JP2002279380A - IC card recording medium and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: IC card without delamination, especially non-contact I with an antenna based on polyethylene terephthalate
Provided is a non-contact IC card recording medium which is compatible with a C module base, has high reliability, and has good durability. Kind Code: A1 A substrate A13 made of at least a thermoplastic polymer resin, a non-contact IC module substrate 14 with an antenna made of polyethylene terephthalate as a base, and a substrate B15 made of a thermoplastic polymer resin are sequentially laminated and integrated. In the IC card, an IC integrated between the base materials A and B and an IC module base with an antenna via adhesive layers 16a and 16b that exhibit adhesiveness by heating.
Card recording medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a recording medium for an IC card, particularly a non-contact IC card, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, in the fields of credit cards, ID cards, cash cards, and the like, an IC module including a semiconductor memory such as a microprocessor, a RAM, and a ROM is mounted on a card material as a card instead of a magnetic card. A so-called IC card has been developed because of its extremely large information recording capacity and high security. In such IC card recording media, there are two types of recording media, a contact type IC card and a non-contact type IC card, depending on the method of accessing the terminal. When the contact type IC card recording medium communicates with the terminal, it is necessary to match the contact of the recording medium with the contact of the terminal and make contact with each other, so that the communication work is troublesome and the communication speed is slow. Further, since the contacts of the recording medium are exposed on the surface of the recording medium, there is a disadvantage that the contacts are soiled and easily broken. On the other hand, since the non-contact IC card recording medium communicates information with the terminal using electromagnetic coupling, electromagnetic induction, or microwave, it has no contact. Therefore, communication work is easy,
There is no worry that the contacts will be broken and communication will not be possible.
For this reason, non-contact IC card recording media have been actively developed recently.

[0003] As a method of manufacturing this kind of IC card, there are an adhesive filling method using an adhesive such as a liquid adhesive and a hot melt adhesive, a resin injection molding method using an injection molding machine, and a thermoplastic high-pressure method. There is a thermal lamination method using a substrate made of molecules. Each of these methods has advantages and disadvantages, and is selectively used depending on the scale of card production, card specifications, and required physical properties, and produces a contactless IC card.

[0004] In particular, the thermal laminating method has attracted attention because it is close to the conventional methods for manufacturing credit cards and cash cards, and can use a part of the conventional card manufacturing apparatus and technology. In the thermal lamination method, a base material made of a thermoplastic polymer resin, an inlet made of an antenna and an IC module, and a base material made of a thermoplastic polymer resin are sequentially laminated, and laminated by applying heat and pressure. And cut into a card to produce a non-contact IC card.

[0005] The IC inlet composed of an antenna and an IC module is formed by connecting a molded IC module or an IC bare chip to terminals of a winding antenna, a metal thin film etching antenna, and a conductive ink printed antenna. Since an inexpensive and highly functional non-contact IC card recording medium can be mass-produced, it is preferable to use an antenna substrate on which an etching antenna is formed, and an IC module or an IC bare chip is connected and mounted on an etching antenna terminal on the antenna substrate. In many cases, an IC module substrate with an antenna is used for card production. A substrate made of a heat-resistant material, for example, PE as the antenna substrate
It can be formed on a T substrate, a glass epoxy substrate, a polyimide substrate, or the like, and can be used as an IC module substrate with an antenna. However, in order to reduce manufacturing costs, it is preferable to use a PET (polyethylene terephthalate) substrate. Furthermore, in order to maintain the adhesive strength between the PET substrate and the antenna metal thin film, a curable adhesive may be provided between the PET substrate and the antenna metal thin film. After the metal thin film is corroded by the chemical etching method and patterned into the shape of the antenna, the cured film of the curable adhesive is exposed at the trace of the corroded metal thin film.

A non-contact I obtained by laminating a thermoplastic substrate A and a substrate B on the upper and lower sides of such an IC module substrate with an antenna and performing thermal lamination, respectively.
In the C card recording medium, the adhesive strength between the antenna substrate and the substrates A and B is weak, and delamination of the card recording medium may occur. Therefore, the reliability and durability as an information recording medium are impaired.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is an IC card which does not cause delamination, especially a non-contact IC module base having an antenna made of polyethylene terephthalate as a base material. It is an object of the present invention to provide a method for manufacturing a non-contact IC card recording medium having high reliability, high durability and high reliability at low cost.

[0008]

That is, the invention according to claim 1 relates to a card formed by laminating different resin card base materials, which are integrated via an adhesive layer which exhibits adhesiveness by heating. This is a featured IC card recording medium.

The invention according to claim 2 provides a substrate A made of at least a thermoplastic polymer resin, a non-contact IC module substrate with an antenna made of polyethylene terephthalate as a substrate, and a substrate B made of a thermoplastic polymer resin. Are sequentially laminated and integrated, wherein the base material A and the base material B and the IC module base with the antenna are integrated via an adhesive layer that exhibits adhesiveness by heating. It is an IC card recording medium.

According to a third aspect of the present invention, the adhesive layer which exhibits adhesiveness by heating is a one-part thermosetting adhesive in which a functional group is blocked and a blocking agent is released by heat. An IC card recording medium according to claim 1 or claim 2.

According to a fourth aspect of the present invention, as the adhesive layer, the one-part thermosetting adhesive in which the functional group is blocked and the blocking agent is dissociated by heat has a crosslinking initiation temperature of 50%.
The temperature is in the range of 1 to 150 ° C.
3. The IC card recording medium according to any one of 3.

According to a fifth aspect of the present invention, in the IC card recording medium according to any one of the first to fourth aspects, the thickness of the adhesive layer is 0.3 μm to 10 μm. It is.

According to a sixth aspect of the present invention, there is provided an adhesive layer comprising a one-component thermosetting adhesive in which a base material A made of at least a thermoplastic polymer resin and a functional group is blocked and a blocking agent is released by heat. A non-contact IC module base with an antenna based on polyethylene terephthalate, an adhesive layer made of a one-component thermosetting adhesive in which a functional group is blocked and a blocking agent is dissociated by heat, and a group made of a thermoplastic polymer resin A non-contact IC card in which a material B is successively laminated and integrated, wherein the non-contact IC card is processed by performing heat lamination by heating and pressing using a hot press as a lamination and integration method. This is a method for manufacturing a card recording medium.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION As a one-pack type thermosetting adhesive which exhibits adhesiveness by heating as described above, an isocyanate group is replaced with a phenol group or another hydroxyl group (alcohol, β-diketone) as shown in the example of Chemical Formula 1. , An amine), etc., to form a urethane structure, which has an extremely stable structure at room temperature, does not react with water, polyol, etc., and loses its function as an adhesive. When this adhesive is heated,
Since the urethane structure in which the isocyanate group and the phenol group have reacted decomposes to regenerate the isocyanate, the adhesiveness is developed by heating.

[0015]

Embedded image

For example, trimethylpropane of formula 1
By blocking 1-methyl-2-isocyan-4-carbamate with a phenol and an isocyanate group which is a functional group, stability to moisture is improved. Therefore, it can be processed into an emulsion adhesive. After the adhesive is applied, the solvent is evaporated and heated to about 140 ° C. or higher, so that the urethane structure is decomposed, the diisocyanate is regenerated, and the adhesive functions.

The stabilization of the isocyanate group (functional group) is called blocking, and phenol serves as a blocking agent. As other blocking agents for isocyanate, acetoacetic ester, cyclohexanone oxime, thiophenol, aliphatic alcohol and the like are used.

By using an adhesive exhibiting adhesiveness by this heat, lamination can be performed without concern for pot life when an IC card is produced.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings. 1A and 1B are configuration diagrams of a non-contact IC card recording medium according to one embodiment of the present invention, wherein FIG. 1A is an external view and FIG. 1B is a cross-sectional view taken along a line XX. The non-contact IC card recording medium (10) of the present invention shown in FIG. 1 includes a base material A (13), an IC module base with an antenna (14), and a base material B (15).
And an adhesive layer (16) between the IC module substrate (14) and the substrate A (13) and the substrate B (14).
a, 16b) and a printed layer (17) on a base material. The IC module base (14) is provided with an IC module (11) and an antenna circuit (12).

Next, each configuration will be described. Substrate A
(13) and the base material B (15) are thermoplastic polymer resins having strength, for example, PET (polyethylene terephthalate), polyvinyl chloride, polyester, polycarbonate, polymethacrylmethyl, polystyrene, polylactic acid,
Polycaprolactone, poly (3-hydroxybutyrate-
Synthetic resins such as 3-hydroxyvalerate) and polyvinyl alcohol, simple resins of natural resins, and composites, alloys, and blends of these resins or modified resins alone or in combination can be used. Further, these resins alone, composites, alloys, and blends can be modified by adding pigments, dyes, surfactants, and the like.

The substrate A (13) and the substrate B (1
A printing layer (17) such as ID information and a picture design is provided on one entire surface or one surface of 5). In order to improve the adhesiveness between the base material and the printed layer, the surface of the base material may be subjected to an easy adhesion treatment, for example, a corona discharge treatment, a plasma treatment, a resin coating, or the like. Further, another functional thin film layer, for example, a protective layer, a magnetic recording layer, a visible recording layer, or the like may be provided on the entire surface or a part of the surface of the base material or the surface of the printing layer.

Adhesion layer (16a, 1) of base material A (13) and base material B (15) and non-contact IC module base (14) with an antenna made of polyethylene terephthalate
As 6b), an adhesive composed of a one-component thermosetting adhesive in which a functional group is blocked and a blocking agent is dissociated by heat is used.

In general, there are a thermosetting adhesive and a thermoplastic adhesive as adhesives, but a curable adhesive used between an antenna metal thin film and an antenna substrate on a non-contact IC module substrate with an antenna. Since the cured film is exposed, the thermoplastic adhesive does not provide sufficient adhesive strength with the cured film of the curable adhesive, so a thermosetting adhesive is used.

The thermosetting adhesive basically includes a two-part curing type adhesive and a one-part curing type adhesive. Two-part curable adhesives include, for example, two-part urethane adhesive, epoxy adhesive, amino adhesive, etc., but the reaction starts after mixing the two parts,
If the coating is not performed immediately and the lamination is not performed, the function of the adhesive is lost. As a one-part curable adhesive,
There are a moisture-curable urethane adhesive, a light-curable adhesive and the like. However, in the case of a moisture-curable urethane adhesive, there is a problem of reaction gas generation as the reaction progresses. There is a need issue. Therefore, these problems are solved by using a one-component thermosetting adhesive in which a functional group is blocked and a blocking agent is dissociated by heat as an adhesive layer as in the present invention. By applying heat,
Since adhesiveness is developed, in the lamination process,
There is no need to consider pot life.

Further, if the dissociation start temperature of the blocking agent, that is, the reaction start temperature of the adhesive is high, the pot life of the adhesive is prolonged, but the heating temperature for inducing a cross-linking reaction is increased, and the shape of the recording medium is reduced It will have an effect. The present invention sets the cross-linking initiation temperature of a one-component thermosetting adhesive having a blocked functional group at 50 ° C. to 150 ° C., so that the reaction does not proceed during processing of the recording medium, The substrate A (13) and the substrate B (15) can be bonded to the antenna-equipped IC module substrate (14) without affecting the shape of the IC module.

Further, by setting the crosslinking initiation temperature within the above range, a crosslinking reaction can be caused by the heat of the lamination during lamination thermal lamination of the recording medium. Therefore, it is not necessary to increase the number of heating steps for the crosslinking reaction.

The functional group described in the present invention is blocked,
One-part thermosetting adhesives that release the blocking agent due to heat include adhesives composed of blocked isocyanate and polyol, adhesives having floc-type carboxyl groups and epoxy groups, cyclocarbonate groups (epoxy groups are blocked) and carboxyl groups. An adhesive containing a group, an adhesive containing a ship base (blocking of an amino group) and an isocyanate group or an epoxy group can be used.

The adhesive layer is composed of the substrate A (13) and the substrate B (1
What is necessary is just to form on the surface of 5) using the conventional coating and printing method. For example, a coating method using a roll coater or a gravure coater, a printing method using screen printing, offset printing, or the like can be used. The thickness of the adhesive layer is preferably provided in the range of 0.3 μm to 10 μm. If the adhesive layer is too thin, the adhesive strength will be reduced, and if the adhesive layer is too thick, cohesive failure of the adhesive layer may occur.

IC module board with antenna (14)
As the antenna substrate, a PET (polyethylene terephthalate) base material is used. A metal thin film is adhered to the upper and lower sides of the PET substrate via a thermosetting adhesive. As a bonding method, for example, a dry lamination method using a two-component urethane adhesive may be used. As the metal thin film, an inexpensive metal having high conductivity and good corrosion resistance may be used. For example, an aluminum thin film or a copper thin film may be used. The antenna and the connection terminals are formed on the PET base material on which the metal thin film is laminated by chemical etching to form an antenna substrate. Further, in order to prevent corrosion of the antenna, a metal surface may be subjected to rust prevention treatment.

As an IC module, an IC chip on which an electric circuit is formed is mounted on an antenna substrate by a known bare chip mounting method, and is connected to an antenna or formed.
The chip is mounted on a chip mounting board by a known mounting method, resin-molded, and then mounted on the antenna board,
It is formed by connecting to an antenna. To improve the reliability of the IC chip, the bare chip mounted on the antenna substrate may be further sealed and reinforced with resin or the like.

The substrate A (13) on which the adhesive layer (16a) is formed as described above, and the non-contact IC module substrate (1) with an antenna made of polyethylene terephthalate as the substrate
4) The base material B (15) on which the adhesive layer (16b) is formed is laminated, integrated by thermal lamination, and then cut into a card shape to obtain the non-contact IC card recording medium of the present invention. When a non-contact IC card recording medium is formed by integrating the base material A (13), the IC module base with an antenna (14), and the base material B (15) by heat lamination, the card surface is flattened. It is preferable that the resin of the base material A and the base material B be flowed and embedded above and below the IC module by increasing the temperature of the laminate and further applying pressure. However, as the temperature increases, the risk of breakage of the IC module due to the heat of the heat laminate increases.

As shown in FIG. 2, the card recording medium has heat resistance, good surface flatness, and minimizes the influence on the breakage of the IC module during thermal lamination.
Base A (13) and IC module base with antenna (1
4) Between the base material B (15) and the IC module base with an antenna (14), the thermoplastic polymer resin of the base material A (13) and the base material B (15), respectively, May be provided with a base material C (18a) and a base material D (18b) made of a thermoplastic polymer resin having a heat deformation temperature lower than the thermal deformation temperature.

In this case, the adhesive layer (16a, 16b) made of a one-component thermosetting adhesive from which the functional group is blocked and the blocking agent due to heat is dissociated is composed of the base material C (18a) and the IC module base with antenna. (14) and substrate D
(18b) and IC module board with antenna (14)
Are formed between them. The adhesive may be formed on the surfaces of the substrates C and D in the same manner as the method of forming the adhesive layer on the surfaces of the substrates A and B. Further, in order to make the surface of the card recording medium smoother, a hole having the same size as an electric component such as a chip of the IC module (11) is formed on the base material C or the base material D, and the electric component such as the chip is formed through the hole. It is also preferable to perform heat lamination after laminating the base material so as to be inserted into the substrate.

In the case of using the base material C (18a) and the base material D (18b), the heat laminating method is as follows.
3) The base material C (18) provided with the adhesive layer (16a)
a), IC module base with antenna based on polyethylene terephthalate (14), adhesive layer (16b)
A one-time laminating method of sequentially laminating the base material D (18b) provided with the base material and the base material B (15) and then performing heat lamination; and a base material C (18a) provided with the adhesive layer (16a).
IC module base with antenna (14), adhesive layer (1
The base material D (18b) provided with the base material 6b) is sequentially laminated and subjected to primary heat lamination to be integrated, and then the base material A
There is a double lamination method in which the secondary heat lamination is performed by laminating the laminate with (13) and the base material B (15). In particular, in the case of double lamination, the temperature of the secondary lamination can be lowered to minimize the influence of the base material A and the base material B on the printed layer (17).

In any of the above-described thermal laminating methods, the base material A and the base material C or the base material B by reducing the heat laminating temperature.
In order to prevent a decrease in the lamination strength of the base material D and the base material A,
It is preferable to provide an adhesive layer between the base material C and the base material B and between the base material B and the base material D. (See FIG. 3) Examples of the adhesive layer include thermoplastics such as a vinyl acetate adhesive, a polyvinyl alcohol adhesive, a polyamide adhesive, an acrylic adhesive, a polyester adhesive, a polyurethane adhesive, and an epoxy adhesive. Adhesives and thermosetting adhesives can be used.

Hereinafter, the present invention will be described with reference to specific examples. <Embodiment 1> FIG. 1 shows a non-contact IC according to an embodiment of the present invention.
It is a block diagram of a card recording medium (10). An antenna circuit (12) is formed by laminating a 15 μm aluminum metal thin film on the front and back surfaces of a 38 μm white PET (polyethylene terephthalate) base material by dry lamination via a urethane adhesive, printing a photoresist, and then performing a chemical etching process. And connection terminals were formed to form an antenna substrate. Then, an antenna using the polyethylene terephthalate of Example 1 as a base material was prepared by mounting a 120 μm-thick Myfair chip on the antenna substrate via an anisotropic conductive film (ACF) and further sealing with an epoxy sealing resin. Non-contact IC module base (14).

Next, a 360 μm-thick white amorphous PET substrate (PET-G: manufactured by Eastman Chemical Co., Ltd.) is used as the substrate A (13) and the substrate B (15). Using an adhesive composed of a blocked isocyanate and a polyester polyol, 2 μm is applied to the surface of each of the substrate A and the substrate B by a roll coater. Further, a printed layer (17) of a picture and ID data is formed on the other surfaces of the base material A and the base material B by offset printing. Non-contact I with antenna on the surface of substrate A (13) on which adhesive layer (16a) is formed
C Module base (14) is laminated, and base material B
The adhesive layer (16b) of (15) is used for the IC module substrate (1).
6b). The laminated body thus laminated was placed in a hot press, and the temperature was 140 ° C. and the pressure was 1
By applying heat and pressure of 000 kPa, thermal lamination is performed and integrated.

Thus, the thickness 0.76 mm, I
A laminate in which the C module was embedded was obtained, which was cut into the shape of a card recording medium to obtain a non-contact IC card recording medium (10) of Example 1. The card recording medium (10) obtained as described above had no distortion such as the pattern of the print layer (17), had good surface smoothness, and was able to communicate normally in a communication test. Further evaluation of the delamination strength of the card,
In each case, an adhesive strength of 10 N / cm or more was obtained, and no delamination occurred until the substrate was broken.

<Embodiment 2> FIG. 3 is a block diagram of another non-contact IC card recording medium (20) according to an embodiment of the present invention. A 10 μm copper metal thin film is adhered to the front and back surfaces of a 25 μm transparent PET (polyethylene terephthalate) substrate by dry lamination via a urethane adhesive, a photoresist is printed, and the antenna and the connection terminals are formed by chemical etching. The antenna substrate was formed. Then, a 170 μm thick Myfair chip is mounted on the antenna substrate via an anisotropic conductive ink, and further sealed with an epoxy sealing resin. IC module base (24).

Next, a white stretched PET substrate (PET-G: Eastman Chemical Co., Ltd.) having a thickness of 125 μm was used as the substrate A (23) and the substrate B (25).
m of an amorphous PET substrate, a substrate C (28a) and a substrate D
Used as (28b). Then, an adhesive composed of an aldimine and an epoxy resin is used as an adhesive layer, and the base material C (28
1 μm is formed by screen printing on the surfaces of a) and the substrate D (28b).

Further, a thermoplastic polyester adhesive (29a, 29b) is applied to the surfaces of the base material A (23) and the base material B (25) using a knife coater. A printing layer (27) for a picture and ID data is formed in advance on the other surfaces of the base material A and the base material B by gravure printing. Base material C (28a)
A non-contact IC module substrate with an antenna (24) is laminated on the surface on which the adhesive layer (26a) is formed, and a base material D (28b) is provided thereon, and the adhesive layer (26b) of the base material D is provided on the IC module substrate ( 24). The laminated body thus laminated was placed in a hot press,
By applying heat and pressure at 5 ° C. and a pressure of 784 kPa, thermal lamination is performed and integrated.

In this manner, the printed layers of the base material A (23) and the base material B (25) are respectively laminated on both sides of the integrated laminate so that the printed layers are on the outside. By applying a heat and pressure of 1000 kPa, a laminate in which an IC module having a thickness of 0.78 mm is embedded is obtained, which is cut into the shape of a card recording medium, and the non-contact IC card recording medium of Example 2 is cut. (20).

The card recording medium (20) obtained as described above did not have any distortion such as the pattern of the printed layer (27), had very good surface flatness, and was able to communicate normally in a communication test. Further, when the delamination strength of the card was evaluated, an adhesion strength of 10 N / cm or more was similarly obtained, and no delamination occurred until the substrate was broken.

[0044]

As described above, according to the present invention, according to the present invention, the base material A composed of a thermoplastic resin and the adhesive composed of a one-component thermosetting adhesive in which a functional group is blocked and a blocking agent is dissociated by heat are used. Layer, non-contact IC module base with antenna based on polyethylene terephthalate, adhesive layer made of one-component thermosetting adhesive in which functional groups are blocked and the blocking agent is released by heat, base material made of thermoplastic resin Are sequentially laminated and thermally laminated to form an IC.
It is possible to mass-produce IC card recording media with no module breakage, good surface smoothness and no delamination at low cost.

[Brief description of the drawings]

1A and 1B are configuration diagrams of an IC card recording medium according to an embodiment of the present invention, wherein FIG. 1A is an external view and FIG. 1B is a cross-sectional view taken along a line XX.

FIG. 2 is a sectional view showing the configuration of another IC card recording medium according to the present invention.

FIG. 3 is a sectional view showing the configuration of another IC card recording medium according to the present invention.

[Explanation of symbols]

10 ... IC card 11
... IC module 12 ... Antenna circuit 13
... Base A 14 ... IC module base with antenna 15 ... Base B 16a, 16b
... adhesive layer 17 ... printing layer 18a
... Base material C 18b ... Base material D 20 ...
IC card 21 IC module 22
Antenna circuit 23 ... Base material A 24 ... IC module base with antenna 25 ... Base material B 26a, 26b
... adhesive layer 27 ... printing layer 28a
... Base material C 28b ... Base material D 29a, 29b
… Adhesive layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09J 201/00 C09J 175/04 G06K 19/077 B29K 67:00 // C09J 175/04 G06K 19/00 H B29K 67:00 K F term (reference) 2C005 MA11 MA19 MB01 MB08 NA08 NA09 PA19 RA04 4F100 AK01A AK01C AK42A AK42B AK42C AK51G AT00B BA03 BA06 CA02G CB00 EJ202 EJ422 GB71 JB16A JB16C JK11 J03A37A03A37A TN44 TN53 TQ04 4J040 EF331 JA09 JB02 LA06 LA07 MA10 MB05 NA21 PA30 5B035 AA04 BA05 BB09 CA01

Claims (6)

[Claims] 1. An IC card recording medium wherein a card formed by laminating different resin card base materials is integrated via an adhesive layer which exhibits adhesiveness by heating. 2. A substrate A made of at least a thermoplastic polymer resin, a non-contact IC module base with an antenna made of polyethylene terephthalate, and a substrate B made of a thermoplastic polymer resin are sequentially laminated and integrated. An IC card recording medium characterized in that the substrate A and the substrate B are integrated with an IC module substrate with an antenna via an adhesive layer that exhibits adhesiveness by heating. 3. The one-component thermosetting adhesive wherein the functional group is blocked and the blocking agent is dissociated by heat as the adhesive layer which exhibits adhesiveness by heating. Item 3. An IC card recording medium according to Item 2. 4. The cross-linking initiation temperature of the one-component thermosetting adhesive in which the functional group is blocked and the blocking agent is dissociated by heat as the adhesive layer is in the range of 50 ° C. to 150 ° C. I according to any one of claims 1 to 3
C card recording medium. 5. The thickness of the adhesive layer is 0.3 μm to 10 μm.
5. The method according to claim 1, wherein
Item 10. The IC card recording medium according to Item 1. 6. A substrate A comprising at least a thermoplastic polymer resin, an adhesive layer comprising a one-component thermosetting adhesive in which a functional group is blocked and a blocking agent is released by heat, and a substrate made of polyethylene terephthalate. Non-contact IC module base with antenna, adhesive layer made of one-component thermosetting adhesive whose functional group is blocked and the blocking agent is dissociated by heat, and base material B made of thermoplastic polymer resin are sequentially laminated and integrated. A method for manufacturing an IC card recording medium, comprising: performing heat lamination by heating and pressurization using a hot press as a lamination and integration method in an integrated IC card.