serial number and ID information generated by the serial number / ID generation device 21 on the wiring region 12 of the module substrate 10 are shown.

FIG. 2 is a flowchart showing a method for recording a serial number, which is a product number of the module substrate 10, and ID information in the wiring area 12 of the module substrate 10, which is an electronic circuit substrate of the present invention.

In FIG. 1 and FIG.
When recording the wiring pattern 12a indicating the serial number or ID information which is the product number of 0 in the wiring area 12, first, the serial number
A serial number and ID information are generated by the ID generation device 21 (step 201).

Next, the serial number / ID generation device 21 generates a wiring pattern 12a according to the generated serial number and ID information, and transfers the wiring pattern 12a to the wiring printer 22 (step 202). Here, the serial number / ID generation device 21 transmits the generated serial number and ID information to the direct wiring printer 2.
2, and the wiring pattern 12a may be generated by the wiring printer 22.

FIG. 3 is a diagram showing a method of generating the wiring pattern 12a by the wiring printer 22. here,
The wiring pattern 12a is printed on the insulator 31 in the wiring area 12 by the wiring printer 22 (Step 203).
Here, the inkjet nozzle 22 of the wiring printer 22
a, an ink solvent 34 containing a predetermined granular metal, such as gold or silver or copper, whose surface is coated with an organic material 32, is injected onto the insulator 31, and a predetermined wiring pattern 12a is formed in the wiring region 12a. It is formed by printing on top.

Next, the metal 3 is fired at a predetermined temperature and time according to the type of the organic material 32 and the metal 33.
By burning the organic material 32 covering 3 and binding the metal particles, the conductive wiring pattern 12a can be obtained (step 204).

In this manner, the wiring pattern 12a is formed in the wiring area 12 of the module substrate 10, and the fixed wiring 14 is drawn into the wiring area 12 from the interface circuit 13 in advance.
2a (step 205).

The electronic circuit board and the method of manufacturing the electronic circuit board according to the present invention have been described above.
Via the interface circuit 13 and the fixed wiring 14, C
The wiring state can be detected from devices such as the PU 11 on the module substrate 10.

In the above description, the wiring pattern 12a
The interface circuit 13 is mounted to make the state of the I / O port appear as an I / 0 port.
The wiring pattern 12a may be read directly from the PU 11.

When the printed wiring pattern 12a is heated for firing, if only the wiring region 12 is locally heated by a method such as laser beam irradiation, the mounted components and the substrate may be damaged. There is no.

In the present invention, the wiring pattern 1
In addition to printing 2a, it is also possible to print an ID or a serial number or a barcode at the same time, so that management in mass-producing boards becomes very easy.

In the above description, information is recorded according to the connection state of the terminals of the fixed wiring 14. However, coasting information is recorded by using a change in capacitance or a change in resistance value caused by changing the wiring pattern 12a. You can also.

[0035]

As described above, according to the electronic circuit board and the method of manufacturing the electronic circuit board of the present invention, a predetermined wiring pattern is formed by an ink jet printer,
It is possible to detect the wiring status from devices on the module board such as, so that IDs and serial numbers can be printed and bar codes can be printed. It has become very easy to do.

Further, according to the present invention, since a FlashROM is not required, a connector for writing is not required on the substrate, so that the mounting area and the cost can be reduced.

In addition, since it is not necessary to connect a writing device for writing information to a substrate and a wiring pattern can be drawn in a non-contact manner, information can be recorded quickly and easily.

Furthermore, since the wiring pattern to be printed is small, the printing time is only several milliseconds, and the numbers and symbols representing the information of the printing pattern can be printed at the same time, so that the management becomes very easy.

[Brief description of the drawings]

FIG. 1 is a view showing a module substrate which is an electronic circuit substrate of the present invention and a method for manufacturing the same.

FIG. 2 is a module board 1 which is an electronic circuit board of the present invention.
9 is a flowchart illustrating a method of recording a serial number, which is a product number of a module substrate, and ID information in a wiring area of zero.

FIG. 3 shows a wiring pattern 12a by a wiring printer 22;
FIG. 6 is a diagram showing a method of generating a.

FIG. 4 is a diagram showing a module board which is a conventional electronic circuit board and a method of manufacturing the same.

FIG. 5 shows a module board 10 which is a conventional electronic circuit board.
9 is a flowchart illustrating a method of recording a serial number, which is a product number of the module substrate 100, and ID information in the FlashROM 120 of No. 0.

[Explanation of symbols]

 10, 100 Module board 11, 110 CPU 12 Wiring area 12a Wiring pattern 13 Interface circuit 14 Fixed wiring 21, 210 Serial number / ID generator 22 Wiring printer 22a Inkjet nozzle 31 Insulator 32 Organic material 33 Metal 34 Solvent 120 FlashROM 130 I / O connector

Claims (6)

[Claims] An electronic circuit board having a predetermined function, comprising: a wiring area having a wiring pattern corresponding to a predetermined product number or an ID number; and an interface circuit for detecting the wiring pattern in the wiring area. And an electronic circuit board, wherein the wiring pattern is formed by being printed on the wiring area by an inkjet printer. 2. The wiring pattern according to claim 1, wherein the wiring pattern is formed by printing on the wiring area with metal particles coated with an organic material by an inkjet printer.
An electronic circuit board according to any one of the preceding claims. 3. The wiring pattern according to claim 1, wherein the wiring pattern is printed on the wiring area with metal particles coated with an organic material by an ink jet printer, and baked at a predetermined temperature and time. Electronic circuit board. 4. A method of manufacturing an electronic circuit board for manufacturing an electronic circuit board having a predetermined function, comprising: (A) generating a wiring pattern corresponding to a predetermined product number or ID number;
(B) The method for manufacturing an electronic circuit board, wherein the wiring pattern is formed by printing on a predetermined area of the electronic circuit board. 5. The electronic circuit board according to claim 4, wherein in the step (B), the wiring pattern is formed by printing on the predetermined area of the electronic circuit board by an inkjet printer. Production method. 6. The step (B) includes printing the wiring pattern on the predetermined area of the electronic circuit board with metal particles coated with an organic material by an ink-jet printer, and baking the wiring pattern at a predetermined temperature and time. 5. The method for manufacturing an electronic circuit board according to claim 4, wherein the wiring pattern is formed by a method.